CN102778475A - Method for measuring solid-solid thermal contact resistance via up-and-down constant temperature parameter identification method - Google Patents

Method for measuring solid-solid thermal contact resistance via up-and-down constant temperature parameter identification method Download PDF

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CN102778475A
CN102778475A CN2012102793278A CN201210279327A CN102778475A CN 102778475 A CN102778475 A CN 102778475A CN 2012102793278 A CN2012102793278 A CN 2012102793278A CN 201210279327 A CN201210279327 A CN 201210279327A CN 102778475 A CN102778475 A CN 102778475A
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temperature
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test point
parameter identification
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CN102778475B (en
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宣益民
张平
李强
徐德好
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Nanjing University of Science and Technology
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Abstract

The invention discloses a method for correcting and measuring a solid-solid thermal contact resistance via up-and-down constant temperature based on an American national standard ASTMD 5470. A high precision temperature sensor is adopted to perform up-and-down constant temperature parameter identification for a test-ware via a multi-point constant temperature so as to eliminate the error terms and the hot loss errors of the temperature sensors, and is combined with a controllable warm radiation radiation-proof screen and the auxiliary measures, so that an aim of high-precisely testing the thermophysical parameters of the test-ware is achieved. According to the method, the interface thermal contact resistances between same materials and different materials can be measured with high precise.

Description

A kind of constant temperature parameter identification method is up and down surveyed solid-affixed thermal resistance of touching
Technical field
The invention belongs to technical field of measurement and test, be specifically related to a kind of solid-the affixed thermo-resistance measurement method of touching, particularly a kind of up and down constant temperature parameter identification method is surveyed solid-affixed thermal resistance of touching.
Background technology
Thermal contact resistance is a parameter that receives numerous factor affecting such as material property, mechanical property, surface topography, contact pressure, temperature, clearance material.Whether stable according to the experiment hot-fluid, generally be divided into transient state method and steady state method to the thermal contact resistance measuring method.The transient state method also is a kind of thermal contact resistance experimental measurement method commonly used; It mainly comprises photothermal laser mensuration, thermal imaging method, " flash " flicker method, laser optoacoustic method etc.; Wherein the photothermal laser mensuration comprises modulation photo-thermal method and heat scan method again, and modulation photo-thermal method has the branch of photo-thermal amplitude method, photo-thermal phase method and impulse method again.Though though various transient state method is suitable for quick measurement and can measures little film to nanometer scale, its measuring process is subject to the various factors influence, and derivation of equation relative complex, measuring accuracy also cannot say for sure to demonstrate,prove.Therefore, what interface thermal contact resistance measuring method was the most frequently used is steady state method: keep certain temperature difference in two contacts on the samples, measure the temperature value of two samples on axially, obtain the temperature difference on the interface thereby be extrapolated to the contact interface place by Fourier law again; Heat flux can be measured or calculated by the thermal conductivity and the thermograde of specimen material by thermal flow meter, thus R=|T1-T2|/Q.It is similar with the testing standard equipment of American National Standard ASTMD5470-06 mostly stable state thermal contact resistance method of testing is, but have document to point out because thermometric uncertain sum of errors thermal loss error is difficult to guarantee that the interface thermal contact resistance is had sufficiently high measuring accuracy more.
Summary of the invention
The objective of the invention is to put forward a kind of constant temperature parameter identification method up and down and survey solid-affixed thermal resistance of touching.
The technical solution that realizes the object of the invention is: a kind of constant temperature parameter identification method is up and down surveyed solid-affixed thermal resistance of touching, and comprises following concrete steps:
The first step, the choosing of the preparation of testing apparatus and test sample test point:
Process two samples; Be installed in two up and down between the symmetrically arranged refrigeration heating jacket with sample is vertically coaxial; Two refrigeration heating jackets are provided with answers force loading device; Described sample is provided with temperature sensor, and temperature sensor is connected with data acquisition system (DAS), is used for the axial temperature of test sample;
Following relation is satisfied in position on the sample between the test point: each sample all is provided with n test point between from the lower surface to the upper surface, and the axial distance between adjacent two test points on each sample is equal, and the distance between the test point is dx;
Second step loaded compressive stress, and forward heats sample:
The end heating axial to two samples, other end cooling, specimen temperature begins the collecting test temperature after reaching and stablizing; Described probe temperature comprises the measurement temperature T of n test point on each sample I, jI=1, n, n are test point number on the sample, j=1, and 2 represent two different samples respectively;
In the 3rd step, test point is measured the correction of temperature:
Carrying out under the sufficient adiabatic condition, same steady temperature is set at the two ends of sample simultaneously, specimen temperature begins the collecting test temperature after reaching and stablizing; Described probe temperature comprises that measurement temperature n of n test point on the sample is a test point number on the sample;
Temperature measurement range to n the test point of being gathered in the step 2 need be carried out the measurement temperature acquisition that above-mentioned many steady temperatures point repeats n test point on the sample based on precision; And the measurement temperature of each test point on the sample and the steady temperature that sets carried out the parameter identification analysis, carry out the synthetic correlation function of linear fit or multivariate quasi;
The 4th step, the calculating of thermal contact resistance R:
Find the solution the related function in the 3rd step to the measurement temperature of each test point of gathering in the step 2 and to obtain one to revise temperature
Figure BDA00001983696700022
n be test point number on the sample;
And then under the situation of ignoring the hot-fluid loss, but the thermal contact resistance R that calculates sample of degree of precision.
Be the heat flux that calculates of degree of precision, also can be at the test sample two ends or any end axially add the standard thermal flow meter of same sectional dimension.
Described temperature sensor adopts thermopair, thermal resistance, PT100 or PT25.
Compare with prior art; That a kind of up and down constant temperature parameter identification method of the present invention is surveyed is solid-and the affixed thermal resistance of touching adopts up and down the symmetrical test structure of two-way hot-fluid to carry out up and down steady temperature to eliminate the error term of thermal loss and temperature sensor basically, and can under the higher precision prerequisite of assurance, can measure thermal contact resistance fast.
For the ease of understanding structure content of the present invention in depth and can reaching beneficial effect, the present invention is done further explain below in conjunction with accompanying drawing and practical implementation.
Description of drawings
Fig. 1 surveys solid-affixed structural representation that touches the device of thermal resistance for a kind of constant temperature parameter identification method up and down of the present invention.
Fig. 2 is a system testing schematic diagram of the present invention;
Fig. 3 is the synoptic diagram of test test specimen 1 among the present invention;
The temperature deviation of Fig. 4 after for the steady temperature up and down that adopts the inventive method is with the graph of a relation of steady temperature.
The correlation parameter of the fitting function of Fig. 5 after for the steady temperature up and down that adopts the inventive method.
Fig. 6 is the graph of a relation of revised thermal contact resistance of the inventive method and heat flux.
Embodiment
Therefore; For addressing the above problem; The present invention has proposed a kind of thermostat temperature correction up and down and has surveyed solid-affixed method of touching thermal resistance on American National Standard ASTM D5470 basis; Adopt temperature sensors of high precision to carry out the error term and the thermal loss error of each temperature sensor of steady temperature parameter identification cancellation up and down through test block being carried out multiple spot constant temperature; Come and ancillary method reduces lateral heat flow loss in conjunction with controllable temperature heat radiation protective shield of radiation, reach the purpose of the thermal physical property parameter of high precision measurement test specimen, this method can high-precision measurement same material and the interface thermal contact resistance of storeroom of the same race not.
In Fig. 1; The invention discloses a kind of proving installation of high precision thermal interfacial material; This device is the symmetrical structure of positive and negative up and down two-way hot-fluid test; Comprise control system, support 3, the first ball jacket 4-1, the second ball jacket 4-2, sliding screw 5, directed steel ball and pressure transducer 6, auxiliary heater 7, vacuum (-tight) housing 9, test specimen test section 10, answer force loading device, vacuum extraction gas port 13, intake-outlet 14, data acquisition system (DAS), sealed chassis 16; Back up pad 17, levelling lever 20 and heater strip 21; It is characterized in that: answer force loading device to be made up of hydraulic cylinder 11 and pressure power source 12, hydraulic cylinder 11 is positioned at the top of pressure power source 12; Data acquisition system (DAS) is made up of temperature sensor, sealing data connector 15, and temperature sensor links to each other with sealing data connector 15 through lead; Control system is made up of controllable temperature protective shield of radiation 2, heating and cooling cover 1 and control protective shield of radiation heater strip R2; Sample testing district 10 comprises the test test specimen; Wherein directed steel ball and pressure transducer 6, support 3, back up pad 17 and heating and cooling cover symmetry about in the of 1; Directed steel ball and pressure transducer 6 are fixed on back up pad 17 centers, answer force loading device to pass through support 3 location and also contact with directed steel ball and pressure transducer 6, are the sample loading stress; It is fixing that the first ball jacket 4-1 is arranged on the two ends up and down and the back up pad 17 of sliding screw 5; The second ball jacket 4-2 is arranged on the bottom of sliding screw 5 and fixes with support 3, and auxiliary heater 7 is between back up pad 17 and heating and cooling cover 1, and sample testing district 10 is between laterally zygomorphic two heating and coolings cover 1; Two controllable temperature protective shield of radiations 2 are positioned at the outside in sample testing district 10; Vacuum (-tight) housing 9 is positioned at the external stability of whole device on sealed chassis 16, and sliding screw 5 is fixed in the top of sealed chassis 16, and vacuum extraction gas port 13, intake-outlet 14 and sealing data connector 15 all are arranged on the sealed chassis 16; Hydraulic cylinder 11 runs through the center of sealed chassis 16, and sealed chassis is provided with four groups of levelling levers 20.
Fig. 2 is a test philosophy synoptic diagram of the present invention, in carrying out test process, reduces thermal loss by heating arrangement on the control system regulation and control protective shield of radiation and the approximate thermograde of test specimen with this according to the temperature sensor measurement temperature on thermal flow meter and the test specimen.The also corresponding auxiliary heater that is furnished with is regulated and control with the approximate temperature of heating source to reduce thermal loss in the position of the heating jacket that freezes up and down.
In Fig. 3; Be fitted with the front view of the test test specimen 1 of temperature sensor among the present invention; On this test specimen, be fitted with the position up and down symmetry 3 groups of temperature sensors of strict demand are arranged, distance is 25mm between the neighboring sensors, the distance of contact interface to first sensing station is 2mm.Test specimen can be processed into cylindrical or cuboid, and the plug-in opening of temperature sensor has strict positional precision and form accuracy requirement.Before the plug-in mounting temperature sensor, the processing test specimen is carried out acetone, isopropyl acetone and ultrasonic cleaning.Temperature sensor is that equidistance is arranged, and the probe of temperature sensor is through in welding or the heat-conducting cream bonding plug-in opening.
The invention discloses a kind of constant temperature parameter identification method up and down and measure the method for thermal contact resistance between a pair of Cu alloy material test specimen, its testing procedure is following:
The first step, the choosing of the preparation of testing apparatus and test sample test point:
As depicted in figs. 1 and 2; Can produce two standard materials (present embodiment adopts 99.999% fine copper) thermal flow meter according to the coefficient of heat conductivity of known materials, process two Cu alloy material test specimens, test specimen vertically is installed in two up and down between the symmetrically arranged refrigeration heating jacket; Two refrigeration heating jackets are provided with answers force loading device; Described test specimen is provided with temperature sensor, and temperature sensor is connected with data acquisition system (DAS), is used to test the axial temperature of test specimen;
Following relation is satisfied in position on the test specimen between the test point: each test specimen all is provided with 3 test points between from the lower surface to the upper surface; Axial distance on each test specimen between adjacent two test points equates; Distance between the test point is dx=25mm; From the position of contact interface to a test point is 2mm, (T.x) of test specimen 1 as shown in Figure 2 7Test point is 2mm to the distance of contact interface, and test specimen 2 is 2mm from the position of contact interface to a test point equally.And by the probe mounting hole that processes temperature sensor of temperature sensor size equidistance on standard material thermal flow meter and test specimen; Probe mounting hole≤the 0.5mm of described temperature sensor; Pass through the temperature sensor probe of welding or heat-conducting cream bonding≤0.5mm in the probe mounting hole; Temperature sensor is connected with data acquisition system (DAS) through the connector of chamber walls, and temperature sensor of the present invention adopts thermopair.
Second step loaded compressive stress (present embodiment is 2.1MPa), and forward heats sample:
To be furnished with shown in as depicted in figs. 1 and 23 groups of temperature sensors test specimen 1 and 2 be installed in vertically up and down that two ends are arranged with in the vacuum chamber of thermal flow meter, refrigeration heating jacket, assisted heating device; For less thermal loss the heat-insulation layer skin add one be embedded with heating arrangement the controllable temperature protective shield of radiation; After vacuumizing, carry out the forward hot-fluid test of heating bottom, top refrigeration; This moment, the controllable temperature protective shield of radiation simulated the thermograde of approximate test specimen; The auxiliary heater that the top is arranged reduces the thermal loss of Y according to its temperature of temperature control of heating and cooling cover; Carry out temperature data acquisition when reaching stable state, loading power this moment can be through the heat flux that converts of the thermal flow meter of symmetric arrangement up and down.
For example when heat flux is 3.5W, record (T.x) on the test specimen 1 5=25.053, (T.x) 6=24.658, (T.x) 7=24.257, (T.x) on the test specimen 2 9=23.038, (T.x) 10=22.64 with (T.x) 11=22.243.
In the 3rd step, test point is measured the correction of temperature:
Carrying out under the sufficient adiabatic condition, to (T.x) on the test specimen of being gathered in the step 21 5, (T.x) 6(T.x) 7And (T.x) on the test specimen 2 9, (T.x) 10(T.x) 11Totally 6 test points are to the heating and cooling cover of the symmetric arrangement up and down stable state image data of carrying out 7 steady temperature points from 22 ~ 28 ℃.As shown in Figure 4, set the steady temperature of heating and cooling cover and write down (T.x) 5, (T.x) 6, (T.x) 7, (T.x) 9, (T.x) 10(T.x) 11The measurement temperature of test point
Figure BDA00001983696700051
With Deviation with this steady temperature.Present case is by carrying out y=A0 * x 3+ A1 * x 2The equation with many unknowns function of+A2 * x+A3 carries out data fitting to this temperature deviation and steady temperature, and parameter A 0, A1, A2 and the A3 of match are as shown in Figure 5.
The 4th step, the calculating of thermal contact resistance R:
As shown in Figure 6, for example when heat flux is 3.5W, (T.x) 5=25.053, (T.x) 6=24.658, (T.x) 7=24.257 and (T.x) 9=23.038, (T.x) 10=22.64 with (T.x) 11Obtain the temperature deviation value in the match related function of totally 6 test points in=22.243 the 3rd step of temperature value substitution, thereby obtain ( T ~ . x ) 5 = 25.039 , ( T ~ . x ) 6 = 24.625 , ( T ~ . x ) 7 = 24.198 , ( T ~ . x ) 9 = 23.061 , ( T ~ . x ) 10 = 22.642 , ( T ~ . x ) 11 = 22.241 .
Adding forward hot-fluid when test, when heat flux is 3.5W, revised according to (T.x) on the test specimen 1 5, (T.x) 6(T.x) 7With the revised temperature gradient relation of 3 test point positions, and (T.x) on the test specimen 2 9, (T.x) 10(T.x) 11With the revised temperature gradient relation of 3 test point positions, the extrapolation interface temperature of the test specimen 1 that obtains through numerical method extrapolation does
Figure BDA00001983696700061
The extrapolation interface temperature of test specimen 2 does
Figure BDA00001983696700062
The interface temperature difference of two test specimens is: Δ T ~ s = T ~ s - 1 - T ~ s - 2 = 1.089
Then thermal contact resistance
Figure BDA00001983696700064
For: R ~ = Δ T ~ s Q = 0.311 K / W .
Wherein Q is a heat flux.
As shown in Figure 6, in heat flux during at 3.5W, last heating is by the temperature (T.x) that not have correction on test specimen 1 and the test specimen 2 5=25.053, (T.x) 6=24.658, (T.x) 7=24.257, (T.x) 9=23.038, (T.x) 10=22.64 with (T.x) 11=22.243 contact thermal resistances that calculate are 0.33K/W, and adopt revised temperature ( T ~ . x ) 5 = 25.03866 , ( T ~ . x ) 6 = 24.6249 , ( T ~ . x ) 7 = 24.19786 , ( T ~ . x ) 9 = 23.061 , ( T ~ . x ) 10 = 22.642 With ( T ~ . x ) 11 = 22.241 The contact thermal resistance that calculates is 0.311K/W.In like manner; To employing shown in Figure 6 up and down the measured temperature value of contact thermal resistance that calculates of different direction of heat flow revise, promptly obtain contact thermal resistance that different up and down direction of heat flow shown in Figure 6 calculate and adopt the contact thermal resistance that obtains after the correction of this method temperature with the relation that loads hot-fluid.
The above attaches for the detailed description of preferred embodiment of the present invention and figure; Be not to be used for limiting the present invention; All scopes of the present invention should be as the criterion with patent right book scope required for protection; The embodiment of all and of the present invention design philosophys and similar variation thereof, approximate construction all should be contained among the scope of patent protection of the present invention.

Claims (3)

1. constant temperature parameter identification method is surveyed solid-affixed thermal resistance of touching about in the of one kind, it is characterized in that said method comprises following concrete steps:
The first step, the choosing of the preparation of testing apparatus and test sample test point:
Process two samples; Be installed in two up and down between the symmetrically arranged refrigeration heating jacket with sample is vertically coaxial; Two refrigeration heating jackets are provided with answers force loading device; Described sample is provided with temperature sensor, and temperature sensor is connected with data acquisition system (DAS), is used for the axial temperature of test sample;
Following relation is satisfied in position on the sample between the test point: each sample all is provided with n test point between from the lower surface to the upper surface, and the axial distance between adjacent two test points on each sample is equal, and the distance between the test point is dx;
Second step loaded compressive stress, and forward heats sample:
The end heating axial to two samples, other end cooling, specimen temperature begins the collecting test temperature after reaching and stablizing; Described probe temperature comprises the measurement temperature T of n test point on each sample I, jI=1, n, n are test point number on the sample, j=1, and 2 represent two different samples respectively;
In the 3rd step, test point is measured the correction of temperature:
Carrying out under the sufficient adiabatic condition, same steady temperature is set at the two ends of sample simultaneously, specimen temperature begins the collecting test temperature after reaching and stablizing; Described probe temperature comprises that measurement temperature
Figure FDA00001983696600011
n of n test point on the sample is a test point number on the sample;
Temperature measurement range to n the test point of being gathered in the step 2 need be carried out the measurement temperature acquisition that above-mentioned many steady temperatures point repeats n test point on the sample based on precision; And the measurement temperature of each test point on the sample and the steady temperature that sets carried out the parameter identification analysis, carry out the synthetic correlation function of linear fit or multivariate quasi;
The 4th step, the calculating of thermal contact resistance R:
Find the solution the related function in the 3rd step to the measurement temperature of each test point of gathering in the step 2 and to obtain one to revise temperature
Figure FDA00001983696600012
n be test point number on the sample;
And then under the situation of ignoring the hot-fluid loss, but the thermal contact resistance R that calculates sample of degree of precision.
2. up and down constant temperature parameter identification method according to claim 1 is surveyed solid-affixed thermal resistance of touching, and it is characterized in that at the test sample two ends or any end axially adds the standard thermal flow meter of same sectional dimension.
3. constant temperature parameter identification method up and down according to claim 1 is surveyed solid-affixed thermal resistance of touching, and it is characterized in that described temperature sensor adopts thermopair, thermal resistance, PT100 or PT25.
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CN103792254A (en) * 2014-01-17 2014-05-14 中国空间技术研究院 High-precision temperature control testing system for thermal resistance testing
CN103792254B (en) * 2014-01-17 2016-06-29 中国空间技术研究院 High precision temperature control pilot system for thermo-resistance measurement
CN105628503A (en) * 2014-11-05 2016-06-01 桂林电子科技大学 Sustained and stable high-precision vacuum pressure loading device
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CN109959676B (en) * 2017-12-14 2021-11-16 核工业西南物理研究院 Method for testing thermal contact resistance of graphite and graphite film material
CN109839406A (en) * 2019-03-27 2019-06-04 桂林电子科技大学 A kind of high precision measurement method of interface contact heat resistance
CN109813753A (en) * 2019-03-28 2019-05-28 桂林电子科技大学 The accuracy method of two-way heat flow method measurement interface contact heat resistance
CN109813753B (en) * 2019-03-28 2022-08-05 桂林电子科技大学 High-precision method for measuring interface contact thermal resistance by bidirectional heat flow method
CN110108743A (en) * 2019-05-08 2019-08-09 河北省农林科学院旱作农业研究所 A kind of method of winter wheat heat resistance Rapid identification
CN110108743B (en) * 2019-05-08 2022-06-03 河北省农林科学院旱作农业研究所 Method for rapidly identifying heat resistance of winter wheat

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