CN103151260A - 利用强制对流对薄膜装置进行均匀热处理的设备及方法 - Google Patents
利用强制对流对薄膜装置进行均匀热处理的设备及方法 Download PDFInfo
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- CN103151260A CN103151260A CN2012100133023A CN201210013302A CN103151260A CN 103151260 A CN103151260 A CN 103151260A CN 2012100133023 A CN2012100133023 A CN 2012100133023A CN 201210013302 A CN201210013302 A CN 201210013302A CN 103151260 A CN103151260 A CN 103151260A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Abstract
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Claims (23)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US201161432775P | 2011-01-14 | 2011-01-14 | |
US61/432,775 | 2011-01-14 | ||
US13/343,531 US8998606B2 (en) | 2011-01-14 | 2012-01-04 | Apparatus and method utilizing forced convection for uniform thermal treatment of thin film devices |
US13/343,531 | 2012-01-04 |
Publications (1)
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CN103151260A true CN103151260A (zh) | 2013-06-12 |
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Application Number | Title | Priority Date | Filing Date |
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CN2012100133023A Pending CN103151260A (zh) | 2011-01-14 | 2012-01-16 | 利用强制对流对薄膜装置进行均匀热处理的设备及方法 |
Country Status (4)
Country | Link |
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US (1) | US8998606B2 (zh) |
CN (1) | CN103151260A (zh) |
DE (1) | DE102012000734A1 (zh) |
TW (1) | TWI549189B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105386126A (zh) * | 2014-09-03 | 2016-03-09 | 东京毅力科创株式会社 | 磁性退火装置 |
Families Citing this family (8)
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US8398772B1 (en) * | 2009-08-18 | 2013-03-19 | Stion Corporation | Method and structure for processing thin film PV cells with improved temperature uniformity |
US20130153202A1 (en) * | 2010-12-30 | 2013-06-20 | Poole Ventura, Inc. | Thermal diffusion chamber with convection compressor |
US20130192522A1 (en) * | 2010-12-30 | 2013-08-01 | Poole Ventura, Inc. | Thermal diffusion chamber with convection compressor |
JP5951889B2 (ja) * | 2013-03-27 | 2016-07-13 | 東京エレクトロン株式会社 | 基板処理装置 |
KR101442222B1 (ko) | 2013-04-05 | 2014-09-24 | 주식회사 아바코 | 열처리 시스템과 열처리 방법 및 그를 이용한 cigs 태양전지의 제조방법 |
US9741575B2 (en) * | 2014-03-10 | 2017-08-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | CVD apparatus with gas delivery ring |
TWI581335B (zh) * | 2015-07-24 | 2017-05-01 | 茂迪股份有限公司 | 熱處理裝置 |
TWI754065B (zh) * | 2017-06-23 | 2022-02-01 | 日商三井化學東賽璐股份有限公司 | 零件製造裝置及零件製造方法 |
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TW201250851A (en) | 2012-12-16 |
US8998606B2 (en) | 2015-04-07 |
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TWI549189B (zh) | 2016-09-11 |
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