CN102665480A - Nail care system - Google Patents
Nail care system Download PDFInfo
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- CN102665480A CN102665480A CN2010800587913A CN201080058791A CN102665480A CN 102665480 A CN102665480 A CN 102665480A CN 2010800587913 A CN2010800587913 A CN 2010800587913A CN 201080058791 A CN201080058791 A CN 201080058791A CN 102665480 A CN102665480 A CN 102665480A
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- manicure
- band
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- nail
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- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
- A45D29/00—Manicuring or pedicuring implements
- A45D29/11—Polishing devices for nails
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- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
- A45D29/00—Manicuring or pedicuring implements
- A45D29/04—Nail files, e.g. manually operated
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- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
- A45D29/00—Manicuring or pedicuring implements
- A45D29/11—Polishing devices for nails
- A45D29/12—Polishing devices for nails manually operated
Abstract
A nail care system for buffing and polishing fingernails and toenails is disclosed. The system includes a nail care strip that includes a layer of a liquid silicone resin formulation and abrasive grains.
Description
Technical field
Generally speaking, this disclosure relates generally to a manicure system that is used for grinding and buffing finger nail and toenail.
Background technology
In the nursing of finger nail and toenail, natural and artificial nails are cleaned, rasion, level and smooth and polishing.Typical nail file is used to the top that finger nail and toenail is surperficial and the end cunning of flattening.Typically, nail file is long and hard band, and these bands have the texture of sand paper.
Commercially available nail file has stood many drawbacks.After using several times, this nail file trends towards becoming and can see degeneration, inhomogeneous and tarnish, thereby presents ugly outward appearance, even this product possibly still have a considerable amount of residue purposes.In addition, many nail files have embedded a plurality of nail particles and bacterium, and these particles and bacterium are from the surface finish of finger nail and toenail.Therefore, in hydrotherapy and manicure facility, because bacterium and nail particle are propagated the possibility to other clients, nail file can not be used for surpassing one client.
In addition, many nail files are configured as a general chunk, this chunk be stiff such it can't easily coincide to nail surface.Because the thickness and the hardness of these nail files, polish unapproachable zone trial, such as the wavy zone between skin and finger nail, possibly cause the surface of this nail is applied excessive pressure and relatively little polish.
Therefore, an improved manicure system will hope.
Summary of the invention
In a concrete embodiment, disclosed a manicure system that is used for grinding and buffing finger nail and toenail.This system comprises a manicure band, and this manicure band comprises the layer of a liquid silicon resin preparation and abrasive grain.
A kind of method of be used to polish finger nail and toenail is provided in another embodiment.This method comprises with a manicure band cleaning nail and polishing nail.This manicure band comprises the layer of a liquid silicon resin preparation and abrasive grain.
Description of drawings
Through can understanding this disclosure better, and make its many feature and advantage become clear for those of ordinary skill in the art referring to accompanying drawing.
Fig. 1 comprises the sketch of an exemplary manicure system.
Fig. 2 comprises the diagram of a cross sectional view of the manicure band of an exemplary structured.
In different figure, use identical reference symbol to represent similar or identical item.
The specific embodiment
In this specification and claim, term " comprises (including) " and " comprising (comprising) " is the term of open-ended and should be interpreted as and be meant " including but not limited to ... ".... these terms contained have more restrictive term " mainly by ... form " with " by ... composition ".
A manicure system is provided, and this system can be used to handle the surface of a finger nail, toenail or their combination.For example, this manicure system comprise one be used to grind, the manicure band of cleaning, finger nail of grinding and buffing and a toenail.In an exemplary embodiment, this manicure band comprises the layer of a liquid silicon resin and abrasive grains.This manicure band is reusable, a flexible bar, and this bar can be handled the end face or the end face of nail." nail " as used herein is meant finger nail, toenail or their combination.
In an exemplary, this manicure system 100 is commercial article that are used for commercial distribution.Fig. 1 has schematically showed a manicure system 100, and this manicure system comprises a manicure band 102 and packing 104.Packing 104 comprises a maintenance storehouse 106 that is used for nail care strip band 102.Packing 104 can comprise explanation 108 and bar code 110 or the selling price of sales transactions or other indicants of service provider of a sales information, title or this manicure band.
In addition, manicure system 100 can comprise the specification 112 of one group of printing.The specification 112 of this printing can be printed on the packing 104 or be involved with packing 104 and manicure band 102 as an independent sheet.In a schematic embodiment, this instructions direct a user place this manicure band 102 on the surface of a finger nail or a toenail.In another exemplary, specification 112 instructs a user with this manicure band this finger nail of polishing or this toenail.In another exemplary, specification 112 instructs a user with this manicure band this finger nail of polishing or this toenail.
This manicure band is formed by an abrasive material preparation, and this abrasive material preparation has formed a surface characteristics layer.In one embodiment, this manicure band is (that is, not the containing a structure back sheet) of no backing, makes that this manicure band is a self-supporting.Particularly, the preparation that forms this surface characteristics layer is a self-supporting, makes this layer ability before abrasive characteristic runs out, withstand to use and does not have a structure degradation.This abrasive material characteristic layer comprises a cluster of a plurality of surperficial protuberances., the cluster of these surperficial protuberances can be random, and in one embodiment, forms a pattern.In addition; This cross-sectional surface area can change (normally, increase) during this manicure bar belt wear, such as under the situation of the surperficial protuberance of an inclined side (cone, cone, prism or the like; The surface protuberance); Or during wearing and tearing, can have constant cross-sectional surface area usually, such as under the protuberance situation of vertical wall (rectangle, foursquare, club wait protuberance).In a schematic embodiment, this manicure band can also comprise an adhesive layer.
In an exemplary embodiment, this manicure band comprises an abrasive characteristic layer, and this abrasive characteristic layer is formed by a silicone resin and abrasive grain.For example, this silicone resin can be formed by the silicone rubber (HCR) or a liquid silicone rubber (LSR) of a high-consistency.In one embodiment, silicone rubber of this high-consistency (HCR) or liquid silicone rubber (LSR) can further comprise a kind of enhancing particulate.In a concrete instance, this silicone resin is formed by a kind of LSR.Generally, this silicone rubber, such as LSR or HSR, crosslinked this silicone resin forms a matrix to form this silicone resin, and abrasive grain can be distributed or disperseed in this matrix.A kind of so crosslinked silicone resin contrasts as a kind of adhesive of abrasive grain and with noncrosslinking silica gel, and these noncrosslinking siloxanes are configured to move on the surface of a manicure band.
This silicone resin also can be formed by silicone oil, and these silicone oil do not contain fumed silica generally and obtain.In a schematic embodiment, these silicone oil, A part and B part are carried out blend with catalyst, enhancing particulate (like fumed silica) and abrasive grain, and are solidified subsequently to be formed into this silicone resin product.In a concrete embodiment; This silicone resin is a liquid silicone rubber; Wherein A part and B part and catalyst, enhancing particulate (like, fumed silica) and abrasive grain carry out blend, and solidify subsequently to form this silicone resin product.
A kind of exemplary silicone oil or silicone rubber comprise that functional group can be attached to the siloxane polymer skeleton on it.In an example, a kind of functional group can comprise a kind of nullvalent functional group, for example halogen group, phenyl or alkyl, or its any combination.For example, a kind of fluorosilicone can comprise a fluorine functional group that is attached on this skeleton.In another exemplary, this siloxane backbone can be attached in a methyl, ethyl, propyl group or its any combination.In addition, this siloxane backbone can comprise the reactive functional groups that promotes crosslinked effect.An exemplary reactive functional groups comprises: hydride group, hydroxyl, vinyl or its any combination.For example, this siloxane polymer can comprise: gather fluorosilicone, phenyl silicone, gather alkylsiloxane or its any combination, they can have reactive functional groups, for example vinyl ends (termination).In an instantiation, this silicone resin is formed by a kind of basic polysiloxanes and a kind of cross-linking reagent.For example; This basic polysiloxanes can be a kind of alkylsiloxane that gathers; Like the siloxane polymer that is formed by a kind of precursor, this precursor is like dimethyl siloxane, di-ethyl siloxane, dipropyl siloxanes, Methylethyl siloxanes, methyl-propyl siloxanes or their combination.In a concrete embodiment, this gathers alkylsiloxane and comprises a kind of polydialkysiloxane, like dimethyl silicone polymer (PDMS).For example, this silicone resin is a kind of liquid silicone rubber (LSR), wherein this first comprise a kind of ethenyl blocking or grafting gather alkylsiloxane.
In an example, this silicone resin, for example this liquid silicone rubber further comprises a kind of cross-linking reagent.In one embodiment, this crosslinking agent can be an organic crosslinking agent.In an instantiation, this crosslinking agent is based on the crosslinking agent of siloxanes, comprises reactive hydrides functional group.For example, this crosslinking agent can comprise a kind of crosslinking agent based on siloxanes, have the reactive functional groups of being attached to (as, hydride or oh group) on siloxane backbone.In a specific embodiments, this crosslinking agent can be to gather hydrogenation alkylsiloxane (polyhydroalkylsiloxane).In one embodiment, this silicone resin is a liquid silicone rubber, and wherein this second portion comprises a kind of crosslinking agent.
In a specific embodiments, this abrasive characteristic layer can be to be formed by a kind of uncured preparation (comprising liquid silicone rubber (LSR)).For example, when use test method DIN 53 019 at about 10s
-1The temperature of shear rate and about 21 ° of C under when measuring, this uncured liquid silicone rubber can have be not more than about 600, the viscosity of 000cps.For example, this viscosity can be not more than about 450,000cps, as be not more than about 400,000cps.Typically, this viscosity is at least about 50,000cps, and as at least about 100,000cps.In another example, the viscosity that does not strengthen the silicone oil of particulate can be about 5cps to about 165,000cps.
Under the situation of the preparation that solidifies, before solidifying, can different curing agent, catalyst and heat or light trigger and sensitizer be joined in this silicone resin.In an example, this preparation can use a kind of peroxide catalyst to solidify.In another example, this preparation can use a kind of platinum catalyst to solidify.In one embodiment, this catalyst can be the combination of a kind of peroxide catalyst and a kind of platinum catalyst.In an instantiation, a kind of first of liquid silicone rubber further comprises this catalyst and a kind of inhibitor.For example; This silicone resin comprises a kind of two parts liquid silicone rubber (LSR) of platinum catalysis; Wherein part A comprise a kind of ethenyl blocking or grafting gather alkylsiloxane, a kind of catalyst and a kind of inhibitor; And part B comprises a kind of crosslinking agent based on siloxanes, and this crosslinking agent comprises reactive hydrides functional group.
The silicone matrix that is formed by the silicone resin of this curing can show desirable mechanical property, makes that planting the clean article that silicone resin forms thus is self-supporting, thereby enables to form a kind of clean article that does not have backing.Particularly, this silicone resin can be used for forming the manicure band, and this manicure band has withstood use and do not had structure degradation before abrasive characteristic is consumed.For example, this silicone matrix (not having abrasive grains) elongation at break, hot strength or stretch modulus of can performance making us hoping.For example; This silicone matrix (not having abrasive grains) can demonstrate the elongation at break at least about 50%; As at least about 100%, at least about 200%, at least about 300%, at least about 350%, at least about 450%, or or even at least about 500%; As use DIN 53 504S1 to measure in one embodiment, under the situation that does not have abrasive grain, silica filled dose silicone resin with enhancing can have the elongation at break at least about 350%; For example at least about 450% or even at least about 500%, measure as using DIN 53 504S1.In another example, this does not exist the silicone resin of the curing of abrasive grain can have the hot strength at least about 10MPa.
This preparation further comprises abrasive grain.Under the situation of the preparation that solidifies, this silicone resin can carry out blend with abrasive grain before solidifying.Typically, these abrasive grains are carried out blend to form a homogeneous mixture that spreads all over the abrasive grain of this silicone resin.These abrasive grains can be formed by a kind of combination of following any abrasive grain or multiple abrasive grain, and these abrasive grains comprise: oxide, carborundum, garnet, diamond, cubic boron nitride, silicon nitride, ceria, titanium dioxide, titanium diboride, boron carbide, tin oxide, tungsten carbide, titanium carbide, iron oxide, chromium oxide, flint, diamond dust or their any combination of silica, aluminium oxide (fusion or sintering), zirconia, zirconia/aluminium oxide.For example; These abrasive grains can be selected from down group, and this group is made up of the following: the alumina zirconia of silica, aluminium oxide, zirconia, carborundum, silicon nitride, boron nitride, garnet, diamond, congruent melting, ceria, titanium diboride, boron carbide, flint, diamond dust, aluminum oxynitride or their a kind of blend.Particularly, these abrasive grains can be selected from down group, and this group is made up of the following: nitride-based, oxide-based, carbon compound or their any combination.In an example, this nitride can be selected from down group, and this group is made up of the following: cubic boron nitride, silicon nitride or their any combination.In another example, this oxide can be selected from down group, and this group is made up of the following: the oxide of silica, aluminium oxide, zirconia, zirconia/aluminium oxide, cerium oxide, titanium dioxide, tin oxide, iron oxide, chromium oxide or their any combination.In another example, this carbide can be selected from down group, and this group is made up of the following: carborundum, boron carbide, tungsten carbide, titanium carbide or their any combination, and particularly can comprise carborundum.Concrete embodiment is used the fine and close abrasive grain that mainly comprises Alpha-alumina.In another instantiation, these abrasive grains comprise carborundum.
Abrasive grain can also have special shape.An instance of this shape comprises: club, triangle, pyramid, taper shape, medicine ball, hollow ball or analogous shape.Alternately, abrasive grain can be shaped brokenly.
These abrasive grains have generally and are not more than 2000 microns particle mean size, as are not more than about 1500 microns.In another example, abrasive grain is to be not more than about 750 microns, as is not more than about 350 microns.For example, abrasive grain can be at least 0.1 micron, 0.1 micron to about 1500 microns according to appointment, and more typically be about 0.1 micron to about 200 microns, or about 1 micron to about 100 microns.The granularity of these abrasive grains typically is defined as the longest dimension of this abrasive grain.In general, a distribution that has granularity.In some cases, size distribution is controlled by strictness.In one embodiment, these abrasive grains further comprise the aggregation of these abrasive grains.Typically, the size of the type of abrasive grain and abrasive grain can be selected according to remaining clean Surface.
In an exemplary preparation, these abrasive grains provide this preparation gross weight about 10% to about 90%, for example from about 30% to about 80%.In an exemplary, this preparation comprises based on the gross weight of this preparation these abrasive grains at least about 30wt%.For example, this preparation can comprise these abrasive grains at least about 45wt%, for example at least about these abrasive grains of 55wt%.Generally, this preparation comprises these abrasive grains that are not more than 90wt%, for example is not more than these abrasive grains of 85wt%.
In an exemplary, the preparation that forms this manicure band can comprise a kind of enhancing particulate.Under the situation of the preparation that solidifies, this optional enhancing particulate typically added before solidifying.Typically, these are strengthened particulate and carry out blend to form a homogeneous mixture that spreads all over the enhancing particulate of this silicone resin.For example, this enhancing particulate can be incorporated in this silicone resin as replacement scheme, and this enhancing particulate can join with the preparation of this preparation in this silicone oil, for example before adding these abrasive grains.A kind of exemplary enhancing particulate comprises: silica granule, alumina particle or their any combination.In an instantiation, this enhancing particulate comprises silica, for example fumed silica.A kind of exemplary silica microparticle can get under trade name Aerosil from Degussa (Degussa) company, like Aerosil R812S, or from Cabot (Cabot) Ke De of company, like Cabosil M5 fumed silica.In another exemplary, this enhancing silica can be incorporated in a kind of liquid silicone rubber preparation, for example from watt Elastosil 3003 preparations that gram siloxanes company (Wacker Silicones) can get.In one embodiment, this enhancing particulate typically is dispersed in this silicone matrix, and typically is monodispersed, is not have aggregation in fact.In another embodiment, this strengthen microparticulate in this silicone matrix as aggregation and agglomerate.
In another exemplary, strengthen particulate through method based on solution, for example colloidal sol pottery that form and that collosol and gel forms forms, and is suitable for particularly well in this preparation.Suitable colloidal sol is commercially available.For example; Colloidal silica in aqueous solution is at trade name " LUDOX " ((the E.I.DuPont de Nemours and Co. of Wilmington, Delaware State city E.I.Du Pont Company; Inc.)); " NYACOL " (Massachusetts ashland city Nikkor company (Nyacol Co.)) or " NALCO " (Oak Tree small stream city, Illinois State Nalco Chemical Co (Nalco Chemical Co.)) are commercially available down.Many commercially available colloidal sols are alkaline, are through alkali, and for example NaOH, potassium hydroxide or ammonium hydroxide are stable.The other example of suitable colloidal silica is described in U.S. Patent number 5,126, and in 394, this patent is combined in this by reference.Especially very suitable is the silica of colloidal sol formation and the aluminium oxide that colloidal sol forms.These colloidal sols can carry out functionalization through one or more suitable surface treatment reagent and inorganic oxide base particle are reacted in colloidal sol.
In a specific embodiments, this enhancing particulate is a submicron-scale.These strengthen surface area that particulates have can be at about 50m2/g to the scope of about 500m2/g, as at about 100m2/g extremely in the scope of about 400m2/g.This enhancing particulate can be the particulate of nano-scale, for example has the particulate of about 3nm to about 500nm average grain diameter.In an exemplary, this particulate filler has the average grain diameter of about 3nm to about 200nm, and 3nm is to about 100nm according to appointment, and about 3nm is to about 50nm, and about 8nm is to about 30nm, or about 10nm is to about 25nm.In a plurality of concrete embodiments, this average grain granularity is not more than about 500nm, as is not more than about 200nm or is not more than about 150nm.Strengthen particulate for this, this average grain diameter can be defined as corresponding to peak value volume fraction in low-angle neutron scattering (SANS) distribution curve or corresponding to the particle diameter of the particle size of 0.5 cumulative volume mark of SANS distribution curve.
This enhancing particulate can also characterize through a narrow distribution curve with about 2.0 times half-breadth of the average grain diameter of being not more than.For example, this half-breadth can be to be not more than approximately 1.5, or the half-breadth that is not more than about 1.0 these distributions is the width of this distribution curve at its half place of maximum height, for example the half the particle fraction at this distribution curve peak place.In a concrete embodiment, this grading curve is unimodal.In an alternate embodiment, this particle diameter distribution is bimodal or in this particle diameter distributes, has the peak greater than.
In an example, this enhancing particulate with based on this siloxanes, strengthen particulate and abrasive grain combination weight an amount and be included in this preparation.For example, this enhancing particulate can be by being included at least about the amount of 3wt% in this preparation based on the gross weight of this preparation (this preparation comprise strengthen particulate, silicone resin and abrasive grain).Particularly, this preparation can comprise the enhancing particulate at least about 5wt%, or particulate, as at least about the enhancing particulate of 10wt% or even at least about the enhancing particulate of 13wt%.In addition, this preparation can comprise the enhancing particulate that is not more than about 60wt%, as is not more than the enhancing particulate of about 50wt%
Generally, this preparation has formed (comprising this silicone resin, abrasive grain and optional enhancing particulate) the abrasive characteristic layer of this manicure band.The type of abrasive grain and any optional enhancing particulate can be selected according to the abrasive levels of on this nail surface, hoping.In some embodiments, this manicure band mainly is made up of the liquid silicone rubber and the abrasive grain of above description.As use here; This phrase " comprises " basically and this manicure band interrelates; The aggregation of having got rid of this manicure band that influences this fundamental sum novel feature; Although this manicure band possibly use different vulcanizing agents, catalyst, temperature-sensitive or emulsion, sensitising agent and enhancing particulate.As in this use; The phrase that is used in combination with this manicure band " mainly by ... form " got rid of the existence of the polymer of the basic and novel feature that influences this manicure band in advance, although different curing agent, catalyst and heat or light trigger, sensitizer and strengthen particulate and can in this manicure band, use.
In case form a layer, then this preparation shows multiple mechanical property, these mechanical properties have advantageously strengthened the performance of the manicure band that is formed by this preparation.Particularly, this preparation can show the mechanical property of making us hoping, like elongation at break, hardness, stretch modulus or hot strength.In addition, this manicure band can the performance when producing the surface characteristics of hoping for this nail surface be assessed, for example, and flatness, polishing, gloss, or the like.
In an exemplary, this preparation shows the elongation at break at least about 50%, and for example use test method ASTMD 412 or test DIN 53 504 S1 methods are measured.Particularly, this elongation at break can be at least about 100%, as at least about 125%, or or even at least about 135% elongation at break.
The preparation of this curing can also have desirable hardness, as based on method of testing DIN53505 in about 50 Shore A to the hardness of about 75 Shore D scopes.For example, this hardness can be to be not more than about 75 Shore D, as is not more than about 60 Shore D, perhaps not even greater than about 50 Shore D.The scale of hardness of the preparation of this curing is understood a kind of flexible material.
In another exemplary, this preparation shows the desirable stretch modulus that under 100% strain, is not more than about 8.0Mpa based on ASTM D 412.For example, this stretch modulus can be to be not more than 7.6MPa, as, be not more than 7.5MPa.In addition, the preparation of this curing can have the desirable hot strength at least about 7.0MPa based on ASTM D 412.For example, the preparation of this curing can have at least about 7.5MPa, like the hot strength at least about 8.0MPa.As replacement scheme, this preparation can show the stretch modulus at least about 8MPa, as at least about 14MPa, or even at least about 30MPa.Concrete preparation can show the stretch modulus greater than 100MPa.
In a schematic embodiment, this preparation forms this abrasive characteristic layer of this manicure band.Fig. 2 comprises the diagram of the manicure band 200 of an example structureization.Alternatively, this preparation can be used to form the manicure band of other non-structured coatings or the manicure band of bonding.Typically, the manicure band of a structurized coating comprises the manicure band of a coating, and the manicure band of this coating has a cluster of the surface texture of a plurality of protrusions, typically is arranged in the pattern.
This structure manicure band; The abrasive article that also is called as a through engineering approaches; Comprise a plurality of abrasive grains; These abrasive grains are dispersed in a kind of adhesive and form discrete three-dimensional element, these three-dimensional elements or be on this manicure band or the pattern arrangement that spreads all over this band also or in no gauge array.In one embodiment, thus these manicure bands are designed to wear down constantly to be exposed new abrasive material and grinds the interface to this.
The exemplary manicure band of in Fig. 2, showing 200 comprises an abrasive characteristic layer 202.This abrasive characteristic layer 202 comprises projective structure 208, and this projective structure 208 can be by with a pattern form arrangement.In the embodiment of being showed, this projective structure 208 is configured in response to wearing and tearing the increase contact area is provided, as under the situation of the protuberance with inclined side surfaces.For example, this structure 208 can have a cross section, and this cross section has the distance that increases along with the bottom from this abrasive characteristic layer 202 and the cross section that reduces.Typically, this abrasive characteristic layer 202 is formed by the preparation that comprises this liquid silicone rubber preparation, abrasive grain and optional enhancing particulate.Particularly, these abrasive grains disperse on the whole thickness of this abrasive characteristic layer 202, make this abrasive characteristic layer from sharpening.Be meant when this clean article like " self-sharpening " in this use to be utilized and when the thickness of this abrasive characteristic layer 202 in the wear process reduces, kept it to grind the abrasive characteristic layer 102 of quality.For example, this preparation can be formed layer and a curing or a fixed abrasive characteristic layer 202 that has structure 208 with production that has pattern.
In a schematic embodiment, this abrasive material characteristic layer 202 can be formed has a backing or supporting layer.This backing typically directly is bonded to and directly contacts this abrasive characteristic layer 202.For example, this abrasive characteristic layer 202 can be expressed into or roll to a back sheet.This backing or supporting layer can comprise: polymer film, foam of polymers or fibr tissue.In an instantiation, this back sheet or supporting layer can comprise: cloth, paper or their any combination.Typically, this back sheet or supporting layer are non-grinding layers that does not comprise abrasive grain.In one embodiment, this back sheet or supporting layer provide other structural support generally or have given manicure band mechanical property, do not have this abrasive characteristic layer 102 of these characteristics also can not move.
As replacement scheme, this manicure band 202 can neither one backing layer.The concrete preparation that is used to form this abrasive characteristic layer 202 provides desirable mechanical property and can be self-supporting.In other words, this abrasive characteristic layer 202 can be configured and in use or during making not rely on a backing layer.For example, a self-supporting abrasive characteristic layer 202 can withstand use and not have structure degradation before these abrasive characteristics are exhausted.Particularly; The characteristic of the polymer in this preparation can allow to form this manicure band 200 and need not a back sheet; This can have the concrete advantage that surmounts prior art, and these prior aries require to use a back sheet to carry this grinding layer through this coating procedure and mechanical integrity or flexibility in use are provided generally.Particularly, this abrasive characteristic layer 202 can be self-supporting and do not have support or the back sheet below.Support below this kind or back sheet have tensile properties usually, and for example combining of intensity and flexibility, these characteristics are superior to those characteristics of traditional grinding layer.。In this specific embodiment, this manicure band 200 does not contain a layer, and the tensile properties that this layer has is superior to the tensile properties of this abrasive characteristic layer 202.
Except that this abrasive characteristic layer 202, this manicure band 200 can comprise an adhesive layer 204.In one embodiment, this adhesive layer 204 can comprise the adhesive of a kind of contact adhesive or curing.When using this adhesive the manicure band to be bonded on the burnisher, prevent too early bonding thereby release film can cover this adhesive character layer.This kind release film was typically just removed before manicure band 200 being attached on its nail burnisher.In one embodiment, an adhesive layer can form a undesirable surperficial (not shown), and for example contact adhesive surface, and this adhesive character layer can have the surface characteristics that forms this adhesive upper surface.In a concrete embodiment, this adhesive layer is directly to contact this abrasive characteristic layer, gets involved structure sheaf in the middle of not having.
In another exemplary, this grinding layer 202 can be adhered on the connecting plate 206.For example, this connecting plate 206 can be parts of a hook and loop fastening system.Such fastening system can be used to a manicure band 200 and be connected on the nail burnisher.
The structure 208 of this manicure band 200 can be by a pattern arrangement.For example, this abrasive structure can be by a grid pattern arrangement.In another exemplary, this abrasive structure can be by the parallel lines arrangement.Alternatively, these structures can random arrangement and the pattern that limits, and perhaps element can be with row or the row skew each other that replaces.In an additional instance, these structures can be the protuberances that disperses, and have sloped sidewall.In another example, these structures can be to have the protuberance of the separation of upright side walls in fact.These structures can be by the array arrangement with pattern or can be by a kind of random array arrangement.
In one embodiment, be configured to increase contact area from the abrasive structure of this abrasive characteristic layer protrusion in response to wearing and tearing.For example, this abrasive structure can have a leg-of-mutton cross section.Through one first degree of wear, this contact area is the contact area that produces less than from other wearing and tearing.Typically, through the minimizing of vertical height, the contact area that on a horizontal plane, forms generally increases.In another exemplary, this structure can have the cross section of a semicircle.These structures or protuberance can have the moulding regularly or the vertical section of moulding brokenly.If regular moulding, then these protuberances can have the cross section of level, and are for example circular or polygonal.
Get back to Fig. 2, it is useful especially that the preparation of more than describing has been found in the manicure band that forms concrete structureization (especially do not support or back sheet those), and comprises thin structure.In an exemplary, the total height of passing through letter " b " expression that this abrasive characteristic layer 202 has is to be not more than about 500 Mills, as is not more than about 350 Mills; Be not more than about 200 Mills; Be not more than about 100 Mills, be not more than about 50 Mills, or not even greater than about 35 Mills.This abrasive structure 208 like what represent through letter " a ", can be to be not more than about 20 Mills, for example is not more than about 15 Mills.In addition, the width of this abrasive characteristic layer 202 (not comprising this abrasive structure 208) as represented through letter " c ", can be to be not more than about 15 Mills, for example is not more than about 10 Mills.
This manicure band 200 can cut and moulding by any rational size according to purposes.For example, can this manicure band be shaped to a square, rectangle, circle, ellipse, triangle, cylinder or any rational form.In addition, can this manicure band be shaped to suitable manual or any rational burnisher.In one embodiment, this manicure band, instrument or their combination can be selected to change this abrasiveness as required.In a concrete embodiment, this manicure band can from be used to clean, this instrument of health or their combination removes.In addition, this manicure band 200 has flexibility, and this flexibility is to hope for the shape and the corrugated surface of cleaning finger nail and toenail.For example, the hardness of this clean article is based on method of testing DIN53 505 in about 50 Shore A to the scope of about 75 Shore D.For example, this hardness can be to be not more than about 75 Shore D, as is not more than about 60 Shore D, perhaps not even greater than about 50 Shore D.
In a concrete embodiment, disclosed a kind of method of polish finger nail or toenail.A kind of a kind of exemplary method of polish finger nail or toenail is provided.In a concrete embodiment, a manicure band is used to assist the polishing of finger nail or toenail.This method comprises this nail of cleaning.In one embodiment, this nail is cleaned with any rational anticipation method.For example, this nail water (like running water, distilled water, deionized water and and their combination) is cleaned.In addition, any rational soap, cleaning agent, solvent, cleaning agent and analog can be used as and remove any foreign matter (like dirt, dunghill, nail polish, nail chip and analog that maybe be on nail) so that the nail surface of a nature, cleaning to be provided.Typical solvent comprises any rational nail polish remover.In one embodiment, this solvent comprises chemical cleaner.In one embodiment, this manicure band does not comprise any additional chemical cleaner.In a concrete embodiment, this manicure band can be used to clean finger nail or the toenail with any nail chip and foreign matter.
Polish through this manicure band in the surface of this finger nail, toenail or its combination.This surface of polishing comprises through friction, washing and similar action and grinds this nail surface, so that a smooth nail surface to be provided.In one embodiment, this finger nail or toenail can with or need not polish by a kind of solvent.A kind of typical solvent can help this nail surface of polishing.This solvent can be before polishing this finger nail or toenail, in the process of this finger nail of polishing or toenail or its any combination, be provided.Solvent can comprise water, like running water, distilled water, deionized water and their combination.Solvent may further include any rational polishing agent, like wax, lubricant, buffer, analog and their combination.For example, polishing agent powder can be with during this manicure band combines.In an exemplary, this polishing agent powder and water react.
Although this manicure system implementation scheme is useful for the finger nail and the toenail of self-sow, other surfaces still can be cleaned, and for example comprise, any artificial nail surface.In a schematic embodiment, nail chips, foreign matter have been cleared up in this artificial nails surface, and have no nail polish.
Improved surface characteristics advantageously is provided in the specific embodiments of this manicure band in use.For example, use the specific embodiments of this manicure band can be illustrated in the improvement aspect roughness and gloss on this finger nail and the toenail.In a schematic embodiment, this manicure band this finger nail of polishing or toenail, and on this finger nail and toenail surface, do not stay dark cut or blemish.In a concrete embodiment, it is useful that this manicure band does not have under the situation that subsequent coated handles therein, and can give the characteristic of the dirty and dust of this polished surface resistant with this manicure band polishing.In another embodiment, this manicure band therein this nail to be coated under any rational nail oil condition subsequently be useful.
In addition, this manicure band can easily be cleaned and reused.In a concrete embodiment, this manicure band water cleans any nail chip and dirt that stays.In a schematic embodiment, this manicure band can't be retained in nail chip and foreign matter in its structure, and therefore can not propagate into other surfaces to nail chip and dirt.In addition, this manicure band can reuse, that is, can be used as a manicure bar and bring and be repeatedly used, and do not degenerate and lose its efficient.For example, this manicure band can be used at least about 3 to about 5 times, as at least about 10 times, or even at least about 20 times, and the not visible degeneration of this manicure band.In one embodiment, any rational cleaning agent can use on this manicure band, to kill or to remove any germ, bacterium and analog.Exemplary cleaning agent comprises alcohol, antiseptic, or the like.For example, can a kind of cleaning agent be added on this manicure band so that kill or remove any germ, bacterium and analog through any rational method.In one embodiment, this manicure band is soaked in this cleaning agent to kill or to remove any germ, bacterium and analog.
The other details of constructing this manicure band can find in U.S. Patent Application Publication US2008/0014840A1 (US ' 840), and it is combined in this by reference.Should point out that US ' 840 is to repairing under the background in automotive paints rather than the abrasive structure of using under the manicure band background generally, and combine them be used to polish the method for finger nail and toenail.
The theme that more than discloses should be considered to illustrative and nonrestrictive, and accompanying claims is intended to contain all these type of changes, enhancing and other embodiments that drops in the true scope of the present invention.Therefore, allow to the full extent at law, scope of the present invention should be by confirming following claim and their equivalent the wideest permissible explanation, and should not receive the constraint or the restriction of above detailed explanation.
Claims (48)
1. manicure system that is used for grinding and buffing finger nail and toenail, this system comprises a manicure band, this manicure band comprises the layer of a liquid silicon resin preparation and abrasive grain.
2. manicure as claimed in claim 1 system further comprises a packing, and this packing has of being used for this manicure band and keeps the storehouse, and this packing provides a sales information relevant with this grinding band.
3. manicure as claimed in claim 2 system further comprises a specification that is included in the printing in this packing, and user of the instructions direct of this printing uses this manicure band on finger nail and toenail.
4. manicure as claimed in claim 3 system, wherein, the instructions direct of this printing a user polish to nail with this manicure band.
5. manicure as claimed in claim 3 system, wherein, the instructions direct of this printing a user polish nail with this manicure band.
6. manicure as claimed in claim 1 system, wherein, this liquid silicon resin is that the silicone resin by two parts forms, one of them part comprises a kind of crosslinking agent.
7. like each described manicure system in the claim 1 to 6, wherein, this manicure band comprises based on the gross weight of this preparation these abrasive grains at least about 30wt%.
8. like each described manicure system in the claim 1 to 7, wherein, these abrasive grains are to be selected from down group, and this group is made up of the following: nitride-based, carbon compound, oxide-based and their a kind of blend.
9. like each described manicure system in the claim 1 to 7; Wherein, These abrasive grains are to be selected from down group, and this group is made up of the following: the oxide of silica, aluminium oxide, zirconia, alumina-zirconia, carborundum, garnet, diamond, cubic boron nitride, silicon nitride, cerium oxide, titanium dioxide, titanium diboride, boron carbide, tin oxide, tungsten carbide, titanium carbide, iron oxide, chromium oxide, flint, diamond dust and their any combination.
10. like each described manicure system in the claim 1 to 9, wherein, these abrasive grains are that the form with a kind of aggregation exists.
11. like each described manicure system in the claim 1 to 10, wherein, this manicure band further comprises a kind of enhancing particulate.
12. manicure as claimed in claim 11 system, wherein, this strengthen the included value of particulate be this preparation gross weight at least about 3wt%.
13. manicure as claimed in claim 11 system, wherein, this enhancing particulate comprises silica.
14. like each described manicure system in the claim 1 to 13, wherein this manicure band is to be in a kind of form of abrasive sheet and this manicure band neither one back sheet therein.
15. like each described manicure system in the claim 1 to 14, wherein, this manicure band is to be in a kind of form with a first type surface, wherein, this first type surface has a cluster of a plurality of surperficial protuberances.
16. manicure as claimed in claim 15 system, wherein, the cluster of these surperficial protuberances is arranged in the pattern.
17. manicure as claimed in claim 15 system, wherein, these surperficial protuberances are surperficial protuberances of sloped sidewall.
18. manicure as claimed in claim 15 system, wherein, these surperficial protuberances are surperficial protuberances of vertical wall.
19. like each described manicure system in the claim 1 to 18, wherein, this manicure band further comprises a kind of polishing agent.
20. like each described manicure system in the claim 1 to 19, wherein, this manicure band has the thickness that is not more than about 500 mils.
21. manicure as claimed in claim 20 system, wherein, this thickness is to be not more than about 350 mils.
22. the method for polish finger nail and toenail, this method comprises:
This finger nail, toenail or their combination are cleaned; And
With a manicure band this finger nail, toenail or their combination are polished, this manicure band comprises the layer of a liquid silicon resin preparation and abrasive grain.
23. method as claimed in claim 22, wherein, this liquid silicon resin is formed by a kind of two-part silicone rubber, and one of them part comprises a kind of crosslinking agent.
24. like each described method in the claim 22 to 23, wherein, this manicure band comprises these abrasive grains at least about 30wt% based on this preparation gross weight.
25. like each described method in the claim 22 to 24, wherein, these abrasive grains are to be selected from down group, this group is made up of the following: nitride-based, carbon compound, oxide-based and their blend.
26. method as claimed in claim 25, wherein, these abrasive grains comprise a kind of carbide.
27. method as claimed in claim 26, wherein, this carbide is to be selected from down group, and this group is made up of the following: carborundum, boron carbide, tungsten carbide, titanium carbide and their composition.
28. method as claimed in claim 26, wherein, this carbide comprises carborundum.
29. method as claimed in claim 25, wherein, these abrasive grains comprise a kind of nitride.
30. method as claimed in claim 29, wherein, this nitride is to be selected from down group, and this group is made up of the following: cubic boron nitride, silicon nitride and their combination.
31. method as claimed in claim 25, wherein, these abrasive grains comprise a kind of oxide.
32. method as claimed in claim 31; Wherein, This oxide is to be selected from down group, and this group is made up of the following: the oxide of silica, aluminium oxide, zirconia, alumina-zirconia, cerium oxide, titanium dioxide, tin oxide, iron oxide, chromium oxide and their combination.
33. like each described method in the claim 22 to 24; Wherein, These abrasive grains are to be selected from down group, and this group is made up of the following: the oxide of silica, aluminium oxide, zirconia, alumina-zirconia, carborundum, garnet, diamond, cubic boron nitride, silicon nitride, cerium oxide, titanium dioxide, titanium diboride, boron carbide, tin oxide, tungsten carbide, titanium carbide, iron oxide, chromium oxide, flint, diamond dust and their any combination.
34. like each described method in the claim 22 to 33, wherein, these abrasive grains are the forms that are in aggregation.
35. like each described method in the claim 22 to 34, wherein, this manicure band further comprises a kind of enhancing particulate.
36. method as claimed in claim 35, wherein, this strengthen the included value of particulate be this preparation gross weight at least about 3wt%.
37. method as claimed in claim 35, wherein, this enhancing particulate comprises silica.
38. like each described method in the claim 22 to 37, wherein, this manicure band has the elongation at break at least about 100%.
39. like each described method in the claim 22 to 38, wherein, this manicure band has the thickness that is not more than about 500 mils.
40. method as claimed in claim 39, wherein, this thickness is to be not more than about 350 mils.
41. like each described method in the claim 22 to 40, wherein, this manicure band comprises a first type surface with one group of protuberance.
42. method as claimed in claim 41, wherein, this group protuberance is arranged in the pattern.
43. method as claimed in claim 41, wherein, this group protuberance is the surperficial protuberance of sloped sidewall.
44. method as claimed in claim 41, wherein, this group protuberance is the surperficial protuberance of vertical wall.
45. like each described method in the claim 22 to 44, wherein, this manicure band is the self-supporting formula.
46. like each described method in the claim 22 to 45, further be included in polishing before, to this nail a kind of solvent is provided in the bruting process or in its combination.
47. like each described method in the claim 22 to 46, wherein, this manicure band further comprises a kind of polishing agent.
48., further comprise this manicure band added a kind of cleaning agent so that remove any bacterium from this manicure band like each described method of claim 22 to 47.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29071509P | 2009-12-29 | 2009-12-29 | |
| US61/290715 | 2009-12-29 | ||
| PCT/US2010/062428 WO2011090758A2 (en) | 2009-12-29 | 2010-12-29 | Nail care system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102665480A true CN102665480A (en) | 2012-09-12 |
Family
ID=44307494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010800587913A Pending CN102665480A (en) | 2009-12-29 | 2010-12-29 | Nail care system |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20110192410A1 (en) |
| EP (1) | EP2519125A4 (en) |
| JP (1) | JP2013514872A (en) |
| KR (1) | KR20120092707A (en) |
| CN (1) | CN102665480A (en) |
| AU (1) | AU2010343053A1 (en) |
| BR (1) | BR112012014896A2 (en) |
| CA (1) | CA2785452A1 (en) |
| CL (1) | CL2012001765A1 (en) |
| MX (1) | MX2012007111A (en) |
| WO (1) | WO2011090758A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107865507A (en) * | 2016-09-27 | 2018-04-03 | 卡西欧计算机株式会社 | Object holding member and drawing apparatus |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101529461B1 (en) * | 2014-10-21 | 2015-06-17 | 제이씨코리아 주식회사 | A composition for removing nail polish and a kit comprising the same |
| FR3036957B1 (en) * | 2015-06-03 | 2018-10-12 | Fiabila | COSMETIC COMPOSITION OF STAINLESS POLYURETHANE AQUEOUS POWDERABLE NAIL VARNISH |
| KR101900941B1 (en) * | 2018-04-09 | 2018-09-21 | (주)알파옵트론 | Nail care implement and manufacturing method for the same |
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- 2010-12-29 JP JP2012546262A patent/JP2013514872A/en active Pending
- 2010-12-29 CN CN2010800587913A patent/CN102665480A/en active Pending
- 2010-12-29 CA CA2785452A patent/CA2785452A1/en not_active Abandoned
- 2010-12-29 MX MX2012007111A patent/MX2012007111A/en not_active Application Discontinuation
- 2010-12-29 BR BR112012014896A patent/BR112012014896A2/en not_active IP Right Cessation
- 2010-12-29 WO PCT/US2010/062428 patent/WO2011090758A2/en active Application Filing
- 2010-12-29 US US12/980,851 patent/US20110192410A1/en not_active Abandoned
- 2010-12-29 EP EP10844291.4A patent/EP2519125A4/en not_active Withdrawn
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Also Published As
| Publication number | Publication date |
|---|---|
| AU2010343053A1 (en) | 2012-06-14 |
| CL2012001765A1 (en) | 2012-12-14 |
| MX2012007111A (en) | 2012-07-23 |
| WO2011090758A2 (en) | 2011-07-28 |
| CA2785452A1 (en) | 2011-07-28 |
| US20110192410A1 (en) | 2011-08-11 |
| JP2013514872A (en) | 2013-05-02 |
| KR20120092707A (en) | 2012-08-21 |
| BR112012014896A2 (en) | 2017-03-14 |
| WO2011090758A3 (en) | 2011-12-01 |
| EP2519125A4 (en) | 2014-03-05 |
| EP2519125A2 (en) | 2012-11-07 |
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