CN102744674A - Chemical-mechanical polishing device - Google Patents
Chemical-mechanical polishing device Download PDFInfo
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- CN102744674A CN102744674A CN2012102607556A CN201210260755A CN102744674A CN 102744674 A CN102744674 A CN 102744674A CN 2012102607556 A CN2012102607556 A CN 2012102607556A CN 201210260755 A CN201210260755 A CN 201210260755A CN 102744674 A CN102744674 A CN 102744674A
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- mechanical arm
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Abstract
The invention discloses a chemical-mechanical polishing device, which comprises a reverse sensor mounting hole arranged on a mechanical arm retaining part, a mechanical arm sensor arranged in the reverse sensor mounting hole and a detecting object arranged on the mechanical arm part. As the mechanical arm part rotates relative to the mechanical arm retaining part, when a fan-shaped opening part formed by the detecting object arranged on the mechanical arm part corresponds to the mechanical arm sensor on the position of the reverse sensor mounting hole, the mechanical arm sensor at the mounting hole senses the mechanical arm, and a reset notice signal is sent by the mechanical arm sensor; and in addition, chemical polishing is carried out on a wafer to be processed after the reset notice signal is received from the mechanical arm sensor by a processing unit, so that a defect in the prior table design is solved by the improved design; when the sensor fails, the table cannot stop polishing if the mechanical arm is out of position; and only the sensor works normally, and the mechanical arm is at the right position, the table can start to polish.
Description
Technical field
The present invention relates to field of semiconductor manufacture, more particularly, the present invention relates to a kind of chemical-mechanical grinding device.
Background technology
The metallization processes that has an even surface that cmp (CMP, chemical mechanical polishing is also referred to as chemically mechanical polishing) is widely used in the semiconductor fabrication is at present handled.The process of cmp is to be placed on wafer on the grinding pad of rotation, adds certain pressure again, grinds wafer so that wafer planarizationization with chemical grinding liquid.In the process that chemical-mechanical grinding device grinds silicon chip; Grinding agent (polishing fluid) flows on grinding pad through pipeline; In process of lapping, play lubrication, and grinding agent also can play suitable chemical reaction with the silicon chip that is ground, raising grinding removal speed.
Chemical-mechanical grinding device such as the Mirra Mesa that company of Applied Materials produces transmits mechanical arm through grinding agent and transmits grinding agent.In order to prevent after having used grinding agent transmission mechanical arm, to forget that making grinding agent transmit mechanical arm resets, having designed closely, switch detects the physical location that grinding agent transmits mechanical arm.
Fig. 1 schematically shows the sketch map that grinding agent transmits mechanical arm.This grinding agent transmits mechanical arm and comprises: rotatable mechanical arm part 1, non-rotatable mechanical arm retaining part 2, be arranged in the sensor installing hole 3 on the mechanical arm retaining part 2 and be arranged in the mechanical arm sensor (not shown) in the sensor installing hole 3.Wherein, sensor installing hole 3 is corresponding to the reset position of mechanical arm part 1.
The mechanical arm sensor for example is a switch closely, a kind of passive element.Wherein, the mechanical arm sensor is used for sending corresponding signal when mechanical arm part 1 does not reset sensing before handling beginning to learn mechanical lapping.For example, sensing mechanical arm part 1 when having resetted, the mechanical arm sensor sends signal " 0 "; Otherwise, sensing mechanical arm part 1 when not resetting, the mechanical arm sensor sends signal " 1 ".
Sketch map when specifically, Fig. 2 schematically shows grinding agent shown in Figure 1 and transmits mechanical arm and do not reset.As shown in Figure 2; Because rotatable mechanical arm part 1 is with respect to the rotation of non-rotatable mechanical arm retaining part 2; The detected object that on mechanical arm part 1, is provided with is (represented like the black semicircle; Detected object covers the hemicycle of mechanical arm retaining part 2) when not reaching the sensor installing hole 3 corresponding to the reset position of mechanical arm part 1, mechanical arm sensor 4 sensings at sensor installing hole 3 places are less than mechanical arm part 1, thus judge that mechanical arm part 1 does not reset.
Sketch map when Fig. 3 schematically shows grinding agent shown in Figure 1 and transmits mechanical arm and reset.As shown in Figure 2; Because rotatable mechanical arm part 1 is with respect to the rotation of non-rotatable mechanical arm retaining part 2; The detected object that on mechanical arm part 1, is provided with is (represented like the black semicircle; Detected object covers the hemicycle of mechanical arm retaining part 2) when reaching the sensor installing hole 3 corresponding to the reset position of mechanical arm part 1, the mechanical arm sensor 4 at sensor installing hole 3 places senses mechanical arm part 1, thereby judges that mechanical arm part 1 has resetted.
But, break down if connect the cable of mechanical arm sensor, so will be not can be " 0 " from the mechanical arm sensor signal that the pager you receives that gives a warning, board thinks that mechanical arm resets.So, at this moment, do not reset even sense mechanical arm part 1, also can't correctly send caution signal; Chemical-mechanical grinding device can not stop to handle thus.Like this, because mechanical arm part 1 do not reset, thereby can not transmit grinding agent, chemical machinery will carry out under the situation of grinding agent not having thus, thereby damages wafer.
Therefore, be desirable to provide the solution whether a kind of mechanical arm of sensing effectively part resets.
Summary of the invention
Technical problem to be solved by this invention is to have above-mentioned defective in the prior art; Do not changing original sensor logic; Realize logic inversion through the physical location adjustment, the chemical-mechanical grinding device that provides a kind of mechanical arm of sensing effectively part whether to reset.
According to the present invention; A kind of chemical-mechanical grinding device is provided, and it comprises: rotatable mechanical arm part, non-rotatable mechanical arm retaining part, be arranged in reverse sensor installing hole on the mechanical arm retaining part, be arranged in mechanical arm sensor in the reverse sensor installing hole, be arranged in detected object and processing unit on the mechanical arm part; Wherein, reverse sensor installing hole is with relative corresponding to the reset position of mechanical arm part; Wherein, The mechanical arm sensor is used for sending the notification signal that resets that the expression mechanical arm partly resets when mechanical arm partly resets sensing before handling beginning to learn mechanical lapping; And the mechanical arm sensor does not send any signal sensing when mechanical arm part does not reset; Wherein, the fan-shaped part that surpasses 180 degree in the covered cross section of said detected object; And; On the one hand; Because rotatable mechanical arm part is with respect to the rotation of non-rotatable mechanical arm retaining part; The formed fan-shaped opening portion of the detected object that partly go up to be provided with when mechanical arm is not during corresponding to the mechanical arm sensor at reverse sensor position of mounting hole place, and the mechanical arm sensor sensing at sensor installing hole place is less than the mechanical arm part, and the mechanical arm sensor does not send any signal thus; On the other hand; Because rotatable mechanical arm part is with respect to the rotation of non-rotatable mechanical arm retaining part; The formed fan-shaped opening portion of the detected object that partly go up to be provided with when mechanical arm is during corresponding to the mechanical arm sensor at reverse sensor position of mounting hole place; The mechanical arm sensor at sensor installing hole place senses the mechanical arm part, thereby the mechanical arm sensor sends the notification signal that resets; And the processing unit of chemical grinding equipment is handled at the chemical grinding that after mechanical arm sensor receives the notification signal that resets, just starts pending wafer.
Preferably, the cross section of said mechanical arm retaining part is not by the size of the size of the arch section of said detected object covering corresponding to the mechanical arm sensor in the reverse sensor installing hole.
Preferably, said detected object covered the mechanical arm retaining part the cross section 340 the degree to 355 the degree fan-shaped part.
Preferably, said detected object 6 covered mechanical arm retaining part 2 the cross section 350 the degree fan-shaped part.
Preferably, said mechanical arm sensor is a switch closely.
Preferably, the said notification signal that resets is signal " 1 "
According to the embodiment of the invention; Because the mechanical arm sensor does not send any signal sensing when mechanical arm part does not reset; And only sense mechanical arm when partly resetting and have only working sensor just often just can send the notification signal that resets this moment at the mechanical arm sensor, thereby chemical grinding equipment could start the chemical grinding processing to pending wafer.Thus, only do not have fault at the cable that connects mechanical arm sensor, thereby and the mechanical arm part resetted in the time of can grinding agent being provided, just can start the chemical grinding of pending wafer is handled.In other words, this improvement design has solved a defective of original board design: when sensor failure, board can not stop to grind yet if mechanical arm is not in the position.Board just can begin milled processed when having only when working sensor normal and mechanical arm correct position.
So, thereby can not occur because chemical machinery will be in the problem that does not have to carry out under the situation of grinding agent damaging wafer according to chemical grinding equipment of the present invention.Thereby, the chemical grinding equipment whether the present invention provides a kind of mechanical arm of sensing effectively part to reset.
Description of drawings
In conjunction with accompanying drawing, and, will more easily more complete understanding be arranged and more easily understand its attendant advantages and characteristic the present invention through with reference to following detailed, wherein:
Fig. 1 schematically shows the sketch map that grinding agent transmits mechanical arm.
Sketch map when Fig. 2 schematically shows grinding agent shown in Figure 1 and transmits mechanical arm and do not reset.
Sketch map when Fig. 3 schematically shows grinding agent shown in Figure 1 and transmits mechanical arm and reset.
Sketch map when Fig. 4 schematically shows and transmits mechanical arm and do not reset according to the grinding agent of the embodiment of the invention.
Sketch map when Fig. 5 schematically shows and transmits mechanical arm and reset according to the grinding agent of the embodiment of the invention.
Need to prove that accompanying drawing is used to explain the present invention, and unrestricted the present invention.Notice that the accompanying drawing of expression structure possibly not be to draw in proportion.And in the accompanying drawing, identical or similar elements indicates identical or similar label.
The specific embodiment
In order to make content of the present invention clear more and understandable, content of the present invention is described in detail below in conjunction with specific embodiment and accompanying drawing.
Chemical-mechanical grinding device according to the embodiment of the invention comprises: rotatable mechanical arm part 1, non-rotatable mechanical arm retaining part 2, be arranged in the reverse sensor installing hole on the mechanical arm retaining part 2 and be arranged in the mechanical arm sensor 4 in the reverse sensor installing hole.
Wherein, reverse sensor installing hole is with relative corresponding to the reset position of mechanical arm part 1.
Wherein, Mechanical arm sensor 4 is used for sending the notification signal that resets that expression mechanical arm part 1 resets when mechanical arm part 1 resets sensing before handling beginning to learn mechanical lapping; The notification signal that for example resets is signal " 1 ", and certainly, the notification signal that resets also can be a signal " 0 ".And different with prior art is, mechanical arm sensor 4 does not send any signal sensing when mechanical arm part 1 does not reset.
Chemical-mechanical grinding device according to the embodiment of the invention also comprises the detected object 6 that is arranged on the mechanical arm part.
And; Like Fig. 4 and Fig. 5, the detected object that is provided with on the mechanical arm part 1, different with prior art is; Said detected object 6 is the hemicycle part of 180 of the cross section of mulch-laying machine tool arm retaining part 2 degree only not only, but the fan-shaped part that surpasses 180 degree in covered cross section.
For example, preferably, said detected object 6 covered mechanical arm retaining part 2 the cross section 340 the degree to 355 the degree fan-shaped part.More preferably, said detected object 6 covered mechanical arm retaining part 2 the cross section 350 the degree fan-shaped part.
In addition, preferably, in concrete preferred embodiment, the cross section of mechanical arm retaining part 2 is not by the size of the size of the arch section of said detected object 6 coverings corresponding to the mechanical arm sensor 4 in the reverse sensor installing hole.
Sketch map when correspondingly, Fig. 4 schematically shows and transmits mechanical arm and do not reset according to the grinding agent of the embodiment of the invention.
As shown in Figure 4; Because rotatable mechanical arm part 1 is with respect to the rotation of non-rotatable mechanical arm retaining part 2; When the formed fan-shaped opening portion of the detected object that is provided with on the mechanical arm part 16 during not corresponding to the mechanical arm sensor 4 at reverse sensor position of mounting hole place; Mechanical arm sensor 4 sensings at sensor installing hole 3 places are less than mechanical arm part 1, thereby judgement mechanical arm part 1 does not reset.And different with prior art is, is sensing mechanical arm part 1 when not resetting, and the mechanical arm sensor does not send any signal.
Sketch map when in addition, Fig. 5 schematically shows and transmits mechanical arm and reset according to the grinding agent of the embodiment of the invention.The reset mode of mechanical arm part 1 shown in Figure 5 is equal to the reset mode of mechanical arm part 1 shown in Figure 3.
As shown in Figure 5; Because rotatable mechanical arm part 1 is with respect to the rotation of non-rotatable mechanical arm retaining part 2; When the formed fan-shaped opening portion of the detected object that is provided with on the mechanical arm part 16 during corresponding to the mechanical arm sensor 4 at reverse sensor position of mounting hole place; The mechanical arm sensor 4 at sensor installing hole 3 places senses mechanical arm part 1, thereby judges that mechanical arm part 1 has resetted.And, sensing mechanical arm part 1 when not resetting, mechanical arm sensor 4 sends the notification signal that resets, for example signal " 1 ".
And different with prior art is that the processing unit (not shown) of chemical grinding equipment is handled at the chemical grinding that after mechanical arm sensor 4 receives the notification signal that resets, just starts pending wafer.
Thus; Can find out; According to the embodiment of the invention; Because mechanical arm sensor 4 does not send any signal when mechanical arm part 1 does not reset sensing, and just sends the notification signal that resets when mechanical arm part 1 resets and only sense at mechanical arm sensor 4, thereby chemical grinding equipment could start the chemical grinding processing to pending wafer.Thus, only do not have fault at the cable that connects mechanical arm sensor, thereby and mechanical arm part 1 resetted when grinding agent (polishing fluid) can be provided, just can start the chemical grinding of pending wafer is handled.
Can find out that this improvement design of the embodiment of the invention has solved a defective of original board design: when sensor failure, board can not stop to grind yet if mechanical arm is not in the position.Board just can begin milled processed when having only when working sensor normal and mechanical arm correct position.So, thereby can not occur because chemical machinery will be in the problem that does not have to carry out under the situation of grinding agent damaging wafer according to the chemical grinding equipment of the embodiment of the invention.Thereby, the chemical grinding equipment that provides a kind of mechanical arm of sensing effectively part whether to reset.
It is understandable that though the present invention with the preferred embodiment disclosure as above, yet the foregoing description is not in order to limit the present invention.For any those of ordinary skill in the art; Do not breaking away under the technical scheme scope situation of the present invention; All the technology contents of above-mentioned announcement capable of using is made many possible changes and modification to technical scheme of the present invention, or is revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical scheme of the present invention, all still belongs in the scope of technical scheme protection of the present invention any simple modification, equivalent variations and modification that above embodiment did according to technical spirit of the present invention.
Claims (6)
1. chemical-mechanical grinding device is characterized in that comprising: rotatable mechanical arm part, non-rotatable mechanical arm retaining part, be arranged in reverse sensor installing hole on the mechanical arm retaining part, be arranged in mechanical arm sensor in the reverse sensor installing hole, be arranged in detected object and processing unit on the mechanical arm part;
Wherein, reverse sensor installing hole is with relative corresponding to the reset position of mechanical arm part;
Wherein, The mechanical arm sensor is used for resetting and sending the notification signal that resets that the expression mechanical arm partly resets sensing mechanical arm before handling beginning to learn mechanical lapping; And the mechanical arm sensor does not send any signal sensing when mechanical arm part does not reset;
Wherein, the fan-shaped part that surpasses 180 degree in the covered cross section of said detected object;
And; On the one hand; Because rotatable mechanical arm part is with respect to the rotation of non-rotatable mechanical arm retaining part; The formed fan-shaped opening portion of the detected object that partly go up to be provided with when mechanical arm is not during corresponding to the mechanical arm sensor at reverse sensor position of mounting hole place, and the mechanical arm sensor sensing at sensor installing hole place is less than the mechanical arm part, and the mechanical arm sensor does not send any signal thus;
On the other hand; Because rotatable mechanical arm part is with respect to the rotation of non-rotatable mechanical arm retaining part; The formed fan-shaped opening portion of the detected object that partly go up to be provided with when mechanical arm is during corresponding to the mechanical arm sensor at reverse sensor position of mounting hole place; The mechanical arm sensor at sensor installing hole place senses the mechanical arm part, thereby the mechanical arm sensor sends the notification signal that resets;
And the processing unit of chemical grinding equipment is handled at the chemical grinding that after mechanical arm sensor receives the notification signal that resets, just starts pending wafer.
2. chemical-mechanical grinding device according to claim 1 is characterized in that, the cross section of said mechanical arm retaining part is not by the size of the size of the arch section of said detected object covering corresponding to the mechanical arm sensor in the reverse sensor installing hole.
3. chemical-mechanical grinding device according to claim 1 and 2 is characterized in that, said detected object covered the mechanical arm retaining part the cross section 340 the degree to 355 the degree fan-shaped part.
4. chemical-mechanical grinding device according to claim 3 is characterized in that, said detected object 6 covered mechanical arm retaining part 2 the cross section 350 the degree fan-shaped part.
5. chemical-mechanical grinding device according to claim 1 and 2 is characterized in that, said mechanical arm sensor is a switch closely.
6. chemical-mechanical grinding device according to claim 1 and 2 is characterized in that, the said notification signal that resets is signal " 1 ".
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210260755.6A CN102744674B (en) | 2012-07-26 | 2012-07-26 | Chemical-mechanical grinding device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210260755.6A CN102744674B (en) | 2012-07-26 | 2012-07-26 | Chemical-mechanical grinding device |
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| Publication Number | Publication Date |
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| CN102744674A true CN102744674A (en) | 2012-10-24 |
| CN102744674B CN102744674B (en) | 2016-10-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210260755.6A Active CN102744674B (en) | 2012-07-26 | 2012-07-26 | Chemical-mechanical grinding device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113305818A (en) * | 2021-05-28 | 2021-08-27 | 高彦波 | Mechanical arm self-checking reset and protection method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1618538A1 (en) * | 1988-09-13 | 1991-01-07 | Предприятие П/Я А-1067 | Arrangement for electromechanical polishing and bringing parts to specified size |
| US5807165A (en) * | 1997-03-26 | 1998-09-15 | International Business Machines Corporation | Method of electrochemical mechanical planarization |
| US6176992B1 (en) * | 1998-11-03 | 2001-01-23 | Nutool, Inc. | Method and apparatus for electro-chemical mechanical deposition |
| CN1531747A (en) * | 2001-03-14 | 2004-09-22 | 美商・应用材料股份有限公司 | Planarization of substrates using electrochemical mechanical polishing |
| US20070102116A1 (en) * | 2001-06-19 | 2007-05-10 | Applied Materials, Inc. | Feedback control of chemical mechanical polishing device providing manipulation of removal rate profiles |
| CN201833275U (en) * | 2010-08-05 | 2011-05-18 | 清华大学 | Chemical-mechanical polishing machine and chemical-mechanical polishing equipment with same |
-
2012
- 2012-07-26 CN CN201210260755.6A patent/CN102744674B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1618538A1 (en) * | 1988-09-13 | 1991-01-07 | Предприятие П/Я А-1067 | Arrangement for electromechanical polishing and bringing parts to specified size |
| US5807165A (en) * | 1997-03-26 | 1998-09-15 | International Business Machines Corporation | Method of electrochemical mechanical planarization |
| US6176992B1 (en) * | 1998-11-03 | 2001-01-23 | Nutool, Inc. | Method and apparatus for electro-chemical mechanical deposition |
| CN1531747A (en) * | 2001-03-14 | 2004-09-22 | 美商・应用材料股份有限公司 | Planarization of substrates using electrochemical mechanical polishing |
| US20070102116A1 (en) * | 2001-06-19 | 2007-05-10 | Applied Materials, Inc. | Feedback control of chemical mechanical polishing device providing manipulation of removal rate profiles |
| CN201833275U (en) * | 2010-08-05 | 2011-05-18 | 清华大学 | Chemical-mechanical polishing machine and chemical-mechanical polishing equipment with same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113305818A (en) * | 2021-05-28 | 2021-08-27 | 高彦波 | Mechanical arm self-checking reset and protection method |
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| CN102744674B (en) | 2016-10-26 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140430 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20140430 Address after: 201203 Shanghai Zhangjiang hi tech park Zuchongzhi Road No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
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