CN102903685A - Heat conducting pad - Google Patents
Heat conducting pad Download PDFInfo
- Publication number
- CN102903685A CN102903685A CN2012104224962A CN201210422496A CN102903685A CN 102903685 A CN102903685 A CN 102903685A CN 2012104224962 A CN2012104224962 A CN 2012104224962A CN 201210422496 A CN201210422496 A CN 201210422496A CN 102903685 A CN102903685 A CN 102903685A
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- China
- Prior art keywords
- face
- conductive pad
- heat conductive
- screw rod
- top face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The embodiment of the invention discloses a heat conducting pad, comprising a top face, two bottom faces and an elastic part made of a metal material, wherein the top face and the bottom faces are both wedge-shaped metal blocks, the top face is arranged between the two bottom faces, and the bottom faces are matched with a slope of the top face; the elastic part comprises a screw rod and a pressure spring sleeved on the screw rod, and the bottom faces and the top face are provided with through holes allowing the screw rod to pass through; and the pressure spring is arranged between an end part at one end of the screw rod and the bottom face adjacent to the end part. According to the embodiment, by means of arranging the elastic part between the top face to come into contact with a chip to be subjected to heat radiation and the bottom face in contact with a heat radiator, the distance between the top face and each bottom face of the heat conducting pad disclosed by the embodiment can be adjusted through the elastic part; and with total adoption of metal materials, volatile matters cannot be produced due to high temperature, so that the problem that certain electronic devices are failed because certain components in silicone oil contained in the heat conducting pad in the prior art are prevented from chemical reaction with the electronic devices is avoided.
Description
The application is application number: " 201010532188.6 ", application title " a kind of heat conductive pad ", the applying date: the division of the application for a patent for invention of submitting on the 04th November in 2010.
Technical field
The present invention relates to field of radiating, more particularly, relate to a kind of heat conductive pad.
Background technology
In electronic equipment, in order to save the cost of heat abstractor, generally can make adjacent nearer a plurality of chips come to dispel the heat simultaneously for a plurality of chips with same radiator.Because the height of the chip in the circuit board is difference to some extent, so absorb tolerance when being transmitted on the radiator for the heat with chip, the method that generally adopts at present is to add heat conductive pad between chip and radiator.Thereby so that use the heat in the different chip of the height of same radiator all can be passed to radiator.Wherein, heat-conducting effect preferably heat conductive pad constitute the sheet metal that outside the elasticity organosilicon material, is surrounded by high thermal conductivity coefficient.
The inventor finds in implementing process of the present invention, because the chief component composition of heat conductive pad of the prior art is organosilicon material, because when organosilicon is in the environment of high-temperature closed, can volatilize the silicone oil of complicated component, thus meeting so that silicone oil contact with electronic devices and components in the electronic equipment.
Because the silicone oil that volatilizes is with after electronic devices and components contact, some one-tenth branch and some electronic devices and components generation chemical reaction in the silicone oil can cause the inefficacy of these electronic devices and components, so heat conductive pad of the prior art can shorten the useful life of electronic equipment.
Summary of the invention
In view of this, the embodiment of the invention provides a kind of heat conductive pad, affects the problem in the useful life of electronic equipment to solve heat conductive pad that prior art exists.
The embodiment of the invention is achieved in that
A kind of heat conductive pad comprises: the elastomeric element of end face, bottom surface and metal material;
Described end face and bottom surface are the wedge metal piece, and described bottom surface is two, and described end face is located at the centre of two bottom surfaces, and the inclined-plane of described bottom surface and end face is suitable;
Described elastomeric element comprises screw rod and the compression spring that is sheathed on the described screw rod, and described bottom surface and end face are provided with can be by the through hole of described screw rod; Described compression spring be located at described screw rod an end end and and contiguous bottom surface, this end between.
Can find out from above-mentioned technical scheme, the embodiment of the invention is the elastomeric element of metal by the material that adopts, so can not produce because of high temperature volatile matter, thereby contain the silicone oil that when high temperature, can volatilize in the organosilicon material of having avoided heat conductive pad of the prior art to adopt, thereby cause some one-tenth branch and some electronic devices and components generation chemical reaction in the silicone oil, make the problem of the inefficacy of electronic devices and components.The embodiment of the invention the end face that contacts with the chip of needs heat radiations and with bottom surface that radiator contacts between be provided with elastomeric element, thereby so that can adjust distance by elastomeric element between the end face of the heat conductive pad in the embodiment of the invention and the bottom surface, thereby so that the chip of a plurality of differing heights is when using same radiator, after being provided with heat conductive pad between each chip and the radiator, heat conductive pad can fully contact with chip and radiator, and then each chip can conduct to radiator with heat by the heat conductive pad of oneself.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, the below will do simple the introduction to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in the following describes only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of heat conductive pad described in the embodiment of the invention;
Fig. 2 is the another structural representation of heat conductive pad described in the embodiment of the invention;
Fig. 3 is the structural representation of heat conductive pad described in further embodiment of this invention;
Fig. 4 is the structural representation of heat conductive pad described in further embodiment of this invention;
Fig. 5 is the structural representation of heat conductive pad described in further embodiment of this invention;
Fig. 6 is the structural representation of heat conductive pad described in further embodiment of this invention;
Fig. 7 is the structural representation of heat conductive pad described in further embodiment of this invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
In order to solve in the prior art, some that contains in the silicone oil that the silicone oil that can volatilize when the high temperature causes owing to heat conductive pad becomes branch and some electronic devices and components generation chemical reaction, thereby make the problem of the inefficacy of electronic devices and components, the embodiment of the invention discloses a kind of heat conductive pad, concrete structure comprises as shown in Figure 1: the end face 1, bottom surface 2 and the elastomeric element 3 that are metal material; End face 1 is connected by kink 4 with bottom surface 1, and end face 1 is parallel to each other with bottom surface 2; Elastomeric element 3 between end face 1 and bottom surface 2 and respectively with end face 1 and bottom surface 2 Elastic Contact.
Heat conductive pad in the embodiment of the invention when practical application, is installed between the chip and radiator that needs heat radiation.Such as, when using a fin to be two chip coolings simultaneously, each chip all is equipped with a heat conductive pad, the end face 1 of each heat conductive pad all contacts with separately chip, then with the radiator synchronous press mounting on the bottom surface 2 of two heat conductive pads, like this, the heat that chip produces will conduct on the radiator by heat conductive pad, then radiator is dissipation of heat, thereby played the effect to the chip cooling.
In order to contact with chip fully, the end face 1 of the heat conductive pad in the embodiment of the invention is the plane with the contact-making surface of chip, and by kink 4, end face 1 is connected with the bottom surface 2 of the contact-making surface that has equally the plane; In order to strengthen the elastic force between end face 1 and the bottom surface 2, so that the end face 1 of heat conductive pad firmly contacts with radiator with chip respectively with bottom surface 2, in the embodiment of the invention, between end face 1 and bottom surface 2, be provided with elastomeric element 3;
Like this, when heat conductive pad is being compressed between chip and the radiator, the end face 1 of heat conductive pad and bottom surface 2 are under the elastic force effect of elastomeric element 3, respectively with tight and firm the contacting of chip, because the material of heat conductive pad is metal, heat conductivility is better, so the heat that chip produces can be conducted to fin, and then by radiator with dissipation of heat, finally play the effect to chip cooling; And, because in the embodiment of the invention, used material is metal material, does not comprise silicone oil, so also can not produce volatile matter in the environment of high temperature.So the embodiment of the invention has solved in the prior art, owing to containing silicone oil in the material, and silicone oil produces in hot environment that volatile matter is understood and electronic devices and components generation chemical reaction causes the problem of the damage of electronic devices and components.Thereby the embodiment of the invention can prolong the useful life of electronic devices and components effectively.
Further, in the embodiment of the invention, end face 1, bottom surface 2 and elastomeric element 3 can be formed by the sheet material bending of monoblock.
Because used material is metal in the embodiment of the invention, have good ductility, thus can make its moulding by bending easily, and, adopt by the mode with the metallic plate bending forming, not only so that the processing of heat conductive pad is more convenient and simple and easy.And by can also better keeping elasticity between each position of metal of bending forming, thereby can play the effect that end face 1 and bottom surface 2 are contacted with radiator with chip respectively.
Because in metal, the heat conductivility of copper is relatively high, the elasticity of copper material itself is better and price is relatively cheap, so in embodiments of the present invention, each parts of heat conductive pad comprise end face 1, bottom surface 2 and elastomeric element 3, the material that adopts can be copper.
Concrete mode can be, can be with the respectively bending downwards of both sides of a copper coin, form the end face 1 of heat conductive pad between two bending places of copper coin, part after the bending then forms respectively the bottom surface 2 of heat conductive pad, wherein the bottom surface 2 of a side can also be by extending to end face 1 bending, form elastomeric element 3, elastomeric element 3 with end face 1 Elastic Contact; Thereby so that heat conductive pad is when being squeezed, elastomeric element 3 can play the effect of resiliency supported between end face 1 and bottom surface 2, and then so that the end face 1 of heat conductive pad and bottom surface 2 respectively with tight and firm the contacting of chip and radiator.
Further, in embodiments of the present invention, elastomeric element 3 to end face 1 bending and with end face 1 Elastic Contact after, can also be to the bottom surface 3 bendings and with the bottom Elastic Contact.
Since elastomeric element 3 with end face 1 Elastic Contact after, 2 bendings to the bottom surface, so elastomeric element 3 integral body are inverted V-shaped, like this, owing to having increased the resiliency supported between 3 pairs of end faces 1 of elastomeric element and the bottom surface 3, so can effectively strengthen the elastic force of elastomeric element 3, thereby also just can be so that the end face of heat conductive pad 1 be firm with contacting more closely of chip and radiator respectively with bottom surface 2.
Such as Fig. 3, Fig. 4 and shown in Figure 5, in the embodiment of the invention, end face, bottom surface and elastomeric element can be formed by the sheet material bending of monoblock, and another kind of execution mode can also be arranged, and are specially:
The bottom surface comprises left bottom surface 21 and right bottom surface 22; Elastomeric element comprises left elastomeric element 32 and right elastomeric element 31;
In the embodiment of the invention, although the bottom surface of heat conductive pad is divided for left and right sides two parts, end face 11 or one, and whole heat conductive pad is also or be made of a sheet metal, such as, or take copper coin as example; Its concrete constituted mode is:
Before the heat conductive pad that forms as shown in Figure 3, copper coin can at first be cut to shape as shown in Figure 5, wherein, can form respectively left bottom surface 21 and left elastomeric element 32 after left extension 41 and 42 bendings of right extension, and right bottom surface 22 and right elastomeric element 31; 43 of pars intermedias form end face 11.
Further, in embodiments of the present invention, the end that elastomeric element contacts with end face can also be cambered surface.
Friction when contacting with end face in order to reduce elastomeric element, elastomeric element can be slided in the contact site of end face smoothly, so that effectively resiliency supported to be provided between bottom surface and end face, an end that in the embodiment of the invention elastomeric element is contacted with end face is designed to cambered surface, thereby avoid elastomeric element because the friction when contacting with end face is excessive, can makes between end face and the bottom surface and can't push.Preferably, in the embodiment of the invention, cambered surface can be by forming after the end bending that elastomeric element is contacted with end face; Like this, as long as after the end that elastomeric element contact with the end face bending, just can form a cambered surface, this mode is not only processed simply but also is effective.
The embodiment of the invention also provides a kind of heat conductive pad, as shown in Figure 6 and Figure 7, comprising: the end face 51, bottom surface 52 and the elastomeric element 53 that are metal material;
In the embodiment of the invention, when the screw rod that passes end face 51 and two bottom surfaces 52 is provided with compression spring, compression spring can produce thrust to the bottom surface 52 of with it contact, thereby this thrust formation is transmitted to the extruding of end face 51 in bottom surface 52, since between the bottom surface 52 on the end face 51 that mediates and both sides for the inclined-plane contacts, so end face 51 is understood to top offset; Because screw rod passes the through hole that end face 51 and bottom surface 52 are provided with, so end face 51 can be through to top offset the screw limiting of end face 51, that is, when screw rod is stopped by place, the upper edge of the through hole of bottom surface 52, be the peak of end face to displacement.
Like this, when the end face 51 of the heat conductive pad in the embodiment of the invention and bottom surface divide 52 during not by chip 54 and radiator 55 extruding, can produce elastic force, make end face 51 and bottom surface 52 respectively with chip 54 and radiator 55 tight and firm contacting, the heat that thereby chip 54 can be produced is transmitted on the radiator 55 by heat conductive pad, and then pass through radiator 55 with dissipation of heat, finally played the effect to chip 54 heat radiations.
Further, in embodiments of the present invention, in order further to strengthen the elasticity of heat conductive pad, can also be equipped with compression spring in two ends of screw rod, thereby so that the elasticity of heat conductive pad is better, and then so that heat conductive pad is more tight and firm with contacting of chip and radiator.
Preferably, in embodiments of the present invention, the wedge metal piece is specifically as follows the wedge shape aluminium block; Since aluminium block have the cost of heat conductivility preferably and aluminium lower, be easy to machine-shaping, so, in embodiments of the present invention, adopted the wedge shape aluminium block as end face and bottom surface.
Each embodiment adopts the mode of going forward one by one to describe in this specification, and what each embodiment stressed is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.For the disclosed device of embodiment, because it is corresponding with the disclosed method of embodiment, so description is fairly simple, relevant part partly illustrates referring to method and gets final product.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and General Principle as defined herein can be in the situation that do not break away from the spirit or scope of the present invention, in other embodiments realization.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (3)
1. a heat conductive pad is characterized in that, comprising: the elastomeric element of end face, bottom surface and metal material;
Described end face and bottom surface are the wedge metal piece, and described bottom surface is two, and described end face is located at the centre of two bottom surfaces, and the inclined-plane of described bottom surface and end face is suitable;
Described elastomeric element comprises screw rod and the compression spring that is sheathed on the described screw rod, and described bottom surface and end face are provided with can be by the through hole of described screw rod; Described compression spring be located at described screw rod an end end and and contiguous bottom surface, this end between.
2. described heat conductive pad according to claim 1 is characterized in that, the other end end of described screw rod and and contiguous bottom surface, this end between be provided with compression spring.
3. described heat conductive pad according to claim 2 is characterized in that, described wedge metal piece is the wedge shape aluminium block.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010532188.6A CN102142407B (en) | 2010-11-04 | 2010-11-04 | Heat conducting pad |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010532188.6A Division CN102142407B (en) | 2010-11-04 | 2010-11-04 | Heat conducting pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102903685A true CN102903685A (en) | 2013-01-30 |
| CN102903685B CN102903685B (en) | 2015-12-16 |
Family
ID=44409817
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010532188.6A Expired - Fee Related CN102142407B (en) | 2010-11-04 | 2010-11-04 | Heat conducting pad |
| CN201210422496.2A Expired - Fee Related CN102903685B (en) | 2010-11-04 | 2010-11-04 | A kind of heat conductive pad of electronic equipment |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010532188.6A Expired - Fee Related CN102142407B (en) | 2010-11-04 | 2010-11-04 | Heat conducting pad |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN102142407B (en) |
| WO (1) | WO2012058926A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108364922A (en) * | 2018-01-31 | 2018-08-03 | 北京比特大陆科技有限公司 | Liquid cooling heat radiation system |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102958323A (en) * | 2011-08-29 | 2013-03-06 | 佳能企业股份有限公司 | Heat conducting structure |
| CN107223006B (en) * | 2017-06-28 | 2018-02-27 | 日海通信服务有限公司 | Rack and its radiator |
| US10806054B1 (en) | 2019-08-06 | 2020-10-13 | Honeywell International Inc. | Flexible elastic thermal bridge for electronic subassemblies with variable gaps between components and enclosures |
| CN111029315B (en) * | 2019-11-19 | 2021-09-21 | 中国航空工业集团公司西安航空计算技术研究所 | Chip flexible heat transfer mechanism |
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2010
- 2010-11-04 CN CN201010532188.6A patent/CN102142407B/en not_active Expired - Fee Related
- 2010-11-04 CN CN201210422496.2A patent/CN102903685B/en not_active Expired - Fee Related
-
2011
- 2011-06-07 WO PCT/CN2011/075403 patent/WO2012058926A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4654754A (en) * | 1982-11-02 | 1987-03-31 | Fairchild Weston Systems, Inc. | Thermal link |
| US5307236A (en) * | 1991-07-23 | 1994-04-26 | Alcatel Telspace | Heatsink for contact with multiple electronic components mounted on a circuit board |
| JPH1168360A (en) * | 1997-08-08 | 1999-03-09 | Nec Corp | Cooling structure for semiconductor element |
| US6088228A (en) * | 1998-12-16 | 2000-07-11 | 3M Innovative Properties Company | Protective enclosure for a multi-chip module |
| US20010028552A1 (en) * | 2000-04-10 | 2001-10-11 | Cit Alcatel | Securing heat sinks to electronic components |
| JP2003198171A (en) * | 2001-12-28 | 2003-07-11 | Furukawa Electric Co Ltd:The | Heat sink and radiator |
| CN2587135Y (en) * | 2002-11-27 | 2003-11-19 | 世顶企业有限公司 | Radiator fastener structure |
| CN2831718Y (en) * | 2005-04-15 | 2006-10-25 | 富准精密工业(深圳)有限公司 | Radiation boards |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108364922A (en) * | 2018-01-31 | 2018-08-03 | 北京比特大陆科技有限公司 | Liquid cooling heat radiation system |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012058926A1 (en) | 2012-05-10 |
| CN102142407B (en) | 2014-02-19 |
| CN102903685B (en) | 2015-12-16 |
| CN102142407A (en) | 2011-08-03 |
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