CN103456860A - Photoelectric device and manufacturing method thereof - Google Patents
Photoelectric device and manufacturing method thereof Download PDFInfo
- Publication number
- CN103456860A CN103456860A CN201210171665XA CN201210171665A CN103456860A CN 103456860 A CN103456860 A CN 103456860A CN 201210171665X A CN201210171665X A CN 201210171665XA CN 201210171665 A CN201210171665 A CN 201210171665A CN 103456860 A CN103456860 A CN 103456860A
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- Prior art keywords
- lens
- support
- electrooptical device
- adhesion
- catoptric arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Abstract
The invention provides a photoelectric device and a manufacturing method thereof. The photoelectric device comprises a support, a photoelectric element, at least on electrode, a lens and a covering adhesive layer. The support is provided with a reflecting structure with an opening. The photoelectric element is arranged in the opening. The electrodes are arranged in the support and electrically connected with the photoelectric element. The lens is arranged on the support and comprises an adhesive part, the adhesive part is provided with a supporting face, an alignment face and an adhesive face, and the adhesive face is provided with a convex or concave surface. The covering adhesive layer is filled in an area formed by encircling of the reflecting structure, and covers the photoelectric element, and the lens is adhered to the support via the adhesive part of the lens. By the photoelectric device, the problem of inclination or offset of the lens can be alleviated and/or avoided, and the lens is enabled to be accurately positioned and stably arranged on the photoelectric element.
Description
Technical field
The present invention relates to a kind of electrooptical device and manufacture method thereof, and be particularly related to a kind of light-emitting diode assembly and manufacture method thereof.
Background technology
Usually be provided with optical lens on photoelectric cell to assist the transmission of light.Generally speaking, optical lens is to be bonded on the support that carries photoelectric cell by adhesion coating.
Yet, when being bonded on support by optical lens, the problem of lens tilt or skew easily occurs, cause the transmission of light to produce error, affect the usefulness of photoelectric cell.
Therefore, industry is needed the technology that can solve and/or alleviate the problems referred to above badly.
Summary of the invention
The objective of the invention is to propose a kind of electrooptical device, to address the above problem.
The invention provides a kind of electrooptical device, comprising: a support, there is a catoptric arrangement, wherein this catoptric arrangement has an opening; One photoelectric cell, be arranged in this opening; At least one electrode, be arranged in this support and be electrically connected this photoelectric cell; One lens, be arranged on this support, and it comprises an adhesion part, and this adhesion part has a supporting surface, an aligning surface and a bonding plane, and wherein this bonding plane has a convex or concave surface; And one cover adhesion coating, be filled in the zone that this catoptric arrangement surrounds and cover this photoelectric cell, and by this adhesion part of these lens, these lens being bonded on this support.
The invention provides a kind of electrooptical device, comprising: a support, there is a catoptric arrangement, wherein this catoptric arrangement has an opening; One photoelectric cell, be arranged in this opening; At least one electrode, be arranged in this support and be electrically connected this photoelectric cell; One lens, be arranged on this support, and it comprises an adhesion part, and this adhesion part has a supporting surface, an aligning surface and a bonding plane, and wherein this bonding plane has an adhesion side and an adhesion bottom surface; And one cover adhesion coating, be filled in the zone that this catoptric arrangement surrounds and cover this photoelectric cell, and by this adhesion part of these lens, these lens being bonded on this support.
The invention provides a kind of manufacture method of electrooptical device, comprising: a support is provided; One photoelectric cell is arranged on this support; Fill in the zone that this catoptric arrangement surrounds by a covering adhesion coating and cover this photoelectric cell; One lens are arranged to an opening and this covering adhesion coating top of this support, wherein these lens comprise a supporting surface, an aligning surface and a bonding plane, and wherein this bonding plane has a convex or concave surface; And it is curing that this is covered to adhesion coating.
The invention provides a kind of manufacture method of electrooptical device, comprising: a support is provided; One photoelectric cell is arranged on this support; Fill in the zone that this catoptric arrangement surrounds by a covering adhesion coating and cover this photoelectric cell; One lens are arranged to an opening and this covering adhesion coating top of this support, wherein these lens comprise a supporting surface, an aligning surface and a bonding plane, and wherein this bonding plane has an adhesion side and an adhesion bottom surface; And it is curing that this is covered to adhesion coating.
Lens in electrooptical device of the present invention have a specially designed adhesion part, can make lens with cover adhesion coating can self-contraposition when bonding, can alleviate and/or avoid the problem of lens run-off the straight or skew, make lens can accurately locate and firmly be arranged on photoelectric cell, can lower the transmission error of light, promote element efficiency, also effectively simplify production process and reduce costs.
The accompanying drawing explanation
Figure 1A-Fig. 1 C shows the process section of electrooptical device according to an embodiment of the invention.
Fig. 2 shows the profile of lens according to another embodiment of the present invention.
Fig. 3 A-Fig. 3 C shows respectively the profile of the electrooptical device of various aspect embodiment according to the present invention.
Wherein, description of reference numerals is as follows:
10 ~ support;
100 ~ catoptric arrangement;
100T ~ surface;
100R ~ sidewall;
102a, 102b ~ conduction region;
104a, 104b ~ electrode;
110 ~ photoelectric cell;
112a, 112b ~ conducting wire;
13 ~ lens;
131 ~ bright dipping position;
132H ~ supporting surface;
132P ~ bonding plane;
132P1 ~ adhesion side;
132P2 ~ adhesion bottom surface;
132S ~ aligning surface;
140 ~ covering adhesion coating;
300 ~ particle;
D1, D2, DL ~ external diameter.
Embodiment
Below will describe making and the occupation mode of the embodiment of the present invention in detail.So it should be noted, the invention provides many inventive concepts for application, it can multiple specific pattern be implemented.The specific embodiment of discussing of giving an example in literary composition is only manufacture and use ad hoc fashion of the present invention, non-in order to limit the scope of the invention.In addition, may use label or the sign of repetition in different embodiment.These only repeat, in order simply clearly to narrate the present invention, not represent between discussed different embodiment and/or structure and must have any association.
Figure 1A-Fig. 1 C shows the process section of electrooptical device according to an embodiment of the invention.As shown in Figure 1A, this electrooptical device has a support 10, and this support 10 comprises a catoptric arrangement 100.The material of this catoptric arrangement 100 can comprise plastic cement, silica gel, epoxy resin, multilayer film coating, macromolecular material, ceramic material, semi-conducting material, metal material or aforesaid combination.This catoptric arrangement 100 comprises an opening.
This electrooptical device comprises that a photoelectric cell 110 is arranged in the opening of this catoptric arrangement 100.This photoelectric cell 110 can be light-emitting component (for example light-emitting diode) or Photosensing Units.Take light-emitting diode as example, and photoelectric cell 110 has P type electrode and N-type electrode (not shown), and it can for example, be electrically connected by conducting wire 112a and 112b (bonding wire) conduction region 102a and the 102b be arranged in support 10.This conduction region 102a and 102b can be electrically connected electrode 104a and the 104b be arranged on support 10 by the conducting wire (not shown).
Then, as shown in Figure 1B, can insert in the zone that this catoptric arrangement 100 surrounds, to cover photoelectric cell 110 covering adhesion coating 140.Cover adhesion coating 140 tool high transmission rate and stickiness.Cover adhesion coating 140 and can comprise silica gel, epoxy resin, glass or aforesaid combination.Cover adhesion coating 140 and also can comprise the printing opacity macromolecular material that other are applicable.Covering adhesion coating 140 can be in order to protect photoelectric cell 110, and can be in order to the fixing follow-up set lens 13 of adhering.
These lens 13 can comprise silica gel, epoxy resin, glass or aforesaid combination.Perhaps, lens 13 can be other applicable transparent materials.Lens 13 can comprise bright dipping position 131, and it can have evagination profile or curved profile.Lens 13 also comprise an adhesion part, and it has a supporting surface 132H, an aligning surface 132S and a bonding plane 132P.
Then, lens 13 can be arranged on catoptric arrangement 100, lens 13 can penetrate covering adhesion coating 140 and fix, as shown in Figure 1 C.After placing lens 13, selectivity will cover adhesion coating 140 and solidify.By cover the curing step of adhesion coating 140 can comprise carry out photocuring to covering adhesion coating 140, be heating and curing, room temperature spontaneous curing or aforesaid combination.
The upper step that lens 13 is arranged to catoptric arrangement 100 can comprise the surperficial 100T of the supporting surface 132H contact reflex structure 100 of lens 13, and aligning surface 132S is entered in opening along the sidewall 100R of catoptric arrangement 100.
As shown in Figure 1 C, the supporting surface 132H of lens 13 is positioned on the surperficial 100T of catoptric arrangement 100.Supporting surface 132H can directly contact reflex structure 100 surperficial 100T.Perhaps, can be formed with the other materials layer between the surperficial 100T of supporting surface 132H and catoptric arrangement 100.Catoptric arrangement 100 can prop up supporting surface 132H and make lens 13 be held in appropriate location.Supporting surface 132H can be planar annular.The maximum outside diameter D1 of supporting surface 132H is greater than the opening D outer diameter L of catoptric arrangement 100.On the whole supporting surface 132H can be parallel to the surperficial 100T of catoptric arrangement 100.The maximum outside diameter D2 of bonding plane 132P is less than the opening D outer diameter L of catoptric arrangement 100.
The aligning surface 132S of lens 13 can be in order to the aligning of attachment lens 13.Lens 13 can along catoptric arrangement 100 sidewall 100R and move down.On the whole aligning surface 132S is parallel to the sidewall 100R of catoptric arrangement 100.Aligning surface 132S can directly contact reflex structure 100 sidewall 100R.Perhaps, also can be formed with the other materials layer between the sidewall 100R of aligning surface 132S and opening.This aligning surface 132S connects supporting surface 132H.
But the bonding plane 132P autoregistration face 132S of lens 13 extends towards photoelectric cell 110.Bonding plane 132P can directly contact and cover adhesion coating 140.Bonding plane 132P can comprise the convex or concave curved surface.Because lens 13 have bonding plane 132P, can make lens 13 be pressed into the process that covers adhesion coating 140 more smooth, and can avoid and/or reduce Bubble formation in covering adhesion coating 140.Therefore, light can more successfully spread out of or reach from the external world photoelectric cell 110 from photoelectric cell 110.
Fig. 2 shows the profile of lens according to another embodiment of the present invention, and wherein same or analogous label is in order to indicate same or analogous element.Lens 13 in the embodiment of Fig. 2 are similar in appearance to lens 13 described in Fig. 1 embodiment, and wherein the main distinction is that the bonding plane 132P of the lens 13 in Fig. 2 can comprise adhesion side 132P1 and adhesion bottom surface 132P2.On the whole adhesion bottom surface 132P2 can be a plane, outer convex surface or inner sunken face.The shown lens 13 of Fig. 2 can replace the lens in Fig. 1 embodiment.In this case, on the whole adhesion bottom surface 132P2 can be parallel to the surperficial 100T of catoptric arrangement 100.So it should be noted, the embodiment of the present invention is not limited to this.
Fig. 3 A-Fig. 3 C shows respectively the profile according to the electrooptical device of other embodiments of the invention, and wherein same or analogous label is in order to indicate same or analogous element.In these embodiments, can in electrooptical device, import a plurality of light wavelength conversion particles and/or a plurality of optics diffusion particle.For example, particle 300 can be arranged among lens 13, as shown in Figure 3A.Perhaps, particle 300 can be arranged at and cover among adhesion coating 140, as shown in Figure 3 B.Or particle 300 can be arranged at lens 13 and cover among adhesion coating 140, as shown in Figure 3 C.Applicable light wavelength conversion particle for example comprises yttrium-aluminium-garnet (YAG) fluorescent material, silicate fluorescent powder, terbium aluminium garnet (TAG) fluorescent material, oxide fluorescent powder, Nitride phosphor, aluminum oxide fluorescent material, other can be for fluorescent material and material or the aforesaid combination of wavelength conversion.Applicable optics diffusion particle as comprised silicon dioxide granule, aluminium oxide particles, calcirm-fluoride particle, calcium carbonate particle, barium sulfate particle, other can make light beam produce particle or the aforesaid combination of diffusion phenomena.In addition, the lens 13 in Fig. 2 embodiment also can be similarly in order to replace the lens of arbitrary embodiment in Fig. 3 A-Fig. 3 C.
Lens in the electrooptical device of the embodiment of the present invention have a specially designed adhesion part, can make lens with cover adhesion coating can self-contraposition when bonding, can alleviate and/or avoid the problem of lens run-off the straight or skew, make lens can accurately locate and firmly be arranged on photoelectric cell, can lower the transmission error of light, promote element efficiency, also effectively simplify production process and reduce costs.In addition, the convex or concave surface design of scioptics bottoms, can also effectively avoid covering in adhesion coating and produce bubble, promotes the usefulness of electrooptical device.
Although the present invention discloses as above with several preferred embodiments; so it is not in order to limit the present invention; any those of ordinary skills without departing from the spirit and scope of the present invention; when changing arbitrarily and retouching, so protection scope of the present invention is as the criterion when looking appended the scope that claim defines.
Claims (18)
1. an electrooptical device, is characterized in that, comprising:
One support, have a catoptric arrangement, and wherein this catoptric arrangement has an opening;
One photoelectric cell, be arranged in this opening;
At least one electrode, be arranged in this support and be electrically connected this photoelectric cell;
One lens, be arranged on this support, and these lens comprise an adhesion part, and this adhesion part has a supporting surface, an aligning surface and a bonding plane, and wherein this bonding plane has a convex or concave surface; And
One covers adhesion coating, is filled in the zone that this catoptric arrangement surrounds and covers this photoelectric cell, and by this adhesion part of these lens, these lens being bonded on this support.
2. an electrooptical device, is characterized in that, comprising:
One support, have a catoptric arrangement, and wherein this catoptric arrangement has an opening;
One photoelectric cell, be arranged in this opening;
At least one electrode, be arranged in this support and be electrically connected this photoelectric cell;
One lens, be arranged on this support, and these lens comprise an adhesion part, and this adhesion part has a supporting surface, an aligning surface and a bonding plane, and wherein this bonding plane has an adhesion side and an adhesion bottom surface; And
One covers adhesion coating, is filled in the zone that this catoptric arrangement surrounds and covers this photoelectric cell, and by this adhesion part of these lens, these lens being bonded on this support.
3. electrooptical device as claimed in claim 2, wherein this adhesion bottom surface comprises a plane, an outer convex surface or an inner sunken face.
4. electrooptical device as claimed in claim 1 or 2, wherein the material of this catoptric arrangement comprises plastic cement, silica gel, epoxy resin, multilayer film coating, macromolecular material, ceramic material, semi-conducting material, metal material or aforesaid combination.
5. electrooptical device as claimed in claim 1 or 2, wherein this supporting surface directly contacts a surface of this catoptric arrangement, and this aligning surface directly contacts a sidewall of this catoptric arrangement, and this covering adhesion coating directly contacts this bonding plane of these lens.
6. electrooptical device as claimed in claim 1 or 2, wherein this photoelectric cell comprises a light-emitting component or a Photosensing Units.
7. electrooptical device as claimed in claim 1 or 2, wherein this supporting surface connects this aligning surface, and this supporting surface is a planar annular.
8. electrooptical device as claimed in claim 1 or 2, wherein this covering adhesion coating comprises silica gel, epoxy resin, glass, printing opacity macromolecular material or aforesaid combination.
9. electrooptical device as claimed in claim 1 or 2, wherein these lens comprise silica gel, epoxy resin, glass or aforesaid combination.
10. electrooptical device as claimed in claim 1 or 2, it also comprises a plurality of light wavelength conversion particles or a plurality of optics diffusion particle, is arranged at these lens maybe among this covering adhesion coating.
11. electrooptical device as claimed in claim 10, wherein this light wavelength conversion particle comprise yttrium aluminium garnet fluorescent powder, silicate fluorescent powder, terbium aluminium garnet fluorescent material, oxide fluorescent powder, Nitride phosphor, aluminum oxide fluorescent material, can be for fluorescent material and material or the aforesaid combination of wavelength conversion.
12. electrooptical device as claimed in claim 10, wherein this optics diffusion particle comprises silicon dioxide granule, aluminium oxide particles, calcirm-fluoride particle, calcium carbonate particle, barium sulfate particle, makes light beam produce particle or the aforesaid combination of diffusion phenomena.
13. electrooptical device as claimed in claim 1 or 2, wherein the maximum outside diameter of this supporting surface is greater than the opening external diameter of this catoptric arrangement.
14. electrooptical device as claimed in claim 1 or 2, wherein the maximum outside diameter of this bonding plane is less than the opening external diameter of this catoptric arrangement.
15. the manufacture method of an electrooptical device, is characterized in that, comprising:
One support is provided;
One photoelectric cell is arranged on this support;
Fill in the zone that this catoptric arrangement surrounds by a covering adhesion coating and cover this photoelectric cell;
One lens are arranged to an opening and this covering adhesion coating top of this support, wherein these lens comprise a supporting surface, an aligning surface and a bonding plane, and wherein this bonding plane has a convex or concave surface; And
This is covered to adhesion coating solidifies.
16. the manufacture method of an electrooptical device, is characterized in that, comprising:
One support is provided;
One photoelectric cell is arranged on this support;
Fill in the zone that this catoptric arrangement surrounds by a covering adhesion coating and cover this photoelectric cell;
One lens are arranged to an opening and this covering adhesion coating top of this support, wherein these lens comprise a supporting surface, an aligning surface and a bonding plane, and wherein this bonding plane has an adhesion side and an adhesion bottom surface; And
This is covered to adhesion coating solidifies.
17. the manufacture method of electrooptical device as claimed in claim 16, wherein this adhesion bottom surface comprises a plane, an outer convex surface or an inner sunken face.
18. as the manufacture method of claim 15 or 16 described electrooptical devices, wherein by this covering adhesion coating curing step comprise to this covering adhesion coating carry out photocuring, be heating and curing, room temperature spontaneous curing or aforesaid combination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210171665XA CN103456860A (en) | 2012-05-29 | 2012-05-29 | Photoelectric device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210171665XA CN103456860A (en) | 2012-05-29 | 2012-05-29 | Photoelectric device and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103456860A true CN103456860A (en) | 2013-12-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210171665XA Pending CN103456860A (en) | 2012-05-29 | 2012-05-29 | Photoelectric device and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN103456860A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105895787A (en) * | 2016-06-06 | 2016-08-24 | 青岛海信电器股份有限公司 | Light-emitting diode (LED), LED packaging method, straight down type backlight module and liquid crystal display television |
| CN106016184A (en) * | 2015-03-27 | 2016-10-12 | 锋翔科技公司 | Light engine frame with integrated baffle |
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| US20050072981A1 (en) * | 2002-02-19 | 2005-04-07 | Ryoma Suenaga | Light-emitting device and process for producing thereof |
| US20070278512A1 (en) * | 2006-05-31 | 2007-12-06 | Cree, Inc. | Packaged light emitting devices including multiple index lenses and methods of fabricating the same |
| US20080224162A1 (en) * | 2007-03-14 | 2008-09-18 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode package |
| US20110006668A1 (en) * | 2009-07-10 | 2011-01-13 | Hussell Christopher P | Lighting Structures Including Diffuser Particles Comprising Phosphor Host Materials |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20050072981A1 (en) * | 2002-02-19 | 2005-04-07 | Ryoma Suenaga | Light-emitting device and process for producing thereof |
| US20070278512A1 (en) * | 2006-05-31 | 2007-12-06 | Cree, Inc. | Packaged light emitting devices including multiple index lenses and methods of fabricating the same |
| US20080224162A1 (en) * | 2007-03-14 | 2008-09-18 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode package |
| US20110006668A1 (en) * | 2009-07-10 | 2011-01-13 | Hussell Christopher P | Lighting Structures Including Diffuser Particles Comprising Phosphor Host Materials |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106016184A (en) * | 2015-03-27 | 2016-10-12 | 锋翔科技公司 | Light engine frame with integrated baffle |
| CN106016184B (en) * | 2015-03-27 | 2020-02-14 | 锋翔科技公司 | Light engine frame with integrated baffle |
| CN105895787A (en) * | 2016-06-06 | 2016-08-24 | 青岛海信电器股份有限公司 | Light-emitting diode (LED), LED packaging method, straight down type backlight module and liquid crystal display television |
| CN105895787B (en) * | 2016-06-06 | 2019-02-19 | 青岛海信电器股份有限公司 | LED, LED encapsulation method, down straight aphototropism mode set and LCD TV |
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Application publication date: 20131218 |