CN103037624A - Method of eliminating electroplate lead on ceramic substrate - Google Patents
Method of eliminating electroplate lead on ceramic substrate Download PDFInfo
- Publication number
- CN103037624A CN103037624A CN2011103017782A CN201110301778A CN103037624A CN 103037624 A CN103037624 A CN 103037624A CN 2011103017782 A CN2011103017782 A CN 2011103017782A CN 201110301778 A CN201110301778 A CN 201110301778A CN 103037624 A CN103037624 A CN 103037624A
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- CN
- China
- Prior art keywords
- lead wire
- electroplate lead
- ceramic substrate
- laser
- electroplate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 26
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 41
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 13
- 239000010931 gold Substances 0.000 claims description 13
- 229910052737 gold Inorganic materials 0.000 claims description 13
- 238000000608 laser ablation Methods 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 238000003698 laser cutting Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Abstract
The invention applies to the technical field of laser processing and provides a method of eliminating a electroplate lead on a ceramic substrate. The method of eliminating the electroplate lead on the ceramic substrate includes the following steps of eliminating a gold-plating layer which is arranged on the electroplate lead through the laser and eliminating the electroplate lead. The method of eliminating the electroplate lead on the ceramic substrate eliminates the gold-plating layer which is arranged on the electroplate lead through the laser and then eliminates the electroplate lead. The ceramic substrate is not scratched and product quality is greatly improved.
Description
Technical field
The invention belongs to technical field of laser processing, relate in particular to a kind of method of removing electroplate lead wire on the ceramic substrate.
Background technology
That ceramic substrate has is high temperature resistant, electrical insulation capability is good, dielectric constant and dielectric loss is low, thermal conductivity is large, chemical stability is good, the major advantage such as close with the thermal coefficient of expansion of element, but ceramic substrate is more crisp, and the chip area of making is less, and cost is high.In the making of wiring board, electroplate lead wire is that one whole product connects the one section circuit (the circuit material is copper) between each miscellaneous goods in gold-plated, so that electric current can pass through each miscellaneous goods when whole product is gold-plated, make whole product plated with gold, the recycling grinding tool thrusts electroplate lead wire after the whole operation of finishing the wiring board making at last, and in the making of part ceramic substrate, also can relate to the removal electroplate lead wire, ceramic wafer just can't thrust electroplate lead wire with grinding tool because material is very crisp.The artificial method of general employing is peeled electroplate lead wire off with blade under magnifying glass, and can scratch ceramic substrate this moment, so that cause damage.
Summary of the invention
The purpose of the embodiment of the invention is to provide a kind of method of removing electroplate lead wire on the ceramic substrate, is intended to solve the problem that existing method can scratch ceramic substrate.
The embodiment of the invention is achieved in that a kind of method of removing electroplate lead wire on the ceramic substrate, may further comprise the steps:
By the Gold plated Layer on the laser ablation electroplate lead wire;
Remove described electroplate lead wire.
The embodiment of the invention is removed electroplate lead wire more first by the Gold plated Layer on the laser ablation electroplate lead wire, can not scratch ceramic substrate like this, has greatly promoted product quality.
Description of drawings
Fig. 1 is the realization flow figure of electroplate lead wire on the removal ceramic substrate that provides of the embodiment of the invention.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
The embodiment of the invention is removed electroplate lead wire more first by the Gold plated Layer on the laser ablation electroplate lead wire, can not scratch ceramic substrate like this, has greatly promoted product quality.
Be described in detail below in conjunction with the realization of specific embodiment to invention.
Fig. 1 shows the realization flow of electroplate lead wire on the removal ceramic substrate that the embodiment of the invention provides, and details are as follows:
In step S101, by the Gold plated Layer on the laser ablation electroplate lead wire;
Laser is produced by ultraviolet laser cutting machine tool in the embodiment of the invention, and its centre wavelength is 355nm.This length ultraviolet laser energy is large, and suitable each heavy metal species of processing is such as gold.
At first, produce corresponding procedure according to position and the shape of electroplate lead wire to be removed; Then, ceramic substrate to be processed is placed on the table top of laser cutting machine, by the CCD of laser cutting machine target is taken the location, make procedure corresponding to the ceramic substrate on the table top; Then, adjust the focal height of laser beam, its focus is positioned on the electroplate lead wire to be removed, adjust the laser processing technology parameter, the Gold plated Layer on the electroplate lead wire is removed.
Wherein, procedure has an outline line that is covered with described laser scanning track, and adjacent laser scanning track spacing is half of its spot diameter.For example, when spot diameter was 20um, owing to a little less than the energy of energy than the center at hot spot edge, so the distance between the track is smaller, at this interval is set as 10um, with faster removal Gold plated Layer, and effect was good.
In step S102, remove electroplate lead wire.
Usually, electroplate lead wire is the copper lead-in wire, is easy to etching, thereby adopts etching method that electroplate lead wire is disposed.Particularly, prior to laminating film on the ceramic substrate, and carry out exposure-processed; To the exposure after ceramic substrate develop, etching, thereby etch away electroplate lead wire.Can't etch gold because etching solution copper can only be etched away, so first by the Gold plated Layer on the laser ablation electroplate lead wire.
In addition, owing to lamination, exposure, development, etching are maturation process, formed automatic production line.Compare manually and process with blade, efficient significantly improves, and can not scratch ceramic substrate.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. a method of removing electroplate lead wire on the ceramic substrate is characterized in that, said method comprising the steps of:
By the Gold plated Layer on the laser ablation electroplate lead wire;
Remove described electroplate lead wire.
2. the method for electroplate lead wire on the removal ceramic substrate as claimed in claim 1 is characterized in that, described electroplate lead wire is etched away.
3. the method for electroplate lead wire on the removal ceramic substrate as claimed in claim 2 is characterized in that the described step that described electroplate lead wire is etched away is specially:
Laminating film on described ceramic substrate, and carry out exposure-processed;
To the exposure after ceramic substrate develop, etching, etch away described electroplate lead wire.
4. such as the method for electroplate lead wire on claim 1, the 2 or 3 described removal ceramic substrates, it is characterized in that described laser is produced by ultraviolet laser cutting machine tool, its centre wavelength is 355nm.
5. the method for electroplate lead wire on the removal ceramic substrate as claimed in claim 4 is characterized in that described step by the Gold plated Layer on the laser ablation electroplate lead wire is specially:
Position and shape according to electroplate lead wire to be removed are produced corresponding procedure;
Ceramic substrate to be processed is placed on the table top of described laser cutting machine, by the CCD of described laser cutting machine target is taken the location, make described procedure corresponding to the ceramic substrate on the table top;
Adjust the focal height of laser beam, its focus is positioned on the electroplate lead wire described to be removed, adjust the laser processing technology parameter, the Gold plated Layer on the described electroplate lead wire is removed.
6. the method for electroplate lead wire on the removal ceramic substrate as claimed in claim 5 is characterized in that, described procedure has an outline line that is covered with described laser scanning track, and adjacent laser scanning track spacing is half of its spot diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110301778.2A CN103037624B (en) | 2011-10-09 | 2011-10-09 | Method of eliminating electroplate lead on ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110301778.2A CN103037624B (en) | 2011-10-09 | 2011-10-09 | Method of eliminating electroplate lead on ceramic substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103037624A true CN103037624A (en) | 2013-04-10 |
| CN103037624B CN103037624B (en) | 2015-06-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110301778.2A Active CN103037624B (en) | 2011-10-09 | 2011-10-09 | Method of eliminating electroplate lead on ceramic substrate |
Country Status (1)
| Country | Link |
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| CN (1) | CN103037624B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106695121A (en) * | 2017-01-09 | 2017-05-24 | 上海交通大学 | Cladding layer removing device and method through laser melting assisted by compressed air |
| CN109686514A (en) * | 2018-12-24 | 2019-04-26 | 河北中瓷电子科技有限公司 | Ceramic insulator route coating method |
| CN110091069A (en) * | 2019-04-09 | 2019-08-06 | 大族激光科技产业集团股份有限公司 | Laser strip method |
| CN111315148A (en) * | 2020-02-27 | 2020-06-19 | 惠州中京电子科技有限公司 | Rework method for gold plating plate or gold plating plate lead metal infiltration short circuit |
| CN112218437A (en) * | 2020-10-19 | 2021-01-12 | 西安空间无线电技术研究所 | Method for removing electroplating connection line of thin film circuit pattern |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001073154A (en) * | 1999-09-06 | 2001-03-21 | Hitachi Cable Ltd | Production of partially plated plastic molding |
| US6660559B1 (en) * | 2001-06-25 | 2003-12-09 | Amkor Technology, Inc. | Method of making a chip carrier package using laser ablation |
| CN102014580A (en) * | 2010-11-24 | 2011-04-13 | 深南电路有限公司 | Manufacturing technology of whole-plate gold-plated plate |
-
2011
- 2011-10-09 CN CN201110301778.2A patent/CN103037624B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001073154A (en) * | 1999-09-06 | 2001-03-21 | Hitachi Cable Ltd | Production of partially plated plastic molding |
| US6660559B1 (en) * | 2001-06-25 | 2003-12-09 | Amkor Technology, Inc. | Method of making a chip carrier package using laser ablation |
| CN102014580A (en) * | 2010-11-24 | 2011-04-13 | 深南电路有限公司 | Manufacturing technology of whole-plate gold-plated plate |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106695121A (en) * | 2017-01-09 | 2017-05-24 | 上海交通大学 | Cladding layer removing device and method through laser melting assisted by compressed air |
| CN109686514A (en) * | 2018-12-24 | 2019-04-26 | 河北中瓷电子科技有限公司 | Ceramic insulator route coating method |
| CN110091069A (en) * | 2019-04-09 | 2019-08-06 | 大族激光科技产业集团股份有限公司 | Laser strip method |
| CN110091069B (en) * | 2019-04-09 | 2021-09-24 | 大族激光科技产业集团股份有限公司 | Laser deplating method |
| CN111315148A (en) * | 2020-02-27 | 2020-06-19 | 惠州中京电子科技有限公司 | Rework method for gold plating plate or gold plating plate lead metal infiltration short circuit |
| CN112218437A (en) * | 2020-10-19 | 2021-01-12 | 西安空间无线电技术研究所 | Method for removing electroplating connection line of thin film circuit pattern |
| CN112218437B (en) * | 2020-10-19 | 2022-06-03 | 西安空间无线电技术研究所 | Method for removing electroplating connection line of thin film circuit pattern |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103037624B (en) | 2015-06-03 |
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Address after: 518000 Shenzhen Province, Nanshan District high tech park, North West New Road, No. 9 Applicant after: HANS LASER TECHNOLOGY INDUSTRY GROUP CO., LTD. Applicant after: Shenzhen Dazu Digital Control Science & Technology Co., Ltd. Address before: 518000 Shenzhen Province, Nanshan District high tech park, North West New Road, No. 9 Applicant before: Dazu Laser Sci. & Tech. Co., Ltd., Shenzhen Applicant before: Shenzhen Dazu Digital Control Science & Technology Co., Ltd. |
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Effective date of registration: 20200628 Address after: 518000 workshop 5 / F, 1 / 2 / F, 14 / F, 17 / F, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Address before: 518000 No. 9 West West Road, Nanshan District hi tech park, Shenzhen, Guangdong Co-patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
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Address after: 518000 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's CNC Technology Co.,Ltd. Address before: 518000 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. |