CN102502253A - Conveying system for wafer-shaped object - Google Patents
Conveying system for wafer-shaped object Download PDFInfo
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- CN102502253A CN102502253A CN2011103701423A CN201110370142A CN102502253A CN 102502253 A CN102502253 A CN 102502253A CN 2011103701423 A CN2011103701423 A CN 2011103701423A CN 201110370142 A CN201110370142 A CN 201110370142A CN 102502253 A CN102502253 A CN 102502253A
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- wafer
- shaped article
- processing unit
- mechanical hands
- delivery system
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Abstract
The invention discloses a conveying system for a wafer-shaped object, which belongs to the technical field of semiconductor wafer manufacture. The conveying system comprises at least two processing units (1) and mechanical hands (2), wherein, the distances between the mechanical hands (2) and the processing units (1) are equivalent, and the mechanical hands (2) are used for placing the wafer-shaped object to be processed in the processing units (1) and taking out the wafer-shaped object that is processed. The conveying system can store and take out the wafer-shaped object through the self-rotation and the lifting of the two mechanical hands by enabling the distances between the mechanical hands (2) and the processing units (1) to be equivalent, and can adopt a temporary storage platform to transit so as to achieve one wafer transition process or directly convey wafers to processing unit areas with the help of the movement of the mechanical hands on guiding rails after taking wafers from cassette areas by adopting the mechanical hands provided with the guiding rails; the two manners achieve simple motion path and are rapid and reliable to store and take out; and meanwhile, the conveying system can effectively reduce the occupied track area by compared with the same type of equipment.
Description
Technical field
The present invention relates to semiconductor crystal wafer manufacturing technology field, relate in particular to a kind of delivery system of wafer-shaped article.
Background technology
Be used to carry the device of wafer-shaped article in the prior art; Its processing unit is linear arrangement, monosymmetric normally; And adopt a solid mechanical hand-screw to change and get sheet (or sheet is got in a band guide mechanism hand cooperation) and place temporary platform, between processing of wafers unit and temporary platform, pick and place wafer by the another one linear drive apparatus.
This mode relates to one and rotatablely moves and the rotatablely move compounding practice of the compound motion formed with straight-line motion of another one, and kinematic accuracy design more complicated influence access sheet speed, and access wafer movement path complicacy.
Summary of the invention
The technical matters that (one) will solve
The technical matters that the present invention will solve is: a kind of delivery system of wafer-shaped article is provided, and its access sheet speed is fast, and the motion path of access wafer-shaped article is simple.
(2) technical scheme
For addressing the above problem; The invention provides a kind of delivery system of wafer-shaped article; Comprise at least two processing units, manipulator, said manipulator equates with the distance of each processing unit; Be used for pending wafer-shaped article is placed into said processing unit, and the wafer-shaped article that disposes is taken out.The centre of gration of said manipulator equates with the distance at each processing unit processes center.
Preferably, said processing unit is circumference or equilateral polygon array layout.
Preferably, also comprise at least one card casket, be used to deposit pending wafer-shaped article and the wafer-shaped article that disposes.
Preferably, said band guide mechanism hand is positioned at guide rail when the part in processing unit zone, makes the center of said band guide mechanism hand equate with each distance of handling unit center.
Preferably, said manipulator comprises: the card casket zone machines hand and the processing unit zone machines hand that is positioned at the processing unit zone that are positioned at card casket zone.
Preferably, also comprise temporary platform, be used for the wafer-shaped article of depositing pending wafer-shaped article temporarily or disposing.
(3) beneficial effect
The present invention equates with the distance of each processing unit through making manipulator; Rely on two manipulator self rotations and go up and down to realize the wafer-shaped article accessing operation; And can carry out transition through temporary platform and accomplish the sheet process that once passes; Perhaps adopt with band guide mechanism hand and get from card casket zone behind the sheet directly by through mobile the deliver to processing unit zone of manipulator on guide rail; This dual mode motion path is simple, and the access fast and reliable can effectively reduce shared footprint area with apparatus in comparison the present invention of the same type simultaneously.
Description of drawings
Fig. 1 is the structural representation that adopts the delivery system of the wafer-shaped article of keeping in platform described in the embodiment of the present invention;
Fig. 2 is the structural representation that adopts the delivery system of the wafer-shaped article of being with the guide mechanism hand described in the embodiment of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment, specific embodiments of the invention describes in further detail.Following examples are used to explain the present invention, but are not used for limiting scope of the present invention.
Shown in Fig. 1-2; The delivery system of wafer-shaped article of the present invention; Comprise at least two processing units 1, manipulator 2, said manipulator 2 equates with the distance of each processing unit 1; Be used for pending wafer-shaped article is placed into said processing unit 1, and the wafer-shaped article that disposes is taken out.The access arm center of said manipulator 2 equates with the distance at each processing unit processes center.
Preferably, said processing unit 1 is circumference or equilateral polygon array layout.
Preferably, also comprise at least one card casket 3, be used to deposit pending wafer-shaped article and the wafer-shaped article that disposes.
Preferably, said manipulator 2 is band guide mechanism hand, and said band guide mechanism hand is positioned at guide rail 4 when the part in processing unit zone, makes the center of said band guide mechanism hand equate with the distance at each processing unit 1 center.
Preferably, said manipulator 2 comprises: the card casket zone machines hand and the processing unit zone machines hand that is positioned at the processing unit zone that are positioned at card casket zone.
Preferably, also comprise temporary platform 5, be used for the wafer-shaped article of depositing pending wafer-shaped article temporarily or disposing.
The motion path of wafer-shaped article has two kinds among the present invention:
The motion path one of wafer-shaped article: from card casket 3, fetch wafer-shaped article by card casket zone machines hand and be placed on temporary platform 5; Fetching wafer-shaped article by processing unit zone machines hand from temporary platform 5 is placed into the processing unit 1;
The motion path two of wafer-shaped article: band guide mechanism hands movement fetches wafer-shaped article to card casket zone from card casket 3; Band guide mechanism hand clamping wafer-shaped article moves to the processing unit zone together; Band guide mechanism hand is put into wafer-shaped article in the processing unit 1.
Above embodiment only is used to explain the present invention; And be not limitation of the present invention; The those of ordinary skill in relevant technologies field under the situation that does not break away from the spirit and scope of the present invention, can also be made various variations and modification; Therefore all technical schemes that are equal to also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.
Claims (7)
1. the delivery system of a wafer-shaped article; Comprise at least two processing units (1), manipulator (2); It is characterized in that said manipulator (2) equates with the distance of each processing unit (1); Be used for pending wafer-shaped article is placed into said processing unit (1), and the wafer-shaped article that disposes is taken out.
2. the delivery system of wafer-shaped article as claimed in claim 1 is characterized in that, said processing unit (1) is circumference or equilateral polygon array layout.
3. the delivery system of wafer-shaped article as claimed in claim 1 is characterized in that, also comprises at least one card casket (3), is used to deposit pending wafer-shaped article and the wafer-shaped article that disposes.
4. the delivery system of wafer-shaped article as claimed in claim 3; It is characterized in that; Said manipulator (2) is band guide mechanism hand; Said band guide mechanism hand is positioned at guide rail (4) when the part in processing unit zone, makes the center of said band guide mechanism hand equate with the distance at each processing unit (1) center.
5. the delivery system of wafer-shaped article as claimed in claim 1 is characterized in that, said manipulator (2) comprising: the card casket zone machines hand and the processing unit zone machines hand that is positioned at the processing unit zone that are positioned at card casket zone.
6. the delivery system of wafer-shaped article as claimed in claim 5 is characterized in that, also comprises temporary platform (5), is used for the wafer-shaped article of depositing pending wafer-shaped article temporarily or disposing.
7. the delivery system of wafer-shaped article as claimed in claim 6 is characterized in that, said temporary platform comprises temporary platform (6) of at least one pending wafer-shaped article and the temporary platform (7) of at least one wafer-shaped article that disposes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110370142.3A CN102502253B (en) | 2011-11-18 | 2011-11-18 | Conveying system for wafer-shaped object |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110370142.3A CN102502253B (en) | 2011-11-18 | 2011-11-18 | Conveying system for wafer-shaped object |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102502253A true CN102502253A (en) | 2012-06-20 |
| CN102502253B CN102502253B (en) | 2014-09-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110370142.3A Active CN102502253B (en) | 2011-11-18 | 2011-11-18 | Conveying system for wafer-shaped object |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103824797A (en) * | 2012-11-16 | 2014-05-28 | 上海微电子装备有限公司 | Silicon-chip transportation device and method |
| WO2015014012A1 (en) * | 2013-08-01 | 2015-02-05 | 上海集成电路研发中心有限公司 | Device platform system and wafer transmission method thereof |
| CN103824797B (en) * | 2012-11-16 | 2016-11-30 | 上海微电子装备有限公司 | Chip transmission apparatus and method |
| CN106315210A (en) * | 2015-07-10 | 2017-01-11 | 上海微电子装备有限公司 | Wafer box storing and taking device and method |
| CN106910702A (en) * | 2017-03-02 | 2017-06-30 | 泉州市憬承光电科技有限公司 | A kind of automatic wafer transporter and transport method |
| CN113071795A (en) * | 2021-03-31 | 2021-07-06 | 江苏创源电子有限公司 | Material storage box mechanism and material storage device |
| CN114204409A (en) * | 2022-02-18 | 2022-03-18 | 武汉锐晶激光芯片技术有限公司 | Chip cavity surface processing device |
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| CN103824797A (en) * | 2012-11-16 | 2014-05-28 | 上海微电子装备有限公司 | Silicon-chip transportation device and method |
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| CN106910702B (en) * | 2017-03-02 | 2019-05-03 | 泉州市憬承光电科技有限公司 | A kind of automatic wafer transporter and transport method |
| CN113071795A (en) * | 2021-03-31 | 2021-07-06 | 江苏创源电子有限公司 | Material storage box mechanism and material storage device |
| CN114204409A (en) * | 2022-02-18 | 2022-03-18 | 武汉锐晶激光芯片技术有限公司 | Chip cavity surface processing device |
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|---|---|
| CN102502253B (en) | 2014-09-10 |
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