CN102778475B - Method for measuring solid-solid thermal contact resistance via up-and-down constant temperature parameter identification method - Google Patents
Method for measuring solid-solid thermal contact resistance via up-and-down constant temperature parameter identification method Download PDFInfo
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- CN102778475B CN102778475B CN201210279327.8A CN201210279327A CN102778475B CN 102778475 B CN102778475 B CN 102778475B CN 201210279327 A CN201210279327 A CN 201210279327A CN 102778475 B CN102778475 B CN 102778475B
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Abstract
The invention discloses a method for correcting and measuring a solid-solid thermal contact resistance via up-and-down constant temperature based on an American national standard ASTMD 5470. A high precision temperature sensor is adopted to perform up-and-down constant temperature parameter identification for a test-ware via a multi-point constant temperature so as to eliminate the error terms and the hot loss errors of the temperature sensors, and is combined with a controllable warm radiation radiation-proof screen and the auxiliary measures, so that an aim of high-precisely testing the thermophysical parameters of the test-ware is achieved. According to the method, the interface thermal contact resistances between same materials and different materials can be measured with high precise.
Description
Technical field
The invention belongs to technical field of measurement and test, be specifically related to a kind of solid-affixed tactile thermo-resistance measurement method, Gu particularly a kind of upper and lower constant temperature parameter identification method is surveyed solid-thermal contact resistance.
Background technology
Thermal contact resistance is a parameter that affected by the many factors such as material property, mechanical property, surface topography, contact, temperature, clearance material.Whether stable according to experiment hot-fluid, generally thermal contact resistance measuring method is divided into Transient Method and steady state method.Transient Method is also a kind of conventional thermal contact resistance experimental measurement method, it mainly comprises photothermal laser mensuration, thermal imaging method, " flash " flicker method, laser optoacoustic method etc., wherein photothermal laser mensuration comprises again modulation photo-thermal method and heat scan method, and modulation photo-thermal method has again dividing of photo-thermal amplitude method, photo-thermal phase method and impulse method.Though although various Transient Method is suitable for Quick Measurement and can measures the little film to nanometer scale, its measuring process is subject to various factors impact, and derivation of equation relative complex, measuring accuracy is also difficult to ensure card.Therefore, what interface thermal contact resistance measuring method was the most frequently used is steady state method: on two contact samples, maintain certain temperature difference, measure the temperature value of two samples on axially, thereby then by Fourier law, be extrapolated to contact interface place and obtain the temperature difference on interface; Heat flux can be measured or be calculated by thermal conductivity and the thermograde of specimen material by thermal flow meter, thus R=|T1-T2|/Q.It is similar with the testing standard equipment of American National Standard ASTMD5470-06 mostly stable state thermal contact resistance method of testing is, but have document to point out because thermometric uncertain error and thermal loss error are difficult to guarantee that interface thermal contact resistance is had to sufficiently high measuring accuracy more.
Summary of the invention
Gu the object of the invention is to put forward a kind of upper and lower constant temperature parameter identification method, survey solid-thermal contact resistance.
The technical solution that realizes the object of the invention is: Gu a kind of upper and lower constant temperature parameter identification method is surveyed solid-thermal contact resistance, comprise following concrete steps:
The first step, the choosing of the preparation of testing apparatus and test sample test point:
Process two samples, sample is vertically coaxially installed between two upper and lower symmetrically arranged refrigeration heating jackets, on two refrigeration heating jackets, be provided with stress loading device, on described sample, be provided with temperature sensor, temperature sensor is connected with data acquisition system (DAS), for the axial temperature of test sample;
Position on sample between test point meets following relation: each sample all arranges n test point between from lower surface to upper surface, and the axial distance between adjacent two test points on each sample equates, the distance between test point is dx;
Second step, loads compressive stress, and forward heats sample:
One end heating axial to two samples, the other end is cooling, and specimen temperature starts collecting test temperature after reaching and stablizing; Described probe temperature comprises the measurement temperature T of n test point on each sample
i, ji=1, n, n is test point number on sample, j=1,2 represent respectively two different samples;
The 3rd step, test point is measured the correction of temperature:
Carrying out under sufficient adiabatic condition, same steady temperature is set in the two ends of sample simultaneously, specimen temperature starts collecting test temperature after reaching and stablizing; Described probe temperature comprises the measurement temperature of n test point on sample
n is test point number on sample;
To the temperature measurement range of the n gathering in a step 2 test point, according to precision, need to carry out the measurement temperature acquisition that above-mentioned many steady temperatures point repeats n test point on sample, and the measurement temperature of each test point on sample and the steady temperature setting are carried out to parameter identification analysis, carry out the synthetic related function of linear fit or multivariate quasi;
The 4th step, the calculating of thermal contact resistance R:
The related function of the 3rd step is solved and obtains a correction temperature the measurement temperature of each test point gathering in step 2
n is test point number on sample;
And then ignoring hot-fluid loss in the situation that, the thermal contact resistance R that calculates sample that can degree of precision.
For the heat flux that calculates of degree of precision, also can be at test sample two ends or one end axially adds same sectional dimension arbitrarily standard thermal flow meter.
Described temperature sensor adopts thermopair, thermal resistance, PT100 or PT25.
Compared with the existing technology, Gu a kind of upper and lower constant temperature parameter identification method of the present invention is surveyed solid-thermal contact resistance, adopt the symmetrical test structure of upper and lower two-way hot-fluid to carry out the error term that upper and lower steady temperature is eliminated thermal loss and temperature sensor substantially, and can guarantee to measure fast thermal contact resistance under higher precision prerequisite.
For the ease of understanding structure content of the present invention in depth and can reaching beneficial effect, below in conjunction with accompanying drawing and concrete enforcement, the present invention is described in further detail.
Accompanying drawing explanation
Gu the structural representation of Fig. 1 to be the present invention a kind of upper and lower constant temperature parameter identification method surveys device of solid-thermal contact resistance.
Fig. 2 is system testing schematic diagram of the present invention;
Fig. 3 tests the schematic diagram of test specimen 1 in the present invention;
Fig. 4 is for adopting temperature deviation after the steady temperature up and down of the inventive method with the graph of a relation of steady temperature.
Fig. 5 is for adopting the correlation parameter of the fitting function after the steady temperature up and down of the inventive method.
Fig. 6 is the graph of a relation of the revised thermal contact resistance of the inventive method and heat flux.
Embodiment
Therefore, for addressing the above problem, Gu the present invention has proposed a kind of method that solid-thermal contact resistance is surveyed in upper and lower thermostat temperature correction on American National Standard ASTM D5470 basis, by test block being carried out to multiple spot constant temperature, adopt temperature sensors of high precision to carry out error term and the thermal loss error of upper and lower each temperature sensor of steady temperature parameter identification cancellation, in conjunction with controllable temperature heat radiation protective shield of radiation, come and ancillary method reduces lateral heat flow loss, reach the object of the thermal physical property parameter of high precision measurement test specimen, this method can high-precision measurement same material and the interface thermal contact resistance of storeroom of the same race not.
In Fig. 1, the invention discloses a kind of proving installation of high precision thermal interfacial material, the symmetrical structure that this device is upper and lower positive and negative two-way heat flux measurement, comprise control system, support 3, the first ball jacket 4-1, the second ball jacket 4-2, sliding screw 5, directed steel ball and pressure transducer 6, auxiliary heater 7, vacuum (-tight) housing 9, test specimen test section 10, stress loading device, vacuum extraction gas port 13, intake-outlet 14, data acquisition system (DAS), sealed chassis 16, back up pad 17, levelling lever 20 and heater strip 21, it is characterized in that: stress loading device is comprised of hydraulic cylinder 11 and pressure power source 12, and hydraulic cylinder 11 is positioned at the top of pressure power source 12, data acquisition system (DAS) is comprised of temperature sensor, sealing data connector 15, and temperature sensor is connected with sealing data connector 15 by wire, control system is comprised of controllable temperature protective shield of radiation 2, heating and cooling cover 1 and control protective shield of radiation heater strip R2, sample testing district 10 comprises test test specimen, wherein directed steel ball and pressure transducer 6, support 3, back up pad 17 and heating and cooling cover are symmetrical Shang Xia 1, directed steel ball and pressure transducer 6 are fixed on back up pad 17 centers, stress loading device also contacts with directed steel ball and pressure transducer 6 by support 3 location, for sample loading stress, it is fixing that the first ball jacket 4-1 is arranged on two ends up and down and the back up pad 17 of sliding screw 5, the second ball jacket 4-2 is arranged on the bottom of sliding screw 5 and fixes with support 3, auxiliary heater 7 is between back up pad 17 and heating and cooling cover 1, sample testing district 10 is between laterally zygomorphic two heating and coolings cover 1, two controllable temperature protective shield of radiations 2 are positioned at the outside in sample testing district 10, vacuum (-tight) housing 9 is positioned at the external stability of whole device in sealed chassis 16, sliding screw 5 is fixed on the top of sealed chassis 16, vacuum extraction gas port 13, intake-outlet 14 and sealing data connector 15 are all arranged in sealed chassis 16, hydraulic cylinder 11 runs through sealed chassis 16 center, in sealed chassis, be provided with four groups of levelling levers 20.
Fig. 2 is test philosophy schematic diagram of the present invention, in carrying out test process, according to the temperature sensor measurement temperature on thermal flow meter and test specimen, by heating arrangement and the approximate thermograde of test specimen on control system regulation and control protective shield of radiation, with this, reduces thermal loss.In the position of the heating jacket that freezes up and down, also the corresponding auxiliary heater that is furnished with regulates and controls the temperature approximate with heating source and reduces thermal loss.
In Fig. 3, in the present invention, be fitted with the front view of the test test specimen 1 of temperature sensor, on this test specimen, being fitted with the upper and lower symmetry in position has 3 groups of temperature sensors of strict demand, and between adjacent sensors, distance is 25mm, and contact interface to the distance of first sensing station is 2mm.Test specimen can be processed into cylindrical or cuboid, and the plug-in opening of temperature sensor has strict positional precision and form accuracy requirement.Before plug-in mounting temperature sensor, processing test specimen is carried out to acetone, isopropyl acetone and Ultrasonic Cleaning.Temperature sensor is equidistant arrangement, and the probe of temperature sensor is by welding or heat-conducting cream bonding plug-in opening.
The invention discloses a kind of upper and lower constant temperature parameter identification method and measure the method for thermal contact resistance between a pair of Cu alloy material test specimen, its testing procedure is as follows:
The first step, the choosing of the preparation of testing apparatus and test sample test point:
As depicted in figs. 1 and 2, can produce two standard materials (the present embodiment adopts 99.999% fine copper) thermal flow meter according to the coefficient of heat conductivity of known materials, process two Cu alloy material test specimens, test specimen is vertically arranged between two upper and lower symmetrically arranged refrigeration heating jackets, on two refrigeration heating jackets, be provided with stress loading device, on described test specimen, be provided with temperature sensor, temperature sensor is connected with data acquisition system (DAS), for testing the axial temperature of test specimen;
Position on test specimen between test point meets following relation: each test specimen all arranges 3 test points between from lower surface to upper surface, axial distance on each test specimen between adjacent two test points equates, distance between test point is dx=25mm, from the position of contact interface to test point, be 2mm, (T.x) of test specimen 1 as shown in Figure 2
7test point is 2mm to the distance of contact interface, and test specimen 2 is 2mm from the position of contact interface to test point equally.And by temperature sensor size equidistant probe mounting hole that processes temperature sensor on standard material thermal flow meter and test specimen, probe mounting hole≤the 0.5mm of described temperature sensor, in probe mounting hole, pass through the temperature sensor probe of welding or heat-conducting cream bonding≤0.5mm, temperature sensor is connected with data acquisition system (DAS) by the connector of chamber walls, and temperature sensor of the present invention adopts thermopair.
Second step, loads compressive stress (the present embodiment is 2.1MPa), and forward heats sample:
As depicted in figs. 1 and 2 by be furnished with 3 groups of temperature sensors test specimen 1 and 2 be vertically installed in upper and lower two ends and be arranged with thermal flow meter, refrigeration heating jacket, in the vacuum chamber of assisted heating device, for less thermal loss adds a controllable temperature protective shield of radiation that is embedded with heating arrangement at heat-insulation layer skin, after vacuumizing, carry out the forward heat flux measurement of heating bottom, top refrigeration, now controllable temperature protective shield of radiation simulates the thermograde of approximate test specimen, the auxiliary heater that top is arranged controls according to the temperature of heating and cooling cover the thermal loss that its temperature reduces Y, while reaching stable state, carry out temperature data acquisition, now loading power can be by the heat flux that converts of the thermal flow meter that is arranged symmetrically with up and down.
For example, when heat flux is 3.5W, record (T.x) on test specimen 1
5=25.053, (T.x)
6=24.658, (T.x)
7=24.257, (T.x) on test specimen 2
9=23.038, (T.x)
10=22.64 and (T.x)
11=22.243.
The 3rd step, test point is measured the correction of temperature:
Carrying out under sufficient adiabatic condition, to (T.x) on the test specimen 1 gathering in step 2
5, (T.x)
6(T.x)
7and (T.x) on test specimen 2
9, (T.x)
10(T.x)
11totally 6 test points to the heating and cooling cover being arranged symmetrically with up and down the stable state image data of carrying out 7 steady temperature points from 22 ~ 28 ℃.As shown in Figure 4, set steady temperature the record (T.x) of heating and cooling cover
5, (T.x)
6, (T.x)
7, (T.x)
9, (T.x)
10(T.x)
11the measurement temperature of test point
with
deviation with this steady temperature.Present case is by carrying out y=A0 * x
3+ A1 * x
2the equation with many unknowns function of+A2 * x+A3 carries out data fitting to this temperature deviation and steady temperature, and parameter A 0, A1, A2 and the A3 of matching are as shown in Figure 5.
The 4th step, the calculating of thermal contact resistance R:
As shown in Figure 6, for example, when heat flux is 3.5W, (T.x)
5=25.053, (T.x)
6=24.658, (T.x)
7=24.257 and (T.x)
9=23.038, (T.x)
10=22.64 and (T.x)
11in the matching related function of totally 6 test points of=22.243 temperature value substitution the 3rd step, obtain temperature deviation value, thereby obtain
When adding forward heat flux measurement, when heat flux is 3.5W, revised according to (T.x) on test specimen 1
5, (T.x)
6(T.x)
7with the revised temperature gradient relation of 3 test point positions, and (T.x) on test specimen 2
9, (T.x)
10(T.x)
11with the revised temperature gradient relation of 3 test point positions, by the extrapolate extrapolation interface temperature of the test specimen 1 that obtains of numerical method, be
the extrapolation interface temperature of test specimen 2 is
The interface temperature difference of two test specimens is:
Then thermal contact resistance
for:
Wherein Q is heat flux.
As shown in Figure 6, in heat flux, during at 3.5W, upper heating is by the temperature (T.x) that does not have on test specimen 1 and test specimen 2 to revise
5=25.053, (T.x)
6=24.658, (T.x)
7=24.257, (T.x)
9=23.038, (T.x)
10=22.64 and (T.x)
11=22.243 thermal contact resistance values that calculate are 0.33K/W, and adopt revised temperature
With
The thermal contact resistance value calculating is 0.311K/W.In like manner, the thermal contact resistance that the upper and lower different direction of heat flow of employing shown in Fig. 6 are calculated is worth measured temperature value to be revised, and obtains the different direction of heat flow up and down shown in Fig. 6 the thermal contact resistance value calculating and the relation that adopts the same loading of the thermal contact resistance value hot-fluid obtaining after the correction of this method temperature.
The above is the detailed description of preferred embodiment of the present invention and schemes attached; not be used for limiting the present invention; all scopes of the present invention should be as the criterion with patent right book scope required for protection; the embodiment of design philosophy all and of the present invention and similar variation thereof, approximate construction, all should be contained among scope of patent protection of the present invention.
Claims (3)
1. Gu upper and lower constant temperature parameter identification method is surveyed solid-thermal contact resistance, it is characterized in that described method comprises following concrete steps:
The first step, the choosing of the preparation of testing apparatus and test sample test point:
Process two samples, sample is vertically coaxially installed between two upper and lower symmetrically arranged refrigeration heating jackets, on two refrigeration heating jackets, be provided with stress loading device, on described sample, be provided with temperature sensor, temperature sensor is connected with data acquisition system (DAS), for the axial temperature of test sample;
Position on sample between test point meets following relation: each sample all arranges n test point between from lower surface to upper surface, and the axial distance between adjacent two test points on each sample equates, the distance between test point is dx;
Second step, loads compressive stress, and forward heats sample:
One end heating axial to two samples, the other end is cooling, and specimen temperature starts collecting test temperature after reaching and stablizing; Described probe temperature comprises the measurement temperature T of n test point on each sample
i,j, i=1 ... n, n is test point number on sample, j=1,2 represent respectively two different samples;
The 3rd step, test point is measured the correction of temperature:
Carrying out under sufficient adiabatic condition, same steady temperature is set in the two ends of sample simultaneously, specimen temperature starts collecting test temperature after reaching and stablizing; Described probe temperature comprises the measurement temperature of n test point on sample
n is test point number on sample;
To the temperature measurement range of the n gathering in a step 2 test point, according to precision, need to carry out the measurement temperature acquisition that above-mentioned many steady temperatures point repeats n test point on sample, and the measurement temperature of each test point on sample and the steady temperature setting are carried out to parameter identification analysis, carry out the synthetic related function of linear fit or multivariate quasi;
The 4th step, the calculating of thermal contact resistance R:
The related function of the 3rd step is solved and obtains a correction temperature the measurement temperature of each test point gathering in step 2
n is test point number on sample;
And then ignoring hot-fluid loss in the situation that, the thermal contact resistance R that calculates sample that can degree of precision.
Upper and lower constant temperature parameter identification method solid 2. according to claim 1 is surveyed solid-thermal contact resistance, it is characterized in that at test sample two ends or any one end axially adds the standard thermal flow meter of same sectional dimension.
3., Gu upper and lower constant temperature parameter identification method according to claim 1 is surveyed solid-thermal contact resistance, it is characterized in that described temperature sensor adopts occasionally thermal resistance of thermoelectricity.
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| CN103792254B (en) * | 2014-01-17 | 2016-06-29 | 中国空间技术研究院 | High precision temperature control pilot system for thermo-resistance measurement |
| CN105628503A (en) * | 2014-11-05 | 2016-06-01 | 桂林电子科技大学 | Sustained and stable high-precision vacuum pressure loading device |
| CN109959676B (en) * | 2017-12-14 | 2021-11-16 | 核工业西南物理研究院 | Method for testing thermal contact resistance of graphite and graphite film material |
| CN109839406B (en) * | 2019-03-27 | 2022-08-09 | 桂林电子科技大学 | High-precision testing method for interface contact thermal resistance |
| CN109813753B (en) * | 2019-03-28 | 2022-08-05 | 桂林电子科技大学 | High-precision method for measuring interface contact thermal resistance by bidirectional heat flow method |
| CN110108743B (en) * | 2019-05-08 | 2022-06-03 | 河北省农林科学院旱作农业研究所 | Method for rapidly identifying heat resistance of winter wheat |
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