CN102985510B - Completely crued heat or electricity-conductivity original place form gap-filler - Google Patents

Abstract

Use thermally and/or electrically conductive composites, to fill the heat between the first and second surfaces and/or EMI shielding gap.The supply of the stable complex of the forma fluens of mixture as the polymer gel component solidified and particulate filler component is provided.Under an applied pressure a certain amount of complex is assigned on one of surface (forming gap when opposed) by nozzle, sieve, masterplate or other holes or is assigned in the gap formed between the surfaces.The complex that described gap is distributed at least partially is at least partly filled.

Description

Completely crued heat or electricity-conductivity original place form gap-filler

Cross-Reference to Related Applications

This application claims the U.S.Provisional Serial submitted on August 12nd, 2009 The rights and interests of 61/233,186, the disclosure of this provisional application is attached to herein by quoting in full In.

Invention field

The present invention refers broadly to thermally and/or electrically-conductive composites, and described complex can be used as Such as between the surface of an electronic component and another component (such as radiator or circuit board) Gap-filler or joint filling, for they conductivity cool down and/or electromagnetic interference (EMI) screen Cover.This complex provides with the polymer gel component form of solidification, the polymer of this solidification Gel component and curable resin Composition are blended and are filled with thermally and/or electrically-conductive particles. The invention further relates to such as pass through nozzle or other openings (such as printing sieve or masterplate) by this Plant complex to be applied in one of such surface or the gap between such surface.

Background of invention

For modern electronic equipment (such as TV, radio, computer, Medical Instruments, business Business machine, communication apparatus etc.) circuit design become day by day complicated.Such as, manufactured integrated Circuit is for containing these and other equipment being equivalent to hundreds of thousands transistor.Although design Complexity improves, but the size of equipment is along with manufacturing less electronic component and by more The ability that these elements are packaged in the least area improves and persistently reduces.

Owing to electronic component has become less and more densely packed packs on circuit board and chip, Designer and the present facing challenges of maker be, how to distribute these elements by resistance or with The heat that other mode produces.It practice, it is known that many electronic component, especially merit Rate semiconductor element such as transistor and microprocessor are at high temperature easier to lost efficacy or event occurs Barrier.Therefore, heat-sinking capability is typically the restrictive factor of element function.

Electronic component in integrated circuit is traditionally via mandatory in the shell of device Or convection circulation air cools down.About this point, as element packaging ingredient or Cooling fins is provided, to increase the sky being exposed to convection current-formation as its single adnexa The surface area of the packaging of air-flow.Electric fan has the most been used to improve the air that circulates in the enclosure Volume.But, but high power circuit typical for current electronic designs and less more dense The circuit of packaging, generally it is found that simple air circulation is not sufficient enough to cool down component.

By electronic component being to be mounted directly to radiating component such as " cold drawing " or other radiators Or heat spreader, can achieve over and circulate accessible heat radiation by simple air.Dissipation structure Part can be special heat-conductive ceramic or metallic plate or the structure having fin, or simply Chassis or circuit board for device.But, exceed between electronic component and dissipation component Normal thermograde, the interface between main body, develop suitable thermograde as heat Interface impedance or contact resistance.

It is to say, and such as U.S. Patent number 4, described in 869,954, by the hot interface of element It is generally irregular in the significant or scale of microcosmic that surface engages with radiator.Work as interface During surface engagement, between form pouch or void space, air can be trapped wherein.This A little pouches reduce the total surface area contact in interface, and then reduce heat transfer area and by interface Total heat transfer efficiency.Moreover, it is well known that air is the heat conductor of relative mistake, exist in interface Air pouch reduces the rate of heat transfer by interface.

In order to improve the heat transfer efficiency by interface, generally by heat-conductivity, electricity-insulant Pad or other be placed between radiator and electronic component, with fill any irregular surface and Eliminate air pouch.For this purpose, the material begun with such as is filled with heat-conduction The silicone grease of property filler (such as aluminium oxide) or wax.As at U.S. Patent number 5,250,209； 5,167,851；4,764,845；4,473,113；4,473,113；4,466,483；With 4,299,715 In further describe, this material usually semiliquid or solid at normal room temperatures, but It is liquefiable at elevated temperatures or softening, to flow and to conform better to irregular interface Surface.

But, oils and fats and the wax of aforementioned type the most known in the art are the most usual Can not self-supporting or otherwise form stable, and be considered to be applied to radiator or electronics unit The interface surface of part has trouble.In order to provide generally for being easily processed and preferred form membrane These materials, it is necessary to base material, net or other carriers are provided, introduce among or between can be formed Another boundary layer of other air pouch.Additionally, use this material to be usually directed to pass through Electronics assembler manual application or laying, which increase manufacturing cost.

Or, another kind of method is that the sheet-like material using solidification is to replace silicone grease or wax.Can This material mixture is become containing one or more scattered heat-conduction in polymeric binder Property particulate filler, and can solidify sheet material, carry, pad or form membrane provide.Typical viscous Mixture material includes silicone, carbamate, thermoplastic elastomer and other elastomers, typically Filler includes aluminium oxide, magnesium oxide, zinc oxide, boron nitride and aluminium nitride.

The example of above-mentioned boundary material is to be filled with aluminium oxide or the silicone of boron nitride or amino first Acid esters elastomer, they are with CHO-THERMAnd THERM-A-GAP^TMTitle by Chomerics Division of Parker-Hannifin Corp., 77Dragon Court, Woburn, MA 01801 sells.Additionally, U.S. Patent number 4,869,954 discloses one Solidification, form stable, sheet-like heat-conductive of material for transferring heat energy.Should Material is formed by urethane adhesive, firming agent and one or more heat conductive filler. Filler (can include aluminium oxide, aluminium nitride, boron nitride, magnesium oxide or zinc oxide) particle diameter is at about 1-50 In the range of micron (0.05-2 mil).Similar material can be described in U.S. Patent number 5,679,457；5,545,473；5,533,256；5,510,174；5,471,027；5,359,768； 5,321,582；5,309,320；5,298,791；5,213,868；5,194,480；5,151,777； 5,137,959；5,060,114；4,979,074；4,974,119；4,965,699；4,869,954； 4,842,911；4,782,893；4,685,987；4,654,754；4,606,962；4,602,678, And WO 96/37915.Other materials, as being described in U.S. Patent number 6,031,025； 5,929,138；5,741,877；5,665,809；5,467,251；5,079,300；4,852,646； And WO 96/05602, WO 00/63968；With EP 643,551, can use gel or Gel-like material is as the binding agent of filler or carrier.

The sheet material of the above-mentioned type, pad and band the most generally can accept and cool down electric component group in conductivity Part (such as semiconductor chip, i.e. at U.S. Patent number 5, the punch die described in 359,768) In be used as boundary material.But, in certain applications, it is desirable to retaining element (the such as bullet of weight Spring, clip etc.) use enough power to make these materials meet interface surface, to obtain enough Surface for effectively heat transfer.It practice, apply for some, due in relatively low clamping Interface surface can be conformed better under pressure, continue to liquefy the most at elevated temperatures, melt Or the material softened, such as oils and fats and wax.

Recently, introduced phase-change material to be easily processed, its at room temperature self-supporting and shape Formula is stable, but in the temperature range of operation of electronic component at a temperature of liquefaction or with its other party Formula softens, to form the thixotroping phase of the thickness conforming better to interface surface.These phase-change materials Can be as independent film or as the sieve (heated screen) of the heating printed on substrate surface Supply, advantageously under the relatively low clamping pressure of about 5psi (35kPa), the operation of element In temperature, conformally flowing aspect works like oils and fats and wax.This material further describes In commonly assigned Decembers in 1998 that submit to and entitled " Method of Applying on the 15th A Phase Change Interface Material (method using transformation interface material) " the U.S. The patent No. 6,054,198 and United States serial 09/212,111, and in title THERMFLOWBy Chomerics under T310, T443, T705, T710, T725 and A725 Division of Parker-Hannifin Corp. sells.Other phase-change materials have by Bergquist Trade name " the HI-FLOW that Company (Minneapolis, MN) sells^TM", by Trade name " the T-PCM that Thermagon, Inc. (Cleveland, OH) sell^TM" and by Orcus, Inc. the trade name " THERMAPHASE " that (Stilwell, KS) sells.Phase-change material/gold Belong to paper tinsel laminated material and have the trade name " T-MATE sold by Thermagon, Inc.^TM”。

For typical commercial Application, thermal interfacial material can carry or sheet-form supply, its bag With outer barrier liner and the interlayer of hot complex in including.Unless hot complex is the most tacky, no Then the side of composite layer can be coated with a thin layer contact adhesive (PSA), for being executed by complex Heating surface for radiator.In order to promote automatization's distribution and use, can be by band or sheet material Outer barrier liner and compound interlayer die-cut, to form a series of single predefined size Pad.Therefore, each pad can be removed from interior barrier liner, and " shell conventional and glue (peel And stick) " application use adhesive phase and radiator to bond, this can be by radiator manufacturer Carry out.

When pad adheres to the heating surface of radiating component (such as radiator or heat spreader), and When the protectiveness that outer liner original place forms the outer surface of composite layer covers, dissipation component and pad Can provide as integrated package.Before mounting assembly, outer barrier liner is moved from composite layer Remove, pad is placed on electronic component.Clip can be used for fastening assembly original place.

Other materials, as at U.S. Patent number 5,467,251 and commonly assigned U.S. Patent number 7,208,192 and 5, illustrate in 781,412, and by Chomerics Division of Parker-Hannifin Corp is with title " THERM-A-FORM^TM" sell, commonly referred to as Material or sealant is formed for hot IFC interfacial complex, joint filling, original place.Generally with load one or Mode in multiple pipes, container etc. supplies these materials, most commonly, as one pack system or double groups Separatory body or the reactive system of filling otherwise flowed, it is in room temperature or the temperature of rising The lower solidification of degree, is formed with original place in the gap using complex or element.Using can be sleeve Or pipe rifle or other distribution systems.

In view of the material used in thermal management and the multiformity of application, as above illustrated , it is contemplated that in thermal management materials, the sustained improvement to this material and application is electronic equipment system Make what business accepted completely.

Summary of the invention

The present invention relates to one thermally and/or electrically-conductive composites, described complex apply Can distribute as beadlet, block, pattern or other forms under pressure, nozzle send or by sieve Or the opening printing in masterplate, or otherwise can be distributed by hole.Pipe, set can be contained in A certain amount of complex in cylinder or other containers can distribute from the teeth outwards, and this surface is with relative , engage, coordinate or otherwise adjacent formation gap, surface, or directly distribute In the gap formed between abutment surface.When applied, complex " original place " is (that is, former Position) form the beadlet of material or block.In gap, the beadlet of the complex that original place is formed or block As conformal boundary material, at least partly to fill gap, thus between the surfaces provide heat and / or electricity-conductive path.

But, different from more conventional " original place formation " material, the complex of the present invention includes Gel component that is the most fully crosslinked or that otherwise solidify is as key component, such as It is described more fully in commonly assigned U.S. Patent number 7,208,192.But, by can The resin Composition of solidification combines with gel component, can prepare complex, to keep can distributing with soft Soft, for use as gel mat or other boundary materials, but after distribution and deformation (deflect) Solidification further, to be limited between the element in electronic installation or to migrate in other application.This Outward, curable resin and the combination of gel component make before or after deformation, complex Beadlet, pad or other forms of distribution start time formed solidification outer layer or crust, for use as " resin dike ", for accommodating complex in relative thick or deep gap and joint.

The complex of the present invention in being contained in pipe, sleeve or other containers or otherwise supplied Can at room temperature store, and need not freezing or that other are special storage.Have and applying Pressure under assignable flowing viscosity while, complex is generally also provided with viscoelasticity, and Obvious filling settlement is not presented when filling.This complex has unlimited storage the most effectively Deposit time limit and working time, and can provide as one-component system, it is not necessary to before a distribution Mixed by user or carry out solidification after the distribution and arrange.No matter with beadlet, block or other shapes Formula is used, and the complex of distribution is usually form stable, thus can be with conventional molding or crowded The bar, pad, sheet material or other prefabrications that go out are similarly processed for assembly.Although additionally, Beadlet or the block of distribution are form stable, but also dead-soft and be conformal, when deformation Need little power or substantially need not power.Automatization's distributing equipment can be used to use complex, Or use the spreader rifle of pneumatically or manually-operation otherwise to use.

In an exemplary embodiment, being formulated as by complex is flowing under an applied pressure , but the form stable when being applied in surface or gap, as the blend of following material Or other mixture: (I) polymer gel component；(II) curable resin Composition；(III) Can be thermally and/or electrically-conductive particles or the filler of their blend.Gel component can be such as For thermoplastic gel or silicone gel (it can be organopolysiloxane).Curable resin Composition Can be that room temperature vulcanization (RTV) can the silicone resin of moisture solidification.Advantageously, complex can be filled out It is charged to the load level such as between the about 20-90% of gross weight, to present at least about 0.5 The thermal conductivity of W/m-K, this forms, with current molding or original place, the thermal conductivity class that material presents Seemingly, but still can use the equipment distribution of routine simultaneously.

Therefore, present invention resides in structure, the element illustrated in detailed disclosure subsequently Combination and/or parts and the arrangement of step.Advantages of the present invention includes substantially completely-solidifies Heat or reply compound by cable, its can distribute for original place formed uses, but allow " further " former The other safety margin of ground solidification.Other advantages include soft and conformal complex, and it is at dress During joining, there is the stable distribution speed of rapid form, low-force deformation, and in sane shake Dynamic and vibration is absorbed heat or solidifies further in the application of electricity assembly.Based on the disclosure contained by this paper, These and other advantages will be readily apparent to one having ordinary skill.

Accompanying drawing is sketched

In order to be more fully understood by character and the target of the present invention, in conjunction with accompanying drawing with reference in detailed below Illustrate, in accompanying drawing:

Fig. 1 be when distributing from the teeth outwards the present invention thermally and/or electrically-generation of conductive composites The perspective view slightly illustrated that table is used；

Fig. 2 is the sectional view on display surface (surface of such as Fig. 1), this surface and matching surface Be oppositely arranged with between form interfacial gap, the beadlet of the complex of the present invention wherein used, Block or other forms show can fit at least partly to fill gap between the surfaces；With

Fig. 3 is the sectional view for choosing application showing complex of the present invention as joint filling.

Each accompanying drawing is further described in conjunction with following detailed Description Of The Invention.

Detailed Description Of The Invention

For convenience rather than any restricted purpose, some term can be used in the following description. Such as, term " forward ", " backward ", " right ", " left ", "up" and "down" Assigned direction in involved accompanying drawing, wherein term " inwardly ", " internal ", " interior " Or " inner side " and " outwards ", " outside ", " outward ", " outside " refer to respectively towards With the direction at the center away from the element related to, and term " radially " or " level " and " axially " or " vertically " refers to hang down perpendicular and parallel side with the center longitudinal axis relating to element respectively To, axle, plane.It not that the term of the similar input of the above language specifically mentioned equally should Regard as convenience rather than any restrictive sense.It addition, term " EMI Shielding " it is understood to include, and be used interchangeably with following term: electromagnetic compatibility (EMC), conductivity and/or ground connection, corona shielding, Radio frequency interference (RFI) shielding and antistatic I.e. static discharge (ESD) protection.

In the accompanying drawings, having the element that alphanumeric specifies can mention the most jointly, or For choosing, such as context it will be apparent that the only numerical portion by specifying is mentioned.This Outward, the ingredient of different elements can be specified with single labelling in the accompanying drawings, this it should be understood that For being this ingredient of finger element rather than whole element.Available arrow specify typically mention with And space, surface, size and degree are mentioned.

In order to the purpose of following discloses is described, mainly describe herein in conjunction with heat-conductive preparation The present invention related to thermally and/or electrically-conductive composites.This preparation can be as hot interface material Material in thermal management assemblies use, under an applied pressure can as beadlet, block, pattern or its He distributes at form, nozzle send or by the opening printing in sieve or masterplate, or can pass through Hole on the heating surface of radiating component (such as radiator) is otherwise distributed, for The cooperation heating surface of electronic component carries out heat transfer contact.Therefore, this assembly and hot interface material Material is described in U.S. Patent number 6,096,414 elsewhere；6,054,198；5,798,171； 5,766,740；5,679,457；5,545,473；5,533,256；5,510,174；5,471,027； 5,359,768；5,321,582；5,309,320；5,298,791；5,250,209；5,213,868； 5,194,480；5,137,959；5,167,851；5,151,777；5,060,114；4,979,074； 4,974,119；4,965,699；4,869,954；4,842,911；4,782,893；4,764,845； 4,685,987；4,654,754；4,606,962；4,602,678；4,473,113；4,466,483； 4,299,715；With 3,928,907.However, it should be understood that each aspect of the present invention can be used In other thermal management applications, and the most such as joint filling uses.Due to additionally or in the alternative Being configured to electrical conductivity, the complex of the present invention also acts as original place and forms EMI shielding material Material.Therefore, this purposes and application should be regarded as the most within the scope of the invention.

Rule according to the present invention, it is provided that the complex of flowing, it presents in terms of total form Continuous print gel phase and in continuous phase the discontinuous phase of scattered particulate filler.Flowing and viscous Thick or viscoelastic this complex be especially suitable for use as original place formed (FIP) hot interface or EMI shielding gasket material, as the most non-cave in or otherwise form stable beadlet, Block or other forms can be distributed, nozzle send or by the opening printing in sieve or masterplate, or Person is otherwise divided by the hole on the surface of base material (such as radiator or electronic component) Join.So beadlet, block, pattern or other forms of distribution is conformal, therefore can be filled in Electronic installation and electricity the component of equipment, between circuit board and the abutment surface of shell or at it Gap between his abutment surface (such as can be in middle existence such as building structure).

In an exemplary formulation, the complex of the present invention is configured to the flowing of following components Mixture: the polymer gel component that (a) solidifies；B resin Composition that () is curable；(c) Filler component." flowing " refers to that the compositions of mixing presents representative fluid flow characteristics, Can pass under pressure through distributing nozzle, pin or other holes (such as printing sieve or masterplate) with to Fixed flowing velocity extrusion.Such as, the pressure of applying at about 90psi (620kPa) be can be observed Under power, it is about 2g/ minute by the flow rate in 0.047 inch of (1mm) hole.Additionally, carry It is enough thickness or viscoelastic for complex, such as, in about normal room temperature (i.e., about 25-30 DEG C) under, about 15,000,000cps so that compositions can by or by nozzle, pin, sieve Or the distribution of other holes, as beadlet, block, pattern or other forms of usual form stable." shape Formula is stable " refer to that the amount being applied to the compositions of base material is at least in the range of normal room temperature At a temperature of cave in essentially without significantly (that is, less than 25%), hang from above, be cast in the steady state Or other flowings." solidification " refers to gel component, and unless containing reactive assistant or Diluent, except when beyond can normally developing after aging, complex itself does not present further Significantly it is polymerized, cross-links, vulcanizes, hardens, is dried etc. and chemically or physically to change, such as from it The gel form of flowing becomes solid or semi-solid form or phase." curable " refers to resin Component after the distribution and carried out before or after deformation further significantly polymerization, crosslinking, Vulcanize, harden, be dried etc. and chemically or physically to change, such as from its thickness flowed or viscoelastic Property form becomes solid or semi-solid form or phase.

Can be used as the gel of polymer gel component (a) include based on silicone (that is, polysiloxanes, Such as polysiloxane) system, and system based on other polymer, it can be heat Plasticity or heat cured, such as polyurethane, polyureas, fluoropolymer, chlorosulfonic acid ester, poly-fourth Diene, butyl rubber (butyls), neoprene, nitrile, polyisoprene and nitrile rubber, altogether Polymers, such as ethylene-propylene (EPR), styrene-isoprene-phenylethene (SIS), styrene- Butadiene-styrene (SBS), Ethylene-Propylene-Diene monomer (EPDM), nitrile-butadiene (NBR), Styrene ethylene butadiene (SEB) and styrene-butadiene (SBR), and their blend, Such as ethylene or propylene-EPDM, EPR or NBR." polymer coagulates terms used herein Glue " in a kind of implication, belong to the conventional sense of the polymer system of its fluid-increment, should System can include chemically the continuous print polymerization of (such as, ion or covalency) or physical crosslinking mutually or Network, and oil, such as silicone or other oil, plasticizer, unreacted monomer or swelling or with Other modes fill other fluid extender in the space of network.The crosslinking of this network can be controlled Density and the ratio of extender, to change modulus (that is, pliability) and other character of gel. Term " polymer " (or optionally for silicone) gel " being also understood as including alternatively can be wide in range Be categorized as having with gel-like as the pseudo gel of viscoelasticity property or tremelloid material, than As having " loose " cross-linked network formed by relatively long cross linked chain, but such as lack Fluid-extender.

About silicone gel, the most soft silicone gel, such as by NuSil Technology (Carpinteria, CA) sells with title " GEL-8100 ".Such as basis ASTM D217, this gel osmotic value under its condition of cure is about 100 × 10^-1mm。 Other soft silicone gels have by Dow Corning (Midland, MI) with title " 3-6636 " Sell.

Can be used as that the resin of curable resin Composition (b) includes can the room temperature-sulfuration of moisture solidification (RTV) silicone, such as at U.S. Patent number 6,096,413 and 5, described in 910,524. This silicone can be oxime or other condensation cured polymer.Curable resin Composition (b) and solidification The blend of gel component (a) gross weight about 5-50% based on component (a) and (b) weight can be comprised The curable resin Composition (b) of amount.

According to an aspect of the present invention, polymer gel and the blend of curable resin Composition By its load filler component (c) and give heat-conductivity, filler component (c) can comprise one or Multiple heat-conductivity particulate filler.About this point, polymer gel component is usually formed viscous Mixture, heat-conductive filler is disperseed in the adhesive.The ratio of the filler comprised be enough to Thermal conductivity needed for intended application is provided, and generally loads the pact between complex gross weight Between 20-90%.For purposes of the invention, the size and dimension of filler is not crucial. About this point, filler can have any common shape, is broadly characterized as " granule ", bag Include solid or hollow ball or microsphere, thin slice, plates, irregular or cellulosic, Such as chopped or the fiber that grinds or filament, but preferably powder, to guarantee uniform point That dissipate and homogenizing mechanically and thermally character.The particle diameter of filler or distribution typically range between about 0.01-10 In the range of mil (0.25-250 μm), its can be diameter, input diameter, length or granule its His size, but can become according to the thickness in gap to be filled further.If so desired, fill out Material may be selected to be electrically non-conductive so that complex can be dielectric or electricity-insulation and hot- Conductive.Or, in the application that need not electric insulation, filler can be electric-conductive.

Suitably heat-conductive filler generally includes oxide, nitride, carbide, two boron Compound, graphite and metallic particles, and their mixture, more particularly boron nitride, two boronations Titanium, aluminium nitride, carborundum, graphite, metal such as silver, aluminum and copper, metal-oxide are such as Aluminium oxide, magnesium oxide, zinc oxide, beryllium oxide and stibium oxide, and their mixture.This The thermal conductivity peculiarly presented between about 20-50W/m-K of filler.For economical former Cause, can use aluminum oxide, i.e. aluminium oxide, and for reasons of improving thermal conductivity, more excellent Choosing considers boron nitride.Load heat-conductive filler, according to ASTM D5470, complex allusion quotation The thermal conductivity of at least about 0.5W/m-K can be presented type, and according to ASTM D5470, can Present less than about 1 DEG C-in²/W(6℃-cm²/ W) thermal impedance, but can be according to composite layer Thickness and become.

According to a further aspect in the invention, polymer gel component (a) and curable resin group The blend of point (b) gives electricity-conductivity by its load electricity-conductive filler, except hot- Can provide beyond conductive filler (that is, blend), or replace heat-conductive filler.It addition, According to selected filler, this filler can be used as heat and electricity-conductive filler.

Suitably electricity-conductive filler includes: noble metal and base metal, such as nickel, copper, Stannum, al and ni；The plating noble metal of noble metal or base metal, the most silver-plated copper, nickel, aluminum, Stannum or gold；Plate copper or the silver of non-noble metal noble metal and base metal, such as nickel plating；And plating Noble metal or non-noble metal nonmetal, the most silver-plated or graphite of nickel plating, glass, pottery, Plastics, elastomer or Muscovitum；Mixture with them.Filler also can be broadly classified as " Grain " form, but it is believed that the concrete shape of this form is not crucial for the present invention, and And conventional in the manufacture of the conductive of material of the type that present document relates to or preparation relating to can be included Any shape, including hollow or solid microspheres, elastomer balloon, thin slice, plates, fibre Dimension, rod, the granule of irregular-shape, or their mixture.It also hold that the grain of filler Footpath is not crucial, and can be narrow or wide distribution or scope, but generally between about Between 0.250-250 μm.

Filler load percentage in the composition be enough to provide intended and applies desired gap Interior conductivity and the level of EMI shield effectiveness.Great majority are applied, about 10 In the frequency range of MHz-10GHz, the EMI shield effectiveness of at least 10dB is considered to connect It is subject to, and generally at least 20dB, and preferably at least about 60dB or higher.This effect Rate is converted into generally optionally based on complex cumulative volume or weight between about 10-90% volume Or the proportion of filler of 50-90% weight, and the body of no more than about 1 Ω-cm or specific insulation, But it is known by using EMI absorbability or " lossy " filler such as ferrite or painting The graphite of cloth nickel, can realize comparable EMI shield effectiveness under relatively low conductivity. Also as is known, the final shield effectiveness of component 32 will based on electricity-conductivity or other fill out The material amount of material and film thickness and become.

According to the requirement of intended concrete application, other filler and additive can be included in compound In the preparation of thing.This filler and additive can include routine wetting agent or surfactant, Pigment, dyestuff and other coloring agent, opacifier, defoamer, antistatic additive, coupling agent are such as Titanate, chain extension oil, viscosifier, pigment, lubricant, stabilizer, emulsifying agent, antioxidation Agent, thickening agent and/or fire retardant such as aluminum trihydrate, antimony trioxide, metal-oxide and Salt, the graphite granule of insertion, phosphate ester, decabromobiphenyl oxide, borate, phosphate, Halo complex, glass, can be pyrolysismethod or the silicon dioxide of crystallization, silicate, Muscovitum, With glass or polymeric microspheres.Typically, these fillers and additive are blended with preparation or with Other modes mix, and can comprise between the about 0.05-90% or more of its cumulative volume.

Such as, complex can be prepared in the mixing apparatus of mill or other routines, as one Kind or various kinds of resin or the mixture of other polymer, other polymer can be also oligomer or in advance Polymers, optionally, according to system, for cross-linking agent, catalyst and extender, filler component and Optional additive component.Before mixing, polymer gel component (a) can be stood polymer Further polymerization or otherwise by resin, oligomer or prepolymer cures or be converted into fluid Or the condition of the polymer gel component of nonfluid increment.About this point, mixture can be added Heat, such as in the case of hot addition polymerization (that is, vulcanize or cross-link) system.Or, chemistry or thing Reason gelation reaction can i.e. hydrolyze at atmospheric water, be exposed to ultraviolet (UV) radiation or other solidifications Carry out under the influence of mechanism such as anaerobic curing.

According to the polymer gel system used, can be by inorganic or organic solvent or other diluent Or rheological agent joins in the mixture of complex, to control the viscosity of final complex, can Regulation viscosity is for application equipment to be used or technique.As mentioned, final complex Viscosity at about 25-30 DEG C could typically be about 15,000,000cps.Before mixing or it After, complex also can be made to foam, such as physical foaming agents (such as nitrogen, carbon dioxide or Other gases) or chemical blowing agent (its can be organic double compound or inorganic composite such as decomposes or Volatilization and produce the water of gas) control under.After mixing, complex can be loaded single pipe, In sleeve or container, and store the most such as to use hand-held applicator rifle or syringe, Or alternatively use automatic gauge and distributing equipment such as robot applicator to use.

With reference now to accompanying drawing, wherein running through several figures, corresponding reference is used for specifying accordingly Element, the most identical element specifies reference with primary or continuous print alphanumeric, The exemplary allocations of communication resources of the complex of the present invention of mixing and solidification use the most in FIG 10 Place's display.In FIG, by a certain amount of under display (illustrates with arrow 14) under an applied pressure The complex of 12 is assigned on that prime or unprimed surface 16, this surface can as a example by Plastics, metal or pottery such as radiator, cold drawing, circuit board, case member or electronic component Surface.About this point, the supply (with reference to 18) of display complex loads as one-component system Sleeve, pipe or other containers 20 that fluid communication connects, can use the nozzle 22 with hole 24 As directed direct supply or supplied by the flexible pipe being connected with head or other conduits.12 will be measured The hole passed through of complex distribution can be alternatively the opening in sieve or masterplate, such as printing During type distribution is used.

Rifle or syringe can used manually to apply or passing through air or without air measuring equipment (ratio Such as dispensing cylinder or pump) the applying pressure that produces 14 times, the complex of metered amount can as pad or Other send from nozzle 22 and to surface 16.When applied, amount 12 can substantially self-adhesion Invest surface 16, such as by surface tension, inherent viscosity or other cohesivenesss.With oils and fats Deng different, amount 12 can be advantageously form stable at normal room temperatures so that is executed For parts or element can be treated for assembly or contrary.Additionally, with adhere to surface To form complex different in conventional original place, the complex of the present invention can be easily clear from surface 16 Clean or otherwise remove with repair or reform.

With reference now to Fig. 2, display module figure, wherein there is the surface 16 of amount of application 12 with same Sample can be the cooperation table on the surface of radiator, cold drawing, circuit board, case member or electronic component Face 30 relatively or is provided adjacent to other heat, with between limit gap (with reference to 32), gap Can be such as from about 2 mils (0.05mm) or following to about 100 mils (2.5mm) or above model Enclose.In gap 32, it can be seen that complex (mentioning now as layer 34) meets surface 16 and 30, And at least partly fill gap 32.Advantageously, can relatively low power or essentially without The conformal deformation of layer 34 is realized, it is, such as, at about 0.3psi (2kPa) under conditions of power The lower compression of about 25% or force deformation, and about 1psi's (6kPa) or lower about 50% Compression or force deformation.Before using this deformation, due to the tide of curable resin Composition (b) Curing or other solidifications, the most tack-free outer layer or crust (representing with 36) can when starting Formed around the edge (with reference to 38) of layer 34.Initial due to curable resin Composition (b) Solidification, can form this crust 36, and it can the most about 5-10 minute and at moisture Formed when being exposed to atmospheric water in the case of solidification resin.Further in curable component (b) Before solidifying and therefore improve total viscosity of complex, crust 36 can be used as " resin dike ", Migrate between surface 16 and 30 with relieved layer 34.

Or, can by the complex direct injection of cambium layer 34 to gap 32, such as via The perforate (with reference to 40 in profile) formed by one of surface 16 or 30.It addition, and With reference now to Fig. 3, in the gap between abutment surface 44 and 46, can change into as beadlet 40 use complex, such as along seam 42.In this using, at curable resin Before component (b) solidification further, can be in the outer surface of beadlet 40 or other edge (references 50) initial crust (representing with 48) is formed on.This crust 48 similarly serves as " resin dike ", To accommodate beadlet 40 in seam 42.

Due to it is contemplated that without departing under the rule that present document relates to, the present invention can be carried out some and change Become, thus be directed at all the elements included in preceding description should be interpreted that illustrative rather than Restrictive sense.All lists of references (including herein cited any priority document) are by drawing With being expressly incorporated into herein.

Claims (25)

1. fill the space between the first and second surfaces with the method forming assembly, institute The method of stating comprises the following steps:

The supply of a complex that () offer forma fluens is stable, described complex comprises following The mixture of component: the polymer gel component that (I) solidifies；(II) curable resin Composition； (III) particulate filler component；

B () distributes a certain amount of described complex；

C (), before or after step (b), forms space, institute between the first and second surfaces State space at least partly to be filled by the complex distributed in step (b) at least partially；With

D () solidifies described curable resin Composition, to form conforma layer in described space, Described layer is formed by the resin Composition solidified, the polymer gel component of solidification and filler component.

2. the process of claim 1 wherein:

One that the complex of distribution in step (b) is assigned in the first and second surfaces On；With

By in the first and second surfaces is disposed adjacent to first after step (c) With another and the space of forming step (c) in second surface, wherein will divide in step (b) The complex joined deforms betwixt, at least partly to fill described space.

3. the process of claim 1 wherein:

The space of forming step (c) before step (c)；With

The complex of distribution in step (b) is assigned in described space.

4. the process of claim 1 wherein that described complex is included as component (I), (II) and (III) The filler component of the 20-90% of gross weight.

5. the process of claim 1 wherein that described complex is included as component (I) and (II) gross weight The component (II) of the 5-50% of amount.

6. the process of claim 1 wherein that the mean diameter of described filler component is 0.01-10 Mil.

7. the process of claim 1 wherein that the thickness in the space of formation is in step (c) 2-100 mil.

8. the process of claim 1 wherein:

Described space is heat space；With

Described filler component is hot-conductive.

9. the method for claim 8, the thermal conductivity of wherein said filler component is at least 20 W/m-K。

10. the method for claim 8, wherein said filler component selected from oxide, nitride, Carbide, diboride, graphite and metallic particles and their mixture.

The method of 11. claim 8, the thermal conductivity of wherein said complex is at least 0.5 W/m-K。

12. the process of claim 1 wherein that described complex viscosity at 25-30 DEG C is 15,000,000cps。

The method of 13. claim 2, wherein said complex is substantially from adhering to the first He In at least one in second surface, step (b) is distributed described complex to described at least one On individual.

14. the process of claim 1 wherein:

Described space is EMI shielding space；With

Described filler component is electric-conductive.

The method of 15. claim 14, the electric specific insulation of wherein said complex is little In 1 Ω-cm.

The method of 16. claim 14, wherein said complex is substantially at 10MHz-10 The EMI shield effectiveness of at least 60dB is presented in the frequency range of GHz.

17. the process of claim 1 wherein that described polymer gel component comprises silicone polymer Thing.

18. the process of claim 1 wherein that described resin Composition comprises silicone resin.

The method of 19. claim 18, wherein said silicone resin is can moisture solidification.

The method of 20. claim 1, it is other that described method is additionally included in before step (b) Step:

There is provided the hole being connected with the supply of described complex with fluid communication, wherein

Under an applied pressure, described hole in step (b), described complex is distributed.

The method of 21. claim 20, wherein in step (a) in the way of loading in container The supply of described complex is provided.

22. the process of claim 1 wherein:

To have form described complex of distribution in step (b) at edge；With

The first solidification in step (b) of described resin Composition, with the perimeter in described form Form crust.

The method of 23. claim 22, wherein said form is pad or beadlet.

The method of 24. claim 22, wherein said crust forms dike at described perimeter.

25. assemblies, described assembly is formed by the method any one of aforementioned claim.