CN102629562A

CN102629562A - Base plate processing device and base plate processing system

Info

Publication number: CN102629562A
Application number: CN2012100017357A
Authority: CN
Inventors: 西城洋志; 小林宽
Original assignee: Yamaha Motor Co Ltd
Current assignee: Yamaha Motor Co Ltd
Priority date: 2011-02-02
Filing date: 2012-01-05
Publication date: 2012-08-08
Anticipated expiration: 2032-01-05
Also published as: JP5190127B2; CN102629562B; KR101314142B1; KR20120089576A; JP2012160627A

Abstract

The invention provides a base plate processing device and a base plate processing system. An assembling machine (10) (the base plate processing device) restrains the increase of total time necessary for executing designated processing on a base plate of an object to be processed and determines bad mark information of each vice base plates possessed by the base plate of an object to be processed by no means of special equipment. The assembling machine (10) comprises a base plate recognition camera (13b) and a controller (19); based on damage mark information representing whether to provide a damage mark (BM) for single sheet base plates (50a), the controller (19) makes the base plate recognition camera (13b) control shooting order by a way of shooting the single sheet base plates (50a) according to multichip splicing base plates (50) which are easy to determine objects to be processed, and accordingly the multichip splicing base plates (50) of objects to be processed are determined and the damage mark information of the multichip splicing base plates (50) of objects to be processed are determined.

Description

Substrate board treatment and base plate processing system

Technical field

The present invention relates to substrate board treatment and base plate processing system, particularly each substrate in a plurality of substrates that have a plurality of auxiliary substrates is respectively carried out the substrate board treatment and the base plate processing system of the processing of appointment.

Background technology

In the past, it is known each substrate in a plurality of substrates that have a plurality of auxiliary substrates respectively to be carried out the substrate board treatment of processing of appointments such as installation of printing, electronic component of scolder.

Generally speaking, when utilizing substrate board treatment that a plurality of substrates are carried out the processing of appointment, sometimes each auxiliary substrate in a plurality of auxiliary substrates that each substrate had in these a plurality of substrates had the bad bad mark (damage mark) of this auxiliary substrate of expression.In this case, aforesaid substrate board treatment in the past on the other hand, does not carry out the processing of appointment to do not carry out the processing of appointment with the auxiliary substrate of bad mark to the auxiliary substrate with bad mark.At this; For aforesaid substrate board treatment in the past; When the substrate to process object carries out the processing of appointment; Because all auxiliary substrates in a plurality of auxiliary substrates that substrate had of process object are confirmed whether have bad mark one by one, need whether confirm representing each auxiliary substrate in a plurality of auxiliary substrates with the bad label information of bad mark.Therefore, the problem that the required total ascent time of processing that exists substrate to process object to carry out appointment increases.

Therefore; In order to eliminate aforesaid problem; A kind ofly all auxiliary substrates in a plurality of auxiliary substrates that substrate had of process object are not confirmed whether have bad mark (damage mark) one by one even proposed; Also can confirm the substrate board treatment (for example, with reference to patent documentation 1) of the bad label information (damage label information) of each auxiliary substrate in a plurality of auxiliary substrates.

In above-mentioned patent documentation 1, the production method of the circuit substrate of a kind of use component mounter (substrate board treatment) is disclosed, this component mounter carries out the installation treatment of element to each substrate in a plurality of substrates that have a plurality of patterns (auxiliary substrate) respectively.Under the production method of this circuit substrate, to the IC tag of each substrate in a plurality of substrates with each substrate that is used for distinguishing these a plurality of substrates.In addition, utilize the IC tag keymake that the damage label information (bad label information) of each pattern of substrate is write this IC tag.In addition, the component mounter of record reads the IC tag of the substrate of process object through utilizing the IC tag reader in this patent documentation 1 when substrate is carried out the processing of installation elements, confirms the damage label information of each pattern of the substrate of process object.

Patent documentation 1: Japan Patent open communique spy open 2006-93349 number

; Component mounter (substrate board treatment) for record in above-mentioned patent documentation 1; Existence need be provided with the problem of special equipments such as IC tag reader, IC tag keymake for the damage label information (bad label information) of each pattern in a plurality of patterns (auxiliary substrate) that substrate had of confirming process object.

Summary of the invention

The present invention proposes in order to solve aforesaid problem; One of the object of the invention is: the required total ascent time of the processing that provides a kind of substrate that can suppress process object to carry out appointment increases, and substrate board treatment and base plate processing system that special equipment just can be confirmed the bad label information of each auxiliary substrate in a plurality of auxiliary substrates that substrate had of process object are not set.

To achieve these goals; Substrate board treatment involved in the present invention carries out the processing of appointment to each substrate in a plurality of substrates that have a plurality of auxiliary substrates respectively; Comprise: image pickup part, each auxiliary substrate in a plurality of auxiliary substrates that substrate had of process object is taken; And control part; Shooting action to image pickup part is controlled; Wherein, Control part based on expression whether on each auxiliary substrate in a plurality of auxiliary substrates that each substrate had in a plurality of substrates with the bad label information of bad mark; Shooting order through controlling a plurality of auxiliary substrates is so that image pickup part is that the order of which substrate in a plurality of substrates is taken a plurality of auxiliary substrates that substrate had of process object by the substrate of confirming process object easily, and the substrate that comes to confirm process object thus is which substrate in a plurality of substrates, and the bad label information of a plurality of auxiliary substrates that substrate had of definite determined process object.

For substrate board treatment involved in the present invention; As stated; Control part is set; This control part based on expression whether on each auxiliary substrate in a plurality of auxiliary substrates that each substrate had in a plurality of substrates with the bad label information of bad mark, control the shooting order of a plurality of auxiliary substrates so that image pickup part is that the order of which substrate in a plurality of substrates is taken a plurality of auxiliary substrates that substrate had of process object by the substrate of confirming process object easily.Thus; Because the shooting of a plurality of auxiliary substrates that substrate had of process object is set to the order of confirming substrate easily in proper order; Even all a plurality of auxiliary substrates are not taken successively so do not make image pickup part; Only through taking a part of auxiliary substrate in a plurality of auxiliary substrates, the substrate that also can confirm process object is which substrate in a plurality of substrates, and can confirm the bad label information of each auxiliary substrate in a plurality of auxiliary substrates that substrate had of determined process object.In addition; Because can utilize control part carry out process object substrate confirm and a plurality of auxiliary substrates that substrate had of process object in the confirming of bad label information of each auxiliary substrate, so need not to be provided with in addition confirming and the specialized apparatus of confirming of the bad label information of auxiliary substrate of the substrate that carries out process object.Consequently can suppress the substrate of process object is carried out the required total ascent time increase of processing of appointment, and need not to be provided with in addition the bad label information that specialized apparatus just can be confirmed each auxiliary substrate in a plurality of auxiliary substrates that substrate had of process object.

According to described substrate board treatment; Comparatively it is desirable to; Control part is based on the bad label information group of each auxiliary substrate in the bad label information of a plurality of auxiliary substrates that each substrate had in a plurality of substrates, corresponding; Shooting order through controlling a plurality of auxiliary substrates is so that image pickup part is that the order of which substrate in a plurality of substrates is taken a plurality of auxiliary substrates that substrate had of process object by the substrate of confirming process object easily; The substrate that comes to confirm process object thus is which substrate in a plurality of substrates, and confirms the bad label information of a plurality of auxiliary substrates that substrate had of determined process object.According to constituting as described above; Through the bad label information group of comparison by bad label information with the corresponding auxiliary substrate of a plurality of substrates of the captured auxiliary substrate of the image pickup part of the substrate of process object, thereby the substrate that can confirm process object easily is which substrate in a plurality of substrates.

In this case; Comparatively it is desirable to; Control part is in the bad label information group of each auxiliary substrate of the correspondence of a plurality of substrates; On all auxiliary substrates of correspondence in a plurality of auxiliary substrates that each substrate had in a plurality of substrates all under the situation with bad mark, or corresponding all auxiliary substrates all with under the situation of bad mark; Control the shooting action of said image pickup part, the auxiliary substrate of the correspondence in a plurality of auxiliary substrates that substrate had of process object is got rid of from the reference object of image pickup part.According to constituting as described above; In the bad label information group of each auxiliary substrate of the correspondence of a plurality of substrates; Through from the reference object of image pickup part, getting rid of all auxiliary substrate and whole auxiliary substrate of having bad mark with bad mark; Thereby can reduce quantity, so can confirm that the substrate of process object is which substrate in a plurality of substrates with less shooting number of times as the auxiliary substrate of the reference object of image pickup part.

According to the substrate board treatment of controlling the shooting order of a plurality of auxiliary substrates based on the bad label information group of each auxiliary substrate of the correspondence of above-mentioned a plurality of substrates; Comparatively it is desirable to; Control part is controlled the shooting action of said image pickup part; So that image pickup part is in the bad label information group of each auxiliary substrate of the correspondence of a plurality of substrates, in the auxiliary substrate of the correspondence from a plurality of auxiliary substrates that each substrate had a plurality of substrates, begin successively each auxiliary substrate in a plurality of auxiliary substrates that substrate had of process object to be taken with the corresponding auxiliary substrate of auxiliary substrate that the quantity of not having the auxiliary substrate of bad mark differs bigger with quantity with the auxiliary substrate of bad mark.As stated; In the bad label information group of each auxiliary substrate of the correspondence of a plurality of substrates; Then can determine whether it is the substrate of process object if be conceived to shooting number of times still less with the quantity of the auxiliary substrate of bad mark and the bad label information group that differs bigger auxiliary substrate with the quantity of the auxiliary substrate of bad mark.

According to described substrate board treatment, comparatively it is desirable to, control part exists in a plurality of substrates under the situation of a plurality of candidate item of substrate of process object, preferentially confirm in a plurality of candidate item of substrate of process object, bad label information substrate the earliest.At this, a plurality of substrates that utilize substrate board treatment to carry out the processing of appointment become the possibility height of the process object of substrate board treatment with bad label information order early.In this case, for the present invention, because preferentially confirm can be from the possibility of the process object that the becomes substrate board treatment high candidate item, so can confirm the substrate of process object with higher efficient.In this case; Comparatively it is desirable to; Control part is got rid of the substrate of the candidate item of the substrate of confirming as process object under the inconsistent situation of bad label information of bad label information with the captured corresponding auxiliary substrate of auxiliary substrate of substrate and the image pickup part of substrate process object of the candidate item of the substrate of confirming as process object by the captured auxiliary substrate of the image pickup part of the substrate of process object from the candidate item of the substrate of process object.According to constituting as described above; Through from the candidate item of the substrate of process object, getting rid of the bad label information of corresponding auxiliary substrate and the inconsistent substrate of substrate of process object; Because can dwindle the scope of candidate item of the substrate of process object, so can confirm the substrate of process object with being more prone to.

In addition; Comparatively it is desirable to; Said control part; A plurality of substrates are obtained data set, and this data set comprises the workpiece identifier of discerning said substrate uniquely, confirm block address and the said bad label information of said fixed said each auxiliary substrate of the coordinate of said auxiliary substrate to each workpiece identifier; The a plurality of bad label information that said data set comprised is carried out the grouping as group according to this each block address; To said each group, the selected bad label information that can confirm the workpiece identifier that this data set comprised uniquely; And let the auxiliary substrate of the said image pickup part pair block address corresponding take with selected bad label information; Contrast this bad label information and the bad label information of confirming from said data centralization; Carry out repeatedly said selected and contrast action up to the bad label information of captured auxiliary substrate with till the bad label information of confirming from data centralization is consistent, and from said data centralization definite with as the consistent workpiece identifier of the substrate of process object.For this mode; Confirm the substrate of process object through a plurality of substrates (workpiece identifier); Block address according to each auxiliary substrate is divided into groups as group to a plurality of bad label informations, in group, begins to contrast successively auxiliary substrate from the bad label information that can confirm uniquely, therefore; The bad label information that is grouped into each group plays a role as the filter that reduces in order to confirm substrate information necessary amount, can from a plurality of substrates, confirm the substrate of process object expeditiously.

In addition, in this case, comparatively it is desirable to, control part is got rid of selected related bad label information and the update group of workpiece identifier from data centralization at every turn when confirming workpiece identifier.Therefore; After confirming and contrasting bad label information; Even produce inconsistent, when selected substrate (workpiece identifier) as next candidate item, because from the bad label information of each group, got rid of the related bad label information of inconsistent substrate (workpiece identifier); So in each group, existence can confirm uniquely that the probability of the bad label information of workpiece identifier increases.

In addition, comparatively it is desirable to, control part is detecting under the situation of a plurality of bad label informations, in preferentially selected this bad label information, bad label information the earliest.For this mode, because preferentially confirm can be from the possibility of the process object that the becomes substrate board treatment high candidate item, so can confirm the substrate of process object with higher efficient.In addition, the present invention is a kind of base plate processing system, comprising: the 1st substrate board treatment, carry out the processing of appointment to each substrate in a plurality of substrates that have a plurality of auxiliary substrates respectively; The 2nd substrate board treatment, each substrate in a plurality of said substrate that said the 1st substrate board treatment was handled carries out the processing of follow-up appointment; Server, storage representation whether on each auxiliary substrate in the said a plurality of auxiliary substrates that each substrate had in said a plurality of substrates with the bad label information of bad mark; Communication unit communicates so that said the 1st substrate board treatment and said the 2nd substrate board treatment can be shared said bad label information said bad label information; And image pickup part; Each auxiliary substrate in said a plurality of auxiliary substrates that said substrate had of process object is taken; Wherein, In said the 2nd substrate board treatment and the said server any one is based on said bad label information; Shooting order through controlling said a plurality of auxiliary substrates is so that said image pickup part is that the order of which substrate in said a plurality of substrate is taken said a plurality of auxiliary substrates that substrate had of said process object by the substrate of confirming said process object easily; The substrate that comes to confirm said process object thus is which substrate in said a plurality of substrate, and confirms the said bad label information of said a plurality of auxiliary substrates that substrate had of determined said process object.For this mode; Because the shooting of a plurality of auxiliary substrates that substrate had of process object is set to the order of confirming substrate easily in proper order; Even all a plurality of auxiliary substrates are not taken successively so do not make image pickup part; Only through taking a part of auxiliary substrate in a plurality of auxiliary substrates, the substrate that also can confirm process object is which substrate in a plurality of substrates, and can confirm the bad label information of each auxiliary substrate in a plurality of auxiliary substrates that substrate had of determined process object.In addition; Because can utilize control part carry out process object substrate confirm and a plurality of auxiliary substrates that substrate had of process object in the confirming of bad label information of each auxiliary substrate, so need not to be provided with in addition confirming and the specialized apparatus of confirming of the bad label information of auxiliary substrate of the substrate that carries out process object.Consequently can suppress the substrate of process object is carried out the required total ascent time increase of processing of appointment, and need not to be provided with in addition the bad label information that specialized apparatus just can be confirmed each auxiliary substrate in a plurality of auxiliary substrates that substrate had of process object.In addition, confirming that from a plurality of substrates the processing of substrate both can be the mode of being carried out by the 2nd substrate board treatment, perhaps also can be the mode of being carried out by server.Storing process particularly is installed in server, and server is carried out under the situation of the processing of from a plurality of substrates, confirming substrate, need not to carry out the transmission/reception of data set, can alleviate communication load and make the processing high speed.

The base plate processing system related according to comparatively desirable mode; The 1st substrate board treatment; Through each auxiliary substrate as a plurality of substrates of process object is taken; The recognition result of the bad mark of the assigned address that invests each auxiliary substrate in advance is created as the message file of this each substrate, and sends the message file of creating to server.As stated, can utilize server to realize the unified management of bad label information.

Description of drawings

Fig. 1 is the figure of structure of the base plate processing system of the expression fitting machine that comprises first to the 3rd execution mode of the present invention.

Fig. 2 is the vertical view of an example of the multi-disc splicing substrate of the expression fitting machine of being moved into first to the 3rd execution mode of the present invention.

Fig. 3 be illustrated in be connected in of the present invention first and the server of the fitting machine of the 3rd execution mode in the chart of an example of institute's stored damaged label information table.

Fig. 4 is the vertical view of structure of the fitting machine of expression first to the 3rd execution mode of the present invention.

Fig. 5 is the block diagram of structure of the fitting machine of expression first to the 3rd execution mode of the present invention.

Fig. 6 is the figure of the fitting machine service failure label information table that is used to the to explain first execution mode of the present invention definite step when confirming the multi-disc splicing substrate of process object.

Fig. 7 is the flow chart that is used to explain the control action of the controller the when fitting machine that utilizes first execution mode of the present invention carries out the installation of element.

Fig. 8 is the flow chart of detailed content of definite processing that is used for explaining the damage label information of the substrate of carrying out at flow chart shown in Figure 5.

Fig. 9 is the chart that is illustrated in an example of institute's stored damaged label information table in the server of the fitting machine that is connected in second execution mode of the present invention.

Figure 10 is the fitting machine service failure label information table that is used to the to explain second execution mode of the present invention figure of definite sequence really when confirming the multi-disc splicing substrate of process object.

Figure 11 is the flow chart that is used to explain the control action of the controller the when fitting machine that utilizes second execution mode of the present invention carries out the installation of element.

Figure 12 is the flow chart of detailed content of definite processing that is used for explaining the damage label information of the substrate of carrying out at flow chart shown in Figure 11.

Figure 13 is ER (Entity Relationship, the entity relationship) figure of the storage example of the damage label information in expression first execution mode.

Figure 14 is the flow chart of the control action of the fitting machine that is used to explain the variation of utilizing first execution mode controller when carrying out the installation of element.

Figure 15 is the flow chart of detailed content of definite processing that is used for explaining the damage label information of the substrate of carrying out at flow chart shown in Figure 14.

Embodiment

Below, based on description of drawings execution mode of the present invention.

(first execution mode)

At first, referring to figs. 1 through Fig. 3, the structure of the base plate processing system 1 of the fitting machine 10 that comprises first execution mode of the present invention is described.In addition, fitting machine 10 is examples of " substrate board treatment " of the present invention.

As shown in Figure 1, base plate processing system 1 comprises printing machine 2, inspection machine 3 and fitting machine 10.This base plate processing system 1 is the system that each printed circuit board (PCB) in a plurality of printed circuit board (PCB)s of conveyance on substrate transferring path 4 (multi-disc splicing substrate 50) is carried out the installation of element (electronic components such as IC, transistor, capacitor and resistance).At this, multi-disc splicing substrate 50 is meant the printed circuit board (PCB) that is made up of the combination of the plural printed circuit board (PCB) (monolithic substrate 50a) of the electronic circuit that is formed with one or more.Aforesaid multi-disc splicing substrate 50 is handled as single printed circuit board (PCB), afterwards, is divided into plural printed circuit board (PCB) (monolithic substrate 50a) and uses.

For first execution mode, as shown in Figure 2, on multi-disc splicing substrate 50, dividing has 9 pieces, and each piece constitutes the monolithic substrate 50a that is formed with identical electronic circuit (not shown) respectively.Each monolithic substrate 50a utilizes the block address (A1, A2, A3, B1, B2, B3, C1, C2 and C3) that can be discerned to each multi-disc splicing substrate 50 by computer, can confirm the coordinate of each the monolithic substrate 50a on each multi-disc splicing substrate 50.Below, for the ease of explanation, the example that conveyance on substrate transferring path 4 is had 5 multi-disc splicing substrates 50 of these 9 monolithic substrate 50a respectively describes.In addition, multi-disc splicing substrate 50 is examples of " substrate " of the present invention, and monolithic substrate 50a is an example of " auxiliary substrate " of the present invention.

As shown in Figure 1; Printing machine 2 is to the scolder of each multi-disc splicing substrate 50 printing (coatings) in 5 multi-discs splicing substrates 50 of conveyance on substrate transferring path 4 with the corresponding appointed pattern in installation site of element, and the multi-disc after the printing solder is spliced substrate 50 device of side (inspection machine 3) device of taking out of downstream.For first execution mode, whether each electronic circuit that printing machine 2 has each a monolithic substrate 50a that checks that respectively multi-disc splicing substrate 50 is had exists the function of defective.Particularly, printing machine 2 is taken through each monolithic substrate 50a that multi-disc splicing substrate 50 is had, and whether identification has the mark BM (with reference to Fig. 2) of damage at the assigned address of each monolithic substrate 50a.Aforesaid damage mark BM is additional by the producer of multi-disc splicing substrate 50.For example, be with damaging mark BM on the piece of A2, B1, B3 and C2 in the block address of the multi-disc of Fig. 2 splicing substrate 50.In addition, damaging mark BM is an example of " bad mark " of the present invention.

In addition; Printing machine 2 will be created as the message file of each multi-disc splicing substrate 50 to the recognition result of the damage mark BM of each monolithic substrate 50a of above-mentioned 5 multi-discs splicing substrate 50, and send the message file of creating to the damage label information storage server that is connected in printing machine 25.

With reference to Figure 13, damage the monolithic substrate table 602 that label information storage server 5 stores multi-disc splicing substrate table 601 and is associated with multi-disc splicing substrate table 601, the processing substrate information of the data of the message file that sends as accumulation printing machine 2.At this, " table " is meant in Database Systems, preserves the data acquisition system of data with two-dimensional matrix (row and column), in following explanation, the project of showing (field) is called row, and the implementation value of showing (distributing to the value of the reality of row) is called row.In addition, in the drawings, (PK) the expression primary keyword (FK) is represented outside keyword.Primary keyword has in table the capable identified attributes uniquely of carrying out.Outside keyword is used for reference to having the data of the table of this primary keyword through having identical value with primary keyword.And, the relation (contact) between the arrow among the figure is represented, expression is arranged in the outside keyword of table of terminal point side of arrow with reference to the primary keyword of the table of the starting point side that is arranged in arrow.In addition, will be called radix (cardinality) at the corresponding relation of primary keyword between two tables and outside keyword, arrow is represented the situation that starting point is 0 or 1, terminal point has a plurality of radixes.

Multi-disc splicing substrate table 601 be with workpiece identifier as primary keyword, the table of the required project of the processing of multi-disc splicing substrates 50 such as sign has been installed in storage.In this substrate table 601, preserve by the relevant information of printing machine 2 multi-discs splicing that send and conveyance on substrate transferring path 4 substrate 50.It is to represent to install whether the row that multi-disc is spliced boolean (Boolean) type of substrate 50 that sign has been installed.

Monolithic substrate table 602 is the tables that carry out association with the radix of one-to-many with respect to multi-disc splicing substrate table 601; With workpiece identifier is outside keyword; Be numbered primary keyword with manufacturing, have the row that comprise { sign is got rid of in block address, damage label information, timestamp, shooting }.

Block address is the row that are kept at the block address of a plurality of monolithic substrate 50a that each multi-disc splicing substrate 50 of conveyance is had on the substrate transferring path 4.

Damage label information store expression whether each the monolithic substrate 50a in each monolithic substrate 50a with the information of OK that damages mark BM (do not have and damage mark) or NG (the damage mark is arranged) (below be called damage label information).

In the timestamp, store the moment of the damage mark BM of each monolithic substrate 50a of identification as the timestamp that damages label information.

Take to get rid of and indicate it is in definite step of stating after being illustrated in, the row of the Boolean type of the monolithic substrate that need not take.

For first execution mode, the message file based on printing machine 2 sends generates damage label information table 60 as shown in Figure 3 from the aforesaid substrate process information.Damaging label information table 60 is the multi-disc splicing substrates to appointment, utilizes and damages information storage server 5, makes each table 601,602 of Figure 13 connect an example of the data set of (Natural Join) and generation naturally.Damage the workpiece that label information table 60 comprised and determine, promptly for example through being that the workpiece of vacation (False) determines with the value that sign is installed of timestamp selective sequential multi-disc splicing substrate table 601 with predefined number by following mode.At this, as shown in Figure 1, damage label information storage server 5 and not only be connected with printing machine 2, also be connected with inspection machine 3 with fitting machine 10.That is, damaging label information table 60 is shared between printing machine 2, inspection machine 3 and fitting machine 10 via damaging label information storage server 5.In addition, in following explanation, also will damage the multi-disc splicing substrate that label information table 60 comprised and be called workpiece.In embodiment illustrated, utilize the workpiece identifier of multi-disc splicing substrate table 601, for example can discern workpiece uniquely with workpiece 1, workpiece 2, workpiece 3, workpiece 4 and workpiece 5 such forms.

With reference to Fig. 1, inspection machine 3 is devices of checking the printing state of the scolder that the multi-disc splicing substrate of moving into from the device (printing machine 2) of upstream side 50 is printed.This inspection machine 3 normally is printed under the situation on the multi-disc splicing substrate 50 being judged as scolder; This multi-disc splicing substrate 50 is taken out of the device (fitting machine 10) in downstream; On the other hand; Normally be not printed under the situation on the multi-disc splicing substrate 50 being judged as scolder, this multi-disc splicing substrate 50 do not taken out of fitting machine 10.

Fitting machine 10 is the devices to each multi-disc splicing substrate 50 installation elements in a plurality of multi-disc splicing substrates 50 of conveyance on substrate transferring path 4.Each monolithic substrate 50a installation elements of multi-disc that 10 pairs of devices from upstream side of this fitting machine (inspection machine 3) are moved into splicing substrate 50, and the splicing of the multi-disc behind installation elements substrate 50 taken out of the device ((not shown) such as reflow soldering apparatus that element is welded) in downstream.

Then, with reference to Fig. 4 and Fig. 5, the concrete structure of the fitting machine 10 of first execution mode of the present invention is described.

As shown in Figure 4, fitting machine 10 comprises pedestal 11, substrate transferring band 12 and head unit 13.

On pedestal 11, be provided with 4 belt

element supply departments

14 and 2 component recognition video cameras 15.2 belt element supply departments 14 in 4 belt element supply departments 14 are located at the end of the arrow Y1 direction side on the pedestal 11.In addition, remaining 2 belt element supply department 14 is located at the end of the arrow Y2 direction side on the pedestal 11.In addition, arrow Y1 direction side and the arrow Y2 direction side of 2 component recognition video cameras 15 on pedestal 11 is provided with one respectively.

In 4 belt element supply departments 14, a plurality of belt feeders 16 of holding element are arranged along directions X respectively and are provided with.These a plurality of belt feeders 16 are supplied element via the element taking-up 16a of portion of front end respectively.

Component recognition video camera 15 is set at the height and position of the below of the head unit 13 on the pedestal 11.In addition, the shooting direction of component recognition video camera 15 is towards the top.In addition, component recognition video camera 15 can be taken the element through the adsorption head 13a absorption of stating behind the head unit 13 from lower face side.

Substrate transferring band 12 has a pair of conveyer belt 12a of portion that arranges along the Y direction, and extends setting at pedestal 11 upper edge directions Xs.This substrate transferring band 12 constitutes the part in the substrate transferring path 4 (with reference to Fig. 1) of 5 multi-disc splicings of conveyance substrate 50.Particularly; Substrate transferring band 12 will be fixed on the installation exercise position of appointment from the multi-disc splicing substrate 50 that the device (inspection machine 3) that is positioned at arrow X2 direction side (upstream side) is moved into; And the multi-disc splicing substrate 50 after the installation exercise end is taken out of to the device that is positioned at arrow X1 direction side (downstream) (reflow soldering apparatus that for example, element is welded etc.).

Head unit 13 can move on directions X along the head unit support 17 that extends along directions X on the height and position of the appointment above the pedestal 11.Particularly, head unit support 17 has along the ball-screw 17a of directions X extension and the servomotor 17b (X axle motor (with reference to Fig. 5)) that makes ball-screw 17a rotation.Ball-screw 17a is through this servomotor 17b rotation, thereby head unit 13 moves along directions X with respect to head unit support 17.In addition, head unit 13 has the ball nut (not shown) that is screwed together in ball-screw 17a.

In addition, head unit support 17 can move on the Y direction along pair of guide rails portion 18, and this pair of guide rails portion 18 is arranged on the pedestal 11 and along the Y direction with the mode of crossing over substrate transferring band 12 extends.Particularly, pair of guide rails portion 18 has along a pair of ball-screw 18a of Y direction extension and a pair of servomotor 18b (Y axle motor (with reference to Fig. 5)) that makes a pair of ball-screw 18a rotation.Through these servomotors 18b a pair of ball-screw 18a is rotated synchronously, thereby head unit support 17 move on the Y direction with respect to pair of guide rails portion 18.In addition, head unit support 17 has the ball nut (not shown) that is screwed together in ball-screw 18a.Thus, head unit 13 in the top of multi-disc splicing substrate 50 (substrate transferring band 12), the position of the top of the top of the belt feeder 16 (the element taking-up 16a of portion) of belt element supply department 14 and component recognition video camera 15 can move horizontally.

In addition, on head unit 13, be provided with 4 the adsorption head 13a that are spaced setting that on directions X, separate appointment.On each adsorption head 13a, the suction nozzle (not shown) that is used for carrying out at front end (lower end) absorption and the lift-launch of element is installed downwards with outstanding mode.In addition, on each adsorption head 13a, be provided with make suction nozzle along the vertical direction (Z direction) mobile servomotor (Z axle motor (with reference to Fig. 5)), to make suction nozzle be the servomotor (R axle motor (with reference to Fig. 5)) etc. of center rotation with it.Through such structure; Head unit 13 can move along the XY direction above pedestal 11; Thereby, and the element of absorption is installed on the multi-disc splicing substrate 50 of the process object on the substrate transferring band 12 from the element taking-up 16a of the portion absorptive element of belt feeder 16.

In addition, at the sidepiece of the arrow X1 of head unit 13 direction side, be provided with the substrate identification video camera 13b that each the monolithic substrate 50a among 9 monolithic substrate 50a that can be had the multi-disc splicing substrate 50 of process object takes.In addition, the shooting direction of substrate identification video camera 13b is towards the below.This substrate identification video camera 13b takes each monolithic substrate 50a that multi-disc splicing substrate 50 is had from upper surface side when installation elements.In addition, the photographic images of this substrate identification video camera 13b uses when the controller of stating after the utilization 19 carries out whether on monolithic substrate 50a, having the identification that damages mark BM.In addition, substrate identification video camera 13b is an example of " image pickup part " of the present invention.

The action of fitting machine 10 is through controller shown in Figure 5 19 controls.Control part 19 comprises arithmetic processing section 19a, storage part 19b, motor control part 19c, the outside input and output 19d of portion, image processing part 19e and Department of Communication Force 19f.In addition, controller 19 has the display unit 19g that is made up of liquid crystal indicator etc.In addition, controller 19 is examples of " control part " of the present invention.

Arithmetic processing section 19a carries out the control of controller 19 integral body.In addition, various programs through execution such as arithmetic processing section 19a of storage part 19b storage, via after the damage label information table 60 (with reference to Fig. 3) that obtains of the Department of Communication Force 19f that states etc.In addition, motor control part 19c control is used to make the driving of the motor (servomotor 17b, servomotor 18b, Z axle motor and R axle motor) of head unit 13 actions.In addition, the outside input and output 19d of portion is connected in various transducers and the retainer that is arranged in the fitting machine 10.In addition, image processing part 19e carries out image processing to the photographed data that utilizes substrate identification video camera 13b, component recognition video camera 15 to take.In addition, Department of Communication Force 19f is connected in and stores the damage label information storage server 5 that damages label information table 60.

At this, for first execution mode, controller 19 is carried out the processing of the multi-disc splicing substrate 50 of from a plurality of workpiece 1 to 5 that damage label information table 60 is comprised, confirming process object and the processing of from the workpiece of confirming, confirming the damage label information.

Usually, in the system of the information of a server of a plurality of nodes sharing, set up two-phase lock system (Two-Phase Locking System), guarantee the unified integrality (so-called ACID characteristic) of data.Therefore, if with reference to the data of damaging label information storage server 5, then definite multi-disc splicing substrate 50 that comes from the upstream process conveyance is that which substrate a plurality of multi-disc splicing substrates 50 is possible in theory., in the system of reality, in the substrate manufacturing midway, be not exist production line to stop fully, the substrate of confirming is excluded, or the situation of the order transposing of substrate in repair.Therefore; For each above-mentioned execution mode; When conveyance multi-disc splicing substrate 50, confirm that this multi-disc splicing substrate 50 is which substrate in a plurality of multi-disc splicing substrates 50 of login in damaging label information storage server 5, seeks the reliability of operation and taking into account of efficiency.

Particularly, controller 19 divides into groups with as damage label information group to a plurality of damage label informations that damage label information table 60 and comprised according to each block address.Then; Damage the label information group based on this; The selected damage label information that can confirm workpiece uniquely; From 9 monolithic substrate 50a that the multi-disc of process object splicing substrate 50 is had, select and the selected corresponding monolithic substrate of damage label information 50a, substrate identification video camera 13b is taken selected this monolithic substrate 50a, and shooting results and selected damage label information are contrasted.Thus, controller 19 confirms that the multi-disc splicing substrate 50 of process object is to damage in 5 multi-discs splicing substrates 50 (workpiece) that label information table 60 comprised which.

At this,, service failure label information table 60 is confirmed concrete definite step of the multi-disc splicing substrate 50 of process object describes with reference to Fig. 6.

At first, shown in the step (a) of Fig. 6, being conceived to damage in the group of label information table 60, damaging label information all is the group (row of block address A3) of OK or NG (quantity of OK or NG is 0).In the example of Fig. 6, the damage label information of the row of the block address A3 of each workpiece is OK.Therefore, even substrate identification video camera 13b is taken the block address A3 of the multi-disc splicing substrate 50 of process object, can't confirm that also the multi-disc splicing substrate 50 of process object is which workpiece in the workpiece 1 to 5.Thereby, in definite step afterwards, from the reference object of substrate identification video camera 13b, get rid of block address A3.

Then, shown in the step (b) of Fig. 6, being conceived to damage in the group of label information table 60, damaging label information is the group (row of block address B3) that quantity and the quantity of NG of OK differs maximum.For embodiment illustrated; In the damage label information of the row of block address B3; Only the damage label information of workpiece 5 is OK, and the damage label information of remaining workpiece 1 to 4 is NG, therefore; As long as the damage label information of the block address B3 of the multi-disc of process object splicing substrate 50 is OK, just can confirm that the multi-disc splicing substrate 50 of process object is a workpiece 5.Therefore, selected workpiece 5 is as the candidate item of the multi-disc splicing substrate 50 of process object.And the damage label information for the block address B3 of the multi-disc splicing substrate 50 of confirming process object makes substrate identification video camera 13b take the block address B3 of the multi-disc splicing substrate 50 of process object.In addition; At the multi-disc splicing substrate 50 of not confirming process object through this step is under the situation (the damage label information of the block address B3 of the multi-disc splicing substrate 50 of process object is the situation of NG) of workpiece 5; The multi-disc of proceeding process object is spliced confirming of substrate 50; And in the step afterwards, become the candidate item of the multi-disc splicing substrate 50 of process object, from the damage label information table 60 of process object, get rid of workpiece 5 in order not make workpiece 5.And, upgrade the information of the quantity of the demonstration OK be positioned at the hypomere that damages label information table 60 and NG.

Then, shown in the step (c) of Fig. 6, be conceived to upgrade quantity in the damage label information table 60 under the state of information of quantity of the quantity that shows OK and NG, OK or NG and be 0 group (block address B3).With above-mentioned same; Even substrate identification video camera 13b is taken the block address B3 of the multi-disc splicing substrate 50 of process object; The multi-disc splicing substrate 50 that also can't confirm process object is which workpiece in the workpiece 1 to 5; Therefore, from the reference object of substrate identification video camera 13b, get rid of block address B3.And with above-mentioned same, the quantity that has been conceived to upgrade quantity in the damage label information table 60 under the state of information of quantity of the quantity that shows OK and NG, OK and NG differs the group (row of block address A1 and C1) of maximum.

For illustrative damage label information table 60 in Fig. 6, shown in step (c), in the damage label information of each workpiece in the row that are arranged in block address A1, only the damage label information of workpiece 3 is NG, and remaining

workpiece

1,2 and 4 damage label information are OK.In addition, in the damage label information of each workpiece in the row that are arranged in block address C1, only the damage label information of workpiece 2 is NG, and remaining

workpiece

1,3 and 4 damage label information are OK.Thereby, if substrate identification video camera 13b is taken the block address A1 or the C1 of the multi-disc splicing substrate 50 of process object, can confirm then whether the multi-disc splicing substrate 50 of process object is workpiece 3 or workpiece 2.That is, selected workpiece 2 and the candidate item of workpiece 3 as the multi-disc splicing substrate 50 of process object.

At this, generally speaking, 5 of conveyance multi-disc splicing substrates 50 begin in order to ensuing (downstream) device conveyance from the multi-disc splicing substrate of having accomplished at the device of upstream side to handle 50 on substrate transferring path 4.Particularly, the multi-disc splicing substrate 50 after finishing from the identification processing that utilizes the damage mark BM that printing machine 2 carries out begins conveyance successively.Below, for the ease of explanation, the example that 5 multi-disc splicing substrates 50 (

workpiece

1,2,3,4 and 5) are handled according to this identification that utilizes printing machine 2 to damage mark BM in proper order describes.In this case, exist when a plurality of in the candidate item (workpiece) of the multi-disc of process object splicing substrate 50, the related workpiece of the moment of timestamp damage label information the earliest is that the possibility of multi-disc splicing substrate 50 of process object is high.Thereby; Shown in the step (c) of Fig. 6; Be selected as at workpiece 2 and workpiece 3 under the situation of candidate item of multi-disc splicing substrate 50 of process object; After whether the workpiece 2 of the moment damage label information the earliest that acknowledging time stabs is the multi-disc splicing substrate 50 of process object, whether be that the method efficient of affirmation of workpiece 3 is higher.

Thereby; Following method is preferable; Promptly; Substrate identification video camera 13b is taken the related monolithic substrate 50a of block address C1 of the multi-disc splicing substrate 50 of process object; And whether the damage label information of block address C1 of confirming the multi-disc splicing substrate 50 of process object be after the NG, and substrate identification video camera 13b is taken the related monolithic substrate 50a of block address A1 of the multi-disc splicing substrate 50 of process object, and confirm whether the damage label information of block address A1 of the multi-disc splicing substrate 50 of process object is NG.In addition; At the multi-disc of process object splicing substrate 50 neither workpiece 2 neither workpiece 3 situation (the damage label information of the block address C1 of the multi-disc splicing substrate 50 of process object is OK; And the damage label information of block address A1 is the situation of OK) under; With above-mentioned same, from the damage label information table 60 of process object, get rid of workpiece 2 and workpiece 3.And, upgrade the information of the quantity of the demonstration OK be positioned at the hypomere that damages label information table 60 and NG.

Then; Shown in the step (d) of Fig. 6; In the damage label information table 60 under the state of the information of the quantity of having upgraded the quantity that shows OK and NG; With above-mentioned same, the quantity of from the reference object of substrate identification video camera 13b, getting rid of OK or NG is 0 group (row of block address A1, B1, C1 and C3).Then, be conceived to the quantity of OK and the quantity of NG and differ maximum group (row of block address A2, B2 and C2).In addition, in this case, in the arbitrary row in block address A2, B2 and C2, the quantity of OK be 1 and the quantity of NG be 1.Thereby; Even substrate identification video camera 13b is taken the related monolithic substrate 50a of arbitrary row among block address A2, B2 and the C2 of the multi-disc splicing substrate 50 of process object, which in workpiece 1 or 4 the multi-disc splicing substrate 50 that also all can confirm process object are.Through above step, which in the workpiece 1 to 5 the multi-disc splicing substrate 50 of confirming process object are.Like this; Even substrate identification video camera 13b is taken whole 9 monolithic substrate 50a that the multi-disc splicing substrate 50 of process object is had; Through make substrate identification video camera 13b to 4 monolithic substrate 50a at the most (in step shown in Figure 6; 4 block address B3, C1, A1, the related monolithic substrate 50a of A2) take, just can confirm the multi-disc splicing substrate 50 of process object.In addition, even under the situation of step (d), after whether the workpiece 2 of the moment damage label information the earliest that acknowledging time stabs is the multi-disc splicing substrate 50 of process object, whether be that the efficient of method of affirmation of workpiece 3 is also higher.

As stated; For first execution mode; Controller 19 exists in damaging each group of label information table 60 all to be had with the group (the damage label information of piece all be the group of NG) of damaging mark BM or to all pieces under the situation of group (the damage label information of piece all is the group of OK) of damage mark BM all pieces; Get rid of the value of sign through the shooting of upgrading monolithic substrate table 602 shown in Figure 13, thereby control with the corresponding monolithic substrate of the piece 50a of eliminating from the reference object of substrate identification video camera 13b with this group.

In addition; Controller 19 carries out following control; In the OK of each piece in being arranged in each row that damages label information table 60 or the information sets of NG, substrate identification video camera 13b each monolithic substrate 50a from 9 monolithic substrate 50a that had with the multi-disc splicing substrate 50 that begins with the quantity (quantity of NG) of the piece that damages mark BM and the corresponding monolithic substrate of the piece 50a that differs bigger with the quantity (quantity of OK) of the piece that damages mark BM in order process object is taken.Thus; Because can from group, search for the damage label information that to confirm workpiece uniquely; So when splicing substrate 50 at the contrast workpiece and as the multi-disc of process object; Only damage the corresponding monolithic substrate of label information 50a, just can judge the similarities and differences of workpiece and multi-disc splicing substrate 50 through taking with this.

In addition; Controller 19 exists in 5 multi-discs splicing substrates 50 under the situation of candidate item of multi-disc splicing substrate 50 of a plurality of process object, in preferentially selected these a plurality of candidate item, damage label information workpiece (moment of the timestamp related workpiece of damage label information the earliest) the earliest.

In addition; Controller 19 is got rid of the multi-disc splicing substrate of selecting as the candidate item of the multi-disc splicing substrate 50 of process object 50 from the damage label information table 60 of process object under the inconsistent situation of damage label information by the damage label information of the captured monolithic substrate 50a of the substrate identification video camera 13b of the multi-disc of process object splicing substrate 50 and selection processing selecting through damaging label information.

Then, controller 19 is controlled the damage label information of 9 monolithic substrate 50a that had with the multi-disc splicing substrate 50 of confirming determined process object under the situation of the multi-disc splicing substrate 50 of having confirmed process object with above-mentioned step.For example; Controller 19 is that multi-disc as shown in Figure 2 is spliced under the situation of substrate 50 (workpiece 1) at the multi-disc splicing substrate 50 of having confirmed process object, confirms as the damage label information of the multi-disc splicing substrate 50 of process object with damaging the label information information with OK workpiece 1 corresponding row or NG table 60.Then; Controller 19 is controlled as follows; That is, only the damage label information to the multi-disc of process object splicing substrate 50 (workpiece 1) is the related monolithic substrate 50a of piece (block address A1, A3, B2, C1 and C3) of OK, utilizes head unit 13 installation elements; On the other hand, be not the related monolithic substrate 50a installation elements of piece (block address A2, B1, B3 and C2) of NG to damaging label information.

Then, with reference to Fig. 7 and Fig. 8, the control flow of the controller 19 the when fitting machine 10 that utilizes first execution mode of the present invention is carried out the installation of element describes.

At first, as shown in Figure 7, in step S1, judge whether to move into multi-disc splicing substrate 50 from upstream side via substrate transferring band 12.In step S1, carry out this judgement repeatedly till multi-disc splicing substrate 50 is moved into substrate transferring band 12.Then, moved under the situation of substrate transferring band 12, got into step S2 at multi-disc splicing substrate 50.

Then, in step S2, carry out the processing that the multi-disc splicing substrate of moving into 50 is fixed in the installation exercise position of the appointment on the substrate transferring band 12, get into step S3.Then, in step S3, carry out the definite processing (with reference to Fig. 8) that damages label information.In this step S3, the damage label information of each the monolithic substrate 50a among 9 monolithic substrate 50a that the multi-disc splicing substrate of confirming to move into 50 (the multi-disc splicing substrate 50 of process object) is had.

Then, in step S4, be based on the damage label information of confirming among the above-mentioned steps S3, carry out the processing of installation elements on the multi-disc splicing substrate 50 of process object.Particularly; To the damage label information with the multi-disc splicing substrate 50 that is confirmed as process object is that the corresponding monolithic substrate of the piece 50a of OK carries out the installation of element; On the other hand, not to carrying out the installation of element with the corresponding monolithic substrate of the piece that is confirmed as NG 50a.

Then, in step S5, carry out to remove the processing of state that multi-disc splicing substrate 50 behind the installation elements is fixed in the installation exercise position of the appointment on the substrate transferring band 12, get into step S6.Then, in step S6, the multi-disc splicing substrate 50 after installation exercise finishes via substrate transferring band 12 downstream side take out of end process.

Then, with reference to Fig. 8, the detailed content of definite processing of the damage label information in the step S3 of above-mentioned Fig. 7, carried out is described.

At first; In step S11; Execution is obtained the processing that damages label information table 60 (with reference to Fig. 3) from damaging label information storage server 5 via Department of Communication Force 19f, this damages label information table 60 expression whether each the monolithic substrate 50a among 9 monolithic substrate 50a being had of each multi-disc splicing substrate 50 in 5 multi-discs splicing substrates 50 of conveyance on substrate transferring path 4 with damage mark BM (with reference to Fig. 2).In addition, the damage label information table 60 that obtains is stored among the storage part 19b.

Then, in step S12, whether the label information that respectively damages that judge to damage label information table 60 all is identical pattern (all be OK or all be NG).In this step S12,, get into step S13 damaging respectively the damaging under the situation that label information all is identical pattern of label information table 60.Then, in step S13, carry out the timestamp related workpiece of damage label information is the earliest confirmed as the processing of the multi-disc splicing substrate 50 of process object, the step S21 that states after the entering.

In addition; In above-mentioned steps S12; Damage label information damaging label information table 60 has under the situation of different patterns; Controller 19 damages label information according to each row of this damage label information table 60 and divides into groups each, carries out the processing discerned as group with each row, to after the processing of counting as the quantity of the quantity of the OK that derives attribute, NG, gets into step S14.Then, in step S14, the quantity that judges whether to exist OK or NG is 0 group.In this step S14, damaging under the situation that the quantity that has OK or NG in the label information table 60 is 0 group being judged as, get into step S15.

Then; In step S15; In each group, exist to damage label information and all be under the situation of group of OK or NG; Get rid of the value of sign through the shooting of upgrading monolithic substrate table 602 shown in Figure 13, thereby carry out from the reference object of substrate identification video camera 13b, getting rid of the processing of the related monolithic substrate 50a of this group, get into step S16.In addition, in above-mentioned steps S14, damage under the situation of group that label information all is OK or NG, also get into step S16 even be judged as not exist.

In step S16, in each group on damaging label information table 60, carry out differing the selected processing that can confirm the damage label information of workpiece uniquely the maximum group, entering step S17 from the quantity of the quantity of OK and NG.

Then; In step S17; Make among 9 monolithic substrate 50a that substrate identification video camera 13b had the multi-disc splicing substrate 50 in process object, corresponding with damage label information selected in step S16, as the processing that the monolithic substrate 50a of the multi-disc splicing substrate 50 of process object takes, get into step S18.In addition; Shown in the step (c) of Fig. 6; The difference of the quantity of OK and the quantity of NG is in a plurality of groups under the identical situation; In other words, exist under the situation of a plurality of groups with the damage label information that can confirm workpiece uniquely, the corresponding monolithic substrate of the piece 50a with damage label information in a plurality of damage label informations that can confirm workpiece uniquely, the earliest (moment of timestamp damage label information the earliest) is taken.

Then, in step S18, judge whether damage label information selected in above-mentioned steps S16 is with consistent by the damage label information of the captured monolithic substrate 50a of substrate identification video camera 13b in above-mentioned steps S17.

In step S18, in above-mentioned steps S16, under selected damage label information and the inconsistent situation of damage label information in above-mentioned steps S17, get into step S19 by the captured monolithic substrate 50a of substrate identification video camera 13b.Then, in step S19, carry out from the damage label information table 60 of process object, getting rid of the processing that in above-mentioned steps S18, is judged as the determined workpiece of inconsistent damage label information, return above-mentioned steps S12.

On the other hand, in step S18, in above-mentioned steps S16 selected damage label information with in above-mentioned steps S17 by under the consistent situation of the damage label information of the captured monolithic substrate 50a of substrate identification video camera 13b, entering step S20.Then, in step S20, carry out the determined workpiece of damage label information selected in above-mentioned steps S16 is confirmed as the processing of the multi-disc splicing substrate 50 of process object, get into step S21.

Then; In step S21; Carry out from damage label information table 60, obtaining the damage label information of the workpiece of the multi-disc splicing substrate 50 of in above-mentioned steps S13 or above-mentioned steps S20, confirming as process object; And the damage label information that will obtain is confirmed as the processing of damage label information of the multi-disc splicing substrate 50 of process object, end process.Confirm to move into the damage label information of the multi-disc splicing substrate 50 of fitting machine 10 as described above.

For first execution mode; Controller 19 is set as described above; This controller 19 based on expression whether each the monolithic substrate 50a among 9 monolithic substrate 50a being had of each multi-disc splicing substrate 50 in 5 multi-discs splicing substrates 50 (workpiece 1 to 5) with the damage label information that damages mark BM (damaging label information table 60); Control the shooting order of 9 monolithic substrate 50a so that substrate identification video camera 13b is orders of which the multi-disc splicing substrate 50 in 5 multi-discs splicing substrates 50 by the multi-disc splicing substrate 50 of confirming process object easily, 9 monolithic substrate 50a that the multi-disc splicing substrate 50 of process object is had take.Thus; Because the shooting of 9 monolithic substrate 50a that the multi-disc of process object splicing substrate 50 is had is set to the order of the multi-disc splicing substrate 50 of confirming process object easily in proper order; Even so substrate identification video camera 13b is taken whole 9 monolithic substrate 50a successively; Only through the part among 9 monolithic substrate 50a is taken; The multi-disc splicing substrate 50 that just can confirm process object is which the multi-discs splicing substrate 50 in 5 multi-discs splicing substrates 50, and can confirm the damage label information of each the monolithic substrate 50a among 9 monolithic substrate 50a that the multi-disc splicing substrate 50 of determined process object had.

In addition; Because can utilize controller 19 carry out process object multi-disc splicing substrate 50 confirm and 9 monolithic substrate 50a that the multi-disc splicing substrate 50 of process object is had in the confirming of damage label information of each monolithic substrate 50a, so need not to be provided with in addition confirming and the specialized apparatus of confirming of the damage label information of monolithic substrate 50a of the multi-disc splicing substrate 50 that carries out process object.The required total ascent time of processing that consequently can suppress the multi-disc of process object splicing substrate 50 is carried out appointments increases, and can need not to be provided with in addition the damage label information of each the monolithic substrate 50a among 9 monolithic substrate 50a that specialized apparatus just confirms that the multi-disc splicing substrate 50 of process object had.

In addition; For first execution mode; Constitute controller 19 as described above; The damage label information group of each monolithic substrate 50a in the damage label information (damaging label information table 60) of 9 monolithic substrate 50a that this controller 19 is had based on each multi-disc splicing substrate 50 in 5 multi-discs splicing substrate 50, corresponding (damaging OK or the information sets of NG in the row that are arranged in each piece of label information table 60); Control the shooting order of 9 monolithic substrate 50a so that substrate identification video camera 13b is orders of 5 which substrates in the multi-disc splicing substrate 50 by the multi-disc splicing substrate 50 of confirming process object easily; 9 auxiliary substrates to the multi-disc of process object splicing substrate 50 is had are taken; Controlling with the multi-disc splicing substrate 50 of confirming process object thus is which the multi-discs splicing substrate 50 in 5 multi-discs splicing substrates 50, and confirms the damage label information of 9 monolithic substrate 50a that the multi-disc splicing substrate 50 of determined process object is had.Thus; Through relatively by the damage label information group of damage label information with the corresponding monolithic substrate 50a of 5 multi-discs splicing substrates 50 of the captured monolithic substrate 50a of the substrate identification video camera 13b of the multi-disc splicing substrate 50 of process object, thereby the multi-disc splicing substrate 50 that can easily confirm process object is that which multi-disc that 5 multi-discs are spliced in the substrates 50 are spliced substrate 50.

In addition; For first execution mode; Constitute controller 19 as described above; This controller 19 is controlled as follows; So that substrate identification video camera 13b is in the damage label information group (damaging label information table 60) of each monolithic substrate 50a of the correspondence of 5 multi-discs splicing substrates 50, among the monolithic substrate 50a of the correspondence among 9 monolithic substrate 50a that each multi-disc splicing substrate 50 since 5 multi-discs splicing substrates 50 is had, with successively each monolithic substrate 50a that the multi-disc of process object is spliced among 9 monolithic substrate 50a that substrate 50 had being taken with the quantity of the monolithic substrate 50a that the damages mark BM monolithic substrate 50a corresponding with the monolithic substrate 50a that differs bigger with the quantity of the monolithic substrate 50a that damages mark BM.Thus; Through from the reference object of substrate identification video camera 13b, getting rid of in the damage label information group of each monolithic substrate 50a of the correspondence of 5 multi-discs splicing substrates 50 all with the monolithic substrate 50a that damages mark BM and the monolithic substrate 50a of all having damage mark BM; Thereby can reduce quantity as the monolithic substrate 50a of the reference object of substrate identification video camera 13b; Therefore, can confirm that the multi-disc splicing substrate 50 of process object is which the multi-disc splicing substrate 50 in 5 multi-disc splicing substrates 50 with less shooting number of times.

In addition; For first execution mode; Constitute controller 19 as described above; This controller 19 is in the damage label information group (damaging label information table 60) of each monolithic substrate 50a of the correspondence of 5 multi-disc splicing substrates 50; All monolithic substrate 50a of correspondence among 9 monolithic substrate 50a that each multi-disc splicing substrate 50 in 5 multi-discs splicing substrates 50 is had all with the situation of damaging mark BM under, or corresponding all monolithic substrate 50a all with the situation of damaging mark BM under, control the monolithic substrate 50a that splices the correspondence among 9 monolithic substrate 50a that substrate 50 had with the multi-disc of from the reference object of substrate identification video camera 13b, getting rid of process object.Thus; In the damage label information group of each monolithic substrate 50a of the correspondence of 5 multi-discs splicing substrates 50; Then can determine whether it is the multi-disc splicing substrate 50 of process object if be conceived to shooting number of times still less with the quantity of the monolithic substrate 50a that damages mark BM and the damage label information group that differs bigger monolithic substrate 50a with the quantity of the monolithic substrate 50a that damages mark.

In addition; For first execution mode; Constitute controller 19 as described above; In 5 multi-discs splicing substrates 50, exist under the situation of candidate item of multi-disc splicing substrate 50 of a plurality of process object; In the candidate item of the preferential multi-disc splicing substrate 50 of confirming a plurality of process object, damage the earliest multi-disc splicing substrate 50 of label information (as the recognition result to the damage mark BM of each monolithic substrate 50a, the establishment of the message file of creating to each multi-disc splicing substrate 50 is the earliest multi-disc splicing substrate 50 constantly).At this, 5 multi-discs utilizing fitting machine 10 to carry out the processing of appointment are spliced substrates 50 becomes the possibility height of the process object of fitting machine 10 according to the timestamp that damages label information (being directed against the establishment moment of the message file of above-mentioned each multi-disc splicing substrate 50 establishment) order early.In this case, for first execution mode, because preferentially confirm can be from the possibility of the process object that the becomes fitting machine 10 high candidate item (multi-disc splicing substrate 50), so can confirm the multi-disc splicing substrate 50 of process object with higher efficient.

In addition; For first execution mode; Constitute controller 19 as described above; By the damage label information of the captured monolithic substrate 50a of the substrate identification video camera 13b of the multi-disc of process object splicing substrate 50 with the multi-disc splicing substrate 50 of the candidate item of the monolithic substrate 50a that confirms as process object and the inconsistent situation of damage label information by the captured corresponding monolithic substrate of the monolithic substrate 50a 50a of the substrate identification video camera 13b of the multi-disc splicing substrate 50 of process object under, from the damage label information table 60 of process object, get rid of the multi-disc splicing substrate 50 of the candidate item of the multi-disc splicing substrate 50a that confirms as process object.Thus; Through the damage label information of the corresponding monolithic substrate 50a of eliminating from the damage label information table 60 of process object and the multi-disc splicing substrate 50 inconsistent multi-discs splicing substrates 50 of process object; Thereby can dwindle the candidate item scope of the multi-disc splicing substrate 50 of process object; Therefore, can more easily confirm the multi-disc splicing substrate 50 of process object.

(second execution mode)

Then, with reference to Fig. 1, Fig. 2, Fig. 4, Fig. 5 and Fig. 9 to Figure 12, the fitting machine 20 of second execution mode of the present invention is described.For second execution mode; With by the stage before moving into fitting machine 10 9 monolithic substrate 50a all to be damaged above-mentioned first execution mode that the identification of mark BM handles at multi-disc splicing substrate 50 different, describe only 6 monolithic substrate 50a among 9 monolithic substrate 50a being damaged the example that the identification of mark BM handles by the stage before moving into fitting machine 20 at multi-disc splicing substrate 50.In addition, fitting machine 20 is examples of " substrate board treatment " of the present invention.

As shown in Figure 1, for second execution mode, base plate processing system 1a comprises printing machine 2a, inspection machine 3 and fitting machine 20.Whether this printing machine 2a is identified in the assigned address of 6 the monolithic substrate 50a (for example, block address B1 to B3 and C1 to C3 (with reference to Fig. 2)) among 9 monolithic substrate 50a (block address A1 to A3, B1 to B3 and C1 to C3 (with reference to Fig. 2)) that each multi-disc splicing substrate 50 in 5 multi-discs splicing substrates 50 of conveyance on the substrate transferring path 4 had with damage mark BM (with reference to Fig. 2).In addition; Printing machine 2a will be created as the message file of each multi-disc splicing substrate 50 to the recognition result that above-mentioned 5 multi-discs are spliced the damage mark BM of substrate 50, and send the message file of creating to the damage label information storage server that is connected in printing machine 2a 5.Particularly, printing machine 2a sends damage label information table 60a as shown in Figure 9 to damaging label information storage server 5.

In addition; For second execution mode; The controller 29 (with reference to Fig. 5) of fitting machine 20 (with reference to Fig. 4) is same with above-mentioned first execution mode; Based on damaging label information table 60a, control shooting order is so that substrate identification video camera 13b is orders of which the multi-disc splicing substrate 50 in 5 multi-disc splicing substrates 50 (workpiece 1 to 5) by the multi-disc splicing substrate 50 of confirming process object easily; Each monolithic substrate 50a that the multi-disc of process object splicing substrate 50 is had takes, and which in the workpiece 1 to 5 the multi-disc splicing substrate 50a that confirms process object thus be.In addition, controller 29 is examples of " control part " of the present invention.

In addition; For second execution mode; Controller 29 has been confirmed at service failure label information table 60a to control the damage label information of whole 9 the monolithic substrate 50a that had with the multi-disc splicing substrate 50 of confirming determined process object under the situation of multi-disc splicing substrate 50 of process object.In addition; Shown in figure 10; Because definite step of multi-disc splicing substrate 50 of process object of damage label information table 60a of having used second execution mode with above-mentioned use shown in Figure 6 definite step of multi-disc splicing substrate 50 of process object of damage label information table 60 of first execution mode identical, so the omission explanation.

At this; For second execution mode; Different with above-mentioned first execution mode; Because the identification in that multi-disc splicing substrate 50 is not carried out the damage mark BM of 3 (block address A1 to A3) monolithic substrate 50a by the stage before being moved into fitting machine 20 is handled, thus controller 29 through making substrate identification video camera 13b these 3 monolithic substrate 50a of the multi-disc splicing substrate 50 of process object are taken, thereby the identification of carrying out the damage mark BM of these 3 monolithic substrate 50a is handled.

In addition; Controller 29 uses the damage label information of the monolithic substrate 50a of the damage label information of 3 definite monolithic substrate 50a of substrate identification video camera 13b and remaining 6 (block address B1 to B3 and C1 to C3) that service failure label information table 60a confirms as stated through combination, thereby controls the damage label information of whole 9 the monolithic substrate 50a that had with the multi-disc splicing substrate 50 of confirming process object.Promptly; For second execution mode; Because share confirming of the damage label information that carries out whole monolithic substrate 50a that 1 multi-disc splicing substrate 50 had by printing machine 2a (with reference to Fig. 1) and fitting machine 20; Even so under the situation of definite spended time of the damage label information of whole monolithic substrate 50a that multi-disc splicing substrate 50 is had, also can obtain printing machine 2a and handle required total ascent time of 1 multi-disc splicing substrate 50 and fitting machine 20 and handle 1 multi-disc and splice substrate 50 balance of required total ascent time.

In addition, other structures of second execution mode are identical with above-mentioned first execution mode.

Then, with reference to Figure 11 and Figure 12, the control flow of the controller 29 the when fitting machine 20 that utilizes second execution mode of the present invention is carried out the installation of element describes.In addition; Utilize each of step S31, S32 and S34 to S36 of Figure 11 that the controller 29 of second execution mode carries out handle respectively the Fig. 6 that carries out with the controller that utilizes above-mentioned first execution mode 19 step S1, S2 and S4 to S6 respectively handle identically, therefore omit explanation.

Below, with reference to Figure 12, the detailed content of definite processing of the damage label information in the step S33 of above-mentioned Figure 11, carried out is described.In addition; The processing of the step S41 to S50 of Figure 12 (confirming the processing of the multi-disc splicing substrate 50 of process object) is service failure label information table 60a (with reference to Fig. 9) and not service failure label information table 60 (with reference to Fig. 2) with the difference of the processing of the step S11 to S20 of Fig. 7 of above-mentioned first execution mode; In addition identical with the processing of the step S11 to S20 of above-mentioned Fig. 7, therefore omit explanation.

Shown in figure 12; Under the situation of the multi-disc splicing substrate 50 of having confirmed process object through the processing of carrying out step S41 to S50; In step S51, carry out among 9 monolithic substrate 50a that the multi-disc splicing substrate 50 of process object had, yet confirm to damage label information, block address is the identification of damage mark BM of the monolithic substrate 50a of A1 to A3.Particularly, carry out the processing that the corresponding monolithic substrate of block address A1 to A3 50a that 13b pair of multi-disc with process object of substrate identification video camera spliced substrate 50 is taken.

Then; In step S52; Be utilized among the above-mentioned steps S51 damage label information and remaining B1 to B3 that service failure label information table 60a confirms and the damage label information of C1 to C3 of the block address A1 to A3 of the multi-disc splicing substrate 50 that uses the process object that substrate identification video camera 13b confirms; The processing of the damage label information of whole 9 monolithic substrate 50a that the multi-disc splicing substrate 50 of process object is had, end process are confirmed in execution.

In addition, other effects of second execution mode are identical with above-mentioned first execution mode.

(the 3rd execution mode)

Then, referring to figs. 1 through Fig. 5, the base plate processing system 1b of the 3rd execution mode of the present invention is described.For the 3rd execution mode; To damage above-mentioned first execution mode that the identification of mark BM handles different with each the monolithic substrate 50a that utilizes the 2 pairs of multi-discs of printing machine splicing substrate 50 to be had, and each the monolithic substrate 50a that multi-disc splicing substrate 50 is had by the producer of multi-disc splicing substrate 50 damages the identification of mark BM and handles.

As shown in Figure 1, the base plate processing system 1b of the 3rd execution mode is made up of printing machine 2b, inspection machine 3 and fitting machine 30.In addition, fitting machine 30 is examples of " substrate board treatment " of the present invention.For this base plate processing system 1b; 5 of conveyance multi-discs splicing substrates 50 are moved into the stage before the printing machine 2b on substrate transferring path 4, by the producer of multi-disc splicing substrate 50 each monolithic substrate 50a of this 5 multi-discs splicing substrates 50 are applied and damage mark BM (with reference to Fig. 2).In addition, at this moment, the producer that the identification of the damage mark BM of each monolithic substrate 50a that multi-disc splicing substrate 50 is had is handled also by multi-disc splicing substrate 50 carries out.

Promptly; For the 3rd execution mode; The producer of multi-disc splicing substrate 50 5 multi-disc splicing substrates 50 of conveyance on substrate transferring path 4 are moved into the printing machine 2b stage before; The damage label information table 60b (with reference to Fig. 3) of the damage label information of each the monolithic substrate 50a among the monolithic substrate 50a of 9 (block address A1 to A3, B1 to B3 and C1 to C3 (with reference to Fig. 2)) that each multi-disc splicing substrate 50 in these 5 multi-discs splicing substrates 50 of establishment storage is had, and to damaging the damage label information table 60b that 5 transmissions of label information storage server are created.

The controller 39 (with reference to Fig. 5) of the fitting machine 30 (with reference to Fig. 4) of the 3rd execution mode is based on the damage label information table 60b (with reference to Fig. 3) that the producer by above-mentioned multi-disc splicing substrate 50 creates, and which in the workpiece 1 to 5 the multi-disc splicing substrate 50 of confirming process object are.In addition, controller 39 is examples of " control part " of the present invention.

In addition, other structures of the 3rd execution mode are identical with above-mentioned first execution mode.

In addition, definite step of multi-disc splicing substrate 50 of process object of damage label information table 60b of having used the 3rd execution mode with above-mentioned use shown in Figure 6 the multi-disc of process object of damage label information table 60 of first execution mode to splice definite step of substrate 50 identical.That is, the control action of the controller 19 the when fitting machine 10 of the control action of the controller 39 the when fitting machine 30 of the 3rd execution mode carries out the installation of element and above-mentioned Fig. 7 and first execution mode shown in Figure 8 carries out the installation of element is identical, therefore omits explanation.

In addition, the effect of the 3rd execution mode is identical with above-mentioned first execution mode.

In addition, this disclosed execution mode should be considered to all points and all just give an example, and unrestricted.Scope of the present invention can't help above-mentioned execution mode explanation and by shown in the scope of technical scheme, further contain and impartial meaning of the scope of technical scheme and all changes in the scope.

For example, in above-mentioned first and second execution modes, show as an example of substrate board treatment of the present invention and use the example of fitting machine, but the invention is not restricted to this.For the present invention, also can use the substrate board treatment (printing machine, inspection machine etc.) beyond the fitting machine.

In addition, in above-mentioned first to the 3rd execution mode, the multi-disc splicing substrate that shows conveyance on the substrate transferring path is 5 a example, but the invention is not restricted to this.For the present invention, as long as the multi-disc of conveyance on substrate transferring path splicing substrate is a plurality of, both can be more than 2 and below 4, also can be more than 6.

In addition, in above-mentioned first to the 3rd execution mode, the quantity that shows 1 multi-disc splicing monolithic substrate that substrate had is 9 example, but the invention is not restricted to this.For the present invention, as long as the quantity of 1 multi-disc splicing monolithic substrate that substrate had is a plurality of, both can be more than 2 and below 8, also can be more than 10.

In addition, in above-mentioned first to the 3rd execution mode, show the example that service failure label information table is confirmed the multi-disc splicing substrate of process object, but the invention is not restricted to this.For the present invention, thereby get final product, need not service failure label information table through making substrate identification video camera take the multi-disc splicing substrate of confirming process object to the monolithic substrate by the order of the multi-disc splicing substrate of confirming process object easily.

In addition, in above-mentioned first and second execution modes, show printing machine and create the example that damages the label information table, in above-mentioned the 3rd execution mode, the producer who shows multi-disc splicing substrate creates the example that damages the label information table, but the invention is not restricted to this.For the present invention, inspection machine also can be created and damage the label information table.

In addition, in above-mentioned first and second execution modes, show the example that obtains the damage label information table of printing machine establishment via server, but the invention is not restricted to this.For the present invention, can not obtain the damage label information table that printing machine is created through fitting machine directly is connected with printing machine via server yet.

In addition; For above-mentioned first to the 3rd execution mode; Show under the situation of candidate item of the multi-disc splicing substrate that has a plurality of process object; Carry out the example of definite processing of the multi-disc splicing substrate of process object by the timestamp that damages label information (as the recognition result to the damage mark of each monolithic substrate of each multi-disc splicing substrate, the establishment of the message file of creating to each multi-disc splicing substrate constantly) order early, but the invention is not restricted to this.For the present invention, also can carry out definite processing of the multi-disc splicing substrate of process object by the order beyond above-mentioned.

In addition; In above-mentioned second execution mode; The identification processing that shows the damage mark of 6 monolithic substrates in multi-disc splicing 9 monolithic substrates that substrate had is undertaken by printing machine; And the example that is undertaken by fitting machine is handled in the identification of the damage mark of remaining 3 monolithic substrate, but the invention is not restricted to this.For the present invention, also can freely set the quantity of damaging the quantity of the monolithic substrate that the identification of mark handles and damaging the monolithic substrate that the identification of mark handles by fitting machine by printing machine.

In addition; In each above-mentioned execution mode; Be in the definite processing (step S3, S33) that damages label information, must from damage the label information table, select the example of some substrates (workpiece identifier), but in the definite processing that damages label information; Need not necessarily to confirm uniquely, also can be uncertain in the time can't confirming.As such variation, to describing of the structure below Figure 14.

With reference to Figure 14, for the variation shown in this figure, this puts different with Fig. 7 between step S3 and step S4, to be inserted with step S51, S52.

In step S51; After in definite processing of the damage label information stated; Judge the value of all shooting signs that are applied in, when the value of this sign is true (True), execution in step S52; Each monolithic substrate 50a to splice substrate 50 as the multi-disc of process object takes, and confirms to damage label information.That is, in the definite processing that damages label information, under situation about can't from damage the label information table, confirm as the information of the substrate of process object, fitting machine 3 self confirms to damage label information through taking.Under the situation of execution in step S51, or be to deny under the situation of (NO), in step S50 with the same execution in step of first execution mode S4 to S6.

Then, with reference to Figure 15, the detailed content of definite processing of the damage label information in the step S3 of above-mentioned Figure 14, carried out is described.In addition, the processing of the step S11 to S19 of Figure 15 (confirming the processing of the multi-disc splicing substrate 50 of process object) is identical with the processing of the step S11 to S19 of above-mentioned Fig. 7 respectively, therefore omits explanation.In addition; In step S18; In above-mentioned steps S16 selected damage label information with in above-mentioned steps S17, discern under the consistent situation of the damage label information of the captured monolithic substrate 50a of video camera 13b by substrate; Carry out the processing identical, therefore omit explanation with step S20, the S21 of above-mentioned Fig. 7.

With reference to Figure 15, in definite processing of the related damage label information of this variation, after the processing of step S19, controller 19 judges in step S301 whether the workpiece of not search remains in the damage label information table 60.Suppose to remain under the situation about damaging in the label information table 60 at the workpiece of not search, controller 19 moves to step S12, repeatedly the processing below the execution in step S12.On the other hand; Workpiece in not search does not remain under the situation about damaging in the label information table 60; In step S302; The mode of controller 19 so that the damage label information that splices substrates 50 as all multi-discs of process object is taken is made as all shooting signs that are set among the storage part 19b very, and returns main routine.As stated; In the definite processing that damages label information, can't from damage the label information table, confirm under the situation as the workpiece identifier of process object; As long as confirm to damage label information through fitting machine self; Therefore, compare, further raise the efficiency with the situation that all process object are taken.

And, in each execution mode, carry out the definite processing that damages label information by the controller of fitting machine; But the invention is not restricted to this, also can adopt following structure, promptly; Storing process (stored procedures) is installed in the damage label information storage server 5; By the selected processing that damages the workpiece among label information storage server 5 execution graphs 8, Figure 12, Figure 15, fitting machine only receives selected result, and contrasts with multi-disc splicing substrate 50 as process object.In this case, damage label information table itself because need not transmission/reception, so have the advantage that communication load alleviates.

In addition, server of the present invention is not limited to the damage label information storage server 5 of physics, also can be the decentralized system that is made up of the printing machine that is connected in this damage label information storage server 5, fitting machine etc.

In addition, beyond any doubt, can in the scope of technical scheme of the present invention, carry out various changes.

Claims

1. substrate board treatment, it carries out the processing of appointment to each substrate in a plurality of substrates that have a plurality of auxiliary substrates respectively, it is characterized in that comprising:

Image pickup part is taken respectively each auxiliary substrate in said a plurality of auxiliary substrates that said substrate had of process object; And

Control part is controlled the shooting action of said image pickup part, wherein,

Said control part; Based on expression whether on each auxiliary substrate in the said a plurality of auxiliary substrates that each substrate had in said a plurality of substrates with the bad label information of bad mark; Shooting order through controlling said a plurality of auxiliary substrates is so that said image pickup part is that the order of which substrate in said a plurality of substrate is taken said a plurality of auxiliary substrates that substrate had of said process object by the substrate of confirming said process object easily; The substrate of confirming said process object is which substrate in said a plurality of substrate, and confirms the said bad label information of said a plurality of auxiliary substrates that substrate had of determined said process object.

2. substrate board treatment according to claim 1 is characterized in that:

Said control part; Said bad label information group based on said each auxiliary substrate in the said bad label information of the said a plurality of auxiliary substrates that each substrate had in said a plurality of substrates, corresponding; Shooting order through controlling said a plurality of auxiliary substrates is so that said image pickup part is that the order of which substrate in said a plurality of substrate is taken said a plurality of auxiliary substrates that substrate had of said process object by the substrate of confirming said process object easily; The substrate of confirming said process object is which substrate in said a plurality of substrate, and confirms the said bad label information of said a plurality of auxiliary substrates that substrate had of determined said process object.

3. substrate board treatment according to claim 2 is characterized in that:

In the said bad label information group of said each auxiliary substrate of the correspondence of said a plurality of substrates; On all auxiliary substrates of said correspondence in said a plurality of auxiliary substrates that each substrate had in said a plurality of substrates all under the situation with bad mark, or all auxiliary substrates of said correspondence all with under the situation of bad mark; Said control part; Control the shooting action of said image pickup part, the auxiliary substrate of the said correspondence in said a plurality of auxiliary substrates that substrate had of said process object is got rid of from the reference object of said image pickup part.

4. substrate board treatment according to claim 3 is characterized in that:

Said control part; Control the shooting action of said image pickup part; So that said image pickup part is in the said bad label information group of said each auxiliary substrate of the correspondence of said a plurality of substrates; In the auxiliary substrate of the said correspondence from the said a plurality of auxiliary substrates that each substrate had said a plurality of substrates, with beginning with the corresponding said auxiliary substrate of auxiliary substrate that the quantity of not having the auxiliary substrate of said bad mark differs bigger with the quantity of the auxiliary substrate of said bad mark, successively each auxiliary substrate in said a plurality of auxiliary substrates that substrate had of said process object is taken.

5. according to each described substrate board treatment in the claim 1 to 4, it is characterized in that:

Said control part exists in said a plurality of substrates under the situation of a plurality of candidate item of substrate of said process object, preferentially confirms the said bad label information said substrate the earliest in a plurality of candidate item of substrate of said process object.

6. substrate board treatment according to claim 5 is characterized in that:

Said control part; Under the said bad label information inconsistent situation of said bad label information, the said substrate of the candidate item of the substrate of confirming as said process object is got rid of from the candidate item of the substrate of said process object with the captured corresponding auxiliary substrate of auxiliary substrate of the said image pickup part of said substrate and the substrate said process object of the candidate item of the substrate of confirming as said process object by the captured auxiliary substrate of the said image pickup part of the substrate of said process object.

7. according to each described substrate board treatment in the claim 1 to 4, it is characterized in that: said control part,

A plurality of substrates are obtained data set, and this data set comprises the workpiece identifier of discerning said substrate uniquely, confirm block address and the said bad label information of said fixed said each auxiliary substrate of the coordinate of said auxiliary substrate to each workpiece identifier;

The a plurality of bad label information that said data set comprised is carried out the grouping as group according to this each block address;

To said each group, the selected bad label information that can confirm the workpiece identifier that this data set comprised uniquely; And

Let the auxiliary substrate of the said image pickup part pair block address corresponding take, contrast this bad label information and the bad label information of confirming from said data centralization with selected bad label information,

Carry out repeatedly said selected and contrast action up to the bad label information of captured auxiliary substrate with till the bad label information of confirming from data centralization is consistent, and from said data centralization definite with as the consistent workpiece identifier of the substrate of process object.

8. substrate board treatment according to claim 7 is characterized in that:

Said control part is got rid of the related bad label information of selected said workpiece identifier and is upgraded said group from said data centralization when confirming said workpiece identifier at every turn.

9. substrate board treatment according to claim 7 is characterized in that:

Said control part is detecting under the situation of a plurality of bad label informations, the bad label information the earliest in preferentially selected this bad label information.

10. base plate processing system is characterized in that comprising:

The 1st substrate board treatment carries out the processing of appointment to each substrate in a plurality of substrates that have a plurality of auxiliary substrates respectively;

The 2nd substrate board treatment, each substrate in a plurality of said substrate that said the 1st substrate board treatment was handled carries out the processing of follow-up appointment;

Server, storage representation whether on each auxiliary substrate in the said a plurality of auxiliary substrates that each substrate had in said a plurality of substrates with the bad label information of bad mark;

Communication unit communicates so that said the 1st substrate board treatment and said the 2nd substrate board treatment can be shared said bad label information said bad label information; And

Image pickup part is taken each auxiliary substrate in said a plurality of auxiliary substrates that said substrate had of process object, wherein,

In said the 2nd substrate board treatment and the said server any one; Based on said bad label information; Shooting order through controlling said a plurality of auxiliary substrates is so that said image pickup part is that the order of which substrate in said a plurality of substrate is taken said a plurality of auxiliary substrates that substrate had of said process object by the substrate of confirming said process object easily; The substrate of confirming said process object is which substrate in said a plurality of substrate, and confirms the said bad label information of said a plurality of auxiliary substrates that substrate had of determined said process object.

11. base plate processing system according to claim 10 is characterized in that:

Said the 1st substrate board treatment; Through each auxiliary substrate as a plurality of said substrates of process object is taken; The recognition result of the bad mark of the assigned address that invests each auxiliary substrate in advance is created as the message file of this each substrate, and sends the message file of being created to said server.