CN103033277B - Device and method for evaluating relation of interface temperature and interface heat exchange coefficient - Google Patents
Device and method for evaluating relation of interface temperature and interface heat exchange coefficient Download PDFInfo
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- CN103033277B CN103033277B CN201210521048.8A CN201210521048A CN103033277B CN 103033277 B CN103033277 B CN 103033277B CN 201210521048 A CN201210521048 A CN 201210521048A CN 103033277 B CN103033277 B CN 103033277B
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Abstract
Provided is a device for evaluating relation of interface temperature and an interface heat exchange coefficient between a die and a sample in a hot stamping process. The device for evaluating the relation of the interface temperature and the interface heat exchange coefficient comprises a cooling device, a sample fixing device, a temperature detecting device and a data processing system. The cooling device comprises an upper tool and a lower tool, the sample fixing device is arranged on the upper surface of the upper tool, and the temperature detecting device is arranged on one side, close to the upper tool, of the sample fixing device. A plurality of support poles are arranged inside the upper tool, the cavities among the support poles are cooling water channels, and the cooling water channels are connected with a cooling water inlet and a cooling water outlet respectively. The invention further discloses a method for evaluating the relation of the interface temperature and the interface heat exchange coefficient between the die and the sample in the hot stamping process, and supplies corresponding theoretical basis to the test of interface coefficient.
Description
Technical field
The present invention relates to determinator and the method for interface temperature and interface heat exchange coefficient relation, relate in particular to mold surface temperature and interface heat exchange coefficient relation test device and method in drop stamping process, belong to high-strength steel sheet drop stamping technical field.
Background technology
Conventional heat transfer process is according to known starting condition or boundary condition, solves the temperature variation of thermal conductor inside, is a kind of well-posed problem.Backward heat conduction (Inverse Heat Conduction Problem, IHCP) is a kind of ill-posed problem.IHCP calculates boundary condition or the starting condition of thermal conductor according to the situation of change of thermal conductor temperature: by thermal sensor being installed in thermal conductor inside, utilize thermal sensor to record the temperature variation of the inner relevant position of thermal conductor, recycle suitable computing method and according to temperature variations, determine starting condition or the boundary condition of thermal conductor.At present, scholar both domestic and external has proposed multiple Numerical method and has solved IHCP.Because anti-pass heat problem is a kind of ill-posed problem, solving of it is more many than conventional heat transfer process complexity, selects easy, reliable method research backward heat conduction, has important value in practical engineering application.
According to the temperature variation of thermal conductor, solving the coefficient of heat transfer between thermal conductor and surrounding medium, is a kind of in multiple IHCP, and domestic and international many scholars are studied this backward heat conduction.Osman and Beck record the temperature variations of spheroid inside by thermal sensor is set in spheroid, utilize reverse hot transmission method to calculate the interface heat exchange coefficient between quenching spheroid and heat eliminating medium, result of calculation shows: utilize the coefficient of heat transfer and the theoretical value that reverse hot transmission method obtains to coincide better.Naylor and Osthuizens utilize the temperature field in sensor measurement sample cooling procedure, according to the temperature curve measuring, by process of iteration, process backward heat conduction, and have obtained the coefficient of heat transfer between sample and heat eliminating medium.Gu Jianfeng etc. have studied ultimate principle and the algorithm with anti-pass by the use of thermal means gauging surface integrated heat transfer coefficient, utilize reverse radiant heat method to obtain the interface heat exchange coefficient between chilled water and quenching oil and quenching boron steel, result of study shows: adopt the size (1mm) of appropriate time step-length (0.01s) and finite element grid, multipoint method can reflect that the surface generalization coefficient of heat transfer is with the situation of change of surface temperature more exactly.Chen Nailu etc., for the coefficient of heat transfer of quenching oil under different in flow rate under measurements and calculations industrial condition, adopt Ultrasonic Doppler Flowmeter to measure the flow velocity of medium, with 120 * 120 * 20mm
3tabular sample and inverse heat conduction method are measured and have been calculated the coefficient of heat transfer.Cheng Mei etc. are applied to Beck anti-inference method the calculating of quenching process boundary condition, have developed the handling procedure of temperature field simulation procedure boundary condition, have realized the simulation of sample transient state temperature field in quenching process.Cheng Heming etc. quench and During Gas Quenching in High Pressure for the chilled water of 45 steel samples, utilize and show method of finite difference, nonlinear estimation method and the temperature being obtained by thermal sensor test, carrying out oppositely heat conduction solves, obtained temperature variant heat transfer boundary coefficient between 45# steel and chilled water, and temperature variant heat transfer boundary coefficient between 45# steel and gases at high pressure.
For the IHCP of other type, scholar both domestic and external has also carried out corresponding research work.Yang Chen etc. have proposed a kind of method that solves Nonlinear Heat Conduction inverse problem (prediction material thermal physical property parameter) based on Levenberg-Marquardt iterative process, the one-dimensional and unsteady state heat conduction of take in flat board is research object, on numerical result accurately, apply non-homogeneous stochastic error and simulate transient temperature experimental data, application the method is constant to heat-conduction coefficient and specific heat capacity respectively, and the situations such as function that heat-conduction coefficient and specific heat capacity are temperature are predicted.Qian Weiqi etc., adopting on the basis of finite volume method numerical solution three-dimensional unstable state heat conduction problem, are converted into optimization problem by the Converse solved problem of surface heat flow, have set up two kinds of Converse solved algorithms of sequential function method and method of conjugate gradient; Adopt these two kinds of algorithms to solve a typical examples, result of calculation shows: two kinds of Converse solved algorithms setting up all have good noiseproof feature.Tang Zhonghua etc. use for reference Iteration Regularized method, set up utilize material internal temperature field measurement result backwards calculation material heat-conduction coefficient in time with the adjoint equation method of spatial position change function, in optimizing process, to objective function, stopping criterion is set; By typical examples, calculated and shown, the method can draw comparatively rational Converse solved result in the less situation of measurement noise.Somchart Chantasiriwan calculates border hot-fluid and the boundary temperature of one-dimensional linear heat conduction problem by continuous function method, obtained the Biot value with time correlation, result of study shows: the expression formula of Biot is the nonlinear equation with measured temperature correlation.In addition, the scholars such as Lesnic, Kim, Park, Taler, Shen, Tseng utilize respectively the methods such as boundary element method, domain decomposition method, integral method, the golden method of character used in proper names and in rendering some foreign names the Liao Dynasty, finite volume method, iteration adjustment method, Sensitivity Method to be studied backward heat conduction, have calculated time dependent border, sample interface place hot-fluid.
Drop stamping technology, boron steel steel plate (initial strength is 500～600MPa) to be heated to austenitizing state (be heated to 850～950 degrees Celsius, and be incubated 5～7 minutes), then fast transfer is to the impact briquetting of mould high speed, in the situation that guaranteeing certain pressure, product carries out Quenching Treatment to be greater than the cooling velocity of 27 ℃/s in die ontology, and the pressurize approximately 4～10s that quenches, to obtain the forming mode of the super-high strength steel part with even martensitic stucture.Method for numerical simulation is a kind of important means of research boron steel drop stamping technique.When utilizing Numerical Method Study boron steel drop stamping technique, need corresponding drop stamping key parameter, comprise various thermal physical property parameters, the mechanical property parameters of boron steel, Contact Boundary parameter etc.Wherein, Contact Boundary parameter is one of parameter of most critical, and its order of accuarcy directly affects the solving precision of temperature field, stress-strain field and tissue field.Contact Boundary parameter comprises the relation between interface heat exchange coefficient, interface temperature and interface heat exchange coefficient and interface temperature.At present, in the document and patent of having published, all do not relate to the relation between contact interface temperature and interface heat exchange coefficient.
Summary of the invention
The present invention, according to the present Research of relation between prior art median surface temperature and interface heat exchange coefficient, provides a kind of device and method for assessment of the interface temperature between mould and sample in drop stamping process and interface heat exchange coefficient relation.
Technical scheme of the present invention is: a kind of device for assessment of the interface temperature between mould and sample in drop stamping process and interface heat exchange coefficient relation, comprise cooling device, sample fixing device, temperature-detecting device and data handling system, described cooling device comprises frock and lower frock, described sample fixing device is placed on the upper surface of frock, and described sample fixing device is provided with temperature-detecting device near a side of upper frock;
Described upper frock inside is provided with several support columns, and the cavity between described support column is cooling-water duct, and described cooling-water duct is connected respectively with cooling water inlet, coolant outlet;
Described sample fixing device comprises muff and the sample rest area that is positioned at muff inside, and the unique opening surface of described muff contacts with the upper surface of upper frock;
One end of described temperature-detecting device penetrates muff and enters sample rest area, and the installation direction of described temperature-detecting device is vertical with heat transfer direction, and described temperature-detecting device is connected with temperature collect module.
Preferably, described upper frock is connected by trip bolt with lower frock.
Preferably, described upper frock is provided with seal groove with the lower surface that lower frock contacts, and in described seal groove, O-ring seal is installed.
Preferably, described muff consists of heat-insulating material winding multilayer; Described temperature-detecting device is placed in temperature-detecting device mounting hole, and described temperature-detecting device is thermopair.
Preferably, described heat-insulating material is the refractory fiber paper that coefficient of heat conductivity is low, and the thickness of described winding is not less than as 10mm; The distance of described temperature-detecting device mounting hole and upper frock upper surface is 2mm.
Preferably, the upper surface thickness of described upper frock is 2mm, and the material of described upper frock and lower frock is 4Cr5MoSiV.
Assess the interface temperature between mould and sample and a method for interface heat exchange coefficient relation in drop stamping process, comprise the following steps:
1. by the Temperature Setting of heating arrangement, be the probe temperature requiring, in heating arrangement, pass into blanket gas, start heating arrangement;
2. sample is placed in muff, temperature-detecting device is penetrated to muff, and be fixed on sample, obtain ready sample fixing device;
3. upper frock and lower frock are fixed together, obtain cooling device, and pass into chilled water;
4. by step 2. ready sample fixing device put into heating arrangement, after temperature reaches design temperature, continue insulation 30min, temperature is evenly and reach setting value everywhere to guarantee sample;
5. the sample fixing device heating is taken out from heating arrangement, be placed on adiabatic heat-insulation medium, then temperature-detecting device is connected with data handling system by data acquisition module;
6. sample is transferred on cooling device, image data 10min, obtains cooling curve;
7. according to the cooling curve collecting, adopt reverse hot conduction technique and finite element technique that cooling curve is coupled and is solved, obtain interface heat exchange coefficient, specimen surface temperature and the frock surface temperature of sample and cooling device surface of contact, thereby obtain interface temperature that frock contacts with sample and the relation between interface heat exchange coefficient.
Described Finite Element Method with the detailed process that improved linear search method combines is: first determine the interval range at coefficient of heat transfer place, then interval range is dwindled, determine the suitable coefficient of heat transfer; Concrete steps are: a. to each constantly, suppose a coefficient of heat transfer, then calling finite element solving program calculates the temperature field of part, obtain calculated value, b. the measured value that relatively calculated value and thermopair record, calculated difference, according to the coefficient of heat transfer of difference adjustment supposition, re-start calculating, and then relatively; C. so repeatedly carry out, until the difference of calculated value and measured value meets the requirements of precision; In computation process, the coefficient of heat transfer of supposing is by improved linear search method, to judge direction and the amplitude of its adjustment.
Preferably, described step 7. in the computing formula of difference be:
In formula, E (a) is the error function between observed temperature and analog computation temperature, and α is the interface heat exchange coefficient between heat eliminating medium and sample, the number that N is the temperature test point set in sample; T
ithe observed temperature of i pacing pilot, T
i' be the accounting temperature of i pacing pilot.
Preferably, described step determines that the algorithm of coefficient of heat transfer place interval range is as follows in 7.:
(1) get initial ranging step-length α s, put coefficient of heat transfer initial value α
3(for very first time section, its value is arbitrary value, and each time period is a upper time period to optimize the coefficient of heat transfer obtaining later), calls temperature field and organizes field stimulation program, and by (4-2) formula, calculate the error E of analog temperature field and accounting temperature field
3=E (α
3), juxtaposition kk=0.
(2) replace hot factor alpha=α
3+ α s, calls temperature field and organizes field stimulation program, and by (4-2) formula, calculates the error E=E (α) of analog temperature field and accounting temperature field, juxtaposition kk=kk+1.
(3) if E*E
3> 0, compares E and E
3size.If | E| < | E
3|, put α s=2.0* α s, α
3=α, E
3=E, forwards (2) step to; If | E| > | E
3|, put α s=-α s, and forward (2) step to; If | E|=|E
3|, forward (5) step to.
(4) if E*E
3≤ 0, forward (5) step to.
(5) put α
l=min{ α, α
3, α
r=max{ α, α
3, E
l=min{E, E
3, E
r=min{E, E
3}
(6) put
call temperature field and organize field stimulation program, and by (4-2) formula, calculate the error E=E (α) of analog temperature field and accounting temperature field.If E*E
3> 0, puts E
l=E, α
l=α, kk=kk-1; Otherwise put E
r=E, α
r=α, kk=kk-1.
(7) if kk > 1 forwards (6) step to; Otherwise, stopping calculating, the region of search is defined as [α
l, α
r].
Preferably, described step determines that the algorithm of the suitable coefficient of heat transfer is in 7.:
(1) establishing by the definite region of search of improved advance and retreat method is [a, b], puts accuracy requirement ε, calculates respectively left and right and sounds out point
β
l＝a+(1-τ)(b-a)，β
r＝a+τ(b-a)
Wherein
And corresponding functional value
φ
l＝E(β
l)，φ
r＝E(β
r)；
(2) if φ
l< φ
r, put
b＝β
r，β
r＝β
l，φ
r＝φ
l
And calculate
β
l＝a+(1-τ)(b-a)
φ
l＝E(β
l)
Otherwise put
a＝β
l，β
l＝β
r，φ
l＝φ
r
And calculate
β
r＝a+τ(b-a)，φ
r＝E(β
r)；
(3) if | b-a|≤ε, is handled as follows: if φ
l< φ
r, put μ=β
l, otherwise put μ=β
r, μ, as minimal point, is stopped calculating; If | b-a| > ε, forwards (2) step to.
Preferably, the installation direction of described temperature-detecting device is vertical with heat transfer direction, and described temperature-detecting device is placed in temperature-detecting device mounting hole, and described temperature-detecting device is thermopair.
Preferably, described muff consists of heat-insulating material winding multilayer; Described heat-insulating material is the refractory fiber paper that coefficient of heat conductivity is low.
Preferably, the temperature range of described heating arrangement heating is 300-1000 ℃.
The invention has the beneficial effects as follows:
(1) a kind of interface temperature for assessment of mould in drop stamping process and sample surface of contact and the device and method between interface heat exchange coefficient are provided, for the test of boundary coefficient provides corresponding theoretical foundation;
(2) installation direction of temperature-detecting device is set to vertically with the direction of conducting heat, and guarantees not have the accuracy of warm spot, and has eliminated the impact of thermocouple mounting hole for specimen temperature field distribution, has guaranteed the accuracy of this device experimental result;
(3) cooling device is formed by fixedly connecting by upper frock and lower frock, and the surface thickness of wherein going up frock is only 2mm, the impact of the variation that has reduced the thermal physical property parameter of frock material own on temperature field computational accuracy;
(4) in upper frock, be provided with several support columns, guaranteed the planarization of upper frock and sample contact interface, further guaranteed the good contact of mould and sample;
(5) upper frock arranges seal groove with the surface that lower frock contacts, and in seal groove, O-ring seal is installed, and further frock is sealed, and prevents the seepage of chilled water.
(6) muff of described sample fixing device for being prepared by heat-insulating material, the unique opening surface of described muff contacts with the upper surface of upper frock, has guaranteed that in test process, the heat of sample all transmits by the surface of contact of sample and frock.
Accompanying drawing explanation
Fig. 1 is the structural representation of apparatus for evaluating in the present invention;
Fig. 2 is the structural representation of cooling device in apparatus for evaluating;
Fig. 3 is the front view of the upper frock in cooling device;
Fig. 4 is that upper frock is along the cut-open view of A-A face;
Fig. 5 is the cooling curve that in the present invention, appraisal procedure collects;
The finite element model of Fig. 6 for building;
Fig. 7 is the process flow diagram of coupling analysis;
Fig. 8 is the variation of cooling frock surface temperature;
Fig. 9 is temperature and the coefficient of heat transfer of interface;
Wherein: 1, cooling water inlet, 2, sample rest area, 3, muff, 4, coolant outlet, 5, temperature-detecting device, 6, temperature collect module, 7, power supply, 8, O-ring seal, 9, support column, 10, lower frock, 11, upper frock, 13, seal groove.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described further.
A device for assessment of mold surface temperature in drop stamping process and interface heat exchange coefficient relation, comprises cooling device, sample fixing device and temperature-detecting device.Described cooling device comprises frock 11 and lower frock 10, described upper frock 11 is connected by trip bolt with lower frock 10, described upper frock 11 is provided with seal groove 13 with the lower surface that lower frock 10 contacts, in described seal groove 13, O-ring seal 8 is installed, compression deformation by O-ring seal 8 seals cooling device, prevents chilled water seepage.The surface thickness 2mm of described upper frock 11, the impact of the variation that has reduced frock material thermal physical property parameter on temperature field computational accuracy; The planarization of frock 11 surfaces in process of the test in assurance, guarantees that sample lower surface and upper frock 11 Surface Contacts are good.Described upper frock 11 inside are provided with the upper frock 11 passive several support columns 9 in surface, and the cavity between described support column 9 is cooling-water duct, and described cooling-water duct is connected respectively with cooling water inlet 1, coolant outlet 4; Cooling water inlet 1 is connected with the water pump of chilled water is provided; Coolant outlet 4 is connected with cooling water tank.
Described sample fixing device comprises muff 3 and the sample rest area 2 that is positioned at muff 3 inside, and the unique opening surface of described muff 3 contacts with the upper surface of upper frock 11; Described sample fixing device is provided with temperature-detecting device 5 near a side of upper frock 11, and one end of described temperature-detecting device 5 penetrates muff 3 and enters sample rest area 2; Described temperature-detecting device 5 is thermopair, is placed in temperature-detecting device mounting hole, is connected with temperature collect module 6, and described temperature collect module 6 is connected with power supply 7.The installation direction of described temperature-detecting device 5 is vertical with heat transfer direction, has guaranteed not have the accuracy of warm spot, and has eliminated the impact of temperature-detecting device mounting hole for specimen temperature field distribution.Described muff 3 is wound around multilayer by heat-insulating material and forms; Described heat-insulating material is the refractory fiber paper that coefficient of heat conductivity is low, and the thickness of described winding is 10mm.The end face of sample and side insulation cover 3 parcels, in test process, guarantee that the heat of sample all transmits by sample 2 and the surface of contact of frock.
Assess mould and the interface temperature of sample and a method for interface heat exchange coefficient relation in drop stamping process, comprise the following steps:
1. by the Temperature Setting of heating arrangement, be 550 ℃, in heating arrangement, pass into blanket gas nitrogen, start heating arrangement;
2. sample is placed in muff, temperature-detecting device is penetrated to muff, and be fixed on sample along the vertical direction of heat transfer direction, obtain ready sample fixing device;
3. upper frock and lower frock are fixed together, obtain cooling device, and pass into chilled water;
4. by step 2. ready sample fixing device put into heating arrangement, after temperature reaches design temperature, continue insulation 30min, temperature is evenly and reach setting value everywhere to guarantee sample;
5. the sample fixing device heating is taken out from heating arrangement, be placed on adiabatic heat-insulation medium, then temperature-detecting device is connected with data handling system by data acquisition module;
6. sample is transferred on cooling device, image data 10min, obtains cooling curve;
7. according to the cooling curve collecting, adopt finite element technique to combine with improved linear search method, cooling curve is coupled and is solved, build and obtain finite element model (Fig. 6); The upper surface B1 of described upper frock contacts with sample, the lower surface B2 of described upper frock contacts with chilled water, coupling solves the temperature variation curve (Fig. 8) that obtains B1 and B2 place, the surface temperature of B1 place, the interface sample further calculating changes and interface heat exchange coefficient (Fig. 9), thereby obtains interface temperature that frock contacts with sample and the relation between interface heat exchange coefficient.
Described Finite Element Method with the detailed process that improved linear search method combines is: first determine the interval range at coefficient of heat transfer place, then interval range is dwindled, determine the suitable coefficient of heat transfer; Concrete steps are: a. to each constantly, suppose a coefficient of heat transfer, then calling finite element solving program calculates the temperature field of part, obtain calculated value, b. the measured value that relatively calculated value and thermopair record, calculated difference, according to the coefficient of heat transfer of difference adjustment supposition, re-start calculating, and then relatively; C. so repeatedly carry out, until the difference of calculated value and measured value meets the requirements of precision; In computation process, the coefficient of heat transfer of supposing is by improved linear search method, to judge direction and the amplitude of its adjustment.
The computing formula of described difference is:
In formula, E (a) is the error function between observed temperature and analog computation temperature, and α is the interface heat exchange coefficient between heat eliminating medium and sample, the number that N is the temperature test point set in sample; T
ithe observed temperature of i pacing pilot, T
i' be the accounting temperature of i pacing pilot.
The algorithm of described definite coefficient of heat transfer place interval range is as follows:
(1) get initial ranging step-length α s, put coefficient of heat transfer initial value α
3(for very first time section, its value is arbitrary value, and each time period is a upper time period to optimize the coefficient of heat transfer obtaining later), calls temperature field and organizes field stimulation program, and by (4-2) formula, calculate the error E of analog temperature field and accounting temperature field
3=E (α
3), juxtaposition kk=0.
(2) replace hot factor alpha=α
3+ α s, calls temperature field and organizes field stimulation program, and by (4-2) formula, calculates the error E=E (α) of analog temperature field and accounting temperature field, juxtaposition kk=kk+1.
(3) if E*E
3> 0, compares E and E
3size.If | E| < | E
3|, put α s=2.0* α s, α
3=α, E
3=E, forwards (2) step to; If | E| > | E
3|, put α s=-α s, and forward (2) step to; If | E|=|E
3|, forward (5) step to.
(4) if E*E
3≤ 0, forward (5) step to.
(5) put α
l=min{ α, α
3, α
r=max{ α, α
3, E
l=min{E, E
3, E
r=min{E, E
3}
(6) put
call temperature field and organize field stimulation program, and by (4-2) formula, calculate the error E=E (α) of analog temperature field and accounting temperature field.If E*E
3> 0, puts E
l=E, α
l=α, kk=kk-1; Otherwise put E
r=E, α
r=α, kk=kk-1.
(7) if kk > 1 forwards (6) step to; Otherwise, stopping calculating, the region of search is defined as [α
l, α
r].
The algorithm of described definite suitable coefficient of heat transfer is:
(1) establishing by the definite region of search of improved advance and retreat method is [a, b], puts accuracy requirement ε, calculates respectively left and right and sounds out point
β
l＝a+(1-τ)(b-a)，β
r＝a+τ(b-a)
Wherein
And corresponding functional value
φ
l＝E(β
l)，φ
r＝E(β
r)；
(2) if φ
l< φ
r, put
b＝β
r，β
r＝β
l，φ
r＝φ
l
And calculate
β
l＝a+(1-τ)(b-a)
φ
l＝E(β
l)
Otherwise put
a＝β
l，β
l＝β
r，φ
l＝φ
r
And calculate
β
r＝a+τ(b-a)，φ
r＝E(β
r)；
(3) if | b-a|≤ε, is handled as follows: if φ
l< φ
r, put μ=β
l, otherwise put μ=β
r, μ, as minimal point, is stopped calculating; If | b-a| > ε, forwards (2) step to.
Claims (10)
1. one kind for assessment of the interface temperature of mould and sample in drop stamping process and the device of interface heat exchange coefficient relation, it is characterized in that: comprise cooling device, sample fixing device, temperature-detecting device, described cooling device comprises frock (11) and lower frock (10), described sample fixing device is placed on the upper surface of frock (11), and described sample fixing device is provided with temperature-detecting device (5) near a side of upper frock (11);
Described upper frock inside is provided with several support columns (9), and the cavity between described support column (9) is cooling-water duct, and described cooling-water duct is connected respectively with cooling water inlet (1), coolant outlet (4);
Described sample fixing device comprises muff (3) and is positioned at the inner sample rest area (2) of muff (3), and the unique opening surface of described muff (3) contacts with the upper surface of upper frock (11);
One end of described temperature-detecting device (5) penetrates muff (3) and enters sample rest area (2), the installation direction of described temperature-detecting device (5) is vertical with heat transfer direction, and described temperature-detecting device (5) is connected with temperature collect module (6).
2. according to claim 1 a kind of for assessment of the interface temperature of mould and sample in drop stamping process and the device of interface heat exchange coefficient relation, it is characterized in that: described upper frock (11) is connected by trip bolt with lower frock (10).
3. according to claim 1 a kind of for assessment of the interface temperature of mould and sample in drop stamping process and the device of interface heat exchange coefficient relation, it is characterized in that: the lower surface that described upper frock (11) contacts with lower frock (10) is provided with seal groove (13), and O-ring seal (8) is installed in described seal groove (13).
4. a kind of for assessment of the interface temperature of mould and sample in drop stamping process and the device of interface heat exchange coefficient relation according to described in claim 1-3 any one, is characterized in that: described muff (3) is wound around multilayer by heat-insulating material and forms; Described temperature-detecting device (5) is placed in temperature-detecting device mounting hole, and described temperature-detecting device (5) is thermopair.
5. according to claim 4 a kind of for assessment of the interface temperature of mould and sample in drop stamping process and the device of interface heat exchange coefficient relation, it is characterized in that: described heat-insulating material is the refractory fiber paper that coefficient of heat conductivity is low, and the thickness of described winding is not less than 10mm; The distance of described temperature-detecting device mounting hole and upper frock (11) upper surface is 2mm.
6. according to claim 1 a kind of for assessment of the interface temperature of mould and sample in drop stamping process and the device of interface heat exchange coefficient relation, it is characterized in that: the upper surface thickness of described upper frock (11) is 2mm, described upper frock (11) is 4Cr5MoSiV with the material of lower frock (10).
7. according to claim 1 a kind of for assessment of the interface temperature of mould and sample in drop stamping process and the device of interface heat exchange coefficient relation, it is characterized in that: also comprise data handling system, described data handling system comprises temperature collect module, cooling curve database, Converse solved software and interface heat exchange coefficient database.
8. employing is claimed in claim 1 for assessment of mould and the interface temperature of sample and the method for interface heat exchange coefficient relation in the assessment drop stamping process of the interface temperature of mould and sample in drop stamping process and the device of interface heat exchange coefficient relation, it is characterized in that: comprise the following steps:
1. by the Temperature Setting of heating arrangement, be the probe temperature requiring, in heating arrangement, pass into blanket gas, start heating arrangement;
2. sample is placed in muff, temperature-detecting device is penetrated to muff, and be fixed on sample, obtain ready sample fixing device;
3. upper frock and lower frock are fixed together, obtain cooling device, and pass into chilled water;
4. by step 2. ready sample fixing device put into heating arrangement, after temperature reaches design temperature, continue insulation 30min, temperature is evenly and reach setting value everywhere to guarantee sample;
5. the sample fixing device heating is taken out from heating arrangement, be placed on adiabatic heat-insulation medium, then temperature-detecting device is connected with data handling system by temperature collect module;
6. sample is transferred on cooling device, image data 10min, obtains cooling curve;
7. according to the cooling curve collecting, adopt finite element technique and improved linear search method to combine, be coupled and solve, obtain interface heat exchange coefficient, specimen surface temperature and the frock surface temperature of sample and cooling device surface of contact, thereby obtain interface temperature that frock contacts with sample and the relation between interface heat exchange coefficient; Described finite element technique with the detailed process that improved linear search method combines is: first determine the interval range at coefficient of heat transfer place, then interval range is dwindled, determine the suitable coefficient of heat transfer; Concrete steps are: a. to each constantly, suppose a coefficient of heat transfer, then calling finite element solving program calculates the temperature field of part, obtain calculated value, the difference of the measured value that b. comparison calculated value and thermopair record, the error of calculation, according to error condition, the coefficient of heat transfer of adjusting supposition, re-starts calculating, and then relatively; C. so repeatedly carry out, until the error of calculated value and measured value meets the requirements of precision; In computation process, the coefficient of heat transfer of supposing is by improved linear search method, to judge direction and the amplitude of its adjustment.
9. employing according to claim 8 is claimed in claim 1 for assessment of mould and the interface temperature of sample and the method for interface heat exchange coefficient relation in the assessment drop stamping process of the interface temperature of mould and sample in drop stamping process and the device of interface heat exchange coefficient relation, it is characterized in that: the installation direction of described temperature-detecting device (5) is vertical with heat transfer direction, described temperature-detecting device (5) is placed in temperature-detecting device mounting hole, and described temperature-detecting device (5) is thermopair.
10. employing according to claim 8 is claimed in claim 1 for assessment of mould and the interface temperature of sample and the method for interface heat exchange coefficient relation in the assessment drop stamping process of the interface temperature of mould and sample in drop stamping process and the device of interface heat exchange coefficient relation, it is characterized in that: described muff (3) is wound around multilayer by heat-insulating material and forms; Described heat-insulating material is the refractory fiber paper that coefficient of heat conductivity is low.
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