CN103021887B - Airtight capping method for cooling-required FC (flip chip) circuits - Google Patents
Airtight capping method for cooling-required FC (flip chip) circuits Download PDFInfo
- Publication number
- CN103021887B CN103021887B CN201210591102.6A CN201210591102A CN103021887B CN 103021887 B CN103021887 B CN 103021887B CN 201210591102 A CN201210591102 A CN 201210591102A CN 103021887 B CN103021887 B CN 103021887B
- Authority
- CN
- China
- Prior art keywords
- cover plate
- seam
- weldering
- heat
- conducting glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention provides an airtight capping method for cooling-required FC (flip chip) circuits. The method includes the steps of firstly, welding an FC on a substrate by flip bonding; secondly, coating the back of the FC with heat-conducting glue, positioning a cover plate on a shell welding ring, and allowing the inner surface of the cover plate to fully contact with the heat-conducting glue in an adhered manner; secondly, performing primary seam welding, subjecting upper and lower edges of the cover plate and the shell welding ring to seam welding, and subjecting left and right edges of the cover plate, except for non-welding reserved areas, to seam welding with the shell welding ring; thirdly, solidifying the heat-conducting glue, and exhausting gas in a cavity below the cover plate; fourthly, filling the cavity below the cover plate with nitrogen; and fifthly, subjecting the non-welding reserved areas on the left and right edges of the cover plate to seam welding with the shell welding ring. The method guarantees both airtightness and internal atmosphere to meet the design requirements after the cooling-required FC circuits are capped, and is simple in process and easy to implement.
Description
Technical field
The present invention relates to a kind of method of chip circuit sealing cap, especially a kind of air-tightness sealing cap method having cooling requirements FC circuit.
Background technology
Before the present invention occurs, the air-tightness conventional parallel seam weldering mode sealing cap (every two corresponding side seam welderings of square cover plate once complete) of FC circuit (FC: back-off core wire sheet) is only applicable to the small-power chip package without special heat-radiating requirement.At present, along with the appearance of high-power FC chip, it has had requirement to heat dissipation design, need to allow the back side of chip be bondd cover plate (cover plate can be used as heating panel) by heat-conducting glue, and heat-conducting glue inevitably produces some pernicious gases when solidifying.In the case, as also adopted conventional parallel to stitch weldering mode sealing cap, air-tightness cannot be taken into account and require and FC inside circuit atmosphere requirements; And the two has cooling requirements FC circuit necessarily to ensure at present, sealing cap will ensure the air-tightness of FC circuit later on the one hand, namely with isolate from outer air, will ensure that FC inside circuit reduces the existence of pernicious gas and the existence of steam as far as possible in addition on the one hand.
Summary of the invention
The object of the invention is supplementary the deficiencies in the prior art, a kind of air-tightness sealing cap method having cooling requirements FC circuit is provided, complete the process of whole seam weldering stage by stage, can exhale pernicious gases in seam weldering process, ensure that air-tightness requires and FC inside circuit atmosphere requirements.The technical solution used in the present invention is:
There is an air-tightness sealing cap method for cooling requirements FC circuit, comprise following processing step:
Step 101, is first welded on substrate by FC chip back-off;
Step 102, is then coated in heat-conducting glue the back side of FC chip, and cover plate is positioned in shell welding ring, and cover inner surface fully contacts adhesion with heat-conducting glue;
Step 103, then puts into parallel seam sealing machine the FC circuit of also non-air-tightness sealing cap, carries out first stage seam weldering, by the top of cover plate, below and shell welding ring carry out seam and weld; The left side and the right of cover plate reserve and does not stitch weldering trough and do not carry out seam weldering, on the left side of cover plate and the right, except not stitching and welding trough, other parts and shell welding ring are carried out seam and are welded;
Step 104, carries out the solidification of heat-conducting glue subsequently in parallel seam sealing machine, and the curing temperature of heat-conducting glue is 120 ~ 150 DEG C, and curing time is 2 ~ 4 hours; Then the gas in the cavity under cover plate is discharged;
Step 105, is then filled with the cavity under cover plate, nitrogen gas purity >=99.0%, is filled with 5 minutes ~ 10 minutes time in parallel seam sealing machine by nitrogen;
Step 106, finally carries out the weldering of second stage seam, the left side of cover plate, the right will not stitched weldering trough and shell welding ring is carried out seam and welded, completes the hermetic seal sealing cap that FC circuit is last.
Further, in above-mentioned steps 103, the length of the left side of cover plate 4, the right not being stitched weldering trough 6 is about 1/4 of the right.
Advantage of the present invention: adopt the method to carry out sealing cap to FC circuit, after can ensuring heat dissipation design requirement FC circuit sealing cap, air-tightness and internal atmosphere all can meet design requirement.The process of this method is simple, easily realizes.
Accompanying drawing explanation
Fig. 1 is schematic diagram after FC circuit coated with thermally conductive glue.
Fig. 2 is that FC circuit places schematic diagram after cover plate.
Fig. 3 is first stage seam weldering schematic diagram.
Fig. 4 is second stage seam weldering schematic diagram.
Embodiment
Below in conjunction with concrete drawings and Examples, the invention will be further described.
Particularly, as shown in Figure 1, Figure 2, Figure 3, Figure 4:
Embodiment one: a kind of air-tightness sealing cap method having cooling requirements FC circuit, comprises following processing step:
Step 101, first by FC chip 1(and Flip Chip back-off core wire sheet) back-off welding is on the substrate 5;
Step 102, is then coated in heat-conducting glue 2 back side of FC chip 1, and cover plate 4 is positioned in shell welding ring 3, and cover plate 4 inner surface fully contacts adhesion with heat-conducting glue 2; The manufacturer of heat-conducting glue 2 is Tech Bond company of the U.S., and model is TB3619;
Step 103, then puts into parallel seam sealing machine the FC circuit of also non-air-tightness sealing cap, carries out first stage seam weldering, by the top of cover plate 4, below and shell welding ring 3 carry out seam and weld; The left side and the right of cover plate 4 reserve and does not stitch weldering trough 6 and do not carry out seam weldering, the left side of cover plate 4 and the right are welded the outer other parts in trough 6 and shell welding ring 3 and carried out seam except not stitching and weld;
Step 104, carries out the solidification of heat-conducting glue 2 subsequently in parallel seam sealing machine, and the curing temperature of heat-conducting glue 2 is 150 DEG C, and curing time is 2 hours, is then discharged by the gas in the cavity under cover plate 4; To exhale pernicious gases, and steam etc.The left side of cover plate 4 and the right are not stitched weldering trough 6 to can be used for gas and discharge;
Step 105, is then filled with the cavity under cover plate 4, nitrogen gas purity >=99.0%, is filled with 5 minutes ~ 10 minutes time in parallel seam sealing machine by nitrogen; To meet the atmosphere requirements of FC inside circuit;
Step 106, finally carries out the weldering of second stage seam, carrying out seam and welds, completing the hermetic seal sealing cap that FC circuit is last by the left side of cover plate 4, the right not being stitched weldering trough 6 with shell welding ring 3.
Further, in above-mentioned steps 103, the length of the left side of cover plate 4, the right not being stitched weldering trough 6 is about 1/4 of the right.
Embodiment two: a kind of air-tightness sealing cap method having cooling requirements FC circuit, comprises following processing step:
Step 101, first by FC chip 1(and Flip Chip back-off core wire sheet) back-off welding is on the substrate 5;
Step 102, is then coated in heat-conducting glue 2 back side of FC chip 1, and cover plate 4 is positioned in shell welding ring 3, and cover plate 4 inner surface fully contacts adhesion with heat-conducting glue 2; The manufacturer of heat-conducting glue 2 is Tech Bond company of the U.S., and model is TB3619;
Step 103, then puts into parallel seam sealing machine the FC circuit of also non-air-tightness sealing cap, carries out first stage seam weldering, by the top of cover plate 4, below and shell welding ring 3 carry out seam and weld; The left side and the right of cover plate 4 reserve and does not stitch weldering trough 6 and do not carry out seam weldering, the left side of cover plate 4 and the right are welded the outer other parts in trough 6 and shell welding ring 3 and carried out seam except not stitching and weld;
Step 104, carries out the solidification of heat-conducting glue 2 subsequently in parallel seam sealing machine, and the curing temperature of heat-conducting glue 2 is 120 DEG C, and curing time is 4 hours, is then discharged by the gas in the cavity under cover plate 4; To exhale pernicious gases, and steam etc.The left side of cover plate 4 and the right are not stitched weldering trough 6 to can be used for gas and discharge;
Step 105, is then filled with the cavity under cover plate 4, nitrogen gas purity >=99.0%, is filled with 5 minutes ~ 10 minutes time in parallel seam sealing machine by nitrogen; To meet the atmosphere requirements of FC inside circuit;
Step 106, finally carries out the weldering of second stage seam, carrying out seam and welds, completing the hermetic seal sealing cap that FC circuit is last by the left side of cover plate 4, the right not being stitched weldering trough 6 with shell welding ring 3.
Further, in above-mentioned steps 103, the length of the left side of cover plate 4, the right not being stitched weldering trough 6 is about 1/4 of the right.
Key of the present invention is the process completing whole seam weldering stage by stage: first stage seam postwelding, the left side of cover plate 4, the right respectively reserve one section and do not carry out seam weldering (late stage exhaust use, see Fig. 3), treat that exhaust terminates, repair welding (the second stage seam weldering of remainder is carried out again after being filled with nitrogen, complete air-tightness sealing cap, see Fig. 4).
Carry out because the sealing cap in the present invention have employed segmentation, at first stage seam postwelding, carry out the solidification of heat-conducting glue 2, subsequently the gas in the cavity under cover plate 4 is fully discharged; Then nitrogen is filled with the cavity under cover plate 4, finally carries out air-tightness seam weldering (final sealing cap) of second stage.Adopt the method sealing cap, after can ensuring the air-tightness sealing cap of heat dissipation design requirement FC circuit, internal atmosphere meets design requirement.Meet air-tightness and the internal atmosphere of cooling requirements FC circuit, internal pressure also can control at 1 atm higher.
Claims (2)
1. there is an air-tightness sealing cap method for cooling requirements FC circuit, it is characterized in that: comprise the following steps:
Step 101, is first welded on substrate (5) by FC chip (1) back-off;
Step 102, then heat-conducting glue (2) is coated in the back side of FC chip (1), and cover plate (4) is positioned in shell welding ring (3), cover plate (4) inner surface fully contacts adhesion with heat-conducting glue (2);
Step 103, then puts into parallel seam sealing machine the FC circuit of also non-air-tightness sealing cap, carries out first stage seam weldering, by the top of cover plate (4), below and shell welding ring (3) carry out seam and weld; The left side and the right of cover plate (4) reserve and does not stitch weldering trough (6) and do not carry out seam weldering, the left side of cover plate (4) and the right are welded trough (6) outer other parts and shell welding ring (3) and carried out seam except not stitching and weld;
Step 104, carries out the solidification of heat-conducting glue (2) subsequently in parallel seam sealing machine, and the curing temperature of heat-conducting glue (2) is 120 ~ 150 DEG C, and curing time is 2 ~ 4 hours; Then the gas in the cavity under cover plate (4) is discharged;
Step 105, is then filled with the cavity under cover plate (4), nitrogen gas purity >=99.0%, is filled with 5 minutes ~ 10 minutes time in parallel seam sealing machine by nitrogen;
Step 106, finally carries out the weldering of second stage seam, carrying out seam and welds, completing the air-tightness sealing cap that FC circuit is last by the left side of cover plate (4), the right not being stitched weldering trough (6) with shell welding ring (3).
2. there is the air-tightness sealing cap method of cooling requirements FC circuit as claimed in claim 1, it is characterized in that: in above-mentioned steps 103, the length of the left side of cover plate (4), the right not being stitched weldering trough (6) is 1/4 of the right of cover plate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210591102.6A CN103021887B (en) | 2012-12-31 | 2012-12-31 | Airtight capping method for cooling-required FC (flip chip) circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210591102.6A CN103021887B (en) | 2012-12-31 | 2012-12-31 | Airtight capping method for cooling-required FC (flip chip) circuits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103021887A CN103021887A (en) | 2013-04-03 |
| CN103021887B true CN103021887B (en) | 2015-04-22 |
Family
ID=47970348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210591102.6A Active CN103021887B (en) | 2012-12-31 | 2012-12-31 | Airtight capping method for cooling-required FC (flip chip) circuits |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103021887B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11204552A (en) * | 1998-01-07 | 1999-07-30 | Nec Corp | Semiconductor-device packaging method and semiconductor device |
| US6445062B1 (en) * | 1999-02-19 | 2002-09-03 | Nec Corporation | Semiconductor device having a flip chip cavity with lower stress and method for forming same |
| CN201478293U (en) * | 2009-08-20 | 2010-05-19 | 无锡中微高科电子有限公司 | Airtight Seal Structure for Flip Chip Bonding |
| CN101728340A (en) * | 2008-10-22 | 2010-06-09 | 索尼株式会社 | Semiconductor device and method of manufacturing the same |
| CN102646607A (en) * | 2012-01-15 | 2012-08-22 | 中国电子科技集团公司第十研究所 | Technology method of parallel seam welding of MMW (Millimeter Waves) T/R assembly high conduction material |
-
2012
- 2012-12-31 CN CN201210591102.6A patent/CN103021887B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11204552A (en) * | 1998-01-07 | 1999-07-30 | Nec Corp | Semiconductor-device packaging method and semiconductor device |
| US6445062B1 (en) * | 1999-02-19 | 2002-09-03 | Nec Corporation | Semiconductor device having a flip chip cavity with lower stress and method for forming same |
| CN101728340A (en) * | 2008-10-22 | 2010-06-09 | 索尼株式会社 | Semiconductor device and method of manufacturing the same |
| CN201478293U (en) * | 2009-08-20 | 2010-05-19 | 无锡中微高科电子有限公司 | Airtight Seal Structure for Flip Chip Bonding |
| CN102646607A (en) * | 2012-01-15 | 2012-08-22 | 中国电子科技集团公司第十研究所 | Technology method of parallel seam welding of MMW (Millimeter Waves) T/R assembly high conduction material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103021887A (en) | 2013-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5373203B2 (en) | Glass plate composite sealing method | |
| WO2012058938A1 (en) | Vacuum glass sealing method and vacuum glass product | |
| CN204144238U (en) | The package assembling of high power semiconductor chip | |
| CN104191092B (en) | The laser-TIG hybrid silk filling seal weld method of L-type aluminium alloy structure | |
| CN105118790B (en) | A kind of high temperature packaging framework preparation method of silicon carbide diode | |
| CN109834356A (en) | A kind of production method of complexity dual alloy cone structure | |
| CN109514018A (en) | A kind of golden tin ring seal cover process method of semiconductor devices | |
| CN102969254B (en) | Dual-interface card packaging method | |
| CN203659916U (en) | Chip angle correction apparatus for LED packaging | |
| CN205428913U (en) | Power semiconductor module | |
| CN104157605A (en) | Salient point interconnection welding method | |
| CN107634044A (en) | A kind of high-power SIP gold tin welding encapsulating structure and method for packing | |
| CN102784742B (en) | Glue filling process for tire pressure monitoring sensor | |
| CN204315538U (en) | A kind of IC encapsulates load vacuum track | |
| CN103943763B (en) | A kind of encapsulating structure and method of flip LED chips | |
| CN109473512A (en) | A kind of full-inorganic LED light and its packaging method | |
| CN103021887B (en) | Airtight capping method for cooling-required FC (flip chip) circuits | |
| CN204118038U (en) | High power transistor die Bonder | |
| CN103295920B (en) | Nonisulated type power model and packaging technology thereof | |
| CN206210768U (en) | A kind of highly reliable surface-pasted diode | |
| CN103042285B (en) | Oxygen-free copper and stainless steel body vacuum welding method | |
| CN203659827U (en) | Chip correcting claw | |
| CN106409772B (en) | Highly reliable surface-pasted diode of one kind and preparation method thereof | |
| CN205231041U (en) | Electronic packaging shell is heat sink to weld bear building -up structure | |
| CN205141014U (en) | LED packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |