CN103358413A - Method for regulating use proportion of recycling sand in silicon wafer cutting - Google Patents
Method for regulating use proportion of recycling sand in silicon wafer cutting Download PDFInfo
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- CN103358413A CN103358413A CN2013103342769A CN201310334276A CN103358413A CN 103358413 A CN103358413 A CN 103358413A CN 2013103342769 A CN2013103342769 A CN 2013103342769A CN 201310334276 A CN201310334276 A CN 201310334276A CN 103358413 A CN103358413 A CN 103358413A
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Abstract
Provided is a method for regulating a use proportion of recycling sand in silicon wafer cutting. The method comprises the following steps that the working platform speed, the wire speed, the steel wire tension, the slurry temperature , the slurry flow and the ditch of wheel guiding grooves of a cutting method are determined, the recycling sand and brand-new sand are mixed and used in proportion, and silicon wafer cutting is carried out; through multiple times of cutting experiments, the size distribution condition, the circular degree value, the fine powder content and the pH value of recycling silicon carbide in the recycling sand are verified, and an optimum value enabling a silicon wafer obtained by cutting to be qualified is found and used as the quality control point of the silicon carbide in the recycling sand; under the premise that the quality of the recycling sand reaches the quality control point and the use proportion of the recycling sand is improved, the quality of the cut silicon wafer is made to be qualified through the mode of reducing the parameters of the working platform speed, improving the parameters of the wire speed of a steel wire, improving the parameters of the steel wire tension, improving the parameters of the slurry flow and reducing the parameters of the slurry temperature. The method regulates process parameters by determining the quality control point of the recycling sand, and achieves the improvement of the use proportion of the recycling sand.
Description
Technical field
The present invention relates to silicon chip cutting field, particularly relate to a kind of the accent and survey the method that reclaims the sand usage ratio in the silicon chip cutting, the method passes through to determine to reclaim the qualifying point of sand, and the adjusting process parameter realizes improving recovery sand usage ratio.
Background technology
Because photovoltaic industry is increasingly competitive, the cost of any link all will impel the cost with whole link, could use the product of producing to have competitiveness.
For silicon chip cutting, using maximum is the multi-wire saw technology, and the monocrystalline bar of this technology after with the evolution processing is fixed on the stainless steel work-piece by glass plate, then is placed into the respective regions of cutting machine.Guide wheel is processed through grooving processes and is carved with and the matched accurate wire casing of use line of cut diameter at wheel body, and steel wire is by forming up and down two parallel nets on the wire casing that sequentially is wrapped in back and forth a guide wheel.The rotation of driven by engine guide wheel, guide wheel drives cutting steel wire and walks about at a high speed, and linear speed is generally 5 to 25 meters of per seconds.Sand mouth in the workbench both sides is sprayed on mortar on the gauze equably, the mixed liquor that mortar is comprised of carborundum (SiC) particle and polyethylene glycol (PEG) suspension.Along with entering crystal bar, line of cut carries out cutting operation.Crystal bar slowly advances downwards with workbench simultaneously, and by gauze, thousands of wafers just cuts and finishes crystal bar fully.The cutting of solar silicon wafers is that steel wire is being cut with silicon carbide micro-powder in fact, so the grain type of micro mist and granularity are the bright and clean degree of silicon chip table sheet and the key of cutting power.Grain type rule, the silicon chip that cuts out show will fineness fine; Even particle size distribution will improve the cutting power of silicon chip, and the micro mist in the old sand slurry is comprised of the silica flour that produces in the silicon chip cutting process, iron powder.Because after brand-new mortar has cut once, the cutting power of carborundum is also stronger in the old sand slurry, the higher suspendability that affects whole mortar of powder content during just old sand is starched, and part micro mist meeting packaged silicon carbide is surperficial, thus reduced the integral cutting ability of mortar.Generally adopt in the industry at present and improve the mortar manufacturing expense that mortar reclaims the usage ratio of product, the mode that reduces new mortar renewal amount merely reduces silicon chip processing.
Yet along with the development of mortar recovery technique, the old sand slurry has been realized Separation of Solid and Liquid.Reclaim carborundum, reclaim polyethylene glycol by step by step sieve worry, and cooperate coupling cutting, cleaning, reclaim product and can satisfy need of production fully.Adopting at present the usage ratio that reclaims product lower in the industry, mainly is to lack owing to reclaiming the product technology parameter and standard, therefore can not guarantee to reclaim the stability of carborundum quality.Also do not mate with using the ratio and the silicon chip cutting technique that reclaim carborundum in addition, cause the cutting qualification rate to reduce relevant, because along with the lifting of reclaiming the sand ratio, the whole circularity of carborundum can increase.In each cutting, use under the constant prerequisite of mortar total amount, broaching load, improve mortar and reclaim the carborundum usage ratio its integral cutting ability is descended, if do not seek the silicon chip cutting technique that matches, will cause the cutting qualification rate to reduce.
Therefore, how to confirm old sand slurry qualifying point, and under this qualifying point, improve the usage ratio that old sand is starched, the adjusting process parameter, greatly improve the utilization rate of old sand slurry, finally satisfy need of production, realize that the raising of economic benefit becomes this area problem in the urgent need to address.
Summary of the invention
For solving the problems of the technologies described above, the purpose of this invention is to provide a kind of method that reclaims the sand usage ratio in the silicon chip cutting of surveying of transferring.
For achieving the above object, technical scheme provided by the present invention is as follows:
A kind of accent surveyed the method that reclaims the sand usage ratio in the silicon chip cutting, may further comprise the steps:
Step 1 is determined a kind of speed of table, linear velocity, steel wire tension force, slurry temperature, slurry flow, guided wheel slot distance of cutting method, and recovery sand and brand-new sand mix in proportion use and carries out the silicon chip cutting;
Step 2 is passed through repeatedly cutting experiment, verifies out the size distribution situation, circularities, powder content and the pH value that reclaim carborundum in the recovery sand, and finds out the qualified optimum value of silicon chip that cutting is obtained, as the qualifying point that reclaims sand;
Step 3 reaches under the prerequisite of above-mentioned qualifying point in recovery chiltern amount, improve and reclaim the sand usage ratio, and by linear velocity parameter, raising steel wire tension parameters, the raising slurry flow parameter that reduces speed of table parameter, raising steel wire, the mode that reduces the slurry temperature parameter, make the Si wafer quality that cuts out qualified.
Further, the recovery sand in the described step 1 and brand-new sand ratio are 1:1.
Further, the speed of table is that 290um/min, linear velocity are 13.4m/s, to set steel wire tension force be that 23N, slurry temperature are that 23 ℃, slurry flow are that 140kg/min, guided wheel slot are apart from being 355um in the described step 1.
Further, the qualifying point that reclaims carborundum in the sand in the described step 2 is: the median diameter value be controlled at 9.8 ± 0.5um, powder content less than 30%, circularities less than 0.92, pH value 6～7.
Further, reclaiming the sand ratio in the described step 3, to be promoted to the ratio that reclaims sand and brand-new sand be 7:3.
Further, speed of table 280um/min, linear velocity 13.8m/s in the described step 3, set steel wire tension force 24N, 21 ℃ of slurry temperatures, slurry flow 145kg/min, guided wheel slot apart from 355um.
Further, in the cutting method of described step 1, cut elapsed time 10.3h, each cutting consumption steel wire amount 500km at every turn.
Further, in the cutting method of described step 3, cut elapsed time 10.5h, each cutting consumption steel wire amount 520km at every turn.
Adopt technique scheme, beneficial effect of the present invention has:
The present invention promotes modes such as reclaiming the sand quality by the optimization cutting method, realizes that silicon chip cutting qualification rate does not descend, and finally reaches the purpose that reduces silicon chip cutting processing cost after improving recovery sand usage ratio.
The product standard that the present invention only need adjust cutting technique, strict control recovery sand can put into production, be fit to industrial production in enormous quantities, can produce great economic benefit, and the abundant application of reclaiming product, also playing positive role aspect resources circulation, the environmental friendliness.
The specific embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
The invention provides a kind of method that reclaims the sand usage ratio in the silicon chip cutting of surveying of transferring, the method is: the speed of table of determining a kind of cutting method is that 290um/min, linear velocity are 13.4m/s, to set steel wire tension force be that 23N, slurry temperature are that 23 ℃, slurry flow are that 140kg/min, guided wheel slot are apart from being 355um, reclaiming sand is under the condition of 1:1 with the long-pending ratio of brand-new sand body, carry out the silicon chip cutting, cut elapsed time 10.3h, each cutting consumption steel wire amount 500km at every turn; By cutting experiment repeatedly, verify out the size distribution situation, circularities, powder content and the pH value that reclaim carborundum in the recovery sand, and find out to make and cut the qualified optimum value of silicon chip that obtains, qualifying point as reclaiming carborundum in the sand is specially: the median diameter value be controlled at 9.8 ± 0.5um, powder content less than 30%, circularities less than 0.92, pH value 6～7; Reach under the prerequisite of above-mentioned qualifying point in recovery chiltern amount, improve and reclaim the sand usage ratio, it is 7:3 that recovery sand ratio is promoted to the ratio that reclaims sand and brand-new sand, and by linear velocity parameter, raising steel wire tension parameters, the raising slurry flow parameter that reduces speed of table parameter, raising steel wire, the mode that reduces the slurry temperature parameter, make the Si wafer quality that cuts out qualified.The parameters of cutting method is particularly: speed of table 280um/min, linear velocity 13.8m/s, setting steel wire tension force 24N, 21 ℃ of slurry temperatures, slurry flow 145kg/min, guided wheel slot cut elapsed time 10.5h, each cutting consumption steel wire amount 520km apart from 355um at every turn.
The present invention is on the basis that increases the steel wire consumption, and same the mistake improved the usage ratio that the mode that reclaims the sand quality, optimizes cutting technique has improved recovery sand, significantly reduced the manufacturing expense of silicon chip processing, and then significantly reduced cutting cost.Debug out for the stable cutting technique that reclaims carborundum or recovery cutting liquid, use to greatest extent and reclaim product.Specifically, by determining to reclaim the silicon carbide products standard, as reclaim the carborundum granularity distribution situation, circularities, powder content, PH etc., realize reclaiming the carborundum stay in grade, by reducing the speed of table parameter of scroll saw cutting machine, improve the linear velocity parameter of the steel wire of scroll saw cutting machine, thereby improve the steel wire silt carrying capacity, improve cutting power, improve the steel wire tension parameters of scroll saw cutting machine, thereby reduce steel wire line bow, thereby the slurry flow parameter that improves the scroll saw cutting machine improves the steel wire silt carrying capacity, improves cutting power, and the modes such as slurry temperature parameter that reduce the scroll saw cutting machine are carried out the technique adjustment of cutting method, be that technological parameter and current recovery sand usage ratio adapt, make and strictly controlling in the situation of the product quality that reclaims sand the more usage ratio that increases recovery sand, be widely used in the actual production, will produce great economic benefit, and reclaim the application of product, in resources circulation, the environmental friendliness aspect also plays positive role.
Embodiment 1
Reclaim chiltern amount standard (namely reclaiming chiltern amount control point): the median diameter value be controlled at 9.8 ± 0.5um, powder content less than 30%, circularities less than 0.92, pH value 6～7.
Brand-new sand use amount 350L reclaims sand use amount 150L, reclaims the chiltern amount: the median diameter value is that 10.0um, powder content are 25%, circularities is 0.89, pH value 6.5, meets and reclaims the sand Application standard; The parameters of cutting method is: speed of table 280um/min, linear velocity 13.8m/s, setting steel wire tension force 24N, 21 ℃ of slurry temperatures, slurry flow 145kg/min, guided wheel slot cut elapsed time 10.5h, each cutting consumption steel wire amount 520km apart from 355um at every turn.The silicon chip surface quality that obtains after the cutting is good, kerf value 10.2um, and TTV value 15.5um, silicon chip cutting qualification rate is 96.5%.
Embodiment 2
Reclaim chiltern amount standard (namely reclaiming chiltern amount control point): the median diameter value be controlled at 9.8 ± 0.5um, powder content less than 30%, circularities less than 0.92, pH value 6～7.
Brand-new sand use amount 350L reclaims sand use amount 150L, reclaims the chiltern amount: the median diameter value is that 10.0um, powder content are 25%, circularities is 0.89, pH value 6.5, meets and reclaims the sand Application standard; The parameters of cutting method is: speed of table 288um/min, linear velocity 13.5m/s, setting steel wire tension force 23.5N, 22 ℃ of slurry temperatures, slurry flow 142kg/min, guided wheel slot cut elapsed time 10.35h, each cutting consumption steel wire amount 505km apart from 355um at every turn.The silicon chip surface poor quality who obtains after the cutting, kerf value 11.5um, TTV value 16.8um, silicon chip cutting qualification rate is 95.5%.
Embodiment 3
Reclaim chiltern amount standard (namely reclaiming chiltern amount control point): the median diameter value be controlled at 9.8 ± 0.5um, powder content less than 30%, circularities less than 0.92, pH value 6～7.
Brand-new sand use amount 350L reclaims sand use amount 150L, reclaims the chiltern amount: the median diameter value is that 10.0um, powder content are 25%, circularities is 0.89, pH value 6.5, meets and reclaims the sand Application standard; The parameters of cutting method is: speed of table 285um/min, linear velocity 13.6m/s, setting steel wire tension force 23.8N, 22.5 ℃ of slurry temperatures, slurry flow 143kg/min, guided wheel slot cut elapsed time 10.4h, each cutting consumption steel wire amount 510km apart from 355um at every turn.The silicon chip surface poor quality who obtains after the cutting, kerf value 10.9um, TTV value 16.3um, silicon chip cutting qualification rate is 96.0%.
Embodiment 4
Reclaim chiltern amount standard (namely reclaiming chiltern amount control point): the median diameter value be controlled at 9.8 ± 0.5um, powder content less than 30%, circularities less than 0.92, pH value 6～7.
Brand-new sand use amount 350L reclaims sand use amount 150L, reclaims the chiltern amount: the median diameter value is that 10.0um, powder content are 25%, circularities is 0.89, pH value 6.5, meets and reclaims the sand Application standard; The parameters of cutting method is: speed of table 283um/min, linear velocity 13.7m/s, setting steel wire tension force 23.9N, 21.8 ℃ of slurry temperatures, slurry flow 144kg/min, guided wheel slot cut elapsed time 10.45h, each cutting consumption steel wire amount 515km apart from 355um at every turn.The silicon chip surface poor quality who obtains after the cutting, kerf value 10.5um, TTV value 15.8um, silicon chip cutting qualification rate is 96.3%.
Embodiment 5
Reclaim chiltern amount standard (namely reclaiming chiltern amount control point): the median diameter value be controlled at 9.8 ± 0.5um, powder content less than 30%, circularities less than 0.92, pH value 6～7.
Brand-new sand use amount 350L reclaims sand use amount 150L, reclaims the chiltern amount: the median diameter value is that 10.2um, powder content are 27%, circularities is 0.90, pH value 6.3, meets and reclaims the sand Application standard; The parameters of cutting method is: speed of table 280um/min, linear velocity 13.8m/s, setting steel wire tension force 24N, 21 ℃ of slurry temperatures, slurry flow 145kg/min, guided wheel slot cut elapsed time 10.5h, each cutting consumption steel wire amount 520km apart from 355um at every turn.The silicon chip surface quality that obtains after the cutting is good, kerf value 10.4um, and TTV value 15.7um, silicon chip cutting qualification rate is 96.4%.
Embodiment 6
Reclaim chiltern amount standard (namely reclaiming chiltern amount control point): the median diameter value be controlled at 9.8 ± 0.5um, powder content less than 30%, circularities less than 0.92, pH value 6～7.
Brand-new sand use amount 350L reclaims sand use amount 150L, reclaims the chiltern amount: the median diameter value is that 9.3um, powder content are 23%, circularities is 0.85, pH value 6.8, meets and reclaims the sand Application standard; The parameters of cutting method is: speed of table 280um/min, linear velocity 13.8m/s, setting steel wire tension force 24N, 21 ℃ of slurry temperatures, slurry flow 145kg/min, guided wheel slot cut elapsed time 10.5h, each cutting consumption steel wire amount 520km apart from 355um at every turn.The silicon chip surface quality that obtains after the cutting is good, kerf value 9.8um, and TTV value 14.8um, silicon chip cutting qualification rate is 96.7%.
The above embodiment has only expressed embodiments of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (8)
1. transfer the method for surveying recovery sand usage ratio in the silicon chip cutting for one kind, it is characterized in that, may further comprise the steps:
Step 1 is determined a kind of speed of table, linear velocity, steel wire tension force, slurry temperature, slurry flow, guided wheel slot distance of cutting method, and recovery sand and brand-new sand mix in proportion use and carries out the silicon chip cutting;
Step 2 is passed through repeatedly cutting experiment, verifies out the size distribution situation, circularities, powder content and the pH value that reclaim carborundum in the recovery sand, and finds out the qualified optimum value of silicon chip that cutting is obtained, as the qualifying point that reclaims sand;
Step 3 reaches under the prerequisite of above-mentioned qualifying point in recovery chiltern amount, improve and reclaim the sand usage ratio, and by linear velocity parameter, raising steel wire tension parameters, the raising slurry flow parameter that reduces speed of table parameter, raising steel wire, the mode that reduces the slurry temperature parameter, make the Si wafer quality that cuts out qualified.
2. the method that reclaims the sand usage ratio in the silicon chip cutting surveyed in accent according to claim 1, it is characterized in that, the recovery sand in the described step 1 and brand-new sand ratio are 1:1.
3. the method that reclaims the sand usage ratio in the silicon chip cutting surveyed in accent according to claim 2, it is characterized in that, the speed of table is that 290um/min, linear velocity are 13.4m/s, to set steel wire tension force be that 23N, slurry temperature are that 23 ℃, slurry flow are that 140kg/min, guided wheel slot are apart from being 355um in the described step 1.
4. the method that reclaims the sand usage ratio in the silicon chip cutting surveyed in accent according to claim 3, it is characterized in that, the qualifying point that reclaims carborundum in the sand in the described step 2 is: the median diameter value be controlled at 9.8 ± 0.5um, powder content less than 30%, circularities less than 0.92, pH value 6～7.
5. the method that reclaims the sand usage ratio in the silicon chip cutting surveyed in accent according to claim 4, it is characterized in that, reclaiming the sand ratio in the described step 3, to be promoted to the ratio that reclaims sand and brand-new sand be 7:3.
6. the method that reclaims the sand usage ratio in the silicon chip cutting surveyed in accent according to claim 5, it is characterized in that, speed of table 280um/min, linear velocity 13.8m/s, setting steel wire tension force 24N, 21 ℃ of slurry temperatures, slurry flow 145kg/min, guided wheel slot are apart from 355um in the described step 3.
7. reclaim the method for sand usage ratio in the accent survey silicon chip according to claim 6 cutting, it is characterized in that, in the cutting method of described step 1, cut elapsed time 10.3h, each cutting consumption steel wire amount 500km at every turn.
8. reclaim the method for sand usage ratio in the accent survey silicon chip according to claim 7 cutting, it is characterized in that, in the cutting method of described step 3, cut elapsed time 10.5h, each cutting consumption steel wire amount 520km at every turn.
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| CN106444630A (en) * | 2016-11-24 | 2017-02-22 | 常州协鑫光伏科技有限公司 | On-line regulation method and apparatus of mortar |
| CN108000739A (en) * | 2017-11-28 | 2018-05-08 | 江苏奥明能源有限公司 | A kind of mortar cutting method |
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