CN103384443A - Conducting through hole structure for circuit board - Google Patents
Conducting through hole structure for circuit board Download PDFInfo
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- CN103384443A CN103384443A CN201210134558XA CN201210134558A CN103384443A CN 103384443 A CN103384443 A CN 103384443A CN 201210134558X A CN201210134558X A CN 201210134558XA CN 201210134558 A CN201210134558 A CN 201210134558A CN 103384443 A CN103384443 A CN 103384443A
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- sided board
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Abstract
The invention provides a conducting through hole structure for a circuit board. After a circuit is formed by a carrier plate, a gum layer and a conductor layer are formed. At least one through hole penetrates through the carrier plate, the circuit, the gum layer and the conductor layer in the vertical direction, and a hole wall surface is formed. The conductor layer and a circuit exposing area have height difference in the vertical direction. A conductor covering portion covers the conductor layer and the hole wall surface of the through hole. The carrier plate can be a single face plate, a double-face plate, a multi-layer plate or combination of the single face plate, the double-face plate and the multi-layer plate. The single face plate, the double-face plate and the multi-layer plate can be circuit boards of flexible circuit boards, hard circuit boards or flexible-hard combined plates and the like with characteristics of different materials. The conducting through hole structure for the circuit board has the following advantages that due to the fact that a raw material is directly etched, the excellent rate can be greatly improved; the problem of impurities in the manufacturing process is solved; a material in use is good in stability; a hole plating area structure of a base material is changed, others are not greatly changed, so that flexibility is improved, and density of the circuit is increased.
Description
Technical field
The invention relates to a kind of circuit board through hole technology, refer to especially a kind of conduction through hole structure of circuit board.
Background technology
Looking into printing circuit board (PCB) is important electronic unit, is also the supporter of electronic component, is the supplier that electronic element circuit connects.Traditional circuit board is the engineering method that adopts printing etching resistance agent, makes circuit and the drawing of circuit, therefore is called as printed circuit board (PCB) or printed substrate.Due to the continuous microminiaturization of electronic product and become more meticulous, the circuit board of most is all to adopt to attach etching resistance agent (press mold or coating), through after exposure imaging, then makes circuit board with etching.
Now use the manufacturing process of the conduction through hole structure of circuit board, first to prepare a support plate with upper and lower two copper foil layers and glue-line, after it is carried out drilling program and electroplates a upper conductor covering section, this support plate is again through after coating dry film, exposure, development, etching, form several etch areas, inciting somebody to action at last, the support plate of etching gives pressing again.
Yet, now use the processing procedure of the conduction through hole structure of circuit board, be first to hole to carry out again the etching processing procedure after electroplating manufacturing process, following shortcoming usually occur although flow process is simple and easy: the uneven thickness of (1) support plate, cause fine rule road manufacturing process yield to descend; (2) electroplating process produces impurity, causes image transfer and etching yield to descend; (3) dimensionally stable of support plate reduces, and causes exposure aligning inaccurate; (4) carrying board structure produce to change, and easily causes pliability variation etc., therefore now still have its improved space with the manufacturing process of the conduction through hole structure of circuit board.
Summary of the invention
In view of this, main purpose of the present invention namely is to provide a kind of conduction through hole structure of circuit board.
The conduction through hole structure that the present invention adopts for the problem that solves prior art is after a support plate forms circuit, then forms glue-line and conductor layer.At least one perforation runs through this support plate, this circuit, this glue-line and this conductor layer with a vertical direction, and forms a hole wall surface.This conductor layer and this circuit exposed area have a difference in height in this vertical direction.One conductor covering section is covered in the hole wall surface of this conductor layer and this perforation.This support plate can be single sided board, double sided board, multi-layer sheet or its combination, and this single sided board and double sided board, multi-layer sheet can be the circuit boards of the dissimilar material properties such as flexible circuit board, hard circuit board or Rigid Flex.
Compared to the manufacturing process of the conduction through hole structure of available circuit plate, the present invention has advantages of following: (1) is because be the raw material direct etchings, therefore yield can significantly promote; (2) free from admixture problem in manufacturing process; (3) stability of material that uses is good; (4) substrate material is except hole plating plot structure changes, and other changes little, and pliability is increased; (5) density of circuit increases.Concrete grammar of the present invention and structural design will and attachedly be graphic and be further described by following embodiment.
Description of drawings
Fig. 1-Fig. 5 shows the profile of conduction through hole structure when making of first embodiment of the invention circuit board;
Fig. 6 shows the profile of first embodiment of the invention after completing combination;
Fig. 7-Figure 11 shows the carrying board structure profile of second embodiment of the invention;
Figure 12 shows one of second embodiment of the invention profile after completing combination;
Figure 13 shows two of the profile of second embodiment of the invention after completing combination;
Figure 14 shows the profile of carrying board structure when separating of third embodiment of the invention;
Figure 15 shows the profile of carrying board structure when separating of fourth embodiment of the invention;
Figure 16 shows the profile of carrying board structure when separating of fifth embodiment of the invention;
Figure 17 shows the profile of carrying board structure when separating of sixth embodiment of the invention;
Figure 18 shows the profile of carrying board structure when separating of seventh embodiment of the invention;
Figure 19 shows the profile of seventh embodiment of the invention after completing combination;
Figure 20 shows the profile of carrying board structure when separating of eighth embodiment of the invention;
Figure 21 shows the profile of carrying board structure when separating of ninth embodiment of the invention;
Figure 22 shows the profile of carrying board structure when separating of tenth embodiment of the invention.
Drawing reference numeral:
100,200,300,400,500,600 support plates
700,800,900,901 support plates
11 first substrates
11a first substrate upper surface
11b first substrate lower surface
12 first double sided boards
12a double sided board upper surface
12b double sided board lower surface
13 second substrates
13a second substrate upper surface
13b second substrate lower surface
14 the 3rd substrates
15 second double sided boards
15a double sided board upper surface
15b double sided board lower surface
Circuit on 21
210 interstitial areas
Circuit exposed area on 211
22 times circuits
220 interstitial areas
221 times circuit exposed areas
23, circuit in the middle of 23a, 23b
Circuit in the middle of 23c the first double sided board
Circuit in the middle of 23d the second double sided board
24,25,26 middle circuits
31 upper glue layers
32 lower glue layers
41 upper conductor layer
42 lower conductor layer
5 perforations
51 hole wall surfaces
6 conductor covering sections
71,72,73,74,75,76 binder courses
8,8a, 8b buried via hole
The I vertical direction
H1 the first difference in height
H2 the second difference in height
Embodiment
See also Fig. 1-5, it shows the profile of conduction through hole structure when making of first embodiment of the invention circuit board, and Fig. 6 shows the profile of the first embodiment after completing.First embodiment of the invention support plate 100 is single sided boards.
As shown in the figure, first substrate 11 has a first substrate upper surface 11a and first substrate lower surface 11b.First substrate upper surface 11a is formed with at least one upper circuit 21.Separated out with interstitial area 210 between circuit 21 on each.
One upper glue layer 31 is formed on the surface of circuit 21 on this.Upper glue layer 31 can cover the surface of circuit 21 fully, also can the local subregion that covers upper glue layer 31, be defined as circuit exposed area 211 on upper circuit 21 surfaces that do not covered by upper glue layer 31, can be used as the contact that exposes of surface adhering device (SMD) or golden finger (Gold Finger).
Be formed with a upper conductor layer 41 on the surface of upper glue layer 31, and this upper conductor layer 41 has one first difference in height h1 (as shown in Figure 3) with the upper circuit exposed area 211 that is somebody's turn to do upper circuit 21 at this vertical direction I.First substrate lower surface 11b at first substrate 11 is formed with a lower conductor layer 42.
As shown in Figure 4, at least one perforation 5 runs through this upper conductor layer 41, upper glue layer 31, upper circuit 21, first substrate 11, lower conductor layer 42 with a vertical direction I, and forms a hole wall surface 51.
As shown in Figure 5, a conductor covering section 6 is covered in the upper surface of this upper conductor layer 41, the lower surface of lower conductor layer 42 and the hole wall surface 51 of perforation 5.The manufacturing process that conductor covering section 6 can be coated with dry film, exposure, development and etching forms.The conductor material that conductor covering section 6 uses can be selected from copper, silver, golden material one or a combination set of.
As shown in Figure 6, conductor covering section 6 is adjacent to zone beyond perforation 5 and lower conductor layer 42 and is adjacent to zone beyond perforation 5 being adjacent to zone, upper conductor layer 41 beyond perforation 5, can be removed or the part reservation by existing lithographic technique.
This upper conductor layer 41, upper circuit 21 and lower conductor layer 42 reach electrical communication via conductor covering section 6.
The first substrate 11 of the present embodiment be a single sided board as support plate, also can be used as this support plate by other single sided board and single sided board, single sided board and double sided board, double sided board and double sided board, multiple-plate combination.
See also Fig. 7-13, it shows the profile of conduction through hole structure when making of second embodiment of the invention circuit board.Second embodiment of the invention support plate 200 is double sided boards.
As shown in Figure 7, one first double sided board 12 has a pair of panel upper surface 12a and a double sided board lower surface 12b, is formed with respectively at least one upper circuit 21 and at least one lower circuit 22.Separated out with interstitial area 210 between circuit 21 on each, also separated out with interstitial area 220 between each time circuit 22.Should include at least one upper circuit exposed area 211 by upper circuit 21, and this time circuit 22 also optionally includes at least one lower circuit exposed area 221.
As Fig. 8 and shown in Figure 9, a upper glue layer 31 is formed on the surface of circuit 21 on this.One lower glue layer 32 is formed on the surface of this time circuit 22.Be formed with a upper conductor layer 41 on the surface of upper glue layer 31, and this upper conductor layer 41 has one first difference in height h1 with the upper circuit exposed area 211 that is somebody's turn to do upper circuit 21 at this vertical direction I.
Be formed with a lower conductor layer 42 on the surface of lower glue layer 32, and the lower circuit exposed area 221 of this lower conductor layer 42 and this time circuit 22 has one second difference in height h2 at this vertical direction I.
As shown in figure 10, at least one perforation 5 runs through this upper conductor layer 41, upper glue layer 31, upper circuit 21, the first double sided board 12, lower circuit 22, lower glue layer 32, lower conductor layer 42 with a vertical direction I, and forms a hole wall surface 51.
As shown in figure 11, a conductor covering section 6 is covered in the upper surface of this upper conductor layer 41, the lower surface of lower conductor layer 42 and the hole wall surface 51 of perforation 5.
As shown in figure 12, conductor covering section 6 is adjacent to zone beyond perforation 5 being adjacent to zone, upper conductor layer 41 beyond perforation 5, can be removed by existing lithographic technique.
As shown in figure 13, conductor covering section 6 is adjacent to zone beyond perforation 5 being adjacent to zone, lower conductor layer 42 beyond perforation 5, can also be removed or the part reservation by existing lithographic technique.
Figure 14 shows the profile that the 3rd embodiment support plate 300 in the present invention is comprised of two single sided boards.Show in figure, it can include at least one first substrate 11, and it has a first substrate upper surface 11a and first substrate lower surface 11b, and at least one upper circuit 21 is formed on this first substrate upper surface 11a.At least one second substrate 13 has a second substrate upper surface 13a and second substrate lower surface 13b, this second substrate upper surface 13a is incorporated into the first substrate lower surface 11b of this first substrate 11 by a binder course 71, and at least one lower circuit 22 is formed on this second substrate lower surface 13b.Binder course 71 has adhesion and the material behavior that insulate.After the 3rd embodiment support plate 300 is replaced aforementioned the first embodiment support plates 100, then carry out as the manufacturing process of Fig. 2～6, the circuit board that is comprised of two single sided boards that can complete conducts electricity the through hole structure.
Figure 15 shows the profile that the 4th embodiment support plate 400 in the present invention is comprised of three single sided boards.Its general configuration is identical with the embodiment of Figure 14, and more includes at least one the 3rd substrate 14 and binder course 71,72 between the first substrate lower surface 11b of the second substrate upper surface 13a of second substrate 13 and first substrate 11.The surface of the 3rd substrate 14 is laid with at least one middle circuit 23.
Figure 16 shows that the 5th embodiment support plate 500 in the present invention is by two single sided boards and the profile that double sided board forms.It includes a first substrate 11, and it has a first substrate upper surface 11a and first substrate lower surface 11b, and at least one upper circuit 21 is formed on this first substrate upper surface 11a.One second substrate 13 has a second substrate upper surface 13a and second substrate lower surface 13b, and at least one lower circuit 22 is formed on this second substrate lower surface 13b.
More include at least one the first double sided board 12 between the first substrate lower surface 11b of the second substrate upper surface 13a of second substrate 13 and first substrate 11.The first double sided board 12 has a pair of panel upper surface 12a and double sided board lower surface 12b, is laid with respectively at least one middle circuit 23a, 23b.This double sided board upper surface 12a is incorporated into the first substrate lower surface 11b of this first substrate 11 by a binder course 71, and double sided board lower surface 12b is incorporated into the second substrate upper surface 13a of second substrate 13 by a binder course 72.
Figure 17 shows that the 6th embodiment support plate 600 in the present invention is by a single sided board and the profile that double sided board forms.It includes a first substrate 11, and it has a first substrate upper surface 11a and first substrate lower surface 11b, and at least one upper circuit 21 is formed on this first substrate upper surface 11a.At least one the first double sided board 12 has a pair of panel upper surface 12a and double sided board lower surface 12b, this double sided board upper surface 12a is incorporated into the first substrate lower surface 11b of this first substrate 11 by a binder course 71, and at least one lower circuit 22 is formed on this double sided board lower surface 12b.The double sided board upper surface 12a of the first double sided board 12 is laid with at least one middle circuit 23.
Figure 18 shows the profile that the 7th embodiment support plate 700 in the present invention is comprised of two double sided boards, and Figure 19 shows the profile of the 7th embodiment after completing combination in the present invention.Support plate 700 includes one first double sided board 12, and it has a pair of panel upper surface 12a and double sided board lower surface 12b, and at least one upper circuit 21 is formed on this two-sided upper surface 12a.At least one the second double sided board 15 has a pair of panel upper surface 15a and double sided board lower surface 15b, this double sided board upper surface 15a is incorporated into the double sided board lower surface 12b of this first double sided board 12 by a binder course 71, and at least one lower circuit 22 is formed on the double sided board lower surface 15b of this second double sided board 15.The double sided board lower surface 12b of the first double sided board 12 is laid with the middle circuit 23c of at least one the first double sided board.The two-sided upper surface 15a of the second double sided board 15 also is laid with the middle circuit 23d of at least one the second double sided board.
Consult shown in Figure 19ly, after completing combination, a upper glue layer 31 is formed at least a portion zone of the upper circuit 21 of the first double sided board 12, should be defined as upper circuit exposed area 211 by upper circuit 21 by what this upper glue layer 31 covered.One upper conductor layer 41 is formed on the upper surface of this upper glue layer 31, and this upper conductor layer 41 with should upper circuit exposed area 211 in the vertical direction I have one first difference in height h1.
One lower glue layer 32 is formed at least a portion zone of the lower circuit 22 of the second double sided board 15, and this time circuit 22 that is not covered by this lower glue layer 32 is defined as lower circuit exposed area 221.One lower conductor layer 42 is formed on the lower surface of this lower glue layer 32, and this lower conductor layer 42 and this time circuit exposed area 221 in the vertical direction I have one second difference in height h2.
At least one perforation 5 runs through upper conductor layer 41, upper glue layer 31, upper circuit 21, the first double sided board 12, the middle circuit 23c of the first double sided board, binder course 71, the middle circuit 23d of the second double sided board, the second double sided board 15, lower circuit 22, lower glue layer 32, lower conductor layer 42 with this vertical direction I, and forms a hole wall surface 51.The lower conductor layer 42 that the upper conductor layer 41 that one conductor covering section 6 is covered in hole wall surface 51, this first double sided board 12 of this perforation 5 is adjacent to the regional area of this perforation 5 and this second double sided board 15 is adjacent to the regional area of this perforation 5.
When practical application, perforation 5 can optionally be electrically connected to according to actual needs upward circuit 21, lower circuit 22, the middle circuit 23c of the first double sided board, the middle circuit 23d of the second double sided board.
Figure 20 shows that the 8th embodiment support plate 800 in the present invention is by a single sided board and the profile that double sided board forms.Show in figure, it includes at least one first substrate 11 and one first double sided board 12.The first double sided board 12 includes a buried via hole 8.The structure of this buried via hole 8 is identical with the structure of perforation shown in Figure 13 5, and only before in conjunction with first substrate 11 and the first double sided board 12, this buried via hole 8 is made moulding in advance.The position at the upper circuit of these the first double sided board 12 upper surfaces as the lower surface of middle circuit 24, the first double sided boards 12 at least one lower circuit 22 of tool.The upper surface 11a of first substrate 11 forms at least one upper circuit 21.Pass through binder course 73 combinations between the first double sided board 12 and first substrate 11.
In this embodiment, its be with a single sided board and be formed with buried via hole 8 structure double sided board by binder course 73 in conjunction with rear formation support plate 800, after again this support plate 800 being replaced aforementioned the first embodiment support plate 100, again in the position of the buried via hole 8 that is offset this first double sided board 12, carry out the manufacturing process as Fig. 2～6, the circuit board conduction through hole structure that can complete and have buried via hole and middle line layer.
Figure 21 shows the profile that the 9th embodiment support plate 900 in the present invention is comprised of two double sided boards.Show in figure, it includes at least two double sided boards 12,15, and two double sided boards have been pre-formed all respectively buried via hole 8a, 8b.The double sided board upper surface 12a of the first double sided board 12 is formed with at least one middle circuit 24, and double sided board face lower surface 12b forms circuit 22 at least once.The double sided board lower surface 15b of second double sided board 15 forms at least one middle circuit 25, and double sided board upper surface 15a forms at least one upper circuit 21.By binder course 74 combinations between two double sided boards 12,15.
Two double sided boards 12,15 by binder course 74 in conjunction with after, then carry out perforation production process as the aforementioned, so can complete one and have the four-layer circuit board structure of buried via hole and middle line layer, with as the support plate in the present invention.In this embodiment, it is that two double sided boards 12,15 that will be formed with buried-hole structure pass through binder course 74 in conjunction with rear formation support plate 900, after again this support plate 900 being replaced aforementioned the first embodiment support plate 100, again in the position of avoiding this buried via hole, carry out the manufacturing process as Fig. 2～6, the circuit board conduction through hole structure that can complete and have buried via hole and middle line layer.
Figure 22 shows that the tenth embodiment support plate 901 in the present invention is by a double sided board and two profiles that single sided board forms.Show in figure, it includes at least one first double sided board 12, and this double sided board has been pre-formed buried via hole 8.The double sided board upper surface 12a of the first double sided board 12 and double sided board lower surface 12b are formed with respectively at least one middle circuit 24,26, and pass through respectively a binder course 75,76 in conjunction with a first substrate 11 and a second substrate 13.First substrate 11 and second substrate 13 are all single sided board, and the upper surface 11a of this first substrate 11 form at least one on circuit 21, and form circuit 22 at least once at the lower surface 13b of second substrate 13.
After the first double sided board 12 passes through respectively binder course 75,76 combinations with first substrate 11, second substrate 13, again in the position of the buried via hole 8 that is offset this first double sided board 12, carry out the manufacturing process as Fig. 2～6, so can complete one and have the four-layer circuit board structure of buried via hole and middle line layer, with as the support plate in the present invention.
By above embodiment as can be known, the present invention can be combined into various carrying board structure by one or more single sided board, double sided board or multi-layer sheet, and each single sided board, double sided board, multi-layer sheet can be the circuit boards of the dissimilar material properties such as flexible circuit board, hard circuit board or Rigid Flex.And different embodiment all can and make flow process in conjunction with through-hole construction of the present invention.
By above embodiment as can be known, the industrial utilization that the true tool of the present invention is splendid was therefore the present invention had accorded with the important document of patent already.Only above narration be only preferred embodiment explanation of the present invention, allly is skillful in this skill person when doing according to above-mentioned explanation other all improvement, and only these changes still belong to the scope of creation spirit of the present invention and claims.
Claims (19)
1. the conduction through hole structure of a circuit board, is characterized in that, comprising:
One first substrate, it is a single sided board, has a first substrate upper surface and a first substrate lower surface;
At least one upper circuit is formed on described first substrate upper surface;
One upper glue layer, at least a portion that is formed on described upper circuit is regional, and the described upper circuit that is not covered by described upper glue layer is defined as upper circuit exposed area;
One upper conductor layer is formed on described upper glue layer, and described upper conductor layer and described upper circuit exposed area have one first difference in height in a vertical direction;
One lower conductor layer is formed on described first substrate lower surface;
At least one perforation runs through described upper conductor layer, described upper glue layer, described upper circuit, described first substrate, described lower conductor layer with described vertical direction, and forms a hole wall surface;
One conductor covering section is covered in the hole wall surface of described perforation, described upper conductor layer is adjacent to the regional area of described perforation and the regional area that described lower conductor layer is adjacent to described perforation.
2. the conduction through hole structure of circuit board as claimed in claim 1, is characterized in that, more includes between described lower conductor layer and described first substrate lower surface:
One second substrate, described second substrate have a second substrate upper surface and a second substrate lower surface, and described second substrate upper surface is incorporated into the first substrate lower surface of described first substrate with described vertical direction;
At least one lower circuit is formed on described second substrate lower surface;
One lower glue layer, at least a portion that is formed on described lower circuit is regional;
Described lower conductor layer namely is formed under described lower glue layer;
Described perforation connects described second substrate, described lower circuit, described lower glue layer, described lower conductor layer, and described conductor covering section also is covered in the regional area that described lower conductor layer is adjacent to described perforation.
3. the conduction through hole structure of circuit board as claimed in claim 2, it is characterized in that, the zone definitions that described lower circuit is not covered by described lower glue layer is lower circuit exposed area, and described lower conductor layer and described lower circuit exposed area have one second difference in height in described vertical direction.
4. the conduction through hole structure of circuit board as claimed in claim 2, it is characterized in that, more include at least one the 3rd substrate between the first substrate lower surface of described first substrate and the second substrate upper surface of described second substrate, and described the 3rd substrate includes at least one middle circuit.
5. the conduction through hole structure of circuit board as claimed in claim 4, is characterized in that, described first substrate, described second substrate and described the 3rd substrate are a kind of of soft board, hardboard, Rigid Flex.
6. the conduction through hole structure of circuit board as claimed in claim 2, it is characterized in that, more be combined with at least one the first double sided board between the first substrate lower surface of described first substrate and the second substrate upper surface of described second substrate, described the first double sided board has a pair of panel upper surface and double sided board lower surface, and circuit in the middle of being formed with respectively, described perforation connects described the first double sided board.
7. the conduction through hole structure of circuit board as claimed in claim 6, is characterized in that, described the first double sided board position more includes at least one buried via hole in the position that is offset from described perforation.
8. as the conduction through hole structure of claim 1 a described circuit board, it is characterized in that, the first substrate lower surface of described first substrate is combined with at least one the first double sided board, described the first double sided board has a pair of panel upper surface and double sided board lower surface, described lower circuit is formed on described double sided board lower surface, be formed with at least one middle circuit at described double sided board upper surface, described perforation connects described the first double sided board.
9. the conduction through hole structure of circuit board as claimed in claim 8, is characterized in that, described the first double sided board position more includes at least one buried via hole in the position that is offset from described perforation.
10. the conduction through hole structure of circuit board as claimed in claim 8, is characterized in that, described the first double sided board is a kind of of soft board, hardboard, Rigid Flex.
11. the conduction through hole structure of a circuit board is characterized in that, comprising:
One first double sided board has one first double sided board upper surface and one first double sided board lower surface;
At least one upper circuit is formed on described the first double sided board upper surface;
One upper glue layer, at least a portion that is formed on described upper circuit is regional, and the described upper circuit that is not covered by described upper glue layer is defined as upper circuit exposed area;
One upper conductor layer is formed on described upper glue layer, and described upper conductor layer and described upper circuit exposed area have one first difference in height in a vertical direction;
At least one lower circuit is formed on described the first double sided board lower surface;
One lower glue layer, at least a portion that is formed on described lower circuit is regional;
One lower conductor layer is formed on described lower glue layer;
At least one perforation runs through described upper conductor layer, described upper glue layer, described upper circuit, described the first double sided board, described lower circuit, described lower glue layer, described lower conductor layer with described vertical direction, and forms a hole wall surface;
One conductor covering section is covered in the hole wall surface of described perforation, described upper conductor layer is adjacent to the regional area of described perforation and the regional area that described lower conductor layer is adjacent to described perforation.
12. the conduction through hole structure of circuit board as claimed in claim 11, it is characterized in that, the lower conductor layer bottom surface of described the first double sided board more is combined with at least one the second double sided board by a binder course, described the second double sided board has a pair of panel upper surface and a double sided board lower surface, be formed with respectively at least one upper circuit and lower circuit, at least a portion on described on circuit forms a upper glue layer, the described upper circuit that is not covered by described upper glue layer is defined as upper circuit exposed area, and at least a portion on described lower circuit forms a lower glue layer; One upper conductor layer is formed on described upper glue layer, and described upper conductor layer and described upper circuit exposed area have one first difference in height in described vertical direction, one lower conductor layer is formed on described lower glue layer, described perforation connects described upper conductor layer, described upper glue layer, described upper circuit, described the second double sided board, described lower circuit, described lower glue layer, the described lower conductor layer of described the second double sided board, and the described conductor covering section lower conductor layer that also is covered in described the second double sided board is adjacent to the regional area of described perforation.
13. the conduction through hole structure of circuit board as claimed in claim 12 is characterized in that, described the second double sided board position more includes at least one buried via hole in the position that is offset from described perforation.
14. the conduction through hole structure of circuit board as claimed in claim 12, it is characterized in that, the zone definitions that the lower circuit of described the second double sided board is not covered by described lower glue layer is lower circuit exposed area, and the lower conductor layer of described the second double sided board and described lower circuit exposed area have one second difference in height in described vertical direction.
15. the conduction through hole structure of circuit board as claimed in claim 12 is characterized in that, described the first double sided board and described the second double sided board are a kind of of soft board, hardboard, Rigid Flex.
16. the conduction through hole structure of a circuit board is characterized in that, comprising:
One first double sided board has one first double sided board upper surface and one first double sided board lower surface;
At least one upper circuit is formed on described the first double sided board upper surface;
One upper glue layer, at least a portion that is formed on described upper circuit is regional, and the described upper circuit that is not covered by described upper glue layer is defined as upper circuit exposed area;
One upper conductor layer is formed on described upper glue layer, and described upper conductor layer and described upper circuit exposed area have one first difference in height in a vertical direction;
Circuit in the middle of at least one the first double sided board is formed on described the first double sided board lower surface;
One second double sided board has one second double sided board upper surface and one second double sided board lower surface;
At least one lower circuit is formed on described the second double sided board lower surface;
One lower glue layer, at least a portion that is formed on described lower circuit is regional, and the described lower circuit that is not covered by described lower glue layer is defined as lower circuit exposed area;
One lower conductor layer is formed on described lower glue layer, and described lower conductor layer and described lower circuit exposed area have one second difference in height in described vertical direction;
Circuit in the middle of at least one the second double sided board is formed on described the second double sided board upper surface;
One binder course is between described the first double sided board lower surface and described the second double sided board upper surface;
At least one perforation runs through described upper conductor layer, described upper glue layer, described upper circuit, described binder course, described lower circuit, described lower glue layer, described lower conductor layer with described vertical direction, and forms a hole wall surface;
One conductor covering section, the lower conductor layer that the upper conductor layer that is covered in the hole wall surface of described perforation, described the first double sided board is adjacent to the regional area of described perforation and described the second double sided board is adjacent to the regional area of described perforation.
17. the conduction through hole structure of circuit board as claimed in claim 16 is characterized in that, described the first double sided board position more includes at least one buried via hole in the position that is offset from described perforation.
18. the conduction through hole structure of circuit board as claimed in claim 16 is characterized in that, described the second double sided board position more includes at least one buried via hole in the position that is offset from described perforation.
19. the conduction through hole structure of circuit board as claimed in claim 16 is characterized in that, described the first double sided board and described the second double sided board are a kind of of soft board, hardboard, Rigid Flex.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210134558.XA CN103384443B (en) | 2012-05-03 | 2012-05-03 | The conduction through hole structure of circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210134558.XA CN103384443B (en) | 2012-05-03 | 2012-05-03 | The conduction through hole structure of circuit board |
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| CN103384443A true CN103384443A (en) | 2013-11-06 |
| CN103384443B CN103384443B (en) | 2016-08-24 |
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| CN (1) | CN103384443B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105282962A (en) * | 2014-06-09 | 2016-01-27 | 易鼎股份有限公司 | Flexible circuit board structure combined with carrier plate and manufacturing method thereof |
| CN113438807A (en) * | 2021-06-30 | 2021-09-24 | 东莞市小精灵教育软件有限公司 | Connecting structure of soft board and hard board and manufacturing method thereof |
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| CN100570841C (en) * | 2006-01-04 | 2009-12-16 | 安迪克连接科技公司 | Make the method for circuitized substrate |
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| US4642160A (en) * | 1985-08-12 | 1987-02-10 | Interconnect Technology Inc. | Multilayer circuit board manufacturing |
| JPH08330735A (en) * | 1995-05-31 | 1996-12-13 | Nec Corp | Manufacture of multilayered printed-wiring board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105282962A (en) * | 2014-06-09 | 2016-01-27 | 易鼎股份有限公司 | Flexible circuit board structure combined with carrier plate and manufacturing method thereof |
| CN113438807A (en) * | 2021-06-30 | 2021-09-24 | 东莞市小精灵教育软件有限公司 | Connecting structure of soft board and hard board and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN103384443B (en) | 2016-08-24 |
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