CN102636441A - Test evaluation method of LED (light emitting diode) packaging adhesive - Google Patents
Test evaluation method of LED (light emitting diode) packaging adhesive Download PDFInfo
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- CN102636441A CN102636441A CN2012101313983A CN201210131398A CN102636441A CN 102636441 A CN102636441 A CN 102636441A CN 2012101313983 A CN2012101313983 A CN 2012101313983A CN 201210131398 A CN201210131398 A CN 201210131398A CN 102636441 A CN102636441 A CN 102636441A
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Abstract
The invention relates to a test method and particularly a test method of materials. A test evaluation method of an LED (light emitting diode) packaging adhesive comprises the following steps of: step S1, dispensing and solidifying adhesive to form an LED packaging adhesive film, and preparing an LED packaging adhesive film to be tested; step S2, carrying out light transmittance performance test and other physical property tests on the LED packaging adhesive film; step S3, irradiating the LED packaging adhesive film through a lighting emitting device for light energy shock; step S4, carrying out light transmittance performance test and other physical property tests on the LED packaging adhesive film which is subjected to the energy shock in the step S3; and step S5, comparing and analyzing the test result obtained by the step S2 and the test result obtained by the step S4. The test method provided by the invention can be used for performance test of the LED packaging adhesive.
Description
Technical field
The present invention relates to a kind of method of testing, particularly about the method for testing of material.
Background technology
The LED packaging technology has material impact for the LED product.Wherein, mainly be the selection and the allotment of encapsulating structure and packaging plastic about what have the greatest impact in the LED packaging technology.LED encapsulation manufacturer all will carry out a large amount of performance tests to LED after a LED product process of exploitation or moulding.Owing to the wafer of LED generally is that buying comes, wafer manufacturer has accomplished the performance test of wafer, so the test of LED encapsulation manufacturer generally is the test that is directed against LED packaging technology aspect.In the prior art, generally all be to take the LED sample of designing and developing to test to the LED test.Though such test mode is very directly perceived, exist weak point to be: just can test after all need processing sample at every turn, also need arrange corresponding LED driving, assembling, heat abstractor etc. simultaneously, need expend suitable time and cost.Main in addition, this mode also can only test out the whole structure of LED packaging technology.Because in test process; Because other encapsulating materials such as led chip, LED package support, LED fluorescent powder also are in the experimental enviroment; The decay of also can wearing out; So can only analyze the performance variation of integral LED, and can't test out factor or the factor of packaging plastic of encapsulating structure the leading influence factor that rises to the LED packaging technology.Like this, will cause R&D process veryer long.
In addition, some packaging plastic material production firms can carry out some tests to the LED packaging plastic, use to offer LED encapsulation manufacturer.But material manufacturer generally is the test to the material self character about the test of LED packaging plastic; And encapsulation manufacturer is owing to adopt different packaging technologies different to the curing mode of packaging plastic, and this will cause the test data of the LED packaging plastic that packaging plastic material production firm provides not meet fully or some aspect test data can't be used.And packaging plastic material production firm is that testing cost is higher through special machine test to the test of LED encapsulating material.
Summary of the invention
The applicant is to the deficiency of existing LED test; Proposing a kind of method of testing comes the performance of LED packaging plastic is tested; Especially can test and estimate to the performance of the LED packaging plastic that adopts specific LED packaging plastic condition of cure to solidify down in the packaging technology; Thereby can analyze of the influence of LED packaging plastic factor, come technical guidance is carried out in the LED research and development of products in the LED packaging technology.
The present invention adopts following technical scheme:
A kind of test evaluation method of LED packaging plastic comprises the steps:
Step S1 puts glue, solidify to form LED packaging plastic film, prepares LED packaging plastic film to be tested;
Step S2 carries out light transmittance properties test and other physical property tests to LED packaging plastic film;
Step S3 impacts to carry out luminous energy the irradiation of LED packaging plastic film through light-emitting device;
Step S4 will pass through among the step S3 LED packaging plastic film behind the energy impact and carry out light transmittance properties test and other physical properties tests once more;
Step S5 will compare and analyze with the result who tests through step S4 through the result of step S2 test.
Wherein, make through a glue, the usual manners such as spot gluing equipment, spraying equipment, machine cuts that can pass through that solidify to form LED packaging plastic film to be tested among the step S1, also can be undertaken, realize with mode simply fast by a kind of auxiliary mould.
Wherein, among step S2, the step S4 LED packaging plastic film is carried out the light transmittance properties test and can accomplish, also can be undertaken, realize with simple mode by a kind of test fixture through the transmittance testing apparatus of specialty.Among step S2, the step S4 LED packaging plastic film being carried out other physical property tests can comprise: refraction index test, hardness test, pulling strengrth test, expansion coefficient test, or the like.
Wherein, through light-emitting device the irradiation of LED packaging plastic film is impacted to carry out luminous energy among the step S3, can be accomplished, also can be undertaken, realize with simple and reliable mode by a kind of shock-testing case through the luminous energy impact device of specialty.
Further, the luminous energy of described step S3 is impacted and can under varying environment, be carried out, and the simulation meeting of impacting for the environmental aging of LED packaging plastic film is more near actual situation about using.
The test evaluation method of LED packaging plastic of the present invention is to test and estimate to the performance of the LED packaging plastic that adopts specific LED packaging plastic condition of cure to solidify down in the packaging technology; Situation basically identical with the packaging technology of reality; Thereby can reliable analysis go out of the influence of LED packaging plastic factor, thereby come technical guidance is carried out in the LED research and development of products in the LED packaging technology.In addition; The present invention is directed to the preparation of LED packaging plastic film, the light transmittance properties test of LED packaging plastic film, aging can also the realization of energy impact of LED packaging plastic film by some simpler servicing units; And need not to adopt the professional equipment of expensive to carry out, also practiced thrift the cost of test greatly.
Description of drawings
Fig. 1 is the structural representation of a kind of auxiliary mould embodiment of the present invention.
Fig. 2 is the structural representation of a kind of test fixture embodiment of the present invention.
Fig. 3 is the structural representation of a kind of shock-testing case embodiment of the present invention.
Embodiment
Combine accompanying drawing and embodiment that the present invention is further specified at present.
The test evaluation method of LED packaging plastic of the present invention specifically comprises the steps:
Step S1: put glue, solidify to form LED packaging plastic film, prepare LED packaging plastic film to be tested.The condition of cure of the LED packaging plastic film here and the LED product condition of cure in encapsulation manufacturing process is in full accord; The test that just can realize LED packaging plastic film is equal to the performance that adopts the LED packaging plastic under this packaging technology, thereby makes the performance data of the LED packaging plastic that tests out have very high reference significance.
Wherein, make through a glue, the usual manners such as spot gluing equipment, spraying equipment, machine cuts that can pass through that solidify to form LED packaging plastic film to be tested among the step S1, also can be undertaken, realize with mode simply fast by a kind of auxiliary mould.Consult shown in Figure 1ly, this auxiliary mould is superposeed successively by patrix 101, middle mould 102 and counterdie 103 and constitutes, and can pass through screws; Counterdie 103 is a flat board; Middle mould 102 is provided with the die cavity hole 1021 that one or more are used for forming film; Patrix 101 is provided with hole for injecting glue 1011 corresponding to the position in the die cavity hole 1021 of middle mould 102, and each die cavity hole 1021 can be for 1 or 2 above hole for injecting glue 1011.Preferably, for the use of the temperatures involved patrix that prevents the LED packaging plastic 101 and counterdie 103, be arranged on the face of fitting at patrix 101 and counterdie 103 and respectively be provided with the high temperature resistant adhesive tape 1012,1032 of one deck with mould 102.
Step S2: LED packaging plastic film is carried out light transmittance properties test and other physical property tests.
Wherein, among the step S2 LED packaging plastic film is carried out the light transmittance properties test and can accomplish, also can be undertaken, realize with simple mode by a kind of test fixture through the transmittance testing apparatus of specialty.Consult shown in Figure 2; This test fixture is made up of base plate 201 and light conducting cylinder 202; Base plate 201 is provided with a light source 2011; Light conducting cylinder 202 is socketed on the light source 2011 of base plate 201; Described LED packaging plastic film 4 places the port 2021 of light conducting cylinder 202 again, and the light source 2011 of port of light conducting cylinder 202 2021 and base plate 201 has fixed range, and the shape of the LED packaging plastic film 4 that makes among the opening shape of the port 2021 of light conducting cylinder 202 and the step S1 is identical, etc. greatly, thickness is film thickness; Light source 2011 can be that incandescent lamp, LED, Halogen lamp LED etc. are the light source of continuous spectrum at visible light wave range bright dipping spectrum, and abundant at the visible light wave range spectral energy.Test time point bright light source 2011; The spectrum of light source 2011 when being placed with LED packaging plastic film 4 with the test of spectrum testing tool; After removing the LED packaging plastic film 4 of port 2021 of light conducting cylinder 202; Use the spectrum of spectrum testing tool testing light source 2011 once more,, thereby converse the transmittance σ 1 of these LED packaging plastic film 4 each wavelength through the spectrum change of front and back 2 secondary light sources.
Among the step S2 LED packaging plastic film being carried out other physical property tests can comprise: refraction index test, hardness test, pulling strengrth test, expansion coefficient test or the like; Like refractive index by refractometer test LED packaging plastic film; Hardness by the sclerometer test film; Measure pulling strengrth, length growth rate by tautness meter, measure film expansion coefficient parameter etc. by dilatometer.Certain, different LED encapsulation manufacturers can reduce corresponding test event or increase other test events according to the factor in the performance aspect which of required investigation LED packaging plastic.
Step S3: the irradiation of LED packaging plastic film is impacted to carry out luminous energy through light-emitting device.
Wherein, through light-emitting device the irradiation of LED packaging plastic film is impacted and can be accomplished through the luminous energy impact device of specialty to carry out luminous energy among the step S3, also can be undertaken, realize with simple and reliable mode by a kind of shock-testing case.
Preferred, the luminous energy of described step S3 is impacted and can under varying environment, be carried out, and the simulation meeting of impacting for the environmental aging of LED packaging plastic film is more near actual situation about using.Consult shown in Figure 3; This shock-testing case is in a shading casing 3, to be separated out an environmental test cavity 302 and light source cavity 301 between at least; Be provided with the environment change device in the environmental test cavity 302; LED packaging plastic film 4 places in the environmental test cavity 302; Light source cavity 301 is provided with a visible light generating means 3011, and through light leaded light to the environmental test cavity 302 of a cover optical transmission system with visible light generating means 3011, the LED packaging plastic film 5 in the environmental test cavity 302 is carried out luminous energy impact.Optical transmission system in embodiment illustrated in fig. 3 is one group of catoptron 5, in fact can also use prism system or Transmission Fibers to realize light leaded light to the environmental test cavity 302 of visible light generating means 3011 is come LED packaging plastic film 5 is carried out the luminous energy impact through light transmission modes such as reflection, refraction, total reflections.Preferably, in environmental test cavity 302 and through optical lens, changing modes such as light path, coating scattering simultaneously lets light in whole cavity body, evenly distribute.
Preferably, described visible light generating means 3011 can carry out the color of visible light source and the adjusting of brightness, can simulate different luminous energies impacts through changing Different Light.Described environment change device can carry out the adjusting of temperature and humidity; As adopt humidifier and dehumidifier to change humidity; Adopt well heater and refrigerator change temperature, can simulate the test experiments of LED packaging plastic under high temperature, low temperature, high low temperature circulation, high/low-temperature impact, constant environment such as damp and hot.
Step S4: will pass through among the step S3 LED packaging plastic film behind the energy impact and carry out light transmittance properties test and other physical properties tests once more.
Wherein, test converses the transmittance σ 2 of each new wavelength of LED packaging plastic film 4, and other physical parameter, like refractive index, hardness, pulling strengrth, length growth rate examination, expansion coefficient or the like.The mode of test and step S2's is identical, in this no longer repeat specification.
Step S5: will compare and analyze with the result who tests through step S4 through the result of step S2 test.Observation relatively cosmetic variation, the physical dimension of luminous energy test front and back LED packaging plastic film changes, compares transmittance σ 1 and σ 2 variable quantities, can measure parameters such as pulling strengrth, length growth rate, dilatometer measurement film expansion coefficient by refractive index, the hardness of sclerometer test film, the tautness meter of refractometer test film simultaneously.The variation of parameters can be passed judgment on this LED packaging plastic weather resistance quality before and after the contrast experiment.
Although specifically show and introduced the present invention in conjunction with preferred embodiment; But the those skilled in the art should be understood that; In the spirit and scope of the present invention that do not break away from appended claims and limited; Can make various variations to the present invention in form with on the details, be protection scope of the present invention.
Claims (10)
1.LED the test evaluation method of packaging plastic is characterized in that, comprises the steps:
Step S1 puts glue, solidify to form LED packaging plastic film, prepares LED packaging plastic film to be tested;
Step S2 carries out light transmittance properties test and other physical property tests to LED packaging plastic film;
Step S3 impacts to carry out luminous energy the irradiation of LED packaging plastic film through light-emitting device;
Step S4 will pass through among the step S3 LED packaging plastic film behind the energy impact and carry out light transmittance properties test and other physical properties tests once more;
Step S5 will compare and analyze with the result who tests through step S4 through the result of step S2 test.
2. the test evaluation method of LED packaging plastic according to claim 1; It is characterized in that: the some glue among the described step S1, to solidify to form LED packaging plastic film be to be undertaken by auxiliary mould; This auxiliary mould is superposeed successively by patrix, middle mould and counterdie and constitutes; Counterdie is a flat board, and middle mould is provided with one or more die cavity holes that is used for forming film, and patrix is provided with one or more hole for injecting glue corresponding to the position in the die cavity hole of middle mould.
3. the test evaluation method of LED packaging plastic according to claim 2 is characterized in that: described upper die and lower die are arranged on the face of fitting with mould and respectively are provided with the high temperature resistant adhesive tape of one deck.
4. the test evaluation method of LED packaging plastic according to claim 1 and 2 is characterized in that: the condition of cure of LED packaging plastic film and the LED product condition of cure in encapsulation manufacturing process is in full accord among the described step S1.
5. the test evaluation method of LED packaging plastic according to claim 1; It is characterized in that: the light transmittance properties test among described step S2 and the S4 is to be undertaken by test fixture; This test fixture is made up of base plate and light conducting cylinder; Base plate is provided with a light source, and light conducting cylinder is socketed on the light source of base plate, and described LED packaging plastic film places the port of light conducting cylinder again; Test time point bright light source; The spectrum of light source when being placed with LED packaging plastic film with the test of spectrum testing tool; After removing the LED packaging plastic film of light conducting cylinder port; Use the spectrum of spectrum testing tool testing light source once more,, thereby converse the transmittance of this each wavelength of LED packaging plastic film through the spectrum change of front and back 2 secondary light sources.
6. the test evaluation method of LED packaging plastic according to claim 1 is characterized in that: other physical property tests among described step S2 and the S4 comprise: refraction index test, hardness test, pulling strengrth test, expansion coefficient test.
7. the test evaluation method of LED packaging plastic according to claim 1 is characterized in that: the luminous energy of described step S3 is impacted and under varying environment, is carried out.
8. the test evaluation method of LED packaging plastic according to claim 7; It is characterized in that: described step S3 to carry out under varying environment that luminous energy impacts be to be undertaken by the shock-testing case; This shock-testing case is in a shading casing, to be separated out an environmental test cavity and light source cavity between at least; Be provided with the environment change device in the environmental test cavity, LED packaging plastic film places in the environmental test cavity, and the light source cavity is provided with a visible light generating means; And, the LED packaging plastic film in the environmental test cavity is carried out luminous energy impact through light leaded light to the environmental test cavity of a cover optical transmission system with the visible light generating means.
9. the test evaluation method of LED packaging plastic according to claim 8 is characterized in that: described visible light generating means can carry out the color of visible light source and the adjusting of brightness.
10. the test evaluation method of LED packaging plastic according to claim 8 is characterized in that: described environment change device can carry out the adjusting of temperature and humidity.
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| CN201210131398.3A CN102636441B (en) | 2012-05-02 | 2012-05-02 | Test evaluation method of LED (light emitting diode) packaging adhesive |
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| CN201210131398.3A CN102636441B (en) | 2012-05-02 | 2012-05-02 | Test evaluation method of LED (light emitting diode) packaging adhesive |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104384068A (en) * | 2014-11-03 | 2015-03-04 | 方小刚 | LED dispensing and packaging device with position sensor and alarm |
| CN104849677A (en) * | 2014-02-17 | 2015-08-19 | 浙江云时代光电科技有限公司 | Method for testing service life of LED lamp |
| CN105424614A (en) * | 2015-12-20 | 2016-03-23 | 合肥艾斯克光电科技有限责任公司 | Performance test method of LED package glue |
| CN105575842A (en) * | 2015-12-20 | 2016-05-11 | 合肥艾斯克光电科技有限责任公司 | Testing method for LED packaging adhesive |
| CN105642508A (en) * | 2015-12-20 | 2016-06-08 | 合肥艾斯克光电科技有限责任公司 | LED glue injecting and testing all-in-one machine |
| CN106525391A (en) * | 2015-09-11 | 2017-03-22 | 常州市武进区半导体照明应用技术研究院 | Accelerated aging system and transmissivity test method for optical component |
| CN106784367A (en) * | 2016-12-20 | 2017-05-31 | 杭州市质量技术监督检测院 | Integrated watertight OLED flat-plate light sources and preparation method thereof |
| CN108645370A (en) * | 2018-04-27 | 2018-10-12 | 厦门多彩光电子科技有限公司 | A kind of method of calibration and calibration equipment of the packaging plastic coefficient of expansion |
| CN109596320A (en) * | 2018-11-29 | 2019-04-09 | 江西省晶瑞光电有限公司 | Fluorescent film piece performance test method and fluorescence diaphragm Central Plains material match the method for determination |
| CN109655432A (en) * | 2018-11-29 | 2019-04-19 | 江西省晶瑞光电有限公司 | Transparent silica gel performance test methods |
| CN113418837A (en) * | 2021-06-10 | 2021-09-21 | 厦门多彩光电子科技有限公司 | Method for evaluating quality of ultraviolet LED packaging adhesive |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104849677A (en) * | 2014-02-17 | 2015-08-19 | 浙江云时代光电科技有限公司 | Method for testing service life of LED lamp |
| CN104384068A (en) * | 2014-11-03 | 2015-03-04 | 方小刚 | LED dispensing and packaging device with position sensor and alarm |
| CN106525391A (en) * | 2015-09-11 | 2017-03-22 | 常州市武进区半导体照明应用技术研究院 | Accelerated aging system and transmissivity test method for optical component |
| CN105424614A (en) * | 2015-12-20 | 2016-03-23 | 合肥艾斯克光电科技有限责任公司 | Performance test method of LED package glue |
| CN105575842A (en) * | 2015-12-20 | 2016-05-11 | 合肥艾斯克光电科技有限责任公司 | Testing method for LED packaging adhesive |
| CN105642508A (en) * | 2015-12-20 | 2016-06-08 | 合肥艾斯克光电科技有限责任公司 | LED glue injecting and testing all-in-one machine |
| CN106784367A (en) * | 2016-12-20 | 2017-05-31 | 杭州市质量技术监督检测院 | Integrated watertight OLED flat-plate light sources and preparation method thereof |
| CN108645370A (en) * | 2018-04-27 | 2018-10-12 | 厦门多彩光电子科技有限公司 | A kind of method of calibration and calibration equipment of the packaging plastic coefficient of expansion |
| CN109596320A (en) * | 2018-11-29 | 2019-04-09 | 江西省晶瑞光电有限公司 | Fluorescent film piece performance test method and fluorescence diaphragm Central Plains material match the method for determination |
| CN109655432A (en) * | 2018-11-29 | 2019-04-19 | 江西省晶瑞光电有限公司 | Transparent silica gel performance test methods |
| CN109596320B (en) * | 2018-11-29 | 2021-06-29 | 江西省晶能半导体有限公司 | Fluorescent membrane performance testing method and method for determining raw material ratio in fluorescent membrane |
| CN113418837A (en) * | 2021-06-10 | 2021-09-21 | 厦门多彩光电子科技有限公司 | Method for evaluating quality of ultraviolet LED packaging adhesive |
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| CN102636441B (en) | 2014-04-30 |
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Address after: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee after: Xiamen Hualian electronic Limited by Share Ltd Address before: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee before: Xiamen Hualian Electronics Co., Ltd. |