CN102905478A - Process for embedding components into multilayer board - Google Patents
Process for embedding components into multilayer board Download PDFInfo
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- CN102905478A CN102905478A CN2012104544354A CN201210454435A CN102905478A CN 102905478 A CN102905478 A CN 102905478A CN 2012104544354 A CN2012104544354 A CN 2012104544354A CN 201210454435 A CN201210454435 A CN 201210454435A CN 102905478 A CN102905478 A CN 102905478A
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Abstract
The invention discloses a process for embedding components into a multilayer board, comprising the following steps of: firstly, making multiple single-layer PCBs (printed circuit board), and making a required circuit on each single-layer PCB, and then mounting corresponding components on the surface of each PCB; secondly, making insulating layers arranged among multiple single-layer PCBs and outside two outer-layer PCBs, and reserving vacancies at positions corresponding to components on the PCBs on the insulating layers; and thirdly, sequentially coinciding the insulating layers and the PCBs and laminating to form a multilayer printed circuit board; and fourthly, making interlayer through holes on the multilayer printed circuit board, and making an outer-layer circuit. According to the process disclosed by the invention, the components are embedded inside the PCBs in advance, so that volume and weight after inter-board mounting can be reduced; meanwhile, reliability is high, shock resistance is high, high frequency characteristic is good, electromagnetic interference and radio frequency interference are reduced, and automation is easy to realize.
Description
Technical field
The present invention relates to bury in a kind of multilayer board components and parts technique.
Background technology
At present, electronic product is towards ultrashort, extra small, ultra-thin future development, and circuit board provides electronic components at the main support body of installing when interconnected, is the indispensable fundamental parts of all electronic products.Selecting being connected of little, the lightweight and high reliability of volume, is one of important content of printed board design.But still adopt Surface Mount Component, in the circuit board at present, this reduces just for the volume of printed board and causes certain bottleneck.
Summary of the invention
In order to overcome defects, the invention provides and bury components and parts technique in a kind of multilayer board, this technique is embedded into PCB inside in advance with components and parts, not only can reduce the volume and weight after mounting between plate, and reliability is high, shock resistance is strong, high frequency characteristics good, reduced electromagnetism and radio frequency interference, easily be automated.
The present invention for the technical scheme that solves its technical problem and adopt is: bury components and parts technique in a kind of multilayer board, may further comprise the steps: 1. make a plurality of individual layer pcb boards, and make the circuit that needs at this each individual layer pcb board, then at components and parts corresponding to this each pcb board surface mount; 2. make to be located at reaching the outer insulating barrier of two outer pcb boards between a plurality of individual layer pcb boards, and the components and parts position on corresponding its corresponding pcb board of this insulating barrier arranges the room; 3. with above-mentioned insulation board and successively superimposed and pressing formation multilayer printed board of pcb board; 5. at via between making layer in this multilayer printed board, and make outer-layer circuit.
The invention has the beneficial effects as follows: this technique is embedded in advance PCB inside with components and parts and has the following advantages: 1. volume is little, lightweight, and have the reliability height, vibration resistance is strong, high frequency characteristics good, reduced electromagnetism and radio frequency interference, easily be automated etc.; 2. production efficiency is high, and the SMT paster time is short, about 0.5-0.7S/Pcs, and PCB namely is equivalent to finish PCB after manufacturing a finished product and the SMT paster is finished, and production efficiency has improved nearly 30%; 3. applied widely, be applicable to bury the production of burying components and parts PCB in components and parts, embedded resistors device and other types in various; 4. it is little, lightweight to bury the elements and parts board volume in, is equivalent to 2/3 of equal circuit board finished product bak stay volume, 4/5 of weight, and effectively reduced electromagnetism and radio frequency interference.
Embodiment
Bury components and parts technique in a kind of multilayer board, may further comprise the steps: 1. make a plurality of individual layer pcb boards, and make the circuit that needs at this each individual layer pcb board, then at components and parts corresponding to this each pcb board surface mount; 2. make to be located at reaching the outer insulating barrier of two outer pcb boards between a plurality of individual layer pcb boards, and the components and parts position on corresponding its corresponding pcb board of this insulating barrier arranges the room; 3. with above-mentioned insulation board and successively superimposed and pressing formation multilayer printed board of pcb board; 5. at via between making layer in this multilayer printed board, and make outer-layer circuit.
Claims (1)
1. bury components and parts technique in a multilayer board, it is characterized in that may further comprise the steps: 1. make a plurality of individual layer pcb boards, and make the circuit that needs at this each individual layer pcb board, then at components and parts corresponding to this each pcb board surface mount; 2. make to be located at reaching the outer insulating barrier of two outer pcb boards between a plurality of individual layer pcb boards, and the components and parts position on corresponding its corresponding pcb board of this insulating barrier arranges the room; 3. with above-mentioned insulation board and successively superimposed and pressing formation multilayer printed board of pcb board; 5. at via between making layer in this multilayer printed board, and make outer-layer circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210454435.4A CN102905478B (en) | 2012-11-14 | 2012-11-14 | Components and parts technique is buried in multilayer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210454435.4A CN102905478B (en) | 2012-11-14 | 2012-11-14 | Components and parts technique is buried in multilayer board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102905478A true CN102905478A (en) | 2013-01-30 |
| CN102905478B CN102905478B (en) | 2016-12-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210454435.4A Active CN102905478B (en) | 2012-11-14 | 2012-11-14 | Components and parts technique is buried in multilayer board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102905478B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040145044A1 (en) * | 2002-01-23 | 2004-07-29 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module with embedded semiconductor chip and method of manufacturing |
| US20100012364A1 (en) * | 2008-07-21 | 2010-01-21 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing electronic component embedded circuit board |
| CN101653053A (en) * | 2008-01-25 | 2010-02-17 | 揖斐电株式会社 | Multilayer wiring board and its manufacturing method |
-
2012
- 2012-11-14 CN CN201210454435.4A patent/CN102905478B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040145044A1 (en) * | 2002-01-23 | 2004-07-29 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module with embedded semiconductor chip and method of manufacturing |
| CN101653053A (en) * | 2008-01-25 | 2010-02-17 | 揖斐电株式会社 | Multilayer wiring board and its manufacturing method |
| US20100012364A1 (en) * | 2008-07-21 | 2010-01-21 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing electronic component embedded circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102905478B (en) | 2016-12-28 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| CB02 | Change of applicant information |
Address after: Qiandeng Town Hongyang road Kunshan City, Suzhou City, Jiangsu Province, No. 322 215341 Applicant after: JIANGSU PUNUOWEI ELECTRONIC CO., LTD. Address before: Suzhou City, Jiangsu province 215341 Kunshan City Qiandeng Private Development Zone (South Village) Applicant before: Kunshan Hwayung Electronics Co., Ltd. |
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| COR | Change of bibliographic data | ||
| GR01 | Patent grant |