CN103221896B - Portable electric appts - Google Patents

Portable electric appts Download PDF

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Publication number
CN103221896B
CN103221896B CN201180047961.2A CN201180047961A CN103221896B CN 103221896 B CN103221896 B CN 103221896B CN 201180047961 A CN201180047961 A CN 201180047961A CN 103221896 B CN103221896 B CN 103221896B
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CN
China
Prior art keywords
connector
chip
pcb
flexible circuit
housing
Prior art date
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Active
Application number
CN201180047961.2A
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Chinese (zh)
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CN103221896A (en
Inventor
F·R·罗斯科普
P·M·霍布森
A·米特尔曼
A-K·施德莱特斯基
E·S·乔尔
S·B·林奇
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Apple Inc
Original Assignee
Apple Computer Inc
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Filing date
Publication date
Priority claimed from US12/859,694 external-priority patent/US8634204B2/en
Priority claimed from US12/859,701 external-priority patent/US8427379B2/en
Priority claimed from US12/859,702 external-priority patent/US8391010B2/en
Priority claimed from US12/859,712 external-priority patent/US8477492B2/en
Priority claimed from US12/859,711 external-priority patent/US8515113B2/en
Priority claimed from US12/950,793 external-priority patent/US9602914B2/en
Application filed by Apple Computer Inc filed Critical Apple Computer Inc
Publication of CN103221896A publication Critical patent/CN103221896A/en
Application granted granted Critical
Publication of CN103221896B publication Critical patent/CN103221896B/en
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1688—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being integrated loudspeakers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1698—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/114—Pad being close to via, but not surrounding the via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Abstract

There is provided the modularization material antenna module including antenna block, the antenna block has a part, and the part has the corresponding part interlocking with non-conductive framework and antenna block is fixed to the shape of non-conductive framework.The non-conductive framework is attached to the inside of conductive shell, so that non-conductive framework and conductive shell form overall structure.Then, antenna flexible cable is mechanically secured to antenna block.Antenna flexible cable can also be electrically connected to circuit board.Framework is designed to support the lid glass of portable electric appts, and can be affixed on housing.The dielectric constant of antenna block is more much smaller than the dielectric constant of framework.

Description

Portable electric appts
Technical field
The present invention relates to consumer products, more particularly to portable electric appts.
Background technology
Portable electric appts can take many forms, such as, for example, iPadTMThe tablet computing device, such as of series iPhoneTMPortable communication device or such as iPodTMPortable electronic device, each be by The Apple Inc. manufactures of Cupertino, CA..These equipment generally have wireless communication mechanism, to provide portable setting Radio communication between standby and base station, cellular tower, desktop computer etc..Common wireless communication mechanism includes IEEE 802.11a, b, g and n (commonly referred to " WiFi "), worldwide interoperability for microwave accesses (WiMAX) and such as global system for mobile communications (GSM) and CDMA (CDMA) cellular communication mechanisms.Need for by antenna be integrated into portable electric appts so as to The improved technology of radio communication can be carried out.
The content of the invention
The compact-folded configuration of integrated antenna package
Inventionbroadly, embodiment disclosed herein describes to be very suitable in such as kneetop computer, mobile phone, net book electricity The memory chip package used in the consumer-elcetronics devices of brain, portable electronic device and panel computer is designed.More specifically Ground, the encapsulation of memory chip for describing to be used in the lightweight consumer-elcetronics devices with thin compact shell is designed.Make Designed with the encapsulation of memory chip and be referred to alternatively as in associated description " foldable memory devices ".The foldable memory sets It is standby to can solve the problem that the assembling related to multiple chips are used in the electronic device, electrical connection and RF shielding problems.It is discussed further below Method and apparatus for realizing these chip packages.
In one embodiment of chip package designs described herein, multiple chips can be coupled to flexible circuit company Device is connect to form memory devices.Flexible circuit connector can include the data and the power traces that are used by chip.Flexible electrical Two chips located adjacent one another on path connector can be by the spaced-apart with certain length of the flexible circuit connector.When When installing memory devices on an electronic device, flexible circuit connector can bend or turn round in the part of each chip chamber Turn, to allow chip directed change relative to each other.
By means of the bending and torsion of chip chamber flexible circuit connector, memory devices can be matched somebody with somebody in installation process It is set to multiple orientations.For example, in a step of installation process, the first chip for being connected to flexible circuit connector can be with The orientation on the second chip side offside ground.The orientation the second chip can be attached to the component of such as printed circuit board (PCB) (PCB) When use.Then, during second step, flexible circuit connector part between the first and second chip can roll over It is folded, so as to allow the directed change between the first chip and the second chip.For example, after folding, the first chip and the second core Piece can be alignd and be combined together with stack arrangement.In general, when memory devices include two or more chip, can be with By the way that multiple steps are in different positioning bendings or fold the flexible circuit connector and adjust each chip determining relative to each other To untill chip is assembled in final package arrangements.
In a particular embodiment, flexible circuit connector can be padded including metal connector, for flexible circuit to be connected Device is connect to be connected to metal framework or other metal parts and be thus grounded.For the ease of ground connection, flexible circuit connector can be The region interior folding of neighbouring connector gasket, thus allows connector gasket to be bound to a particular surface, such as metal framework Surface.When being appropriately grounded, flexible circuit connector may be used to form a part for faraday cup.
In one embodiment, faraday cup can be used for preventing radio frequency (RF) signal of chip generation from reaching installed in just Take the antenna in formula computing device.Antenna can be the part of the wave point used in equipment.Connected using flexible circuit The part that device forms faraday cup rather than separate metallic shield can realize more frivolous design, because flexible electrical Path connector is thinner and lighter compared to the typical metal part shielded for RF.For example, typically being formed using stainless steel For the faraday cup of RF shieldings.The thickness of flexible circuit connector can be the thickness of the parts of stainless steel for using in this way About 1/6.
In a specific embodiment, describe to be installed in portable computing device and be attached to flexible circuit connector The method of memory chip.The method can include：1) the first chip is attached to the second core via flexible circuit connector Piece；2) first chip that enables that the first chip is attached to printed circuit board (PCB) is positioned in metal framework the thus metal frame Frame at least partially surrounding the position of first chip at, wherein the metal framework is mutually coupled with the printed circuit board (PCB)；3) fold soft Property circuit connector simultaneously makes the second chip be alignd with the first chip；4) the second chip is attached to the first chip via adhesive, Wherein described first chip and second chip are alignd and are combined with stack arrangement；5) by the one of flexible circuit connector Part is connected to the one side or the multi-lateral of metal framework and is thus grounded, so as to avoid RF signals from being leaked from the first chip and the second chip Go out (as described above, the RF signals of leakage can influence to be the antenna of portable computing device work)；And 6) will be including the first core The component of piece, the second chip, metal framework and printed circuit board (PCB) is installed in portable computing device.
Inner frame for optimizing hardness and heat transfer
Inventionbroadly, embodiment disclosed herein describe to be highly suitable for consumer-elcetronics devices (such as kneetop computer, Mobile phone, net book computer, portable electronic device and panel computer) structure member.Especially, this document describes such Structure member, its treatment intensity related to the design of the lightweight consumer-elcetronics devices with thin compact shell and heat problem. There is also described herein the method for forming these structure members.
In one embodiment, consumer-elcetronics devices can be the slim type portable electronic equipment with display.This is thin The inside arrangement of the part of type portable electric appts can be counted as the layer of multiple stackings.The layer of stacking can with relative to The certain height of device thickness is related.Various parts of appliance, such as, but not limited to display circuit, CPU, loudspeaker, memory, nothing Line telecommunication circuit and battery, can be arranged and be distributed on the layer of stacking.
One layer in the layer of stacking can be inner frame.Inner frame can be couple to slim type portable electronic equipment External shell.Inner frame can be configured to provide heat point for the part of the heating in the layer adjacent with inner frame With ability, such as radiate.Further, inner frame can be used to the overall structure hardness of increase equipment.In addition, interior sash Frame is used as the attachment point of the miscellaneous equipment part (such as display) used in equipment.
In one embodiment, inner frame can be the interior metal framework formed by multilayer different metal.For example, interior Portion's metal framework can include the intermediate layer between two exterior layers, and the intermediate layer is formed by the first metal, described two Individual exterior layer is formed by the second metal.First metal and the second metal can respectively according to them intensity and/or thermal conduction characteristic To select.Additionally, the thickness of each layer can be different, to strengthen its intensity or thermal characteristics.In one embodiment, it is internal The different metal layer of metal framework can be combined using coating.
In a particular embodiment, the first metal for intermediate layer can be selected mainly according to its thermal conduction characteristic, be made Obtain intermediate layer and potentially act as radiator, and being used for two the second metals of exterior layer can mainly be selected as lifting interior metal The intensity of framework, so as to improve the integral hardness of equipment.Generally speaking, the first metal and the second metal can be selected as improving Thermal conduction characteristic, strength characteristics (for example, hardness), environmental characteristics (for example, corrosion resistance) and aesthetic are (for example, equipment Outward appearance) in one or more.For example, intermediate layer can be formed by copper, and this is come selection and two according to its thermal characteristics Individual exterior layer can be formed by stainless steel, and this is come selection according to its strength characteristics.In another embodiment, for two Second metal of exterior layer may be selected so that each exterior layer can serve as radiator, and be used for first gold medal in intermediate layer Category can then be selected according to its strength characteristics.
The first metal when used for the intermediate layer of interior metal framework main is selected so as to intermediate layer according to its thermal characteristics When potentially acting as radiator, one or more holes internally can be set in the exterior layer of metal framework.Can be determined in each hole Position is the heat generating components in nearby device.Heat bridge can be provided, so as to will be with this via the hole of neighbouring heat generating components in exterior layer The associated surface of heat generating components is thermally coupled to the intermediate layer of interior metal framework.In a particular embodiment, heat bridge can be by welding Connect material or heat conductive adhesive brings to be formed.
Synthesis Mike's wind cabin is sealed and mechanical attributes with optimizing
Inventionbroadly, embodiment disclosed herein describes to be very suitable in such as kneetop computer, mobile phone, net book electricity The microphone assembly used in the consumer-elcetronics devices of brain, portable electronic device and panel computer is designed.Microphone assembly May be mounted to that in consumer-elcetronics devices, and by being related to the application of SoundRec to be utilized.More specifically, microphone assembly can quilt For wireless communications application, such as digital telephone.
Microphone assembly can include being coupled to the microphone and Mike's wind cabin (microphone boot) of circuit board.When Microphone assembly is installed in when in equipment, for sound provides pipe between the hole that Mike's wind cabin can be in microphone and apparatus casing Road.Typically, Mike's wind cabin includes being used for the hollow shell of sound conduction to microphone.Then, the sound from device external The hole that ripple can enter in housing, is then being received by Mike's wind cabin and by microphone.
Once the hole that sound wave has passed through in external shell enters, the purpose for tonequality is expected to minimize by enclosure interior Any sound it is mixed with the sound (sound for such as, being generated by the internal loudspeaker in equipment) for coming into Mike's wind cabin Close.In order to avoid sound penetrates into Mike's wind cabin, expect Mike's wind cabin two ends set up can during equipment operation quilt Maintain the high-seal integrality (without being broken).Typically, one end of Mike's wind cabin can be sealed to the table of enclosure interior Face, and the other end of Mike's wind cabin can then be sealed to microphone.Microphone discussed further below and that there is good seal performance The related method and apparatus of storehouse design.
Synthesis Mike wind cabin can include the compressible centering portions being placed between the cap of two ends, both end of which cap by compared to The less compressible material of centering portions is made.For example, end cap can be made up of hard plastic material, and centering portions then can be by more Soft plastic material (such as silastomer) is made.As a further example, end cap can be made up of softer plastic material, and centering portions are then Can be made up of harder plastic material.In general, end cap and centering portions can be made up of the material of different hardness respectively. In one embodiment, the relative hardness of every kind of material can be selected to improve the sealing integrity of synthesis Mike's wind cabin and/or subtract Shake attribute.
Synthesis Mike wind cabin includes the hollow inside that can be formed by dijection Shooting Technique.Can be in the every of dijection Shooting Technique Different materials is used during penetrating respectively.For example, harder plastic material can be used during first launches, and in another hair Softer plastic material is used during penetrating.The material used in per injection can be selected, so that by it during Shooting Technique Be combined together.
In another embodiment, the end cap and centering portions of synthesis Mike's wind cabin can be separately formed and then be stacked Together.For example, end cap or centering portions can be moulded separately or are punched.End cap and centering portions can be stacked and protect Hold in place, and without by each part physical bond each other.For example, each part can such as exist in some manner by mechanical constraint They are pressed together to be held in place when part is arranged in equipment.
During installation, contact adhesive (PSA) can be attached to every one end of synthesis Mike's wind cabin.Then, via PSA, The one end for synthesizing Mike's wind cabin can be bound to the surface being associated with microphone, and opposite end is bound to the interior table of housing Face.Compression stress can be applied to synthesis Mike wind cabin.For example, the microphone group including printed circuit, microphone and Mike's wind cabin Part can be fixed to housing in the way of compression stress is applied in Mike's wind cabin.The major part of the compression stress can be by closing Centering portions into Mike's wind cabin are carried, and thus cause the reduction of thickness.The centering portions of compression can be to synthesis Mike's wind cabin End cap apply outward force, thus enable and promote between the housing on PSA and Mike's wind cabin one end and PSA and Mike's wind cabin Excellent sealing on opposite end between microphone.This realization can cause the sound of 40dB or bigger to be isolated.
In a particular embodiment, Mike's wind cabin can be formed hollow circular cylinder, although can also utilize it when expecting His shape.Mike's wind cabin can include the centering portions being placed between the cap of two ends.In one embodiment, the size of each end cap and Shape can be with roughly equal.In other embodiments, the size and dimension of each end cap can be with difference.For example, Mike's wind cabin One end can be sealed to the crooked inner surface of housing, and therefore the end cap in face of this internal Mike's wind cabin of housing can be formed To comply with the shape of the inner surface, better seal is consequently formed and kept.
In one embodiment, a kind of method for manufacturing portable computing device is described.The method can include determining that Synthesize size, shape and the materials synthesis of Mike's wind cabin.Then, synthesis Mike's wind cabin can be formed.Synthesis Mike's wind cabin Can be formed using dijection Shooting Technique.Next, can by the opposite end of synthesis Mike's wind cabin respectively with portable meter The microphone of calculation equipment and the inner surface of housing are combined.It is, for example possible to use PSA is used as bonding agent.Including synthesis microphone The microphone assembly of storehouse, microphone and printed circuit board (PCB) can be fixed to housing so that synthesis Mike's wind cabin is held in place simultaneously Keep sealing.Then, the component of the portable computing device that can complete to include synthesis Mike's wind cabin.
Modularization material antenna module
Inventionbroadly, disclosed embodiments describe a kind of modularization material antenna module including antenna block, institute Stating antenna block has a part, and the part has the corresponding part interlocking with non-conductive framework and is fixed to antenna block does not lead The shape of electric framework.The non-conductive framework is attached to the inside of conductive shell, to cause non-conductive framework and the conductive shell bodily form Integral structure.Then, by antenna block mechanical support antenna flexible cable, and antenna flexible cable is electrically connected to circuit Plate.Framework is designed to support the lid glass for portable electric appts, and can be affixed on housing.Antenna block Dielectric constant is more much smaller than the dielectric constant of framework.In one embodiment, antenna block is made up of cyclic olefin polymer (COP), And framework is made up of glass filled plasticses.The synthesis difference of dielectric constant and framework and the interlocking portions and dielectric of antenna block The difference of loss angle tangent is combined and improves antenna performance.
In another embodiment, there is provided a kind of method of assembly portable formula electronic equipment.In this embodiment, carry Conductive shell is supplied.Then, non-conductive framework is adhered to the inside of conductive shell, to form overall structure.Non-conductive framework It is made up of the material with the first dielectric constant.Then, by the tool of the part by antenna block with first shape and framework The part for having the second shape corresponding to first shape is interlocked, and antenna block is fixed on framework.Antenna block is situated between by with second The antenna block of material of electric constant is made, and the second dielectric constant is more much smaller than the first dielectric constant.Then, antenna is supported by antenna block Flexible cable.
In another embodiment, there is provided a kind of computer-readable medium with computer code, the computer Code is used to be attached to non-conductive framework the inside of conductive shell, to form overall structure, wherein non-conductive framework is by having The frame material of the first dielectric constant is made.This can be included for controlling robotic arm to be adhered to conductive shell with by non-conductive framework The computer code of the inside of body.The computer-readable medium can also include be used for by by antenna block with first shape Part and framework the interlocking of the part with the second shape corresponding to first shape and antenna block is fixed to the meter of framework Calculation machine code.This can be included for controlling robotic arm to perform the computer code of interlocking.The computer-readable medium may be used also With including for causing by the computer code of antenna block mechanical support antenna flexible cable.This can include automatic for controlling Screwdriver is by antenna flexible cable screwing in antenna block and be screwed into the computer code of the conducting bracket for being soldered to housing.
The PCB of formation
Inventionbroadly, embodiment disclosed herein describes to be very suitable in such as kneetop computer, mobile phone, net book electricity The printed circuit board (PCB) (PCB) used in the consumer-elcetronics devices of brain, portable electronic device and panel computer.More specifically, PCB design is described to solve the problems, such as encapsulation when using the lightweight consumer-elcetronics devices with slim compact case.Will description For designing and form the method for PCB and the exemplary embodiment of PCB.
In one embodiment, consumer-elcetronics devices can be the slim type portable electronic equipment with display.It is slim The inside arrangement of part of the portable electric appts in its shell is regarded as the layer of multiple stackings, is driven including display The display and battery of dynamic device circuit can take up the part of the stack layer.Such as, but not limited to CPU, storage can be arranged The remainder of device, acoustic component, wave point, data connector, power connector and associated circuit is being adapted to neighbouring display The layer not being occupied of device, display circuit and battery, or to be occupied by these parts but the layer that is not yet fully used Part.More specifically, the PCB design of description can allow to be adapted to various electronic units and be connected to one another at Anomalistic space Interior, these Anomalistic spaces are located in device housings and are arranged by larger part of appliance and are fixed in the shell institute afterwards .
In a particular embodiment, can be provided in the multi-layer PCB of the relative thin used in portable computing device.Should Multi-layer PCB can be formed as planar configuration.During the assembling of portable computing device, PCB can some regions bending with Can be installed with non-planar configuration.This crooking ability can be more efficiently used for for PCB fitting in the larger of such as battery After part is mounted in remaining free space in shell.
Multi-layer PCB can include multiple basalises and multiple trace layers, and wherein each trace layer is formed at the top of basalis. In order to form trace layer, the gold can be then removed in the solid layer of the conducting metal of basalis deposited atop such as copper Belong to the part of layer to form conductive trace.In order to install PCB with non-planar configuration, expection can be born the region of more macrobending Interior conductive trace is made significantly thicker.Conductive trace can be used for being coupled the part with PCB electric couplings.Each part is located at the top of PCB Side and/or bottom side are connected to other internal parts to fit in free space or when needed.
The hardness of multi-layer PCB can be locally adjusted to allow the circuit board to be easy to be bent in specific region and be difficult at it Bent in his region.Typically, trace layer is only included for will be coupled to the trace that the part of pcb board is linked, and wherein The excess stock for not being used to form trace can be removed.In one or more described trace layers, excess stock can be used for Change the hardness property of PCB.For example, can unnecessary trace material be retained in some trace layer regions to increase these regions The total hardness of neighbouring PCB, while removing the material in other regions to increase the flexibility of PCB.
In a particular embodiment, trace layer can be dedicated to adjust the hardness property of PCB.Can be mainly for Its hardness property rather than its conductive property select the material of trace layer.In this layer, the part of layer can be removed to reduce PCB Hardness and increase remove material near PCB flexibility.In one embodiment, it is possible to use the shape note of such as Nitinol Recall alloy.
In one embodiment, main logic board can be formed by the multi-layer PCB.The main logic board can include via narrow connection The first rectangle part and the second rectangle part that part is linked.The such as part of processor, memory and audio codec The main logic board can be coupled to.The main logic board can be shaped as to fit in and battery is arranged on into the outer of portable computing device After in shell in space remaining, on battery top, under bottom and along battery side.The main logic board can be with Plane or non-planar configuration are installed.
Use the ending connecting audio of the connector in small form factor electronic equipment
A kind of personal media device, at least includes：Housing with multiple openings, wherein at least one openings house is by cloth The housing port for exporting the Part I by the audible energy generated comprising Audio generator in the housing is set to, and at least Another opening is the replacement port for broadcasting the Part II of the audible energy generated by the Audio generator.In shell ends When at least a portion of mouth is blocked, at least some energy in the Part I of audible energy are redirected to replacement port, Thus the perception of the audio output level to the audible energy for exporting is kept to be basically unchanged.
In the one side of described embodiment, replacing port is not seen by the user of individual media substantially with a kind of holding To mode be incorporated to connector opening.In another aspect, connector opening accommodates data connector, and in another aspect, Connector opening accommodates audio jack.
A kind of method for describing in the described embodiment can be carried out by least performing following operation.One shell is provided Body, the housing has the size and shape for being adapted to encirclement for providing multiple functional units of function for personal media device；Will Loudspeaker assembly is attached to enclosure interior；Loudspeaker assembly is acoustically coupled to external rings by configuration via the first audio output port First air path in border；Configuration is located at loudspeaker assembly and the second audio output port independently of the first audio output port Between the second air path, thus the first audio output port and the second audio output port are physically oriented to work as sound When one of frequency output port is by solid blockade, at least another audio output port keeps not being blocked, and uses the first He The sub-audible sound generated by loudspeaker assembly is collaboratively delivered to external environment condition by the second audio output port.
Described is a kind of integrated sub-audible sound output system being incorporated in personal media device.In described implementation In example, personal media device at least includes processor, voicefrequency circuit and data holding unit, and the latter at least includes an audible Sound generator unit.The sub-audible sound maker unit is arranged to according to the retrieval from data holding unit, by audio-frequency electric Road decodes and produces sub-audible sound by the voice data of processor treatment.The integrated sub-audible sound output system includes：The One audio output port, wherein first audio output port is acoustically coupled to sub-audible sound via the first air path generating Device unit.The system also includes being coupled via the second air path acoustics the second audio port of sub-audible sound maker.First The sub-audible sound for collaboratively generating sub-audible sound maker unit with the second air path is via the first audio port and second Audio port is delivered to external environment condition.
In another embodiment, describe a kind of for storing computer program by computing device and in personal matchmaker The non-transitory computer-readable medium used in the area of computer aided component of body equipment.The computer-readable medium at least includes： Computer code for providing housing, the housing has the multiple for being adapted to encirclement for providing function for personal media device The size and shape of functional unit；Computer code for loudspeaker assembly to be attached to enclosure interior；To be raised for configuring Sound device assembly is acoustically coupled to the computer code of the first air path of external environment condition via the first audio output port；For Configuration is located at loudspeaker assembly and independently of the second air path between the second audio output port of the first audio output port Computer code so that the first audio output port and the second audio output port are physically located into and work as audio output port One of by solid blockade when, at least another audio output port keep be not blocked.In the operating process of personal media device In, the first air path and the second air path are given birth to using the first and second audio output ports and collaboratively by loudspeaker assembly Into sub-audible sound be delivered to external environment condition.
In a general sense, disclosed embodiments describe a kind of modularization material antenna module including antenna block, institute Stating antenna block has a part, and the part has the corresponding part interlocking with non-conductive framework and is fixed to antenna block does not lead The shape of electric framework.The non-conductive framework is attached to the inside of conductive shell, to cause non-conductive framework and the conductive shell bodily form Integral structure.Then, by antenna block mechanical support antenna flexible cable, and antenna flexible cable is electrically connected to circuit Plate.Framework is designed to support the cover glass for portable electric appts, and can be affixed on housing.Antenna block Dielectric constant is more much smaller than the dielectric constant of framework.In one embodiment, antenna block is made up of cyclic olefin polymer (COP), And framework is made up of glass filled plasticses.The synthesis difference of dielectric constant is situated between with the interlocking portions and electricity of framework and antenna block The difference of matter loss angle tangent is combined and improves antenna performance.
In another embodiment, there is provided a kind of method of assembly portable formula electronic equipment.In this embodiment, there is provided Conductive shell.Then, non-conductive framework is glued to inside conductive shell to form overall structure.Non-conductive framework is by having The frame material of the first dielectric constant is made.Then, by by a part for the antenna block with first shape with have and this The part interlocking of the framework of the second corresponding shape of first shape, the framework is fixed to by the antenna block.Antenna block by Antenna block of material with the second dielectric constant much smaller than the first dielectric constant is formed.Then antenna can be supported by the antenna block Flexible cable.
In another embodiment, there is provided a kind of computer-readable medium with computer code, the code is used In non-conductive framework being fixed to inside conductive shell to form overall structure, wherein the non-conductive framework is by with the first dielectric The frame material of constant is made.The medium can also include being glued to conduction with by the non-conductive framework for robotic arm The computer code of enclosure interior.The computer-readable medium may also include by by one of the antenna block with first shape Divide and the antenna block is fixed to the frame with the part interlocking of the framework with second shape corresponding with the first shape The computer code of frame.The medium can also include being used for computer code of the robotic arm to perform interlocking.The calculating Machine computer-readable recording medium may also include the computer code for causing antenna flexible cable to be supported by antenna block machinery.The medium is also Can include for controlling automatic screwdriver antenna feed screw is fixed to the conduction rack of antenna block and welded case.
By the detailed description below in conjunction with accompanying drawing, other aspects and advantages of the present invention will become obvious, wherein Accompanying drawing illustrates principle of the invention by way of example.
Brief description of the drawings
By the detailed description below in conjunction with accompanying drawing, described embodiment will become prone to understand, wherein similar is attached Icon note represents similar structural detail, and wherein：
For the compact-folded configuration of integrated antenna package
Figure 1A is the perspective of the foldable memory devices in the first pre-assembled configuration of the embodiment according to described by Figure.
Figure 1B is the perspective of the foldable memory devices in the second pre-assembled configuration of the embodiment according to described by Figure.
Fig. 1 C are the flexible circuit connector perspective views for foldable memory devices of the embodiment according to described by.
What Fig. 2 showed the embodiment according to described by is coupled to printed circuit board (PCB) (PCB) in assembled configuration The top view of foldable memory devices.
Fig. 3 shows cutting for the portable computing device including foldable memory devices of the embodiment according to described by Face figure.
What Fig. 4 showed the embodiment according to described by is coupled to printed circuit board (PCB) (PCB) in pre-assembled configuration The top view of foldable memory devices.
Fig. 5 A-5C show that the different attachment method of the use of the embodiment according to described by is coupled to PCB and and metal The perspective view of the foldable memory devices that framework is mutually attached.
Fig. 5 D show the perspective of the foldable memory devices for being coupled to PCB 1214 of the embodiment according to described by Figure, wherein PCB is with ground using conduction with the contact site of foldable memory devices.
Fig. 6 shows the foldable memory for being coupled to PCB in pre-assembled configuration of the embodiment according to described by The top view of equipment.
Fig. 7 is that the assembling of the embodiment according to described by includes the side of the portable computing device of foldable memory devices The flow chart of method.
Fig. 8 A show the top view of the portable electric appts of the embodiment according to described by.
Fig. 8 B show the bottom view of the portable electric appts of the embodiment according to described by.
Fig. 8 C show the block diagram of the media player of the embodiment according to described by.
Inner frame for optimizing hardness and heat transfer
Fig. 9 A show the top view of the portable electric appts of the embodiment according to described by.
Fig. 9 B show the bottom view of the portable electric appts of the embodiment according to described by.
Fig. 9 C show the block diagram of the portable electric appts of the embodiment according to described by.
Fig. 9 D show the sectional view of the portable electric appts of the embodiment according to described by.
Figure 10 A and 10B show the top view and bottom view of the inner frame of the embodiment according to described by.
Figure 10 C show the top view of the inner frame of the embodiment according to described by.
Figure 11 A-11B show the sectional view of the inner frame of the embodiment according to described by.
Figure 12 A-12B show according to described by embodiment, be thermally coupled to multiple equipment part inner frame cut Face figure.
Figure 13 is the embodiment according to described by, the flow of the method for portable electric appts of the manufacture with inner frame Figure, wherein the inner frame is configured to have specific thermal-structural behaviour.
Figure 14 is the embodiment according to described by, is configured to the block diagram of the portable electric appts of media player.
Synthesis Mike's wind cabin is sealed and mechanical attributes with optimizing
Figure 15 A-15C show the microphone assembly including microphone and Mike's wind cabin of the embodiment according to described by Perspective view.
Figure 16 A-16B show that being in portable computing device housing for the embodiment according to described by is differently directed Microphone assembly perspective view.
Figure 17 A-17B show the embodiment according to described by housing in pre-installed position and installation site The side view of microphone assembly.
Figure 17 C show the side view of the microphone assembly in the housing in response to externally applied force.
Figure 18 A-18D show the sectional view and top view of the synthesis Mike's wind cabin according to preferred embodiment.
Figure 19 is the stream of the method for including synthesizing the portable computing device of Mike's wind cabin according to the manufacture of preferred embodiment Cheng Tu.
Figure 20 A show the top view of the portable electric appts of the embodiment according to described by.
Figure 20 B show the bottom view of the portable electric appts of the embodiment according to described by.
Figure 20 C are the block diagrams of the media player of the embodiment according to described by.
Modularization material antenna module
Figure 21 shows a top perspective view, which illustrates the representative consumer products of the embodiment described by basis.
Figure 22 shows the top perspective view of the modularization material antenna module according to one embodiment.
Figure 23 shows the first sectional view of the modularization material antenna module according to one embodiment.
Figure 24 shows the second sectional view of the modularization material antenna module according to one embodiment.
Figure 25 shows the extended view of the top perspective view of the modularization material antenna module according to one embodiment.
Figure 26 depicts a kind of interchangeable interlocking shape according to one embodiment.
Figure 27 depicts a kind of interchangeable interlocking shape according to another embodiment.
Figure 28 depicts a kind of interchangeable interlocking shape according to one embodiment.
Figure 29 depicts a kind of interchangeable interlocking shape according to another embodiment.
Figure 30 is a flow chart, which depict the side for assembly portable formula electronic equipment according to one embodiment Method.
Figure 31 is the block diagram of portable consumer devices according to an embodiment of the invention.
The PCB of formation
Figure 32 A and 32B show the perspective view and portable meter of the portable computing device of the embodiment according to described by The block diagram of calculation equipment.
Accompanying drawing 33A, 33B and 33C show perspective view and the side of the flexible main logic board of the embodiment according to described by View.
Accompanying drawing 34A, 34B and 34C show the perspective view of flexible PCB of the embodiment according to described by, top view and Bottom view.
Figure 35 A-35C show the top view of the flexible PCB of various bending configurations.
Figure 36 A-36E show the side view of the flexible PCB of various bending configurations.
Figure 37 A show the side cross-sectional view of multi-layer PCB.
Figure 37 B show two top views of trace layer of the multi-layer PCB of Figure 37 A.
Figure 38 is the flow chart of the method that portable computing device is manufactured using multi-layer PCB.
Figure 39 is the block diagram of the portable computing device with media play function of the embodiment according to described by.
Use the ending connecting audio of the connector in small form factor electronic equipment
Figure 40-41 is the perspective of each view of the personal media device for having assembled completely for showing according to embodiments of the present invention Figure.
Figure 42 shows the viewgraph of cross-section of portable electric appts.
Figure 43 shows the zoomed-in view of a part for housing shown in the Fig. 2 seen in front view.
Figure 44 is the side view for the part for showing housing shown in Figure 43, wherein be highlighted output audio port with Relation between sound reflective surfaces.
Figure 45 shows the view of the interior section of the personal media device according to described embodiment.
Figure 46 shows the zoomed-in view of the part shown in Figure 45.
Figure 47 shows the viewgraph of cross-section along Figure 45 lines A-A.
Figure 48 shows using audio jack to transmit another embodiment of sub-audible sound.
Figure 49 details flow chart of the description according to the treatment of described embodiment.
Figure 50 is the block diagram of the arrangement of the functional module that portable media device is utilized.
Figure 51 is the block diagram of the suitable media player being used together with described embodiment.
Specific embodiment
Numerous details will be illustrated in the following detailed description, to provide the bottom on described embodiment The comprehensive understanding of concept.It will be apparent however, to one skilled in the art that it will be obvious that described embodiment can be without one Implement in the case of a little or all these details.In other instances, known process step is not described in detail, with Exempt from unnecessarily to obscure the underlying concept.
For the compact-folded configuration of integrated antenna package
In subsequent accompanying drawing, describe to overcome the encapsulation of the utilization multi-chip of the shortcoming described in previous paragraphs to set Meter.Encapsulation design is referred to alternatively as " foldable memory devices ".Encapsulation design allows to include being connected by flexible circuit connector The memory devices of the multiple memory chips for connecing are simply mounted in portable computing device.Flexible circuit connector can It is utilized for memory devices and data and/or power connection is provided, and can be used for RF shielding purposes.Use flexible circuit connector Rather than individually metallic shield contributes to reduce the general thickness profile of memory cell for RF shieldings, and due to that can save Go to single metal RF shielding installation thus assembling process can also be simplified.
Refer to the attached drawing 1-8C is discussed into these and other embodiments as follows.Even so, those skilled in the art will recognize Know, the detailed description for being given for accompanying drawing herein only for the purposes of illustration, and is considered as limitation.More specifically, Refer to the attached drawing 1A-1C describes foldable memory devices and its associated component in two different pre-assembled configurations.With Afterwards, refer to the attached drawing 2 and 3 is discussed in its final assembling and installs the foldable memory devices in configuring.The He of refer to the attached drawing 4 6, describe the foldable memory being likely to occur in assembling process before the final configuration of foldable memory devices is reached Device configuration.Different foldable memory device configurations can be by being folding or bending over the flexible electrical of foldable memory devices Path connector part obtains.
Referring to Fig. 5 A-5D, describe for by the flexible circuit connector partial earthing of foldable memory devices not Same method.Flexible circuit connector can be grounded with allow it to be used as the faraday cup around foldable memory devices one Part.The method that assembling includes the portable computing device of foldable memory devices is described with reference to Fig. 7.With reference to Fig. 8 A-8B Describe can include foldable memory devices portable electric appts perspective view.Finally, being discussed with reference to Fig. 8 C can With the block diagram of the portable media device including foldable memory devices.
Figure 1A is the foldable memory devices 1100 in the first pre-assembled configuration of the embodiment according to described by Perspective view.In this installation, foldable memory devices 1100 can be used as the memory cell of portable computing device A part.Such as 1100 foldable memory devices can include two or more memory chips.Memory chip can It is attached to such as 1112 flexible circuit connector.In one embodiment, memory chip is flash memory and non-chip.
Show that two chips (1102 and 1104) are attached to the top surface of flexible circuit connector 1112 in figure ia 1112a.The top surface 1112a of the flexible circuit connector 1112 for not adhering to the two chips is then shown in fig. 1 c.It is soft Property circuit connector 1112 (being also referred to as " flexible cable connector ") can include power is delivered into each chip (such as 1102 and 1104) and allow the trace of data communication between chip and other equipment (such as, main logic board).
In one embodiment, flexible cable connector 1112 can include the part extended from top surface 1112a, such as 1110.Part 1110 is located on the fold part 1112f of flexible connector.In the particular embodiment, part 1110 can be Data-interface and deliver to electric power that permission communicates between flexible cable connector and remote equipment (such as, main logic board) A part for the power interface of flexible cable connector 1112.
Chip (such as 1102 and 1104) can include being connect coupled to the data and power supply on flexible cable connector 1112 The data and power interface of mouth.In one embodiment, the data and power interface (not shown) can be soldered to flexible cable Data and power interface (not shown) on connector 1112.For example, flexible cable connector 1112 can be in its top surface Include data and power interface on 1112a, and the corresponding interface on chip (such as 1102 and 1104) can then be soldered to institute State data and power interface.Than welding, can also be used to for chip to be attached to flexible cable company using other binding mechanisms Meet the top surface 1112a of device 1112.It is, for example possible to use liquid adhesive or adhesive tape are with will be every in chip 1102 and 1104 One is attached to flexible cable connector 1112.
Flexible cable connector 1112 can also be included for allowing the flexible cable connector as faraday cup Partial multiple shield traces.Shield traces can be coupled to connector gasket, such as 1106.Such as with reference to Fig. 3,4 and 5A-5C more Describe in detail, connector gasket can be coupled to (such as, band connects or is soldered to) other conducting parts, with chip quilt The faraday cup around the chip is formed when in portable computing device.Faraday cup can prevent from being generated by chip RF signals disturb portable computing device miscellaneous part.For example, portable computing device can include antenna, and faraday Cage can then prevent the RF signals that chip is generated from reaching the antenna.
Chip (such as 1102 and 1104) can be attached to flexible cable connector 1112 so that two chips can be separated by it is soft The partial-length of property cable connector, such as 1112c.Part of the flexible cable connector between two chips is referred to alternatively as " dividing Every part ".Segregated portion 1112c can in different directions be bent and/or turn round during the installation of foldable memory devices Turn, be achieved in one or more different configuration of foldable memory devices.For example, segregated portion 1112c can be first Bend in one way and/or reverse when the first chip is attached to printed circuit board (PCB) during installation steps, then second Bend with a different way and/or reverse when top surface 1112a is bound to top surface 1104a during installation steps.
The distance between chip 1105a can be selected, to cause flexible cable connector to wrap each part and/or comply with not Same surface.For example, as shown in Figures 3 and 4, can cause that the segregated portion 1112c of flexible cable connector 1112 wraps pcb board And metal framework.In embodiments, it is adjustable to the discontinuity on the surface of meter and its wrapping apart from 1105a, such as From the part that surface is holded up.For example, as shown in figure 4, pcb board is in the different height relative to metal framework.If so desired, Segregated portion 1112c can be bound to intermediate surfaces in a certain manner, so that it complies with these surfaces.Anyway, separate These intermediate surfaces are all complied with part, and the topology of these intermediate surfaces can influence to be selected at specific foldable memory Equipment design in use chip chamber apart from 1105a.
The width of segregated portion 1112c is shown as the width of near chip 1102 and 1104.In embodiments, width 1105b can be more greater or lesser than Chip-wide.For example, in one embodiment, the width of the segregated portion 1112c between chip Degree 1105b can narrow to enable that the segregated portion is more readily reversed or bent.In another embodiment, may be used One or more holes are arranged with segregated portion 1112c.When intermediate surfaces are wrapped, hole can allow part from intermediary's table Face is extended by the hole, and this is opposite with discrete parts with extension component.Design in this way, segregated portion 1112c can More preferably to comply with around the surface of extension component.
In one embodiment, segregated portion 1112c of the flexible cable connector 1112 between chip 1102 and 1104 (such as, along line 1108) can be folded, so as to allow the top surface 1102a of chip 1102 and the top surface of chip 1104 1104a aligns and combines.In fig. ib, the flexible cable connector including chip 1102 and 1104 after folding is shown 1112 perspective view.In fig. ib, flexible cable connector 1112 is folded along line 1108, thus exposes flexible cable connector 1112 basal surface 1112b.In one embodiment, the first and second chips can have same size, and two chips One can on top of the other be alignd with stack arrangement directly, thus the corner of each chip is immediately alignd.If Expect, two chips can be combined together in this configuration.In fig. ib, the chip for showing is in and not yet directly align and also need Additional alignment is wanted to cause two chips directly under the configuration of alignment.
In other embodiments, flexible cable connector can be folded, and chip can overlap stack arrangement (wherein Chip be not direct one be placed in another top on) in alignment and combine.Under this arrangement, the top surface 1104a of chip 1104 On the top surface 1102a edges of the chip 1102 being suspended in.In other embodiments, chip 1102 and 1104 can have difference Size.In this embodiment, after folding, chip can be stacked and align so that less chip is on larger chip Between two parties.Can also be configured using eccentric stacked alignment.For example, one or more outer rims of smaller chip can be with larger chip One or more outer rims alignment.
What Fig. 2 showed the embodiment according to described by is coupled to printed circuit board (PCB) (PCB) in assembled configuration The top view of 1214 foldable memory devices 1100.Foldable memory devices 1100 can be the part of component 1200. Component 1200 can include PCB 1214 and multiple miscellaneous parts, such as may be located at the main logic board under screening cover 1206. Component 1200 can be attached to the housing of portable computing device via multiple different attachment points (such as, attachment point 1215).
When pleated, the fold part 1112f of foldable memory devices 1100 can be attached to screening cover 1206 and by This ground connection.The fold part 1112d and 1112e of foldable memory devices 1100 can include connector gasket.These parts Top can be folded to allow that connector gasket is connected to the metal framework around foldable memory devices 1100 Thus (referring to accompanying drawing 3 and 4) be simultaneously grounded.As described above, when being grounded, the various pieces of flexible cable connector are golden with other Category part (such as, metal framework and screening cover 1206) can be a part for the faraday cup around chip.
The segregated portion 1112c of flexible cable connector 1112 is shown as being folded in two places.First is folded in PCB Near 1214 bottoms.Second is folded near the height of screening cover 1206.Segregated portion 1112c is not complied with and prolonged from metal framework The small ledge of the PCB 1214 for stretching out.Thus, can there be gap between flexible cable and metal framework.In other embodiment In, segregated portion 1112c can be attached to the ledge, to cause that segregated portion 1112c is preferably complied with to the intermediate surfaces.
Fig. 3 shows the sectional view of the portable computing device including foldable memory devices.Portable computing device Periphery can be formed by lid glass 1216 and housing 1208.(such as, display drives for display 1218 and its associated circuit Device) may be located under lid glass 1216.Component 1200 including PCB 1214 and foldable memory devices 1100 can be with Under display circuit.In one embodiment, component 1100 may be mounted such that top and the flexibility of screening cover 1206 The basal surface 1112b of cable connector 1112 is each in face of the inner surface of housing 1208.
In the configuration of installation of foldable memory devices, the first chip 1102 and the second chip 1104 are shown as one It is individual to stack on top of the other, wherein the first chip 1102 and the second chip 1104 have roughly the same size and one Just on top of the other.As it was previously stated, if so desired, the first chip 1102 and the second chip 1104 can relative to each other to Left or right shift is vacantly being configured.
The fold part 1112f of flexible cable connector 1112 can be attached to screening cover 1206.Fold part can wrap Include the connector gasket being grounded via screening cover 1206.Fold part 1112e can be attached to the outer surface of metal framework 1210 Part, thus by flexible cable through the external surface grounded of metal framework 1210.In other embodiments, the folding of flexible cable 1112 Cover 1112e can be attached to the inner surface (referring to Fig. 5 A) of metal framework 1210.
The outer surface under stacked chips of flexible cable connector 1112 is shown as relative to housing 1208 Height on inner surface, the height with slightly below screening cover 1206.In other embodiments, stacked chips and flexible cable The height of connector can be higher than the height for shielding.Additionally, stacked chips configuration can include two or more chips, and And it is not limited to two chips shown in Fig. 3.
Typically, the screening cover as a faraday cup part can be formed by conducting metal (such as stainless steel).Such as The thickness of 1112 flexible cable connector 1112 can be about the 1/6 of the thickness of the screening cover formed by stainless steel.Then, make Can be that using for other purposes creates exceptional space during encapsulation is designed instead of metallic shield with flexible cable connector.Example Such as, exceptional space can be used for the size of the battery for increasing utilized, or thicken the structure for increasing equipment hardness.
Fig. 4 shows the foldable memory devices for being coupled to printed circuit board (PCB) (PCB) 1214 in pre-assembled configuration Top view.In one embodiment of installation steps, the first chip 1102 can be disposed within metal framework 1210 and example Adhesive such as is installed via surface and is coupled to PCB 1214.Temporary baffle 1224 can be provided and be fixed to PCB with the first chip When for chip positioning.When the first chip 1102 is attached to PCB 1214, the separating part of foldable memory devices 1100 Dividing 1112c can launch to be placed in side so that foldable memory devices are in the configuration of relatively flat.
In one embodiment of the second installation steps, it is fixed to by the first chip of foldable memory devices 1100 After PCB 1214, the segregated portion 1112c of foldable memory devices 1100 can be folded to by PCB 1214 side and On the intermediate surfaces of the side composition of metal framework 1210, the thus pass of turning-over of chip 1104 and its flexible cable connector Connection part.After the flop, the flexible cable part 1220 on the 1112f of fold part can be aligned to be adapted to metallic shield lid Each hole 1222 in.In one embodiment, flexible cable part 1220 can be to the number of flexible cable connector 1112 According to the part with power interface.
Foldable memory devices can be configured as when flexible cable part 1220 aligns with hole 1222, two chips 1102 It is substantially aligned in stack arrangement with 1104.The bonding agent of such as adhered by double sided plaster agent or liquid adhesive etc can be applied, Thus two chips are fixed in as previously mentioned with respect to the stack arrangement described in accompanying drawing 2 and 3.Then, such as 1112e including connector The fold part of pad can be grounded to another part of faraday cup, such as side of metal framework 1210.Can use many The connector gasket that the different methods of kind are used on the fold part by flexible cable connector 1112 is fixed to faraday cup Other parts.These methods describe refer to the attached drawing 5A-5C.
In one embodiment, the chip in foldable memory devices is stacked in metal framework.Under this arrangement, Connector gasket on the fold part of flexible cable connector is attached to metal framework with so that flexible cable connector connects Ground, and the chip circumference formation faraday cup on foldable memory devices.Fig. 5 A-5C show the implementation according to described by The different attachment method of use of example is coupled to the perspective view of PCB and the foldable memory devices being mutually attached with metal framework.
In fig. 5, the connector gasket that can be formed by the conducting metal of such as copper can be stuffed into metal framework 1210 it It is interior.Then, connector gasket can be soldered to metal framework 1210 along apical margin 1226.In another embodiment, can be by Solder applies to connector gasket, can then fill in metal framework connector gasket and solder.Next, this can be heated Metal framework so that solder melts and connector gasket is bound to inside metal framework 1210.Solder can be including connector The fold part of the foldable memory devices of pad is placed in metal framework inside and connects after being stuffed into metal framework Connect device pad between.
In a specific embodiment, as illustrated in Fig. 5 B, the fold part 1228 of foldable memory devices can be with Fold on metal framework outside, the electroconductive binder of such as conductive adhesive tape be then applied with the outside of the metal framework, It is used to be bound to connector gasket outside metal framework.The shape that pressure can be applied to ensure to combine to fold part 1228 Into.In yet another embodiment, as shown in Figure 5 C, solder can be applied to connector gasket and the He of connector gasket 1228 Outside metal framework, and solder can be heated it is soldered to the metal framework with by connector gasket.
Foldable memory devices can include the multiple fold parts containing metal connector pad.In some embodiments In, a fold can be stuffed into the metal parts of such as metal framework and be combined with the metal inside, and another fold is then Can be folded on metal parts and be combined with the outside of the metal parts, the such as top with screening cover or metal framework Outboard Sections be combined.How to be folded depending on flexible circuit connector and according to connector gasket combine which is Surface (for example, inner surface or outer surface), connector gasket may be located on the top surface or basal surface of flexible cable connector. As set forth above, it is possible to fold part is bound into a surface using the electroconductive binder of such as conductive strips or solder etc.
Fig. 5 D show the perspective of the foldable memory devices for being coupled to PCB 1214 of the embodiment according to described by Figure, wherein PCB is connect with the contact site (for example, connector gasket 1240) of foldable memory devices using conduction band 1230 Ground.In one embodiment, the fold part of the such as 1112f on the flexible cable connector of foldable memory devices Connector gasket 1240 can be included on side, and include part (part 1220 as shown in Figure 4) on another side.In figure In embodiment described in 4, foldable memory devices are folded in so that the part 1220 on the 1112f of fold part is fitted With by the hole in screening cover 1206.If fold part 1112f does not include part, the fold part can be placed in screening cover Top on, to be shelved on the screening cover.In this embodiment, connector gasket can be placed in flexible cable connection On the opposite side of device, thus it will be in face of screening cover 1206.
When fold is partially disposed at the top of screening cover as shown in Fig. 5 A, 5B or 5C, connector gasket exposure can be retained. As shown in Figure 5 D, exposed connector gasket 1240 can be covered by conductive strips (such as 1230), to cause the exposed connector Pad is through miscellaneous part, the such as top ground of screening cover 1206.When being grounded in this way, connector gasket can be allowed can A part for flexible cable connector in folded for storage device equipment is used as a part for faraday cup.
Fig. 6 shows the foldable memory for being coupled to PCB in pre-assembled configuration of the embodiment according to described by The top view of equipment.In this embodiment, foldable memory devices include being attached to four chips of flexible cable connector 1202nd, 1203,1204 and 1205.These chips can be of different sizes compared to the chip in preceding description.For example, chip Can be thinner, it is all in this way it is preceding description chip thickness about 1/2 so that when 1202,1203,1204 and 1205 by one another When individual Shangdi stacks, the height of stacking can be roughly the same with the only stack height including chip 1102 and 1104.
In one embodiment, the first chip of foldable memory devices, such as 1202 can be attached to PCB, such as 1214.Then, in one embodiment, the segregated portion 1212d of flexible cable connector can be folded, to cause chip 1203 It is combined with chip 1202.Next, segregated portion 1212e can be folded, to cause that chip 1205 is combined with chip 1204 These steps are reversible, i.e. chip 1205 can be first bound to chip 1204, and subsequent chip 1203 can be bound to chip 1202。
After chip 1202/1203 and 1204/1205 is combined together, being located at folded flexible cable connector Segregated portion 1212c between chip 1202 and 1204, it is chip-stacked thus, it is possible to chip-stacked 1204/1205 is bound to 1202/1203.Part 1220 on the flexible cable connector of the bottom of chip 1204 can be aligned, to cause members fits By hole 1222.Then, as it was previously stated, fold part on the flexible cable connector of the basal surface of chip 1204 can be with Other metal parts (such as, metal framework and screening cover) are combined and are thus grounded, so as to form method around the chip of stacking Draw cage.
In another embodiment, the folding of foldable memory devices can in a different order carry out that (folding step can Change with depending on foldable memory devices, and these steps are merely provided for the purpose of example).For example, in a reality Apply in example, the segregated portion 1212e of flexible cable connector can be folded, to cause that chip 1205 is combined with chip 1204. Then, segregated portion 1212c can be folded, to enable chip-stacked 1204/1205 to be combined with chip 1202.Then, Segregated portion 1212d can be folded, to enable that chip 1203 is combined with chip-stacked 1202/1204/1205.It is real herein Apply in example, the fold part of flexible cable connector may be located at chip 1203 rather than be shown disposed on the bottom of chip 1204 Portion.The fold part extended from the bottom of chip 1203 can be with other metal parts (such as, screening cover 1206 and metal frames Frame 1210) it is combined, so as to form faraday cup around the chip of stacking,
The number of assembling steps of foldable memory devices description used above can be in the manufacturing process of portable computing device Middle realization.For example, describing to include the portable computing of foldable memory devices according to the assembling of the embodiment with reference to Fig. 7 The method 1300 of equipment.In step 1302, multiple memory chips of such as chip can be connected to flexible circuit connector.It is soft Property circuit connector can include power supply and data trace.Each chip can be connected to the power supply on flexible cable connector And data trace, it is possible thereby to chip is supplied power to, and data can be to and from each chip via data trace.
Chip be used as be memory devices on portable computing device a part.1304, foldable storage The first chip in device equipment can be attached to the component in portable computing device to be installed in.For example, the component can be with Including printed circuit board (PCB), and the first chip can be attached to the printed circuit board (PCB).The component can be used in portable computing It is during the operation of equipment that foldable memory devices are in position.The component for keeping foldable memory devices can be by It is fixed in portable device case, or can be fixed during subsequent number of assembling steps.
In one embodiment, 1306, the segregated portion between two chips can be folded, and two chips can be in heap It is folded to match somebody with somebody align center.1308, two chips can be combined together in the stack arrangement.In general, folding step can be with Depending on the number of chips on foldable memory devices, and each chip be how via flexible connector segregated portion It is connected to each other.Folding sequences are influenceed by the part whether a part for flexible connector will be used as faraday cup, Because the fold sequence may require that each chip terminates at a certain position after generation is folded, thus, it is possible to realize being used for By the appropriate connection of flexible cable connector ground.
1310, the connector gasket on flexible circuit connector can be attached to other metal parts, to form farad A part for cage.For example, as described above, connector gasket can be incorporated in the metal framework around chip.Faraday cup can It is used for the RF signals that shielding is leaked from chip.For example, portable computing device can include antenna, and chip can be by farad Cage by the RF signals that chip is generated around so as to cannot reach antenna.1312, by faraday cup around foldable deposit In the case that storage device is not a part for the component of the housing for being fixed to portable computing device, including foldable deposit The component of storage device may be mounted to that in the portable computing device.
In the above-mentioned methods, one or more steps can be completed during computer-aided manufacturing is processed by processor.Example As processor can be programmed to allow robot device to install and fold foldable memory devices.As a further example, processor can It is programmed to allow robot device that chip is coupled into flexible cable connector or by the connector on flexible cable connector Pad is coupled to miscellaneous part.
Fig. 8 A and 8B show the top view and bottom view of the portable computing device 1400 of the embodiment according to described by. It is hand-held that portable computing device may be adapted to user.Lid glass 1406 and display 1404 can be placed in the opening of housing 1402 In 1408.Lid glass can include the opening for input mechanism (such as load button 1414).In one embodiment, it is defeated Enter button 1414 to can be used for for portable computing device returning to particular state, such as main interface state.
Other input/output means can be arranged around the periphery of housing 1402.For example, can be arranged in the apical margin of housing Such as 1410 power switch, and such as 1412 volume switch can be arranged along a line edge of housing.For connecting The audio jack 1416 and data of earphone or other audio frequency apparatuses/power connector interface are then positioned at the root edge of housing.The shell Body 1400 also includes the hole for allowing the camera 1415 for receiving video data.
Fig. 8 C are the block diagrams of the media player 1500 of the embodiment according to described by.Media player 1500 includes treatment Device 1502, its microprocessor or controller for belonging to all operationss for controlling media player 1500.Media player 1500 store the media data on media item in file system 1504 and cache (cache) 1506.Typically, file System 1504 is storage disk or multiple disks.Typically, file system is that media player 1500 provides massive store ability. But, because the access time to file system 1504 is relatively slow, media player 1500 also includes cache 1506.It is high Speed caching 1506 is, for example, the random access storage device (RAM) provided by semiconductor memory.To the relative of cache 1506 Access time is significantly shorter than the access time to file system 1504.But cache 1506 does not have file system 1504 Large storage capacity.
Further, in activity, file system 1504 consumes more electric power than cache 1506.When media are broadcast When to put device 1500 be the portable electronic device powered by battery (not shown), power consumption is even more important.
Media player 1500 is also including user input equipment 1508, its user for allowing media player 1500 and media Player 1500 is interacted.For example, user input equipment 1508 can take many forms, button, keypad, rotating disk etc.. In addition, media player 1500 include display 1510 (screen display), display can from processor 1502 control with to User's display information.Data/address bus 1511 can aid at least in file system 1504, cache 1506, processor 1502 And the data transfer between codec (CODEC) 1512.
In one embodiment, media player 1500 is used to store multiple media items in file system 1504 (for example Song).When user wants media renderer plays certain media items, the list of available media items can be displayed in display 1510 On.Then, using user input equipment 1508, user can select one of available media items.Receiving to certain media items Selection after, the media data (for example, audio file) of certain media items is supplied to encoder/decoder by processor 1502 (CODEC, codec) 1512.Then codec 1512 produces the analog output signal for loudspeaker 1514.Loudspeaker 1514 can be the loudspeaker outside the inside of media player 1500 or media player 1500.For example, being connected to media play The headphone or earphone of device 1500 are considered as external loudspeaker.
Inner frame for optimizing hardness and heat transfer
In the Thermal structures design of thin compact type portable electric appts, it may be considered that primary factor can be with The arrangement of the interface related part in family.It is determined that after the disposed outside of these parts, it is possible to consider on housing design Factor, such as enclosed inside, weight, intensity and hardness under the expected operating conditions for needed for protection equipment.It is then possible to examine Consider heat problem, such as prevent the development of internal focus.When these design factors are considered, they may be affected one another.Cause This, the design of equipment is probably a process repeatedly.
Used as the illustration of the Thermal structures design process to portable set, the angle of described factor is discussed from the above Equipment is designed.Typically, portable set can include display.Display and input mechanism can be generally arranged at equipment Simultaneously go up.If desired, the housing of thin contour can be defined as around with encapsulating in addition to the visible display part of user All.The face relative to display can be mainly the structure related with housing, but can be including for such as camera Deng the hole of other input equipments.
Along the edge of housing, various input/output means can be arranged, such as volume switch, power knob, data and Power connector, audio sockets etc..Housing can include accommodating the hole of input/output means.Can be with choice arrangement input/output The position of mechanism with strengthen want operation equipment under conditions of interface availability.For example, for desired one-handed performance The input mechanism of equipment, such as audio control switch etc can be arranged in the finger when equipment is held in palm and easily operate Position.Additionally, the output mechanism of such as audio sockets etc can be arranged in the position that will not hinder gripping device, such as exist On the top edge of equipment.
Once arrange the part of user interface, be connected to portable electric appts and allow portable electric appts in order to Its expectation function and the part of appliance that operates can be encapsulated in enclosure.The example of internal unit part can include raising one's voice Device, microphone, the main logic board with processor and memory, non-volatile memory apparatus, data and power interface plate, display are driven Dynamic device and battery.Internally the position aspect of part of appliance can provide certain flexibility, as long as connection required between part Device can have enough spaces.Further, can be made using the approach of the PCB of such as custom-shaped or battery etc available internal Space can be used effectively.
Once user interface has been designed and internal part is encapsulated in suitable compact shell body, it is possible to consider Heat problem.Many internal parts produce heat.In order to prevent heat from being accumulated in some regions and internal part may be damaged, may Mechanism is needed internally to dissipate and conduct heat.The compact design of these equipment almost may not cooled down (i.e., it is allowed to empty to convection current Gas circulates to radiate in a device) leaving space.Accordingly, it may be desirable to other approach process internal cooling problem.
Solve the problems, such as that a kind of approach of cooling can be to provide one or more and be configured to inside different in slave unit Position guides heat and conducts heat to the structure of interior locations different in equipment.In addition to being used for cooling, the structure is also The architectural characteristic of equipment can be used to strengthen, such as increase the integral hardness of equipment.In a particular embodiment, describe to be designed to Meet the inner frame that the heat related to the design and operation of portable electric appts is limited and structure is limited.Inner frame can be with It is configured to conduct and be dissipated in the heat produced in shell.Additionally, inner frame may be constructed such that the overall strong of increase equipment Degree.
Below with reference to Fig. 9 A-14 to the Thermal structures design of these inner frames and their making in portable With discussing.But, those skilled in the art will readily appreciate that herein by reference to the detailed description given by these accompanying drawings Task of explanation is intended merely to, and be should not be construed as restricted.Specifically, reference picture 9A-9D, describes portable electric appts Unitary construction.Equipment can include the inner frame for possessing the capacity of heat transmission, and the inner frame is configured to meet and is discussed The design of equipment the heat limitation and structure limitation related to operation.In Figure 10 A-10C, each of inner frame is shown and discussed Plant embodiment.Reference picture 11A and 11B, describe internal structure and the material related to inner frame.Reference picture 12A, 12B and Figure 13 discusses coupling of the inner frame to various parts of appliance and related manufacture method.Finally, reference picture 14 is described It is configured to the portable computing device of media player.
Fig. 9 A and 9B show the top view and bottom view of the portable electric appts 210 of the embodiment according to described by. Equipment 210 can include the housing 2100 around display 2104.Housing 2100 can be designed with the profile of relative thin.Housing 2100 provide opening 2108, and display 2104 is arranged in the opening 2108.Lid glass 2106 be arranged on display 2104 it On.Lid glass 2106 helps seal opening 2108.Equipment 210 can include that the touch-screen being associated with display (does not show Go out).
The shown device 2104 of the significant portion of the top surface areas of equipment 210 is occupied.The part as needed can be smaller and more Greatly.And, the part for display can be different according to equipment.In certain embodiments, equipment 210 can not even be wrapped Include display.
As it was previously stated, display 2104 can be the part in the user interface being associated with equipment 210.Serve user Diverse location of the miscellaneous equipment component distribution of the integrated operation of interface or equipment 210 on the housing 2100 of equipment 210.These The arrangement of part may influence enclosed inside, and the therefore position of the heat generating components in influence equipment.
Used as an example of the disposed outside of part of appliance, load button 2114 is located on preceding surface.In an implementation In example, load button 2114 can be used to receive instruction and want to allow equipment to return to certain particular state (such as " main interface (home) " State) input.Volume switch 2112 may be located on the side of housing 2100, and the volume switch can be used to regulation and set The volume of the various voice applications correlation of standby upper implementation.Power switch 2110 is located on the top side of equipment 210, audio sockets and use In the opening of data/power connector on the bottom side relative with top side of housing 2100.The bottom side of housing 2100 includes hole. The camera lens 2115 of camera can be arranged in hole.
Fig. 9 C show the block diagram of equipment 10.Display 2104, battery 2132, touch-screen 2122, wireless communication interface 2126th, display controller 2120 and acoustic component 2124 (for example, loudspeaker) can be couple to main logic board (MLB) 2105. Equipment 210 including Sim cards, microphone and other part (not shown) etc. nonvolatile memory, and can be not limited to Part shown in Fig. 9 C.MLB 2105 can include processor and memory.Processor and memory are able to carry out various volumes Cheng Zhiling realizes various functions to allow equipment.User interface as described above is considered permission user and selects and adjust Available various functions in equipment 210.In a particular embodiment, the user that these functions are stored as in equipment is optional The application program selected and be provided.
Fig. 9 D show the sectional view of the portable electric appts 210 of the embodiment according to described by.Shell can be by pushing up Glass 2106 and housing 2100 are constituted.There can be other Shell structures and described embodiment is not limited to the example.As schemed Shown in 9D, housing 2100 can provide the cavity covered by top glass 2106.Housing 2100 can include outer surface and inside Face, the in-profile 2117 of inner surface can be different from the exterior contour of housing 2100.
Various internal unit parts are packaged with shell (shell such as including top glass 2106 and housing 2100), it is all Part of appliance being such as associated with user interface, enabling equipment 210 to be worked for its expectation function.For the mesh for discussing , it may be considered that internal unit part is arranged in the layer of multiple stackings.Each layer of height can be relative in the layer of stacking Specify in the integral thickness 2136 of equipment.For example, top glass 2106 midpoint (middle) height can be defined as it is whole First fraction (first fraction) of body thickness 2136, and the height of battery 2132 can be defined as integral thickness 2136 The second fraction.
The display screen of display 2104 may be located at top glass 2106 directly below.In one embodiment, display screen And its display driving circuit of correlation can be encapsulated in the part together as display 2104.Circuitry 2130 (such as main logic board or the circuit being associated with other parts) and the battery 2132 for the power supply of equipment 210 may be located at display Under 2104.
As described above and as shown in fig. 9d, internal part may be by compact package so as to be almost to allow via air Circulate the path leaving space that effectively cooling is realized for the internal part of heating.Another kind can be combined or replacement convected air is cold But it is that Heat Conduction Material is placed adjacent to thermal source come the approach of the treatment inside heat problem for using.Heat Conduction Material can absorb heat simultaneously And heat is guided from the internal heat resource of the internal unit part for such as generating heat etc, to reduce the near heating sources during equipment operation Temperature.
In one embodiment, it is such as internal during Heat Conduction Material can be incorporated into the internal structure being associated with equipment 210 In framework 2140.Inner frame 2140 (will be described in more detail with reference to drawings described below) may be constructed such that heat from one Or multiple equipment part is guided and increases the bulk strength of equipment.For example, inner frame 2140 may be constructed such that increase sets Standby 210 integral hardness, such as resists the ability of the bending moment that housing 2100 is undergone.
In Fig. 9 D, inner frame 2140 is located at a certain height under display 2104 and on circuitry 2130 Place.Inner frame 2140 can be arranged at the position and be siphoned away with by the heat produced by display circuit.In addition, and circuitry One or more thermals source of 2130 correlations can be positioned adjacent to inner frame 2140, to allow the hot quilt from these parts It is transmitted to the inside of inner frame 140 and is guided from thermal source.
Other packaging structures are possible.Therefore, in other embodiments, inner frame 2140 can be relative to equipment Integral thickness 2136 is located at different height, and also can be positioned adjacent to different parts of appliance.Additionally, such as setting Standby 210 equipment can include the framework of multiple such as frameworks 2140, and described embodiment is not limited to use in single Portion's framework 2140.
In one embodiment, inner frame 2140 is used as the attachment point of miscellaneous equipment part.For example, interior sash Frame 2140 can be attached to via fastener or using cement on housing 2100 installation surface (such as 2134a and 2134b).Then, the miscellaneous equipment part of such as display 2104 can be couple to inner frame 2140 rather than directly coupling To housing 2100.Via the advantage that inner frame 2140 is couple to housing it is that display can be at certain by display 2104 In kind of degree with and the related bending moment isolation of housing 2100, i.e. the bending moment of generation can be dissipated to interior on housing In portion's framework 2140.By display 2104 to and housing 2100 it is related bending moment isolation can prevent to display 2104 damage, such as ruptures.
Figure 10 A and 10B show top 2142a and the bottom of the inner frame 2140 of the embodiment according to described by The view of 2142b.In one embodiment, inner frame can be formed by the sheet material of multilayer, such as including multiple metal levels Sheet material (see Figure 11 A and 11B, it illustrates the section of the inner frame 2140 including its different layers).In a particular embodiment, it is interior Portion's framework 2140 can be formed by making the intermediate layer of the first material be clipped between two exterior layers of the second material.For in The material of interbed and exterior layer can be selected according to their thermal characteristics (such as thermal conductivity) and/or strength characteristics.
In one embodiment, the first material for intermediate layer can be selected mainly according to its thermal characteristics, and be used for Second material of exterior layer can be selected mainly according to its strength characteristics.For example, the intermediate layer of copper can be clipped in two-layer Stainless steel (such as IconelTM) between.The thermal conductivity of copper is IconelTMAbout 25 times, and stainless steel more can bending resistance more than copper Song, copper may be quite soft.In one embodiment, intermediate layer can account for about the 50% of inner frame thickness, and exterior layer Each layer can account for about the 25% of inner frame thickness.When intermediate layer is copper and exterior layer is stainless steel, this construction Remain about the 94% of the hardness of the inner frame of the same thickness being only made of stainless steel.
Other materials combination is possible, and embodiment described herein is not limited to the combination of copper and stainless steel.For example, Other metallic combinations, such as aluminium and stainless steel can also be used.Additionally, nonmetallic and metal material or different types of nonmetallic Material can combine to form the inner frame of such as inner frame 2140.
In a particular embodiment, the inner frame (such as inner frame 2140) that layers of copper is clipped between two stainless steel layers can Formed with using coating.In a kind of realization of coating, a piece of copper can be pressed in two panels stainless steel under high pressure Between so that these sheet materials combine.For example, as a part for coating, it is possible to use high pressure is squeezed between two rolls Compressing tablet material.The sheet material formed via coating can be cut to form inner frame as depicted 2140.
In metallurgy, coating (cladding) is to be combined together different metals.This is a kind of different from welding Or the method that metal tightens together of bonding.Coating generally can extrude two kinds of metals and in high pressure by using mould It is lower that sheet material is compressed or rolled together.Be combined together for metal by " metallurgical process " by coating, and producing can Be annealed, the continuous strip of rolling and incision, to meet point-device electricity, calorifics and/or the terminal requirements of mechanical aspects. The coating combined with noble metal or base metal can be provided in one or two base metal surfaces to inlay or cover.
Generally speaking, coating can refer to a deposition process, and in the deposition process, a kind of metal is coated with another kind Metal, or base material (it can be nonmetallic) is coated with another metal.In some coatings, metal Can be fused in substrate, such as by laser coating.Thus, embodiment described herein is not limited to metal sheet and exists The coating being for example combined together by roller under high pressure.
Inner frame for such as 2140, wherein middle heat conductive layer are sandwiched in two with much lower thermal conductivity Wai Between portion's layer, exterior layer can include one or more holes, and middle heat conductive layer is exposed in one or more of holes.Can be with providing holes Preferably it is thermally coupled with allowing to be formed between middle heat conductive layer and heat generating components.In a particular embodiment, the table of heat generating components Face can be thermally coupled to middle heat conductive layer via welding material or thermal conductive belt.Two-sided thermal conductive belt is often used in and is attached to heat sink The part of such as processor etc in computer application.In embodiments described herein, two-sided thermal conductive belt or welding material can Be used to engage the surface of heat generating components and thereby be thermally coupled to inner frame 2140.
Internally on framework 2140, the position in hole can be selected as the heat generating components being close in portable set.It is multiple Hole 2150a-f is illustrated in the top 2142a and bottom 2142b of inner frame 2140.As illustrated, for inner frame 2140 top 2142a and bottom 2142b, the position in hole can be with difference.As shown in Figure 10 A and 10B, in top 2142a On hole site be different from hole site on the 2142b of bottom.Additionally, internally have on the top 2142a of framework 2140 than More holes on the 2142b of bottom.
On the whole, the position in hole internally in the exterior layer of framework 2140 can be according to the heating used by each equipment Part and it is varied between different devices for the selected enclosed inside scheme of each equipment.In one embodiment In, hole can be only positioned in the one side of inner frame, such as only on top surface or bottom surface.In another embodiment, exterior layer Can be heat conduction and intermediate layer can provide intensity, such as stainless steel layer is clipped between two layers of copper.In this example, outward Hole in portion's layer is unnecessary for the purpose being thermally coupled, because the surface of pyrotoxin can be directly joined to heat conduction Exterior layer.
Figure 10 C show the top view of the inner frame 2160 of the embodiment according to described by.In one embodiment, it is interior Portion's framework 2160 can pass completely through the hole of inner frame 2160, such as hole 2162 including one or more.It is the one or more Hole can be used for placing component, such as through the connector of inner frame 2160.Furthermore it is possible to set pass completely through framework 2160 hole is fastened to another part, such as reference picture 9A, 9B and the apparatus casing of 9D descriptions with by inner frame 2160 2100。
Above with reference to described in Figure 10 A and 10B, inner frame 2160 can include that one or more are sudden and violent in its exterior layer The hole in dew solid intermediate layer.In one embodiment, hole can be filled with the material identical or different with material for intermediate layer Material.Hole 2150a is an example in the hole being filled with.In another embodiment, hole can be not filled, and therefore set The place in hole there may exist slight depression or cavity to expose middle heat conductive layer.Hole 2164 is internally framework 2160 An example in the hole of cavity is formed in exterior layer.
In one embodiment, such as 2166 raised Thermal connector can be provided with.Raised Thermal connector 2166 can Formed with the Heat Conduction Material by such as copper.Raised Thermal connector 2166 can be used for by internally positioned framework 2160 certain The thermal source at highly place is thermally coupled to the heat-conducting layer of inner frame, such as intermediate layer.When heat generating components is located at raised Thermal connector The Thermal connector can be used when at a certain distance from top, the wherein distance too greatly can not be hot to provide using directly welding Connect.In one embodiment, raised Thermal connector 2166 can be adiabatic via such as 2168 outer insulative layer.
In a particular embodiment, raised Thermal connector 2166 can after the formation thereof be couple to inner frame 2160. For example, the Thermal connector 2166 of projection can be welded or cemented on inner frame 2160.In one embodiment, when in outside To expose during heat conductive intermediate layer, raised Thermal connector 2166 can be arranged on one of these positions place to providing holes in layer, to pass through The surface of heat-producing device part is thermally coupled to the intermediate layer of device framework by connector.The raised heat laid by this way The example of connector is also described in reference picture 12B.
Figure 11 A-11B show the sectional view of inner frame, for example, can be used for such as 2150 or 2160 (reference picture 10A- 10C describes the section in inner frame 2150 and inner frame 2160).In Figure 11 A, show including three layers cut Face.This three layers include exterior layer 2170a and 2170b and the intermediate layer 2172 being arranged between the two exterior layers.
The thickness of each in intermediate layer and exterior layer can change.In one embodiment, the thickness of each exterior layer Degree can be with roughly the same.In another embodiment, the thickness of each exterior layer can be with difference.The thickness in intermediate layer can phase Same of different from the thickness of each in two exterior layers.In a particular embodiment, each in two exterior layers Thickness is roughly the same, and the combination thickness of two exterior layers is substantially equal to the thickness in intermediate layer.
Every layer of thickness can change to adjust intensity, weight and/or the thermal characteristics of inner frame.For example, it is stainless Steel layer can make to obtain the thicker bulk strength to increase inner frame.In another example, layers of copper can be made thicker to increase Plus the hot material of inner frame.
First hole 2171a can be arranged in the exterior layer 2170a of top, and the second hole 2171b can be arranged on bottom exterior layer In 2170b.The hole 2171a pushed up in exterior layer 2170a is shown as not being filled, so that adjacent bores form areola.In outside Hole 2171b in layer 2170b is shown populated with and intermediate layer identical material.Will be described below filling such as The certain methods in the hole of 2171b.
In one embodiment, hole 2171b can be completely or partially filled during coating.Example Such as, together with exterior layer can be pressed sufficiently with intermediate layer so that the part in intermediate layer is reached in hole.In another reality Apply in example, hole can be filled after coating.Hole can be filled with the material identical or different with the material in intermediate layer Material.For example, the cavity being formed with holes can be filled with welding material, it is in order to by intermediate layer 2172 to set the welding material It is thermally coupled to the surface of heat generating components.Used as another example, inner frame can be immersed in another material, to fill one Or multiple holes.
Figure 11 B show another embodiment in the section that can be used for inner frame.In this embodiment, intermediate layer 2172 are sandwiched between two exterior layers 2170a and 2170b.But, the part in intermediate layer 2172 is to a certain extent with Another part of interbed is thermally isolated.It is thermally isolated and is illustrated by the material 2173 that 2170b is extended to from top layer 2170a.
In some embodiments, it may be desirable to reduce internally between a part for framework and another part of inner frame The coefficient of overall heat transmission.This can be realized by placing to have between two parts of heat conductive intermediate layer compared with the material of low heat conductivity. For example, intermediate layer 2172 can be made up of two or more single material strips, the material strips are sandwiched in including exterior layer Sheet material between.During coating, in the space between material strips, exterior layer can be pressed together to push up Layer is connected with bottom, and provides the coefficient of overall heat transmission of the reduction between the part in intermediate layer 2172.Similarity as described above Reason can be used to be thermally coupled two layers.For example, in Figure 11 B, if top layer is Heat Conduction Material, such as copper, and intermediate layer is More athermanous material, the stainless steel for such as being formed by single bar, then during coating, top copper layer and bottom copper layer Can be pressed together by the space in stainless steel strip, to be thermally coupled top copper layer and bottom copper layer.
Figure 12 A-12B show according to described by embodiment, be thermally coupled to multiple equipment part inner frame cut Face figure.It is indicated by means of an arrow Heat transmission into the typical directions in intermediate layer.In fig. 12, different parts of appliance is shown as connection The section of the inner frame being connected to shown in Figure 11 A.In this example, the intermediate layer 2172 of inner frame can be by Heat Conduction Material Formed, such as copper, and exterior layer can be formed by the material bigger than copper intensity, such as stainless steel.Can be set in exterior layer Hole is joined with exposing intermediate layer to form preferably heat between the surface for allowing the heat generating components in intermediate layer and neighbouring each hole Connect.
In fig. 12, controller circuitry 2186 may be located at top layer 2170a tops.For example, controller circuitry 2186 can be with It is display circuit, as described by reference picture 9D.PCB 2180 may be located at inner frame lower section.PCB 2180 can be wrapped Include multiple parts, such as 2182a and 2182b.In one embodiment, PCB can include that processor and the master of memory patrol Collect plate.
Hole 2171a in exterior layer 2170a may be located at the high thermal region 2188 related to controller circuitry 2186 it Under.Hole 2171a is not filled by.The heat bridge 2184b of such as welding material etc can be used on the surface of circuitry 2186 with There is provided between interbed 2172 and be thermally coupled.May want to use heat bridge, because the air gap between thermal region high and heat bridge can be with Serve as insulator to prevent heat to be transmitted in intermediate layer.Reserving can place the cavity of heat bridge and can allow controller circuitry quilt Be placed closer to inner frame because do not needed between inner frame and the surface of controller circuitry other space for Heat bridge.During operation, the heat for being produced in thermal region high 2188 can be transmitted in intermediate layer 2172, and from hot-zone high Domain 2188 guides.Therefore, the temperature of neighbouring thermal region high can be lowered via inner frame.
Hole 2171b in exterior layer 2170b is filled.Set between the surface and intermediate layer 2172 of PCB parts 2182a Put heat bridge 2184a.Because hole 2171b is filled and does not provide heat bridge may be located at cavity therein, heat bridge 2184a may increase Big space between PCB parts 2182a and inner frame.In one embodiment, heat bridge 2184a can be heat-conductive bonding agent, Such as double-faced adhesive tape.
When heat bridge 2184a is used near the hole of such as 2171b, heat bridge 2184a can be more than or less than the area in hole. In example in fig. 12, heat bridge is shown as more than hole 2171b.The area of heat bridge (such as 2184a) can be selected as really Guarantor keeps appropriate engagement during the operation of equipment.
As shown in figure 12a, some parts (such as producing the part of at most heat) of only PCB may be thermally coupled to inside Framework, and produce the part of less heat not to be thermally coupled to inner frame.In order to illustrate this point, PCB parts 2182a is shown as Inner frame is thermally coupled to, and PCB parts 2182b is had been not shown to be thermally coupled to inner frame.Design according to specified panel and The quantity of its associated part, one or more parts being associated with plate can be thermally coupled to inner frame.
In Figure 12 B, the sectional view of the part of appliance for being thermally coupled to inner frame is shown.What is illustrated in Figure 12 B cuts In face, the top layer 2170a of inner frame includes two holes of exposure heat conductive intermediate layer 2172.Bottom 2170b is in this section not Including any hole.On top layer 2170a, a hole of neighbouring heat bridge 2194 is filled and another hole of neighbouring heat bridge 2196 does not have It is filled.On the internally positioned frameworks of PCB 2190 including PCB parts 2192.Be not associated with PCB 2190 another Part of appliance 2195 is shown on PCB 2190.
Pcb board is oriented such that the heating surface of PCB parts towards inner frame.When using conductive inner framework, Direction/the position of other internal parts of such as PCB can be adjusted causing that the surface related to heat generating components can be joined with heat It is connected to inner frame.In addition, it is desirable to contribute to the hope being thermally coupled between the part of appliance on PCB and inner frame can also A factor in as PCB design, i.e. part of appliance can be disposed on PCB so that easily realize being thermally coupled.
In Figure 12 B, the surface of PCB parts 2192 (it is heat generating components) is shown as being thermally coupled to via heat bridge 2194 The intermediate layer 2172 of inner frame.In addition, the surface of part 2195 (it is also heat generating components) is shown as via Thermal connector 2198 intermediate layers 2172 for being connected to inner frame.Thermal connector 2198 is couple to intermediate layer 2172 and equipment via heat bridge 2196 The surface of part 2195.As explained above with described in Figure 10 C, Thermal connector 2198 can include surrounding the outside of heat conduction core every Thermosphere.In this example, Thermal connector 2198 is shown as extending to reach heat generating components above the horizontal plane of PCB 2190 2195。
Figure 13 is the method 2200 of the portable electric appts of embodiment, manufacture with inner frame according to described by Flow chart, wherein the inner frame is configured to have specific thermal-structural behaviour.2202, can construct including multiple materials The inner frame of layer.Construction process may relate to select the strong of quantity, the thickness of each layer and desired each layer of layer Degree and thermal characteristics.The intensity and thermal characteristics of desired each layer may influence the material selected by each layer.
In embodiment, the layer selected due to its thermal characteristics is sandwiched between two exterior layers, the two exterior layer quilts The intensity for increasing inner frame is selected, one or more holes can be constructed in exterior layer.This some holes can be provided to permit Perhaps internally formed between the heating surface of the intermediate layer of framework and internal unit part and be preferably thermally coupled.2202, can be with Determine the arrangement of this some holes.
In 2204, the inner frame with selected hole site, thermal characteristics and strength characteristics can be formed.At one In embodiment, inner frame can be formed using coating.2206, in the assembling process of electronic equipment, set with electronics The surface that heat generating components in standby is associated can be thermally coupled to inner frame.2208, inner frame can be mechanically coupled to The housing of electronic equipment.2210, one or more parts of appliance can be mechanically coupled to inner frame.
Figure 14 is the block diagram of the media player 2300 of the embodiment according to described by.Media player 2300 includes treatment Device 2302, its microprocessor or controller for belonging to all operationss for controlling media player 2300.Media player 2300 store the media data on media item in file system 2304 and cache (cache) 2306.Typically, file System 2304 is storage disk or multiple disks.Typically, file system is that media player 2300 provides massive store ability. But, because the access time to file system 2304 is relatively slow, media player 2300 also includes cache 2306.It is high Speed caching 2306 is, for example, the random access storage device (RAM) provided by semiconductor memory.To the relative of cache 2306 Access time is significantly shorter than the access time to file system 2304.But cache 2306 does not have file system 2304 Large storage capacity.
Additionally, file system 2304 can consume more power than cache 2306 when activating.Work as media player 2300 when being the portable electronic device powered by battery (not shown), and power consumption is even more important.
Media player 2300 is also including user input equipment 2308, its user for allowing media player 2300 and media Player 2300 is interacted.For example, user input equipment 2308 can take many forms, button, keypad, rotating disk etc.. In addition, media player 2300 include display 2310 (screen display), display can from processor 2302 control with to User's display information.Data/address bus 2311 can aid at least in file system 2304, cache 2306, processor 2302 And the data transfer between codec (CODEC) 2312.
In one embodiment, media player 2300 is used to store multiple media items in file system 2304 (for example Song).When user wants media renderer plays certain media items, the list of available media items can be displayed in display 2310 On.Then, using user input equipment 2308, user can select one of available media items.Receiving to certain media items Selection after, the media data (for example, audio file) of certain media items is supplied to encoder/decoder by processor 2302 (codec) 2312.Then codec 2312 produces the analog output signal for loudspeaker 2314.Loudspeaker 2314 can Being the loudspeaker outside the inside of media player 2300 or media player 2300.For example, being connected to media player 2300 headphone or earphone is considered as external loudspeaker.
In certain embodiments, the part of appliance of such as display etc with mechanical attachment and can be thermally coupled to interior sash Frame.In some other embodiment, part of appliance can be mechanically coupled to inner frame but not be thermally coupled to inner frame.Again In some embodiments, part of appliance can be thermally coupled to inner frame and be mechanically fixed to housing via other structures part.
In a particular embodiment, portable computing device can be assembled using computer-aided manufacturing and assembling process. Computer-aided manufacturing and assembling process may relate to multiple equipment (multiple equipment for such as being configured in cable architecture is assembled) Use.For example, area of computer aided machine can be configured to remove material after coating or by coating Hole is formed before treatment in sheet material, and hole is formed in diverse location.Used as another example, robot device can be configured For heat generating components such as is thermally coupled into inner frame by welding procedure.
Synthesis Mike's wind cabin is sealed and mechanical attributes with optimizing
In the consumer-elcetronics devices of such as portable computing device, SoundRec ability is fairly common.Then, Equipment typically comprises the microphone of a certain type.Generally, microphone is used in voice application, such as digital telephone, IP electricity Words (VOIP) and voice memo.Microphone is used in also at the same time recording the videograph application of view image and sound.
Microphone may be located in the inner space of electronic equipment.For example, in the portable computing device with housing, It is provided with the built-in microphone for being configured as that sound is received via the hole in housing.A spacing can be separated by between built-in microphone and hole From.Then, Mike's wind cabin can be used for providing the sound tube between hole and built-in microphone.
In portable computing device, it may be desirable to avoid by inside produce or by sound therein with from external source via The sound that hole in housing enters Mike's wind cabin mixes.If for example, equipment includes internal loudspeaker, can expect to avoid The sound of the outside generation that the sound compacting internally produced by loudspeaker is received by microphone through Mike's wind cabin.Additionally, In the case of being acoustically isolated into the outside sound for generating of Mike's wind cabin and other sources of sound, then can more readily using all Such as the method for echo cancelltion.In telephone communication, thus echo cancelltion describes the removal echo from voice communication improves phone The process of the voice quality of calling.Echo cancelltion application may require that and know acoustic enviroment, the acoustic enviroment in such as Mike's wind cabin, This is easier to be determined in the case where Mike's wind cabin is acoustically isolated.
Being acoustically isolated inside Mike's wind cabin can form Mike's wind cabin and by wheat by the material by insulating against sound relatively Gram wind cabin two ends provide good airtight sealing and realize.Sealing integrity can be by for forming one kind of Mike's wind cabin or many Plant material and influenceed for fixing the method for Mike's wind cabin.For example, Mike's wind cabin can be with so that pressure be maintained close Seal up and thereby aid in the mode of the sealing integrity of the seal for maintaining Mike's wind cabin often to hold and fixed.
Sealing integrity can be influenceed by forming the relative hardness of the material of Mike's wind cabin.The advantage of relatively hard materials is Good platform can be provided to set up sealing at Mike's wind cabin often end.The inferior position of relatively hard materials is that it is easier will such as The outside generative power of the power generated when equipment is fallen is delivered to device interior.If excessive by power that Mike's wind cabin is transmitted, have The internal part of portable computing device may be damaged.In view of above-mentioned, Mike's wind cabin design as described below will be using harder material The advantage of the improved sealing property that material can be provided, while meter and the vibrations transitive attribute being associated with using relatively hard materials.
In more detail, referring to Figure 15 A-20C, describe that the relatively hard materials and pin for the selection of its sealing property can be utilized To synthesis Mike's wind cabin of the combination of the softer material of its damping performance selection.But, those skilled in the art will easily anticipate Know and be intended merely to task of explanation herein by reference to the detailed description given by these accompanying drawings, and should not be construed as restricted.More Specifically, the embodiment of synthesis Mike's wind cabin of the combination of harder and softer material will be used with reference to Figure 15 A-15C descriptions.With reference to Figure 16 A-16B, discuss the example for being incorporated to the several installation sites as synthesis Mike's wind cabin of a microphone assembly part. The microphone assembly in pre-installation and installed position is then shown in Figure 17 A-17B.During installation, Mike's wind cabin can be by pressing The mode that thus pressure improves sealing integrity is fixed.The transmission that Mike's wind cabin will be passed through with reference to external force during Figure 17 C description operations. With reference to Figure 18 A-18C, discussion includes the different embodiments of synthesis Mike's wind cabin of various dimensions and material.Described with reference to Figure 19 Manufacture includes the method for the portable computing device for synthesizing Mike's wind cabin.Finally, refer to the attached drawing 20A-20C, discussing to wrap Include the perspective view and block diagram of the portable computing device of synthesis Mike's wind cabin.
Figure 15 A-15C are shown including microphone 3106, circuit board 3104 and such as 3102a, 3102b and 3102c The microphone assembly 3100 of Mike's wind cabin.Microphone 3106 is shown as coupled to circuit board 3104.In a particular embodiment, electricity Road plate can be formed by rigidity or flexible substrates.Mike's wind cabin of such as 3102a, 3102b and 3102c then may include around chamber 3112 Each surface.Chamber 3112 can serve as sound tube.For example, will be described in further detail as described above and with reference to Figure 16 A and 16B, In portable computing device, the hole that chamber 3112 can be acoustically coupled in housing, for use as by outside portable computing device The sound that source produces sends into the sound tube of built-in microphone.
Mike's wind cabin can include inner surface profile and outer surface profile.Inner surface profile provides the boundary of inner chamber 3110a. As shown in fig. 15, Mike's wind cabin 3102a is cylindrical.In this instance, outer surface profile 3108a and inner surface profile 3110a Two concentric cylinders can be described generally as.The top surface 3111 and basal surface of Mike's wind cabin 3102a can be with general planars.
The inner surface profile and outer surface profile of Mike's wind cabin are not required to be made up of concentric shape.In general, appearance Facial contour and inner surface profile with different from each other, and can be each shaped with can be from top surface to basal surface by any The shape of change.For example, chamber 3112 can be wider at top and narrower in bottom.Additionally, chamber 3112 can have one at top Plant shape and there is another shape in bottom.Additionally, in a specific embodiment, chamber 3112 can be followed through microphone Crooked route inside storehouse.
For example, showing the outer surface profile Mike wind cabin 3102b different with inner surface profile in Figure 15 B.Mike's wind cabin The outer surface profile 3108b of the 3102 inner surface profile 3110b for including cylinder and rectangle.In another example, the shape contour Can be with contrast, so that inner surface profile 3110b is for rectangle, and outer surface profile 3108b is cylinder.Similar to Figure 15 A's Example, both top surface 3111 and basal surface are flat.
In embodiments, one or both of top surface and basal surface of Mike's wind cabin can be bendings.For example, in figure In 15C, the Mike's wind cabin 3102c including bending top surface 3111a and flat basal surface is shown.Mike's wind cabin 3102c includes The inner surface profile 3110c of the rectangle and outer surface profile 3108c of rectangle.
In certain embodiments, the top surface (such as 3111a) of Mike's wind cabin can be with the crooked inner surface of apparatus casing It is combined.In order to improve sealing integrity, it is beneficial to the top surface of shaping such as 3111a, so that its curvature is more or less Comply with the curvature of shell inner surface.For example, top surface bending will obtain more equal top surface to comply with the inner surface of housing Pressure distribution, thus improves sealing integrity.In other embodiments, the Mike's wind cabin with planar top surface can be bound to Crooked inner surface, or the Mike's wind cabin with bending top surface can be bound to flat inner surface.In this embodiment, Mike The flat or bending top surface of wind cabin can be used compression stress (that is, by compressing Mike's wind cabin) to be made to comply with inner surface.
In Figure 15 A-15C, the top surface of microphone 3106 is shown as flat and with the Mike of flat basal surface Wind cabin is shown as being combined with the planar top surface of microphone.In other embodiments, the top surface of microphone 3106 can be with Incline or bend, and the basal surface of Mike's wind cabin of such as 3102a, 3102b and 3102c can then be inclined with more or less on demand Comply with the top surface of microphone.As described above, the Mike's wind cabin for shaping in this way can improve Mike's wind cabin basal surface and Sealing integrity between the top surface of microphone.
In other embodiments, the top surface of the basal surface of Mike's wind cabin and microphone can be shaped differently.For example, wheat The top surface of gram wind can be bending, and the basal surface of Mike's wind cabin can be flat.The bottom of Mike's wind cabin can be by can Compression material is made, thus when the flat basal surface of Mike's wind cabin is pressed against on the curved surface of microphone, Mike's wind cabin Flat basal surface can comply with the bending top surface of microphone.
As described above, microphone assembly can be installed in equipment (such as, portable computing device) inside.Microphone group Part and its associated Mike's wind cabin can be positioned such that it aligns with the hole in housing, and the offer sound between hole and microphone Sound tube road.Hole may be located at each position on the outer surface of equipment.The arrangement in hole can influence the position of Mike's wind cabin And orientation.It is following to be described with two with the microphone assembly being differently directed in portable computing device with reference to Figure 16 A and 16B Individual example.
In Figure 16 A and 16B, including microphone 3106, circuit board 3104 and Mike's wind cabin 3102 microphone assembly quilt It is shown positioned in inside the housing 3120 of portable computing device.Housing 3120 is generally rectangular shaped.The outer surface of housing 3120 Including outer surface profile 3120a and inner surface profile 3120b.Outer surface profile 3120a and inner surface profile 3120b can be each other It is shaped differently.For example, outer surface 3120a can be flat in a region, and corresponding interior zone is then bending 's.Inner surface configuration near Mike's wind cabin can influence the sealing integrity of the seal between Mike's wind cabin and inner surface.Such as Upper described, in certain embodiments, the top surface of Mike's wind cabin can be shaped to comply with the shape of shell inner surface, thus improve Sealing integrity.Sealing integrity is important, because the good gas-tight seal sound that can aid in inside Mike's wind cabin Pipeline is acoustically isolated.
In Figure 16 A, Mike's wind cabin 3102 is shown as upwardly-directed, and chamber in Mike's wind cabin is from top to bottom along axle H and housing alignment.In this embodiment, such as the top cover of lid glass can be placed on the opening of housing 3120.Figure 20 A In show one embodiment of the portable computing device including the housing with lid glass.Top cover can include hole.Install Period, microphone assembly is disposed in housing so that the top surface of Mike's wind cabin is in its installation position with the hole in top cover Position alignment when putting.Then, when top cover is mounted, the basal surface of top cover can mutually be tied with the top surface of Mike's wind cabin Close, thus generate sound tube between the hole of top cover and microphone via Mike's wind cabin.
In another embodiment, such as 3120 housing can include the hole 3122 of the microphone for such as 3106. In fig. 16b, housing 3120 is shown as having hole 3122 in the sidepiece near its corner.Microphone 3106 and circuit board 3104 be shown as being positioned so that microphone top surface and circuit board it is substantially parallel with sidepiece with holes, and Mike's wind cabin Alignd with the hole 3102 opening.The sound tube being associated with Mike's wind cabin is substantially alignd with axle W.
Other orientations of microphone assembly and Mike's wind cabin are also possible, and are not limited in Figure 16 A and 16B what is shown Orientation.For example, in one embodiment, the top surface of Mike's wind cabin 3102 can mutually be tied with the shell inner surface near hole 3122 Close, to form sound tube.Then, can be with adjustment circuit plate and the orientation of microphone, to cause microphone storehouse and its inner tube Road is slight curving in some way.Mike's wind cabin can by flexible material with realize bending.It is possible to be not intended to Mike's wind cabin The limit of a certain determination is bent over, so as to the possible hoop for avoiding Mike's wind cabin internal sound pipeline breaks.
In other embodiments, Mike's wind cabin of bending can be provided.For example, the microphone of pipe bend can be configured similarly to Storehouse.The pipe bend can be provided by the curved shape that a certain angle bends with ancon.Mike's wind cabin of bending can allow for microphone Orientation with printed circuit board (PCB) changes relative to housing, and this is probably desired for encapsulation reason.As follows will with reference to Figure 17 A and Mike's wind cabin 3102 is attached to the more details of housing 3120 for 17B descriptions.
Figure 17 A-17B show that the embodiment according to described by is respectively at pre-installed position and installation position in housing The side view of the microphone assembly put.In Figure 17 A, the sectional view of Mike's wind cabin 3102 is shown.The one of Mike's wind cabin 3102 End is alignd with the hole 3121a in housing 3120, and the second end of Mike's wind cabin is then alignd with microphone 3106.Then, via hole Mike's wind cabin between 3121a and microphone 3106 forms sound tube.
First seal 3122 can be formed between the top surface of the basal surface of Mike's wind cabin 3102 and microphone 3106. Second seal 3124 can then be formed between the inner surface of the top surface of Mike's wind cabin 3102 and housing 3120, to cause to be somebody's turn to do Hole of Mike's wind cabin in housing 3120.In one embodiment, first seal and second seal use such as pressure-sensitive The adhesive of adhesive (PSA) is formed.PSA can be provided as double faced adhesive tape.In another embodiment, first seal 3122 or Second seal 3124 can be formed using liquid adhesive.
In one embodiment, microphone 3106 and circuit board 3104 are provided to be attached to the wheat of microphone 3106 Gram wind cabin 3102.In another embodiment, during equipment is assembled, microphone 3106 and circuit board 3104 can as with wheat The separate part of gram wind cabin 3102 is provided.In the case where Mike's wind cabin and microphone are provided as separate part, Mike's wind cabin 3102 can be first attached to microphone 3106, and then be attached to the inner surface of housing 3120, and or vice versa.Attachment Process can be related to arrange PSA or some other sealed binders on every one end of Mike's wind cabin.
Alignd with the hole 3121a of housing and formed between Mike's wind cabin and enclosure interior in Mike's wind cabin 3102 and initially tied After conjunction, compression stress, such as 3130a and 3130b can be applied to Mike's wind cabin.Compression stress can be in Mike's wind cabin 3102, wheat Generated when gram wind 3106 and circuit board 3104 in position.It is, for example possible to use one or more fasteners of such as screw come Circuit board 3104 is fixed to housing 3120 or some others structure nearby.It is in place with screw, can be in Mike's wind cabin Compression stress is generated on 3102.Compression stress can be used for will be around any air pocket extrusion of seal, such that it is able to improve seal Sealing integrity.
As shown in Figure 17 A, housing 3120 can be bent around in Mike's wind cabin 3102.Then, compression stress can be unequally Distribution passes through Mike's wind cabin.For example, the compression stress on the sidepiece 3114a of Mike's wind cabin will be less than the sidepiece in Mike's wind cabin Compression stress on 3114b.As described above, in certain embodiments, Mike's wind cabin 3102 can be shaped to be more uniformly distributed Compression stress.For example, the top surface of Mike's wind cabin can be inclined, the curvature of the inner surface of housing 3120 is thus followed.At it In his embodiment, the top surface of Mike's wind cabin 3102 can not follow the curvature of shell inner surface (for example, top surface can be flat Smooth and inner surface can be bending, as shown in Figure 17 A), and compression stress can be used to oppress the top surface change of Mike's wind cabin Shape, so that it complies with the inner surface of housing.
Height 3135 between circuit board 3104 and a position of housing shows in Figure 17 A.After installation, such as scheme Shown in 17B, height 3135 can change.For example, height 3135 can reduce, this can subtract with the height of Mike's wind cabin 3102 It is small associated.The amount that Mike's wind cabin highly reduces can depend on its original size, the material for forming Mike's wind cabin and It is applied to the size of the compression stress of Mike's wind cabin.
The reduction of Mike's wind cabin height can cause to be transferred to the expansive force 3140 of Mike's wind cabin.Expansive force 3140 can be pushed away To seal 3122 and 3124, such that it is able to improve the sealing integrity of seal.For example, as described above, compression stress can be helped Help removal air pocket.The improvement of sealing integrity can realize the more excellent sound isolation characteristic of Mike's wind cabin internal sound pipeline.Example Such as, as seal becomes more airtight, can reduce and penetrate into Mike's wind cabin via the sound channel inside housing 3120 Sound.In one embodiment, being acoustically isolated in the sound tube of Mike's wind cabin can be that about 40dB is even more big.
Figure 17 C show the side view of the microphone assembly in the housing 3120 in response to externally applied force 3142.Operation The equipment of period, such as portable computing device can undergo the power of outside applying, such as 3142.For example, equipment may be fallen, Thus generative power.
The power that outside applies can transport through the equipment via various paths.The power of such as 3142a can be transported through Mike's wind cabin 3102, and the power of such as 3142b then may pass in microphone 3106 and circuit board 3104.Power can be with dynamic Mode is transmitted.For example, Mike's wind cabin can be compressed, the change of height 3135c can be then caused in response to power expansion.Mike The expansion of wind cabin and shrink can each inter-module of push-and-pull attachment, the seal of such as microphone 3106 and circuit board 3104 and every side Attachment between 3122 and 3124.
If Mike's wind cabin is not designed appropriately, then the expansion and contraction of Mike's wind cabin 3102 and such as circuit board The bending of 3104 miscellaneous part is possible to the deterioration of the sealing integrity of the seal that can cause such as 3122 or 3124.Surveying In examination, for the design of some Mike's wind cabins, finding such as 3122 or 3124 seal can be opened, and microphone 3106 can be from electricity Road plate 3104 departs from, or circuit board can be damaged.In one embodiment, microphone assembly is designed to bear to reach The acceleration of 10000g ' s, this has arranged the amplitude of externally applied force.
During test, the microphone group using the Mike's wind cabin formed by softer and more compressible single material is found Part, compared to the Mike's wind cabin formed by more hard material, has more to shock damage (vibrations caused by such as by accelerating suddenly) Resistance high.But, it was found that the Mike's wind cabin formed by single more hard material is compared to the Mike formed by more soft material Wind cabin, can provide better seal integrality, and thus offer is preferably acoustically isolated.However, being formed using by more hard material The microphone assembly of Mike's wind cabin be easier to be given a shock infringement.
In order to synthesis Mike using the improved sealing property of the antidetonation attribute of more soft material and hard material, can be provided Wind cabin is designed.Synthesis Mike wind cabin can use the combination of hard material and soft material.Relatively hard materials can be used to improve sealing completely Property, and softer material then can be used to improve shock resistance.The following conjunction for describing to be used in microphone assembly with reference to Figure 18 A-18D Into the embodiment of Mike's wind cabin.
Sections of Figure 18 A-18D according to the synthesis Mike's wind cabin for being preferable to carry out being illustrated such as 3200,3225 and 3235 Figure.Top seal and lower seals are shown as being formed in each Mike's wind cabin.In Figure 18 A, show including sealing The top view of Mike's wind cabin 3200 of part 3202a.Top view shows that Mike's wind cabin 3200 is included to the circle of internal path 3215 Shape opening 3210, to be formed by the sound tube of Mike's wind cabin.Packing ring similar to seal 3202a can be in Mike's wind cabin 3200 top is formed.As described above, the inner surface profile and outer surface profile of such as 3200 Mike's wind cabin can be with interior Portion's path change.Then, the top view of Mike's wind cabin can be depended on as outline and the selected surface topography of Internal periphery Change.Seal 3202a is designed to almost cover the top surface of Mike's wind cabin 3200.Then, the shape of seal 3202a Can correspondingly change.
Figure 18 A are returned to, Mike's wind cabin can include the first terminal cap moiety 3204a.First end cap 3204a can be by the first material Formed, and with first thickness 3212.Hermetic unit 3202a can be combined at the top of first end cap 3204a.Second end Cap 3204b may be located on the bottom of Mike's wind cabin.Second end cap can be formed by the second material, and can have second thickness 3216.Thickness be 3214 Mike's wind cabin centering portions 3206 can be placed in first end cap 3204a and the second end cap 3204b it Between.Centering portions can be formed by the 3rd material.First thickness 3212, the thickness 3214 of second thickness 3216 and the 3rd can each other not Together.
Hermetic unit 3202b can be bound to the second end cap 3204b.As it was previously stated, hermetic unit 3202a can be bound to The inner surface on one surface, such as housing.Hermetic unit 3202b can be bound to a surface, the top surface of such as microphone.Sealing Part 3202a and 3202b can be formed by identical or different material.For example, hermetic unit by identical PSA or can have two kinds of differences PSA formed.
In a particular embodiment, for first end cap 3204a the first material and the second material for the second end cap 3204b Material can be selected according to the ability of their improvement sealing integrities, and the 3rd material of centering portions 3206 then can be according to it Damping performance is selected.As described above, can be improved and Mike's wind cabin seal (such as 3202a and 3202b) using hard material Associated sealing integrity, and can then improve the shock resistance of microphone assembly using softer material.Then, select for first The material of end cap and the second end cap can be formed to improve sealing integrity by relatively hard materials, and centering portions then can be by compared to the One end cap and the second end cap is softer and more compressible material forms to improve shock resistance.In one embodiment, first end Cap and the second end cap can be formed by duroplasts, and centering portions can be formed by the plastics softer than end cap of such as silicone-based plastics.
In a specific embodiment, first end cap 3204a and the second end cap 3204b can be made up of the first relatively hard materials, and Centering portions can then be made up of the second softer material.The Mike's wind cabin for designing in this way can be whole during dijection Shooting Technique Body is formed, wherein using the second material in biphasic injection using the first material in a shot.First material and second Material may be selected such that two materials are combined together during dijection Shooting Technique.In other embodiments, first end Cap 3204a, the second end cap 3204b and centering portions 3206 can be formed independently, and such as be punched, and then gluing in some way It is combined to form Mike's wind cabin.
In one embodiment, first end cap 3204a and the second end cap 3204b can have the roughly equal of same thickness Shape.However, the thickness 3214 of centering portions can be with difference.In other embodiments, first end cap and the second end cap can be by not Shape together.For example, in Figure 18 B, showing first end cap 3228a and the second variform Mike's wind cabins of end cap 3228b 3225.Mike's wind cabin includes centering portions 3230, and can select for centering portions 3230, first end cap 3228a and the The material of two end cap 3228b, so as to improve sealing integrity and/or shock resistance in the manner.
The top surface of first end cap 3228a can be bent or be inclined by some way.As set forth above, it is possible to expect first end The shape of cap 3228a substantially complies with its surface to be combined.For example, the shape of first end cap 3228a can comply with the curved of housing Bent inner surface, as illustrated in figures 17 a-17 c.Seal 3226a and 3226b can be joined respectively to first end cap 3228a and second Hold cap 3228b.Seal can be shaped to the surface for following it to be combined.Then, seal 3226a can be bending, with The shape of first end cap 3228a is followed, and seal 3226b is then relatively flat, to follow the planar shaped of bottom end cap 3228b Shape.
In Figure 18 A and 18B, the centering portions 3206 and 3230 of the Mike's wind cabin with relative constancy thickness are shown. In other embodiments, the thickness of the centering portions of Mike's wind cabin can change.For example, in Figure 18 C, showing centering portions Mike's wind cabin 3235 of 3240 thickness change.Mike's wind cabin can include with inclined upper surface first end cap 3238a with And the second end cap 32238b with planar bottom surface.Seal 3236a and 3236b can be respectively attached to hold cap accordingly. The thickness relative constancy of the second end cap 3238b shown in this.
In Figure 18 C, the thickness of centering portions 3240 can be thinning from thickness.Additionally, the thickness of first end cap 3238 then may be used To thicken in the thinning place of centering portions 3240 in thickening local thinning of centering portions.In other embodiments, between two parties Interface between part 3240 and first end cap 3238a be able to can be made into relative level and the second end cap it is thinner or thicker, To cause that the interface between the end cap 3238b of centering portions 3240 and second inclines, the change of centering portions thickness profile is thus allowed Change.In another embodiment, between first end cap 3238a and centering portions 3240 interface and centering portions 3240 and second Hold the interface between cap 3238b all can incline in some way.
The thickness of the centering portions 3240 of Mike's wind cabin can change, and thus change Mike's wind cabin when mounted in it The distribution of compression stress.For example, the thickness of centering portions 3240 can change to produce the compression force distribution being more uniformly distributed, and thus The end cap for being provided as such as 3238a provides better seal.In other embodiments, centering portions 3240 can in specific region It is made thicker or thinner, to adjust the shock absorption properties in these regions.In still other embodiments, centering portions are in specific region It is interior can be made thicker or thinner, to generate preferred vibrations transmission path, such as guiding vibrations are away from more fragile region And the path in the more structure-reinforced region of direction.
In with reference to synthesis Mike's wind cabin of Figure 18 A-18D descriptions, synthesis Mike's wind cabin is formed using multiple material. In one embodiment, as shown in Figure 18 D, homogenous material can be used for microphone storehouse.Mike's wind cabin 3245 includes homogenous material Centering portions 3250.Seal 3246a and 3246b are then shown as being attached to Mike's wind cabin.If cushioning effect can be with Compensated using some way beyond the second vibration-absorptive material, then can improve the ability of sealing integrity according to material to select Use homogenous material, such as single relatively hard materials.
In one example, the geometry of such as 3245 Mike's wind cabin is adjusted to alter its damping performance.For example, can To set the projection of such as 3250a in Mike's wind cabin 3245, to help disperse the vibrations for transporting through Mike's wind cabin.Another In individual embodiment, microphone assembly can be in some way adjusted so as to improve its cushioning ability.For example, can be in microphone group In the means for attachment of part design shock damping feature, or can in microphone assembly using more flexible circuit board with Improve its damping characteristic.
Figure 19 is the stream of the method for including synthesizing the portable computing device of Mike's wind cabin according to the manufacture of preferred embodiment Journey Figure 33 00.3302, the dimension and material of Mike's wind cabin are selected.For example, the centering portions between including being placed in two ends cap Synthesis Mike's wind cabin in, it may be determined that for the dimension that each end cap and centering portions are used.Dimension can be selected to change The sealing integrity and shock absorption properties of kind Mike's wind cabin.Furthermore, it is possible to select the material that each part is used.As it was previously stated, also Material can be selected to improve the sealing integrity and shock absorption properties of Mike's wind cabin.
Next, the Mike's wind cabin according to specific dimension and material can be formed.In one embodiment, Mike's wind cabin can Being to synthesize Mike's wind cabin by what is constituted using the integrally formed multiple material of Shooting Technique and part.In 3304, Mike's wind cabin Part I can be formed by a shot for dijection Shooting Technique.3306, the Part II of Mike's wind cabin can be noted by dijection The another shot for moulding technique is formed.Different materials can be used for per injection.In other embodiments, shape can be separated Into the different piece of Mike's wind cabin, and they are fitted together after the formation of each part.
3308, Mike's wind cabin can be attached to microphone.Microphone can include being coupled to circuit board and wheat A part for the microphone assembly of the microphone of gram wind cabin.3310, microphone assembly can be attached to such as portable computing and set The housing of standby electronic equipment, to form sealing between microphone and housing.In one embodiment, the sealing can be used Contact adhesive is formed.3312, when component is fixed, Mike's wind cabin can be in some way compressed.Compression can change Become the dimension of Mike's wind cabin, and cause that Mike's wind cabin associates seal and exerts a force to it.The power of applying can be used for improving seal Sealing integrity.
Figure 20 A and 20B show that the top view of the portable computing device 3400 of the embodiment according to described by and bottom regard Figure.It is hand-held that portable computing device may be adapted to user.Lid glass 3406 and display 3404 can be placed in housing 3402 In opening 3408.Lid glass can include the opening for input mechanism (such as load button 3414).In one embodiment In, load button 3414 can be used for for portable computing device returning to particular state, such as main interface state.
Other input/output means can be arranged around the periphery of housing 3402.For example, can be arranged in the apical margin of housing Such as 3410 power switch, and such as 3412 volume switch can be arranged along a line edge of housing.For connecting The audio jack 3416 and data of earphone or other audio frequency apparatuses/power connector interface are then positioned at the root edge of housing.The shell Body 3400 also includes the hole for allowing the camera 3415 for receiving video data.
Figure 20 C are the block diagrams of the media player 3500 of the embodiment according to described by.Media player 3500 includes place Reason device 3502, its microprocessor or controller for belonging to all operationss for controlling media player 3500.Media player 3500 store the media data on media item in file system 3504 and cache (cache) 3506.Typically, file System 3504 is storage disk or multiple disks.Typically, file system is that media player 3500 provides massive store ability. But, because the access time to file system 3504 is relatively slow, media player 3500 also includes cache 3506.It is high Speed caching 3506 is, for example, the random access storage device (RAM) provided by semiconductor memory.To the relative of cache 3506 Access time is significantly shorter than the access time to file system 3504.But cache 3506 does not have file system 3504 Large storage capacity.
Further, in activity, file system 3504 consumes more electric power than cache 3506.When media are broadcast When to put device 3500 be the portable electronic device powered by battery (not shown), power consumption is even more important.
Media player 3500 is also including user input equipment 3508, its user for allowing media player 3500 and media Player 3500 is interacted.For example, user input equipment 3508 can take many forms, button, keypad, rotating disk etc.. In addition, media player 3500 include display 3510 (screen display), display can from processor 3502 control with to User's display information.Data/address bus 3511 can aid at least in file system 3504, cache 3506, processor 3502 And the data transfer between codec (CODEC) 3512.
In one embodiment, media player 3500 is used to store multiple media items in file system 3504 (for example Song).When user wants media renderer plays certain media items, the list of available media items can be displayed in display 3510 On.Then, using user input equipment 3508, user can select one of available media items.Receiving to certain media items Selection after, the media data (for example, audio file) of certain media items is supplied to encoder/decoder by processor 3502 (CODEC, codec) 3512.Then codec 3512 produces the analog output signal for loudspeaker 3514.Loudspeaker 3514 can be the loudspeaker outside the inside of media player 3500 or media player 3100.For example, being connected to media play The headphone or earphone of device 3500 are considered as external loudspeaker.
In the above-mentioned methods, it is possible to use computer-aided manufacturing process performs one or more described steps.Calculate Machine auxiliary manufacturing process can be related to program one or more different equipment by formed or assembled Mike's wind cabin and it is portable in terms of Calculation equipment.For example, robot device can be programmed in the housing of portable computing device install microphone by certain orientation Storehouse and/or the microphone assembly including microphone.
Modularization material antenna module
Inventionbroadly, disclosed embodiments describe a kind of modularization material antenna module including antenna block, institute Stating antenna block has a part, and the part has the corresponding part interlocking with non-conductive framework and is fixed to antenna block does not lead The shape of electric framework.The non-conductive framework is attached to the inside of conductive shell, to cause non-conductive framework and the conductive shell bodily form Integral structure.Then, by antenna block mechanical support antenna flexible cable, and antenna flexible cable is electrically connected to circuit Plate.Framework is designed to support the lid glass for portable electric appts, and can be affixed on housing.Antenna block Dielectric constant is more much smaller than the dielectric constant of framework.In one embodiment, antenna block is made up of cyclic olefin polymer (COP), And framework is made up of glass filled plasticses.The synthesis difference of dielectric constant and framework and the interlocking portions and dielectric of antenna block The difference of loss angle tangent is combined and improves antenna performance.
Figure 21 shows a top perspective view, which illustrates the representative consumer products of the embodiment described by basis 4100.Consumer products 4100 can take many forms, not exclusively including portable electronic device (such as iPodTMOr iPod TouchTM), smart phone (such as iPhoneTM), tablet PC (such as iPadTM), each be by The Apple Inc. manufactures of Cupertino, CA..Consumer products 100 can be sent using inside antenna and/or receive wireless Communication.These radio communications can be performed for many different purposes.For example, as described later, can be logical for mobile phone Letter, WiFi communication, BluetoothTMCommunication, wireless broadband communication etc. perform radio communication.So that these communications are more efficient and more Effectively provide the Consumer's Experience of improvement when using consumer products 4100.
Figure 22 shows the top perspective view of the modularization material antenna module according to one embodiment.Herein, there is provided by The housing 4200 that conductive material is made.An example suitable for the conductive material of this embodiment is stainless steel, although ability Field technique personnel will recognize that many other possible material existed suitable for this embodiment, and unless explicitly stated otherwise, Claim should not be construed as being limited to stainless steel.Framework 4202 is affixed on housing 4200, and is typically used for branch The front (not shown) of support equipment.Front can be made up of the transparent material of such as glass, and can be used for overlay device, but still User is allowed to watch following display (not shown) by covering.It is input equipment that the display is also acted as.For example, aobvious Show that device can be the one kind in many different types of touch-screens.
For Support cover thing, framework 4202 can include the edge 4204 with flange portion 4206.In an implementation In example, covering is adhered to edge 4204 around flange 4206, so as to seal whole equipment.Therefore, edge 4204 is not only used As the support of covering, and it is used as the calmodulin binding domain CaM that covering can be attached on framework.Framework 4202 can be by such as The non-conductive frame material of glass filled plasticses is made.A kind of exemplary glass filled plastics suitable for framework 202 be by The KALIX of the Solvay Advanced Polymers manufactures of GA.AlpharettaTM。KALIXTMIncluding 50% with glass fibers Tie up the high performance nylon strengthened.It will be recognized by those of ordinary skills existing suitable for many other of the present embodiment Possible frame material, and unless explicitly stated otherwise, claim should not be construed as being limited to KALIXTMOr any other glass Glass filled plastics.
The dielectric constant of framework 4202 is more much bigger than the dielectric constant of antenna block 4208.For example, glass filled plasticses have About 5 dielectric constant, and the COP that can be used as antenna block of material as outlined above can have approximate 2.25 dielectric constant. In addition, the dielectric loss tangent of framework 4202 is more much bigger than the dielectric loss tangent of antenna block 4208.For example, glass Filled plastics have the dielectric loss tangent between 2.5 and 4, and the antenna block 4208 being made up of COP can have closely Like 0.0005 dielectric loss tangent.Dielectric loss tangent is its intrinsic electromagnetic quantities dissipation of the quantization of dielectric substance Parameter.The term refers to the angle between resistive (damaging) component and its reactance (lossless) component of electromagnetic field in complex plane Degree.Dielectric loss tangent is smaller, and " loss " that antenna is received is fewer.
In addition to being made with the antenna block of material with the dielectric constant more much smaller than frame material for just having described, day Line block 4208 also has a part, and the part has the corresponding part interlocking with framework 4202 and antenna block is fixed on into framework On shape.This is illustrated in Figure 23 and 24.The equipment can also include printed circuit board (PCB) (not shown) integrated circuit, and Other electronic building bricks may be mounted to that on circuit board, and can be used for operation equipment and control display.Printed circuit board (PCB) can With the one or more processors of the various functions including being configured as execution equipment.
Figure 23 shows the first sectional view of the modularization material antenna module according to one embodiment.The sectional view is represented The view that the side of equipment is watched from Figure 22.Such as finding in fig 23, antenna block 4208 includes part 4210, the part 4210 have the shape interlocked with the corresponding part 4212 of framework 4202.Herein, interlocking portions include the protuberance of framework 4202 Points 4212, and antenna block 4208 groove part 4210.However, it will be appreciated by those of ordinary skill in the art that in the presence of with by day The mode that line block 4208 is fixed to framework 4202 interlocks many different modes of these components, and unless expressly stated, right It is required that should not be construed as being limited to any specific shape (one or more).
Figure 24 shows the second sectional view of the modularization material antenna module according to one embodiment.The sectional view is represented The view that the top of equipment is watched from Figure 23.Herein, antenna block 4208 has another part 4214, and the part 4214 has There is the shape interlocked with the corresponding part 4216 of framework 4202.This part 4214 is the jut on the side of antenna block 4208, And part 4216 is the groove part 4216 on the side of framework 4202.By replacing projection between antenna block 4208 and framework 4202 Part and groove part, antenna block 4208 can be more firmly secured on framework 4202.It should be noted that there is any specific number Purpose these corresponding parts for being used to interlocking antenna block 4208 and framework 4202 are not required.With one group of interlocking portions so as to It is sufficient that antenna block 4208 is fixed to framework 4202.However, it is possible to provide additional interlocking portions, to give two components Coupling provide additional strength.Support 4218 is additionally illustrated in this drawing, and the support 4218 is connected to housing 4200, and And allow by screw hole 4222 screw in support 218 part and housing 4200 between be electrically connected.Support 4218 can be welded It is connected to housing 4200.Support 4218 can be constructed from a material that be electrically conducting.
Figure 25 shows the extended view of the top perspective view of the modularization material antenna module according to one embodiment.This Place, antenna flexible cable 4222 has been mechanically secured to the top of antenna block 4208.As shown in figure 24, it is possible to use enter support Antenna flexible cable 4222 is fixed to antenna block 4208 by 4218 screw 4224.It should be noted that support 4218 is needed not to be and shell The component that body 4200 is separate, in fact, in one embodiment, support 4218 and housing 4200 is integrally formed.Antenna flexible cable Line 4222 also may be electrically connected to the circuit board (not shown) of consumer products, and electrical component on circuit board can be attached ground electricity Housing 200 is connected to, so that each component is grounded.
In addition, antenna block 4208 can be grounding to housing 4200.In one example, it is possible to use power spring (is claimed It is ground spring) perform the task.The spring itself can have the corresponding part interlocking with antenna block 4208 and housing 4200 Shape, to fix the ground spring.This spring is designed to elastic deformation, and this can reduce and collide with or other damages are right The influence of consumer products.Even if the elastic deformation of spring can be allowed during drop event or other this impacts, spring It is maintained between antenna block 4208 and housing 4200.
Although antenna block 4208 is shown as with given shape in Figure 22-25, antenna block typically need not be with any special Setting shape is formed.In fact, the shape of antenna block can be changed based on some different factors, the factor includes adjacent structure Design and shape, the easiness of construction, the easiness installed and antenna block will be fixed to firmness on framework. Framework and antenna block mode interlocked with one another can also influence antenna performance, and think with the material with differing dielectric constant It is made the antenna performance that interlocking portions further improve the above.In other words, the interlocking aspect of differing dielectric constant material is improved More than antenna performance, and may go out beyond when differing dielectric constant material is connected in the case of no interlocking portions Existing performance.
In addition, the shape of antenna block can change the radio reception characteristics of equipment.Some shapes and/or size may be generally Increase reduces wireless receiving.In addition, some shapes and sizes can increase wireless receiving when in some manner using equipment, And reduce wireless receiving when otherwise using equipment.For example, position of the hand of user when equipment is hold can change The radio reception characteristics of change equipment.Can be by between the housing parts at the position that antenna block and user generally hold equipment Bigger space is provided, or it is this to be reduced or eliminated by placing nonconducting physical buffer material (such as rubber buffer) Influence.So, antenna block is designed to balance all above-mentioned factors with efficient way as big as possible.
Antenna block, framework and housing can be used any suitable handling process to be manufactured by the material being arbitrarily adapted to.This can To include, for example, metal, synthetic material, plastics etc..These components can be manufactured using any suitable method, such as, Shaping, forging, extruding, machining, molding, punching press and any other suitable manufacture handling process or its combination.
Antenna block can be configured as being operated on any one or more suitable frequency bands, any existing or new to cover Service interested.If desired, multiple antenna blocks can be provided to cover more multiband, or one or more can be given Antenna provides wide-bandwidth resonating element, to cover multiple communication bands interested.Unless clearly abandon, it is any in the application Content shall not be interpreted for required embodiment to be confined to individual antenna block.
Figure 26 depicts a kind of interchangeable interlocking shape according to one embodiment.The figure shows antenna block and framework Interlocking shape region feature, and not shown antenna block and framework further feature (and it is not shown may be in these yuan Other interlocking shapes on part at other positions).Herein, antenna block 4600 includes circular groove part 4602, itself and framework 4606 circular jut 4604 is interlocked.Compared with substantially rectangular shape, there is round-shaped interlocking by manufacture Part, assembling becomes more easy, and this is because these shapes can more quickly slide together than many rectangular shapes.So And, this must balance each other with the following fact：That is, it is round-shaped that big as substantially rectangular in cross section shape resisting may not be provided Separation property.
Figure 27 depicts a kind of interchangeable interlocking shape according to another embodiment.The figure shows antenna block and frame The feature in the interlocking shape region of frame, and not shown antenna block and framework further feature (and it is not shown may be at these Other interlocking shapes on element at other positions).Except antenna block 4700 includes the circular groove part with framework 4706 Outside the lobes point 4702 of 4704 interlockings, this embodiment is similar to the embodiment shown in Figure 26.Such as the reality of Figure 26 Example is applied, circular design can accelerate assembling, but for locking antenna block 4700 and framework 4706, it is also possible to less may be used Lean on.
Figure 28 depicts a kind of interchangeable interlocking shape according to one embodiment.The figure shows antenna block and framework Interlocking shape region feature, and not shown antenna block and framework further feature (and it is not shown may be in these yuan Other interlocking shapes on part at other positions).Herein, antenna block 4800 is comprising with rectangle part 4804 and circular portion 4806 groove part 4802.Groove part 4802 is interlocked with the jut 4808 of framework 4810.Jut 4808 is included Rectangle part 4812 and circular portion 4814.This design provides excellent locking ability, there is provided sizable antenna block 4800 and the separating resistance of framework 4810.However, this must balance each other with the following fact：That is, the assembling of this interlocking portions can Can be difficult, or if there is multiple this groove parts 4802 and jut 4808 in equipment, assembling even can not Can.However, in the case that each in antenna block and framework only has single interlocking portions, the present embodiment is probably preferable 's.
Figure 29 depicts a kind of interchangeable interlocking shape according to another embodiment.The figure shows antenna block and frame The feature in the interlocking shape region of frame, and not shown antenna block and framework further feature (and it is not shown may be at these Other interlocking shapes on element at other positions).Except antenna block 4900 is comprising with rectangle part 4904 and circular portion Outside 4906 jut 4902, this embodiment is similar to the embodiment shown in Figure 28.Jut 4902 and framework 4910 groove part 4908 is interlocked.Groove part 4908 includes rectangle part 4912 and circular portion 4914.As in Figure 28 Embodiment, in antenna block and framework each only have single interlocking portions in the case of, this embodiment is probably Preferably.
Figure 30 is a flow chart, which depict the side for assembly portable formula electronic equipment according to one embodiment Method.5000, there is provided conductive shell.This housing can be made up of such as stainless steel.5002, support is welded to housing.This Planting support can also be made of an electrically conducting material.5004, non-conductive framework is bonded or is otherwise affixed to conductive shell Inside, to form overall structure.Non-conductive framework is made up of the frame material with the first dielectric constant.5006, by mutual The part with first shape of lock antenna and the part with the second shape corresponding to first shape of framework, by antenna block It is fixed on framework.Antenna block is made up of the antenna block of material with the second dielectric constant, and the second dielectric constant is than the first dielectric Constant is much smaller.5008, antenna flexible cable is mechanically secured to antenna block.Antenna flexible cable also may be electrically connected to electricity Road plate.
Figure 31 is the block diagram of portable consumer devices according to an embodiment of the invention.Portable consumer device 5100 can utilize the modularization material antenna module according to above-mentioned any embodiment.Portable consumer device 5100 includes treatment Device 5102, processor 5102 belongs to the microprocessor or controller of the integrated operation for controlling portable consumer device 5100. The media data that portable consumer device 5100 will belong to media item is stored in file system 5104 and cache 5106. File system 5104 is typically storage dish or multiple disks.File system 5104 is usually portable consumer device 5100 and provides Gao Rong Amount storage capacity.File system 5104 not only can with storage media data, and can store non-media data (for example, when with When disk pattern is operated).However, because the access time to file system 5104 is relatively slow, portable consumer device 5100 may be used also With including cache 5106.Cache 5106 is the random access memory (RAM) for for example being provided with semiconductor memory. Access time to the relative access time comparison file system 5104 of cache 5106 is short a lot.However, cache 5106 large storage capacities without file system 5104.In addition, file system 5104, when activated, compares cache The 5106 more power of consumption.When portable consumer device 5100 is the portable consumer device powered with battery (not shown), Power consumption is typically a problem for concern.
In one embodiment, portable consumer device 5100 is used in the memory storage of file system 5104 multiple media item (for example, song).When user wishes to make portable consumer device play particular media item, display can on display 5108 The list of the media item of acquisition.Then, using the Trackpad being built in display 5108, user can select obtainable One of media item.Processor 5102 upon receiving a selection of a particular media item, by certain media items purpose matchmaker Volume data (for example, audio file) is supplied to codec (CODEC) 5110.CODEC5110 is then for loudspeaker 5112 is produced Analog output signal.Loudspeaker 5112 can be the loudspeaker inside portable consumer device 5100, or can be portable Loudspeaker outside consumer device 5100.For example, the headphone or earplug that are connected to portable consumer device 5100 can quilts It is considered external loudspeaker.Loudspeaker 5112 cannot be only used for exporting the audio sound for belonging to the media item played, and And sound effect and cellular calls audio can be exported.Sound effect can be stored in portable consumer device as voice data On 5100, such as it is stored in file system 5104, cache 5106, ROM 5114 or RAM 5116.Use can be responded Family is input into or system request, exports sound effect.When specific sound effect it is to be output to loudspeaker 5112 when, processor 5102 retrieves correlation The sound effect voice data of connection, and CODEC 5110 is provided it to, then be supplied to for audio signal and raise one's voice by CODEC 5110 Device 5112.In the case where the voice data of media item is also output, processor 5100 can process media item and sound The voice data of effect.In this case, the voice data of sound effect can mix with the voice data of media item.Mixed sound Frequency provides voice data and (belongs to media item according to CODEC 5110, CODEC 5110 is then provided to loudspeaker 5112 Both mesh and sound effect).
Portable consumer device 5100 also includes being coupled to the network/bus interface 5118 of data link 5120.Data-Link Road 5120 allows portable consumer device 5100 to be couple to master computer.Data can be provided in wired connection or wireless connection Link 5120.In the case of a wireless connection, network/bus interface 5118 can include wireless transceiver.
The PCB of formation
The factor of consideration is first had in the encapsulation with display and the portable computing device for expecting thin profile is The arrangement of larger part (such as, display, display circuit and battery) in housing.In addition it is also necessary to consider for fixing these The support of larger part of appliance and/or the arrangement of attachment structure.The positioning of larger part of appliance and its support structures is also contemplated that Needs are various input/output means (such as, volume switch, power knob, data and the power supply company around housing outer rim arrangement Connect device and audio jack etc.) enough spaces are provided.In the remaining space not occupied by larger part, then can arrange in other Portion's part (such as, but not limited to processor and memory, loudspeaker, microphone, camera and its associated circuit board) and permission institute There are all kinds of connectors that part of appliance can be controlled and operated with its desired function.
The remaining space not occupied by larger part can be in shell with irregular shape, different positions and height water Divide cloth equally.The part of specialized shapes can be designed to fit in these spaces.Then, each part can in some way each other Connection.For example, in order to allow portable set to provide its desired function, many parts can be with controller board (such as, main logic Plate) communication, to receive operational order.As a further example, many parts need electric power, and this then can be by internal cell via various power supplys Connect to provide.Typically, the space between each part can be used for route data and/or power supply connection.Then, it is necessary to set Space needed for considering power supply and data cube computation in standby encapsulation design.
The a solution for each electric part that connection is distributed in housing is that (flexible connector leads to using flexible connector It is commonly referred to as " flexible cable " connector).One shortcoming of flexible cable connector is the increase of manufacturing step.Whenever one Internal part is connected to another internal part by flexible cable connector, is increased by two manufacturing steps.Can be by inciting somebody to action Flexible cable is connected to one of part and one in saving above-mentioned steps in an assembling process during its manufacture.However, During assembling, it is typical that at least one end of flexible cable connector needs to be connected to the internal part of association.
The further drawback of flexible cable connector is that flexible cable is connected to the tie point of part and is easy in equipment operation Period failure.For example, flexible cable tie point is easier to because vibrations are (such as, when equipment is fallen compared to other kinds of connection When) break down.Additionally, during assembly, it is too early that inappropriate formation of flexible cable tie point may result in equipment Or unexpected failure.Then, the use of flexible cable connector can be introduced wherein can occur reduction equipment global reliability Foozle additional examples.
As described in this article, in order to save flexible cable connector and be adapted to the thin compact that packaging environment is associated Portable electric appts, it is possible to use the flexible and PCB that is formed continuously.For example, single continuous P CB can include two compared with Most of (such as two rectangle parts), it is connected by the PCB parts than two rectangle part much thinners.Two of PCB are larger Part can be formed as two separate PCB and is then being coupled by flexible cable connector.Instead, can be formed by The connector part of PCB replaces the continuous P CB plates of flexible cable connector.It is light that the relative thinning of connector part can allow for its It is flexible.
The major part of PCB can have special shape (for example, non-rectangle) and size, can be fitted to enclosure interior In space.The length and shape of the connector part of PCB can be based between the major part of PCB placement space therein The inner track of presence determines.In one embodiment, the connector part of PCB can be in each location bending, to be adapted to To in available inner track between the major part of PCB.In other embodiments, the major part of PCB can also bend, with Can be fitted in available inner space.
The positioning of the profile of portable computing device, the part for needing connection and each part can all influence described here Free space and may reside within circuit on flexible PCB that flexible PCB can be shaped in the housing of adaptation.In It is that the perspective view and portable computing device of the portable computing device with example profiles are described with reference to Figure 32 A and 32B Each part block diagram.In one embodiment, flexible PCB is formed by main logic board.Then, with reference to Figure 33 A, 33B and 33C Describe to include the flexible main logic board of exemplary panels arrangement in the housing of portable computing device.Flexible PCB its He is configured and arrangement is then discussed with reference to Figure 34 A, 34B and 34C.With reference to Figure 35 A-36E, exemplified with the various configurations of flexible PCB. The hardness property of flexible PCB can be adjusted by manipulating the formation of one or more trace layers in PCB.The shape of these layers Into then refer to the attached drawing 37A-37B is described with manipulation.Portable computing device of the manufacture using flexible PCB is described with reference to Figure 38 Method.Finally, with reference to the block diagram of Figure 39 portable computing devices of the description with media play function.
Figure 32 A show the portable computing device 610 with relative thin profile of the embodiment according to described by Perspective view.Portable computing device 610 can include the housing 6100 with opening 6108.By framework around display 6104 Can be positioned in the opening 6108.The display circuit of display 6104 then can be positioned in housing 6100, such as located immediately at Under display 6104.As described above, the positioning of display circuit can influence available inner space in housing 6100.
Touch-screen can be associated with the display 6104.Circuit (the such as touch-screen control being associated with the touch-screen Device) may be located in housing 6100.Display 6104 can be sealed via lid glass 6106.Load button 6114 can be positioned In the opening of lid glass 6106.The observation circuit being associated with load button 6114 then can be located in housing 6100.One In individual embodiment, load button can be used for for equipment 610 returning to particular state, such as main interface state.
Multiple input/output means can be positioned around shell rim.For example, data/power connector 6118 and audio Jack 6116 may be located at the root edge of housing 6100, and power switch 6110 then can be located at the apical margin of housing 6100.Housing 6100 The opening for loudspeaker and/or microphone can also be included.Supporting the circuit of these parts can be encapsulated in housing 6100 Portion.These circuits can be embodied in the various circuit boards being placed in housing, flexible PCB such as described herein.
The block diagram of equipment 610 shows in Figure 32 B.Above-mentioned part is typically by the treatment in main logic board (MLB) 6105 Device is controlled.Thus it is possible to provide various internal connections to realize movement of the data between MLB 6105 and each part.Internal number How can be encapsulated depending on each part according to the route of connection, including MLB 6105 be positioned in position in housing 6100 with And the position of the available inner track after each internal unit positioning parts.
On data cube computation, MLB 6105 can be connected to the display controller 6120 coupled with display 6104.This Outward, MLB 6105 can also be coupled to acoustic component, such as loudspeaker, audio jack 6116, microphone or be compiled including audio The associated audio of decoder supports circuit.Additionally, MLB 6105 can also be coupled to various input equipments, such as touch-screen 6122nd, volume switch circuit, load button circuit and power switch circuit.Additionally, MLB 6105 can also be coupled to various numbers According to interface, to allow it to receive and send external data, the interface such as can be to include the radio interface 6126 of antenna And data/power connector 6118.
In addition to data cube computation, many internal unit parts may also receive from internal electric source (such as battery 6130) Electric power.For example, battery 6130 can be coupled to MLB 6105, display 6104, display controller 6120, touch-screen 6122 And data/power connector 6118.Similar with data cube computation, the route of power supply connection also can be depending on each in housing 6100 Internal unit part (such as battery 6130) and the positioning of inner track can be used.
Each embodiment of flexible PCB is described with reference to the following drawings.In one embodiment, flexible PCB can be wrapped Include with the part for being shaped as the various sizes for fitting in the inside free space for spreading all over housing.The large-size part of PCB Can be coupled by slim connector part, it is between major part that the slim connector part is then shaped to adaptation Within available inner track.Major part and connector part can be formed as continuous P CB.In a particular embodiment, Main logic board can be formed by the flexible PCB illustrated in drawings described below.
Accompanying drawing 33A, 33B and 33C show perspective view and the side of the flexible MLB 6105 of the embodiment according to described by View.In Figure 33 A, the sectional view of housing 6100 is shown.The section of housing 6100 includes length 6150 and width 6151.Take Certainly in the inner surface profile of housing 6100, length 6150 and width 6151 can be varied from for different sections.
Battery 6130 can be positioned in the centering portions of housing.In one embodiment, battery 6130 can have and make Inner space against cell top end it is available, inner space is available against battery bottom and inner space is available along battery side Positioning and size.It is empty against the inside of cell top end that MLB 6105 may be shaped such that Part I 6105a can be fitted in It is interior, and Part II 6105b can be fitted in the inner space of battery bottom.Connector part 6105c can be by Part I 6105a and Part II 6105b are linked.Connector part 6105c is than Part I 6105a and Part II 6105b is thinner longer.Connector part 6105c is shown as being connected up along the internal path of the side of battery 6130.
Part I 6105a, the shape of Part II 6105b and connector part 6105c and position are merely for example mesh Offer, not for limitation.In embodiments, the Part I 6105a and Part II 6105b of MLB 6105 can compare Shown in figure with greater or lesser size.Additionally, Part I 6105a can have it is different from Part II 6105b Shape and size.Similarly, the shape of each section of such as 6105a and 6105b can be non-rectangle, and need When can include curved surface.Additionally, the such as PCB of MLB 6105 can include two or more major parts.For example, all Flexible PCB such as MLB 6105 can include three major parts being linked by two connector parts.
In embodiments, connector part 6105c can be attached to major part 6105a and 6105b in diverse location. For example, connector part 6105c can be attached near the center of part 6105a and part 6105b, to form " I " shape.Herein In example, if there is having internal path available or if the shell of battery 6130 can include being used as in its top surface or basal surface The groove of the path of connector 6105c, then connector 6105c can be routed on the top of battery 6130 or bottom.
It is straight line that connector 6105c is not necessarily formed.For example, connector 6105c can be formed with follow crooked route or with With the multiple straight-line segments (for example, step or Z-shaped path) each other in different angles.In another example, connector 6105c can be with Including one or more branches.Branch can be connected to other circuits, such as additional PCB.As follows will be with reference to Figure 33 C and 35B- What 36E was further described, connector 6105c formation after, connector 6105c can be bent or be reversed into it is various configuration with Follow specific internal path.For example, will be further described with reference to Figure 33 C as follows, connector 6105c can be curved to through Different height in equipment.
Figure 33 B show the section with constant width value vertical with the section of Figure 33 A.MLB6105 can be positioned at At height 6152 under the top of battery 6130.The Part I 6105a and Part II 6105b of MLB can have and can be fitted It is fitted on the size in the free space between the bottom side of the top side of battery 6130 and battery 6130.Connector part 6105c can be with Through connection battery bottom side and top side side, as shown in phantom in FIG..
In one embodiment, as shown in figure 33b, MLB 6105 can be in a planar configuration with a relative constancy Across the PCB installation of height, i.e. 6105a, 6105b are installed with 6105c with similar height.In other embodiments, MLB can be non-flat Installed in the configuration of face.For example, in Figure 33 C, Part I 6105a may be mounted to that height on the top of battery 6130 simultaneously It is concordant with display 6104, and Part II 6105b is then arranged at the height under the top of battery.Connector part 6105c is then through the difference in height Part I 6105a and Part II 6105b.
In Figure 33 A-33C, the embodiment of the flexible PCB for being configured as MLB 6105 is shown.For the mesh for illustrating , the basal surface that the larger top surface area of MLB 6105 is shown as being roughly parallel to apparatus casing is installed.In other implementations In example, flexible PCB may be mounted so that larger top surface area is approximately perpendicular to the bottom of apparatus casing (referring to accompanying drawing 34A).In some other embodiments, the Part I of flexible PCB can be installed to be makes it parallel with the basal surface of housing, and Part II can be installed to be makes it vertical with the bottom of housing.For example, in Figure 33 A, part 6105a can be installed to be substantially Bottom with housing is parallel, and connector 6105c can be bent to a right angle with so that connector 6105c can be installed to be substantially Basal surface with housing is vertical.Vertical orientation can be described merely for the purpose for illustrating.The flexible PCB's of such as MLB 6105 The setting angle of each part can change, and be not limited to relative to each other or relative to the perpendicular orientation of each dimension of housing Install.
Figure 34 A show the bendable in the configuration substantially vertical with the bottom of housing 6100 of the larger surface region of PCB The perspective view of bent PCB 6160.In non-bending position, the substantially shape of rectangular ribbon of PCB 6160, this is in order at illustration purpose and shows , and other shapes can be utilized.The top view and bottom view of the PCB 6160 under non-bending position are in accompanying drawing 34B and 34C In show.In Figure 34 A, PCB 6160 bends to fit in the space between part of appliance 6165 and housing 6100 around corner It is interior.Part of appliance 6165 can be 1) inherent structure, such as fixing the part of the framework of other internal parts；2) install A part for part of appliance (such as battery) in housing；Or 3) combinations of the above.
During assembling, PCB 6160 is provided as flat band, and can then be bent and/or be torqued into expectation Space in, such as around the space between part of appliance 6165 and housing 6100 of corner.In one embodiment, PCB 6160 material can be configured as making it not keep its curved shape.Then, PCB 6160 may need to be fixed, so that it is protected Hold in bending position as shown in fig. 34 a.
For example, in order to PCB is fixed on into curved shape, PCB 6160 can be attached to sidepiece or the bottom of housing 6100 And/or the side of part of appliance 6165.As a further example, if the space for placing PCB 6160 is sufficiently narrow (such as, in part of appliance Space between 6165 and housing 6100), then PCB 6160 is bent and is being then slid into desired space during assembly. The bending moment (if do not constrained, the PCB 6160 will be straightened) accumulated in PCB 6160 can force PCB 6160 Resist the side in space, and thus, it is possible to help to be fixed in the space that it has been placed.
In another embodiment, PCB 6160 can during assembly be provided as flat band.However, PCB 6160 can It is configured as keeping it or partly keeping the shape after bending.PCB 6160 can be configured as making it (all in specific region Such as, it is designed to the region of bending) interior easily bending, and in other regions (such as, being designed to flat region) It is then harder.The following PCB that refer to the attached drawing 37A and 37B formation described in more detail are carried into variable durometer attribute is (such as 6160) details.
In yet another embodiment, PCB 6160 can be formed with its curved shape before assembly.For example, PCB 6160 can It is molded into curved shape.In another example, PCB 6160 can be formed as even shape, but then in portable computing device Assembling before be manufactured into curved shape.Thus it is possible to the PCB 6160 for providing curved shape is used for assembling process.
In embodiments, PCB 6160 can include being only attached to the top sides of PCB 6160, being only attached to the bottoms of PCB 6160 Side is attached to the part of both the top sides of PCB 6160 and bottom side.The part of attachment can be on each surface of PCB 6160 Extend.Can according to PCB 6160 be in its installation site when housing in free space come alternative pack position.Additionally, can With based on expect bending is positioned on PCB position come alternative pack position.In certain embodiments, it is desirable to some parts are attached It is connected in away from the region for being intended to be enough to bend, because bending can damage the attachment of part or part and PCB 6160.
Figure 34 B and 34C show the top view and bottom view of PCB 6160.In Figure 34 B, on the top of PCB 6160 Part 6162a and 6162b are disposed with close to the end of PCB 6160.In one embodiment, part can be arranged to away from by The bending axis 6165 of the bending direction that arrow 6164 is indicated, because significantly bending may damage the portion for being attached to PCB 6160 Part.
The head room being associated with each part (such as part 6162a to 6162b) for being attached to PCB 6160 can be with Change by part.For example, part 6162b is farther compared to what part 6162a can extend from circuit board top.Each part Height influence required headroom or amount of space when PCB 6160 is installed.The height of each part can influence each part in PCB Positioning on 6160.For example, when PCB 6160 is located at its installation site, part 6162b is located at and causes PCB 6160 away from setting At the position of standby part 6165.Positioning of the part 6162b on PCB 6160 can be selected as making it be located at far when mounted In the region of part of appliance 6165, because available space is greater than part of appliance 6165 and housing in the region Space between 6100.
As described above, PCB 6160 can be included in the part of its top surface and basal surface.On top and bottom Component layouts and quantity can be with different from each other.For example, in Figure 34 B, on the top surface of PCB 6160, being very open each other Be attached with two parts.And in Figure 34 C, three size parts different from each other are shown as compared to shown in Figure 34 B What part was relatively near to each other is attached at the basal surface of PCB 6160.
Figure 35 A-36E show the top view and side view of the flexible PCB 6170 of various bending configurations.As described above, Such as 6170 flexible PCB can be formed by bending configuration.For example, each configuration with reference to shown in Figure 35 A-36E can be Formed in the bending configuration for respectively illustrating.In an alternate embodiment, PCB 6170 can be formed in un-flexed configuration, and can With before assembly or period bends to another configuration.For example, PCB 6170 can be matched somebody with somebody by any shown in Figure 35 B and 35C Put to be formed, and then bending to the configuration shown in Figure 35 A.As a further example, PCB 6170 can be formed simultaneously by the configuration of Figure 35 A Then bent to realize the configuration shown in Figure 35 B and 35C respectively around axle 6165 according to direction 6164.
Such as 6170 PCB can be configured as returning to its original shape after bending, or can be configured as in bending Maintained after generation or part maintains specific bending configuration.In specific location, such as 6170 PCB can be by multiple axles Bending.Similarly, PCB can bend and reverse in specific location.In Figure 36 D and 36E, part 6170a and 6170c are with phase At an angle each other and in different height configuration is installed, installation configuration introduces the part 6170b's of PCB 6170 Bending and torsion.
In other embodiments, such as 6170 PCB can be in multiple location bendings.For example, in Figure 35 A, each portion Point 6170a, 6170b and 6170c can be under specific direction specific bending shaft specifically measure (for example, each part can be with The angle of the specified quantitative on bending shaft specific direction).As a further example, in Figure 35 A, part 6170a, 6170b and/or 6170c can bend at multiple positions respectively.For example, part 6170b can bend at least two various locations.In It is, including the component of the installation of specific PCB 6170 can include multiple different bending ranks.
Flexible PCB 6170 can be formed and/or bend to fit in the space of certain objects.For example, in figure In 36A, the side view of the internal unit part 6176a around PCB 6170 is shown.PCB 6170 can be curved to substantially suitable Answer the side week of part 6176a.The side week of part 6176a includes straight line portion, stepped line part or curved portion.Such as Figure 35 B and Shown in 35C, PCB 6170 can be bent to fit in around curvilinear surface, such as include curvilinear sides week in part of appliance 6176a In the case of.
In Figure 36 B, the side view of part of appliance 6176b is shown.PCB 6170 can be bent with around part 6176b Top surface and basal surface adaptation.Part 6176b can have irregular shape.For example, part 6176b includes that two lack Mouthful.The position that onboard part 6178a and 6178b is placed on the top surfaces of PCB 6170 so that when PCB 6170 is around part When 6176b bends, onboard part is extended in the space that the breach in the side profile by part 6176b is provided.
In Figure 36 C, the side view of part of appliance 6176c and the side view of part of appliance 6180 are shown.In an implementation In example, part of appliance 6180 can be the structural element of such as inner frame.PCB 6170 can be around part of appliance 6176c and part of appliance 6180 bend.Part 6178a may be located on the top surface of PCB 6170, and part 6178b then can position In on the basal surface of PCB 6170.Part 6178a and 6178b can be decided to be to be fitted to around part of appliance 6176c and 6180 , by its created space of orientation.
PCB 6170 is shown as bending, with cause PCB 6170 basal surface and part of appliance 6176c side substantially It is parallel.In one embodiment, the basal surface of PCB 6170 can include connector.Connector can be placed on PCB 6170, So that when PCB 6170 bends under its installation configuration, the connector is relative with the connector on the side of equipment 6176c Together, allowing two connectors to be linked.The two connectors can be coupled in a variety of ways.For example, two connectors can be configured For snapping or weld together.
As previously described, there is provided flexible PCB.It may be desirable to configuration PCB is so that its curved shape after bending can It is kept.In general, it may be desirable that change the hardness property being associated with flexible PCB.Refer to the attached drawing 37A-37B, description May be used to form method and the PCB configuration of the PCB with different hardness attribute.Figure 37 A show the side of multi-layer PCB 6200 Sectional view.The number of plies of offer can be utilized than showing more or less layer merely for illustration purpose.
PCB 6200 can be by multiple trace layers, such as 6202a, 6202b and 6202c, and multiple basalises, such as 6206a, 6206b and 6206c.Trace layer may be used to form with each PCB parts (such as 6204a and 6204b) and in each PCB portions Data/power connector between part.PCB parts 6204a and 6204b are shown on the top surface of PCB 6200, but It is that in other embodiments, these parts may be alternatively located on the basal surface of PCB 6200.
Trace layer can be formed typically by the conductive material of such as copper.Trace layer can be formed solid layer, such as paper tinsel Layer, and can then etch or grind away the part of this layer to form the trace of connecting components.
Depending on the insulation requirements of particular electrical circuit on pcb board, basalis can be formed by different materials.The base that can be used Several examples of bottom material include (Teflon), FR-4, FR-1, CEM-1 or CEM-3.Different layers is presoaked with epoxy resin It is laminated to together.Several examples of utilizable preimpregnation material include but is not limited to FR-2 (phenolic aldehyde cotton paper), FR-3 (cotton paper and Epoxy resin), FR-4 (glass cloth and epoxy resin), FR-5 (glass cloth and epoxy resin), FR-6 (frosted glass and asphalt mixtures modified by epoxy resin Fat), G-10 (glass cloth and epoxy resin), CEM-1 (cotton paper and epoxy resin), CEM-2 (cotton paper and epoxy resin), CEM-3 (glass cloth and epoxy resin), CEM-4 (glass cloth and epoxy resin) and CEM-5 (glass cloth and polyester).
Substrate and trace layer are adjusted to impact its hardness and flexibility.For example, trace layer or basalis can be formed into It is thicker or thinner, so that it is harder or more flexible to obtain multi-layer PCB.Furthermore, it is possible to be directed to its compared to other materials hardness come The material of selection substrate or trace layer.
In one embodiment, the metal level for being selected for its hardness property rather than its conductive property can be used to replace trace Layer.Metal level can be solid enough, and during so that proper such as 6200 multi-layer PCB bending, the PCB maintains its curved shape. One or more such layers can be used in multi-layer PCB.In certain embodiments, these " hardening " layers can not include mark Line.
In a specific embodiment, hardened layer can be combined with the marmem of such as Nitinol.Shape memory Alloy can be formed desired curved shape, and then be flattened into and on such as 6200 PCB.It is the shape The shape of memory alloy layer selection can be the expectation curved shape of the PCB for such as 6200.Onboard part can be in PCB 6200 are in attachment in the case of its flat position.Then, can cause that marmem returns to the shape that its memory keeps. For example, the marmem can be heated.When marmem returns to the position of its memory, whole PCB can be bent To the configuration.
Figure 37 B show the top view of two trace layers (such as 6202a, 6202b or 6202c) of the multi-layer PCB of Figure 37 A Figure.First trace layer includes four traces 6212a, 6212b, 6212c and 6216.These traces may be located at substrate 6218 it On.PCB 6200 is configured as being bent around axle 6165 according to direction 6165.In this region, trace 6212a, 6212b and 6212c Can be thickened to resist the caused infringement of bending.Trace 6216 has been thick, therefore its size is not curved near axle 6165 Increase in bent region.
Typically, it is not used in and forms the excess stock of trace and removed from trace layer.In one embodiment, excess stock Can be left to harden the PCB in specific region.For example, such as 6208 and 6210 excess stock can be left with these PCB is hardened in region.In one embodiment, the excess stock near bending axis 6165 is removed.Excess stock can be removed with Hardness reductions of the PCB in the region is allowed simultaneously therefore to be easier to bend.
Another trace layer shown in Figure 37 B does not include trace, but only has material 6220.Can be merely for its intensity Characteristic (such as its hardness property) selects the material.The additional material part of bending axis can be removed to allow PCB in this area More easily bent in domain.In another embodiment, extra material can be increased in the region, rather than removal.Can be with Increase extra material to allow trace layer and thus allow PCB keeping its shape after the bending of axle 6165.
Figure 38 is the flow chart of the method 6300 that portable computing device is manufactured using multi-layer PCB.6302, plate shape is determined Shape.Plate can have various sizes of part, and this depends on being intended to the space and these parts of each part of adaptation in it Whether it is to be bent and bending how much.As it was previously stated, plate can be by flat formation, or can be by having included matching somebody with somebody for bending section Put to be formed.
6304, can on the top surface of plate and/or basal surface alternative pack position.Component locations can be based at it Free space around configuration lower plate is installed.6306, it may be determined that trace locations and the trace locations for plate.Trace locations Can be made thicker in the position for wishing more plate bengings.
6308, can be with the hardness property of option board.Then, the trace material in trace layer can be stayed in some regions Remove down and in some regions, thus the hardness or flexible characteristic of adjustment plate.Additionally, one or more layers can be exclusively used in adjusting The hardness property of whole plate.For example, can be used for allowing plate to keep shape after its bending for the metal level of its length selection.
6310, flexible PCB can be formed according to the rule being determined as above.It can be formed by even shape, or Can be formed by case of bending.Each part can be attached to PCB.6312, it is possible to use the PCB assembly portables formula of formation is calculated Equipment.Assembling process can be related to be assembled in configuration is bent the PCB of formation.The PCB of formation can in an assembling process by one It is secondary or more to bend secondaryly.
In a particular embodiment, it is possible to use computer-aided manufacturing and assembling process are set assembling the portable computing It is standby.Computer-aided manufacturing and assembling process can be related to the use of multiple equipment, and what is such as constructed in assembly line configuration is more Individual equipment.For example, 6310, in the first area of computer aided assembling process, multiple equipment can be programmed with basis in 6302- 6308 rules for determining form flexible PCB.The first area of computer aided assembling process can be related to the different equipment of programming The particular trace pattern that given shape and arrangement can change by basalis on PCB is formed and/or cuts into by plate substrate.Its His computer-aided manufacturing process can be related to the equipment that can be programmed to assembly portable formula computing device, such as mounter People.Mounter people can be programmed to the mobile PC B during the assembling of portable computing device and be matched somebody with somebody by one or more bendings Put.
Figure 39 is the block diagram of the media player 6400 of the embodiment according to described by.Media player 6400 includes treatment Device 6402, its microprocessor or controller for belonging to all operationss for controlling media player 6400.Media player 6400 store the media data on media item in file system 6404 and cache (cache) 6406.Typically, file System 6404 is storage disk or multiple disks.Typically, file system is that media player 6400 provides massive store ability. But, because the access time to file system 6404 is relatively slow, media player 6400 also includes cache 6406.It is high Speed caching 6406 is, for example, the random access storage device (RAM) provided by semiconductor memory.To the relative of cache 6406 Access time is significantly shorter than the access time to file system 6404.But cache 6406 does not have file system 6404 Large storage capacity.
Further, in activity, file system 6404 consumes more electric power than cache 6406.When media are broadcast When to put device 6400 be the portable electronic device powered by battery (not shown), power consumption is even more important.
Media player 6400 is also including user input equipment 6408, its user for allowing media player 6400 and media Player 6400 is interacted.For example, user input equipment 6408 can take many forms, button, keypad, rotating disk etc.. In addition, media player 6400 include display 6410 (screen display), display can from processor 6402 control with to User's display information.Data/address bus 6411 can aid at least in file system 6404, cache 6406, processor 6402 And the data transfer between codec (CODEC) 6412.
In one embodiment, media player 6400 is used to store multiple media items in file system 6404 (for example Song).When user wants media renderer plays certain media items, the list of available media items can be displayed in display 6410 On.Then, using user input equipment 6408, user can select one of available media items.Receiving to certain media items Selection after, the media data (for example, audio file) of certain media items is supplied to encoder/decoder by processor 6402 (CODEC, codec) 6412.Then codec 6412 produces the analog output signal for loudspeaker 6414.Loudspeaker 6414 can be the loudspeaker outside the inside of media player 6400 or media player 6400.For example, being connected to media play The headphone or earphone of device 6400 are considered as external loudspeaker.
Use the ending connecting audio of the connector in small form factor electronic equipment
Some aspects of described embodiment are related to a kind of small form factor electronic product.In the remaining portion that this is discussed Point, the small form factor electronic equipment is described according to personal media device.Personal media device can include suitable Close the housing for surrounding and supporting various functional units.Housing can support various input/output means, such as volume switch, electricity Source button, data and power connector, audio jack etc..Housing can also be included for accommodating opening for input/output means Mouthful.Availability of the interface under the conditions of equipment scheduled operation can be strengthened by the position where selecting input/output means.Example Such as, for the equipment of one-handed performance to be used, the input mechanism of such as audio control switch etc may be located at one will set For the position for being easy to finger manipulation when being held in palm.Other output mechanisms of such as audio jack etc may be located at not disturb to be held The firmly position of equipment, the top edge of such as equipment.
Being connected to personal media device and the permission equipment operation can be sealed with implementing the part of appliance of its predetermined function It is cased.Then can be internal unit part as long as there is sufficient space to can be used for required connector between the components Position certain flexibility is provided.Furthermore, it is possible to printed circuit board (PCB) (PCB) or battery by using custom-shaped etc Method allows that effective utilization of inner space can be used.Personal media device can include the sound for being adapted to produce sub-audible sound Frequency circuit.The sub-audible sound can by receiving and modulated using audio signal enclosure air capacity acoustic equipment wound Build.In one embodiment, sub-audible sound can be generated by the sub-audible sound maker for being enclosed in enclosure interior.The sub-audible sound Can be in the form of the music provided by decoding the music file of personal media device holding.The sub-audible sound can be with Actively transmitted by the more than one opening in the housing of personal media device.Sub-audible sound maker can be using at least The form of the acoustic speaker with vibrating diaphragm, the acoustic speaker is enclosed to inside the also referred to as acoustic hood of audio amplifier. In one implementation method, opening can include at least one of shell for guiding the sub-audible sound generated by acoustic speaker The first opening in body.Second opening can be used at least remainder of the sub-audible sound that guiding is generated by acoustic speaker. Second opening can be associated with connector assembly, and be referred to as connector port.
Connector assembly for accommodating connector port can be diversified.For example, connector assembly can be adopted With the form (such as 30 pin-type connectors of standard) of data/power connector.Connector assembly can also be with output equipment phase Association, audio jack pipe (the audio jack being for example consistent with audio post (audio post) with size and shape Barrel audio jack (audio jack)).Audio post can be inserted into audio jack pipe.In this way, the electricity on audio post Contact is engaged with the corresponding contact pad on audio jack pipe internal surface, so as to allow in external circuit (for example, earphone) and individual Electric signal is transmitted between media device.Typically, acoustic speaker is disabled when audio post is inserted into audio jack pipe, thus will Audio jack inserts output of the audio jack pipe without interference with sub-audible sound.
In order to strengthen audio experience, the inside dimension of connector port/loudspeaker assembly can be carried out to be passed for volume The Acoustic Optimization sent.In one embodiment, housing port and connector port can have different sizes.Use one More than one of advantage of port be：General audio experience can be partly attributed to perceive the increase of volume and strengthen.Except Lifting is overall to be perceived outside volume, and the configuration of housing port and connectivity port makes it less likely that and outer cover port and company is completely covered Connect both device ports.Thus, user can hold personal media device, and without worrying to interrupt completely from loudspeaker to external rings The air path in border.Additionally, the presence of second port is reduced to from loudspeaker to the total of the air-flow in extraneous air path Body impedance, so as to obtain more preferable acoustics experience.
These and other embodiment will be discussed with reference to Figure 40-51 as follows.But, those skilled in the art will readily recognize that Arrive, the detailed description be given herein for these accompanying drawings is not construed as limitation merely for illustrative purpose.
Figure 40-41 is each view of the personal media device 7100 for having assembled completely for showing according to embodiments of the present invention Perspective view.Personal media device 7100 can have for one-handed performance and be placed on big in the smaller area of pocket etc It is small, i.e. personal media device 7100 can be hand-held type miniature electronic equipment.For example, personal media device 7100 can be corresponded to In computer, media device, telecommunication apparatus etc..Personal media device 7100 is capable of the matchmaker of processing data, especially audio etc Body.Personal media device 7100 can correspond generally to music player, game machine, video machines, personal digital assistant (PDA) etc..For hand-held, personal media device 7100 can individually be operated by user's hand or hands, i.e. not need table The reference surface in face etc.In some cases, handheld device has the size for being placed in user's pocket.Due to size Very little, user need not directly carry the equipment, and thus can be by the equipment belt anywhere (example when user travels Such as, user will not be limited by carrying the equipment of both bulk).
Personal media device 7100 can be diversified.In certain embodiments, personal media device 7100 can be with Perform simple function (for example, be exclusively used in playing and storage media equipment), and in other cases, personal media device can be with Various functions are performed (for example, broadcasting/storage media, reception/transmission call/text message/internet and/or execution web The equipment for browsing).Personal media device 7100 can wirelessly (in the feelings helped with or without wireless enabled accessory system Under condition) and/or communicated via wired path (such as using traditional electric wire).In certain embodiments, personal media device 7100 can be extremely it is portable (for example, small form factor, it is thin, unobtrusively, it is lightweight).Personal media device 7100 is even Can have for one-handed performance and and place size in the smaller area of pocket etc, i.e. personal media device 7100 It can be hand-held type miniature electronic equipment.Personal media device 7100 can correspond to can from Cupertino, California's The iPod that Apple Inc. buyTMOr iPhoneTMIn any electronic equipment.
Personal media device 7100 can include housing 7102, and the housing is configured at least partly surround and personal matchmaker The associated any an appropriate number of part of body equipment 7100.For example, housing 7102 can be surrounded and the various electronics of internal support Part (including IC chip and other circuits), to provide calculating operation for equipment.IC chip and other Circuit can support circuit etc. including microprocessor, memory, battery, circuit board, I/O, various input/output (I/O).Although It is not shown in this figure, but housing 7102 can define the cavity that each part is placed in it, and housing 7102 can be with thing Support any an appropriate number of mechanism of the inside of housing 7102 or the open interior by the surface of housing 7102 in reason ground.
In addition to the functions discussed above, housing 7102 can also at least in part define the outward appearance of personal media device 7100. That is, the shape and form of housing 7102 can help define the overall shape or form of personal media device 7100, or The profile of person's housing 7102 can embody the physical appearance of personal media device 7100.Any appropriate shape can be used. In some embodiments, the size and shape of housing 7102 can be designed to cosily be held in the hand by user.In some realities Apply in example, the shape includes the side surface of the rear surface of slight bending and height bending.Housing 7102 is to be constituted list with one kind The mode global formation of individual full unit.By global formation, housing 7102 has seamless outward appearance, this with including being fixed on Two parts together and thus formed therebetween trough rim, seam conventional housing it is different.That is, being different from conventional shell Body, housing 7102 does not include any gap, thus makes it more firm and more attractive in appearance.Housing 7102 can use any quantity Material be made, including such as plastics, metal, ceramics etc..In one embodiment, housing 7102 can be made of stainless steel, To provide moving perception attractive in appearance, and for all sub-components in it provide structural intergrity and support.Using During metal, housing 7102 can be formed using conventional telescopic core rapid metallic prototyping technique known to the skilled person in the art.
Personal media device 7100 also includes lid 7106, and the lid includes flat outer surface.The outer surface can It is concordant with the edge for example with the housing wall around cover edge.Lid 7106 coordinates with housing 7102 and is set with surrounding individual media Standby 7100.Although lid 7106 can be positioned with various ways come relative housing, in embodiment illustrated, by lid 7106 It is arranged in intraoral and close mouth of the cavity of shell 7100.That is, lid 7106 adapts to opening 7108.It is real replacing Apply in example, lid 7106 can be touch-sensing mechanism that is opaque and can including being formed touch pad.Lid 7106 can To be configured to the user interface of definition/carrying personal media device 7100.Lid 7106 can be provided for display module 7104 Viewing areas for showing graphic user interface (GUI) and from other information (such as text, object and figure) to user.It is aobvious Show that component 7104 can be the part for being assembled and being included in the display unit (not shown) inside housing 7102.This kind of user Incoming event can be used for any amount of purpose, and such as reset personal media device 7100 is presented on display module 7104 Display screen between select etc..In one embodiment, lid 7106 is the protection of transparent or semitransparent material (clear) Top layer so that display module 7104 can be seen by the lid.That is, lid 7106 act as display group The window (that is, transparent cover body covers display screen) of part 7104.In a specific embodiment, lid 7106 is formed by glass (for example, lid glass), and more specifically formed by press polished glass.Although it should be recognized that can be saturating using other Bright material, such as limpid plastics.
Viewing areas can touch sensitivity, for receiving the various aspects for helping control display content on a display screen One or more touch inputs.In some cases, one or more inputs (for example, multiple point touching) can simultaneously be received. In these embodiments, touch-sensing layer (not shown) can be positioned under lid glass 7106.Touch-sensing layer for example can be with It is arranged between lid 7106 and display module 7104.In some cases, touch-sensing layer puts on display module 7104, And touch-sensing layer puts on lid glass 7106 in other situations.Touch-sensing layer can for example be attached to lid glass 7106 inner surface (printing, deposition, lamination or otherwise in connection).Touch-sensing layer is generally comprised and is configured as The multiple sensors activated when finger touches the upper surface of lid glass 7106.In simplest situation, whenever finger warp Electric signal is just produced when crossing sensor.Preset time frame in number of signals can indicate finger touch non-sensitive part on Position, direction, speed and acceleration, i.e. signal are more, and it is more that user moves its finger.In most of situations, signal is by electricity Sub-interface monitor, the electrical interface by the quantity of signal, combination and frequency conversion into position, direction, speed and acceleration information. The information can be then used for performing the desired control function for display module 7104 by personal media device 7100.
Personal media device 7100 may also include one or more switches, and its breaker in middle includes that power switch, volume are controlled Switch, user input equipment etc..Power switch 7110 can be configured as being turned on and off personal media device 7100, and volume Switch 7112 is configured as adjusting the audio volume level that personal media device 7100 is produced.Personal media device 7100 may also include one Individual or multiple connectors, for personal media device 7100 transmission data and/or the electric power of coming and going.For example, opening 7115 can hold Receive audio jack 7116, and being open 7117 can accommodate data/power connector 7118.Audio jack 7116 allows audio-frequency information Exported from personal media device 7100 with wired connector, and connector 7118 is allowed to such as all-purpose computer (such as platform Formula computer, pocket computer) host device send data and from host device receive data.Connector 7118 can be used for Personal media device 7100 upload or from its download audio, video and other view data and operating system, using etc..Example Such as, connector 7118 can be used to for song and playlist, audiobook, photo etc. to download to depositing for personal media device 7100 In storage mechanism (memory).Connector 7118 also allows for electric energy to be sent to personal media device 7100.
The part 7200 of personal media device 7100 can include multiple communication features.For example, part 7200 at least can be with Including the first audio-frequency unit 7120, can be used for output and given birth to by being enclosed in the sub-audible sound generation device assembly inside housing 7102 Into sub-audible sound Part I.The sub-audible sound generation device assembly can take various forms.But in described reality Apply in example, sub-audible sound generation device assembly at least includes being arranged to and the processing unit included in personal media device 7100 The vibrating diaphragm of the audio signal synchronous vibration of offer.Audio signal can be by processing unit by decoding in personal media device 7100 The audio data file that portion keeps is provided.Being enclosed in the second audio port 7122 inside connector assembly 7118 can then use The remainder of the sub-audible sound generated by sub-audible sound generation device assembly in output.In this way, the first audio port 7120 The sub-audible sound generated by sub-audible sound generation device assembly can be collaboratively exported with the second audio port 7122.The cooperation refers to Be for example to be blocked or when otherwise (by finger, clothing etc.) hindered in the first audio port, the second audio The position of port 7122 substantially eliminates the equally also blocked possibility of second audio port 7122.Therefore, because first The shared air path from sub-audible sound maker to external environment condition of 7120 and second audio port of audio port 7122, therefore work as A part (for example, the part being associated with the first audio port 7120) for the air path is blocked or otherwise receives When hindering, at least some sound of the Part I of the sub-audible sound generated by sub-audible sound generation device assembly can be passive Be redirected to the second audio port 7122, thus generally maintain overall and perceive sound output level.
For example, because connector assembly 7118 can receive aerial lug (for example, 30 pin connectors), therefore when company When connecing device and being engaged with connector assembly 7118, the major part of the second audio port 7122 can be blocked or hinder.In such case Under, the user of personal media device 7100 can unlikely be held in the way of the first audio port 7120 of a kind of blocking or obstruction Firmly housing 7102.Therefore, even if the connector of engagement can substantially be blocked or hinder the second audio port 7122, the first audio port 7120 presence also can be by exporting from the passive audible sound for being redirected to the first audio port 7120 of the second audio port 7122 At least some sound in sound totally perceive audio output level to assist in keeping.
Figure 42 shows the viewgraph of cross-section of the mancarried electronic aid 7100 shown in Figure 40-41.Housing 7102 can be surrounded Various internal unit parts, the permission personal media device 7100 being for example associated with user interface is operated for its predetermined function Part.For discussion purposes, it is believed that internal unit part is disposed in the layer of multiple stackings.For example, display group The display screen of part 7104 can be located immediately at the lower section of top glass 7106.In one embodiment, display screen and its association Display driving circuit can be encapsulated in together as a part for display module 7104.In the lower section of display module 7104 Can be circuitry 7130, the main logic board being for example associated with miscellaneous part or circuit, and for individual media Equipment 7100 provides the battery 7132 of electric power.
Inner frame 7140 can increase personal matchmaker for example, by strengthening the ability of the bending moment that resistance housing 7102 bear The overall hardness of body equipment 7100.The inner frame 7140 can be made of various firm and elastic material.For example, when inside When framework 7140 is made up of the metal of stainless steel etc, inner frame 7140 is referred to alternatively as M (metal)-framework 7140.M- frameworks 7140 not only can provide structural support for personal media device 7100, and can also be used to help the generation of various internal parts Heat be sent to external environment condition.M- frameworks 7140 may be located at display module 7104 lower section and circuitry 7130 it is upper Side.In this way, M- frameworks 7140 can provide support for various internal parts, and help transmit from display module 7104 Etc internal part heat.
M- frameworks 7140 can serve as the attachment point of other equipment part.For example, M- frameworks 7140 can via fastener or It is the installation surface 7134a and 7134b being attached to using adhesive on housing 7102.Then, display module 7104 etc Other equipment part can be coupled to M- frameworks 7140, be rather than directly coupled to housing 7102.Display module 7104 is passed through An advantage for being coupled to housing by M- frameworks 7140 is：Display 7140 can be with the bending moment for being associated with housing 7102 slightly Isolation, i.e. the bending moment generated on housing can be dissipated to M- frameworks 7140.By by display module be associated with scratching for housing 7102 Square is isolated, and can prevent from damaging display module 7104, the generation of such as rupture.
It will be noted that in certain embodiments, personal media device 7100 can include additional inner frame.Example Such as, framework 7150 can be directly fixed to housing 7102, and be commonly used for supporting top glass 7106.In this regard, Framework 7150 can be referred to as G (glass)-framework 7150.In order to support that lid glass 7106, G- frameworks 7150 can include tool There is the frame side 7152 of flange portion, wherein lid glass 7106 is bonded around flange 7154 with frame side 7152, thus seals whole Individual equipment.G- frameworks 7150 can be made of non-conductive frames material, such as glass filled plasticses.On being adapted in G- frameworks One example of the glass filled plasticses used in 7150 is by Alpharetta, the Solvay AdvancedPolymers of GA The KALIX of manufactureTM。KALIXTMIncluding the high performance nylon that 50% glass fibre is reinforced.Those of ordinary skill in the art will , it will be recognized that there are a lot of other potential frame materials also to be adapted for being used together with the embodiment, and unless explicitly stated otherwise, no Claim should be construed as being limited to KALIXTMOr other any glass filled plasticses.
Figure 43 shows the zoomed-in view of the part 7200 of housing 7102 shown in the Figure 41 seen from front.Discussed at this Remainder and generality is not lost, the first audio port 7120 will be referred to as housing port 7202, and the second audio port 7120 are referred to as connector port 7204.Housing port 7202 can have be consistent with the overall shape and outward appearance of housing 7102 Size and shape.For example, the side wall 7206 of housing 7102 can have batten or curved shape, this contributes to user by individual Media device 7100 is held in the hand.Correspondingly, housing port 7202 can be shaped to be easier to the shape phase with side wall 7206 Coordinate.Housing port 7202 may be located at the position with the standoff distance of the rear surface 7208 " d " of housing 7102.Housing port 7202 Adopt and configure in a way, as shown in figure 44, the sound 7210 sent from housing port 7202 can be directed with angle, θ The rear surface 7208 of housing 7102.In this way, when personal media device 7100 is placed on support surface S, from housing The sub-audible sound 7210 that port 7202 sends can be directed with surface S be at an angle of θ, thus by sub-audible sound 7210 extremely Few number voice is guided to support surface S.In this way, support surface 7210 can serve as soundboard, so as to sub-audible sound 7210 In at least a portion sound can be reflected by support surface S, so as to produce more robust sounding audio-frequency to present.
Figure 45 shows the view of the interior section 7500 of the personal media device 7100 according to described embodiment.As schemed Shown in 45, M- frameworks 7140 can be used for providing support for various internal parts, such as sub-audible sound generation device assembly 7504 with And connector assembly 7506.In the embodiments described, sub-audible sound generation device assembly 7504 can be by G- frameworks 7150 Housing 7102 is fixed to M- frameworks 7140.Connector assembly 7506 can be installed to printed circuit board (PCB) (PCB) 7508 with veneer.Can Listening generation device assembly 7504 can include the audio amplifier 7510 with Part I 7512 and Part II 7514.Part I 7512 can include the sub-audible sound maker unit 7516 for being arranged to provide sub-audible sound 7518.Part I 7512 can be with It is configured to provide the first air path 7520.First air path 7520 can be coupled via the acoustics of housing port assembly 7522 Sub-audible sound maker unit 7516 and housing port 7202.In this way, the Part I 7524 of sub-audible sound 7518 can To use the first air path 7520 via housing port assembly 7522 and housing port 7202 from sub-audible sound maker Unit 7516 is delivered to external environment condition.
Part II 7514 can be integrally formed with Part I 7512.(also referred to as " the side car of Part II 7514 (side car) " parts) may be configured to provide the second air path 7526.Second air path 7526 can be via connection The acoustics of device assembly 7506 coupling sub-audible sound maker unit 7516 and connector port 7204.In this way, sub-audible sound 7518 Part II 7528 can be using the second air path 7526 from sub-audible sound maker unit 7516 via connection Device port 7204 is delivered to external environment condition.In order to ensure firm attachment sub-audible sound generates device assembly 7504, it is possible to use fastener 7530.Fastener 7530 can be diversified.Fastener 7530 can be used and for sub-audible sound generate device assembly 7504, M- frameworks 7140 and connector assembly 7506 be fixed to housing 7102 screw 7530 form.
Deposited using at least two parallel air paths of the first air path 7520 and the form of the second air path 7526 Have many advantages, such as.One this kind of advantage is：At least two presence of air path can reduce the totality resistance to air-flow It is anti-, thus reduce the loss amount of sub-audible sound energy in course of normal operation.In this way, audible efficiency (that is, gives volume defeated Enter the sound levels of the perception at level) can greatly improve.Additionally, being available for being generated by sub-audible sound by providing at least two The parallel air path that the sub-audible sound 7518 of the generation of device unit 7516 is propagated along it, to flow impedance in an air path Any increase at least can be by being passively redirected to another air path for representing smaller impedance air path by air-flow Partly to compensate.In this way, even if an audio output port is by part even completely plugged, the output sound levels of perception Will not significantly reduce.In this way, remain able to significantly change described in the audio that personal media device 7100 is provided being presented The user of the audio performance of kind personal media device 7100 perceives.
For example, when sub-audible sound maker unit 7516 just provides sub-audible sound 7518, Part I 7524 can be through Housing port 7202 is delivered to by the first air path 7520.The Part II 7528 of sub-audible sound 7518 can simultaneously via the Two air ports 7526 are delivered to connector port 7204.When being perceived by the user, in housing port 7202 and connector port The sound levels (that is, acoustic energy level) perceived on 7204 are roughly the same.In other words, general audio perceives and will cause to listen It is actually what is sent rather than at least two positions from single position that person is inferred to sub-audible sound 7210.If however, for example Finger or other objects are placed on user the position for blocking or hindering housing port 7202, then to the gas in air path 7520 Flow impedance will be significantly increased, and thus cause being greatly reduced for acoustic energy output quantity at housing port 7202.In such case Under, the impedance increase to air-flow met with the first air path 7520 can passively cause Part I 7524 in extremely Few number voice is redirected to the second air path 7526 from the first air path 7520.In this way, even if housing port Acoustic energy output quantity at 7202 is substantially reduced, and the acoustic energy output quantity at connector port 7204 is as acoustics energy Amount has passively been redirected to the second air path 7526 and has increased substantially from the first air path 7520.Thus, perception is total Body audio output level (that is, audio volume level) can keep being basically unchanged.
Thus, the general integrity of the air path 7526 of obvious first air path 7520 and second is for keeping at least portion Above-mentioned advantage (the overall sound of perception and holding especially with regard to the audio balance between audio efficiency, each output port for dividing Learn experience) for be critically important.For example, to any systematicness increase of flow impedance, can reduce can in air path Listening generates the general audio efficiency of device assembly 7504.For example, the second air path 7526 is directly via connector port 7204 are connected to external environment condition.In order to prevent the intrusion reduction air path 7526 of dust and other debris from external environment condition Quality (for example increasing the impedance to air-flow due to the accumulation of dust), can be in connector port 7204 and Part II Filter 7532 is placed between 7514.Filter 7532 (as shown in further detail below and discussing) can be used for preventing Second air path of impurity pollution 7526 of sealing and dust etc.Additionally, in the embodiments described, filter 7532 can To be firm but accessible, the energy that filter 7532 is periodically cleared up in the case where not causing to damage thus is provided the user Power.Additionally, foam seal 7533 and foam seal 7535 can simultaneously be applied to housing port 7202 and connector port 7204. Foam seal 7533 for sealing gland housing port 7202 can be using the shape of relatively thick froth bed and ornamental mesh Formula, and foam seal 7535 can then take the form of the foam ring on connector port 7204 using overlap joint.
In a particularly useful embodiment, filter 7532 can be used and can be placed in air path 7526 Dicoration/hydrophobic mesh heap 7532 form.When air path 7526 is placed into, ornamental/hydrophobic mesh heap 7532 can To prevent water point and dust from invading personal media device 7100.Mesh heap 7532 can include multiple layers, and among these at least Including mesh layer.Mesh layer can provide an ornamental screen cloth, and it can prevent from being immediately seen individual media from external environment condition The inside of equipment 7100.Generally, the mesh-portion of mesh heap 7532 can be made of coarse and waterproof material.In certain situation In, mesh material can be with sufficiently solid, to provide at least some structural supports for connector port 7204.Ornamental mesh Intensity can be with sufficiently large, to resist by for example inserting an object into caused infringement in connector port.
In addition to providing from dust and the moisture protection for invading and the inside for protecting personal media device 7100, institute State mesh and also keep accessible, to implement cleaning and eliminating impurities.The accessibility of mesh is highly useful, because net The aggregation of dust or other debris is apparent on hole heap 7532.The aggregation of dust or other debris is to make us very much at mesh Disagreeable, because the pollutant of dust etc can be focused at mesh and hinder the output of sub-audible sound, thus reduce personal matchmaker The overall performance of body equipment 7100 and total Consumer's Experience.By the burnisher for simply inserting wet swab stick etc, it is possible to The debris of such as dust on mesh are removed, thus prevents the sealing to be packed with and sound output reduction.
The feature of such as sealing gland 7534 can be used the integrality for assisting in keeping the second air path 7526.Sealing gland 7534 Can be used for the engagement being tightly connected between the rear portion of device assembly 7506 and Part II 7514.Sealing gland 7534 can be by with proper When any appropriate compatible material of sealing characteristics is made.For example, sealing gland 7534 can be in the form of foam seal 7534.By There are compressive characteristics in foam, foam seal 7534 can be in the adapter 7536 and connector assembly of Part II 7514 Compressed between 7506 adapter 7538 (shown in Figure 46) in place.In the embodiments described, adapter 7536 can be according to Adapter 7538 is shaped, and thus adapter 7536 can be bound tightly together.In this way, adapter 7536 can be tight Thickly fit in inside the receiving space provided by adapter 7538.
In assembling process, sub-audible sound maker unit 7504 can be placed in housing 7102 using tilting action Portion.The tilting action enables to adapter 7536 obliquely to enter adapter 7538 and by its receiving, now can be to second Part 7514 applies pressure, and then can be connected and fixed to for sub-audible sound maker unit 7504 by the Part II 7514 Meet both device assembly 7506 and PCB 7508.By being tilted into and applying pressure, adapter 7536 can be with compression adapter Foam seal 7534 between 7536 and adapter 7538 so that the experience of foam seal 7534 is significantly compression.In described reality Apply in example, adapter 7538 can be shaped in the way of a kind of compression for emphasizing the experience of foam seal 7534, thus greatly be increased Strong foam seal 7534 stops or at least obviously suppresses moisture or the ability in other pollutant invading air paths 7526.With The associated alignment pin in two part 7514 can be used in insertion process is inclined.The alignment pin have be configured to insert PCB The shape of the receiving hole in 7508 and position.Because PCB 7508 and connector assembly 7506 are welded on during reflow treatment Together, therefore can also be held in position in for Part II 7514 by alignment pin, so that Part II 7514 become cannot With the delamination of connector assembly 7506.
Additionally, keeping feature 7540 to can be used for further ensuring that the sealing gland integrality of the second air path 7526.Keep Feature 7540 can be adapted to M- frameworks 7140, and once in place, just prevent adapter 7536 and adapter 7538 from separating.Accordingly Ground, M- frameworks 7140 are placed on the top of connector assembly 7506 and audio amplifier 7510.M- frameworks 7140 can include being suitable for place into The finger piece of feature 7540 is kept, and in one embodiment, the holding feature may be located at connector assembly 7506 Shell parts.M- frameworks 7140 can also include spring clip, and the latter can load Part II 7514 towards connector assembly 7506 Side.The power created by spring clip can cause sealing 7534 over-pressed with the joint of adapter 536 in adapter 7534 Contracting.Therefore, once in place, M- frameworks 7140 can prevent connector assembly 7506 from being separated with Part II 7514.It should be noted that , sub-audible sound generation unit 7504 can be firmly attached to M- frameworks 7140 and G- frameworks 7150.This hardness installs energy Enough help to prevent hum, and amplify sub-audible sound via back side of shell 7208, wherein the meeting of the back side of shell 7208 exists Personal media device 7100 is protruded when being in the hard flat surface of desk or desk etc.
Figure 46 shows the zoomed-in view of the part 7600 shown in Figure 45.Part 7600 is provided on connector assembly 7506 and Part II 7514 engagement more detailed view.More specifically, part 7600 shows the mesh of filter 7532 The additional detail of heap.Filter 532 can be formed by ornamental mesh 7602, be used to prevent other pollutants of water and dust etc Invade and deteriorate the second air path 7526.In the period of assembly of personal media device 7100, connector assembly 7506 is by making Flowed back with entitled solder or be referred to as the surface mounting technique of backflow and be mounted and be attached to PCB 7508.In reflow treatment Period, the solder of melting be used to all parts be electrically connected to the electrical bonding pads and trace as the parts of PCB 7508.Due to Condition harshness (including high temperature), filter 7532 can not be from for being surface mounted to printed circuit board (PCB) by connector assembly 7506 Adhere in 7508 reflow treatment, therefore, filter 7532 cannot be the integration section of connector assembly 7506.Thus, Can be surface mounted to for connector assembly 7506 in the mounting technology using entitled " port-cullis " (that is, sliding door) by filter 7532 Installed after PCB 7508.By using sliding door, filter 7532 can period of assembly using slit or groove by under Fall appropriate position.Once in place, filter 7532 can be sealed in place using the adhesive of glue etc.With this side Formula, filter 7532 can to environmental pollutants play sealing function, in case it enters inside personal media device.
Figure 47 shows the viewgraph of cross-section 7700 along the line A-A of Figure 45.Viewgraph of cross-section 7700 shows that foam is close The sealability and the relation between adapter 7536 and adapter 7538 of envelope 7534.More specifically, keeping the spring 7701 can be with For by confining force FretensionIt is directly applied to Part II 7514.Confining force FretensionAdapter 7536 can be caused direct again It is in close contact " lance " the shape part 7702 of adapter 7538.In this way, chamfering (chamfered) surface of lance shape part 7702 7704 and 7706 can guide confining force FretensionComponent (such as foam power FfoamIt is shown), so as to towards " the mistake of M- frameworks 7150 The part 7708 of compression " foam seal 7534, thus dramatically increases the sealability of foam seal 7534.Sub-audible sound generation is single Unit 7504 can include the alignment pin 7710 that size and shape is consistent with PCB openings 7712.In the dress of personal media device 7100 With period, using the connector alignment pin 7714 for entering PCB openings 7716, connector assembly 7506 can be fixed to PCB 7508.Sealing 7718 can be used for strengthening sealing, and thus reduce the possibility of sound leakage.
Figure 48 shows another embodiment, wherein replacement or supplement as connector port 7204, audio jack end Mouthfuls 7900 may be used in audio jack air path 7902 export by sub-audible sound maker unit 7516 generate it is audible Sound.Sub-audible sound maker unit 7516 can be acoustically connected to audio jack unit by audio jack air path 7902 7904.More specifically, Part II 7514 can be connected to audio jack unit 7904 at such as audio jack pipe 7906.With This mode, when not taken by audio jack post, the part 7908 of sub-audible sound 7518 can be sent out from audio jack port 7900 Go out.It will be noted that when audio jack post is inserted into audio jack pipe 7906, the generally quilt of sub-audible sound maker unit 7516 Disable, and any potential sub-audible sound that therefore will not be sent with audio jack port 7900 mutually conflicts.
Figure 49 shows the flow chart that the treatment 8000 according to described embodiment is described in detail in detail.Treatment 8000 can 8002 with There is provided for the housing for surrounding multiple functional units to start, wherein the multiple functional unit be used to be personal media device Function is provided.The housing can be made of the metal of such as stainless steel or aluminium, and can have seamless Construction integration.It is described Housing can include multiple openings, and each opening has the size for accommodating input-output apparatus, switch, connector etc. And shape.Next 8004, loudspeaker assembly can be attached to the inside of housing.The loudspeaker assembly can use various shapes Formula.In the embodiments described, loudspeaker assembly includes the acoustic speaker that is for example made of vibrating diaphragm, the vibrating diaphragm then basis The electric signal vibration that the voicefrequency circuit of the audio file kept in decoding personal media device is provided.Next 8006, first Air path will be configured.Via the first audio output port be acoustically coupled to loudspeaker assembly outer by first air path Portion's environment.In the embodiments described, the first audio output port can be in the form of the opening in housing.Next exist 8008, the second air road independently of the first audio output port is configured between loudspeaker assembly and the second audio output port Footpath.Independently meaning the first audio output port and the second audio output port can be physically located with so that in two ports Only one of which or another port can be by the solid blockades of user's finger etc rather than all two ports.In this way, At least one audio port can remained and be not blocked substantially.
8010, sub-audible sound is generated by loudspeaker assembly.8012, the first and second audio ports, audible sound are used Sound is collaboratively delivered to external environment condition from loudspeaker assembly.Collaboratively transmission refers to the first air path and the second air road Footpath is coupled causing that the impedance increase transmitted to acoustic energy in an air path causes in the acoustic energy at least Some are passively redirected to more low-impedance air path from the air path of higher resistance.For example, if the first sound Frequency output port is blocked or is at least obstructed, and causes the impedance in the first air path to acoustic energy stream to increase, then At least some in the acoustic energy that can be otherwise blocked are redirected to the second air path.In this way, individual media sets The audio output level of standby perception will keep being basically unchanged.
Figure 50 is the block diagram of the arrangement 8100 of the functional module utilized by portable media device.Portable media device for example may be used Being the portable media device 7102 illustrated in Figure 40 and Figure 41.Arrangement 8100 includes being the user of portable media device Output audio can also store and retrieve the media player 8102 of the data relevant with data storage device 8104 simultaneously.Arrangement 8100 also include graphic user interface (GUI) manager 8106.GUI manager 8106 operates to control to provide and be displayed in display Information in equipment.Arrangement 8100 also includes promoting the communication module of the communication between portable media device and accessory device 8108.Further, arrangement 8100 also includes that operation sets to verify and obtain from the annex that can be coupled with portable media device The add-on manager 8110 of standby data.For example, accessory device can be wireless interface accessory, such as Figure 40 illustrate with just Take the wireless interface accessory of the coupling of media device 7102.
Figure 51 is the block diagram of the suitable media player 8150 being used together with described embodiment.Media player 8150 exemplified with typical portable media device circuit.Media player 8150 includes processor 8152, and it is related to for controlling The microprocessor or controller of the overall operation of media player processed 8150.Media player 8150 will be related to the media of media item Data are stored in file system 8154 and cache 8156.File system 8154 is typically a storage dish or multiple disks. File system 8154 is usually media player 8150 and provides massive store ability.But, due to file system 8154 Access time is relatively slow, therefore, media player 8150 can also include cache 8156.Cache 8156 is, for example, The random access memory (RAM) provided by semiconductor memory.The relative access time of cache 8156 will be considerably shorter than text The access time of part system 8154.But, large storage capacity of the cache 8156 without file system 8154.More enter one Step, in activity, file system 8154 consumes more electric power than cache 8156.When media player 1150 is by electricity During the portable media device of the power supply of pond 8174, power consumption would generally be a problem.Media player 8150 can also include RAM 8170 and read-only storage (ROM) 8172.ROM 8172 can with it is non-volatile store the program to be performed, utility program or Treatment.RAM 8170 provides volatile data storage, such as the data storage of cache 8156.
Media player 8150 also includes the use for allowing the user of media player 8150 to be interacted with media player 8150 Family input equipment 8158.For example, user input equipment 8158 can take various forms, for example button, keypad, dialing Disk, touch-screen, audio input interface, video/image capture input block, using the input etc. of sensing data form.More Further, media player 8150 includes that (the screen of display 8160 to user's display information can be carried out from the control of processor 8152 Display).Data/address bus 8166 can promote at least in file system 8154, cache 8156, processor 8152 and CODEC Data transmission between 8163.
In one embodiment, media player 8150 is used for multiple media items (for example, song, blog etc.) storage In file system 8154.When user is wished with media renderer plays certain media items, will be shown on display 8160 The list of available media items.Then, by using user input equipment 8158, user can select one of them available media .Once receiving the selection to certain media items, processor 8152 is by the media data of certain media items (for example, audio is literary Part) it is supplied to encoder/decoder (CODEC) 8163.CODEC 8163 then produces the simulation output for loudspeaker 8164 Signal.Loudspeaker 8164 can be the loudspeaker outside the inside of media player 8160 or media player 8150.For example, can be with Think that the earphone or earplug that are connected with media player 8150 are external loudspeakers.
Media player 8150 also includes the network/bus interface 8161 coupled with data link 8162.Data link 8162 permission media players 8150 are coupled to master computer or accessory device.Data link 8162 can be in wired connection or There is provided in wireless connection.In the case of a wireless connection, network/bus interface 8161 can include transceiver.Media Item (media asset) can be related to one or more different types of media contents.In one embodiment, media item is track (for example, song, talking book and blog).In another embodiment, media item is image (for example, photo).And at it In his embodiment, media item can be any combination of audio, figure or video content.
In one embodiment, inside antenna communicates for Wi-Fi, such as according to IEEE802.11a, b, g and n standard Those communications.Wi-Fi is generally used for Wireless Networking computing device, and so as to be often used in transmission and meter in Wi-Fi connection The relevant information of calculation machine.However, the other types of communication carried out in Wi-Fi connection is increasing, the communication includes, example Such as, video phone call, e-book is downloaded to tablet PC etc..Modularization material antenna module described herein can by with In this Wi-Fi communications.In another embodiment, inside antenna is used for short-distance radio connected network communication, such as basis BluetoothTMThose communications of standard.
In another embodiment, inside antenna be used for WiMAX (WiBB) communication, such as IEEE802.16, its It is referred to as WiMAX, Local Multipoint Distribution System (LMDS) and multichannel multiple spot distribute business (MMDS).In another embodiment In, inside antenna is used for cellular communication.This can include using leading to that in many different cellular communication protocols is carried out Letter, the cellular communication protocol is that such as global system for mobile communications (GSM), GPRS (GPRS), code division are more Location (CDMA), Evolution-Data Optimized (EV-DO), enhanced data rates for gsm evolution (EDGE), 3GSM, Digital Enhanced Cordless lead to Letter (DECT), numeral AMPS (IS-136/TDMA) and integrated digital enhanced networks (iDEN).
In certain embodiments, inside antenna is the broad-band antenna that can be configured as receiving multiple different frequency bands.Being expected will Carry out the additional frequency band of deployment when new wireless traffic turns into available.The Antenna Design of each embodiment can be configured as any Operated on one or more suitable frequency bands, to cover any existing or new business interested.If desired, can be with Multiple antennas are provided, to cover more multiband, or wide-bandwidth resonating element can be provided to one or more antennas, to cover Multiple communication bands interested.A use of advantage of the broadband antenna design of the multiple communication bands interested of covering is this Allow to reduce equipment complexity and cost, and minimize the quantity of the handheld device for distributing to antenna structure.
When the relatively large frequency range of hope covering is without providing multiple single antennas or being arranged using tunable antenna When, the Wide-Band Design can be used for one or more antennas in wireless device.If desired, broadband antenna design can be made into It is tunable, to extend its bandwidth coverage, or can be used with reference to additional antenna.Typically, however, the Wide-Band Design is past The need for reduce or eliminating to multiple antennas and tunable configuration.
In addition, embodiments of the invention further relate to the Computer Storage product with computer-readable medium, the computer It is stored with computer-readable recording medium for performing the various computer codes with computer implemented operation.The medium and computer generation Code can be in order at the purpose of the present invention and those codes of particular design and construction, or they can be known type and Be computer software fields technical staff obtained by.The example of computer-readable medium is included but is not limited to：Magnetizing mediums, it is all Such as hard disk, floppy disk and tape；Optical medium, such as CD-ROM and DVD and hologram device；Magnet-optical medium, such as floptical；And It is especially configured with respect to quality the hardware device for storage and configuration processor code, such as application specific integrated circuit (ASIC), programmable logic device Part (PLD) and ROM and RAM device.The example of computer code includes machine code, the machine generation for such as being produced by compiler Code, and the file comprising higher level code performed by the computer using interpreter.
In one embodiment, there is provided a kind of computer-readable medium, it is included for performing assembly portable formula electronics The computer program instructions of the various steps of equipment.Specifically, computer program instructions can be used to control each automatic installation group Part, such as, robotic arm, automatic screwdriver etc., it is (or at least minimized without the intervention of people that they can assemble the equipment The intervention of people).By this way, computer instruction can be programmed to control machine support to be welded into conductive shell, will not be led Electric framework be adhered to the inside of conductive shell, the part with first shape by interlocking antenna and framework with corresponding to The part of the second shape of first shape, antenna block is fixed on framework, antenna flexible cable is threaded through for example, by by screw And support, antenna flexible cable is mechanically fixed to antenna block first-class.
Many features of the invention and advantage are will become apparent from from this written description, and therefore appended claims are intended to cover Cover all these feature and advantage of the invention.Further, since those skilled in the art are readily apparent that many modifications and changes, this Invention is thus not to be limited to accurate construction and the operation for showing and describing.Therefore, all suitable modifications and equivalent are considered as Fall within the scope of the present invention.

Claims (18)

1. it is a kind of manufacture portable computing device method, including：
First chip is attached to the second chip via flexible circuit connector；
First chip is attached to printed circuit board (PCB), wherein the first chip is positioned in causes the metal frame part in metal framework Divide around first chip, the wherein metal framework is mutually coupled with the printed circuit board (PCB)；
Folded flexible circuitry connector simultaneously aligns the second chip with the first chip, wherein first chip and second core Piece is combined with stack arrangement；
A part for flexible circuit connector is grounded through the one side or the multi-lateral of the metal framework, to prevent RF signals from described Spilt in first chip and second chip, wherein the part of flexible circuit connector includes multiple connector gaskets, Wherein flexible circuit connector and metal framework are formed around first chip and the faraday cup of the second chip, wherein connecting Device pad is grounded through metal framework so that the circuit trace coupled with the connector gasket in flexible circuit connector forms method A part for cage is drawn, thus prevents the first chip and the RF signals of the second chip generation from being left from the faraday cup；And
The component for including the first chip, the second chip, metal framework and printed circuit board (PCB) is installed in portable computing device.
2. the method for claim 1, also includes：The part that will be attached to flexible circuit connector is tight with metallic shield Connect the hole alignment of the first chip and the second chip.
3. the method for claim 1, also includes：Connector gasket is soldered to the side or many of metal framework Side.
4. the method for claim 1, also includes：Connector gasket is bound to described in metal framework using conductive strips One side or the multi-lateral.
5. method as claimed in claim 1 or 2, also includes：The Part I of flexible circuit connector is attached to metal frame First side of frame, and the Part II of flexible circuit connector is attached to the second side of metal framework.
6. a kind of memory devices, including：
It is coupled to the first chip of the Part I of flexible circuit connector；
The second chip including top surface and basal surface and the Part II for being coupled to flexible circuit connector, wherein flexible circuit The Part II of connector substantially covers the basal surface；
The Part III between the Part I and the Part II of flexible circuit connector；
The Part IV extended from the Part II of flexible circuit connector, including be coupled in flexible circuit connector Circuit trace connector gasket；
The top surface of the second chip is combined with the first chip by the Part III of folded flexible circuitry connector wherein, Wherein be configured to connector gasket through the metal portion around memory devices by the Part III of the folding of flexible circuit connector Part is grounded the Part IV of flexible circuit connector, and wherein flexible circuit connector and metal parts are formed and set around memory Standby faraday cup, wherein connector gasket are grounded the part for circuit trace is formed faraday cup through metal parts, by This prevents the first chip and the RF signals of the second chip generation from being left from the faraday cup.
7. memory devices as claimed in claim 6, wherein memory devices coupling before being installed in computing device It is connected to the printed circuit board (PCB) including the metal parts.
8. memory devices as claimed in claim 7, wherein connector gasket is soldered to the metal parts.
9. memory devices as claimed in claim 7, wherein connector gasket is bound to the metal via conductive adhesive tape Part.
10. memory devices as claimed in claim 6, also including extending from the Part II and connect including second The Part V of the flexible circuit connector of device pad is connect, wherein in order to memory devices are installed in computing device, folding The Part V is coupled to the metal parts to allow the second connector gasket.
A kind of 11. portable computing devices, including：
Housing；
It is coupled to the antenna of housing；
Memory devices, including：
It is coupled to the first chip of the Part I of flexible circuit connector；
The second chip including top surface and basal surface and the Part II for being coupled to flexible circuit connector, wherein flexible circuit The Part II of connector substantially covers the basal surface；
The Part III between the Part I and the Part II of flexible circuit connector；
The Part IV extended from the Part II of flexible circuit connector, including be coupled in flexible circuit connector Circuit trace connector gasket；
The top surface of the second chip is combined with the first chip by the Part III of folded flexible circuitry connector wherein, Wherein be configured to connector gasket through the metal portion around memory devices by the Part III of the folding of flexible circuit connector Part is grounded the Part IV of flexible circuit connector, and wherein flexible circuit connector and metal parts are formed and set around memory Standby faraday cup, wherein connector gasket are grounded the part for circuit trace is formed faraday cup through metal parts, by This prevents the first chip and the RF signals of the second chip generation from being left from the faraday cup；
Wherein faraday cup is around the first chip and the second chip and thus prevents the first chip and the RF of the second chip generation from believing Number the antenna is reached, wherein the flexible circuit connector is grounded by metal framework.
12. portable computing devices as claimed in claim 11, wherein the metal framework is made up of silver-nickel.
13. portable computing devices as claimed in claim 11, also including printed circuit board (PCB), wherein the second chip is coupled to this Printed circuit board (PCB).
14. portable computing devices as claimed in claim 13, wherein the Part IV of the flexible circuit connector Including first component；And
The portable computing device also includes：
It is couple to printed circuit board (PCB) and close to the metallic shield of first chip and the second chip, including hole, wherein, described The period of assembly of portable computing device, the Part III of the flexible circuit connector is folded to allow the first component Coordinated by the hole in the metallic shield.
15. portable computing devices as claimed in claim 14, also including conductive strips, wherein the conductive strips be placed on it is described The flexible circuit connector is grounded with through the metallic shield on connector gasket and a part for the metallic shield.
16. portable computing devices as claimed in claim 14, also including the Part IV with the flexible circuit connector Multiple parts of coupling, wherein the Part III folds to allow each part by the related hole in the metallic shield Coordinated.
17. portable computing devices as claimed in claim 14, wherein the metallic shield and the flexible circuit connector Part II be faraday cup a part, thus prevent the first chip and the RF signals of the second chip generation from the faraday Left in cage.
18. portable computing devices as claimed in claim 13, also include：
Lid glass；And
Display between the lid glass and the printed circuit board (PCB).
CN201180047961.2A 2010-08-19 2011-08-19 Portable electric appts Active CN103221896B (en)

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CN103221896B true CN103221896B (en) 2017-06-09

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