CN103033277A - Device and method for evaluating relation of interface temperature and interface heat exchange coefficient - Google Patents
Device and method for evaluating relation of interface temperature and interface heat exchange coefficient Download PDFInfo
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- CN103033277A CN103033277A CN2012105210488A CN201210521048A CN103033277A CN 103033277 A CN103033277 A CN 103033277A CN 2012105210488 A CN2012105210488 A CN 2012105210488A CN 201210521048 A CN201210521048 A CN 201210521048A CN 103033277 A CN103033277 A CN 103033277A
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Abstract
Provided is a device for evaluating relation of interface temperature and an interface heat exchange coefficient between a die and a sample in a hot stamping process. The device for evaluating the relation of the interface temperature and the interface heat exchange coefficient comprises a cooling device, a sample fixing device, a temperature detecting device and a data processing system. The cooling device comprises an upper tool and a lower tool, the sample fixing device is arranged on the upper surface of the upper tool, and the temperature detecting device is arranged on one side, close to the upper tool, of the sample fixing device. A plurality of support poles are arranged inside the upper tool, the cavities among the support poles are cooling water channels, and the cooling water channels are connected with a cooling water inlet and a cooling water outlet respectively. The invention further discloses a method for evaluating the relation of the interface temperature and the interface heat exchange coefficient between the die and the sample in the hot stamping process, and supplies corresponding theoretical basis to the test of interface coefficient.
Description
Technical field
The present invention relates to determinator and the method for interface temperature and interface heat exchange coefficient relation, relate in particular to mold surface temperature and interface heat exchange coefficient relation test device and method in the drop stamping process, belong to high-strength steel sheet drop stamping technical field.
Background technology
Conventional heat transfer process is according to known starting condition or boundary condition, finds the solution the temperature variation of thermal conductor inside, is a kind of well-posed problem.Backward heat conduction (Inverse Heat Conduction Problem, IHCP) is a kind of ill-posed problem.IHCP is boundary condition or the starting condition of calculating thermal conductor according to the situation of change of thermal conductor temperature: namely by in thermal conductor inside thermal sensor being installed, utilize the temperature variation of the inner relevant position of thermal sensor record thermal conductor, recycle suitable computing method are determined thermal conductor according to temperature variations starting condition or boundary condition.At present, scholar both domestic and external has proposed multiple Numerical method and has solved IHCP.Because the anti-pass heat problem is a kind of ill-posed problem, finding the solution of it is more many than conventional heat transfer process complexity, selects easy, reliable method research backward heat conduction, has important value in practical engineering application.
Finding the solution the coefficient of heat transfer between thermal conductor and the surrounding medium according to the temperature variation of thermal conductor, is a kind of among the multiple IHCP, and domestic and international many scholars are studied this backward heat conduction.Osman and Beck are by arranging the temperature variations of thermal sensor record spheroid inside in spheroid, utilize the interface heat exchange coefficient between reverse hot transmission method calculating quenching spheroid and the heat eliminating medium, result of calculation shows: the coefficient of heat transfer and the theoretical value of utilizing reverse hot transmission method to obtain are coincide better.Naylor and Osthuizens utilize the temperature field in the sensor measurement sample cooling procedure, process backward heat conduction according to the temperature curve that measures with process of iteration, and have obtained the coefficient of heat transfer between sample and the heat eliminating medium.Gu Jianfeng etc. have studied ultimate principle and the algorithm with anti-pass by the use of thermal means gauging surface integrated heat transfer coefficient, utilize reverse radiant heat method to obtain interface heat exchange coefficient between chilled water and quenching oil and the quenching boron steel, result of study shows: adopt the size (1mm) of appropriate time step-length (0.01s) and finite element grid, multipoint method can reflect more exactly that the surface generalization coefficient of heat transfer is with the situation of change of surface temperature.Chen Nailu etc. adopt Ultrasonic Doppler Flowmeter to measure the flow velocity of medium, with 120 * 120 * 20 mm for the coefficient of heat transfer of quenching oil under different in flow rate under the measurements and calculations industrial condition
3Tabular sample and inverse heat conduction method are measured and have been calculated the coefficient of heat transfer.Cheng Mei etc. are applied to the calculating of quenching process boundary condition with the Beck anti-inference method, have developed the handling procedure of temperature field simulation procedure boundary condition, have realized the simulation of sample transient state temperature field in quenching process.Cheng Heming etc. quench and During Gas Quenching in High Pressure for the chilled water of 45 steel samples, utilize and show method of finite difference, nonlinear estimation method and the temperature that is obtained by the thermal sensor test, carrying out oppositely heat conduction finds the solution, obtained temperature variant heat transfer boundary coefficient between 45# steel and the chilled water, and temperature variant heat transfer boundary coefficient between 45# steel and the gases at high pressure.
For the IHCP of other type, scholar both domestic and external has also carried out corresponding research work.Yang Chen etc. have proposed a kind of method of finding the solution Nonlinear Heat Conduction inverse problem (prediction material thermal physical property parameter) based on the Levenberg-Marquardt iterative process, one-dimensional and unsteady state heat in dull and stereotyped is conducted as research object, apply non-homogeneous stochastic error at numerical result accurately and simulate the transient temperature experimental data, using the method is constant to heat-conduction coefficient and specific heat capacity respectively, and heat-conduction coefficient and specific heat capacity are that the situations such as function of temperature are predicted.Qian Weiqi etc. are converted into optimization problem with the Converse solved problem of surface heat flow on the basis of adopting finite volume method numerical solution three-dimensional unstable state heat conduction problem, set up two kinds of Converse solved algorithms of sequential function method and method of conjugate gradient; Adopt these two kinds of algorithms that a typical examples is found the solution, result of calculation shows: two kinds of Converse solved algorithms setting up all have preferably noiseproof feature.Tang Zhonghua etc. use for reference the Iteration Regularized method, set up utilize the material internal temperature field measurement result backwards calculation material heat-conduction coefficient in time with the adjoint equation method of spatial position change function, in optimizing process, to objective function stopping criterion is set; Show that by typical examples calculating the method can draw comparatively rational Converse solved result in the less situation of measurement noise.Somchart Chantasiriwan is by border hot-fluid and the boundary temperature of the linear heat conduction problem of continuous function method Computing One-Dimensional, obtained the Biot value with time correlation, result of study shows: the expression formula of Biot is the nonlinear equation with measured temperature correlation.In addition, the scholars such as Lesnic, Kim, Park, Taler, Shen, Tseng utilize respectively the methods such as boundary element method, domain decomposition method, integral method, the golden method of character used in proper names and in rendering some foreign names the Liao Dynasty, finite volume method, iteration adjustment method, Sensitivity Method that backward heat conduction is studied, and have calculated time dependent border, sample interface place hot-fluid.
The drop stamping technology, that (initial strength is 500～600MPa) to be heated to the austenitizing state and (to be heated to 850～950 degrees centigrade with the boron steel steel plate, and be incubated 5～7 minutes), then fast transfer is to the impact briquetting of mould high speed, in the situation that guarantees certain pressure, product carries out Quenching Treatment with the cooling velocity greater than 27 ℃/s in die ontology, pressurize about 4～10s that quenches is with the forming mode of the super-high strength steel part that obtains to have even martensitic stucture.Method for numerical simulation is a kind of important means of research boron steel drop stamping technique.When utilizing Numerical Method Study boron steel drop stamping technique, need corresponding drop stamping key parameter, comprise various thermal physical property parameters, the mechanical property parameters of boron steel, Contact Boundary parameter etc.Wherein, the Contact Boundary parameter is one of parameter of most critical, and its order of accuarcy directly affects the solving precision of temperature field, stress-strain field and tissue field.The Contact Boundary parameter comprises the relation between interface heat exchange coefficient, interface temperature and interface heat exchange coefficient and the interface temperature.At present, in the document and patent of having published, all do not relate to the relation between contact interface temperature and the interface heat exchange coefficient.
Summary of the invention
The present invention provides a kind of device and method for assessment of the interface temperature between mould and the sample in the drop stamping process and interface heat exchange coefficient relation according to the present Research of prior art median surface temperature and interface heat exchange coefficient Relations Among.
Technical scheme of the present invention is: a kind of device for assessment of the interface temperature between mould and the sample in the drop stamping process and interface heat exchange coefficient relation, comprise cooling device, sample fixing device, temperature-detecting device and data handling system, described cooling device comprises frock and lower frock, described sample fixing device is placed on the upper surface of frock, and described sample fixing device is provided with temperature-detecting device near a side of upper frock;
Described upper frock inside is provided with several support columns, and the cavity between the described support column is cooling-water duct, and described cooling-water duct links to each other respectively with cooling water inlet, coolant outlet;
Described sample fixing device comprises muff and is positioned at the sample rest area of muff inside that the unique opening surface of described muff contacts with the upper surface of upper frock;
One end of described temperature-detecting device penetrates muff and enters the sample rest area, the installation direction of described temperature-detecting device and heat transfer perpendicular direction, and described temperature-detecting device links to each other with temperature collect module.
Preferably, described upper frock links to each other by trip bolt with lower frock.
Preferably, described upper frock is provided with seal groove with the lower surface that lower frock contacts, and in the described seal groove O-ring seal is installed.
Preferably, described muff is made of heat-insulating material winding multilayer; Described temperature-detecting device is placed in the temperature-detecting device mounting hole, and described temperature-detecting device is thermopair.
Preferably, described heat-insulating material is the low refractory fiber paper of coefficient of heat conductivity, and the thickness of described winding is not less than and is 10mm; The distance of described temperature-detecting device mounting hole and upper frock upper surface is 2mm.
Preferably, the upper surface thickness of described upper frock is 2mm, and the material of described upper frock and lower frock is 4Cr5MoSiV.
A kind ofly assess the interface temperature between the mould and sample and the method for interface heat exchange coefficient relation in the drop stamping process, may further comprise the steps:
1. the Temperature Setting with heating arrangement is the probe temperature that requires, and passes into blanket gas in heating arrangement, starts heating arrangement;
2. sample is placed in the muff, temperature-detecting device is penetrated muff, and be fixed on the sample, obtain ready sample fixing device;
3. upper frock and lower frock are fixed together, obtain cooling device, and pass into chilled water;
4. with step 2. ready sample fixing device put into heating arrangement, after temperature reaches design temperature, continue insulation 30min, temperature is evenly and reach setting value everywhere to guarantee sample;
5. the sample fixing device that heats is taken out from heating arrangement, be placed on the adiabatic heat-insulation medium, then temperature-detecting device is linked to each other with data handling system by data acquisition module;
6. sample is transferred on the cooling device, image data 10min obtains cooling curve;
7. according to the cooling curve that collects, adopting reverse hot conduction technique and finite element technique that cooling curve is coupled finds the solution, obtain interface heat exchange coefficient, specimen surface temperature and the frock surface temperature of sample and cooling device surface of contact, thereby obtain interface temperature that frock contacts with sample and the relation between the interface heat exchange coefficient.
Described Finite Element Method with the detailed process that improved linear search method combines is: determine first the interval range at coefficient of heat transfer place, interval range is dwindled again, determine the suitable coefficient of heat transfer; Concrete steps are: a. to each constantly, suppose a coefficient of heat transfer, then calling the finite element solving program calculates the temperature field of part, obtain calculated value, b. compare the measured value that calculated value and thermopair record, calculated difference is according to the coefficient of heat transfer of difference adjustment supposition, re-start calculating, and then relatively; C. so repeatedly carry out, until the difference of calculated value and measured value meets the requirements of precision; In computation process, the coefficient of heat transfer of supposing is direction and the amplitude of judging its adjustment with improved linear search method.
Preferably, described step 7. in the computing formula of difference be:
In the formula, E (a) is the error function between observed temperature and analog computation temperature, and α is the interface heat exchange coefficient between heat eliminating medium and the sample, and N is the number of the temperature test point set in sample; T
iThe observed temperature of i pacing pilot, T
i' be the accounting temperature of i pacing pilot.
Preferably, described step determines that the algorithm of coefficient of heat transfer place interval range is as follows in 7.:
(1) gets initial ranging step-length α s, replace hot coefficient initial value α
3(for very first time section, its value is arbitrary value, and each time period is a upper time period to optimize the coefficient of heat transfer that obtains later on) called the temperature field and organized the field stimulation program, and calculate the error E of analog temperature field and accounting temperature field by (4-2) formula
3=E (α
3), juxtaposition kk=0.
(2) replace hot factor alpha=α
3+ α s calls the temperature field and organizes the field stimulation program, and calculates the error E=E (α) of analog temperature field and accounting temperature field, juxtaposition kk=kk+1 by (4-2) formula.
(3) if E*E
3＞0, then compare E and E
3Size.If | E|＜| E
3|, then put α s=2.0* α s, α
3=α, E
3=E forwarded for (2) step to; If | E|＞| E
3|, then put α s=-α s, and forwarded for (2) step to; If | E|=|E
3|, then forwarded for (5) step to.
(4) if E*E
3≤ 0, then forwarded for (5) step to.
(5) put α
l=min{ α, α
3, α
r=max{ α, α
3, E
l=min{E, E
3, E
r=min{E, E
3}
(6) put
Call the temperature field and organize the field stimulation program, and calculate the error E=E (α) of analog temperature field and accounting temperature field by (4-2) formula.If E*E
3＞0, then put E
l=E, α
l=α, kk=kk-1; Otherwise put E
r=E, α
r=α, kk=kk-1.
(7) if kk＞1 then forwarded for (6) step to; Otherwise, stopping to calculate, the region of search is defined as [α
l, α
r].
Preferably, described step determines that the algorithm of the suitable coefficient of heat transfer is in 7.:
(1) establishes the region of search of being determined by improved advance and retreat method and be [a, b], put accuracy requirement ε, sound out a β about calculating respectively
l=a+ (1-τ) (b-a), β
r=a+ τ (b-a)
Wherein
, and corresponding functional value
φ
l＝E(β
l)，φ
r＝E(β
r)；
(2) if φ
l＜φ
r, then put
b＝β
r，β
r＝β
l，φ
r＝φ
l
And calculate
β
l＝a+(1-τ)(b-a)
φ
l＝E(β
l)
Otherwise put
a＝β
l，β
l＝β
r，φ
l＝φ
r
And calculate
β
r＝a+τ(b-a)，φ
r＝E(β
r)；
(3) if | b-a|≤ε is handled as follows: if φ
l＜φ
r, then put μ=β
l, otherwise put μ=β
r, μ as minimal point, is stopped to calculate; If | b-a|＞ε then forward to (2) step.
Preferably, the installation direction of described temperature-detecting device and heat transfer perpendicular direction, described temperature-detecting device are placed in the temperature-detecting device mounting hole, and described temperature-detecting device is thermopair.
Preferably, described muff is made of heat-insulating material winding multilayer; Described heat-insulating material is the low refractory fiber paper of coefficient of heat conductivity.
Preferably, the temperature range of described heating arrangement heating is 300-1000 ℃.
The invention has the beneficial effects as follows:
(1) a kind of interface temperature for assessment of mould in the drop stamping process and sample surface of contact and the device and method between the interface heat exchange coefficient are provided, for the test of boundary coefficient provides corresponding theoretical foundation;
(2) installation direction of temperature-detecting device is set to and the perpendicular direction that conducts heat, and guarantees not have the accuracy of warm spot, and has eliminated the impact of thermocouple mounting hole for the specimen temperature field distribution, has guaranteed the accuracy of this device experimental result;
(3) cooling device is formed by fixedly connecting by upper frock and lower frock, and the surface thickness of wherein going up frock is 2mm only, has reduced the variation of the thermal physical property parameter of frock material own to the impact of temperature field computational accuracy;
(4) be provided with several support columns in the upper frock, guaranteed the planarization of upper frock and sample contact interface, further guaranteed the good contact of mould and sample;
(5) upper frock arranges seal groove with the surface that lower frock contacts, and in seal groove O-ring seal is installed, and further frock is sealed, and prevents the seepage of chilled water.
(6) muff of described sample fixing device for being prepared by heat-insulating material, the unique opening surface of described muff contacts with the upper surface of upper frock, has guaranteed that the heat of sample all transmits by the surface of contact of sample and frock in the test process.
Description of drawings
Fig. 1 is the structural representation of apparatus for evaluating among the present invention;
Fig. 2 is the structural representation of cooling device in the apparatus for evaluating;
Fig. 3 is the front view of the upper frock in the cooling device;
Fig. 4 is that upper frock is along the cut-open view of A-A face;
Fig. 5 is the cooling curve that appraisal procedure collects among the present invention;
The finite element model of Fig. 6 for making up;
Fig. 7 is the process flow diagram of coupling analysis;
Fig. 8 is the variation of cooling frock surface temperature;
Fig. 9 is temperature and the coefficient of heat transfer at the interface;
Wherein: 1, cooling water inlet, 2, the sample rest area, 3, muff, 4, coolant outlet, 5, temperature-detecting device, 6, temperature collect module, 7, power supply, 8, O-ring seal, 9, support column, 10, lower frock, 11, upper frock, 13, seal groove.
Embodiment
The present invention is described further below in conjunction with accompanying drawing.
A kind of device for assessment of mold surface temperature in the drop stamping process and interface heat exchange coefficient relation comprises cooling device, sample fixing device and temperature-detecting device.Described cooling device comprises frock 11 and lower frock 10, described upper frock 11 and lower frock 10 link to each other by trip bolt, described upper frock 11 is provided with seal groove 13 with the lower surface that lower frock 10 contacts, in the described seal groove 13 O-ring seal 8 is installed, compression deformation by O-ring seal 8 seals cooling device, prevents the chilled water seepage.The surface thickness 2mm of described upper frock 11 has reduced the variation of frock material thermal physical property parameter to the impact of temperature field computational accuracy; The planarization of frock 11 surfaces in process of the test in the assurance guarantees that sample lower surface and upper frock 11 Surface Contacts are good.Described upper frock 11 inside are provided with the passive several support columns 9 in upper frock 11 surfaces, and the cavity between the described support column 9 is cooling-water duct, and described cooling-water duct links to each other respectively with cooling water inlet 1, coolant outlet 4; Cooling water inlet 1 is connected with the water pump that chilled water is provided; Coolant outlet 4 is connected with cooling water tank.
Described sample fixing device comprises muff 3 and is positioned at the sample rest area 2 of muff 3 inside that described muff 3 unique opening surfaces contact with the upper surface of upper frock 11; Described sample fixing device is provided with temperature-detecting device 5 near a side of upper frock 11, and an end of described temperature-detecting device 5 penetrates muff 3 and enters sample rest area 2; Described temperature-detecting device 5 is thermopair, is placed in the temperature-detecting device mounting hole, links to each other with temperature collect module 6, and described temperature collect module 6 links to each other with power supply 7.The installation direction of described temperature-detecting device 5 and heat transfer perpendicular direction have guaranteed not have the accuracy of warm spot, and have eliminated the impact of temperature-detecting device mounting hole for the specimen temperature field distribution.Described muff 3 twines multilayer by heat-insulating material and consists of; Described heat-insulating material is the low refractory fiber paper of coefficient of heat conductivity, and the thickness of described winding is 10mm.The end face of sample and side insulation cover 3 parcels in test process, guarantee that the heat of sample all transmits by the surface of contact of sample 2 with frock.
A kind ofly assess mould and the interface temperature of sample and the method for interface heat exchange coefficient relation in the drop stamping process, may further comprise the steps:
1. the Temperature Setting with heating arrangement is 550 ℃, passes into blanket gas nitrogen in heating arrangement, starts heating arrangement;
2. sample is placed in the muff, temperature-detecting device is penetrated muff, and be fixed on the sample along the direction of heat transfer perpendicular direction, obtain ready sample fixing device;
3. upper frock and lower frock are fixed together, obtain cooling device, and pass into chilled water;
4. with step 2. ready sample fixing device put into heating arrangement, after temperature reaches design temperature, continue insulation 30min, temperature is evenly and reach setting value everywhere to guarantee sample;
5. the sample fixing device that heats is taken out from heating arrangement, be placed on the adiabatic heat-insulation medium, then temperature-detecting device is linked to each other with data handling system by data acquisition module;
6. sample is transferred on the cooling device, image data 10min obtains cooling curve;
7. according to the cooling curve that collects, adopt finite element technique to combine with improved linear search method, cooling curve is coupled finds the solution, make up and obtain finite element model (Fig. 6); The upper surface B1 of described upper frock contacts with sample, the lower surface B2 of described upper frock contacts with chilled water, the temperature variation curve (Fig. 8) that obtains B1 and B2 place is found the solution in coupling, the surface temperature of B1 place, the interface sample that further calculates changes and interface heat exchange coefficient (Fig. 9), thereby obtains interface temperature that frock contacts with sample and the relation between the interface heat exchange coefficient.
Described Finite Element Method with the detailed process that improved linear search method combines is: determine first the interval range at coefficient of heat transfer place, interval range is dwindled again, determine the suitable coefficient of heat transfer; Concrete steps are: a. to each constantly, suppose a coefficient of heat transfer, then calling the finite element solving program calculates the temperature field of part, obtain calculated value, b. compare the measured value that calculated value and thermopair record, calculated difference is according to the coefficient of heat transfer of difference adjustment supposition, re-start calculating, and then relatively; C. so repeatedly carry out, until the difference of calculated value and measured value meets the requirements of precision; In computation process, the coefficient of heat transfer of supposing is direction and the amplitude of judging its adjustment with improved linear search method.
The computing formula of described difference is:
In the formula, E (a) is the error function between observed temperature and analog computation temperature, and α is the interface heat exchange coefficient between heat eliminating medium and the sample, and N is the number of the temperature test point set in sample; T
iThe observed temperature of i pacing pilot, T
i' be the accounting temperature of i pacing pilot.
The algorithm of described definite coefficient of heat transfer place interval range is as follows:
(1) gets initial ranging step-length α s, replace hot coefficient initial value α
3(for very first time section, its value is arbitrary value, and each time period is a upper time period to optimize the coefficient of heat transfer that obtains later on) called the temperature field and organized the field stimulation program, and calculate the error E of analog temperature field and accounting temperature field by (4-2) formula
3=E (α
3), juxtaposition kk=0.
(2) replace hot factor alpha=α
3+ α s calls the temperature field and organizes the field stimulation program, and calculates the error E=E (α) of analog temperature field and accounting temperature field, juxtaposition kk=kk+1 by (4-2) formula.
(3) if E*E
3＞0, then compare E and E
3Size.If | E|＜| E
3|, then put α s=2.0* α s, α
3=α, E
3=E forwarded for (2) step to; If | E|＞| E
3|, then put α s=-α s, and forwarded for (2) step to; If | E|=|E
3|, then forwarded for (5) step to.
(4) if E*E
3≤ 0, then forwarded for (5) step to.
(5) put α
l=min{ α, α
3, α
r=max{ α, α
3, E
l=min{E, E
3, E
r=min{E, E
3}
(6) put
, call the temperature field and organize the field stimulation program, and calculate the error E=E (α) of analog temperature field and accounting temperature field by (4-2) formula.If E*E
3＞0, then put E
l=E, α
l=α, kk=kk-1; Otherwise put E
r=E, α
r=α, kk=kk-1.
(7) if kk＞1 then forwarded for (6) step to; Otherwise, stopping to calculate, the region of search is defined as [α
l, α
r].
Describedly determine that the algorithm of the suitable coefficient of heat transfer is:
(1) establishes the region of search of being determined by improved advance and retreat method and be [a, b], put accuracy requirement ε, sound out a little about calculating respectively
β
l＝a+(1-τ)(b-a)，β
r＝a+τ(b-a)
Wherein
, and corresponding functional value
φ
l＝E(β
l)，φ
r＝E(β
r)；
(2) if φ
l＜φ
r, then put
b＝β
r，β
r＝β
l，φ
r＝φ
l
And calculate
β
l＝a+(1-τ)(b-a)
φ
l＝E(β
l)
Otherwise put
a＝β
l，β
l＝β
r，φ
l＝φ
r
And calculate
β
r＝a+τ(b-a)，φ
r＝E(β
r)；
(3) if | b-a|≤ε is handled as follows: if φ
l＜φ
r, then put μ=β
l, otherwise put μ=β
r, μ as minimal point, is stopped to calculate; If | b-a|＞ε then forwarded for (2) step to.
Claims (10)
1. one kind for assessment of the interface temperature of mould and sample in the drop stamping process and the device of interface heat exchange coefficient relation, it is characterized in that: comprise cooling device, sample fixing device, temperature-detecting device, described cooling device comprises frock (11) and lower frock (10), described sample fixing device is placed on the upper surface of frock (11), and described sample fixing device is provided with temperature-detecting device (5) near a side of upper frock (11);
Described upper frock inside is provided with several support columns (9), and the cavity between the described support column (9) is cooling-water duct, and described cooling-water duct links to each other respectively with cooling water inlet (1), coolant outlet (4);
Described sample fixing device comprises muff (3) and is positioned at the inner sample rest area (2) of muff (3) that the unique opening surface of described muff (3) contacts with the upper surface of upper frock (11);
One end of described temperature-detecting device (5) penetrates muff (3) and enters sample rest area (2), the installation direction of described temperature-detecting device (5) and heat transfer perpendicular direction, and described temperature-detecting device (5) links to each other with temperature collect module (6).
2. according to claim 1 a kind of for assessment of the interface temperature of mould and sample in the drop stamping process and the device of interface heat exchange coefficient relation, it is characterized in that: described upper frock (11) links to each other by trip bolt with lower frock (10).
3. according to claim 1 a kind of for assessment of the interface temperature of mould and sample in the drop stamping process and the device of interface heat exchange coefficient relation, it is characterized in that: the lower surface that described upper frock (11) contacts with lower frock (10) is provided with seal groove (13), and O-ring seal (8) is installed in the described seal groove (13).
4. any one is described a kind of for assessment of the interface temperature of mould and sample in the drop stamping process and the device of interface heat exchange coefficient relation according to claim 1-3, it is characterized in that: described muff (3) twines multilayer by heat-insulating material and consists of; Described temperature-detecting device (5) is placed in the temperature-detecting device mounting hole, and described temperature-detecting device (5) is thermopair.
5. according to claim 4 a kind of for assessment of the interface temperature of mould and sample in the drop stamping process and the device of interface heat exchange coefficient relation, it is characterized in that: described heat-insulating material is the low refractory fiber paper of coefficient of heat conductivity, and the thickness of described winding is not less than 10mm; The distance of described temperature-detecting device mounting hole and upper frock (11) upper surface is 2mm.
6. according to claim 1 a kind of for assessment of the interface temperature of mould and sample in the drop stamping process and the device of interface heat exchange coefficient relation, it is characterized in that: the upper surface thickness of described upper frock (11) is 2mm, and described upper frock (11) is 4Cr5MoSiV with the material of lower frock (10).
7. according to claim 1 a kind of for assessment of the interface temperature of mould and sample in the drop stamping process and the device of interface heat exchange coefficient relation, it is characterized in that: described data handling system comprises data acquisition module, cooling curve database, Converse solved software and interface heat exchange coefficient database.
8. assess mould and the interface temperature of sample and the method for interface heat exchange coefficient relation in the drop stamping process for one kind, it is characterized in that: may further comprise the steps:
1. the Temperature Setting with heating arrangement is the probe temperature that requires, and passes into blanket gas in heating arrangement, starts heating arrangement;
2. sample is placed in the muff, temperature-detecting device is penetrated muff, and be fixed on the sample, obtain ready sample fixing device;
3. upper frock and lower frock are fixed together, obtain cooling device, and pass into chilled water;
4. with step 2. ready sample fixing device put into heating arrangement, after temperature reaches design temperature, continue insulation 30min, temperature is evenly and reach setting value everywhere to guarantee sample;
5. the sample fixing device that heats is taken out from heating arrangement, be placed on the adiabatic heat-insulation medium, then temperature-detecting device is linked to each other with data handling system by data acquisition module;
6. sample is transferred on the cooling device, image data 10min obtains cooling curve;
7. according to the cooling curve that collects, adopt finite element technique and improved linear search method to combine, be coupled and find the solution, obtain interface heat exchange coefficient, specimen surface temperature and the frock surface temperature of sample and cooling device surface of contact, thereby obtain interface temperature that frock contacts with sample and the relation between the interface heat exchange coefficient; Described Finite Element Method with the detailed process that improved linear search method combines is: determine first the interval range at coefficient of heat transfer place, interval range is dwindled again, determine the suitable coefficient of heat transfer; Concrete steps are: a. to each constantly, suppose a coefficient of heat transfer, then calling the finite element solving program calculates the temperature field of part, obtain calculated value, the difference of the measured value that b. comparison calculated value and thermopair record, the error of calculation, according to error condition, adjust the coefficient of heat transfer of supposition, re-start calculating, and then relatively; C. so repeatedly carry out, until the error of calculated value and measured value meets the requirements of precision; In computation process, the coefficient of heat transfer of supposing is direction and the amplitude of judging its adjustment with improved linear search method.
9. a kind of assess mould and the interface temperature of sample and the method for interface heat exchange coefficient relation in the drop stamping process according to claim 7, it is characterized in that: the installation direction of described temperature-detecting device (5) and heat transfer perpendicular direction, described temperature-detecting device (5) is placed in the temperature-detecting device mounting hole, and described temperature-detecting device (5) is thermopair.
10. a kind of assess mould and the interface temperature of sample and the method for interface heat exchange coefficient relation in the drop stamping process according to claim 7 is characterized in that: described muff (3) twines multilayer by heat-insulating material and consists of; Described heat-insulating material is the low refractory fiber paper of coefficient of heat conductivity.
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103413059A (en) * | 2013-08-23 | 2013-11-27 | 山东建筑大学 | Solid section temperature change measurement system |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6142662A (en) * | 1998-06-16 | 2000-11-07 | New Jersey Institute Of Technology | Apparatus and method for simultaneously determining thermal conductivity and thermal contact resistance |
| CN101871903A (en) * | 2010-05-31 | 2010-10-27 | 清华大学 | Method for determining interface heat exchange coefficient of large-sized steel ingot |
| CN101876642A (en) * | 2009-04-30 | 2010-11-03 | 宝山钢铁股份有限公司 | Method and device for testing interfacial heat transfer coefficient during rapid solidification |
| CN102175712A (en) * | 2011-01-21 | 2011-09-07 | 重庆大学 | Measuring system and method for interface heating power coupling heat transfer coefficients |
| CN102507636A (en) * | 2011-09-30 | 2012-06-20 | 中国科学院金属研究所 | Method for measuring interfacial heat transfer coefficient of rapid cooling process of steel |
-
2012
- 2012-12-07 CN CN201210521048.8A patent/CN103033277B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6142662A (en) * | 1998-06-16 | 2000-11-07 | New Jersey Institute Of Technology | Apparatus and method for simultaneously determining thermal conductivity and thermal contact resistance |
| CN101876642A (en) * | 2009-04-30 | 2010-11-03 | 宝山钢铁股份有限公司 | Method and device for testing interfacial heat transfer coefficient during rapid solidification |
| CN101871903A (en) * | 2010-05-31 | 2010-10-27 | 清华大学 | Method for determining interface heat exchange coefficient of large-sized steel ingot |
| CN102175712A (en) * | 2011-01-21 | 2011-09-07 | 重庆大学 | Measuring system and method for interface heating power coupling heat transfer coefficients |
| CN102507636A (en) * | 2011-09-30 | 2012-06-20 | 中国科学院金属研究所 | Method for measuring interfacial heat transfer coefficient of rapid cooling process of steel |
Non-Patent Citations (1)
| Title |
|---|
| 郝炜等: "铸型界面换热系数的测定方法研究", 《热加工工艺》, vol. 36, no. 21, 31 December 2007 (2007-12-31), pages 11 - 15 * |
Cited By (17)
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|---|---|---|---|---|
| CN103413059B (en) * | 2013-08-23 | 2016-08-10 | 山东建筑大学 | A kind of solid section temperature change measurement system |
| CN103413059A (en) * | 2013-08-23 | 2013-11-27 | 山东建筑大学 | Solid section temperature change measurement system |
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