CN103210456A - Ceramic component and method for producing a ceramic component - Google Patents

Ceramic component and method for producing a ceramic component Download PDF

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Publication number
CN103210456A
CN103210456A CN2011800424412A CN201180042441A CN103210456A CN 103210456 A CN103210456 A CN 103210456A CN 2011800424412 A CN2011800424412 A CN 2011800424412A CN 201180042441 A CN201180042441 A CN 201180042441A CN 103210456 A CN103210456 A CN 103210456A
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China
Prior art keywords
ceramic component
pathway electrode
electrode
pathway
described ceramic
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CN2011800424412A
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Chinese (zh)
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CN103210456B (en
Inventor
T.费希廷格
G.普德米希
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TDK Corp
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Epcos AG
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/1006—Thick film varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105—Varistor cores

Abstract

A ceramic component (100) comprises a basic body (101) with two connecting contacts (102, 103) fitted thereon. The component (100) has a first longitudinally extended via electrode (104) and a second longitudinally extended via electrode (105), said electrodes each being coupled to one of the connecting contacts (102, 103). The first via electrode (104) and the second via electrode (105) each have an extended area (106, 107) in projection in the longitudinal direction. For production purposes, a plurality of ceramic layers (117, 118, 119) is layered to form a layer stack, which forms the basic body (101), and the two via electrodes (104, 105) are introduced into the layer stack transversely to the layer sequence.

Description

Ceramic component and for the manufacture of the method for ceramic component
Technical field
The present invention relates to ceramic component, for example varistor, and relate to the method for the manufacture of this type of device.
Background technology
In order to protect high-frequency circuit to avoid because the damage that static discharge causes can be used varistor.In this type of electronic component, resistance depends on voltage, and is higher than specific threshold voltage and can diminishes suddenly.Thus, can draw away via varistor at the load that applies under the high voltage situation.
Traditional multilayer pressure sensitive resistor has the outside contact site that connects, and the interior electrode of comb shape extends to the ceramic matrix from these outside contact sites that connect.This type of multilayer pressure sensitive resistor for example has been shown in DE19931056.
The electric capacity of this class A of geometric unitA can not be reduced arbitrarily, because especially external electrode can cause than higher total capacitance value having under the ceramic matrix situation of high-k.In addition, the accuracy during the interior electrode (for example by means of silk screen print method) of arrangement comb shape can be restricted, and can form tolerance thus in the electric capacity of member.This also for example is applicable to the fluctuation that determined by process of each layer of ceramic matrix, and described ceramic matrix for example is ceramic membrane.
Summary of the invention
What be worth expectation is a kind of ceramic component of explanation, and it has little electric capacity, and the tolerance of being made decision in this ceramic component can obtain balance.In addition, worth expectation is a kind of method for the manufacture of this type of ceramic component of explanation.
In embodiments of the present invention, ceramic component comprises matrix, and this matrix has two connection contact sites that are installed on this matrix.In addition, this ceramic component comprises the pathway electrode of first and second longitudinal extensions, and they are connected the contact site coupling respectively with one.First and second pathway electrodes have the face of extension respectively during projection in a longitudinal direction.
Can arrange the electric capacity of ceramic component very little by the interior zone that contacts ceramic component by means of pathway electrode.This ceramic component especially has＜electric capacity of 3 pF.
In one embodiment, the projection of the projection of first pathway electrode and alternate path electrode overlaps on the common projection plane respectively in a longitudinal direction.Especially the projection lap of projection is bigger than the underlapped part of projection.In other embodiments, the face of the projection of first pathway electrode is littler than the face of the projection of alternate path electrode on common projection plane.On projection plane, the projection arrangement of first pathway electrode is in the projection inside of alternate path electrode.Therefore can balance be made the tolerance of decision.
In one embodiment of the present invention, the method for the manufacture of ceramic component comprises that a plurality of ceramic layers are piled up stratification to be piled, the matrix of this layer heap formation ceramic component.Two pathway electrodes are presented to the layer heap perpendicular to the relative side, two positions of sequence of layer ground from layer heap.Two connect contact sites and are installed on the layer heap, make connect contact site respectively with a pathway electrode electrical couplings.In execution mode, in order to insert pathway electrode, in layer heap, stamp out groove, and utilize electric conducting material to fill these grooves.
Therefore, can make a kind of ceramic component, it has little electric capacity, and the tolerance of being made decision in this ceramic component can obtain balance.
Description of drawings
Other advantages, feature and improvement project draw from the embodiment that sets forth below in conjunction with accompanying drawing.In the accompanying drawings, identical, type is identical is equipped with identical Reference numeral with the effect components identical.The element that illustrates and their dimension scales each other are not considered as proportionally in principle, or rather, and the layer of each element-for example or zone-for better displaying property and/or better understand and thicker or illustrate significantly turgidly by size.
Wherein:
Figure 1A and 1B show the schematic diagram according to the ceramic component of an execution mode;
Fig. 2 shows the schematic diagram according to the ceramic component of another execution mode;
Fig. 3 shows the schematic diagram according to the ceramic component of another execution mode;
Fig. 4 A and 4B show the schematic diagram according to the ceramic component of an execution mode;
Fig. 5 A and 5B show the schematic diagram according to the ceramic component of an execution mode;
Fig. 6 shows the schematic diagram according to the ceramic component of an execution mode;
Fig. 7 shows the perspective schematic view according to the ceramic component of the perspective demonstration of an execution mode;
Fig. 8 shows has four schematic diagrames that connect the ceramic component of contact site; With
Fig. 9 shows according to an execution mode has eight schematic diagrames that connect the ceramic component of contact site.
Embodiment
Figure 1A shows ceramic component 100 with viewgraph of cross-section.This ceramic component has matrix 101, and it is made of ceramic layer.Be separately installed with in relative side 126,127, two positions for the contact of device 100 electronics be connected contact site 102,103.The pathway electrode 104 of longitudinal extension 126 begins to extend in the matrix 101 from the side.Another pathway electrode 105 127 begins to extend in the matrix 101 from the side.Pathway electrode is stretched over active region 125 places always, for example is furnished with the varistor pottery in this active region 125. Pathway electrode 104 and 105 has the face 106 and 107 that extends perpendicular to longitudinal direction respectively in the end, described end deviates from respectively and connects contact site 102 and 103, connect contact site 102 and 103 respectively with pathway electrode 104 and 105 electrical couplings.
The ceramic layer of matrix 101 is arranged the stratification heap.These layers plane formula on the Y-direction of Fig. 1 extends and piles up at the directions X of Fig. 1 with overlapping each other.These layers perpendicular to connect contact site 102,103 plane formula extend the layout that overlaps each other.Pathway electrode 104 and the 105 stacking direction ground perpendicular to layer heap extend. Pathway electrode 104 and 105 passes a plurality of ceramic layers, especially more than two ceramic layers.
Figure 1B shows the device of Figure 1A along the profile of plane A-A '.When the longitudinal direction of pathway electrode projects to projection plane, for example project to plane A-A ' time, face 106 and face 107 have the zone that overlaps each other.Projection is preferably overlapping fully, as shown in Figure 1B.Pathway electrode 104 and pathway electrode 105 are same big perpendicular to the diameter of vertically widening 115.
In the illustrated embodiment, the projected area on the projection plane of two pathway electrodes 104 and 105 is same big.Pathway electrode 104 and 105 projected area are for example respectively about 3500 μ m 2With 6500 μ m 2Between.When projection has when round-shaped, this is corresponding to the diameter of about 90 μ m with about 65 μ m.
When pathway electrode 104 and 105 for example had cylindrical shape, the projection of pathway electrode was respectively circular.The face 106 of the bottom surface of cylindrical shape and coverage rate and pathway electrode 104 is corresponding with the face towards being connected contact site 102 of pathway electrode.In execution mode, pathway electrode has cylindrical shape, yet they also can have other shape, for example oval bottom surface or the bottom surface of rectangle.
The zone 125 preferential relevant with the electric function of ceramic component, especially varistor function is arranged between the face 106 and 107 of pathway electrode 104 and 105.Therefore can reduce the margin of tolerance of the electric capacity of the margin of tolerance, for example member, and the margin of tolerance for example only also depends on the fluctuation of distance between face 106 and 107 basically.
In the ceramic layer ground cloth postpone that overlaps each other, pathway electrode is placed in the layer heap.For example pathway electrode is stamped in the layer heap, and then utilizes electric conducting material, for example cream to fill.
Fig. 2 shows another embodiment of device 100.Different with the view of Figure 1A and 1B, pathway electrode 104 and 105 has different to each other diameter 115 and 116.During projection in a longitudinal direction, the area of pathway electrode 105 is bigger than the area of pathway electrode 104.Two pathway electrodes are preferably coaxial.Especially the projection that has a less area is fully in the inside of the projection with bigger area.At least, the part that overlaps each other of two projections is bigger than underlapped each other part.
Because electrode 105 extends manyly perpendicular to vertically widening direction ground than pathway electrode 104, therefore reduced the influence to the electrical characteristic of device, these influences are because pathway electrode displacement appearance relative to each other.Two pathway electrodes 104 and 105 to each other perpendicular to the relative displacement situation of vertically widening direction under, pathway electrode 104 projection in a longitudinal direction also is positioned at the inside of the projection of pathway electrode 105.At this, the capacitance characteristic of device is preferentially determined by the pathway electrode 104 that has perpendicular to the less extension of longitudinal direction.
Fig. 3 shows another execution mode of device 100.Different with the figure of front, this device 100 has another pathway electrode 108, and it is arranged between pathway electrode 104 and the pathway electrode 105.Additional pathway electrode 108 is preferably arranged for pathway electrode 104 and 105 coaxial.Pathway electrode vertically widen on the direction projection time, three pathway electrodes 104,105 and 108 projection are overlapping, preferably overlapping fully.Between the relative face 109 in the position of the face 106 of pathway electrode 104 and pathway electrode 108, be furnished with based varistor.Between the relative face 110 in the position of the face 107 of pathway electrode 105 and pathway electrode 108, be furnished with another layer that comprises based varistor.
By the arranged in series of two active regions, one between pathway electrode 104 and the pathway electrode 108 and one between pathway electrode 108 and pathway electrode 105, the electric capacity of device is reduced.
Fig. 4 A and 4B show another execution mode of device 100, and be different with the embodiment of front in described device 100, and two pathway electrodes are connected the contact site coupling respectively with one.Pathway electrode 104 and another pathway electrode 111 be connected contact site 102 electrical couplings.Pathway electrode 105 and another pathway electrode 112 be connected contact site 103 electrical couplings.
Pathway electrode 104 and 111 or 105 and 112 moves towards to be arranged to identical, and preferred parallel begins to extend in a longitudinal direction the inside of matrix 101 up to active region from corresponding connection contact site.
In Fig. 4 B, illustrated along the profile of the plane A-A ' of Fig. 4 A.Illustrate to pathway electrode 105 and 112 the projection dotted line formula to the A-A ' of plane.The cross section of pathway electrode 104 and pathway electrode 111 is surrounded in pathway electrode 104 and 112 projection respectively. Pathway electrode 104 and 105 or 111 and 112 projection are fully overlapping respectively. Pathway electrode 104 or 111 have a projection than small size, fully be arranged in the projection inside of pathway electrode 104 or 111 respectively.
Show another execution mode of device 100 at Fig. 5 A and 5B, matrix comprises the material of the dielectric constant that differs from one another in this device 100.
Zone 118 compared with matrix 101 towards the zone 117 that connects contact site 102 and have common contact-making surface (side 126) with it of matrix 101 has littler dielectric constant, and zone 118 is being connected to zone 117 away from the direction that connects contact site 102.Matrix 101 towards connecting contact site 103 and having littler dielectric constant again, preferably have dielectric constants identical with zone 117 compared with zone 118 with its zone 119 with common contact-making surface (side 127).The material 120 in zone 117 and 119 has littler dielectric constant compared with the material 121 in zone 118.Zone 117 or zone 119 for example have the ε of being about r=5 dielectric constant.The dielectric constant in zone 117 and 119 is more little, and the electric capacity that passes the connection contact site of device is more little.Zone 117,118 and 119 is made of a plurality of ceramic layers respectively.The ceramic layer in zone 117,118 and 119 piles up perpendicular to the longitudinal direction of pathway electrode with overlapping each other.
By with the zone 117 and 119 that is connected the contact site adjacency in and the zone 118 that is arranged in wherein of end face 106 and 107 in active region 125 and pathway electrode 104 and 105 use the material with differing dielectric constant, device 100 has little electric capacity, especially＜5 electric capacity, the electric capacity of preferred＜3 pF of pF.Surrounded because pathway electrode 104 and 105 has the material 120 of little dielectric constant in zone 117 and 119, therefore can reduce the electric scattering effect from zone 117 and 119.In order to reduce, preferably to stop the chemical reaction between the layer with bigger and less dielectric constant, zone 118 constitutes thicker.Especially the part of pathway electrode is disposed in the zone 118.
Fig. 5 B shows along the profile of the plane A-A ' of Fig. 5 A.Pathway electrode 105 surrounds along the material 120 that plane A-A ' quilt has smaller dielectric constant.
Fig. 6 shows another embodiment of device 100, and in this device 100, pathway electrode 104 has perpendicular to the different extension of vertically widening direction along their direction of vertically widening respectively with 105.Respectively with the zone 117 and 119 that is connected contact site 102 and 103 adjacency in, pathway electrode 105 had bigger perpendicular to the extension of vertically widening compared with the join domain 124 of pathway electrode 105 by material 120 area surrounded 123.Especially zone 124 has diameter 115 and regional 123 and has diameter 122, and diameter 122 diameter groups 115 are big.
By the zone with bigger extension 123 of pathway electrode 104 or pathway electrode 105, pathway electrode 104 can be electrically coupled to corresponding contact site 102 and 103 of being connected respectively well with 105.In order to shield and in order to keep ground very little the electric capacity of device, zone 123 is arranged in the material 120.In the zone 118 with material 121, this material 121 has bigger dielectric constant than material 120, constitutes with littler cross section with the pathway electrode of comparing of zone in 123.
Fig. 7 shows device 100 with perspective view.This device for example has zirconium dioxide, ZnO-BI and/or ZnO-PR as based varistor.In other embodiments, this device can comprise capacitor material, especially C0G, X7R, Z5U, Y5V and/or HQM.
Fig. 8 shows another execution mode of device 100 with perspective view, in this device 100, is furnished with four at matrix 101 places and connects contact sites.Be furnished with two at 127 places, side of matrix 101 and connect contact site 103.Relative 126 places, side are furnished with two connection contact sites 102 in the position.Connect contact site for each, a pathway electrode connection contact site direction relative in the position extends through the part matrix.Device 100 according to the execution mode of Fig. 8 for example has≤5.12 mm 2Device area, be preferably 2.5 mm 2Device area.
Fig. 9 shows according to another execution mode has eight devices 100 that connect contact site 102 or 103.Be furnished with four for each side 126 or 127 and connect contact site 102 or 103.Connect contact site for each, a pathway electrode extends to the inside of matrix 101.In other embodiments, connect contact site for each, a plurality of pathway electrodes, for example two pathway electrodes extend to the inside of matrix 101.Device 100 according to the execution mode of Fig. 9 for example has≤8mm 2Device area, especially be 5.12 mm 2Device area.
Utilize the execution mode of Fig. 8 and 9 to constitute the varistor array, it comprises a plurality of independent varistors.
The present invention is not subjected to the restriction according to the description of embodiment.Or rather, the present invention includes every kind of combination of each new feature and feature, especially every kind of combination of contained feature in patent claims is not even this feature or combination itself clearly describes in patent claims or embodiment.

Claims (13)

1. ceramic component comprises:
-matrix (101) has two connection contact sites (102,103) that are installed on the described matrix,
-the first (104) and the pathway electrode of second (105) longitudinal extension, they respectively be connected the coupling of one of contact site (102,103),
-wherein first (104) and second (105) pathway electrode has the face (106,107) of extension respectively during projection in a longitudinal direction.
2. ceramic component according to claim 1, in described ceramic component, the projection of first pathway electrode (104) and alternate path electrode (105) to be projected to small part overlapping.
3. ceramic component according to claim 1 and 2, in described ceramic component, the face of projection (106,107) is same big.
4. ceramic component according to claim 1 and 2, in described ceramic component, the face (106) of the projection of first pathway electrode (104) is littler than the face (107) of the projection of alternate path electrode (105).
5. according to the described ceramic component of one of claim 1 to 4, in described ceramic component, first (104) and second (105) pathway electrode has cylindrical shape respectively.
6. according to the described ceramic component of one of claim 1 to 5, in described ceramic component, one of pathway electrode (104,105) has the first area (123) that has first diameter (122), and the second area (124) that has second diameter (115) different with first diameter (122).
7. according to the described ceramic component of one of claim 1 to 6, in described ceramic component, matrix (101) has two zones (117,118) with the dielectric constant that differs from one another.
8. ceramic component according to claim 7, in described ceramic component, the zone (117,119) towards connecting contact site (102,103) of matrix (101) has littler dielectric constant than being arranged in separately towards the zone (118) between the zone (117,119) of described connection contact site (102,103) respectively.
9. ceramic component according to claim 8, as long as this claim is returned and is drawn claim 6, in described ceramic component, first diameter (122) is bigger than second diameter (115), and the first area (123) of pathway electrode (104,105) surrounds the zone with less dielectric constant (117,119) of matrix (101).
10. according to the described ceramic component of one of claim 1 to 9, in described ceramic component, be furnished with another pathway electrode (108) in deviating between the end that connects contact site (102,103) of first (104) and second (105) pathway electrode.
11. according to the described ceramic component of one of claim 1 to 10, in described ceramic component, between first (104) and second (105) pathway electrode, be furnished with based varistor (125).
12. the method for the manufacture of ceramic component comprises:
-a plurality of ceramic layers (117,118,119) are piled up the stratification heap, described layer heap constitutes the matrix (101) of ceramic component,
-two pathway electrodes (104,105) are presented to the layer heap perpendicular to the relative side, two positions of sequence of layer ground from layer heap,
-connect contact sites (102,103) with two to be installed on the layer heap, make connect contact site (102,103) respectively with one of pathway electrode (104,105) electrical couplings.
13. method according to claim 12, in described method, inserting of pathway electrode (104,105) comprises:
-in layer heap (101), stamp out groove respectively;
-utilize the electric conducting material filling groove.
CN201180042441.2A 2010-09-03 2011-08-31 Ceramic component and the method being used for manufacturing ceramic component Active CN103210456B (en)

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DE102010036270.0 2010-09-03
DE102010036270.0A DE102010036270B4 (en) 2010-09-03 2010-09-03 Ceramic component and method for producing a ceramic component
PCT/EP2011/065049 WO2012028659A2 (en) 2010-09-03 2011-08-31 Ceramic component and method for producing a ceramic component

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CN105493211A (en) * 2013-09-02 2016-04-13 株式会社村田制作所 Variable capacitance element
CN107112102A (en) * 2015-05-07 2017-08-29 摩达伊诺琴股份有限公司 Prevent the device of electric shock and include the electronic installation for the device for preventing getting an electric shock
CN107251178A (en) * 2015-02-27 2017-10-13 株式会社村田制作所 Variable-capacitance element
CN107408459A (en) * 2015-02-27 2017-11-28 株式会社村田制作所 Variable-capacitance element

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CN107112102B (en) * 2015-05-07 2019-12-24 摩达伊诺琴股份有限公司 Electric shock prevention device and electronic device comprising same

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CN103210456B (en) 2016-08-10
WO2012028659A3 (en) 2012-07-26
JP2013536989A (en) 2013-09-26
DE102010036270B4 (en) 2018-10-11
DE102010036270A1 (en) 2012-03-08
WO2012028659A2 (en) 2012-03-08
EP2612333A2 (en) 2013-07-10
EP2612333B1 (en) 2016-07-13
JP5716092B2 (en) 2015-05-13

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