CN102947886A - 存储设备测试系统内的阻尼振动 - Google Patents

存储设备测试系统内的阻尼振动 Download PDF

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CN102947886A
CN102947886A CN2011800299516A CN201180029951A CN102947886A CN 102947886 A CN102947886 A CN 102947886A CN 2011800299516 A CN2011800299516 A CN 2011800299516A CN 201180029951 A CN201180029951 A CN 201180029951A CN 102947886 A CN102947886 A CN 102947886A
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CN102947886B (zh
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彼得·马蒂诺
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Teradyne Inc
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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
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    • GPHYSICS
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    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
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    • G11B33/128Mounting arrangements of constructional parts onto a chassis of the plurality of recording/reproducing devices, e.g. disk drives, onto a chassis

Abstract

本发明公开了一种包括壳体的存储设备测试槽。所述壳体限定用于接纳要进行测试的存储设备的测试室。一个或多个调谐质量阻尼器连接到所述壳体。所述一个或多个调谐质量阻尼器被构造为抑制所述壳体以一种或多种预定频率振动。

Description

存储设备测试系统内的阻尼振动
相关专利申请的交叉引用
本专利申请要求提交于2010年6月17日的美国专利申请No.12/817,614的优先权,所述专利申请的内容据此全文以引用方式并入。
技术领域
本公开涉及存储设备测试系统中的阻尼振动。
背景技术
存储设备制造商通常会测试所制造的存储设备是否符合一系列要求。存在串行或并行测试大量存储设备的测试设备和技术。制造商往往会同时或分批地测试大量存储设备。储设备测试系统通常包括一个或多个测试器支架,所述一个或多个测试器支架具有接纳要进行测试的存储设备的多个测试槽。在一些情况下,存储设备设置在托架中,所述托架用于将存储设备装载至测试支架和从测试支架卸载存储设备。
调节紧邻存储设备的测试环境。对于精确的测试条件和存储设置的安全性而言,测试环境中的最小温度波动可为至关重要的。另外,具有较高容量、较快旋转速度和较小磁头间隙的最新代磁盘驱动器对振动较为敏感。过度振动可影响测试结果的可靠性和电连接的完整性。在测试条件下,驱动器自身可通过支承结构或固定装置将振动传播到相邻单元。此振动“串扰”和外部振动源一起会造成碰撞故障、磁头松动和非重复性脱离磁道(NRRO),从而可能导致较低的产量和增加的制造成本。当前的存储设备测试系统采用自动化和结构化支承系统,所述自动化和结构化支承系统会造成系统中的过度振动并且/或者需要大的占用空间。
发明内容
整体上,本发明涉及测试槽托架以及相关的设备、系统和方法。
在一个方面,存储设备测试槽包括壳体。壳体限定用于接纳要进行测试的存储设备的测试室。测试槽还包括连接(如,使用粘合剂、紧固件等一体地形成或耦合)到壳体的一个或多个调谐质量阻尼器。一个或多个调谐质量阻尼器被构造为抑制壳体以一种或多种预定频率振动。
实施例可包括以下一个或多个特征。
在一些情况下,一个或多个调谐质量阻尼器包括连接到壳体的横梁。横梁一体地连接到壳体(如,与壳体一起模制、加工或以其他方式成形)。横梁包括被构造为相对于彼此滑动的两个或更多个层。横梁包括悬臂梁。一个或多个调谐质量阻尼器还包括耦合到横梁的重物。该重物与横梁成一整体。一个或多个调谐质量阻尼器还包括设置在横梁与重物之间的一层吸能材料。吸能材料包括弹性体、粘弹性粘合剂和/或粘滞液体。一个或多个调谐质量阻尼器还包括固定到吸能层表面的一层大体刚性的材料。所述大体刚性的材料设置在吸能层与重物之间。一种或多种预定频率与壳体的一种或多种振动模式相关。测试室被构造为接纳并支承用于携带要测试的存储设备的存储设备输送器。一个或多个调谐质量阻尼器连接到壳体的外表面。一个或多个调谐质量阻尼器连接到壳体的内表面。
实施例可包括以下一个或多个优点。
向存储设备测试槽中添加一个或多个调谐质量阻尼器可以显著减小存储设备测试槽以一种或多种预定频率的振动。调谐质量阻尼器的总体设计使得可将其设计成对存储设备测试槽的若干模式进行衰减。可以调整悬臂梁、金属重物、刚性层和吸能层的尺寸和特性,以使得阻尼器具有的以若干频率进行振动的振动模式可与存储设备测试槽的若干棘手的振动模式相匹配。
附图说明
图1为存储设备测试系统的透视图。
图2A为测试支架的透视图。
图2B为得自图2A的测试支架的托架容器的详细透视图。
图3A和3B为测试槽托架的透视图。
图4为测试槽组件的透视图。
图5为存储设备测试系统的俯视图。
图6为存储设备测试系统的透视图。
图7A和7B为存储设备输送器的透视图。
图8A为支承存储设备的存储设备输送器的透视图。
图8B为接纳存储设备的存储设备输送器的透视图。
图8C为携带被对准插入到测试槽内的存储设备的存储设备输送器的透视图。
图9为测试电路的示意图。
图10A、10B和11为测试槽的透视图。
图12为包括调谐质量阻尼器的测试槽的透视图。
图13为测试槽上的调谐质量阻尼器的放大透视图。
图14为示出使用和不使用调谐质量阻尼的振动测量的曲线图。
不同附图中的类似参考符号表示类似的元件。
具体实施方式
系统概述
如图1所示,存储设备测试系统10包括多个测试支架100(如,图中示出了10个测试支架)、转运站200和自动控制装置300。如图2A和2B所示,各个测试支架100通常包括底座102。底座102可由多个结构构件104(如成形的金属片、挤出的铝、钢管材、和/或复合构件)来构造,所述多个结构构件104被紧固在一起并且共同限定多个托架容器106。
每个托架容器106可支承一个测试槽托架110。如图3A和3B所示,各个测试槽托架110均支承多个测试槽组件120。测试槽托架110中的不同者可被构造为进行不同类型的测试和/或测试不同类型的存储设备。测试槽托架110彼此也可在测试系统10内的多个托架容器106中互换,由此允许例如基于测试需要来修改和/或定制测试系统10。在图2A所示的例子中,空气导管101提供相应测试支架100的各个测试槽组件120与空气热交换器103之间的气动连通。空气热交换器103设置在远离所接纳测试槽托架110的托架容器106的下方。可与本文所述的那些相结合的测试支架基础构造和特征的其他细节也可存在于提交于2010年2月2日、名称为“STORAGE DEVICE TESTINGSYSTEM COOLING”(存储设备测试系统冷却)、代理人档案号:18523-0103001、发明人:Brian S.Merrow并具有分配的序列号12/698,575的美国专利申请中。
如本文所用的存储设备包括磁盘驱动器、固态驱动器、存储器设备以及受益于异步测试的任何设备。磁盘驱动器通常为在具有磁性表面的快速转动盘片上存储数字编码数据的非易失性存储设备。固态驱动器(SSD)为使用固态存储器存储永久性数据的数据存储设备。使用SRAM或DRAM(而非闪存)的SSD通常称为RAM驱动器。术语“固态”一般来讲用于区分固态电子器件和机电器件。
如图4所示,各个测试槽组件120包括存储设备输送器400、测试槽500和相关的空气移动装置组件700。存储设备输送器400可用于捕集存储设备600(如从转运站200)以及将存储设备600输送至测试槽500中的一个来进行测试。
参见图5和6,自动控制装置300包括机械臂310和设置在机械臂310远端的机械手312(图5)。机械臂310限定了垂直于地板表面316的第一轴线314(图6),可操作机械臂310以在自动控制装置操作区域318内按预定弧线围绕第一轴线314旋转以及从第一轴线314径向延伸。机械臂310被构造为通过在转运站200与测试支架100之间输送存储设备600来独立地为每个测试槽500提供服务。在一些实施例中,机械臂310被构造为使用机械手312从测试槽500中的一个移出存储设备输送器400,然后使用存储设备输送器400从转运站200获取存储设备600,接着将存储设备输送器400及其中的存储设备600返回到测试槽500以测试存储设备600。测试之后,机械臂310从测试槽500中的一个取回存储设备输送器400及支承的存储设备600,然后通过操纵存储设备输送器400(即,使用机械手312)将其返回到转运站200(或将其移至测试槽500中的另一个)。在一些实施例中,机械臂310被构造为使用机械手312从转运站200获取存储设备600,然后将存储设备600移至测试槽500,并且通过将存储设备600设置在存储设备输送器400中并接着将存储设备输送器插入到测试槽500中来将存储设备600设置在测试槽500中。测试之后,机械臂310使用机械手312从存储设备输送器400移出存储设备600并将其返回到转运站200。
参见图7A和7B,存储设备输送器400包括框架410。框架410包括面板412。如图7A所示,面板412沿着第一表面414限定凹陷416。凹陷416可以可脱开的方式被机械臂310的机械手312接合(图5),从而使得机械臂310可抓取和移动输送器400。如图7B所示,面板412还包括斜边缘417。如图7A和7B所示,存储设备输送器400包括具有第一部分402和第二部分404的输送器主体410。输送器主体410的第一部分402包括被构造为接纳或以其他方式接合机械手312(图5)来进行输送的操纵结构416(如,凹陷、凸出、孔洞等)。输送器主体410的第二部分404被构造为接纳存储设备600。在一些例子中,输送器主体的第二部分404限定了由输送器主体410的第一侧壁、第二侧壁418和底板420形成的大致U形开口415。存储设备600接纳在U形开口415中。
如图8A和8B所示,在存储设备600在存储设备输送器400的框架410内就位的情况下,可以使用机械臂310(图6)使存储设备输送器400和存储设备600一起移动,从而将其放置到测试槽500中的一个内。机械手以及可与本文所述的那些相结合的其他细节和特征的详细描述可存在于提交于2008年4月17日、名称为“Transferring DiskDrives Within Disk Drive Testing Systems”(在磁盘驱动器测试系统内输送磁盘驱动器)、代理人档案号:18523-073001、发明人:EvgenyPolyakov等人并具有分配的序列号12/104,536的美国专利申请中,上述申请的全部内容据此以引用方式并入。
参见图9,在一些具体实施中,存储设备测试系统10还可包括至少一台与测试槽500连通的计算机130。计算机130可被构造为提供存储设备600的库存控制和/或提供用于控制存储设备测试系统10的自动化接口。测试电子器件160与各个测试槽500连通。测试电子器件160与设置在各个测试槽500内的连接接口电路182电气连通。这些连接接口电路182被设置为与接纳在相关的测试槽500内的存储设备600电气连通,并由此提供测试电子器件160与测试槽500内的存储设备600之间的连通(如)以便执行测试程序。测试程序可包括功能测试,所述功能测试可包括测试存储设备600接收的功率、工作温度、读写数据的能力以及在不同温度下读写数据的能力(例如在热的时候读取数据并在冷的时候写数据,或反之亦然)。功能测试可以测试存储设备600的每个存储扇区或仅随机采样测试。功能测试可以测试存储设备600的工作温度以及与存储设备600通信的数据完整性。
如图9所示,电力系统170为存储设备测试系统10供电。电力系统170可监控和/或调节对测试槽500中接纳的存储设备600的电力供应。
测试槽
如图10A和10B所示,测试槽500包括形成多个表面的壳体502。壳体502形成第一侧面504、第二侧面506、顶板508、第一底板509以及第二底板510。在图10A和10B的例子中,仅仅出于举例说明的目的,对测试槽500进行取向,使得底板510面朝上。
在测试槽500的一端,壳体502形成由侧壁504、506、顶板508以及第一底板509限定的开口512。开口512可以被设计成接纳并支承存储设备600(图8B),或存储设备输送器400和存储设备600两者(图8B)。容纳有存储设备600和存储设备输送器400两者的测试槽的例子在图11中示出。
一旦将存储设备放置在测试槽500中,就可以对存储设备进行各种测试,例如上述的那些测试。在测试期间,存储设备易受各种组件振动的影响。例如,在测试过程中,测试槽500容纳有存储设备、电子器件、风扇、加热器以及完成测试所需的其他部件。当这些组件中的任一种均可导致可能对测试造成不利影响的多余振动时,测试槽500中振动的另一个来源为测试槽500自身的振动模式。测试槽500的振动模式可以放大来自存储设备、风扇、外部声学噪声以及其他来源的振动。
为了减小测试槽500的振动,可以向测试槽的一部分添加被设计为接收一种或多种特定频率下的振动能量并随后将该能量耗散掉的设备。如图12所示,第二底板510设置有调谐质量阻尼器522,以通过吸收和耗散振动能量而对测试槽500的振动模式中的一种或多种进行衰减。
调谐质量阻尼器522的更详细视图在图13中示出。调谐质量阻尼器522由多个组件组成。悬臂梁514(在图10A和10B中最清楚地看到)位于调谐质量阻尼器522的基座处。悬臂梁514被示为与测试槽500(具体地讲,与第二底板510)成一整体,并且可经由切割通过测试槽500的第二底板510的凹槽而形成。悬臂梁不必与测试槽500成一整体;然而,通过该设计可使悬臂梁514具有紧凑性并刚好放入测试槽500的稀有自由空间内。在一些供替代的选择中,悬臂梁514可以作为替代形成为耦合到测试槽的单独一块。
重物532(图13)连接到悬臂梁514(如,耦合到悬臂梁514或整体地形成于悬臂梁514中)。重物包括悬于悬臂梁514之上的凸缘533。重物532的凸缘533与悬臂梁514之间存在两个材料层。第一材料层为连接到悬臂梁514(如,耦合到悬臂梁514或整体地形成于悬臂梁514中)的吸能层534。吸能层可包含(例如)吸能弹性体。第二材料层为由刚性材料(如,金属或塑料)构成的刚性层536,并附接到吸能层534的表面。刚性层536起到增大吸能层534中张力的作用,其可改善吸能层534吸收能量的能力。刚性层536还起到增大悬臂梁硬度的作用。
选择调谐质量阻尼器522的组件的尺寸和材料,以使得调谐质量阻尼器522具有以与测试槽500的振动模式大约相同的频率振动的一种或多种振动模式。可以将调谐质量阻尼器522定位在测试槽500上的在测试期间显著振动的某一点处。因此,当测试槽500的壳体502振动时,将会激发调谐质量阻尼器522的振动模式,从而导致振动能量流入调谐质量阻尼器522内,并随后被吸能层534吸收并耗散掉。
图14为示例性曲线图1400,示出了不具有调谐质量阻尼器的测试槽的振动能级1402(实线)与配有调谐质量阻尼器的测试槽的受抑制振动能级1404(虚线)的对比。如上所述,调谐质量阻尼器被设计为吸收预定频率的振动能量。在图14的例子中,调谐质量阻尼器已被设计为吸收大约230hz的振动能量。通过将振动能级1402的峰值1406与受抑制振动能级1404的对应峰值1408进行比较,明显看出,调谐质量阻尼器抑制了其上安装有该阻尼器的测试槽以230hz频率进行的振动。
调谐质量阻尼器可以定位在测试槽上具有合适空间的任何位置。虽然在上面的例子中调谐质量阻尼器定位于测试槽的第二底板中,但可以将该调谐质量阻尼器(或额外的调谐质量阻尼器)添加到(例如)侧壁、第一底板和/或顶板。
可能存在与悬臂梁有关的多种变型形式。例如,横梁可以替代悬臂梁在两端均附接到测试槽的壳体,使得横梁的中心可自由移动。横梁可由未粘合在一起的层制成。在这种情况下,当横梁挠曲时所述层可以相对于彼此自由滑动,由此使得滑动表面之间的摩擦作用能够吸收能量并进一步减小振动。在一些例子中,悬臂梁可与第二底板不成一体。例如,悬臂梁可以独立于底板而形成并安装在底板中的开口内。悬臂梁可以成形为使得其或多或少留在第二底板的平面内。
针对调谐质量阻尼器的各种组件进行的材料选择是设计选择的问题,其不应限于本公开中所述的示例性材料。在一些例子中,重物可由填充塑料、金属或其他合适重量的材料形成。在一些例子中,吸能层可由粘弹性粘合剂、粘滞液体或弹性体形成。
吸能层的位置和数量也是设计选择的问题,并且可针对特定应用进行修改。例如,吸能层可以定位在悬臂梁的中心平面处,而不是、或除此之外还施加到横梁表面。此外,两个吸能层可以连接到悬臂梁的相对两侧,或位于悬臂梁的相对两端。
在一些例子中,可以省略刚性层,以使调谐质量阻尼器更为紧凑。
已经描述了多个具体实施。然而,应当理解,可以在不脱离本公开精神和范围的前提下进行多种修改。例如,位于测试槽上的接合本体中的隔离器的凸起可被实施为位于本体上的接合测试槽上的隔离器的凸起。因此,其他具体实施在以下权利要求书的范围内。

Claims (14)

1.一种存储设备测试槽,包括:
壳体,其限定用于接纳要进行测试的存储设备的测试室;以及
连接到所述壳体的一个或多个调谐质量阻尼器,所述一个或多个调谐质量阻尼器被构造为抑制所述壳体以一种或多种预定频率振动。
2.根据权利要求1所述的存储设备测试槽,其中所述一个或多个调谐质量阻尼器包括连接到所述壳体的横梁。
3.根据权利要求2所述的存储设备测试槽,其中所述横梁一体地连接到所述壳体。
4.根据权利要求2所述的存储设备测试槽,其中所述横梁包括被构造为相对于彼此滑动的两个或更多个层。
5.根据权利要求2所述的存储设备测试槽,其中所述横梁包括悬臂梁。
6.根据权利要求2所述的存储设备测试槽,其中所述一个或多个调谐质量阻尼器还包括连接到所述横梁的重物。
7.根据权利要求6所述的存储设备测试槽,其中所述重物一体地连接到所述横梁(如,与所述横梁一起模制、加工或以其他方式成形)。
8.根据权利要求6所述的存储设备测试槽,其中所述一个或多个调谐质量阻尼器还包括设置在所述横梁与所述重物之间的一层吸能材料。
9.根据权利要求8所述的存储设备测试槽,其中所述吸能材料选自:弹性体、粘弹性粘合剂以及粘滞液体。
10.根据权利要求8所述的存储设备测试槽,其中所述一个或多个调谐质量阻尼器还包括固定到所述吸能层表面的一层大体刚性的材料。
11.根据权利要求1所述的存储设备测试槽,其中所述一种或多种预定频率与所述壳体的一种或多种振动模式相关。
12.根据权利要求1所述的存储设备测试槽,其中所述测试室被构造为接纳并支承用于携带要测试的存储设备的存储设备输送器。
13.根据权利要求1所述的存储设备测试槽,其中所述一个或多个调谐质量阻尼器连接到所述壳体的外表面。
14.根据权利要求1所述的存储设备测试槽,其中所述一个或多个调谐质量阻尼器连接到所述壳体的内表面。
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