Embodiment
In order to make technical problem solved by the invention, technical scheme and beneficial effect clearer, below in conjunction with accompanying drawing, the present invention is further elaborated.
The invention provides a kind of electromagnetic shielding filler, described electromagnetic shielding filler is nucleocapsid structure, has as Fig. 1 or structure shown in Figure 2, comprises successively from the inside to the outside kernel 1, is coated on the first shell 2 on kernel 1 and is coated on the second shell 3 on the first shell 2.
Wherein, described kernel 1 is magnetically permeable material, guarantees that electromagnetic screen coating of the present invention has good magnetic diffusivity.The first shell 2 is silver or copper, guarantees that electromagnetic screen coating of the present invention has good electroconductibility.The second shell 3 is the polyacetylene layer, it is conductive polymers, on the one hand guarantee that electromagnetic screen coating of the present invention has good electroconductibility, it has good consistency with film-forming resin on the other hand, makes the filler energy Uniform Dispersion in electromagnetic screen coating of the present invention.
Electromagnetic shielding filler provided by the invention is nucleocapsid structure, wherein kernel 1 is magnetically permeable material, the first shell 2 is conducting metal (being silver or copper), outer is conductive polymers (being the polyacetylene layer), make electromagnetic shielding filler of the present invention have the dual-use function of magnetic conduction, conduction concurrently, film-forming resin in outer field polyacetylene layer and electromagnetic screen coating has good consistency simultaneously, makes electromagnetic screen coating of the present invention have good dispersiveness and capability of electromagnetic shielding.
As one embodiment of the present invention, described magnetically permeable material is magnetic fibre, and namely kernel 1 is magnetic fibre; At this moment, the structure of described electromagnetic shielding filler as shown in Figure 1.Under preferable case, the length of described magnetic fibre is 1 μ m-500 μ m, and Fibre diameter is 10nm-20 μ m.Described magnetic fibre can adopt various magnetic fiber materials common in prior art, for example can be selected from nickel fiber, Fe
3O
4A kind of in fiber or ferrite doped calcium fiber.In described ferrite doped calcium fiber, doped element is Mn, Mg, Zn or Ba.More preferably in situation, the ferrite in described ferrite doped calcium fiber is for removing Fe
3O
4Outside other ferrite.
As another embodiment of the invention, described magnetically permeable material is magnetic-particle, and namely kernel 1 is magnetic-particle; At this moment, the structure of described electromagnetic shielding filler as shown in Figure 2.Under preferable case, the particle diameter of described magnetic-particle is 10nm-500 μ m.Described magnetic-particle can adopt various magnetic-particles common in prior art, for example can be selected from metallic nickel magnetic-particle, ferrite magnetic particle or ferro-aluminum boron magneticalloy particle a kind of.
In the present invention, the thickness of the first shell 2, the second shell 3 need not excessive.Under preferable case, the thickness of described the first shell 2 is 10nm-50 μ m, and the thickness of the second shell 3 is 10nm-30 μ m.
Take the total mass of described electromagnetic shielding filler as benchmark, the content of kernel 1 is 30-90wt%, and the content of the first shell 2 is 5-50wt%, and the content of the second shell 3 is 5-20wt%.Under preferable case, take the total mass of described electromagnetic shielding filler as benchmark, the content of kernel 1 is 42-60wt%, and the content of the first shell 2 is 25-40wt%, and the content of the second shell 3 is 8-20wt%.
The present invention also provides the preparation method of described electromagnetic shielding filler, comprises the following steps:
In A, alkali electroless plating solution that magnetically permeable material be impregnated in, form electroless plating silver layer or chemical plating copper layer on described magnetically permeable material surface; Described alkali electroless plating solution is alkali electroless silver plating liquid or alkaline chemical copper plating liquid;
B, the product that steps A is obtained are placed in the emulsion system that contains acetylene, emulsifying agent and catalyzer, and wherein catalyzer is Ziegler-Natta catalyst, obtains described electromagnetic shielding filler after reaction.
In the preparation method of electromagnetic shielding filler provided by the invention, by the chemical plating at magnetically permeable material surface formation conducting metal (silver or copper), then realize the coating of polyacetylene in synthetic polyacetylene, harsh one-tenth polyacetylene has higher activity, it very easily is adsorbed on the chemical silvering or electroless copper particle that has equally greater activity, the silver or the copper that guarantee polyacetylene and the first shell have good sticking power, thereby obtain electromagnetic shielding filler of the present invention.
Particularly, contain metal host, complexing agent, reductive agent, the agent of suction hydrogen and alkaline reagents in described alkali electroless plating solution, described metal host is water soluble silver salt or water-soluble mantoquita.In the present invention, the complexing agent in described alkali electroless plating solution, former dose of ring, suction hydrogen agent and alkaline reagents all can adopt various raw materials commonly used in prior art, and the present invention does not have singularity to limit.
For example, described complexing agent can be selected from nitrilotriacetic acid(NTA) sodium (NTA), edetate (EDETATE SODIUM or four sodium), diethylenetriamine pentacarboxylic acid salt (DTPA), tartrate, heptose hydrochlorate, Sunmorl N 60S, sodium alginate, monoethanolamine, diethanolamine, trolamine, tripoly phosphate sodium STPP, trisodium phosphate, Sodium hexametaphosphate 99, ethylenediamine tetraacetic methene sodium phosphate (EDTMPS), diethylene triamine pentamethylene phosphonic salt (DETPMPS) or amine three methene phosphoric acid salt.Described reductive agent is selected from hydrazine hydrate, glucose, sucrose, fructose or formaldehyde.The agent of described suction hydrogen is selected from nitro methyl alcohol, 2,4-DNP, p-NP or contraposition phenylate.Described alkaline reagents is selected from ammoniacal liquor, sodium hydroxide or potassium hydroxide.
As previously mentioned, the present invention does not have particular determination for other component in the alkali electroless plating solution, the present invention only is metal host to the restriction of described alkali electroless plating solution, namely selects its corresponding water-soluble metal salt as the metal host in the alkali electroless plating solution according to the conductive metallic material (silver or copper) of the first shell.Particularly, described metal host is water-soluble mantoquita or water soluble silver salt.Wherein, described water soluble silver salt can adopt Silver Nitrate.Described water-soluble mantoquita can adopt copper sulfate, cupric chloride or cupric nitrate.
In the present invention, magnetically permeable material be impregnated in the time of carrying out electroless plating in the alkali electroless plating solution, can suitably select according to the thickness of the first shell of required formation.For example, the thickness of described the first shell is 10nm-50 μ m, and the time of electroless plating can be 10min-5h.
The method according to this invention, after electroless plating is completed, namely at magnetically permeable material surface coating electroless plating silver layer or chemical plating copper layer, then be placed in the emulsion system that contains acetylene, emulsifying agent and catalyzer,, realize the coating of the surperficial polyacetylene of chemical plating when the acetylene polymerization reaction take place forms polyacetylene.Because the silver-colored particle or the copper particle that just form by electroless plating have higher activity; and the polyacetylene that newly synthesizes by polymerization has higher activity equally; therefore it very easily is adsorbed in silver-colored particle or copper particle surface; thereby realize that polyacetylene is to the coating process of the first shell, the electromagnetic shielding filler that obtains having Fig. 1 or structure shown in Figure 2.
In the present invention, the preparation method of polyacetylene is conventionally known to one of skill in the art, only is in the present invention: realize the coating of the magnetic conduction particle of its effects on surface chemical silvering or copper when polymerization generates polyacetylene.Particularly, in the present invention, described emulsifying agent can adopt sodium lauryl sulphate.Described Ziegler-Natta catalyst is conventionally known to one of skill in the art, is the mixture of the first catalyzer and the second catalyzer.Wherein said the first catalyzer is selected from TiCl
4, TiCl
3Or Ti (OR)
4In any one, and the second catalyzer is AlR
3, wherein R is alkyl.In the present invention, there is no particular determination for the temperature and time of the building-up reactions of described polyacetylene.For example, reaction can directly be carried out at normal temperatures, and the reaction times is 2-10h.
At last, the invention provides a kind of electromagnetic screen coating, contain film-forming resin, filler, thinner, coupling agent and dispersion agent in described electromagnetic screen coating; Wherein, described filler is electromagnetic shielding filler provided by the invention.
In electromagnetic screen coating provided by the invention, the contamination of described film-forming resin, coupling agent, dispersion agent is conventionally known to one of skill in the art, and the present invention does not have particular determination.For example, described film-forming resin can be selected from one or more in epoxy resin, acrylic resin, resol and vibrin.Described coupling agent can be selected from titante coupling agent or silane coupling agent, and dispersion agent can adopt organobentonite.
Particularly, take the film-forming resin of 100 weight parts as benchmark, in described electromagnetic screen coating, the content of filler is the 90-200 weight part, and the content of coupling agent is the 0.2-1 weight part, and the content of dispersion agent is the 0.5-5 weight part.
Described thinner is for the viscosity of regulating described electromagnetic screen coating.Therefore, the content of thinner can carry out corresponding selection according to actual needs.Described thinner is various organic solvents commonly used in prior art, for example can be selected from one or more in N-BUTYL ACETATE, tetracol phenixin, ethyl acetate.
Below in conjunction with specific embodiment, the present invention is done further and explain.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.In embodiment and Comparative Examples, the raw material that adopts all is commercially available.
Embodiment 1
(1) 3.5g Silver Nitrate, 4g tartrate, 45g glucose, 2.5g sodium hydroxide, 5mL ammoniacal liquor and 0.15g p-NP are scattered in the 60mL deionized water, obtain the alkali electroless silver plating liquid.
(2) 100g nickel fiber (length is 50 μ m, and diameter is 0.5 μ m) be impregnated in 50min in the alkali electroless silver plating liquid, forming thickness at the nickel fiber surface is 20 μ m electroless plating silver layers (46.67g); Then impregnated in and contain acetylene, sodium lauryl sulphate, TiCl
4And Al (C
2H
5)
3Emulsion system in, react 4h under normal temperature, afterwards coating thickness on electroless plating silver layer surface is the polyacetylene layer (20.00g) of 10 μ m, obtains the electromagnetic shielding filler S1 of the present embodiment, has structure shown in Figure 1.
(3) silane coupling agent of 1 weight part is dispersed in the thinner (ethyl acetate) of 30 weight parts, then add the electromagnetic shielding filler S1 of 96 weight parts, the film-forming resin (resol) of 100 weight parts and the dispersion agent (organobentonite) of 3 weight parts, stirring obtains the electromagnetic screen coating of the present embodiment, is designated as S10.
Embodiment 2
Adopt the step identical with embodiment 1 to prepare electromagnetic shielding filler S2 and the electromagnetic screen coating S20 of the present embodiment, difference is:
In step (1), adopt the alkali electroless silver plating liquid in alkaline chemical copper plating liquid replacement embodiment 1, the component of alkaline chemical copper plating liquid is: CuSO
45H
2O 0.12mol/L, Na
2EDTA2H
2O 0.14mol/L, formaldehyde 10mg/L, 2,4-DNP 15mg/L, and be 12.5 with NaOH adjusting pH value.
Embodiment 3
Adopt the step identical with embodiment 1 to prepare electromagnetic shielding filler S3 and the electromagnetic screen coating S30 of the present embodiment, difference is:
In step (2), the thickness of electroless plating silver layer is 10 μ m, and quality is 17.50g; The thickness of polyacetylene layer is 5 μ m, and quality is 7.50g.
Embodiment 4
Adopt the step identical with embodiment 2 to prepare the electromagnetic shielding filler S4(structure shown in Figure 2 of the present embodiment) and electromagnetic screen coating S40, difference is:
In step (2), adopting particle diameter is nickel fiber in ferro-aluminum boron magneticalloy particle (100g) alternate embodiment 2 of 20 μ m.
Embodiment 5
Adopt the electromagnetic shielding filler S1 preparation electromagnetic screen coating S50 of the present invention with embodiment 1 preparation, specifically comprise: the silane coupling agent of 1 weight part is dispersed in the thinner (ethyl acetate) of 50 weight parts, then add the electromagnetic shielding filler of 200 weight parts, the resol of 100 weight parts and the dispersion agent (organobentonite) of 5 weight parts, the electromagnetic screen coating S50 that stirs and obtain the present embodiment.
Embodiment 6
Adopt the electromagnetic shielding filler S2 preparation electromagnetic screen coating S60 of the present invention with embodiment 2 preparations, specifically comprise: the silane coupling agent of 1 weight part is dispersed in the thinner (ethyl acetate) of 20 weight parts, then add the electromagnetic shielding filler of 150 weight parts, the resol of 100 weight parts and the dispersion agent (organobentonite) of 5 weight parts, the electromagnetic screen coating S60 that stirs and obtain the present embodiment.
Comparative Examples 1
Adopt the disclosed formula of embodiment 2 and the disclosed preparation method of embodiment 5 in CN101210124A, prepare the electrically conducting coating of this Comparative Examples, be designated as DS10.
Performance test:
1, electromagnetic shielding filler sticking power test:
Adopt the disclosed method of GB/T 9286-1998 to carry out the sticking power test to electromagnetic shielding filler sample S1-S4, test result is as shown in table 1.
Table 1
Packing samples |
S1 |
S2 |
S3 |
S4 |
Sticking power |
|
1 grade |
1 grade |
1 grade |
1 grade |
2, the dispersed test of coating
Adopt the method for GB/T 5540-2007 to carry out the dispersiveness test to electromagnetic screen coating sample S10-S60 and DS10, test result is as shown in table 2.
3, coating volume specific resistance test
Adopt the method for GB/T 16906-1997 to carry out the volume specific resistance test to electromagnetic shielding sample S10-S60 and DS10, test result is as shown in table 2.
4, shielding properties test:
Adopt the method for SJ50524-1995 in 100-1.5 * 10
9In the range of frequency of KHz, electromagnetic shielding sample S10-S60 and DS10 are carried out the capability of electromagnetic shielding test, test result is as shown in table 2.
Table 2
Test result by table 1 can find out, in electromagnetic shielding filler provided by the invention, the first shell, the second shell and kernel have higher sticking power.
Test result by table 2 can be found out, adopts the electromagnetic screen coating of electromagnetic shielding filler provided by the invention to have good dispersing uniformity; The coating volume specific resistance is lower than 104 Ω m, at 100-1.5x10 simultaneously
9In the range of frequency of KHz, electromagnet shield effect is 28-55dB, illustrates that electromagnetic screen coating of the present invention has good capability of electromagnetic shielding.
The above is only preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., within all should being included in protection scope of the present invention.