CN103085466B - For solidifying the mixed wavelengths UV LED light source device of tradition UV ink - Google Patents

For solidifying the mixed wavelengths UV LED light source device of tradition UV ink Download PDF

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Publication number
CN103085466B
CN103085466B CN201310041768.9A CN201310041768A CN103085466B CN 103085466 B CN103085466 B CN 103085466B CN 201310041768 A CN201310041768 A CN 201310041768A CN 103085466 B CN103085466 B CN 103085466B
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wafer
mixed wavelengths
tradition
ink
module
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CN103085466A (en
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唐威
张河生
张春玲
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SHENZHEN LAMPLIC TECHNOLOGY CO LTD
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SHENZHEN LAMPLIC TECHNOLOGY CO LTD
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Abstract

The invention discloses a kind of mixed wavelengths UV LED light source device for solidifying tradition UV ink, UV LED module including mixed wavelengths encapsulation, this module is installed in housing and is connected with metal circuit board radiator, and wafer and a grating mirror of sealing wafer that this module is provided with by pedestal, pedestal are constituted;This module is integration packaging one graduation two optical lens also, this module is formed by UV-365NM wafer, UV-385NM wafer, UV-395NM wafer integration packaging, and according to the ratio integration packaging of 1: 1: 2, described heat dissipation cold plate is formed by the metal circuit board with radiating fin and cover plate pressing, described cover plate is provided with coolant and imports and exports, including 2 imports and two outlets。Which solves the problem solidifying tradition UV ink mixed wavelengths selection and proportioning;Reduce LED module group unit to the thermal resistance between heat dissipation cold plate;Avoid LED junction temperature inequality and cause the unbalanced problem in chip light efficiency and life-span, improve and radiation processes keeps the uniformity of temperature, the uniformity of light source hot spot, and the utilization rate of luminous energy on cold drawing。

Description

For solidifying the mixed wavelengths UV LED light source device of tradition UV ink
Technical field
The invention relates to LED light source, more particularly, it relates to a kind of mixed wavelengths UVLED light supply apparatus for solidifying tradition UV ink。
Background technology
UVLED light source technology, applies in UV glue curing and progressively tends to ripe, and wherein You Duojia China and foreign companies in research and development and has relatively multi-product to come out。
UVLED light source is when cured printing ink, and supporting ink must be the ink that LED is special, it is impossible to use traditional UV ink。But, owing to traditional UV ink is highly developed, traditional UV ink all adopts UVLamp (mercury lamp) to solidify。Therefore how to replace tradition mercury lamp with UVLED by a suitable proportioning, the effect reaching to solidify very well tradition UV ink has become the important topic that those skilled in the art study。
In known general prior art, mostly adopt single wavelength: such as single 365NM, or 385NM, or traditional ink is solidified by 395NM light source。The wherein light source of single 365NM or 385 wavelength, owing to the UVLED wafer photoelectric transformation efficiency of low wavelength is low, therefore light source reaches the electrical power height that solidification effect needs, and therefore system manufacturing cost is very high。And the light source of single 395NM wavelength, although photoelectric transformation efficiency is higher, but it can not simulate the spectrum replacing mercury lamp very well, and no matter how high the illumination of light source have, and solidification effect does not all reach highly desirable, and especially after ink solidification, surface drying and glossiness are bad。
On the thermal resistance of LED to cold drawing controls, it is all after adopting direct and a kind of thin metal circuit board (being usually aluminium base or the copper base of 1-2MM) the directly laminating of LED module, fixed by the end face pressing of heat conductive silica gel and cold drawing and conduct heat, wherein hot layer of silica gel is generally at 0.1-0.2MM, and heat conductivity is typically smaller than 5W/m.K。In superintegrated high-power situation, the thermal resistance of thermal conductive silicon glue-line becomes a bottleneck。
Controlling cold plate temperature basis equalization; mostly adopt single pass refrigerant channel; the temperature difference at cold drawing two ends relatively big (generally having 5 degrees Celsius) would generally be caused, this results in the deviation of LED module group unit light efficiency and life-span deviation relatively big (especially for the light source spot length array light source system more than 300MM)。
In utilization ratio of optical energy and hot spot uniformity, being mostly without secondary light-distribution system, the irradiation aspect ratio of light source is relatively low (usually 3-10MM), and having some systems with secondary light-distribution is then adopt quartz pole or half pole to carry out luminous intensity distribution mostly。
2004, the PCT Patent (publication number: WO2004081475A2) that CONTROLCUREINC [US] applies for also was seeking corresponding problem。In the technical scheme that this patent application is recorded, in wavelength proportioning, the present solution provides a kind of 370NM, 390NM, 400NM, 420NM by 1: 1: 1: 1 mixing match scheme;In heat radiation, the module that this technical scheme encapsulates multiple chips hybrid integrated is pressed on heat dissipation cold plate by heat-conducting silicone grease;In luminous intensity distribution, this technical scheme does not relate to and discloses the technical scheme that the secondary light-distribution of rear end solves。
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of mixed wavelengths UVLED light supply apparatus for solidifying tradition UV ink, which solves the problem solidifying tradition UV ink mixed wavelengths selection and proportioning;Reduce LED module group unit to the thermal resistance between heat dissipation cold plate;Avoid LED junction temperature inequality and cause the unbalanced problem in chip light efficiency and life-span, and improve radiation processes keeps the uniformity of temperature, the uniformity of light source hot spot, and the utilization rate of luminous energy on cold drawing。
It is as described below that the invention solves the technical scheme that its technical problem adopts: a kind of mixed wavelengths UVLED light supply apparatus for solidifying tradition UV ink, UVLED module including mixed wavelengths encapsulation, it is characterized in that, the UVLED module of described mixed wavelengths encapsulation is installed in housing and is connected with metal circuit board radiator, and wafer and the grating mirror sealing wafer that the UVLED module of this mixed wavelengths encapsulation is provided with by pedestal, pedestal are constituted;The UVLED module also integration packaging one graduation two optical lens of this mixed wavelengths encapsulation。
Described wafer is for be formed by UV-365NM wafer, UV-385NM wafer, UV-395NM wafer integration packaging。
Described UV-365NM wafer, UV-385NM wafer, UV-395NM wafer according to 1: 1: 2 ratio integration packaging。
Two long sides of described graduation two optical lens are respectively provided with specular aluminium support。
Described metal circuit board radiator is formed by the metal circuit board with radiating fin and cover plate pressing。
Described cover plate is provided with coolant and imports and exports, and including two imports and two outlets, forms two and flows to contrary runner。
Described graduation two optical lens be shaped as cuboid or rectangular prismoid。
The material of described one-level light-distribution lens is plating ultraviolet anti-reflection film quartz glass or high-boron-silicon glass。
Described housing includes protecgulum and bonnet and metal side cover two pieces symmetrical。
Described protecgulum and bonnet are respectively corresponding U-shaped, each other through draw-in groove snapping。
The invention according to said structure, it has the beneficial effects that:
The present invention passes through the wafer of 365nm, 385nm, 395nm in the ratio integration packaging of 1: 1: 2, effectively simulates the spectrum effects of tradition mercury lamp, has weighed again illuminance, total energy consumption, totle drilling cost factors very well, it is achieved that a best cost performance。Proved by real experiment, solidify tradition UV ink effect very good。
The one side of the fine copper plate that the present invention is utilized in thicker (3-10MM) carries out metallic circuit, and another side carries out heat radiation gear piece by machining, then LED module group unit is fitted on the turmeric pad on metal circuit board again。So can greatly reduce LED module group unit to the thermal resistance between heat dissipation cold plate。
Present invention employs the runner design of two parallel opposed longer sides, can must be assigned on two runners uniform for coolant by diverter, reach at system operation, the effect of each point temperature basis equalization on cold drawing。Thereby may be ensured that the LED junction temperature basis equalization being attached on cold drawing。Effectively eliminate heat radiation bottleneck so that High Density Integration is possibly realized。
Present invention employs a kind of cuboid lens in conjunction with specular aluminium reflector to LED module group unit array luminous intensity distribution。LED module group unit itself is packaged with once light-distribution lens, these lens the chip light emitting Angle ambiguity of 180 degree about 90-120 degree, wherein the light of 0-80 degree is all directly entered cuboid lens, all gets to required luminous intensity distribution position by being totally reflected all of light。And the light of 80-120 degree enters in cuboid lens after first passing through the reflection of specular aluminium reflector, then in cuboid lens, get to required luminous intensity distribution position after total reflection。So that hot spot reaches a good uniformity and a significantly high efficiency of light energy utilization。
Accompanying drawing explanation
Below in conjunction with accompanying drawing and embodiment, the invention is described further。
Fig. 1 is the UVLED modular structure schematic diagram of mixed wavelengths of the present invention encapsulation;
Fig. 2 is wafer plan structure schematic diagram of the present invention;
Fig. 3 is wafer perspective view of the present invention;
Fig. 4 is wafer polycrystalline substance schematic diagram of the present invention;
Fig. 5 is metal circuit board heat spreader metals circuit board structure schematic diagram of the present invention;
Fig. 6 is protecgulum of the present invention assembling structural representation;
Fig. 7 is invention rear cover structure schematic diagram;
Fig. 8 is coolant distribution structure drawing of device of the present invention;
Fig. 9 is front/rear cover attachment structure enlarged drawing of the present invention;
Figure 10 is side-looking structural representation of the present invention;
Figure 11 is Figure 10 C-C to sectional view。
Detailed description of the invention
As shown in Figure 1, a kind of mixed wavelengths UVLED light supply apparatus for solidifying tradition UV ink, UVLED module 1 including mixed wavelengths encapsulation, the UVLED module 1 of mixed wavelengths encapsulation is installed in housing 5, housing 5 includes protecgulum 501 and bonnet 502, protecgulum 501 and bonnet 502 are provided with the draw-in groove worked in coordination, the UVLED module 1 of mixed wavelengths encapsulation is by pedestal 103, wafer 101 and a grating mirror 102 of sealing wafer 101 that pedestal 103 is provided with are constituted, described wafer 101 is by 365NM, 385NM, the wafer 10101 of tri-kinds of wavelength of 395NM, 10103, 10102 is integrated by 1: 1: 2 proportioning。Experimental verification such proportioning integration packaging can effectively solidify various UV ink, it is possible to substitutes UV mercury lamp light source completely, and realizes the highest cost performance。The UVLED module 1 of this mixed wavelengths encapsulation is gone back integration packaging one graduation two optical lens 3 and is all located in protecgulum 501; graduation two optical lens 3 shape can be cuboid or rectangular prismoid; 3 two long sides of graduation two optical lens are respectively arranged with L-type specular aluminium support 4 pressing of L-type; and L-type specular aluminium support 4 can coordinate reflecting condensation as reflector; 3 two short sides of graduation two optical lens are respectively arranged with lens carrier pressing; surrounding also has the first rubber seal 11 to protect pressing, it is prevented that extraneous steam or dust enter。The present invention adopts specular aluminium support 4 to add graduation two optical lens 3 to combine secondary light-distribution system: the angular that the UVLED module 1 of mixed wavelengths encapsulation sends is generally between 90 degree-120 degree, the light (80-120 degree) of wide-angle can not directly be beaten on graduation two optical lens 3, one L-type specular aluminium support 4 is set, it is possible to effectively the light of wide-angle is reflexed on graduation two optical lens 3。The back side of described pedestal 103 is provided with positive and negative electrode pad 105 and heat dissipation bonding pad (turmeric technique) 104, and the UVLED module 1 of mixed wavelengths encapsulation is connected with metal circuit board radiator 2 by positive and negative electrode pad 105。
Described metal circuit board radiator 2 is to do, one piece of high-thermal conductive metal plate one side, the turmeric metal circuit board separated containing thermoelectricity。UVLED module 1 one aspect of such mixed wavelengths encapsulation can be passed through low temperature tin cream and add in heating furnace and be thermally welded on metal circuit board;Another aspect is owing to being equipped with turmeric pad on metal circuit board and on the UVLED module 1 of mixed wavelengths encapsulation, and the extraordinary nanometre glue that therefore can pass through some high thermal conductivity coefficient is bonding by both。Described metal circuit board another side is provided with radiating fin, it is possible to according to light source size and thermal power densities, be processed into abundant heat exchange surface area, is then tightened to a heat exchanger having two autonomous channels with sealing ring and cover screw。Described metal circuit board radiator is formed by metal circuit board and cover plate pressing, and described cover plate is provided with coolant and imports and exports, and including two imports and two outlets, forms two and flows to contrary runner。
Present invention additionally comprises coolant distribution device, comprise pipeline 9, twist 8 soon, shunt body 6, fluid quick joint 10, coolant import and export temperature sensor 7 etc.。Coolant enters shunt body 6 from A, is divided into two tributaries of A1, A2, then out enters back into from B2, B1 mouth after heat absorption and flows out from B mouth after shunt body 6 is converged。A, B two mouthfuls external industry cold water or cooling air circulation system。

Claims (4)

1. the mixed wavelengths UVLED light supply apparatus being used for solidifying tradition UV ink, UVLED module including mixed wavelengths encapsulation, it is characterized in that, the UVLED module of described mixed wavelengths encapsulation is installed in housing and is connected with metal circuit board radiator, and wafer and the grating mirror sealing wafer that the UVLED module of this mixed wavelengths encapsulation is provided with by pedestal, pedestal are constituted;The UVLED module also integration packaging one graduation two optical lens of this mixed wavelengths encapsulation, described wafer is by UV-365NM wafer, UV-385NM wafer, UV-395NM wafer integration packaging forms, two long sides of described graduation two optical lens are respectively provided with specular aluminium support, described metal circuit board radiator is formed by the metal circuit board with radiating fin and cover plate pressing, described graduation two optical lens be shaped as cuboid or rectangular prismoid, described cover plate is provided with coolant and imports and exports, including two imports and two outlets, form two and flow to contrary runner, the material of described one-level light-distribution lens is plating ultraviolet anti-reflection film quartz glass or high-boron-silicon glass。
2. according to claim 1 for solidify tradition UV ink mixed wavelengths UVLED light supply apparatus, it is characterised in that described UV-365NM wafer, UV-385NM wafer, UV-395NM wafer according to 1: 1: 2 ratio integration packaging。
3. the mixed wavelengths UVLED light supply apparatus for solidifying tradition UV ink according to claim 1, it is characterised in that described housing includes protecgulum and bonnet and metal side cover two pieces symmetrical。
4. the mixed wavelengths UVLED light supply apparatus for solidifying tradition UV ink according to claim 3, it is characterised in that described protecgulum and bonnet are respectively corresponding U-shaped, each other through draw-in groove snapping。
CN201310041768.9A 2013-02-04 2013-02-04 For solidifying the mixed wavelengths UV LED light source device of tradition UV ink Active CN103085466B (en)

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10094613B2 (en) 2017-01-23 2018-10-09 PlayNitride Inc. Ultraviolet curing module
CN107191794B (en) * 2017-06-01 2020-02-07 深圳市华星光电技术有限公司 Lamp set
CN111230511B (en) * 2020-03-16 2020-11-03 深圳市源铭科技有限公司 UVLED module and production equipment thereof
CN112172337A (en) * 2020-10-09 2021-01-05 广州巍泰机电有限公司 LED equipment of dry tradition UV china ink

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US6331111B1 (en) * 1999-09-24 2001-12-18 Cao Group, Inc. Curing light system useful for curing light activated composite materials
CN1485013A (en) * 2002-09-29 2004-03-31 曹殿生 Semi-conductor luminous tube light-solidified lamp
CN1976953A (en) * 2004-01-07 2007-06-06 肯特治疗股份有限公司 UV curing method and device
CN202082746U (en) * 2011-05-23 2011-12-21 江苏承煦照明电气有限公司 Led light source module
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