CN103085466A - Hybrid wavelength ultraviolet (UV) light-emitting diode (LED) light source device for solidifying traditional UV printing ink - Google Patents
Hybrid wavelength ultraviolet (UV) light-emitting diode (LED) light source device for solidifying traditional UV printing ink Download PDFInfo
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- CN103085466A CN103085466A CN2013100417689A CN201310041768A CN103085466A CN 103085466 A CN103085466 A CN 103085466A CN 2013100417689 A CN2013100417689 A CN 2013100417689A CN 201310041768 A CN201310041768 A CN 201310041768A CN 103085466 A CN103085466 A CN 103085466A
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Abstract
The invention discloses a hybrid wavelength ultraviolet (UV) light-emitting diode (LED) light source device for solidifying traditional UV printing ink. The hybrid wavelength UV LED light source device comprises packaged hybrid wavelength UV LED modules which are arranged in a shell body and connected with a metal circuit board radiator. Each packaged hybrid wavelength UV LED module is formed by a substrate, wafers arranged on the substrate, and a primary light distribution lens for sealing the wafers. The packaged hybrid wavelength UV LED module further integrates and packages a secondary light distribution lens. Each hybrid wavelength UV LED module is formed by a UV-365NM wafer, a UV-385NM wafer and a UV-395NM wafer in an integrated and packaged mode according to the proportion of 1:1:2. A radiating cold plate is formed by a metal circuit board with heat dissipation fins and a cover plate in a press fit mode. Two coolant inlets and two coolant outlets are arranged in the cover plate. The hybrid wavelength UV LED light source device solves the problems of hybrid wavelength selecting and proportioning in solidifying the traditional UV printing ink, reduces thermal resistance from an LED module unit to the radiating cold plate, avoids the problems that light effects and service life of chips are unbalanced due to uneven junction temperature of LEDs, and improves temperature uniformity of the cold plate, uniformity of light spots of a light source and utilization rate of light energy in the radiating process.
Description
Technical field
The invention relates to LED light source, more particularly, relates to a kind of mixed wavelengths UV LED light source device be used to solidifying traditional UV printing ink.
Background technology
UV LED light source technology is used on the UV glue curing and progressively has been tending towards ripe, wherein has many China and foreign companies to come out researching and developing and have than multi-product.
The UV LED light source is in the time of cured printing ink, and supporting printing ink must be the printing ink of LED special use, can not use traditional UV printing ink.But because traditional UV printing ink is very ripe, traditional UV printing ink all adopts UV Lamp (mercury lamp) to be cured.Therefore how to replace traditional mercury lamp with UV LED by a suitable proportioning, the effect that reaches the traditional UV printing ink of fine curing has become the important topic of those skilled in the art's research.
In known general prior art, mostly adopt single wavelength: such as single 365NM, perhaps 385NM, perhaps the 395NM light source is cured traditional printing ink.Single light source with 365NM or 385 wavelength wherein, because the UV LED wafer photoelectric transformation efficiency of low wavelength is low, so light source to reach the electrical power that solidification effect needs high, so system's manufacturing cost is very high.And single light source with the 395NM wavelength, although photoelectric transformation efficiency is higher, it can not fine simulation replaces the spectrum of mercury lamp, how high no matter the illumination of light source has, it is very desirable that solidification effect does not all reach, and especially after ink solidification, surface drying and glossiness are bad.
Control to the thermal resistance of cold drawing at LED, all after adopting the LED module directly directly to fit with a kind of thin metal circuit board (the normally aluminium base of 1-2MM or copper base), end face pressing by heat conductive silica gel and cold drawing is fixedly conducted heat, wherein hot layer of silica gel is usually at 0.1-0.2MM, and thermal conductivity factor is usually less than 5W/m.K.In superintegrated high-power situation, the thermal resistance of thermal conductive silicon glue-line becomes a bottleneck.
Controlling cold drawing temperature basis equalization; mostly adopt single pass refrigerant channel; the temperature difference that usually can cause cold drawing two ends is large (having 5 degrees centigrade) usually, and this has brought the deviation of LED module group unit light efficiency and life-span deviation large (particularly for the array light source system of light source hot spot length greater than 300MM).
In utilization ratio of optical energy and hot spot uniformity, be not to be with the secondary light-distribution system mostly, the irradiation aspect ratio of light source lower (normally 3-10MM) has some systems with secondary light-distribution to adopt quartzy pole or half pole to carry out luminous intensity distribution.
, CON TROL CURE INC[US in 2004] a PCT patent (publication number: WO2004081475A2) also seeking corresponding problem of application.In the technical scheme of this patent application record, on the wavelength proportioning, this technical scheme provides a kind of 370NM, 390NM, and 400NM, 420NM was by 1: 1: 1: 1 mixing match scheme; Aspect heat radiation, this technical scheme presses to the module of multiple chips mixing integration packaging on heat dissipation cold plate by heat-conducting silicone grease; Aspect luminous intensity distribution, this technical scheme does not relate to and discloses the technical scheme of the secondary light-distribution solution of rear end.
Summary of the invention
The technical problem to be solved in the present invention is, a kind of mixed wavelengths UV LED light source device be used to solidifying traditional UV printing ink is provided, this device solves solidify that traditional UV printing ink mixed wavelengths is selected and the problem of proportioning; Reduced the LED module group unit to the thermal resistance between heat dissipation cold plate; Avoid LED junction temperature inequality to cause the unbalanced problem in chip light efficiency and life-span, and improved the uniformity that keeps temperature on cold drawing in the heat radiation process, the uniformity of light source hot spot, and the utilization rate of luminous energy.
It is as described below that the invention solves the technical scheme that its technical problem adopts: a kind of mixed wavelengths UV LED light source device be used to solidifying traditional UV printing ink, the UV LED module that comprises the mixed wavelengths encapsulation, it is characterized in that, the UV LED module of described mixed wavelengths encapsulation is installed in housing and is connected with the metal circuit board radiator, and the wafer that the UV LED module of this mixed wavelengths encapsulation is provided with by pedestal, pedestal and a grating mirror that seals wafer consist of; The UV LED module of this mixed wavelengths encapsulation is integration packaging one secondary light-distribution lens also.
Described wafer is for to be formed by UV-365NM wafer, UV-385NM wafer, UV-395NM wafer integration packaging.
Described UV-365NM wafer, UV-385NM wafer, UV-395NM wafer were according to the ratio integration packaging of 1: 1: 2.
Two long sides of described secondary light-distribution lens respectively are provided with the specular aluminium support.
Described metal circuit board radiator is formed by metal circuit board and the cover plate pressing with radiating fin.
Described cover plate is provided with refrigerant and imports and exports, and comprises two imports and two outlets, forms two and flows to opposite runner.
Described secondary light-distribution lens be shaped as cuboid or rectangular prismoid.
The material of described one-level light-distribution lens is plating ultraviolet anti-reflection film quartz glass or high-boron-silicon glass.
Described shell comprises protecgulum and bonnet, and the metal side cover of two symmetries.
Described protecgulum and bonnet are respectively the U-shaped of correspondence, each other through the draw-in groove snapping.
According to the invention of said structure, its beneficial effect is:
The present invention is by with 365nm, 385nm, and the wafer of 395nm has effectively been simulated the spectrum effects of traditional mercury lamp in the ratio integration packaging of 1: 1: 2, has finely again weighed illuminance, total energy consumption, totle drilling cost factors, has realized the cost performance an of the best.Prove by real experiment, solidify traditional UV printing ink effect very good.
The present invention adopts in the one side of the fine copper plate of thicker (3-10MM) to carry out metallic circuit, and another side is carried out the heat radiation gear piece by machining, and then the LED module group unit is fitted on turmeric pad on metal circuit board.Can greatly reduce like this LED module group unit to the thermal resistance between heat dissipation cold plate.
The present invention has adopted the runner design of two parallel opposed longer sides, can must be assigned on two runners refrigerant is even by current divider, reaches in the time of system works the effect of each point temperature basis equalization on cold drawing.Thereby can guarantee to be attached to the LED junction temperature basis equalization on cold drawing.Effectively eliminate the heat radiation bottleneck, made High Density Integration become possibility.
The present invention adopted a kind of cuboid lens in conjunction with the specular aluminium reflector to LED module group unit array luminous intensity distribution.The LED module group unit itself is packaged with once light-distribution lens, these lens have been controlled at the chip light emitting angle of 180 degree about the 90-120 degree, wherein the light of 0-80 degree all directly enters the cuboid lens, all gets to required luminous intensity distribution position by all light of total reflection.And then the light of 80-120 degree get to required luminous intensity distribution position first through entering in the cuboid lens after the reflection of specular aluminium reflector after total reflection in the cuboid lens.Thereby make hot spot reach a good uniformity and a very high efficiency of light energy utilization.
Description of drawings
Below in conjunction with accompanying drawing and embodiment, the invention is described further.
Fig. 1 is the UV LED modular structure schematic diagram of mixed wavelengths encapsulation of the present invention;
Fig. 2 is wafer plan structure schematic diagram of the present invention;
Fig. 3 is wafer perspective view of the present invention;
Fig. 4 is wafer polycrystalline substance schematic diagram of the present invention;
Fig. 5 is metal circuit board radiator metal circuit board structural representation of the present invention;
Fig. 6 is protecgulum assembly structure schematic diagram of the present invention;
Fig. 7 is rear cover structure schematic diagram of the present invention;
Fig. 8 is coolant distribution structure drawing of device of the present invention;
Fig. 9 is front/rear cover syndeton enlarged drawing of the present invention;
Figure 10 is side-looking structural representation of the present invention;
Figure 11 is that Figure 10 C-C is to cutaway view.
The specific embodiment
as shown in Figure 1, a kind of mixed wavelengths UV LED light source device be used to solidifying traditional UV printing ink, the UV LED module 1 that comprises the mixed wavelengths encapsulation, the UV LED module 1 of mixed wavelengths encapsulation is installed in shell 5, shell 5 comprises protecgulum 501 and bonnet 502, protecgulum 501 and bonnet 502 are provided with the draw-in groove of working in coordination, the UV LED module 1 of mixed wavelengths encapsulation is by pedestal 103, one grating mirror 102 of the wafer 101 that pedestal 103 is provided with and sealing wafer 101 consists of, described wafer 101 is by 365NM, 385NM, the wafer 10101 of three kinds of wavelength of 395NM, 10103, 10102 is integrated by 1: 1: 2 proportioning.The such proportioning integration packaging of experimental verification can effectively solidify various UV printing ink, can substitute the UV mercury lamp light source fully, and realizes the highest cost performance.The UV LED module 1 of this mixed wavelengths encapsulation is gone back integration packaging one secondary light-distribution lens 3 and all is located in protecgulum 501; secondary light-distribution lens 3 shapes can be cuboid or rectangular prismoid; 3 two long sides of secondary light-distribution lens respectively have L-type specular aluminium support 4 pressings of L-type; and L-type specular aluminium support 4 can coordinate reflecting condensation as reflector; 3 two short sides of secondary light-distribution lens respectively have the lens carrier pressing; surrounding also has the first rubber seal 11 protection pressings, prevents that extraneous steam or dust from entering.The present invention adopts specular aluminium support 4 to add secondary light-distribution lens 3 associating secondary light-distribution system: the optic angle degree that the UV LED module 1 of mixed wavelengths encapsulation sends is usually between 90 degree-120 degree, the light of wide-angle (80-120 degree) can not directly be beaten on 3 of secondary light-distribution lens, one L-type specular aluminium support 4 is set, can be effectively the light reflection of wide-angle to secondary light-distribution lens 3.The back side of described pedestal 103 is provided with positive and negative electrode pad 105 and heat dissipation bonding pad (turmeric technique) 104, and the UV LED module 1 of mixed wavelengths encapsulation is connected with metal circuit board radiator 2 by positive and negative electrode pad 105.
Described metal circuit board radiator 2 is simultaneously to do at a high-thermal conductive metal plate to contain the turmeric metal circuit board that thermoelectricity separates.The UV LED module 1 of mixed wavelengths encapsulation can be received on metal circuit board by low temperature tin cream heating welding in heating furnace on the one hand like this; On the other hand owing to being equipped with the turmeric pad on metal circuit board and on the UV LED module 1 of mixed wavelengths encapsulation, the nanometre glue of special type that therefore can be by some high thermal conductivity coefficient is bonding with both.Described metal circuit board another side is provided with radiating fin, can be processed into abundant heat transfer sheet area according to light source size and thermal power density, then is tightened to a heat exchanger that two autonomous channels are arranged with sealing ring and cover screw.Described metal circuit board radiator is formed by metal circuit board and cover plate pressing, and described cover plate is provided with refrigerant and imports and exports, and comprises two imports and two outlets, forms two and flows to opposite runner.
The present invention also comprises the coolant distribution device, comprises pipeline 9, twists 8 soon, current divider main body 6, fluid quick joint 10, refrigerant import and export temperature sensor 7 etc.Refrigerant enters current divider main body 6 from A, is divided into A1, A2 two tributaries, then after the heat absorption from B2, the B1 mouth out enters again and flows out from the B mouth after current divider main body 6 is converged.A, two mouthfuls of external industrial cold water of B or cooling air circulation system.
Claims (10)
1. mixed wavelengths UV LED light source device that is used for solidifying traditional UV printing ink, the UV LED module that comprises the mixed wavelengths encapsulation, it is characterized in that, the UV LED module of described mixed wavelengths encapsulation is installed in housing and is connected with the metal circuit board radiator, and the wafer that the UV LED module of this mixed wavelengths encapsulation is provided with by pedestal, pedestal and a grating mirror that seals wafer consist of; The UV LED module of this mixed wavelengths encapsulation is integration packaging one secondary light-distribution lens also.
2. the mixed wavelengths UV LED light source device be used to solidifying traditional UV printing ink according to claim 1, is characterized in that, described wafer is for to be formed by UV-365NM wafer, UV-385NM wafer, UV-395NM wafer integration packaging.
3. the mixed wavelengths UV LED light source device be used to solidifying traditional UV printing ink according to claim 2, is characterized in that, described UV-365NM wafer, UV-385NM wafer, UV-395NM wafer were according to the ratio integration packaging of 1: 1: 2.
4. the mixed wavelengths UV LED light source device be used to solidifying traditional UV printing ink according to claim 1, is characterized in that, two long sides of described secondary light-distribution lens respectively are provided with the specular aluminium support.
5. the mixed wavelengths UV LED light source device be used to solidifying traditional UV printing ink according to claim 1, is characterized in that, described metal circuit board radiator is formed by metal circuit board and the cover plate pressing with radiating fin.
6. the mixed wavelengths UV LED light source device be used to solidifying traditional UV printing ink according to claim 5, is characterized in that, described cover plate is provided with refrigerant and imports and exports, and comprises two imports and two outlets, forms two and flows to opposite runner.
7. the mixed wavelengths UV LED light source device be used to solidifying traditional UV printing ink according to claim 1, is characterized in that, described secondary light-distribution lens be shaped as cuboid or rectangular prismoid.
8. the mixed wavelengths UV LED light source device be used to solidifying traditional UV printing ink according to claim 1, is characterized in that, the material of described one-level light-distribution lens is plating ultraviolet anti-reflection film quartz glass or high-boron-silicon glass.
9. the mixed wavelengths UV LED light source device be used to solidifying traditional UV printing ink according to claim 1, is characterized in that, described shell comprises protecgulum and bonnet, and the metal side cover of two symmetries.
10. the mixed wavelengths UV LED light source device be used to solidifying traditional UV printing ink according to claim 9, is characterized in that, described protecgulum and bonnet are respectively the U-shaped of correspondence, each other through the draw-in groove snapping.
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| CN201310041768.9A CN103085466B (en) | 2013-02-04 | 2013-02-04 | For solidifying the mixed wavelengths UV LED light source device of tradition UV ink |
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| CN201310041768.9A CN103085466B (en) | 2013-02-04 | 2013-02-04 | For solidifying the mixed wavelengths UV LED light source device of tradition UV ink |
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| CN103085466B CN103085466B (en) | 2016-06-22 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107191794A (en) * | 2017-06-01 | 2017-09-22 | 深圳市华星光电技术有限公司 | A kind of light fixture |
| TWI616614B (en) * | 2017-01-23 | 2018-03-01 | 錼創科技股份有限公司 | Ultraviolet curing module |
| CN111230511A (en) * | 2020-03-16 | 2020-06-05 | 深圳市源铭科技有限公司 | UVLED module and production equipment thereof |
| CN112172337A (en) * | 2020-10-09 | 2021-01-05 | 广州巍泰机电有限公司 | LED equipment of dry tradition UV china ink |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6331111B1 (en) * | 1999-09-24 | 2001-12-18 | Cao Group, Inc. | Curing light system useful for curing light activated composite materials |
| CN1485013A (en) * | 2002-09-29 | 2004-03-31 | 曹殿生 | Semi-conductor luminous tube light-solidified lamp |
| CN1976953A (en) * | 2004-01-07 | 2007-06-06 | 肯特治疗股份有限公司 | UV curing method and device |
| CN202082746U (en) * | 2011-05-23 | 2011-12-21 | 江苏承煦照明电气有限公司 | Led light source module |
| CN202167489U (en) * | 2011-08-11 | 2012-03-14 | 深圳市蓝谱里克科技有限公司 | Chip on board (COB) matrix packaging structure of large power light-emitting diode (LED) |
| CN202501237U (en) * | 2012-02-08 | 2012-10-24 | 杭州杭贝科技有限公司 | LED modular waterproof illuminating light |
| CN202546308U (en) * | 2011-10-24 | 2012-11-21 | 宁波市佰仕电器有限公司 | Thermoelectric separation LED (light-emitting diode) |
| CN202629643U (en) * | 2012-04-19 | 2012-12-26 | 董力刚 | LED (light-emitting diode) lamp structure |
| CN102878455A (en) * | 2012-09-06 | 2013-01-16 | 青岛市灯具二厂 | Intelligent semiconductor heat radiating LED (light-emitting diode) lamp |
| CN202712182U (en) * | 2012-06-20 | 2013-01-30 | 钟才华 | LED COB light source packaging structure with high light efficiency and heat conduction |
| CN203110513U (en) * | 2013-02-04 | 2013-08-07 | 深圳市蓝谱里克科技有限公司 | Mixed-wavelength ultraviolet light-emitting diode (UV LED) light source device for solidifying traditional UV printing ink |
-
2013
- 2013-02-04 CN CN201310041768.9A patent/CN103085466B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6331111B1 (en) * | 1999-09-24 | 2001-12-18 | Cao Group, Inc. | Curing light system useful for curing light activated composite materials |
| CN1485013A (en) * | 2002-09-29 | 2004-03-31 | 曹殿生 | Semi-conductor luminous tube light-solidified lamp |
| CN1976953A (en) * | 2004-01-07 | 2007-06-06 | 肯特治疗股份有限公司 | UV curing method and device |
| CN202082746U (en) * | 2011-05-23 | 2011-12-21 | 江苏承煦照明电气有限公司 | Led light source module |
| CN202167489U (en) * | 2011-08-11 | 2012-03-14 | 深圳市蓝谱里克科技有限公司 | Chip on board (COB) matrix packaging structure of large power light-emitting diode (LED) |
| CN202546308U (en) * | 2011-10-24 | 2012-11-21 | 宁波市佰仕电器有限公司 | Thermoelectric separation LED (light-emitting diode) |
| CN202501237U (en) * | 2012-02-08 | 2012-10-24 | 杭州杭贝科技有限公司 | LED modular waterproof illuminating light |
| CN202629643U (en) * | 2012-04-19 | 2012-12-26 | 董力刚 | LED (light-emitting diode) lamp structure |
| CN202712182U (en) * | 2012-06-20 | 2013-01-30 | 钟才华 | LED COB light source packaging structure with high light efficiency and heat conduction |
| CN102878455A (en) * | 2012-09-06 | 2013-01-16 | 青岛市灯具二厂 | Intelligent semiconductor heat radiating LED (light-emitting diode) lamp |
| CN203110513U (en) * | 2013-02-04 | 2013-08-07 | 深圳市蓝谱里克科技有限公司 | Mixed-wavelength ultraviolet light-emitting diode (UV LED) light source device for solidifying traditional UV printing ink |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI616614B (en) * | 2017-01-23 | 2018-03-01 | 錼創科技股份有限公司 | Ultraviolet curing module |
| US10094613B2 (en) | 2017-01-23 | 2018-10-09 | PlayNitride Inc. | Ultraviolet curing module |
| CN107191794A (en) * | 2017-06-01 | 2017-09-22 | 深圳市华星光电技术有限公司 | A kind of light fixture |
| CN111230511A (en) * | 2020-03-16 | 2020-06-05 | 深圳市源铭科技有限公司 | UVLED module and production equipment thereof |
| CN111230511B (en) * | 2020-03-16 | 2020-11-03 | 深圳市源铭科技有限公司 | UVLED module and production equipment thereof |
| CN112172337A (en) * | 2020-10-09 | 2021-01-05 | 广州巍泰机电有限公司 | LED equipment of dry tradition UV china ink |
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| CN103085466B (en) | 2016-06-22 |
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