CN103229084B - The method manufacturing multiple Optical devices for camera - Google Patents

The method manufacturing multiple Optical devices for camera Download PDF

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Publication number
CN103229084B
CN103229084B CN201180039940.6A CN201180039940A CN103229084B CN 103229084 B CN103229084 B CN 103229084B CN 201180039940 A CN201180039940 A CN 201180039940A CN 103229084 B CN103229084 B CN 103229084B
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lens module
wafer
lens
seat element
ffl
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CN103229084A (en
Inventor
H·拉德曼
P·伦琴
M·马卢克
M·罗西
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Ams Sensors Singapore Pte Ltd
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Heptagon Micro Optics Pte Ltd
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Priority claimed from PCT/CH2011/000180 external-priority patent/WO2012022000A1/en
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Abstract

The present invention relates to a kind of manufacture multiple Optical devices for camera (20a) method, each optics (20a) has the lens module (2a) of fixed focal length for assembling with the imageing sensor comprising image sensor plane (5), each universal focus lens module (2a) includes one or more lens (17a, 18a) or lens component, and the method includes: manufacture multiple lens module (2a..d);Determining lens module value for each lens module (2a..d), wherein said lens module value is relevant to the flange focal distance length (FFL) of respective lens module (2a..d);nullThere is provided to lens module (2a..b) and distribute seat element (3a..b),And described seat element (3a..b) is arranged in described Optical devices (20a) with the spacing distance (6a..b) fixed limiting between described lens module (2a..b) and described image sensor plane (5),The basal seat area segment length (7a..b) of described seat element (3a..b) is variable,Thus,Geometric distance (6a) between described lens module (2a) and described image sensor plane (5) is adjusted for each lens module (2a..d) optical characteristics according to lens module (2a..b) individually or in units of group,Change with offset lens module lens module value between the plurality of lens module (2a..b),So that the described focal plane of described lens module falls in described image sensor plane (5);Assemble described lens module (2a) and seat element (2a), to form Optical devices (20a).

Description

The method manufacturing multiple Optical devices for camera
Technical field
The present invention relates to the field of the digital camera device of such as CMOS or CCD camera.It relates to Manufacture the method for Optical devices, for the Optical devices of this camera and containing described Optical devices Photographing unit.
Background technology
Nowadays, in manufactured electronic equipment (including mobile phone, computer, web camera etc.) very A big part is integrated with camera, the most integrated camera optics element.Increasingly it is important that this Plant camera and can be economically fabricated (such as parallel processing), and they have the fewest machinery Parts that are upper complexity, manufacture difficulty or that need careful process.In particular for mobile phone and Other application, is continuously increased the demand of thin (extension i.e. prolonging optic axis is little) of camera.But Such integrated camera can be obtained with the demand of resolution and also constantly increasing.
For economic reasons, the parts (such as lens module) of Optical devices are often with wafer scale manufacture. Therefore first being produced wafer or wafer stacking by the process of automatization, it comprises multiple same item (example Such as lens module), the most in a following processing step by separating these from wafer or wafer stacking Same item is partitioned into all parts.
The Optical devices of such as lens module also comprise the photovoltaic element with imageing sensor, described light Electric unit defines the image sensor plane being disposed with image sensor element thereon.This photoelectricity list Unit can be as described above with wafer scale manufacture.Such manufacturing process is to it is known in the art, example As described in the open WO 20,09/,076 786 of patent.
Module includes the layout of one or more lens or lens component, for incident illumination at camera The guiding of the image sensor plane of photovoltaic element and distribution.This lens module has fixing Jiao Away from, during described fixed focal length is arranged such that once lens module is assembled into Optical devices, this fixing Jiao Away from being matched with the distance between the lens module of photovoltaic element and the plane of imageing sensor.Therefore method Blue focal length (FFL) defines described fixed focal length, and described flange focal distance corresponds to lens (or object lens) Last physical plane (i.e., under existing conditions, the plane nearest towards sensor of wafer) And the distance between the focal plane (i.e. sensor side) on object opposition side to be imaged.Therefore, flange Focal length is facies digitales dorsales manus FFL.In order to realize high image definition, focal plane and image sensor plane Must be consistent.That is, the large-scale production of camera optics device uses fixed focus lenses module, All lens modules must have constant FFL.
But, due to manufacturing tolerance, wafer or the lens module of wafer stacking assembly and/or different crystalline substances The lens module of sheet or wafer stacking assembly has the FFL value of change to a certain extent.Namely Saying, the FFL value of lens module is partial to Normal Distribution, as shown in FIG. 3.It will be apparent that FFL is not positioned at the lens module at this normal distribution center and is dropped, because the focus of lens module Plane will be far from image sensor plane.But, in order to the production making Optical devices is more economical, need The fewest abandons lens module.In order to reduce above-mentioned manufacturing tolerance, production process can only have Improved in the degree of limit.Therefore, it is necessary to find the parts that other method is dropped with minimizing.
It is well known in the art that, lens are assembled into cylinder and base, then focus on figure being assembled into As on sensor.One shortcoming of this method is to need extra assembly cost, and this is to be walked by focusing Suddenly cause.Owing to cylinder/base solution is the most relatively large, therefore another shortcoming is that it accounts for With bigger camera space.It addition, this method has so-called " foreign body " on the image sensor Risk.Because the granule of this cylinder/base may be fallen on sensor when focus operation.
It is also known in the art that, assembling lens can be carried out by fixed focal length, such as, carry to all of lens For having bottom interval thing or the base of fixing height.The method overcomes the shortcoming of said method, But there is following risk: (this is by it if having specific FFL distribution at the lens of a production batch Conventional manufacturing tolerance causes), many assembling lens are incited somebody to action not in focus and therefore yield can be at a fairly low.
Summary of the invention
It is an object of the present invention to provide the manufacturer of a kind of multiple Optical devices for camera Method, economical and there is the fewest scrap.It is a further object to provide for basis Multiple Optical devices of this camera that the manufacture method of the present invention is produced.
As has already been mentioned above, each Optical devices include having one or more lens or lens The universal focus lens module of part.Described universal focus lens module be for there is image sensing The photovoltaic element of device assembles, and described imageing sensor has image sensor plane.
Described photovoltaic element can be the part according to Optical devices defined in present patent application.Pass Sensor component is disposed in the image sensor plane of imageing sensor.Light is conducted through lens mould Block is to image sensor plane, and irradiates on the sensor element.Therefore, light is properly oriented Sensor plane is important.Imageing sensor can include the array of pel array, i.e. sensing element. Imageing sensor can e.g. CMOS active pixel sensor (APS), also referred to as cmos sensor Or ccd sensor.
Now, the method comprises the following steps:
Manufacture multiple lens module;
Lens module focusing parameter value is determined for each lens module;
There is provided to lens module and distribute seat element, during wherein seat element is arranged in Optical devices To limit the fixed interval distance between lens module and image sensor plane, the base of seat element Section length is variable, accordingly, for each lens module individually or in units of group according to thoroughly The optical characteristics of mirror module adjusts the geometric distance between lens module and image sensor plane, to mend Repay the change of lens module focusing parameter value between multiple lens module, so that Jiao of lens module Plane falls on the image plane, particularly in image sensor plane, or is positioned at and includes optics In the focal depth of the camera of device;
Assembling lens module and seat element, to form Optical devices.
Focusing parameter is preferably focal length, especially flange focal distance (FFL).Can also is that relevant to focal length Other parameters, such as effective focal length (EFL).If relating to FFL in ensuing explanation, The most in the appropriate case, FFL can also mean upper focusing parameter.
If focusing parameter is FFL, the determination step of the focusing parameter value of lens module can include directly Connect or indirectly measure FFL value or can include determining that the specific optical characteristics of lens module, wherein These optical characteristics flange focal distance based on corresponding lens module (FFL).
In a preferred embodiment of the invention, the production of lens module farther includes following step Rapid:
Manufacture one or more than one wafer or wafer stacking assembly, each wafer or wafer stacking Assembly contains multiple lens module;
Every wafer or wafer stacking components apart are become single lens module.
Seat element has several function, is summarized as follows:
-it carries lens module, and lens module can be made the most operable with photovoltaic element Ground connects;
-its restriction lens module and photovoltaic element position relative to each other;And
The variable focusing parameter value of-offset lens module, particularly FFL value, to guarantee lens mould The focal plane of block falls in image sensor plane.
Said method step can also be carried out in a different order.But, the step of method must be to patrol Collect upper significant order to carry out.
The basal seat area segment length (h1, b1) of seat element, particularly in base FFL section length the end of at Between limit stops and the image sensor plane of the lens module on seat element, and limit seat element On lens module limit stops and image sensor plane between total distance in a length field Between.Falling on the image sensor to realize the focal plane of lens module, described total distance needs to be adjusted The whole actual focusing parameter value for corresponding lens module, especially FFL value.This is had by offer The seat element having variable basal seat area segment length (h1) realizes.
Variable basal seat area segment length (h1, b1) is corresponding to a length of interval of seat element, wherein Described length of interval is parallel to assemble photovoltaic element and the axis of lens module.Especially, seat element Variable basal seat area segment length (h1, b1) connect with first by the second contact surface on seat element Touch the distance between surface or stayed surface and limit, by base unit described in described second contact surface Part is supported on photovoltaic element at it towards the side of photovoltaic element or connects directly or indirectly In the component parts of photovoltaic element, described first contact surface or support lens module with Form limit stops.Therefore, the distance between the first and second contact surfaces defines the variable end Seat section length (h1, b1).Optics is preferably arranged the institute for making all optics It is identical for stating the distance between the second contact surface and described image sensor plane.
According to the method for optimizing of further improvement of the present invention, further include steps of
Definition at least two class focuses on parameter value, and particularly FFL class, every class includes that lens module focuses on One scope of parameter value, such as FFL value, or lens module focusing parameter value, such as FFL value A scope, it is in the possibility of the lens module focusing parameter value (such as FFL value) of lens module In the range of distribution;
Based on lens module focusing parameter value, such as FFL value, each lens module is assigned to certain One class;
There is provided to each class and distribute at the bottom of a class of basal seat area segment length (h1, b1) with restriction Seat element, the class that wherein said basal seat area segment length (h1, b1) will be assigned to according to seat element Lens module focusing parameter value (such as FFL value) and limit or will be divided according to seat element The scope of the lens module focusing parameter value (such as FFL value) of the class being fitted on and determine;
To each one seat element being assigned to such of distribution in a class lens module.
Lens module is distributed to a certain class to realize, wherein lens module by getting rid of step Unaccommodated class is excluded until being left correct class.By relative method, lens module can also be classified.
In a preferred embodiment of the invention, described seat element all kinds of between, base unit The basal seat area segment length (h1, b1) of part is graded at defined intervals, such as 5-15 μm, especially It is 10 μm.Interval between all kinds of seat elements is the most constant.If available focusing parameter The spectrum of value (especially FFL value) is divided with the interval of 10 μm, then the base unit of 10 types Part and corresponding 10 class FEL value scopes cover the FFL value of total size 100 μm.Due to position In limit FFL value in the range of lens module quantity along with the distance at normal distribution center Increase and reduce rapidly, deep outlier be preferably not included in the step for not included in, and will be by Scrap.
As it has been mentioned, lens module is preferably with wafer scale manufacture (that is, replicating), wherein Described lens module is based preferably on wafer stacking assembly.Duplication process can include molding or embossing work Skill step.Such as publication EP-A-1 443 344, EP-A-1 837 165, EP-A-1 837 167 He The technique that WO 20,09/,076 786 discloses manufacture (i.e. replicating) lens module.
Therefore, wafer stacking assembly includes multiple lens module.Wafer stacking assembly itself preferably wraps Containing the first wafer and the second wafer.First and second wafers are replicated with multiple for lens module Lens arrangement, wherein the first wafer forms multiple first lens unit, the second wafer forms multiple second Lens unit.First and second wafers are engaged and are such as spaced apart by spacer wafer.I.e. wafer Overlie one another.Spacer wafer can have multiple through hole, and it is directed at the lens arrangement replicated, so that Saturating through first and second uninterruptedly by the light of one or more lens of the first lens unit Space between mirror unit.Alternatively, the object side of the first wafer, it is disposed with in the face of object to be imaged Band maskaperture mask wafer or block wafer.The lens alignment of the lens module of hole and wafer stacking assembly. Porose covering is provided for stopping veiling glare.As it has been described above, cover wafer or block wafer and also may be used To be applied to another chip design for lens module production.Additionally or alternatively, such as first Wafer can include a non transparent layer or multiple nontransparent layer by layer, non transparent layer can form screening together Gear, such as, described by WO 20,09/,076 787, it is incorporated herein by.
In the most further improving at one of the present invention, photovoltaic element also with wafer scale manufacture, Wherein manufactured wafer or wafer stacking assembly comprise multiple photovoltaic element.Then wafer or crystalline substance Sheet stack assemblies is separated into single photovoltaic element.
Present invention additionally comprises the multiple Optical devices for camera manufactured according to foregoing invention method.One Multiple lens modules of group Optical devices have variable focusing parameter value, particularly flange focal distance (FFL).Each Optical devices include seat element.Seat element has variable basal seat area segment length (h1, b1), particularly base FFL section, the base FFL section of wherein said seat element (h1, B1) the lens module FFL value of corresponding Optical devices is adapted to, so that the focal plane of lens module falls In image sensor plane.Described lens module e.g. designs for having the camera of same design 's.For the manufacture of lens module, preferably form lens with identical lens or identical battery of lens Module.But, due in lens module use parts production process in manufacturing tolerance and/ Or due to the manufacturing tolerance in lens module, the FFL between lens module can be different.
Seat element preferably has the shape of the cylindrical elements of hollow, and it accommodates lens module.The end Seat element can to have circle, the oval or form of prismatic cylinder, particularly can also have one long The shape of cube.The ring that seat element can within it comprise at least one projection or circumference protrudes inwardly from, It forms the first contact surface of lens module and as the complete backstop (dead stop) of lens module Or stayed surface uses, this lens module from bottom or from top (as respectively from the of seat element Two contact surfaces and in terms of focal plane) be directed to described seat element.Backstop completely, i.e. first Contact surface, it is also possible to hidden element by the gear at least partly closed and contact table at seat element with second Formed on the end face that face is relative.It can be opaque or transparent that gear hides element.This gear hides element can example The form of the most inside circular protrusion.It is preferably integrated with seat element additionally, gear hides element A part.Therefore, the first contact surface of above-mentioned complete backstop define basal seat area segment length (h1, B1) a border.
Second contact surface of seat element is designed to, when seat element assembles with photovoltaic element, and court To photovoltaic element, and it is designed on photovoltaic element support seat element directly or indirectly.Should The annular anterior of surface e.g. seat element.When fitting together with photovoltaic element, seat element Basal seat area segment length (h1, b1) be preferably dimensioned to be, for the seat element of all classes, base unit Distance between second contact surface and the image sensor plane of photovoltaic element of part, the most so-called dress Put section length (h2, b2), particularly device FFL section, keep constant.
Backstop (at least one particularly described projection) is at the axial direction (D) of seat element completely On relative to the position of described second contact surface and design, the most described first contact surface is relative to institute State the position of the second contact surface, limit the variable basal seat area segment length of seat element.Therefore, right In inhomogeneous focusing parameter value, particularly FFL value, the first contact surface of seat element is along hollow The axial direction (D) (it is corresponding to assembling axle) of cylindric seat element relative to second surface away from From difference, thus realize the variable basal seat area segment length change with offset lens module of seat element Focusing parameter value.Seat element can the most separately fabricated, can also be with wafer scale manufacture.They Can such as be produced by molding process.But, an importance of the present invention is: base section Length (geometric distance between lens module and imaging plane is adjusted by this basal seat area segment length) Can produce with seat element one or be produced by last part technology step, but always at seat element quilt Produce before before being assigned to lens module and assembling with lens module.
The invention provides a kind of for assembling, be assembled into camera formation optics dress respectively with photovoltaic element " prefocus (the pre-focused) " module put.Therefore, when being assembled into camera or be assembled into camera Afterwards or with photovoltaic element assembling process in or with photovoltaic element assemble after, be all made without into The focus steps of one step.
Present invention additionally comprises multiple camera containing Optical devices as above.
Accompanying drawing explanation
Subject of the present invention by with reference to preferred embodiment illustrated in the accompanying drawings in following text Illustrate in greater detail.Figure schematically shows:
Fig. 1 illustrates the wafer stacking assembly including multiple lens module;
Fig. 2 illustrates the lens module gone out from the wafer stacking components apart according to Fig. 1;
Fig. 3 illustrates the FFL value of lens module or depends on the distribution of value of FFL;
Fig. 4 illustrates seat element;
Fig. 5 illustrates the FFL value of the lens module limiting type or depends on the distribution of value of FFL;
Fig. 6 illustrates the first embodiment of one group of Optical devices;
Fig. 7 illustrates imageing sensor;
Fig. 8 illustrates the Optical devices adding photovoltaic element;
Fig. 9 illustrates according to the FFL value in the whole manufacture process of the present invention or the value that depends on FFL Distribution;
Figure 10 illustrates the second embodiment of one group of Optical devices.
Reference marks and their implication arrange in list of numerals in a generalized form in the accompanying drawings Go out.In principle, identical part is with identical reference marks labelling in the drawings.
Detailed description of the invention
Fig. 1 schematically shows the wafer stacking assembly 1 including multiple lens module 2a..d.Lens mould Monomer after block 2a..d separates is also referred to as lens chip.The composition of wafer stacking assembly 1 includes One and second wafer 23,25, each wafer 23,25 is containing multiple lens arrangement 17a..d, 18a..d (referring also to Fig. 2).That the plastics that lens arrangement 17a..d, 18a..d are the most transparent are made or can To comprise transparent plastics, the most transparent curable epoxy resin.They can such as be copied to On the surface of described first and second wafers 23,25.First and second wafers 23,25 can be by moulding Material or glass manufacture maybe can comprise plastics or glass.The lens arrangement 17a..b of the first wafer 23, with Chip carrier part together, limits the first lens unit 13a..b, and each first lens unit is used for One lens module 2a..b.The lens arrangement 18a..b of the second wafer 25 together with chip carrier part, Limiting the second lens unit 15a..b, each second lens unit is used for a lens module 2a..b. First and second lens unit 13a..b, 15a..b of lens module 2a..b form described lens module The lens of 2a..b arrange (Fig. 2).
First and second wafers 23,25 are spaced apart by spacer wafer 24.Spacer wafer 24 includes Multiple spacer element 14a..b, each spacer element is used for a lens module 2a..d.Interval crystalline substance Sheet 24 farther includes multiple opening or through hole 26a..b, each opening or through hole for an interval Element 14a..b, i.e. one lens module 2a..b.The lens cloth of through hole 26a..b and lens module 2a..d Put alignment, so that light can pass through the first lens unit 13a..b, through hole 26a..b and the second lens list Unit 15a..b.First and second wafers 23,25 and spacer wafer 24 are preferably bonded together, example As passed through bonding agent.
On the Free Surface of the first wafer 23, wafer stacking assembly also comprises one and covers wafer 22, Which defines multiple shadowing elements 12a..b, each shadowing elements is used for a lens module 2a..b. Covering wafer 22 and comprise multiple hole 16a..b, each hole is used for a shadowing elements 12a..b.Hole The lens of 16a..b and lens module 2a..d are arranged and are alignd, so that incident illumination is arranging it by lens Before be introduced into and pass through hole 16a..b.Shadowing elements 12a...b is used for preventing less desirable veiling glare from entering Arrange with by lens.Cover wafer 22, be arranged on the first wafer 23, face away from image and pass The direction of sensor plane 5.Cover wafer 22 can be adhered on the first wafer 23, such as by viscous Connect agent.
Certainly, wafer stacking assembly 1 as shown in FIG. 1 is not to produce uniquely may be used of lens module The wafer scale constituted mode of energy.Lens module can also be designed to be based only upon one and comprise lens arrangement Wafer or based on the plural wafer comprising lens arrangement.Interval is need not in the case of the first Wafer, needs more than one spacer wafer in the latter case to be isolated from each other wafer.It addition, Lens arrangement can be provided in the one or both sides on wafer.
Due to manufacturing tolerance, the geometry that such as may can cause lens arrangement is different, lens module Flange focal distance (FFL) 6a..d of 2a..d is variable.The focal plane 27a..d of i.e. lens module 2a..d It is variable with distance 6a..d of lens devices.It is multiple that Fig. 3 shows corresponding to standard profile The FFL value of mirror module or depend on exemplary distribution 19a of value of FEL, it is caused by manufacturing tolerance.
Fig. 4 shows the first embodiment of the seat element 3b of so-called top loading type.Title " top Portion's loading type " refer to that the lens module 2b inside from inserted base element 3b above is (from focal plane 27b Observe).Seat element has cylindrical shape or the rectangular shape of hollow.Inwall at seat element 3b Upper offer circular protrusion, it limits the internal diameter of hollow cylinder.Circular protrusion and hollow cylinder concentric arrangement. The inner space of seat element 3b accommodates lens module 2b, the most above-mentioned projection formed the first contact or Stayed surface 10, (is also shown in form Optical devices 20a in the inner space importing seat element 3b Time Fig. 6), it is as the complete backstop of lens module 2b.Seat element 3b at it towards photoelectricity list The side of unit 4 forms the second contact surface 11, further to assemble with photovoltaic element 4.In this feelings Under condition, before the second contact surface 11 is the annular of the seat element 3b with hollow cylinder arranged concentric End.Once include Optical devices 20a and the photovoltaic element 4 groups of lens module 2a and seat element 3a It is filled with and forms the Optical devices (seeing Fig. 8) being added, by the second contact table on photovoltaic element 4 Face 11 supports seat element 3a..b directly or indirectly.But when Optical devices 20a and photovoltaic element 4 When being operatively coupled on together, it is also possible to form the Optical devices 20a being added the most in the camera.
Distance 7a..7b pair between described second contact surface 11 and first contact surface 10 of projection Answer base FFL section h1.As shown in Figure 6, the base FFL section h1 of seat element 3a..b is Variable and adapt to the FFL value of corresponding lens module 2a..b with the lens module 2a..b described in compensation FFL value change.The transmutability of base FFL section h1 is by ring-shaped protrusion 9a..b edge The diverse location of the axis D of empty cylinder base element 3a..b and realize.Seat element 3a..b's Distance between second contact surface 11 and image sensor plane 5 (respectively focal plane 27a..b) 8 (also referred to as device FFL section h2) are constant.Enforcement according to " top loading base " Example, the flange focal distance length FFL 6a..d of lens module 2a..d is corresponding to variable base FFL section H1 and the summation of constant device FFL section h2.
According to Fig. 9, in the FFL value of first step A each lens module 2a..d or depend on FFL Value determine by such as measuring.In step B subsequently, lens module 2a..d is true according to it Fixed value classification, particularly FFL value.To this, there are several FFL class or group, have five classes here: I, II, III, IV, V, the most each FFL class limits a value scope, particularly FLL value scope. Each lens module 2a..d is assigned to a FFL class now.Outlier can be dropped.
For each class or group, about the position (i.e. projection) of the first contact surface, along described axle Line D provides the seat element of specific design relative to described second contact surface.In step C, often The lens module of individual FFL apoplexy due to endogenous wind and the seat element being assigned to such assemble mutually.
Owing to each FFL class not only contains a value, but the value in the range of, particularly FFL Value, the lens module of a certain FFL class still has variable value, particularly FFL value.Such FFL The distribution 19b of value is in fig .9 shown in step B.Y-axis represents the quantity of seat element, x-axis represents FFL value or depend on the value of FFL.But, in the FFL value of the camera lens module 2a..d of an apoplexy due to endogenous wind Variable 19b is much smaller than overall distribution 19a, no matter so the margin of tolerance is how many, lens module Focal plane can fall substantially in the image sensor plane 5 of imageing sensor 4.At Fig. 5 and Tu In 9 (steps C), it is shown that lens module be classified after cumulative distribution 19c of FFL value.As Can see from figure, the change of FFL value is much smaller compared to distribution 19a, therefore lens mould Because of underproof FFL variable quantity, abandoning of causing is reduced or even can be eliminated block.
Figure 10 shows second enforcement of one group of seat element 43a..b of so-called " end loading type " Example.Title " end loading type " refers to that lens module 42a..b is inserted into seat element 43a..b from below Inside (as viewed from the 57a..b of focal plane).Seat element 43a..b has cylinder or the length of hollow Cube shape.On the end face of the seat element 43a..b of opposed second contact face 51a..b placement, the end Seat element 43a..b comprises limit stops 49, and it forms the first contact surface, thus prevents the lens inserted Module 42a..b moves the further of direction of insertion.In this case, limit stops 49 is cover The form of 49, it covers the opening of seat element 43a..b, contrary with the second contact surface 51a..b. Cover 49 is designed to have the shadowing elements in hole 56.Hole 56 is directed at the lens of lens module 42a...b. The shadowing elements with hole 56 is provided for stopping veiling glare.But, limit stops can also It it is the form of circular protrusion on the end face of described seat element.
The inner space of seat element 43a..b accommodates lens module 42a..b, and the most above-mentioned cover 49 is formed First contact or stayed surface 50, when introducing the inner space of seat element 43a..b to form optics dress When putting 60a..b, it is as the complete backstop of lens module 42a..b.Seat element 43a..b is in its face Also have to the side of photovoltaic element (not shown) the second contact surface 51a..b with photovoltaic element Assemble.In this case, the second contact surface 51a..b is that of seat element 43a..b is ring-type Front end (circular, prismatic or any other shapes of), it is disposed concentrically upon into open circles Cylinder.Once include Optical devices 60a..b and the light of lens module 42a..b and seat element 43a..b Electric unit is assembled to form the Optical devices 60a..b being added, then by the second contact surface 51 at light Seat element 43a..b is supported directly or indirectly on electric unit.But when Optical devices 60a..b and light When electric unit is operatively coupled on together, it is also possible to form the optics dress being added the most in the camera Put 60a..b.
Distance 47a..b between first contact surface 50 of described second contact surface 51a..b and cover 49 Corresponding to variable base FFL section bl.As shown in Figure 10, the base FFL of seat element 43a..b Section bl is variable, and the FFL value adapting to corresponding lens module 42a..b is described to compensate The FFL value change of lens module 42a..b.The transmutability of base FFL section bl is by base unit (along the base length of axis D) that the variable height of part 43a..b realizes.Seat element 43a..b The second contact surface 51a..b and image sensor plane (respectively focal plane 67a..b) between Distance 48, also referred to as device FFL section b2, be all constant for all optical assemblies 60a..b 's.
According to the embodiment of " bottom loaded base ", flange focal distance length FFL of lens module 42a..d 46a..b and lens chip height 70, b4 summation corresponding to variable base FFL section 47a..b, H1 and fixing device FFL section 48, the summation of h2.Height b4 as lens chip 42a..b Like that.
Although describing the present invention with currently preferred embodiment, but remain a need for being expressly understood this Invention is not limited to this, and can also other modes carry out various concrete within the scope of the claims Performance and enforcement.
Reference annotates
1: the wafer stacking assembly of lens module
2a..d: lens module
3a..b: seat element
4: there is the photovoltaic element of imageing sensor
5: image sensor plane
The FFL of 6a..d: lens module
7a..b: variable base FFL section (h1)
8: constant device FFL section (h2)
9a..b: circular protrusion
10: the first contact surfaces
11: the second contact surfaces
12a..b: shadowing elements
13a..b: the first lens unit
14a..b: spacer element
15a..b: the second lens unit
16a..b: masking aperture
The lens arrangement of the 17a..b: the first lens unit
The lens arrangement of the 18a..b: the second lens unit
The FFL distribution of 19a: all lens modules
The FFL distribution of 19b:I-V class and classification
Accumulation FFL distribution after the classification of 19c: lens module
20a..b: Optical devices
22: cover wafer
23: the first wafers
24: spacer wafer
25: the second wafers
26a..b: through hole
27a..d: focal plane
42a..b: lens module
43a..b: seat element
The FFL (lens FFL) of 46a..b: lens module
47a..b: variable base FFL section (b1)
48: constant device FFL section (b2)
49: cover element (shadowing elements)
50: the first contact surfaces
51a..b: the second contact surface
56: masking aperture
60a..b: Optical devices
67a..b: focal plane
70: the height (b4) of lens chip

Claims (9)

1. for the method manufacturing multiple Optical devices for camera (20a), each optics Device (20a) have fixed focal length lens module (2a) and for comprise imageing sensor put down The seat element (3a) that the imageing sensor in face (5) assembles, wherein said lens module is for having The camera of same design and design, the lens module (2a) of each fixed focal length includes one or many Individual lens (17a, 18a) or lens component, the method comprises the following steps:
Manufacturing multiple lens module (2a..d), the most all lens modules are same wafer or crystalline substance The part of sheet stack assemblies;
Lens module focusing parameter value (FP) is determined for each lens module (2a..d);
There is provided to lens module (2a..b) and distribute seat element (3a..b), described seat element (3a..b) to be arranged in described Optical devices (20a) with limit described lens module (2a..b) and Fixing spacing distance (6a..b) between described image sensor plane (5), described base unit The basal seat area segment length (7a..b) of part (3a..b) is variable, accordingly, for each lens module (2a..d) optical characteristics according to lens module (2a..b) adjusts described individually or in units of group Geometric distance (6a) between lens module (2a) and described image sensor plane (5), to mend Repay the change of lens module focusing parameter value between multiple lens module (2a..d), so that described The focal plane of lens module falls on the described plane of delineation, or is positioned at and comprises described Optical devices (20a) Camera focal depth in;
Assemble described lens module (2a) and seat element (2a), to form Optical devices (20a);
Wherein said method further includes steps of
Definition at least two class focuses on parameter value (FP), and every class includes characterizing lens module (2a..d) Lens module focusing parameter value or a scope of lens module focusing parameter value;
Based on a determination that lens module focusing parameter value (6a..d), by each lens module (2a..d) It is assigned to a certain class and focuses on parameter value;
Focusing on parameter value to each class to provide and distribution one class seat element, such seat element has The basal seat area segment length (7a..b) limited, it depends on the class that seat element (3a..b) is assigned to Lens module focusing parameter value or the scope of lens module focusing parameter value;
To each one base being assigned to such of distribution in a class lens module (2a..b) Element (3a..b).
Method the most according to claim 1, wherein said focusing parameter corresponds to flange focal distance (FFL) or corresponding to lens module parameter based on flange focal distance, and wherein said method includes Following step: directly or indirectly measuring or logical by the FFL value of respective lens module (2a..d) Cross the parameter determining flange focusing length (FFL) (6a..d) based on respective lens module (2a..d) Value determines described lens module focusing parameter value.
Method the most according to claim 1, the manufacture of wherein said lens module (2a..d) Method is further comprising the steps of:
Manufacture one or more than one wafer or wafer stacking assembly (1), each wafer or stack of wafers Stacked group part contains multiple lens module (2a..d);
Each wafer or wafer stacking assembly (1) are separated into single lens module (2a..d).
Method the most according to claim 1, wherein said lens module replicates with wafer scale, And wherein said duplication process includes molding or embossing.
Method the most according to claim 1, wherein said seat element (3a..b) all kinds of Between, the described basal seat area segment length (7a..b) of described seat element (3a..b) is with 5-10 μm Interval is graded.
Method the most according to claim 3, wherein, due to the manufacturing tolerance of lens arrangement, The described lens module (2a..d) of wafer or wafer stacking assembly (1) or different wafers or wafer Lens module (2a..d) between stack assemblies (1) has different focusing parameter values.
Method the most according to claim 1, including following manufacturing step: manufacture one or many Individual wafer stacking assembly (1), each wafer stacking assembly (1) contain multiple lens modules (2a..b), Wherein said wafer stacking assembly (1) comprises the first wafer (23a) and the second wafer (25a), The multiple lens arrangements (17a..b, 18a..b) for lens module (2a..b) it are provided with on each wafer, Such as replicate, and wherein said first and second wafers (23a, 25a) are by spacer wafer (24a) In conjunction with, described spacer wafer (24a) there is multiple through hole (16a..b), wherein said through hole (16a, 16b) align with described lens arrangement (17a..b, 18a..b).
Method the most according to claim 1, wherein said Optical devices also include photovoltaic element (4), each photovoltaic element has the imageing sensor comprising image sensor plane (5), and light Electric unit (4) manufactures on a wafer level, and wherein manufactured wafer or wafer stacking assembly comprise many Individual photovoltaic element (4), and wherein wafer or wafer stacking assembly are separated into single photovoltaic element (4), photovoltaic element (4), lens module (2a..b) and seat element (3a..b) are with the company of operation Access node is combined.
9. the method manufacturing camera, comprises according to the manufacture light of any one in claim 1-8 Learn the step of device, also include step Optical devices being inserted camera.
CN201180039940.6A 2010-08-17 2011-08-12 The method manufacturing multiple Optical devices for camera Active CN103229084B (en)

Applications Claiming Priority (3)

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US37432210P 2010-08-17 2010-08-17
US61/374322 2010-08-17
PCT/CH2011/000180 WO2012022000A1 (en) 2010-08-17 2011-08-12 Method of manufacturing a plurality of optical devices for cameras

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CN103229084A CN103229084A (en) 2013-07-31
CN103229084B true CN103229084B (en) 2016-11-30

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CN1682377A (en) * 2002-09-17 2005-10-12 皇家飞利浦电子股份有限公司 Camera device, method of manufacturing a camera device, wafer scale package
US7329861B2 (en) * 2003-10-14 2008-02-12 Micron Technology, Inc. Integrally packaged imaging module
CN101226949A (en) * 2007-01-15 2008-07-23 采钰科技股份有限公司 Image sensing apparatus and encapsulation method thereof

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Publication number Priority date Publication date Assignee Title
CN1656615A (en) * 2002-05-30 2005-08-17 皇家飞利浦电子股份有限公司 Electronic imaging device
CN1682377A (en) * 2002-09-17 2005-10-12 皇家飞利浦电子股份有限公司 Camera device, method of manufacturing a camera device, wafer scale package
US7329861B2 (en) * 2003-10-14 2008-02-12 Micron Technology, Inc. Integrally packaged imaging module
CN101226949A (en) * 2007-01-15 2008-07-23 采钰科技股份有限公司 Image sensing apparatus and encapsulation method thereof

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