CN102903685B - A kind of heat conductive pad of electronic equipment - Google Patents
A kind of heat conductive pad of electronic equipment Download PDFInfo
- Publication number
- CN102903685B CN102903685B CN201210422496.2A CN201210422496A CN102903685B CN 102903685 B CN102903685 B CN 102903685B CN 201210422496 A CN201210422496 A CN 201210422496A CN 102903685 B CN102903685 B CN 102903685B
- Authority
- CN
- China
- Prior art keywords
- face
- conductive pad
- heat conductive
- elastomeric element
- screw rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Present embodiment discloses a kind of heat conductive pad of electronic equipment, comprise the elastomeric element of end face, bottom surface and metal material; End face and bottom surface are wedge metal block, and bottom surface is two, and end face is located at the centre of two bottom surfaces, and the inclined-plane of bottom surface and end face is suitable; Elastomeric element comprises screw rod and is sheathed on the compression spring on screw rod, and bottom surface and end face are provided with can by the through hole of screw rod; Compression spring be located at screw rod end, one end and and contiguous bottom surface, this end between.The present embodiment is by being provided with elastomeric element by with between the end face needing the chip dispelled the heat to contact and the bottom surface contacted with radiator, thus make to adjust distance by elastomeric element between the end face of the heat conductive pad in the present embodiment and bottom surface, in the present embodiment, because adopted material is metal, so volatile matter can not be produced because of high temperature, thus some avoiding in the silicone oil contained in heat conductive pad in prior art becomes branch and some electronic devices and components generation chemical reaction, the problem of electronic component failure can be made.
Description
The application is application number: " 201010532188.6 ", application title " a kind of heat conductive pad of electronic equipment ", the applying date: on November 04th, 2010 submit the division of application for a patent for invention to.
Technical field
The present invention relates to field of radiating, more particularly, relate to a kind of heat conductive pad of electronic equipment.
Background technology
In the electronic device, in order to save the cost of heat abstractor, adjacent nearer multiple chips generally can be made to use same radiator to dispel the heat for multiple chip simultaneously.Due to the height difference to some extent of the chip in circuit board, so in order to absorb tolerance time on the heat conduction of chip to radiator, the method generally adopted at present adds heat conductive pad between chip and radiator.Thus make to use the heat in the different chip of the height of same radiator all can be passed to radiator.Wherein, the formation of the good heat conductive pad of heat-conducting effect is the sheet metal being surrounded by high thermal conductivity coefficient outside eiastomeric silicone material.
Inventor finds in the practice of the invention, main constituent due to heat conductive pad of the prior art is organosilicon material, due to be in high-temperature closed when organosilicon environment in time, silicone oil the silicone oil of complicated component can be volatilized, so can be made to contact with the electronic devices and components in electronic equipment.
After the silicone oil volatilized contacts with electronic devices and components, some in silicone oil becomes branch and some electronic devices and components generation chemical reaction, can cause the inefficacy of these electronic devices and components, so heat conductive pad of the prior art can shorten the useful life of electronic equipment.
Summary of the invention
In view of this, the embodiment of the present invention provides a kind of heat conductive pad of electronic equipment, and the heat conductive pad existed to solve prior art affects the problem in the useful life of electronic equipment.
The embodiment of the present invention is achieved in that
A heat conductive pad for electronic equipment, comprising: the elastomeric element of end face, bottom surface and metal material;
Described end face and bottom surface are wedge metal block, and described bottom surface is two, and described end face is located at the centre of two bottom surfaces, and the inclined-plane of described bottom surface and end face is suitable;
Described elastomeric element comprises screw rod and is sheathed on the compression spring on described screw rod, and described bottom surface and end face are provided with can by the through hole of described screw rod; Described compression spring be located at described screw rod end, one end and and contiguous bottom surface, this end between.
As can be seen from above-mentioned technical scheme, the embodiment of the present invention is the elastomeric element of metal by the material adopted, so volatile matter can not be produced because of high temperature, thus avoid in the organosilicon material of heat conductive pad of the prior art employing containing the silicone oil that can volatilize when high temperature, thus cause some one-tenth branch and some the electronic devices and components generation chemical reaction in silicone oil, make the problem of the inefficacy of electronic devices and components.The embodiment of the present invention is being provided with elastomeric element with between the end face needing the chip dispelled the heat to contact and the bottom surface contacted with radiator, thus make to adjust distance by elastomeric element between the end face of the heat conductive pad in the embodiment of the present invention and bottom surface, thus make the chip of multiple differing heights when using same radiator, be provided with heat conductive pad between each chip and radiator after, heat conductive pad fully can contact with chip and radiator, so each chip can by oneself heat conductive pad by heat conduction to radiator.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of heat conductive pad described in the embodiment of the present invention;
The another structural representation that Fig. 2 is heat conductive pad described in the embodiment of the present invention;
Fig. 3 is the structural representation of heat conductive pad described in further embodiment of this invention;
Fig. 4 is the structural representation of heat conductive pad described in further embodiment of this invention;
Fig. 5 is the structural representation of heat conductive pad described in further embodiment of this invention;
Fig. 6 is the structural representation of heat conductive pad described in further embodiment of this invention;
Fig. 7 is the structural representation of heat conductive pad described in further embodiment of this invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
In order to solve in prior art, because heat conductive pad contains the silicone oil and some in the silicone oil that causes becomes branch and some electronic devices and components generation chemical reaction of volatilizing when high temperature, thus make the problem of the inefficacy of electronic devices and components, the embodiment of the invention discloses a kind of heat conductive pad of electronic equipment, concrete structure as shown in Figure 1, comprising: be the end face 1 of metal material, bottom surface 2 and elastomeric element 3; End face 1 is connected by kink 4 with bottom surface 1, and end face 1 is parallel to each other with bottom surface 2; Elastomeric element 3 between end face 1 and bottom surface 2 and respectively with end face 1 and bottom surface 2 Elastic Contact.
Heat conductive pad in the embodiment of the present invention, when practical application, between the chip being installed in needs heat radiation and radiator.Such as, when use fin is two chip coolings simultaneously, each chip is all equipped with a heat conductive pad, the end face 1 of each heat conductive pad all contacts with respective chip, then by radiator synchronous press mounting on the bottom surface 2 of two heat conductive pads, like this, the heat that chip produces will conduct on radiator by heat conductive pad, then heat distributes by radiator, thus serves the effect to chip cooling.
In order to contact with chip fully, the end face 1 of the heat conductive pad in the embodiment of the present invention is plane with the contact-making surface of chip, and by kink 4, end face 1 connects with the same bottom surface 2 with the contact-making surface of plane; In order to strengthen the elastic force between end face 1 and bottom surface 2, with make the end face 1 of heat conductive pad and bottom surface 2 respectively with chip and radiator firm contact, in the embodiment of the present invention, between end face 1 and bottom surface 2, be provided with elastomeric element 3;
Like this, when heat conductive pad is when being compressed between chip and radiator, the end face 1 of heat conductive pad and bottom surface 2 are under the elastic force effect of elastomeric element 3, contact tight and firm with chip respectively, material due to heat conductive pad is metal, and heat conductivility is better, so the heat conduction that chip can be produced is to fin, and then by radiator, heat is distributed, finally play the effect to chip cooling; And due in the embodiment of the present invention, used material is metal material, does not comprise silicone oil, so also can not volatile matter be produced in the environment of high temperature.So the embodiment of the present invention solves in prior art, due in material containing silicone oil, and silicone oil produce in hot environment volatile matter can and electronic devices and components generation chemical reaction cause the problem of the damage of electronic devices and components.Thus the embodiment of the present invention can extend the useful life of electronic devices and components effectively.
Further, in the embodiment of the present invention, end face 1, bottom surface 2 and elastomeric element 3 can be bent by the sheet material of monoblock and form.
Because material used in the embodiment of the present invention is metal, there is good ductility, so can it be made shaping by bending easily, and, adopt by the mode by metallic plate bending forming, not only make the processing of heat conductive pad more convenient and simple and easy.And by better elasticity can also be kept between each position of metal of bending forming, thus the effect better making end face 1 and bottom surface 2 contact with radiator with chip respectively can be played.
Due in a metal, the heat conductivility of copper elasticity that is relatively high, copper material itself is better and price is relatively cheap, so in embodiments of the present invention, each parts of heat conductive pad, comprise end face 1, bottom surface 2 and elastomeric element 3, and the material adopted can be copper.
Concrete mode can be, can by the both sides of one piece of copper coin respectively to lower bending, the end face 1 of heat conductive pad is formed between two bending places of copper coin, part after bending then forms the bottom surface 2 of heat conductive pad respectively, wherein the bottom surface 2 of side can also bend to end face 1 by extending, formed elastomeric element 3, elastomeric element 3 with end face 1 Elastic Contact; Thus make heat conductive pad when being squeezed, elastomeric element 3 can play the effect of resiliency supported between end face 1 and bottom surface 2, so make the end face 1 of heat conductive pad and bottom surface 2 respectively with tight and firm the contacting of chip and radiator.
Further, in embodiments of the present invention, elastomeric element 3 to end face 1 bend and with end face 1 Elastic Contact after, can also bend to bottom surface 3 and contact with bottom resilient.
Due to elastomeric element 3 with end face 1 Elastic Contact after, bend to bottom surface 2, so elastomeric element 3 entirety is inverted V-shaped, like this, owing to adding the resiliency supported between elastomeric element 3 pairs of end faces 1 and bottom surface 3, so the elastic force of elastomeric element 3 effectively can be strengthened, thus the end face 1 of heat conductive pad and bottom surface 2 also just can be made more closely firm with contacting of radiator with chip respectively.
As shown in Fig. 3, Fig. 4 and Fig. 5, in the embodiment of the present invention, end face, bottom surface and elastomeric element can be bent by the sheet material of monoblock and form, and can also have another kind of execution mode, be specially:
Bottom surface comprises left bottom surface 21 and right bottom surface 22; Elastomeric element comprises left elastomeric element 32 and right elastomeric element 31;
Left bottom surface 21 is bent to form by the left side extension of end face 11, and left elastomeric element 32 is extended by left bottom surface and is bent to form to end face 11, left elastomeric element 32 and end face 11 Elastic Contact;
Right bottom surface 22 is bent to form by the right side extension of end face 11, and right elastomeric element 31 is extended by right bottom surface and is bent to form to end face 11, right elastomeric element 31 and end face 11 Elastic Contact.
In the embodiment of the present invention, although the bottom surface of heat conductive pad is divided in order to left and right two parts, end face 11 or one, and whole heat conductive pad is also or be made up of one piece of sheet metal, such as, or for copper coin; Its concrete constituted mode is:
Before forming heat conductive pad as shown in Figure 3, first copper coin can be cut to shape as shown in Figure 5, wherein, can form left bottom surface 21 and left elastomeric element 32 respectively after left extension 41 and right extension 42 bend, and right bottom surface 22 and right elastomeric element 31; Pars intermedia 43 forms end face 11.
Further, in embodiments of the present invention, one end that elastomeric element contacts with end face can also be cambered surface.
In order to reduce friction when elastomeric element contacts with end face, elastomeric element is slided in the contact site of end face smoothly, to provide resiliency supported effectively between bottom surface and end face, in the embodiment of the present invention, one end that elastomeric element contacts with end face is designed to cambered surface, thus avoid elastomeric element may owing to contacting with end face time friction excessive, can make cannot extrude between end face and bottom surface.Preferably, in the embodiment of the present invention, cambered surface is formed after can being bent by the one end contacted with end face by elastomeric element; Like this, as long as after the one end contacted with end face by elastomeric element bends, just can form a cambered surface, this mode is not only processed simple but also effectively.
The embodiment of the present invention additionally provides a kind of heat conductive pad of electronic equipment, as shown in Figure 6 and Figure 7, comprising: be the end face 51 of metal material, bottom surface 52 and elastomeric element 53;
End face 51 and bottom surface 52 are wedge metal block, and bottom surface 52 is two, and end face is located at the centre of two bottom surfaces, and bottom surface 52 is suitable with the inclined-plane of end face 51;
Elastomeric element 53 comprises screw rod and is sheathed on the compression spring on screw rod, and bottom surface 52 and end face 51 are provided with can by the through hole of screw rod; Compression spring be located at screw rod end, one end and and contiguous bottom surface, this end between.
In the embodiment of the present invention, when the screw rod through end face 51 and two bottom surfaces 52 is provided with compression spring, compression spring can produce thrust to the bottom surface 52 contacted with it, bottom surface 52 is transmitted this thrust thus is formed the extruding to end face 51, owing to being contact of incline plane between the end face 51 that mediates and the bottom surface 52 on both sides, so end face 51 can to top offset; Due to the through hole that screw rod is provided with through end face 51 and bottom surface 52, so end face 51 can be through the screw limiting of end face 51 to top offset, that is, when screw rod is stopped by the upper edge place of the through hole of bottom surface 52, for end face is to the peak of displacement.
Like this, when the end face 51 of the heat conductive pad in the embodiment of the present invention and bottom surface 52 are extruded by chip 54 and radiator 55 respectively, elastic force can be produced, make end face 51 and bottom surface 52 respectively with chip 54 and tight and firm the contacting of radiator 55, thus the heat that chip 54 can be produced is transmitted on radiator 55 by heat conductive pad, and then by radiator 55, heat is distributed, finally serve the effect that chip 54 is dispelled the heat.
Further, in embodiments of the present invention, in order to further strengthen the elasticity of heat conductive pad, compression spring can also be equipped with in two of a screw rod end, thus make the elasticity of heat conductive pad better, and then make the contact of heat conductive pad and chip and radiator more closely with firm.
Preferably, in embodiments of the present invention, wedge metal block is specifically as follows wedge shape aluminium block; Due to aluminium block have the cost of good heat conductivility and aluminium lower, be easy to machine-shaping, so, in embodiments of the present invention, have employed wedge shape aluminium block as end face and bottom surface.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually see.For device disclosed in embodiment, because it corresponds to the method disclosed in Example, so description is fairly simple, relevant part illustrates see method part.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (3)
1. an electronic equipment heat conductive pad, is characterized in that, comprising: the elastomeric element of topside metal block, bottom-side metal block and metal material;
Described topside metal block and bottom-side metal block are wedge metal block, and described bottom-side metal block is two, and described topside metal block is located at the centre of two bottom-side metal blocks, and the inclined-plane of described bottom-side metal block and topside metal block is suitable;
Described elastomeric element comprises screw rod and is sheathed on the compression spring on described screw rod, and described bottom-side metal block and topside metal block are provided with can by the through hole of described screw rod, and described screw rod passes topside metal block and two bottom-side metal blocks by described through hole; Described compression spring be located at described screw rod end, one end and and contiguous bottom surface, this end between.
2. heat conductive pad according to claim 1, is characterized in that, the other end end of described screw rod and and contiguous bottom surface, this other end end between be provided with compression spring.
3. heat conductive pad according to claim 2, it is characterized in that, described wedge metal block is wedge shape aluminium block.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010532188.6A CN102142407B (en) | 2010-11-04 | 2010-11-04 | Heat conducting pad |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010532188.6A Division CN102142407B (en) | 2010-11-04 | 2010-11-04 | Heat conducting pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102903685A CN102903685A (en) | 2013-01-30 |
| CN102903685B true CN102903685B (en) | 2015-12-16 |
Family
ID=44409817
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210422496.2A Expired - Fee Related CN102903685B (en) | 2010-11-04 | 2010-11-04 | A kind of heat conductive pad of electronic equipment |
| CN201010532188.6A Expired - Fee Related CN102142407B (en) | 2010-11-04 | 2010-11-04 | Heat conducting pad |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010532188.6A Expired - Fee Related CN102142407B (en) | 2010-11-04 | 2010-11-04 | Heat conducting pad |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN102903685B (en) |
| WO (1) | WO2012058926A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102958323A (en) * | 2011-08-29 | 2013-03-06 | 佳能企业股份有限公司 | Heat conducting structure |
| CN107223006B (en) * | 2017-06-28 | 2018-02-27 | 日海通信服务有限公司 | Rack and its radiator |
| CN108364922B (en) * | 2018-01-31 | 2021-05-04 | 北京比特大陆科技有限公司 | Liquid cooling heat dissipation system |
| US10806054B1 (en) | 2019-08-06 | 2020-10-13 | Honeywell International Inc. | Flexible elastic thermal bridge for electronic subassemblies with variable gaps between components and enclosures |
| CN111029315B (en) * | 2019-11-19 | 2021-09-21 | 中国航空工业集团公司西安航空计算技术研究所 | Chip flexible heat transfer mechanism |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4654754A (en) * | 1982-11-02 | 1987-03-31 | Fairchild Weston Systems, Inc. | Thermal link |
| US5307236A (en) * | 1991-07-23 | 1994-04-26 | Alcatel Telspace | Heatsink for contact with multiple electronic components mounted on a circuit board |
| US6088228A (en) * | 1998-12-16 | 2000-07-11 | 3M Innovative Properties Company | Protective enclosure for a multi-chip module |
| CN2587135Y (en) * | 2002-11-27 | 2003-11-19 | 世顶企业有限公司 | Radiator fastener structure |
| CN2831718Y (en) * | 2005-04-15 | 2006-10-25 | 富准精密工业(深圳)有限公司 | Radiation boards |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5561322A (en) * | 1994-11-09 | 1996-10-01 | International Business Machines Corporation | Semiconductor chip package with enhanced thermal conductivity |
| US6401807B1 (en) * | 1997-04-03 | 2002-06-11 | Silent Systems, Inc. | Folded fin heat sink and fan attachment |
| JPH1168360A (en) * | 1997-08-08 | 1999-03-09 | Nec Corp | Cooling structure for semiconductor element |
| US6462951B2 (en) * | 2000-04-10 | 2002-10-08 | Alcatal Canada Inc. | Securing heat sinks to electronic components |
| US6687130B2 (en) * | 2001-09-10 | 2004-02-03 | Corvis Corporation | Integrated wedge lock and elastic member |
| US6707670B2 (en) * | 2001-09-12 | 2004-03-16 | Dorsal Networks, Inc. | Systems and methods for mounting devices |
| JP2003198171A (en) * | 2001-12-28 | 2003-07-11 | Furukawa Electric Co Ltd:The | Heat sink and radiator |
| CN1988785A (en) * | 2005-12-23 | 2007-06-27 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator |
| TWI316748B (en) * | 2006-07-17 | 2009-11-01 | Via Tech Inc | Cooling module against esd and electronic package, assembly, and system using the same |
| CN101587887A (en) * | 2008-05-23 | 2009-11-25 | 富准精密工业(深圳)有限公司 | Light-emitting diode structure |
| JP5120284B2 (en) * | 2009-02-04 | 2013-01-16 | 株式会社豊田自動織機 | Semiconductor device |
-
2010
- 2010-11-04 CN CN201210422496.2A patent/CN102903685B/en not_active Expired - Fee Related
- 2010-11-04 CN CN201010532188.6A patent/CN102142407B/en not_active Expired - Fee Related
-
2011
- 2011-06-07 WO PCT/CN2011/075403 patent/WO2012058926A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4654754A (en) * | 1982-11-02 | 1987-03-31 | Fairchild Weston Systems, Inc. | Thermal link |
| US5307236A (en) * | 1991-07-23 | 1994-04-26 | Alcatel Telspace | Heatsink for contact with multiple electronic components mounted on a circuit board |
| US6088228A (en) * | 1998-12-16 | 2000-07-11 | 3M Innovative Properties Company | Protective enclosure for a multi-chip module |
| CN2587135Y (en) * | 2002-11-27 | 2003-11-19 | 世顶企业有限公司 | Radiator fastener structure |
| CN2831718Y (en) * | 2005-04-15 | 2006-10-25 | 富准精密工业(深圳)有限公司 | Radiation boards |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102142407A (en) | 2011-08-03 |
| CN102142407B (en) | 2014-02-19 |
| WO2012058926A1 (en) | 2012-05-10 |
| CN102903685A (en) | 2013-01-30 |
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Granted publication date: 20151216 Termination date: 20201104 |