CN102819300A - Radiator and electronic device structure - Google Patents
Radiator and electronic device structure Download PDFInfo
- Publication number
- CN102819300A CN102819300A CN2011101527780A CN201110152778A CN102819300A CN 102819300 A CN102819300 A CN 102819300A CN 2011101527780 A CN2011101527780 A CN 2011101527780A CN 201110152778 A CN201110152778 A CN 201110152778A CN 102819300 A CN102819300 A CN 102819300A
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- Prior art keywords
- heat sink
- circuit board
- heat
- covers
- spacing
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Abstract
Disclosed are a radiator and an electronic device structure. The radiator is used for a circuit board of an electronic device. A plurality of electronic parts are electrically disposed on the circuit board. The radiator comprises a radiating plate made of metal material. When the radiating plate covers one side of the circuit board, a distance is reserved between the radiating plate and the side of the circuit board to form an air passage. Therefore, overall radiating effect of the circuit board is improved.
Description
[technical field]
The present invention is about a kind of heat abstractor, particularly a kind of have cover heat abstractor and the electronic installation structure that covers in the heat sink on the circuit board.
[background technology]
Because the arithmetic speed of computer apparatus internal electronic element is quick; Add the more miniaturization of overall volume of electronic installation; Make the thermal value of unit area of computer apparatus increase thereupon; If untimely heat energy is loose removed, too high temperature will badly influence stability and the efficient of electronic component when running, even cause shorten or the result of damage the serviceable life of computer apparatus.
The circuit board radiating mode that present industry applies to electronic installation all is to dispel the heat in order to the fan module mostly; Set electronics spare part on the circuit board; For example central processing unit (CPU), south bridge wafer etc.; When running, can produce quite high heat energy, just need carry out heat loss through convection with the fan module this moment.But if under the long-time situation of using electronic installation, the heat energy that motherboard produced will improve relatively, only relies on the inner fan module of electronic installation and can't reach required heat dissipation, so will cause the electronic installation can't efficient normal operation.
Adopt the radiating mode of known fan module only can radiating effect be provided to the specific region of circuit board; But the perform region of not installing the fan module is under long operating state; Its heat energy can't loose immediately and remove, and causes the inner working temperature of electronic installation uneven, and can't reach whole heat dissipation; The causes electrons spare part produces short circuit, or even overheated situation such as burn.
[summary of the invention]
In view of above problem, the invention reside in provides a kind of heat abstractor and electronic installation structure, uses to solve to commonly use and only uses the fan module to dispel the heat, and its institute causes the problem of the integral heat sink usefulness inequality of electronic installation.
A kind of heat abstractor of the present invention is applicable to a circuit board of an electronic installation, and circuit board has relative one first and one second, and circuit board electrically is provided with a plurality of electronics spare parts.Heat abstractor includes one first heat sink, is made with metal material.First heat sink covers on first that covers in circuit board, and has a spacing between first heat sink and circuit board first, uses to constitute a gas channel.
Heat abstractor of the present invention more can include one second heat sink, is made with metal material, and second heat sink covers second that covers in circuit board, and has a spacing between second heat sink and second.In addition, electronic installation has a housing, setting that second heat sink is and housing is fitted each other.
Electronic installation structure of the present invention includes a circuit board and a heat abstractor; Wherein circuit board has relative one first and one second; This heat abstractor has one first heat sink and one second heat sink, and first heat sink and second heat sink system process with metal material.First heat sink covers on first that covers in circuit board; Second heat sink covers on second that covers in circuit board; And have a spacing between first of first heat sink and circuit board, have a spacing between second heat sink and second, to constitute gas channel respectively.
Effect of the present invention is, sees through heat sink and carries out heat dissipation for the circuit board of electronic installation, and the thermal source that the electronics spare part on the circuit board is produced is discharged heat energy by the cross-ventilation mode by gas channel.And the electronics spare part also reaches the heat sink of metal material by conduction pattern with heat energy, sees through convection current and dispels the heat simultaneously with the conduction dual mode, to reach preferable radiating effect.
About characteristic of the present invention, the real work and effect, cooperate the graphic most preferred embodiment of doing to specify as follows now.
[description of drawings]
Fig. 1 is the decomposing schematic representation of first embodiment of the invention.
Fig. 2 A is the schematic perspective view of first embodiment of the invention.
Fig. 2 B be first embodiment of the invention be locked in the casing synoptic diagram.
Fig. 3 is the cross sectional side view along A-A ' axle of Fig. 2 A.
Fig. 4 is the cross sectional side view of another combination of first embodiment of the invention.
Fig. 5 is the decomposing schematic representation of second embodiment of the invention.
Fig. 6 A is the schematic perspective view of second embodiment of the invention.
Fig. 6 B be second embodiment of the invention be locked in the casing synoptic diagram.
Fig. 7 is the cross sectional side view along B-B ' axle of Fig. 6 A.
Fig. 8 is the cross sectional side view of another combination of second embodiment of the invention.
The main element symbol description:
1,101 first of 110 circuit boards
1,102 second 1103 electronics spare parts
1104 combined holes, 210 first heat sinks
2102 perforates of 2101 fixed orifices
310 spacings, 410 fixtures
510 housings, 610 second heat sinks
6101 fixed orifices
[embodiment]
Please cover one first heat sink 210 that covers on the circuit board 110 referring to figs. 1 through having of first embodiment shown in Figure 4.Please with reference to the three-dimensional exploded view of first embodiment shown in Figure 1; The heat abstractor of first embodiment includes one first heat sink 210; Be applicable to a circuit board 110; Wherein circuit board 110 has relative one first 1101 and 1 second 1102, and circuit board 110 electrically is provided with a plurality of electronics spare parts 1103, and circuit board 110 has more a plurality of combined holes 1104.
Please with reference to the schematic perspective view of first embodiment shown in Fig. 2 A and Fig. 2 B; When first heat sink 210 covers first 1101 that covers in circuit board 110; First 1101 electronics spare part 1103 of circuit board 110 wore the perforate 2102 of first heat sink 210 respectively; And fixture 410 wore the fixed orifice 2101 of first heat sink 210 respectively and was fixedly arranged on the combined hole 1104 of circuit board 110; Make first heat sink 210 be able to be suspended on first 1101 of circuit board 110, and can produce a spacing 310 between first heat sink 210 and circuit board 110 first 1101, use and constitute a gas channel; Please with reference to shown in Fig. 2 B; And further fixture 410 is locked on the casing 510, make first 1101 of its circuit board 110 reach radiating effect by first heat sink 210, second 1102 of circuit board 110 then reaches radiating effect by casing 510.See through shown in Fig. 2 AA-A ' section part; The circuit board 110 and first heat sink 210 between the two fixed form and produce between the two between explain apart from the radiating effect that reached, and please with reference to the sectional view of Fig. 3 to Fig. 2 AA-A ' axle of first embodiment shown in Figure 4.
Please with reference to shown in Figure 3; When first heat sink 210 covers first 1101 that covers in circuit board 110; The electronics spare part 1103 of circuit board 110 wore first heat sink 210 respectively; And fixture 410 wore first heat sink 210 and was fixedly arranged on circuit board 110, and the fixture 410 of present embodiment can be screw or other fixed forms, as long as but the circuit board 110 and first heat sink 210 are interfixed; Its fixed form that produces spacing 310 all can be used, be among the present invention not in this qualification.
Please with reference to Fig. 4; Fig. 4 is another combination of first embodiment, and when first heat sink 210 covered first 1101 that covers in circuit board 110, the electronics spare part 1103 of circuit board 110 wore first heat sink 210 respectively; And with first heat sink 210 with binder and circuit board 110 first 1101 gluing mutually; That is to say that binder is suspended on the circuit board 110 heat sink 210 of winning between between first heat sink 210 and circuit board 110 first 1101; Make 110 of first heat sink 210 and circuit boards produce a spacing 310, and this spacing 310 promptly become gas channel.
Combination that it should be noted that first heat sink 210 of the present invention is not disclosed with present embodiment exceeds, and is familiar with this operator, can adopt any suitable associated methods.
About the explanation of the heat dissipation that heat abstractor reaches of present embodiment, when electronics spare part 1103 runnings of circuit board 110, the thermal source of generation by the cross-ventilation mode in the spacing 310 with conduct to first heat sink 210 and reach radiating effect.The thermal source that is produced when circuit board 110 is via the thermal convection of spacing 310, its convection current be hot-air toward rising, cold air is toward descending; Make its continuous circulation, and when hot-air touches first heat sink 210, be low-temperature condition when not contacted by thermal source owing to first heat sink 210; So that thermal source is when touching first heat sink 210; By conducting on first heat sink 210, make it diffuse to heat sink and thermal source is taken away, and institute reaches radiating effect by cold air; And then elevator system stability, and the serviceable life that prolongs electronic component.
Please cover one first heat sink 210 and one second heat sink 610 that covers on the circuit board 110 to having of second embodiment shown in Figure 8 with reference to Fig. 5.Please with reference to the three-dimensional exploded view of second embodiment shown in Figure 5; The heat abstractor of second embodiment includes one first heat sink 210 and one second heat sink 610; Be applicable to a circuit board 110; Wherein circuit board 110 has relative one first 1101 and 1 second 1102, and circuit board 110 electrically is provided with a plurality of electronics spare parts 1103, and circuit board 110 has more a plurality of combined holes 1104.
Please with reference to the schematic perspective view of second embodiment shown in Fig. 6 A and Fig. 6 B; When first heat sink 210 covers first 1101 that covers in circuit board 110; First 1101 electronics spare part 1103 of circuit board 110 wore the perforate 2102 of first heat sink 210 respectively; And fixture 410 wore first fixed orifice 2101 of first heat sink 210 respectively and was fixedly arranged on the combined hole 1104 of circuit board 110; Make first heat sink 210 be able to be suspended on first 1101 of circuit board 110, and can produce a spacing 310 between first heat sink 210 and circuit board 110 first 1101, and second heat sink 610 cover cover in circuit board 110 second 1102 o'clock; Further fixture 410 was worn second fixed orifice 6101 of second heat sink 610 respectively; Second heat sink 610 can be suspended on second 1102 of circuit board 110, make to have a spacing 310 between second heat sink 610 and circuit board 110 second 1102, use and constitute a gas channel; Please with reference to shown in Fig. 6 B; Further fixture 410 is locked on the casing 510, makes first 1101 of its circuit board 110 reach radiating effect by first heat sink 210, second 1102 of circuit board 110 then reaches radiating effect by second heat sink 610.
See through the section part of Fig. 6 A along B-B ' axle; Fixed form between its circuit board 110 and first heat sink 210 and second heat sink 610 and explain apart from the radiating effect that reached between producing, and please with reference to the sectional view along B-B ' axle of Fig. 7 to Fig. 6 A of second embodiment shown in Figure 8.
Please with reference to shown in Figure 7; When first heat sink 210 covers first 1101 that covers in circuit board 110; The electronics spare part 1103 of circuit board 110 wore first heat sink 210 respectively; And fixture 410 wore first heat sink 210 and circuit board 110 and was fixedly arranged on second heat sink 610, and the fixture 410 of present embodiment can be screw or other fixed forms, as long as but the circuit board 110 and first heat sink 210 and second heat sink 610 are interfixed; And the fixed form that can produce spacing 310 all can use, and the present invention is not in this qualification.
Please with reference to Fig. 8; Fig. 8 is another combination of second embodiment, and when first heat sink 210 covers when covering in circuit board 110, the electronics spare part 1103 of circuit board 110 wore first heat sink 210 respectively; And with first heat sink 210 with binder and circuit board 110 first 1101 gluing mutually; That is to say that binder is between between first heat sink 210 and circuit board 110 first 1101, the heat sink 210 of winning is suspended on first 1101 of circuit board 110; Make 110 of first heat sink 210 and circuit boards produce a spacing 310; Again with second heat sink 610 with binder and circuit board 110 second 1102 gluing mutually, binder is between between second heat sink 610 and circuit board 110 second 1102, makes second heat sink 610 be suspended on second 1102 of circuit board 110; Make 110 of second heat sink 610 and circuit boards produce a spacing, and above-mentioned spacing 310 promptly become gas channel.
Combination that it should be noted that first heat sink 210 of the present invention and second heat sink 610 is not disclosed with present embodiment exceeds, and is familiar with this operator, can adopt any suitable associated methods.
About the performed radiating mode of the heat abstractor of present embodiment; When 1103 runnings of the electronics spare part of circuit board 110, the thermal source that it produced by the cross-ventilation mode in the spacing 310 with conduct to first heat sink 210 and second heat sink 610 reaches radiating effect.Rises convection current when first 1101 and second 1102 thermal source of circuit board 110 produces via spacing 310, its convection current be hot-air toward rising, cold air makes its continuous circulation toward decline.
When hot-air touches first heat sink 210 and second heat sink 610; Because first heat sink 210 is a low-temperature condition when not contacted by thermal source with second heat sink 610; So that thermal source just conducts the heat on the heat sink when touching first heat sink 210 and second heat sink 610, and second 1102 thermal source that is produced of circuit board 110 be when being transmitted to second heat sink 610, its thermal source that do not dissipate also can via 610 convection current of second heat sink with conduct on the casing 510; Make circuit board 110 reach the consistent temperature that effectively reduces of globality; Reach preferable radiating effect, and then elevator system stability, and the serviceable life that prolongs electronic component.
Though embodiments of the invention disclose as stated; So be not in order to limit the present invention; Anyly have the knack of related art techniques person; Do not breaking away from the spirit and scope of the present invention, such as according to the described shape of application range of the present invention, structure, characteristic and quantity when can doing a little change, therefore scope of patent protection of the present invention must be looked the appended claim person of defining of this instructions and is as the criterion.
Claims (10)
1. heat abstractor is applicable to it is characterized in that a circuit board of an electronic installation; This circuit board has relative one first and one second, and this circuit board more electrically is provided with a plurality of electronics spare parts, and wherein this heat abstractor includes one first heat sink; Process with a metal material; This first heat sink covers on this first that covers in this circuit board, and has a spacing between this first heat sink and this circuit board this first, to constitute a gas channel.
2. heat abstractor as claimed in claim 1; It is characterized in that wherein this first heat sink has more plurality of openings, respectively corresponding those electronics spare parts; Cover on this first when this first heat sink covers, those electronics spare parts wore those perforates respectively.
3. heat abstractor as claimed in claim 1; It is characterized in that; Wherein this first heat sink has more the plurality of fixed hole; This circuit board has a plurality of combined holes, and the plurality of fixed part wore these fixed orifices respectively and was fixedly arranged on these combined holes, makes this first heat sink be suspended on this first.
4. heat abstractor as claimed in claim 1; It is characterized in that; More comprise a binder; Gluing is between this first heat sink and this circuit board this first, make between this first heat sink and this circuit board this first constituting this spacing, and this first heat sink is suspended on this first of this circuit board.
5. heat abstractor as claimed in claim 1 is characterized in that, wherein the material of this first heat sink is copper, aldary, aluminum or aluminum alloy.
6. heat abstractor as claimed in claim 1; It is characterized in that more include one second heat sink, it is processed with a metal material; This second heat sink covers this second that covers in this circuit board; Have a spacing between this second heat sink and this second, and this electronic installation has a housing, this second heat sink and this housing fit.
7. heat abstractor as claimed in claim 6 is characterized in that, wherein the material of this second heat sink is copper, aldary, aluminum or aluminum alloy.
8. heat abstractor as claimed in claim 6 is characterized in that, wherein this first heat sink has more a plurality of first fixed orifices; This second heat sink has a plurality of second fixed orifices; This circuit board has a plurality of combined holes, and the plurality of fixed part wore these first fixed orifices and these combined holes respectively, and those fixtures are fixedly arranged on these second fixed orifices; Make this first heat sink be suspended on this first, and this second heat sink is suspended on this second.
9. heat abstractor as claimed in claim 6; It is characterized in that, more comprise a binder, this first heat sink of gluing, this second heat sink and this circuit board; This binder gluing is between first of this circuit board and this first heat sink; And this binder gluing makes this first of this first heat sink and this circuit board to constitute this spacing, this spacing of second formation of this of this second heat sink and this circuit board between second of this circuit board and this second heat sink; And this first heat sink is suspended on this first of this circuit board, and this second heat sink is suspended on this second of this circuit board.
10. electronic installation structure is characterized in that, includes:
One circuit board, this circuit board have relative one first and one second; An and heat abstractor; This heat abstractor has one first heat sink and one second heat sink, and this first heat sink and this second heat sink are processed with a metal material, and this first heat sink covers on this first that covers in this circuit board; This second heat sink covers on this second that covers in this circuit board; And have a spacing between first of this of this first heat sink and this circuit board, have a spacing between this second heat sink and this second, to constitute a gas channel respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101527780A CN102819300A (en) | 2011-06-08 | 2011-06-08 | Radiator and electronic device structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101527780A CN102819300A (en) | 2011-06-08 | 2011-06-08 | Radiator and electronic device structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102819300A true CN102819300A (en) | 2012-12-12 |
Family
ID=47303445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101527780A Pending CN102819300A (en) | 2011-06-08 | 2011-06-08 | Radiator and electronic device structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102819300A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104022659A (en) * | 2014-06-18 | 2014-09-03 | 深圳市茂润电气有限公司 | Photovoltaic inverter with long service life, low power consumption and zero noise |
| CN106068071A (en) * | 2015-04-22 | 2016-11-02 | 三星电子株式会社 | There is the electronic equipment of radiator structure |
| CN106231863A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | Pcb board assembly and there is its mobile terminal |
| CN114189976A (en) * | 2020-09-14 | 2022-03-15 | 技嘉科技股份有限公司 | Electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6392890B1 (en) * | 2000-12-20 | 2002-05-21 | Nortel Networks Limited | Method and device for heat dissipation in an electronics system |
| TWI292300B (en) * | 2005-11-21 | 2008-01-01 | Delta Electronics Inc | Electronic device with dual heat dissipating structures |
| CN201199520Y (en) * | 2008-05-08 | 2009-02-25 | 力优勤电子技术（上海）有限公司 | Internal memory radiating fins for full buffer die set |
| US20090103269A1 (en) * | 2007-10-18 | 2009-04-23 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating device for memory card |
| CN201352891Y (en) * | 2009-01-04 | 2009-11-25 | 喆晟工业有限公司 | Radiating fin device of auxiliary buckling part with the functions of clip |
-
2011
- 2011-06-08 CN CN2011101527780A patent/CN102819300A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6392890B1 (en) * | 2000-12-20 | 2002-05-21 | Nortel Networks Limited | Method and device for heat dissipation in an electronics system |
| TWI292300B (en) * | 2005-11-21 | 2008-01-01 | Delta Electronics Inc | Electronic device with dual heat dissipating structures |
| US20090103269A1 (en) * | 2007-10-18 | 2009-04-23 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating device for memory card |
| CN201199520Y (en) * | 2008-05-08 | 2009-02-25 | 力优勤电子技术（上海）有限公司 | Internal memory radiating fins for full buffer die set |
| CN201352891Y (en) * | 2009-01-04 | 2009-11-25 | 喆晟工业有限公司 | Radiating fin device of auxiliary buckling part with the functions of clip |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104022659A (en) * | 2014-06-18 | 2014-09-03 | 深圳市茂润电气有限公司 | Photovoltaic inverter with long service life, low power consumption and zero noise |
| CN106068071A (en) * | 2015-04-22 | 2016-11-02 | 三星电子株式会社 | There is the electronic equipment of radiator structure |
| CN106231863A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | Pcb board assembly and there is its mobile terminal |
| CN114189976A (en) * | 2020-09-14 | 2022-03-15 | 技嘉科技股份有限公司 | Electronic device |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20121212 |