CN103384443B - The conduction through hole structure of circuit board - Google Patents
The conduction through hole structure of circuit board Download PDFInfo
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- CN103384443B CN103384443B CN201210134558.XA CN201210134558A CN103384443B CN 103384443 B CN103384443 B CN 103384443B CN 201210134558 A CN201210134558 A CN 201210134558A CN 103384443 B CN103384443 B CN 103384443B
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Abstract
The present invention provides the conduction through hole structure of a kind of circuit board, is after a support plate forms circuit, then forms glue-line and conductor layer.At least one perforation runs through this support plate, this circuit, this glue-line and conductor layer with a vertical direction, and forms a hole wall surface.This conductor layer has a difference in height with the circuit exposed area of this circuit in this vertical direction.One conductor covering part is covered in the hole wall surface of this conductor layer and this perforation.This support plate can be single sided board, dual platen, multi-layer sheet or a combination thereof, and this single sided board and dual platen, multi-layer sheet can be the circuit boards of the dissimilar material properties such as flexible circuit board, hard circuit board or Rigid Flex.The present invention has the advantage that therefore acceptance rate can be substantially improved because being raw material direct etching；Free from admixture problem in manufacturing process；The stability of material used is good；Substrate material is in addition to hole plating plot structure changes, and other change is little, makes pliability increase；The density of circuit increases.
Description
Technical field
The invention relates to a kind of circuit board through hole technology, particularly relate to the conduction through hole knot of a kind of circuit board
Structure.
Background technology
Looking into printing circuit board (PCB) is important electronic unit, is also the supporter of electronic component, is electronic element circuit
The supplier connected.Traditional circuit board, is the engineering method using printing etching resist, makes circuit and the drawing of circuit, therefore
It is referred to as printed circuit board (PCB) or printed substrate.Due to the continuous microminiaturization of electronic product and become more meticulous, current most circuit
Plate is all to use to attach etching resist (press mold or coating), after exposure imaging, then makes circuit board with etching.
Now by the manufacturing process of the conduction through hole structure of circuit board, it is first to prepare one there is upper and lower two copper foil layers and glue
The support plate of layer, carries out drilling program to it and electroplates after a upper conductor covering part, and this support plate is again through being coated with dry film, exposing, show
After shadow, etching, form several etch areas, the support plate the most etched is given pressing.
But, now with the processing procedure of the conduction through hole structure of circuit board, it is first to carry out entering again after manufacturing process is electroplated in boring
Row etching processing procedure, although following shortcoming the most usually occurs in flow process: the uneven thickness of (1) support plate, causes fine rule road to manufacture work
Skill yield declines；(2) electroplating process produces impurity, causes image transfer and etching yield to decline；(3) the dimensionally stable fall of support plate
Low, cause exposure aligning to be forbidden；(4) carrying board structure produces and changes, and easily causes pliability variation etc., therefore now by the conduction of circuit board
The manufacturing process of through hole structure still suffers from its space improved.
Summary of the invention
In view of this, the main object of the present invention is i.e. to provide the conduction through hole structure of a kind of circuit board.
The present invention solves that the conduction through hole structure that problem of the prior art is used is after a support plate forms circuit,
Form glue-line and conductor layer again.At least one perforation runs through this support plate, this circuit, this glue-line and this conductor with a vertical direction
Layer, and form a hole wall surface.This conductor layer and this circuit exposed area have a difference in height in this vertical direction.One conductor covers
Portion is covered in the hole wall surface of this conductor layer and this perforation.This support plate can be single sided board, dual platen, multi-layer sheet or a combination thereof, and
This single sided board and dual platen, multi-layer sheet can be the dissimilar material properties such as flexible circuit board, hard circuit board or Rigid Flex
Circuit board.
Compared to available circuit plate conduction through hole structure manufacturing process, the present invention have the advantage that (1) because of
For being raw material direct etching, therefore yield can be substantially improved；(2) free from admixture problem in manufacturing process；(3) material used is steady
Qualitative good；(4) substrate material is in addition to hole plating plot structure changes, and other change is little, makes pliability increase；(5) density of circuit
Increase.Concrete grammar of the present invention and structure design, will be by below example and attached further in graphic work
Explanation.
Accompanying drawing explanation
Fig. 1-Fig. 5 shows the conduction through hole structure of first embodiment of the invention circuit board profile in time making；
Fig. 6 shows first embodiment of the invention profile after completing combination；
Fig. 7-Figure 11 shows the carrying board structure profile of second embodiment of the invention；
Figure 12 shows one of second embodiment of the invention profile after completing combination；
Figure 13 shows the two of second embodiment of the invention profile after completing combination；
Figure 14 shows the carrying board structure of third embodiment of the invention profile in time separating；
Figure 15 shows the carrying board structure of fourth embodiment of the invention profile in time separating；
Figure 16 shows the carrying board structure of fifth embodiment of the invention profile in time separating；
Figure 17 shows the carrying board structure of sixth embodiment of the invention profile in time separating；
Figure 18 shows the carrying board structure of seventh embodiment of the invention profile in time separating；
Figure 19 shows seventh embodiment of the invention profile after completing combination；
Figure 20 shows the carrying board structure of eighth embodiment of the invention profile in time separating；
Figure 21 shows the carrying board structure of ninth embodiment of the invention profile in time separating；
Figure 22 shows the carrying board structure of tenth embodiment of the invention profile in time separating.
Drawing reference numeral:
100,200,300,400,500,600 support plate
700,800,900,901 support plate
11 first substrates
11a first substrate upper surface
11b first substrate lower surface
12 first dual platens
12a dual platen upper surface
12b dual platen lower surface
13 second substrates
13a second substrate upper surface
13b second substrate lower surface
14 the 3rd substrates
15 second dual platens
15a dual platen upper surface
15b dual platen lower surface
Circuit on 21
210 interstitial areas
Circuit exposed area on 211
22 times circuits
220 interstitial areas
221 times circuit exposed areas
23,23a, 23b middle line
23c the first dual platen middle line
23d the second dual platen middle line
24,25,26 middle line
31 upper glue layers
32 lower glue layers
41 upper conductor layer
42 lower conductor layer
5 perforations
51 hole wall surfaces
6 conductor covering part
71,72,73,74,75,76 binder course
8,8a, 8b buried via hole
I vertical direction
H1 the first difference in height
H2 the second difference in height
Detailed description of the invention
Refer to Fig. 1-5, conduction through hole structure the cuing open in time making of its display first embodiment of the invention circuit board
Face figure, and Fig. 6 shows first embodiment profile in the completed.First embodiment of the invention support plate 100 is a single sided board.
As it can be seen, first substrate 11 has a first substrate upper surface 11a and first substrate lower surface 11b.First base
Plate upper surface 11a is formed with circuit 21 at least.Separated out with interstitial area 210 between each upper circuit 21.
One upper glue layer 31 is formed at the surface of circuit 21 on this.Upper glue layer 31 can be completely covered the surface of circuit 21,
Can also the subregion of local complexity upper glue layer 31, be defined as circuit on upper circuit 21 surface not covered by upper glue layer 31
Exposed area 211, can be as surface adhering device (SMD) or the exposed contact of golden finger (Gold Finger).
Be formed with a upper conductor layer 41 on the surface of upper glue layer 31, and this upper conductor layer 41 with this on the upper circuit of circuit 21
Exposed area 211 has one first difference in height h1 (as shown in Figure 3) in this vertical direction I.Under the first substrate of first substrate 11
Surface 11b is formed with a lower conductor layer 42.
As shown in Figure 4, at least one perforation 5 runs through this upper conductor layer 41, upper glue layer 31, upper circuit with vertical direction I
21, first substrate 11, lower conductor layer 42, and form a hole wall surface 51.
As it is shown in figure 5, a conductor covering part 6 be covered in the upper surface of this upper conductor layer 41, the lower surface of lower conductor layer 42,
And the hole wall surface 51 of perforation 5.The manufacturing process formation that conductor covering part 6 can be coated with dry film, expose, develops and etch.
The conductor material that conductor covering part 6 is used can be selected from one or a combination set of copper, silver, golden material.
As shown in Figure 6, conductor covering part 6 being adjacent to the region beyond perforation 5, upper conductor layer 41 be adjacent to perforation 5 with
Outer region and lower conductor layer 42 are adjacent to the region beyond perforation 5, can be removed by existing lithographic technique or
Part retains.
This upper conductor layer 41, upper circuit 21 reach electrical communication with lower conductor layer 42 via conductor covering part 6.
The first substrate 11 of the present embodiment be a single sided board as support plate, also can be by other single sided board and single sided board, list
Panel is used as this support plate with dual platen, dual platen with dual platen, multiple-plate combination.
Refer to Fig. 7-13, conduction through hole structure the cuing open in time making of its display second embodiment of the invention circuit board
Face figure.Second embodiment of the invention support plate 200 is a dual platen.
As it is shown in fig. 7, one first dual platen 12 has an a pair of panel upper surface 12a and dual platen lower surface 12b, respectively
It is formed with circuit 21 and circuit 22 the most once at least one.Separated out with interstitial area 210 between each upper circuit 21, each under
Also separated out with interstitial area 220 between circuit 22.On this, circuit 21 includes circuit exposed area 211 at least, and is somebody's turn to do
Lower circuit 22 has also been optionally included with circuit exposed area 221.
As can be seen from figures 8 and 9, a upper glue layer 31 is formed at the surface of circuit 21 on this.One lower glue layer 32 is formed under this
The surface of circuit 22.Be formed with a upper conductor layer 41 on the surface of upper glue layer 31, and this upper conductor layer 41 with this on circuit 21
Upper circuit exposed area 211 has one first difference in height h1 in this vertical direction I.
A lower conductor layer 42 it is formed with on the surface of lower glue layer 32, and the lower circuit of this lower conductor layer 42 and this lower circuit 22
Exposed area 221 has one second difference in height h2 in this vertical direction I.
As shown in Figure 10, at least one perforation 5 runs through this upper conductor layer 41, upper glue layer 31, upper circuit with vertical direction I
21, the first dual platen 12, lower circuit 22, lower glue layer 32, lower conductor layer 42, and form a hole wall surface 51.
As shown in figure 11, a conductor covering part 6 is covered in the upper surface of this upper conductor layer 41, the following table of lower conductor layer 42
The hole wall surface 51 of face and perforation 5.
As shown in figure 12, conductor covering part 6 being adjacent to the region beyond perforation 5, upper conductor layer 41 be adjacent to perforation 5 with
Outer region, can be removed by existing lithographic technique.
As shown in figure 13, conductor covering part 6 being adjacent to the region beyond perforation 5, lower conductor layer 42 be adjacent to perforation 5 with
Outer region, can also be removed by existing lithographic technique or part retains.
Figure 14 shows the profile that the 3rd embodiment support plate 300 in the present invention is made up of two single sided boards.In figure
Showing, it can include at least one first substrate 11, and it has a first substrate upper surface 11a and first substrate lower surface 11b,
On at least one, circuit 21 is formed at this first substrate upper surface 11a.At least one second substrate 13 has a second substrate upper surface
13a and second substrate lower surface 13b, this second substrate upper surface 13a are to be incorporated into this first substrate 11 by a binder course 71
First substrate lower surface 11b, and the most once circuit 22 is formed at this second substrate lower surface 13b.Binder course 71 has viscous
The material behavior with edge.After the 3rd embodiment support plate 300 replacement aforementioned first embodiment support plate 100, then perform such as
The manufacturing process of Fig. 2～6, can complete a circuit board conductive through hole structure being made up of two single sided boards.
Figure 15 shows the profile that the 4th embodiment support plate 400 in the present invention is made up of three single sided boards.It is big
Cause structure identical with the embodiment of Figure 14, and at the second substrate upper surface 13a and the first of first substrate 11 of second substrate 13
At least one the 3rd substrate 14 and binder course 71,72 has been further included between base lower surface 11b.The surface of the 3rd substrate 14 is laid
There is at least one middle line 23.
Figure 16 shows that the 5th embodiment support plate 500 in the present invention is made up of two single sided boards and a dual platen
Profile.It includes a first substrate 11, and it has a first substrate upper surface 11a and first substrate lower surface 11b, at least
On one, circuit 21 is formed at this first substrate upper surface 11a.One second substrate 13 has a second substrate upper surface 13a and second
Base lower surface 13b, and the most once circuit 22 is formed at this second substrate lower surface 13b.
Between the second substrate upper surface 13a and the first substrate lower surface 11b of first substrate 11 of second substrate 13 more
Include at least one first dual platen 12.First dual platen 12 has a pair of panel upper surface 12a and dual platen lower surface 12b,
It is laid with at least one middle line 23a, 23b respectively.This dual platen upper surface 12a be by a binder course 71 be incorporated into this first
The first substrate lower surface 11b of substrate 11, and dual platen lower surface 12b is incorporated into second substrate 13 by a binder course 72
Second substrate upper surface 13a.
Figure 17 shows that the sixth embodiment support plate 600 in the present invention is made up of a single sided board and a dual platen
Profile.It includes a first substrate 11, and it has a first substrate upper surface 11a and first substrate lower surface 11b, at least
On one, circuit 21 is formed at this first substrate upper surface 11a.At least one first dual platen 12 have a pair of panel upper surface 12a with
Dual platen lower surface 12b, this dual platen upper surface 12a are the first substrates being incorporated into this first substrate 11 by a binder course 71
Lower surface 11b, and the most once circuit 22 is formed at this dual platen lower surface 12b.The dual platen upper surface of the first dual platen 12
12a is laid with at least one middle line 23.
Figure 18 shows the profile that the 7th embodiment support plate 700 in the present invention is made up of two dual platens, and schemes
The profile after completing combination of the 7th embodiment in the 19 display present invention.Support plate 700 includes one first dual platen 12, its
Having a pair of panel upper surface 12a and dual platen lower surface 12b, at least one, circuit 21 is formed at this two-sided upper surface 12a.Extremely
Few one second dual platen 15 has a pair of panel upper surface 15a and dual platen lower surface 15b, and this dual platen upper surface 15a is logical
Cross a binder course 71 and be incorporated into the dual platen lower surface 12b of this first dual platen 12, and the most once circuit 22 be formed at this
The dual platen lower surface 15b of two dual platens 15.It is two-sided that the dual platen lower surface 12b of the first dual platen 12 is laid with at least one first
Plate middle line 23c.The two-sided upper surface 15a of the second dual platen 15 is also laid with at least one second dual platen middle line 23d.
Refering to shown in Figure 19, after completing combination, a upper glue layer 31 is formed at the upper circuit 21 of the first dual platen 12 extremely
Few a part of region, do not covered by this upper glue layer 31 this on circuit 21 be defined as upper circuit exposed area 211.One upper conductor layer 41
Be formed at the upper surface of this upper glue layer 31, and this upper conductor layer 41 with this on circuit exposed area 211 have one the in vertical direction I
One difference in height h1.
One lower glue layer 32 is formed at least some of region of the lower circuit 22 of the second dual platen 15, not by this lower glue layer 32
This lower circuit 22 covered is defined as lower circuit exposed area 221.One lower conductor layer 42 is formed at the lower surface of this lower glue layer 32, and
This lower conductor layer 42 has one second difference in height h2 with this lower circuit exposed area 221 in vertical direction I.
At least one perforation 5 runs through upper conductor layer 41, upper glue layer 31, upper circuit the 21, first dual platen with this vertical direction I
12, the first dual platen middle line 23c, binder course the 71, second dual platen middle line 23d, the second dual platen 15, lower circuit
22, lower glue layer 32, lower conductor layer 42, and form a hole wall surface 51.One conductor covering part 6 is covered in the hole wall table of this perforation 5
Face 51, the upper conductor layer 41 of this first dual platen 12 are adjacent to the regional area of this perforation 5 and this second dual platen 15 times
Conductor layer 42 is adjacent to the regional area of this perforation 5.
When reality is applied, perforation 5 optionally can electrically connect according to being actually needed circuit 21 on this, lower circuit 22, the
One dual platen middle line 23c, the second dual platen middle line 23d.
Figure 20 shows that the 8th embodiment support plate 800 in the present invention is made up of a single sided board and a dual platen
Profile.Showing in figure, it includes at least one first substrate 11 and one first dual platen 12.First dual platen 12 includes one
Buried via hole 8.The structure of this buried via hole 8 is identical with the structure of the perforation 5 shown in Figure 13, is only combining first substrate 11 and the first dual platen
Before 12, this buried via hole 8 makes molding the most in advance.Position at the upper circuit of this first dual platen 12 upper surface as middle line 24,
The lower surface of the first dual platen 12 then has circuit 22.The upper surface 11a of first substrate 11 forms circuit at least
21.First dual platen 12 is combined by a binder course 73 between first substrate 11.
After first substrate 11 is combined by binder course 73 with the first dual platen 12, then at the position being offset from this buried via hole 8
Place, carries out perforation production process as the aforementioned, so can complete three layer circuit board structures with buried via hole and middle line layer,
Using as the support plate in the present invention.
In this embodiment, it is that the dual platen of the structure that a single sided board and have been formed with buried via hole 8 is by combining
Layer 73 constitutes support plate 800 after combining, then by after this support plate 800 replacement aforementioned first embodiment support plate 100, then at skew this
The position of the buried via hole 8 of one dual platen 12, performs such as the manufacturing process of Fig. 2～6, can complete and have buried via hole and middle line
The circuit board conductive through hole structure of layer.
Figure 21 shows the profile that the 9th embodiment support plate 900 in the present invention is made up of two dual platens.In figure
Display, it includes at least two dual platen 12,15, and two dual platens are pre-formed with buried via hole 8a, 8b the most respectively.First pair
The dual platen upper surface 12a of panel 12 is formed with at least one middle line 24, and dual platen face lower surface 12b forms at least one and rolls off the production line
Road 22.The dual platen lower surface 15b of second dual platen 15 forms at least one middle line 25, and dual platen upper surface 15a is then
Form circuit 21 at least.It is to be combined by binder course 74 between two dual platens 12,15.
After two dual platens 12,15 are combined by binder course 74, then carry out perforation production process as the aforementioned, so may be used
Complete a four-layer circuit board structure with buried via hole and middle line layer, using as the support plate in the present invention.In this embodiment
In, it is to pass through to constitute after binder course 74 combines support plate 900 by two dual platens 12,15 having been formed with buried-hole structure, then will
After this support plate 900 replacement aforementioned first embodiment support plate 100, then at avoiding the position of this buried via hole, perform such as the system of Fig. 2～6
Make process, can complete and there is the circuit board conductive through hole structure of buried via hole and middle line layer.
Figure 22 shows that the tenth embodiment support plate 901 in the present invention is made up of a dual platen and two single sided boards
Profile.Showing in figure, it includes at least one first dual platen 12, and this dual platen is pre-formed with buried via hole 8.First is two-sided
The dual platen upper surface 12a and dual platen lower surface 12b of plate 12 are respectively formed with at least one middle line 24,26, and lead to respectively
Cross a binder course 75,76 and combine first substrate 11 and a second substrate 13.First substrate 11 and second substrate 13 are all one side
Plate, and form circuit 21 at least at the upper surface 11a of this first substrate 11, and in the lower surface 13b shape of second substrate 13
Become circuit 22.
After first dual platen 12 is combined by binder course 75,76 respectively with first substrate 11, second substrate 13, then at partially
Move the position of the buried via hole 8 of this first dual platen 12, perform the such as manufacturing process of Fig. 2～6, so can complete one have buried via hole and in
Between the four-layer circuit board structure of line layer, using as the support plate in the present invention.
By above embodiment, the present invention can pass through one or more single sided board, dual platen or many
Laminate and be combined into various different carrying board structure, and each single sided board, dual platen, multi-layer sheet can be flexible circuit boards, hard
The circuit board of the property dissimilar material properties such as circuit board or Rigid Flex.And different embodiments all can passing through in conjunction with the present invention
Pore structure and Making programme.
From embodiments above, the present invention really has splendid industrial utilization, therefore the present invention had accorded with specially already
The important document of profit.Only above narration is only presently preferred embodiments of the present invention explanation, all is skillful in this those skilled in the art when can be according to above-mentioned
Explanation and make other all improvement, only these changes still fall within the creation spirit of the present invention and the scope of claims.
Claims (13)
1. a conduction through hole structure for circuit board, is characterized in that, including:
One first substrate, it is a flexible circuit board, has a first substrate upper surface and a first substrate lower surface；
Circuit at least one, is formed at described first substrate upper surface；
One upper glue layer, is formed at least some of region of described upper circuit, the described upper circuit not covered by described upper glue layer
It is defined as circuit exposed area；
One upper conductor layer, is formed on described upper glue layer, and described upper conductor layer and described upper circuit exposed area are at a Vertical Square
To having one first difference in height, described upper circuit exposed area is not covered by described upper glue layer and described upper conductor layer and expose to
Described upper glue layer and described upper conductor layer, outside the surface of described upper circuit exposed area is as surface adhering device or golden finger
Dew contact；
One lower conductor layer, is formed at described first substrate lower surface；
At least one perforation, with described vertical direction run through described upper conductor layer, described upper glue layer, described upper circuit, described
One substrate, described lower conductor layer, and form a hole wall surface；
One conductor covering part, is covered in the hole wall surface of described perforation, described upper conductor layer is positioned at the regional area of described perforation
And described lower conductor layer is positioned at the regional area of described perforation, region beyond described perforation, the described conductor covering part,
The region that described upper conductor layer is positioned at beyond described perforation is removed, and described upper conductor layer, described upper circuit are led under described
Body layer reaches electrical communication via described conductor covering part.
2. the conduction through hole structure of circuit board as claimed in claim 1, is characterized in that, described lower conductor layer and described first
Further include between base lower surface:
One second substrate, described second substrate has a second substrate upper surface and a second substrate lower surface, described second base
Plate upper surface is incorporated into the first substrate lower surface of described first substrate with described vertical direction；
Circuit the most once, is formed at described second substrate lower surface；
One lower glue layer, is formed at least some of region of described lower circuit；
Described lower conductor layer is i.e. formed at the lower surface of described lower glue layer；
The through described second substrate of described perforation, described lower circuit, described lower glue layer, described lower conductor layer, and described conductor covers
Cap is also covered in described lower conductor layer and is positioned at the regional area of described perforation.
3. the conduction through hole structure of circuit board as claimed in claim 2, is characterized in that, described lower circuit is not by described lower glue
The region that layer covers is defined as lower circuit exposed area, and described lower conductor layer and described lower circuit exposed area are in described vertical direction
There is one second difference in height.
4. the conduction through hole structure of circuit board as claimed in claim 2, is characterized in that, the first substrate of described first substrate
At least one the 3rd substrate, and described 3rd substrate has been further included between the second substrate upper surface of lower surface and described second substrate
Include at least one middle line.
5. the conduction through hole structure of circuit board as claimed in claim 2, is characterized in that, the first substrate of described first substrate
At least one first dual platen more it is combined with between the second substrate upper surface of lower surface and described second substrate, described first two-sided
Plate has a pair of panel upper surface and dual platen lower surface, and is respectively formed with a middle line, described perforation through described the
One dual platen.
6. the conduction through hole structure of circuit board as claimed in claim 5, is characterized in that, described first dual platen position is in skew
At least one buried via hole has been further included in the position of described perforation.
7. the conduction through hole structure of the circuit board as described in claim 2, is characterized in that, the first base of described first substrate
Plate lower surface is combined with at least one first dual platen, and described first dual platen has a pair of panel upper surface and dual platen following table
Face, described lower circuit is formed at described dual platen lower surface, is formed with at least one middle line, institute at described dual platen upper surface
State through described first dual platen of perforation.
8. the conduction through hole structure of circuit board as claimed in claim 7, is characterized in that, described first dual platen position is in skew
At least one buried via hole has been further included in the position of described perforation.
9. the conduction through hole structure of circuit board as claimed in claim 7, is characterized in that, described first dual platen be soft board,
Hardboard, the one of Rigid Flex.
10. a conduction through hole structure for circuit board, is characterized in that, including:
One first dual platen, it is a flexible circuit board, has one first dual platen upper surface and one first dual platen lower surface；
Circuit at least one, is formed at described first dual platen upper surface；
One upper glue layer, is formed at least some of region of described upper circuit, the described upper circuit not covered by described upper glue layer
It is defined as circuit exposed area；
One upper conductor layer, is formed on described upper glue layer, and described upper conductor layer and described upper circuit exposed area are at a Vertical Square
To having one first difference in height, described upper circuit exposed area is not covered by described upper glue layer and described upper conductor layer and expose to
Described upper glue layer and described upper conductor layer, outside the surface of described upper circuit exposed area is as surface adhering device or golden finger
Dew contact；
Circuit the most once, is formed at described first dual platen lower surface；
One lower glue layer, is formed at least some of region of described lower circuit；
One lower conductor layer, is formed at the lower surface of described lower glue layer；
At least one perforation, with described vertical direction run through described upper conductor layer, described upper glue layer, described upper circuit, described
One dual platen, described lower circuit, described lower glue layer, described lower conductor layer, and form a hole wall surface；
One conductor covering part, is covered in the hole wall surface of described perforation, described upper conductor layer is positioned at the regional area of described perforation
And described lower conductor layer is positioned at the regional area of described perforation, region beyond described perforation, the described conductor covering part,
The region that described upper conductor layer is positioned at beyond described perforation is removed, described upper conductor layer, described upper circuit, described lower circuit
Electrical communication is reached via described conductor covering part with described lower conductor layer.
The conduction through hole structure of 11. 1 kinds of circuit boards, is characterized in that, including:
One first dual platen, it is a flexible circuit board, has one first dual platen upper surface and one first dual platen lower surface；
Circuit at least one, is formed at described first dual platen upper surface；
One upper glue layer, is formed at least some of region of described upper circuit, the described upper circuit not covered by described upper glue layer
It is defined as circuit exposed area；
One upper conductor layer, is formed at described upper glue layer, and described upper conductor layer and described upper circuit exposed area is in a vertical direction
Having one first difference in height, described upper circuit exposed area is not covered by described upper glue layer and described upper conductor layer and expose to institute
Stating upper glue layer and described upper conductor layer, the surface of described upper circuit exposed area is exposing as surface adhering device or golden finger
Contact；
At least one first dual platen middle line, is formed at described first dual platen lower surface；
One second dual platen, has one second dual platen upper surface and one second dual platen lower surface；
Circuit the most once, is formed at described second dual platen lower surface；
One lower glue layer, is formed at least some of region of described lower circuit, the described lower circuit not covered by described lower glue layer
It is defined as lower circuit exposed area；
One lower conductor layer, is formed at described lower glue layer, and described lower conductor layer and described lower circuit exposed area is at described Vertical Square
To having one second difference in height；
At least one second dual platen middle line, is formed at described second dual platen upper surface；
One binder course, between described first dual platen lower surface and described second dual platen upper surface；
At least one perforation, runs through described upper conductor layer, described upper glue layer, described upper circuit, described knot with described vertical direction
Close layer, described lower circuit, described lower glue layer, described lower conductor layer, and form a hole wall surface；
One conductor covering part, be covered in the hole wall surface of described perforation, the upper conductor layer of described first dual platen be positioned at described in pass through
The regional area in hole and the lower conductor layer of described second dual platen are positioned at the regional area of described perforation, described conductor covering part
Be positioned at the region beyond described perforation, described upper conductor layer is positioned at the region beyond described perforation and described lower conductor layer is positioned at
Region beyond described perforation is removed, described upper conductor layer, described upper circuit, described lower circuit and described lower conductor layer warp
Electrical communication is reached by described conductor covering part.
The conduction through hole structure of 12. circuit boards as claimed in claim 11, is characterized in that, described first dual platen position is partially
Move and further included at least one buried via hole in the position of described perforation.
The conduction through hole structure of 13. circuit boards as claimed in claim 11, is characterized in that, described second dual platen position is partially
Move and further included at least one buried via hole in the position of described perforation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210134558.XA CN103384443B (en) | 2012-05-03 | 2012-05-03 | The conduction through hole structure of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210134558.XA CN103384443B (en) | 2012-05-03 | 2012-05-03 | The conduction through hole structure of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103384443A CN103384443A (en) | 2013-11-06 |
| CN103384443B true CN103384443B (en) | 2016-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210134558.XA Active CN103384443B (en) | 2012-05-03 | 2012-05-03 | The conduction through hole structure of circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI616120B (en) * | 2014-06-09 | 2018-02-21 | Flexible circuit board structure combined with carrier board and manufacturing method thereof | |
| CN113438807A (en) * | 2021-06-30 | 2021-09-24 | 东莞市小精灵教育软件有限公司 | Connecting structure of soft board and hard board and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4642160A (en) * | 1985-08-12 | 1987-02-10 | Interconnect Technology Inc. | Multilayer circuit board manufacturing |
| US6121553A (en) * | 1997-03-03 | 2000-09-19 | Hitachi Chemical Company, Ltd. | Circuit boards using heat resistant resin for adhesive layers |
| CN1429063A (en) * | 2001-12-28 | 2003-07-09 | 株式会社东芝 | Multilayer printed wiring board and mfg. method, electronic equipment |
| CN100570841C (en) * | 2006-01-04 | 2009-12-16 | 安迪克连接科技公司 | Make the method for circuitized substrate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2630308B2 (en) * | 1995-05-31 | 1997-07-16 | 日本電気株式会社 | Method for manufacturing multilayer printed wiring board |
| TWI434638B (en) * | 2010-07-29 | 2014-04-11 | Advanced Semiconductor Eng | Manufacturing process of circuit substrate |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4642160A (en) * | 1985-08-12 | 1987-02-10 | Interconnect Technology Inc. | Multilayer circuit board manufacturing |
| US6121553A (en) * | 1997-03-03 | 2000-09-19 | Hitachi Chemical Company, Ltd. | Circuit boards using heat resistant resin for adhesive layers |
| CN1429063A (en) * | 2001-12-28 | 2003-07-09 | 株式会社东芝 | Multilayer printed wiring board and mfg. method, electronic equipment |
| CN100570841C (en) * | 2006-01-04 | 2009-12-16 | 安迪克连接科技公司 | Make the method for circuitized substrate |
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| CN103384443A (en) | 2013-11-06 |
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