CN103124009A - Connector structure and production method thereof - Google Patents
Connector structure and production method thereof Download PDFInfo
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- CN103124009A CN103124009A CN2011103700401A CN201110370040A CN103124009A CN 103124009 A CN103124009 A CN 103124009A CN 2011103700401 A CN2011103700401 A CN 2011103700401A CN 201110370040 A CN201110370040 A CN 201110370040A CN 103124009 A CN103124009 A CN 103124009A
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- layer
- material layer
- line layer
- connector construction
- elastic cantilever
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Abstract
The invention discloses a connector structure and a production method thereof. The production method includes providing a substrate comprising a dielectric core, a first circuit layer, a conducting material layer and a via hole, wherein the dielectric core is provided with a first surface and a second surface which are opposite, the first circuit layer and the conducting material layer are positioned on the first surface and the second surface respectively, the via hole is positioned in the dielectric core and connected with the first circuit layer and the conducting material layer; providing an adhesive layer with a through hole filled with conductive adhesive; providing patterned metal foil with a conducting elastic cantilever pattern which comprises a fixed end and a free end connected with the fixed end; pressing and fitting the substrate, the adhesive layer and the patterned metal foil, and connecting the first circuit layer with the fixed end through the conductive adhesive; and removing part of the patterned metal foil, and reserving the fixed end and the free end which form the conducting elastic cantilever pattern and the patterned conducting material layer.
Description
Technical field
The present invention relates to a kind of connector construction and preparation method thereof, and particularly relate to a kind of connector construction than low production cost and preparation method thereof that has.
Background technology
Generally speaking, usually can be equipped with connector on electronic installation and have the connecting hole that exposes connector, thus, the outside line of grid line or sound source wire and so on can be by being inserted in connecting hole and is electrically connected to connector.
Fig. 1 is the generalized section of existing a kind of connector construction.Please refer to Fig. 1, existing connector construction 10 has substrate 100, the first conductive layer 110, the second conductive layer 120, electrically conductive elastic cantilever 130, adhesion coating 140, copper layer 150, nickel dam 160 and gold layer 170.Substrate 100 has each other relative first surface 100a and second surface 100b, and has via 100c in substrate 100.The first conductive layer 110 is disposed on first surface 100a, and the second conductive layer 120 is disposed on second surface 100b, and the first conductive layer 110 is electrically connected to by via 100c with the second conductive layer 120.Electrically conductive elastic cantilever 130 is pressed on the first conductive layer 110 by adhesion coating 140.Copper layer 150 is disposed on the surface of electrically conductive elastic cantilever 130 and via 100c, and nickel dam 160 is disposed on copper layer 150, so that electrically conductive elastic cantilever 130 can be electrically connected to via 100c.In addition, gold layer 170 selectivity are disposed on nickel dam 160, in order to be electrically connected to outer member.
In the manufacturing process of connector construction 10, generally that the metal forming that first will have electrically conductive elastic cantilever 130 is pressed on the first conductive layer 110 by adhesion coating 140, then copper layer 150 is plated on the surface of electrically conductive elastic cantilever 130 and via 100c, nickel dam 160 is plated on the surface of copper layer 150 and gold layers 170 is plated on part nickel dam 160, remove again afterwards not needing part and keeping electrically conductive elastic cantilever 130 of metal forming, and with the second conductive layer 120 patternings.Therefore, the manufacturing process of existing connector construction 10 has more complicated manufacturing process steps and needs the more time of cost, and thereby makes connector construction 10 have higher production cost.
In addition, in connector construction 10, electrically conductive elastic cantilever 130 is to be electrically connected to the second conductive layer 120 by copper layer 150.Yet the part that is positioned in copper layer 150 on via 100c easily is subject to the impact of follow-up manufacture craft and produces damage, even fracture, thereby produce the problem that electrical reliability descends.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method of connector construction, it has better simply manufacturing process steps.
Another purpose of the present invention is to provide a kind of connector, and it has lower production cost.
For reaching above-mentioned purpose, the present invention proposes a kind of manufacture method of connector construction, it comprises provides the substrate that comprises dielectric core (dielectric core), the first line layer, conductive material layer and at least one via, dielectric core has each other relative first surface and second surface, the first line layer is positioned on first surface, conductive material layer is positioned on second surface, and via is arranged in dielectric core and be connected with the first line layer and conductive material layer; Adhesion coating with at least one through hole is provided, and is filled with conducting resinl in through hole; Pattern metal paper tinsel with at least one electrically conductive elastic cantilever pattern is provided, and electrically conductive elastic cantilever pattern comprises anchor portion and the free end that is connected with anchor portion; Solderless substrate, adhesion coating and pattern metal paper tinsel, wherein adhesion coating is between substrate and pattern metal paper tinsel, and conducting resinl connects the first line layer and anchor portion; Remove partially patterned metal forming, keep anchor portion and free end, wherein anchor portion and free end consist of the electrically conductive elastic cantilever; And with the conductive material layer patterning, to form the second line layer.
According to the manufacture method of the described connector construction of the embodiment of the present invention, the formation method of above-mentioned substrate is for example first to form the first conductive material layer on first surface, and forms the second conductive material layer on second surface.Then, form at least one through hole in the first conductive material layer, dielectric core and the second conductive material layer.Then, form the 3rd conductive material layer on the sidewall of through hole.Then, insert the consent material in through hole.Afterwards, with the first conductive material layer patterning, to form the first line layer.
According to the manufacture method of the described connector construction of the embodiment of the present invention, the formation method of above-mentioned adhesion coating is for example that the sticky material layer first is provided, and the surface of this sticky material layer has protective layer.Then, form through hole in sticky material layer and protective layer.Then, insert conducting resinl in through hole.Afterwards, remove protective layer.
According to the manufacture method of the described connector construction of the embodiment of the present invention, the formation method of above-mentioned pattern metal paper tinsel is for example that metal forming first is provided.Then, carry out etching process, remove the part metals paper tinsel, to form electrically conductive elastic cantilever pattern.Afterwards, carry out the punching press manufacture craft, make the upper surface of free end higher than the upper surface of anchor portion.
According to the manufacture method of the described connector construction of the embodiment of the present invention, above-mentioned after carrying out the punching press manufacture craft, can also partly form nickel dam on metal forming.
According to the manufacture method of the described connector construction of the embodiment of the present invention, above-mentioned after forming nickel dam, can also form the gold layer on the part free end.
A kind of connector construction of the another proposition of the present invention, it comprises substrate, at least one electrically conductive elastic cantilever and adhesion coating.Substrate comprises dielectric core, the first line layer, the second line layer and at least one via.Dielectric core has each other relative first surface and second surface.The first line layer is positioned on first surface.The second line layer is positioned on second surface.Via is arranged in dielectric core and is connected with the first line layer and the second line layer.The electrically conductive elastic cantilever arrangement is on the first line layer.The free end that the electrically conductive elastic cantilever has anchor portion and is connected with anchor portion, wherein the upper surface of free end is higher than the upper surface of anchor portion.Adhesion coating is disposed between the first line layer and electrically conductive elastic cantilever.Adhesion coating has at least one through hole, and is filled with conducting resinl in through hole.Conducting resinl connects the first line layer and anchor portion.
According to the described connector construction of the embodiment of the present invention, also comprise the nickel dam that partly is disposed on the electrically conductive elastic cantilever.
According to the described connector construction of the embodiment of the present invention, also comprise the gold layer that is disposed on the part free end.
Based on above-mentioned, in the present invention, because substrate, adhesion coating and pattern metal paper tinsel are independent making respectively, and do not need to form in order to connect the conductive layer of electrically conductive elastic cantilever and line layer on extra via in substrate, therefore can effectively improve speed of production, and make the making flow process of connector construction comparatively simple, and then can reduce the production cost of connector construction.In addition, because the electrically conductive elastic cantilever is to be electrically connected to the first line layer and the second line layer by the conducting resinl in adhesion coating, therefore can avoid electrical reliability be subject to the impact of follow-up manufacture craft and descend.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and coordinate appended accompanying drawing to be described in detail below.
Description of drawings
Fig. 1 is the generalized section of existing a kind of connector;
Fig. 2 A to Fig. 2 D is the making flow process profile of the substrate of the connector construction that illustrates according to the embodiment of the present invention;
Fig. 3 A to Fig. 3 C is the making flow process profile of the adhesion coating of the connector construction that illustrates of the embodiment of the present invention;
Fig. 4 A to Fig. 4 C is the making flow process top view of the electrically conductive elastic cantilever of the connector construction that illustrates of the embodiment of the present invention;
Fig. 5 A to Fig. 5 C is the making flow process profile of the I-' I hatching line electrically conductive elastic cantilever in Fig. 4 A to Fig. 4 C;
Fig. 6 A to Fig. 6 B is the making flow process profile of the connector construction that illustrates of the embodiment of the present invention;
Fig. 7 is the generalized section of the connector construction that illustrates of another embodiment of the present invention.
The main element symbol description
10,60: connector construction
20,100: substrate
30,140: adhesion coating
40: the pattern metal paper tinsel
100a, 200a: first surface
100b, 200b: second surface
100c, 206: via
110: the first conductive layers
120: the second conductive layers
130: the electrically conductive elastic cantilever
150: the copper layer
160,404: nickel dam
170,406: the gold layer
200: dielectric core
202a: the first conductive material layer
202b: the second conductive material layer
204,304: through hole
208: the consent material
210a: the first line layer
210b: the second line layer
300: the sticky material layer
302: protective layer
306: conducting resinl
400: metal forming
402: electrically conductive elastic cantilever pattern
402a: anchor portion
402b: free end
403: the electrically conductive elastic cantilever
Embodiment
Connector construction of the present invention mainly comprises substrate, electrically conductive elastic cantilever and adhesion coating.Below will the manufacture method of substrate, electrically conductive elastic cantilever, adhesion coating and connector structure be explained.
Fig. 2 A to Fig. 2 D is the making flow process profile of the substrate of the connector construction that illustrates according to the embodiment of the present invention.At first, please refer to Fig. 2 A, dielectric core 200 is provided.Dielectric core 200 has each other relative first surface 200a and second surface 200b.In addition, the first conductive material layer 202a and the second conductive material layer 202b lay respectively on first surface 200a and second surface 200b.The first conductive material layer 202a, the second conductive material layer 202b are for example metal level.
Then, please refer to Fig. 2 B, form through hole 204 in dielectric core 200 and the first conductive material layer 202a, the second conductive material layer 202b.The formation method of through hole 204 is for example laser drill or machine drilling.
Then, please refer to Fig. 2 C, form the 3rd conductive material layer on the sidewall of through hole 204, to form via 206.The formation method of via 206 is for example to carry out electroplating manufacturing process.Via 206 is in order to connect the first conductive material layer 202a and the second conductive material layer 202b.
Afterwards, please refer to Fig. 2 D, carry out making plug holes, to insert consent material 208 in through hole 204.Then, carry out the patterning manufacture craft, remove part the first conductive material layer 202a, to form the first line layer 210a on first surface 200a.Thus, can form substrate 20 in connector construction of the present invention.
Fig. 3 A to Fig. 3 C is the making flow process profile of the adhesion coating of the connector construction that illustrates according to the embodiment of the present invention.At first, please refer to Fig. 3 A, sticky material layer 300 is provided.The material of sticky material layer 300 for example is low gummosis dielectric layer.In addition, the surface of sticky material layer 300 has protective layer 302.Protective layer 302 is for example polyethylene terephthalate (polyethylene terephthalate, PET) film.
Then, please refer to Fig. 3 B, form through hole 304 in sticky material layer 300 and protective layer 302.The formation method of through hole 304 is for example laser drill or machine drilling.
Afterwards, please refer to Fig. 3 C, insert conducting resinl 306 in through hole 304.Conducting resinl 306 is for example copper cream or tin cream.Then, remove protective layer 302, make conducting resinl 306 protrude from two surfaces of sticky material layer 300.Thus, can form adhesion coating 30 in connector construction of the present invention.
Fig. 4 A to Fig. 4 C is the making flow process top view of the electrically conductive elastic cantilever of the connector construction that illustrates according to the embodiment of the present invention.Fig. 5 A to Fig. 5 C is the making flow process profile according to the I-' I hatching line electrically conductive elastic cantilever in Fig. 4 A to Fig. 4 C.At first, please simultaneously with reference to Fig. 4 A and Fig. 5 A, provide metal forming 400.Metal forming 400 is for example Copper Foil.
Then, please simultaneously with reference to Fig. 4 B and Fig. 5 B, with metal forming 400 patternings, have the pattern metal paper tinsel 40 of electrically conductive elastic cantilever pattern 402 with formation.Be for example that metal forming 400 is carried out etching process with the method for metal forming 400 patternings, remove part metals paper tinsel 400, to form pattern metal paper tinsel 40.Electrically conductive elastic cantilever pattern 402 comprises anchor portion 402a and free end 402b.Free end 402b is connected with anchor portion 402a, makes the follow-up electrically conductive elastic cantilever that is made of free end 402b and anchor portion 402a to be electrically connected to outer member via free end 402b.
Afterwards, please carry out forming step to electrically conductive elastic cantilever pattern 402 simultaneously with reference to Fig. 4 C and Fig. 5 C, make the upper surface of free end 402b higher than the upper surface of anchor portion 402a.Above-mentioned forming step is for example to carry out the punching press manufacture craft.In addition, after electrically conductive elastic cantilever pattern 402 is carried out forming step, can also partly form nickel dam 404 on pattern metal paper tinsel 40.In detail, on the extra-regional part that nickel dam 404 is formed at when pattern metal paper tinsel 40 is pressure bonded to adhesion coating 30 with conducting resinl 306 contacts, namely nickel dam 404 exposes and treats the zone that contacts with conducting resinl 306.In addition, partly form nickel dam 404 on pattern metal paper tinsel 40 after, can also form gold layer 406 on part free end 402b.Nickel dam 404 produces oxidation in order to prevent metal forming 400, and can avoid metal forming 400 and gold layer 406 to produce reaction.Gold layer 406 occurs with the problem that prevents loose contact between free end 402b and outer member in order to improve the frictional force between free end 402b and outer member.
Fig. 6 A to Fig. 6 B is the making flow process profile of the connector construction that illustrates according to the embodiment of the present invention.At first, please refer to Fig. 6 A, solderless substrate 20, be formed with the adhesion coating 30 and pattern metal paper tinsel 40 of nickel dam 304 and gold layer 306, wherein adhesion coating 30 between substrate 20 and pattern metal paper tinsel 40, and 306 connection the first line layer 210a and anchor portion 402a of the conducting resinl in adhesion coating 30.
Afterwards, please refer to Fig. 6 B, remove partially patterned metal forming 40, keep anchor portion 402a and free end 402b (both consisting of electrically conductive elastic cantilever 403), and with the second conductive material layer 202b patterning to form the second line layer 210b.Thus, can form connector construction 60 of the present invention.
Special one carry be, in other embodiments, after forming the second line layer 210b, can also be optionally on the second line layer 210b the above-mentioned adhesion coating 30 and pattern metal paper tinsel 40 of pressing, then remove partially patterned metal forming 40, keep anchor portion 402a and free end 402b, as Fig. 7 institute formula.Meaning namely can form the connector construction with four sandwich circuit layers.
In sum, in the manufacturing process of connector construction of the present invention, because substrate, adhesion coating and pattern metal paper tinsel are independent making respectively, and do not need to form in order to connect the conductive layer of electrically conductive elastic cantilever and line layer on extra via in substrate, therefore can effectively improve speed of production, and make the making flow process of connector construction comparatively simple, and then can reduce the production cost of connector construction.
In addition, in connector construction of the present invention, because the electrically conductive elastic cantilever is to be electrically connected to the first line layer and the second line layer by the conducting resinl in adhesion coating, but not the conductive layer on via is electrically connected to by additional configuration, therefore can avoid electrical reliability to be subject to the impact of follow-up manufacture craft and descend.
Although disclosed the present invention in conjunction with above embodiment; yet it is not to limit the present invention; be familiar with this operator in technical field under any; without departing from the spirit and scope of the present invention; can do a little change and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (9)
1. the manufacture method of a connector construction comprises:
One substrate is provided, this substrate comprises dielectric core, the first line layer, conductive material layer and at least one via, this dielectric core has each other relative first surface and second surface, this first line layer is positioned on this first surface, this conductive material layer is positioned on this second surface, and this via is arranged in this dielectric core and is connected with this first line layer and this conductive material layer;
One adhesion coating is provided, and this adhesion coating has at least one through hole, and is filled with conducting resinl in this through hole;
One pattern metal paper tinsel is provided, and this pattern metal paper tinsel has at least one electrically conductive elastic cantilever pattern, and this electrically conductive elastic cantilever pattern comprises anchor portion and the free end that is connected with this anchor portion;
This substrate of pressing, this adhesion coating and this pattern metal paper tinsel, wherein this adhesion coating is between this substrate and this pattern metal paper tinsel, and this conducting resinl connects this first line layer and this anchor portion;
Remove this pattern metal paper tinsel of part, keep this anchor portion and this free end, wherein this anchor portion and this free end consist of an electrically conductive elastic cantilever; And
This conductive material layer of patterning is to form one second line layer.
2. the manufacture method of connector construction as claimed in claim 1, wherein the formation method of this substrate comprises:
Form one first conductive material layer on this first surface, and form one second conductive material layer on this second surface;
Form at least one through hole in this first conductive material layer, this dielectric core and this second conductive material layer;
Form one the 3rd conductive material layer on the sidewall of this through hole;
Insert the consent material in this through hole; And
This first conductive material layer of patterning is to form this first line layer.
3. the manufacture method of connector construction as claimed in claim 1, wherein the formation method of this adhesion coating comprises:
One sticky material layer is provided, and the surface of this sticky material layer has a protective layer;
Form this through hole in this sticky material layer and this protective layer;
Insert this conducting resinl in this through hole; And
Remove this protective layer.
4. the manufacture method of connector construction as claimed in claim 1, wherein the formation method of this pattern metal paper tinsel comprises:
One metal forming is provided;
Carry out an etching process, remove this metal forming of part, to form this electrically conductive elastic cantilever pattern; And
Carry out a punching press manufacture craft, make the upper surface of this free end higher than the upper surface of this anchor portion.
5. the manufacture method of connector construction as claimed in claim 4, wherein after carrying out this punching press manufacture craft, also be included in and partly form a nickel dam on this metal forming.
6. the manufacture method of connector construction as claimed in claim 5, wherein after forming this nickel dam, also be included on this free end of part and form a gold medal layer.
7. connector construction comprises:
Substrate, comprise dielectric core, the first line layer, the second line layer and at least one via, this dielectric core has each other relative first surface and second surface, this first line layer is positioned on this first surface, this second line layer is positioned on this second surface, and this via is arranged in this dielectric core and is connected with this first line layer and this second line layer;
At least one electrically conductive elastic cantilever is disposed on this first line layer, the free end that this electrically conductive elastic cantilever has anchor portion and is connected with this anchor portion, and wherein the upper surface of this free end is higher than the upper surface of this anchor portion; And
Adhesion coating is disposed between this first line layer and this electrically conductive elastic cantilever, and this adhesion coating has at least one through hole, is filled with conducting resinl in this through hole, and this conducting resinl connects this first line layer and this anchor portion.
8. connector construction as claimed in claim 7, also comprise nickel dam, partly is disposed on this electrically conductive elastic cantilever.
9. connector construction as claimed in claim 8, also comprise the gold layer, is disposed on this free end of part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103700401A CN103124009A (en) | 2011-11-18 | 2011-11-18 | Connector structure and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103700401A CN103124009A (en) | 2011-11-18 | 2011-11-18 | Connector structure and production method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103124009A true CN103124009A (en) | 2013-05-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103700401A Pending CN103124009A (en) | 2011-11-18 | 2011-11-18 | Connector structure and production method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103124009A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979733A (en) * | 2014-04-08 | 2015-10-14 | 欣兴电子股份有限公司 | Connector manufacturing method |
| CN110649445A (en) * | 2018-06-27 | 2020-01-03 | 欣兴电子股份有限公司 | Method for manufacturing connector structure |
| CN112492751A (en) * | 2019-09-12 | 2021-03-12 | 庆鼎精密电子（淮安）有限公司 | Connector and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5152695A (en) * | 1991-10-10 | 1992-10-06 | Amp Incorporated | Surface mount electrical connector |
| US5173055A (en) * | 1991-08-08 | 1992-12-22 | Amp Incorporated | Area array connector |
| US20100170700A1 (en) * | 2007-05-29 | 2010-07-08 | Panasonic Corporation | Solid printed circuit board and method of manufacturing the same |
| CN102904082A (en) * | 2011-07-25 | 2013-01-30 | 欣兴电子股份有限公司 | Connector structure and manufacturing method thereof |
-
2011
- 2011-11-18 CN CN2011103700401A patent/CN103124009A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5173055A (en) * | 1991-08-08 | 1992-12-22 | Amp Incorporated | Area array connector |
| US5152695A (en) * | 1991-10-10 | 1992-10-06 | Amp Incorporated | Surface mount electrical connector |
| US20100170700A1 (en) * | 2007-05-29 | 2010-07-08 | Panasonic Corporation | Solid printed circuit board and method of manufacturing the same |
| CN102904082A (en) * | 2011-07-25 | 2013-01-30 | 欣兴电子股份有限公司 | Connector structure and manufacturing method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979733A (en) * | 2014-04-08 | 2015-10-14 | 欣兴电子股份有限公司 | Connector manufacturing method |
| CN104979733B (en) * | 2014-04-08 | 2017-03-29 | 欣兴电子股份有限公司 | The manufacture method of adapter |
| CN110649445A (en) * | 2018-06-27 | 2020-01-03 | 欣兴电子股份有限公司 | Method for manufacturing connector structure |
| CN110649445B (en) * | 2018-06-27 | 2021-02-26 | 欣兴电子股份有限公司 | Method for manufacturing connector structure |
| CN112492751A (en) * | 2019-09-12 | 2021-03-12 | 庆鼎精密电子（淮安）有限公司 | Connector and manufacturing method thereof |
| CN112492751B (en) * | 2019-09-12 | 2021-09-28 | 庆鼎精密电子（淮安）有限公司 | Connector and manufacturing method thereof |
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Application publication date: 20130529 |