CN102830134A - Up-and-down constant-temperature parameter identifying method for testing thermal interface material performance - Google Patents
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- CN102830134A CN102830134A CN2012102787718A CN201210278771A CN102830134A CN 102830134 A CN102830134 A CN 102830134A CN 2012102787718 A CN2012102787718 A CN 2012102787718A CN 201210278771 A CN201210278771 A CN 201210278771A CN 102830134 A CN102830134 A CN 102830134A
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Abstract
The invention discloses an up-and-down constant-temperature parameter identifying method for testing the thermal interface material performance. The up-and-down constant-temperature parameter identifying method comprises the following steps: step one, preparing a standard material thermal flow meter; step two, placing a thermal interface material between contact interfaces of two thermal flow meters, loading pressure stress, and heating the thermal flow meters forward; step three, amending measuring temperature of a test point; step four, calculating a contact thermal resistance R; and step five, measuring the thickness L of the thermal interface material, and calculating the equivalent heat conducting coefficient of the thermal interface material. According to the invention, a symmetrical testing structure which is amended by up-and-down constant-temperature parameter identification is adopted for measuring, the inconsistent error of temperature measurement caused by different contact thermal resistance of each temperature sensor and the thermal flow meters or incomplete linearity of temperature and the like can be eliminated, and further the performance of the thermal interface material with high accuracy can be measured on the premise that the thermal flow rate is ensured.
Description
Technical field
The invention belongs to technical field of measurement and test, be specifically related to a kind of thermal contact resistance method of testing and equipment, be applicable to, be particularly useful for performance test thermal interfacial material to the test of the interface thermal contact resistance of common used material.
Background technology
Thermal contact resistance is a parameter that receives numerous factor affecting such as material property, mechanical property, surface topography, contact pressure, temperature, clearance material.Whether stable according to the experiment hot-fluid, generally be divided into transient state method and steady state method to the thermal contact resistance measuring method.The transient state method also is a kind of thermal contact resistance experimental measurement method commonly used; It mainly comprises photothermal laser mensuration, thermal imaging method, " flash " flicker method, laser optoacoustic method etc.; Wherein the photothermal laser mensuration comprises modulation photo-thermal method and heat scan method again, and modulation photo-thermal method has the branch of photo-thermal amplitude method, photo-thermal phase method and impulse method again.Though though various transient state method is suitable for quick measurement and can measures little film to nanometer scale, its measuring process is subject to the various factors influence, and derivation of equation relative complex, measuring accuracy also cannot say for sure to demonstrate,prove.Therefore, what interface thermal contact resistance measuring method was the most frequently used is steady state method: keep certain temperature difference in two contacts on the samples, measure the temperature value of two samples on axially, obtain the temperature difference on the interface thereby be extrapolated to the contact interface place by Fourier law again; Heat flux can be measured or calculated by the thermal conductivity and the thermograde of specimen material by thermal flow meter, thus R=|T1-T2|/Q.It is similar with the testing standard equipment of American National Standard ASTMD5470-06 mostly stable state thermal contact resistance method of testing is, but have document to point out because thermometric uncertain sum of errors thermal loss error is difficult to guarantee that the interface thermal contact resistance is had sufficiently high measuring accuracy more.
Summary of the invention
The object of the present invention is to provide a kind of up and down constant temperature parameter identification method calorimetric boundary material thermal contact resistance, but under the prerequisite that guarantees the heat flux precision thermal contact resistance that records thermal interfacial material of very high degree of precision and effective equivalent heat conductivity.
The technical solution that realizes the object of the invention is: constant temperature parameter identification method calorimetric boundary material performance up and down is characterized in that following steps:
The first step, the preparation of testing standard material thermal flow meter.
Process the thermal flow meter of two standard materials; With vertical coaxial being installed between the two heating and coolings cover of thermal flow meter; Two heating and cooling covers are provided with the stress charger; Described thermal flow meter is provided with temperature sensor, and temperature sensor is connected with data acquisition system (DAS), is used for the axial temperature of test sample;
Following relation is satisfied in position on the thermal flow meter between the test point: with the contact interface sectional position on two thermal flow meter axial directions is the plane of symmetry; Test point position on two thermal flow meters is symmetry fully; Axial distance between adjacent two test points on each thermal flow meter equates; Each thermal flow meter is provided with n test point between from the lower surface to the upper surface, and the distance between the test point is dx;
Second step, place thermal interfacial material between the two thermal flow meter contact interfaces, load compressive stress, forward heats thermal flow meter:
To two end heating wherein that thermal flow meter is axial, other end cooling, specimen temperature begins the collecting test temperature after reaching and stablizing; Described probe temperature comprises the measurement temperature T of n test point on each thermal flow meter
I, j, i=1, n, n are test point number and by plane of symmetry symmetry on the thermal flow meter, j=1, and 2 represent two different thermal flow meters respectively;
In the 3rd step, test point is measured the correction of temperature;
Carrying out under the sufficient adiabatic condition, a steady temperature is set at the two ends of thermal flow meter simultaneously, specimen temperature begins the collecting test temperature after reaching and stablizing; Described probe temperature comprises measurement temperature
i=1 of n test point on the thermal flow meter; N, n are test point number on the thermal flow meter;
Temperature measurement range to n the test point of being gathered in second step need be carried out the measurement temperature acquisition that above-mentioned many steady temperatures point repeats n test point on the thermal flow meter based on precision; And the measurement temperature of each test point on the thermal flow meter and the steady temperature that sets carried out the parameter identification analysis, carry out the synthetic correlation function of linear fit or multivariate quasi;
The 4th step, the calculating of thermal contact resistance R;
Find the solution related function in the 3rd step to the measurement temperature of each test point of gathering in the step 2; Obtain one and revise temperature
i=1; N, n are test point number on the thermal flow meter;
And then under the situation of ignoring the hot-fluid loss, but the thermal contact resistance R that calculates thermal flow meter of degree of precision;
In the 5th step, thermal interfacial material thickness L measures, the calculating of the equivalent heat conductivity of thermal interfacial material;
Reference point locations through at the in-situ measurement system of two thermal flow meter contact interface location arrangements changes the thickness L that records thermal interfacial material, calculates apparent thermal contact resistance R
AFor: R
A=A * R, wherein A is a contact area, thus equivalent effective thermal conductivity k
EffFor:
Be to guarantee the one dimension property of thermograde, thermal flow meter be right cylinder or rectangular parallelepiped.
When positive and negative two-way test to contact interface temperature T
S-1＇, T
S-1" and T
S-2＇, T
S-2" calculating also can adopt least square method to carry out that linear fit is found the solution or the indirect problem method is found the solution.
In-situ measurement system is equipped with in contact interface position at two thermal flow meters.
The present invention compared with prior art; Of the present invention a kind of adopt the method for constant temperature parameter identification method calorimetric boundary material up and down adopt the symmetrical test structure of constant temperature parameter identification correction up and down measure cancellation basically owing to the thermal contact resistance of each temperature sensor and thermal flow meter different or temperature not exclusively be linearity etc. the thermometric inconsistency error that causes of reason, but and then under the prerequisite of assurance heat flux precision the thermal contact resistance that records thermal flow meter of very high degree of precision.
Description of drawings
Fig. 1 is the front view of proving installation of the present invention;
Fig. 2 is a system testing schematic diagram of the present invention;
Fig. 3 is the front view of standard thermal flow meter 1 among the present invention;
Fig. 4 is for adopting the inventive method temperature deviation on the thermal flow meter 1 and 2 when constant temperature is tested up and down;
Parameter when Fig. 5 carries out the related function match for adopting the inventive method to the temperature deviation on thermal flow meter 1 and 2;
Fig. 6 for adopt the inventive method when pressure 2MPa respectively on heating and down the resulting thermal contact resistance of the heating thermal contact resistance of carrying out obtaining after the thermostat temperature correction with the relation of heat flux;
Embodiment
The present invention has proposed a kind of performance of constant temperature parameter identification method calorimetric boundary material up and down that adopts on American National Standard ASTM D5470 basis; Described method of testing is to adopt the symmetrical test structure of constant temperature up and down; Through the test thermal flow meter is carried out the inconsistency sum of errors thermal loss error of each temperature sensor of steady temperature parameter identification cancellation up and down; Come and ancillary method reduces hot-fluid loss in conjunction with controllable temperature heat radiation protective shield of radiation; Reach the purpose of the thermal physical property parameter of high precision measurement thermal interfacial material, this method can be high-precision measurement fill interface thermal contact resistance and effective equivalent heat conductivity behind the thermal interfacial material.
Below in conjunction with accompanying drawing the present invention is described in further detail.
In conjunction with Fig. 1; The invention discloses a kind of device of constant temperature parameter identification method calorimetric boundary material up and down that adopts; This device is the symmetrical structure of positive and negative up and down two-way hot-fluid test; Comprise control system, support 3, the first ball jacket 4-1, the second ball jacket 4-2, sliding screw 5, directed steel ball and pressure transducer 6, auxiliary heater 7, vacuum (-tight) housing 9, test specimen test section 10, answer force loading device, vacuum extraction gas port 13, intake-outlet 14, data acquisition system (DAS), sealed chassis 16; Back up pad 17, levelling lever 20 and heater strip 21; It is characterized in that: answer force loading device to be made up of hydraulic cylinder 11 and pressure power source 12, hydraulic cylinder 11 is positioned at the top of pressure power source 12; Data acquisition system (DAS) is made up of temperature sensor, sealing data connector 15, and temperature sensor links to each other with sealing data connector 15 through lead; Control system is made up of controllable temperature protective shield of radiation 2, heating and cooling cover 1 and control protective shield of radiation heater strip R2; Sample testing district 10 comprises the test test specimen; Wherein directed steel ball and pressure transducer 6, support 3, back up pad 17 and heating and cooling cover symmetry about in the of 1; Directed steel ball and pressure transducer 6 are fixed on back up pad 17 centers, answer force loading device to pass through support 3 location and also contact with directed steel ball and pressure transducer 6, are the sample loading stress; It is fixing that the first ball jacket 4-1 is arranged on the two ends up and down and the back up pad 17 of sliding screw 5; The second ball jacket 4-2 is arranged on the bottom of sliding screw 5 and fixes with support 3, and auxiliary heater 7 is between back up pad 17 and heating and cooling cover 1, and sample testing district 10 is between laterally zygomorphic two heating and coolings cover 1; Two controllable temperature protective shield of radiations 2 are positioned at the outside in sample testing district 10; Vacuum (-tight) housing 9 is positioned at the external stability of whole device on sealed chassis 16, and sliding screw 5 is fixed in the top of sealed chassis 16, and vacuum extraction gas port 13, intake-outlet 14 and sealing data connector 15 all are arranged on the sealed chassis 16; Hydraulic cylinder 11 runs through the center of sealed chassis 16, and sealed chassis is provided with four groups of levelling levers 20.
Fig. 2 is a test philosophy synoptic diagram of the present invention, in carrying out test process, regulates and control heating arrangement on the protective shield of radiation according to the measurement temperature of the temperature sensor on the thermal flow meter and it is reached with the approximate thermograde of thermal flow meter reduce the hot-fluid loss with this.Regulate and control with the approximate temperature of heating source to reduce thermal loss at the also corresponding auxiliary heater that is furnished with in position of heating and cooling cover up and down.
In Fig. 3, be fitted with the front view of the standard thermal flow meter 1 of temperature sensor among the present invention, on this thermal flow meter, be fitted with the position up and down symmetry 3 groups of temperature sensors of strict demand are arranged.The standard thermal flow meter can be processed into right cylinder or rectangular parallelepiped; The plug-in opening of temperature sensor has strict positional precision and form accuracy requirement; And assurance has enough symmetries up and down; Before the plug-in mounting temperature sensor, standard thermal flow meter (what present case selected for use is Elkonite copper tungsten alloy30W3 material, and coefficient of heat conductivity is 216 ± 2W/mK, and hardness is 276HV) is carried out alcohol, acetone, isopropyl acetone and ultrasonic cleaning.Temperature sensor is that symmetrical equidistance is arranged, and the probe of temperature sensor is through in welding or the heat-conducting cream bonding plug-in opening.The temperature sensor that present embodiment adopts is a thermal resistance.
The invention discloses a kind of constant temperature parameter identification method up and down and measure the method for the thermal contact resistance of Graphite pad thermal interfacial material, its testing procedure is following:
The first step, the preparation of testing standard material thermal flow meter.
As depicted in figs. 1 and 2; Why thermal flow meter selects the 30W3 tungsten-copper alloy to consider following reason up and down: because the good heat-conducting of copper and the high strength of tungsten make it between material hardness and heat conductivility, to reach good balance, so can reduce to destroy the possibility that contacts the end face surface topography in the use for a long time.Produce two standard materials (Elkonite copper-tungsten alloy 30W3 material) thermal flow meter; Process two tungsten-copper alloy material thermal flow meters; Thermal flow meter vertically is installed between two up and down symmetrically arranged heating and cooling covers, and two heating and cooling covers are provided with the stress charger, and described thermal flow meter is provided with temperature sensor; Temperature sensor is connected with data acquisition system (DAS); Be used to test the axial temperature of thermal flow meter, if the temperature sensor that is adopted is a thermopair, 1-4 the thermopair of then evenly arranging according to this thermal flow meter axial cross section on average tried to achieve the temperature of this axial point; If the temperature sensor that is adopted is a thermal resistance; Then the thermal flow meter axial cross section is arranged that evenly 1-4 thermal resistance of thermometric adopts 4 line systems to connect method; Exciting current to this 1-4 thermal resistance of evenly arranging is identical, can adopt parallel connection method to come on average to try to achieve the temperature of this axial point and reduce the hot-fluid that the lead-in wire because of thermal resistance causes the lead-in wire of this 1-4 thermal resistance signal collection terminal of evenly arranging and lose.
Following relation is satisfied in position on the thermal flow meter between the test point: with the contact interface sectional position on the two thermal flow meter y directions is the plane of symmetry; Test point position on two thermal flow meters is symmetry fully; Each thermal flow meter all is provided with 4 test points between from the lower surface to the upper surface; Axial distance on each thermal flow meter between adjacent two test points equates; Distance between the test point is dx=25mm, is 2mm from the position of contact interface to a test point, (T.x) of thermal flow meter 1 as shown in Figure 2
3Test point is 2mm to the distance of contact interface, and thermal flow meter 2 is 2mm from the position of contact interface to a test point equally.And by the probe mounting hole that processes temperature sensor of temperature sensor size equidistance on standard material thermal flow meter and thermal flow meter; Probe mounting hole≤the 0.5mm of described temperature sensor; Pass through the temperature sensor probe of welding or heat-conducting cream bonding≤0.5mm in the probe mounting hole; Temperature sensor is connected with data acquisition system (DAS) through the connector of chamber walls, and temperature sensor of the present invention adopts the four-wire system thermal resistance.
Second step, place thermal interfacial material between the two thermal flow meter contact interfaces, load compressive stress, forward heats thermal flow meter:
To be furnished with shown in as depicted in figs. 1 and 23 groups of temperature sensors thermal flow meter 1 and 2 vertically be installed in two ends and all have in the vacuum chamber of thermal flow meter, heating and cooling cover, assisted heating device; For reduce thermal loss the heat-insulation layer skin add one be embedded with heating arrangement the controllable temperature protective shield of radiation; After vacuumizing, carry out the forward hot-fluid test of heating bottom, top refrigeration; This moment, the controllable temperature protective shield of radiation simulated the thermograde of approximate thermal flow meter; The auxiliary heater that the top is arranged is controlled its temperature to reduce the thermal loss of Y according to the temperature of heating and cooling cover; Carry out temperature data acquisition when reaching stable state, loading power this moment can be through the heat flux that converts of the thermal flow meter of symmetric arrangement up and down.
For example, when heat flux is 3.5W, record (T.x) on the thermal flow meter 1 at pressure 2MPa
1=25.053, (T.x)
2=24.658, (T.x)
3=24.257, (T.x) on the thermal flow meter 2
4=23.038, (T.x)
5=22.64 with (T.x)
6=22.243.
In the 3rd step, test point is measured the correction of temperature:
Carrying out under the sufficient adiabatic condition, to (T.x) on the thermal flow meter of being gathered in the step 21
1, (T.x)
2(T.x)
3And (T.x) on the thermal flow meter 2
4, (T.x)
5(T.x)
6Totally 6 test points are to the heating and cooling cover of the symmetric arrangement up and down stable state image data of carrying out 7 steady temperature points from 22 ~ 28 ℃.As shown in Figure 4, set the steady temperature of heating and cooling cover and write down (T.x)
1, (T.x)
2, (T.x)
3, (T.x)
4, (T.x)
5(T.x)
6The measurement temperature of test point
With
Deviation with this steady temperature.Present case is by carrying out y=A0 * x
3+ A1 * x
2The equation with many unknowns function of+A2 * x+A3 carries out data fitting to this temperature deviation and steady temperature, and parameter A 0, A1, A2 and the A3 of match are as shown in Figure 5.
The 4th step, the calculating of thermal contact resistance R:
As shown in Figure 6, for example when heat flux is 3.5W, (T.x)
1=25.053, (T.x)
2=24.658, (T.x)
3=24.257 and (T.x)
4=23.038, (T.x)
5=22.64 with (T.x)
6Obtain the temperature deviation value in the match related function of totally 6 test points in=22.243 the 3rd step of temperature value substitution, thereby obtain
Adding forward hot-fluid when test, when heat flux is 3.5W, revised according to (T.x) on the thermal flow meter 1
1, (T.x)
2(T.x)
3With the revised temperature gradient relation of 3 test point positions, and (T.x) on the thermal flow meter 2
4, (T.x)
5(T.x)
6With the revised temperature gradient relation of 3 test point positions, the extrapolation interface temperature of the thermal flow meter 1 that obtains through numerical method extrapolation does
The extrapolation interface temperature of thermal flow meter 2 does
The interface temperature difference of two thermal flow meters is:
Then thermal contact resistance
For:
Wherein Q is a heat flux.
As shown in Figure 6, at pressure 2MPa, heat flux is when 3.5W, and last heating is by the temperature (T.x) that does not have on thermal flow meter 1 and the thermal flow meter 2 to revise
5=25.053, (T.x)
6=24.658, (T.x)
7=24.257, (T.x)
9=23.038, (T.x)
10=22.64 with (T.x)
11=22.243 contact thermal resistances that calculate are 0.33K/W, and adopt revised temperature
With
The contact thermal resistance that calculates is 0.307K/W.In like manner; To employing shown in Figure 6 up and down the measured temperature value of contact thermal resistance that calculates of different direction of heat flow revise, promptly obtain contact thermal resistance that different up and down direction of heat flow shown in Figure 6 calculate and adopt the contact thermal resistance that obtains after the correction of this method temperature with the relation that loads hot-fluid.
In the 5th step, thermal interfacial material thickness L measures, the calculating of the equivalent heat conductivity of thermal interfacial material;
Reference point locations through at the in-situ measurement system of two thermal flow meter contact interface location arrangements changes the thickness L=0.2mm that records thermal interfacial material, calculates apparent thermal contact resistance R
AFor: R
A=A * R=150.698mm
2K/W, wherein contact area is A=490.874mm
2Thereby, equivalent effective thermal conductivity k
EffFor:
The above attaches for the detailed description of preferred embodiment of the present invention and figure; Be not to be used for limiting the present invention; All scopes of the present invention should be as the criterion with patent right book scope required for protection; The embodiment of all and of the present invention design philosophys and similar variation thereof, approximate construction all should be contained among the scope of patent protection of the present invention.
Claims (4)
1. constant temperature parameter identification method calorimetric boundary material performance up and down is characterized in that following steps:
The first step, the preparation of testing standard material thermal flow meter.
Process the thermal flow meter of two standard materials; With vertical coaxial being installed between two heating and coolings covers of thermal flow meter; Two heating and cooling covers are provided with the stress charger; Described thermal flow meter is provided with temperature sensor, and temperature sensor is connected with data acquisition system (DAS), is used for the axial temperature of test sample;
Following relation is satisfied in position on the thermal flow meter between the test point: with the contact interface sectional position on two thermal flow meter axial directions is the plane of symmetry; Test point position on two thermal flow meters is symmetry fully; Axial distance between adjacent two test points on each thermal flow meter equates; Each thermal flow meter is provided with n test point between from the lower surface to the upper surface, and the distance between the test point is dx;
Second step, place thermal interfacial material between the two thermal flow meter contact interfaces, load compressive stress, forward heats thermal flow meter:
To two end heating wherein that thermal flow meter is axial, other end cooling, specimen temperature begins the collecting test temperature after reaching and stablizing; Described probe temperature comprises the measurement temperature T of n test point on each thermal flow meter
I, j, i=1, n, n are test point number and by plane of symmetry symmetry on the thermal flow meter, j=1, and 2 represent two different thermal flow meters respectively;
In the 3rd step, test point is measured the correction of temperature;
Carrying out under the sufficient adiabatic condition, a steady temperature is set at the two ends of thermal flow meter simultaneously, specimen temperature begins the collecting test temperature after reaching and stablizing; Described probe temperature comprises measurement temperature
i=1 of n test point on the thermal flow meter; N, n are test point number on the thermal flow meter;
Temperature measurement range to n the test point of being gathered in second step need be carried out the measurement temperature acquisition that above-mentioned many steady temperatures point repeats n test point on the thermal flow meter based on precision; And the measurement temperature of each test point on the thermal flow meter and the steady temperature that sets carried out the parameter identification analysis, carry out the synthetic correlation function of linear fit or multivariate quasi;
The 4th step, the calculating of thermal contact resistance R;
Find the solution related function in the 3rd step to the measurement temperature of each test point of gathering in the step 2; Obtain one and revise temperature
i=1; N, n are test point number on the thermal flow meter;
And then under the situation of ignoring the hot-fluid loss, but the thermal contact resistance R that calculates thermal flow meter of degree of precision;
In the 5th step, thermal interfacial material thickness L measures, the calculating of the equivalent heat conductivity of thermal interfacial material;
Reference point locations through at the in-situ measurement system of two thermal flow meter contact interface location arrangements changes the thickness L that records thermal interfacial material, calculates apparent thermal contact resistance R
AFor: R
A=A * R, wherein A is a contact area, thus equivalent effective thermal conductivity k
EffFor:
2. constant temperature parameter identification method calorimetric boundary material performance up and down according to claim 1, it is characterized in that: thermal flow meter is right cylinder or rectangular parallelepiped.
3. up and down constant temperature parameter identification method calorimetric boundary material performance according to claim 1 is characterized in that: when positive and negative two-way test to contact interface temperature T
S-1＇, T
S-1" and T
S-2＇, T
S-2" calculating also can adopt least square method to carry out that linear fit is found the solution or the indirect problem method is found the solution.
4. constant temperature parameter identification method calorimetric boundary material performance up and down according to claim 1, it is characterized in that: in-situ measurement system is equipped with in the contact interface position at two thermal flow meters.
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| CN102980910A (en) * | 2012-11-30 | 2013-03-20 | 深圳市博恩实业有限公司 | Heat conduction material property testing equipment |
| CN104215661A (en) * | 2014-09-02 | 2014-12-17 | 兰州大学 | Solid interface contact thermal resistance test device based on super-magnetostrictive intelligent material |
| CN105388184A (en) * | 2015-12-17 | 2016-03-09 | 北京航空航天大学 | Specimen installation fixture used for contact thermal resistance testing |
| CN106093108A (en) * | 2016-05-19 | 2016-11-09 | 南京航空航天大学 | Unidirectional fibre toughening composition Equivalent Thermal Conductivities predictor method based on interstitial defect identification |
| CN109839406A (en) * | 2019-03-27 | 2019-06-04 | 桂林电子科技大学 | A kind of high precision measurement method of interface contact heat resistance |
| WO2021004106A1 (en) * | 2019-07-10 | 2021-01-14 | 南京航空航天大学 | Online monitoring device for deposit thickness on bottom of horizontal flue, and method |
| CN114062420A (en) * | 2020-08-10 | 2022-02-18 | 华为技术有限公司 | Device and method for testing heat conduction parameters |
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| CN102980910A (en) * | 2012-11-30 | 2013-03-20 | 深圳市博恩实业有限公司 | Heat conduction material property testing equipment |
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| CN104215661B (en) * | 2014-09-02 | 2017-02-22 | 兰州大学 | Solid interface contact thermal resistance test device based on super-magnetostrictive intelligent material |
| CN105388184A (en) * | 2015-12-17 | 2016-03-09 | 北京航空航天大学 | Specimen installation fixture used for contact thermal resistance testing |
| CN106093108A (en) * | 2016-05-19 | 2016-11-09 | 南京航空航天大学 | Unidirectional fibre toughening composition Equivalent Thermal Conductivities predictor method based on interstitial defect identification |
| CN106093108B (en) * | 2016-05-19 | 2018-10-16 | 南京航空航天大学 | Unidirectional fibre toughening composition Equivalent Thermal Conductivities predictor method based on interstitial defect identification |
| CN109839406A (en) * | 2019-03-27 | 2019-06-04 | 桂林电子科技大学 | A kind of high precision measurement method of interface contact heat resistance |
| WO2021004106A1 (en) * | 2019-07-10 | 2021-01-14 | 南京航空航天大学 | Online monitoring device for deposit thickness on bottom of horizontal flue, and method |
| CN114062420A (en) * | 2020-08-10 | 2022-02-18 | 华为技术有限公司 | Device and method for testing heat conduction parameters |
| CN114062420B (en) * | 2020-08-10 | 2023-09-08 | 华为技术有限公司 | Device and method for testing heat conduction parameters |
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