CN103212856B - The process of the thicker material of a kind of Ultra-Violet Laser processing - Google Patents
The process of the thicker material of a kind of Ultra-Violet Laser processing Download PDFInfo
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- CN103212856B CN103212856B CN201210015881.5A CN201210015881A CN103212856B CN 103212856 B CN103212856 B CN 103212856B CN 201210015881 A CN201210015881 A CN 201210015881A CN 103212856 B CN103212856 B CN 103212856B
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Abstract
The invention discloses the process of the thicker material of a kind of Ultra-Violet Laser processing, described method comprises the steps: step S1, according to the inside/outside circle size of cutting the part that will retain and determine cutting pattern; If retain inside, then inside dimension is for requiring size, to external expansion; If retain outside, then external dimensions is for requiring size, inwardly expands; Step S2, arrange cutting auger, helix pitch is 0.1 ~ 1 spot size size, and coil width sets according to material thickness; Step S3, adjustment laser parameter cut.The process that the present invention proposes has widened processing groove, and the trench backfill effect of such material will reduce, laser just can further deep layer cutting until cut and wear material; Meanwhile, the laser path that the present invention proposes is the mode that spiral one cutter is walked, and is significantly increased than the cutting speed of such as concentric circles, concentric boxes mode.In addition, the present invention, when not changing focal position, improves thicker material cutting efficiency.
Description
Technical field
The invention belongs to technical field of laser processing, relate to a kind of laser processing, especially relate to the process of the thicker material of a kind of Ultra-Violet Laser processing.
Background technology
The advantages such as laser cutting is as a kind of Novel hot cutting technique, and have cutting speed fast, production efficiency is high, and cutting surfaces quality is good, the little and environmental protection in heat affected area, oneself, through becoming one of main sheet fabrication mode, obtains applying more and more widely.
When using laser to process thicker material, higher laser power may be used to carry out process faster.But known laser technology may produce too much heat and chip.These chips can strengthen the difficulty that laser is processed further usually.Laser further cutting can be subject to the impact of the trench backfill of laser injection material.When material thickness increases, backfill just can become the further processing seriously directly hindering laser.
In view of this, nowadays in the urgent need to the method for the thick material of a kind of new laser cutting, to improve working (machining) efficiency.
Summary of the invention
The present invention is intended at least to solve one of technical problem existed in prior art.For this reason, one object of the present invention is the process proposing the thicker material of a kind of Ultra-Violet Laser processing, can improve the working (machining) efficiency of the thicker material of cutting.
According to the process of the thicker material of a kind of Ultra-Violet Laser processing of the embodiment of the present invention, described method comprises the steps:
Step S1, according to the inside/outside circle size of cutting the part that will retain and determine cutting pattern; If retain inside, then inside dimension is for requiring size, to external expansion; If retain outside, then external dimensions is for requiring size, inwardly expands;
Step S2, arrange cutting auger, helix pitch is 0.1 ~ 1 spot size size, and coil width sets according to material thickness;
Step S3, adjustment laser parameter cut.
In one embodiment of the present invention, described method comprises the step widening processing groove.
Preferably, in described step S3, the laser path of cutting is the mode that spiral one cutter is walked; According to cutting effect, cutting times is set as one or many as required.
In one embodiment of the present invention, in described step S2, the establishing method of coil width is: constantly in focal position add man-hour, and the thickness d of material is less than the depth of focus length of laser; Focal position is arranged on the position of material d/2, coil width is more than or equal to d/2*tan θ, and θ is laser beam divergence.
Beneficial effect of the present invention is, the process that the present invention proposes has widened processing groove, and the trench backfill effect of such material will reduce, laser just can further deep layer cutting until cut and wear material; Meanwhile, the laser path that the present invention proposes is the mode that spiral one cutter is walked, and is significantly increased than the cutting speed of such as concentric circles, concentric boxes mode.In addition, the present invention, when not changing focal position, improves thicker material cutting efficiency.
Additional aspect of the present invention and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become obvious and easy understand from accompanying drawing below combining to the description of embodiment, wherein:
Fig. 1 is the flow chart of process according to an embodiment of the invention.
Fig. 2 is cutting pattern schematic diagram.
Fig. 3 is cutting process schematic diagram according to an embodiment of the invention.
Detailed description of the invention
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the embodiment be described with reference to the drawings, only for explaining the present invention, and can not limitation of the present invention being interpreted as.
Refer to Fig. 1, according to the process of the thicker material of a kind of Ultra-Violet Laser processing of the present invention, described method comprises the steps:
Step S1, according to the inside/outside circle size of cutting the part that will retain and determine cutting pattern; If retain inside, then inside dimension is for requiring size, to external expansion; If retain outside, then external dimensions is for requiring size, inwardly expands.
Step S2, arrange cutting auger, helix pitch is 0.1 ~ 1 spot size size, and coil width sets according to material thickness.In the present embodiment, the establishing method of coil width is: constantly in focal position add man-hour, and the thickness d of material is less than the depth of focus length of laser; Focal position is arranged on the position of material d/2, coil width is more than or equal to d/2*tan θ, and θ is laser beam divergence.In one embodiment of the present invention, arranging of coil width can widen processing groove, and the trench backfill effect of such material will reduce, laser just can further deep layer cutting until cut and wear material.
Step S3, adjustment laser parameter cut.According to cutting effect, cutting times is set as one or many as required; Laser path is the mode (can consult Fig. 2) that spiral one cutter is walked, and along with processing pass increases, working depth increases thereupon, until cut (can consult Fig. 3).
In the description of this description, specific features, structure, material or feature that the description of reference term " a kind of embodiment " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Although illustrate and describe embodiments of the invention, those having ordinary skill in the art will appreciate that: can carry out multiple change, amendment, replacement and modification to these embodiments when not departing from principle of the present invention and aim, scope of the present invention is by claim and equivalents thereof.
Claims (4)
1., by a process for the thicker material of Ultra-Violet Laser processing, it is characterized in that, described method comprises the steps:
Step S1, according to the inside/outside circle size of cutting the part that will retain and determine cutting pattern; If retain inside, then inside dimension is for requiring size, to external expansion; If retain outside, then external dimensions is for requiring size, inwardly expands;
Step S2, arrange cutting auger, helix pitch is 0.1 ~ 1 spot size size, and coil width sets according to material thickness;
Step S3, adjustment laser parameter cut;
In described step S2, the establishing method of coil width is: constantly in focal position add man-hour, and the thickness d of material is less than the depth of focus length of laser; Focal position is arranged on the position of material d/2, coil width is more than or equal to d/2*tan θ, and θ is laser beam divergence.
2. the process of the thicker material of Ultra-Violet Laser processing according to claim 1, it is characterized in that, described method comprises the step widening processing groove.
3. the process of the thicker material of Ultra-Violet Laser processing according to claim 1, it is characterized in that, in described step S3, according to cutting effect, cutting times is set as one or many as required.
4. the process of the thicker material of Ultra-Violet Laser processing according to claim 1, it is characterized in that, in described step S3, the laser path of cutting is the mode that spiral one cutter is walked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210015881.5A CN103212856B (en) | 2012-01-19 | 2012-01-19 | The process of the thicker material of a kind of Ultra-Violet Laser processing |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210015881.5A CN103212856B (en) | 2012-01-19 | 2012-01-19 | The process of the thicker material of a kind of Ultra-Violet Laser processing |
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| Publication Number | Publication Date |
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| CN103212856A CN103212856A (en) | 2013-07-24 |
| CN103212856B true CN103212856B (en) | 2016-02-24 |
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| CN201210015881.5A Active CN103212856B (en) | 2012-01-19 | 2012-01-19 | The process of the thicker material of a kind of Ultra-Violet Laser processing |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105618936B (en) * | 2014-11-21 | 2017-12-01 | 大族激光科技产业集团股份有限公司 | One kind uses laser grooving and scribing glass processing method |
| CN105983786B (en) * | 2015-02-04 | 2019-06-11 | 大族激光科技产业集团股份有限公司 | A method of glass processing is realized using laser |
| CN106541214A (en) * | 2016-09-30 | 2017-03-29 | 广东正业科技股份有限公司 | A kind of laser cutting device and its cut-sytle pollination method and system |
| CN117066709A (en) * | 2023-06-26 | 2023-11-17 | 西南石油大学 | Process method for cutting medium-thickness and above steel by using laser without auxiliary blowing |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4718418A (en) * | 1983-11-17 | 1988-01-12 | Lri L.P. | Apparatus for ophthalmological surgery |
| EP0448408A2 (en) * | 1990-03-23 | 1991-09-25 | Canon Kabushiki Kaisha | Optical cutting method and optical cutter |
| CN1213440A (en) * | 1996-03-12 | 1999-04-07 | 电科学工业公司 | Mutli-tool positioning system |
| US6231566B1 (en) * | 1998-08-12 | 2001-05-15 | Katana Research, Inc. | Method for scanning a pulsed laser beam for surface ablation |
| CN1780714A (en) * | 2003-04-25 | 2006-05-31 | 日东电工株式会社 | Method of producing laser-processed product and adhesive sheet, for laser processing used therefor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4467168A (en) * | 1981-04-01 | 1984-08-21 | Creative Glassworks International | Method of cutting glass with a laser and an article made therewith |
| US6897405B2 (en) * | 2001-11-30 | 2005-05-24 | Matsushita Electric Industrial Co., Ltd. | Method of laser milling using constant tool path algorithm |
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2012
- 2012-01-19 CN CN201210015881.5A patent/CN103212856B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4718418A (en) * | 1983-11-17 | 1988-01-12 | Lri L.P. | Apparatus for ophthalmological surgery |
| EP0448408A2 (en) * | 1990-03-23 | 1991-09-25 | Canon Kabushiki Kaisha | Optical cutting method and optical cutter |
| CN1213440A (en) * | 1996-03-12 | 1999-04-07 | 电科学工业公司 | Mutli-tool positioning system |
| US6231566B1 (en) * | 1998-08-12 | 2001-05-15 | Katana Research, Inc. | Method for scanning a pulsed laser beam for surface ablation |
| CN1780714A (en) * | 2003-04-25 | 2006-05-31 | 日东电工株式会社 | Method of producing laser-processed product and adhesive sheet, for laser processing used therefor |
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| CN103212856A (en) | 2013-07-24 |
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