CN102478592A - Vertical type elastic probe structure - Google Patents
Vertical type elastic probe structure Download PDFInfo
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- CN102478592A CN102478592A CN2010105711374A CN201010571137A CN102478592A CN 102478592 A CN102478592 A CN 102478592A CN 2010105711374 A CN2010105711374 A CN 2010105711374A CN 201010571137 A CN201010571137 A CN 201010571137A CN 102478592 A CN102478592 A CN 102478592A
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- contact element
- probe
- probe structure
- rectilinear
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Abstract
The invention discloses a vertical type elastic probe structure. The probe mainly comprises a first contact, an elastomer and a second contact. The elastomer is at a middle position; the first contact and the second contact are respectively arranged at the periphery of the elastomer; and the elastomer is similar to a double-ring overlying type body but the upper shape and the lower shape of the elastomer are not symmetrical, so that the stress of the elastomer can be distributed uniformly when the elastomer is deformed due to compression. According to the invention, the provided probe can be applied for electrical connection between two members or can be installed in a probe card; and the probe has a good contact performance and can be applied to a high speed and high frequency chip test.
Description
Technical field
The invention relates to a kind of probe, particularly about a kind of design of miniature probe, can apply in high frequency, the apparatus for testing chip at a high speed, possessing can be by the elasticity of vertically compressing, to keep excellent contact state in the test process.
Background technology
Probe is mainly used in the test jobs of naked crystalline substance (die); Utilize a plurality of probes on it to contact, cooperate relevant testing tool and software control, carry out the test of naked brilliant each item function with naked crystalline substance; Filter out defective products; Repair or scrap,, and the yield of product is promoted so that carry out follow-up packaging operation again.
Along with the evolution of integrated circuit technology, live width and spacing between circuit are dwindled day by day, and probe also from needle point cantalever type probe crooked, that laterally place, changes the thinner and intensive vertical probe in pin footpath into.Vertical probe is also because of the lifting of technology; Can be divided into the spring probe that forms with machining; Or make the probe of various geometric cross section with chemical etching; Or the multilayer microprobe made from micro electronmechanical technology; Or adopt the dark etching model of little shadow (Lithographie Ga Vanoformung Abformung, LIGA) probe of processing of technology etc., for example " manufacturing approach of vertical probe measuring head " of Taiwan Industrial Technology Research Institute patent of invention I284209 number in Taiwan.The probe that present most vertical probe carb adopted all is that the middle section position at probe forms elastic buffer shape miscellaneous, makes probe when the test contact, have deflection and elasticity longitudinally, and the inventor thinks deeply the another kind of probe structure of design for this reason.
Summary of the invention
Fundamental purpose of the present invention provides a kind of rectilinear elastomeric probe structure; Innovation shaped design for a kind of miniature probe; Can apply in the apparatus for testing chip of high-frequency high-speed; Mainly be the elastic body design that is formed with upper and lower asymmetric in the probe centre position, elastomeric stress distribution is comparatively even when making probe stressed, with the serviceable life of continuity probe.
Another object of the present invention provides a kind of miniature probe structure of accurate positioning; This probe is micron (micro meter; μ m) level size requires comparatively strictness on the assembling location, so the present invention is designed with the single contact direction of probe the form of two contact elements; Can let probe accurately locate when mounted, to satisfy the demand of this type of apparatus for testing chip.
Further object of the present invention provides a kind of rectilinear elastomeric probe structure, and this probe can be as the conducting element of the electric connection between two members (like two circuit boards).
For reaching above-mentioned purpose; Probe shape of the present invention mainly is to be made up of at least one first contact element, an elastic body and at least one second contact element, and this elastic body is positioned at the centre position, and this first contact element and second contact element are formed at the upper and lower diverse location place of this elastomeric perimeter respectively; This elastic body is like the folded mutually type body of dicyclo; And the shape of upper and lower ring body is also asymmetric, and wherein a ring body is roomy than another ring body, and stress distribution was comparatively even when this elastic body was out of shape by compression.
Cooperate the detailed description of following diagram, embodiment, will on address other purposes of the present invention and advantage and be described in detail in after.
Description of drawings
Fig. 1 is the synoptic diagram of first kind of embodiment of the present invention.
Fig. 2 is the synoptic diagram of second kind of embodiment of the present invention.
Fig. 3 A is the synoptic diagram of the another kind of shape of the present invention's first contact element and second contact element.
Fig. 3 B is the synoptic diagram of the another kind of shape of the present invention's first contact element and second contact element.
Fig. 4 is the synoptic diagram of the third embodiment of the present invention.
Fig. 5 is the synoptic diagram of the made probe of utilization the present invention.
Fig. 6 A is the synoptic diagram of the probe of initial design of the present invention.
Fig. 6 B is the synoptic diagram under the probe stress of initial design of the present invention.
Fig. 7 is the synoptic diagram of the probe deformations of the third embodiment of the present invention when stressed.
Wherein, description of reference numerals is following:
1 probe, 2 probe
11 first contact elements, 3 circuit boards
12 elastic bodys, 4 first fixed cells
13 second contact elements, 41 storage tanks
1A probe 42 holes
11A first contact element 5 second fixed cells
13A second contact element 51 storage tanks
1B probe 52 holes
11B first contact element 6 chips to be measured
The 12B elastic body
13B second contact element
The 1C probe
The 12C elastic body
Embodiment
As shown in Figure 1, be synoptic diagram of the present invention.Probe 1 of the present invention mainly is to be made up of first contact element 11, elastic body 12 and 13 of first contact elements; 12 on elastic body is in the centre position; The folded mutually type body that forms of similar two rings, and the shape of upper and lower ring body and asymmetric, wherein a ring body presents similar ellipse body that couches or round body in the present embodiment; Another ring body is vertical type ellipse body, is low wide and up narrow design.The design of these elastic body 12 this kind shapes can make stress be uniformly distributed in elastic body everywhere when stressed being compressed, and avoids stress concentration at single ring body place, with the serviceable life of continuity probe.First contact element 11 and second contact element, 13 numbers have only one in the present embodiment; And present up and down each other correspondence and be arranged at outer wall place around the elastic body 12; First contact element 11, second contact element, 13 shapes present elongated needle-like; But this is merely a kind of embodiment of the present invention, does not therefore limit scope of the present invention.Probe 1 of the present invention is to constitute with the good metal material of electric conductivity, because shape is comparatively special, is of a size of a micron specification, during production is to adopt the dark etching model of little shadow (LIGA) technology to process.
As shown in Figure 2, be second kind of enforcement illustration of the present invention.Mainly be the shape of improvement first contact element 11A and the 3rd contact element 13A in the present embodiment; Probe 1A mainly is the conductor element as the electrical transmission usefulness between two kinds of objects in the present embodiment, and this moment, the length of the first contact element 11A and the second contact element 13A did not just need oversize.The shape of the first contact element 11A and the second contact element 13A then is the circular arc camber body in the present embodiment, only protrudes in the outer circumferential walls of elastic body 12.Hence one can see that; First contact element of the present invention and second contact element are not limited to specific shape; Need only make things convenient for the object (like circuit board, chip to be measured) that contacts with desire to cooperate gets final product; And for example shown in Fig. 3 A and shown in Fig. 3 B, the terminal shape of first contact element and second contact element also can be the shape at tip or two tips.
The number of other first contact element and second contact element is not limit one yet, and is as shown in Figure 4, and the third implements illustration for the present invention.Probe 1B has one first contact element 11B and two second contact element 13B in the present embodiment, and elastic body 12B shape is then same as the previously described embodiments.Because the present invention be miniature probe, the wherein design of two second contact element 13B, purpose is accurate position probe, and probe can not vacillated now to the left, now to the right, generation θ angular displacement problem, but the number of the first same contact element 11B also several.
When designing probe, shown in Fig. 6 A, the elastic body 12C that probe 1C is positioned at the centre position presents the folded mutually type body of similar many annulus to the inventor at first, but shape is corresponding each other up and down.But this type of probe 1C is (shown in Fig. 6 B) when stressed, and can't exert all one's strength is uniformly distributed in probe everywhere, and stress concentrates on the ring body (like the upper ring body among the figure) of contiguous force side easily and locates, and under long repeatable operation, probe is ruptured in stress raiser.Yet the present invention is the designed probe 1B of institute afterwards, and is as shown in Figure 7, and when the first contact element 11B was stressed, elastic body 12B can evenly exert all one's strength and be distributed in everywhere, can not produce the situation that stress is concentrated the somewhere, so can effectively continue the serviceable life of probe.
The above is merely the preferred embodiments of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (9)
1. rectilinear elastomeric probe structure; It is characterized in that including at least one first contact element, an elastic body and at least one second contact element; This elastic body has the shape of folded mutually type body of dicyclo and upper and lower ring body and asymmetric; Wherein a ring body is roomy than another ring body, and this first contact element and this second contact element are positioned at the upper and lower diverse location place of this elastomeric perimeter.
2. rectilinear elastomeric probe structure as claimed in claim 1 is characterized in that this first contact element and this second contact element all protrude in the outer circumferential walls face of this probe.
3. rectilinear elastomeric probe structure as claimed in claim 2 is characterized in that this second contact element and this first contact element are the circular arc camber body.
4. rectilinear elastomeric probe structure as claimed in claim 1 is characterized in that this first contact element and this second contact element are elongated aciculiform.
5. rectilinear elastomeric probe structure as claimed in claim 1 is characterized in that a ring body is ellipse body or the round body that seemingly couches, and another ring body is vertical type ellipse body.
6. rectilinear elastomeric probe structure as claimed in claim 1 is characterized in that the number of this first contact element is identical with the number of this second contact element.
7. rectilinear elastomeric probe structure as claimed in claim 1 is characterized in that the number of this first contact element is different from the number of this second contact element.
8. rectilinear elastomeric probe structure as claimed in claim 7, the number that it is characterized in that this first contact element is two.
9. rectilinear elastomeric probe structure as claimed in claim 7, the number that it is characterized in that this second contact element is two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105711374A CN102478592A (en) | 2010-11-30 | 2010-11-30 | Vertical type elastic probe structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105711374A CN102478592A (en) | 2010-11-30 | 2010-11-30 | Vertical type elastic probe structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102478592A true CN102478592A (en) | 2012-05-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105711374A Pending CN102478592A (en) | 2010-11-30 | 2010-11-30 | Vertical type elastic probe structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102478592A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108663553A (en) * | 2017-03-29 | 2018-10-16 | 上海中船电气有限公司 | A kind of contact semi-conducting material measuring head |
| CN111033273A (en) * | 2018-01-11 | 2020-04-17 | 欧姆龙株式会社 | Probe, inspection tool, inspection unit, and inspection apparatus |
| CN111812366A (en) * | 2020-08-05 | 2020-10-23 | 苏州韬盛电子科技有限公司 | Method for manufacturing wafer test micro probe based on micro electro mechanical system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5366380A (en) * | 1989-06-13 | 1994-11-22 | General Datacomm, Inc. | Spring biased tapered contact elements for electrical connectors and integrated circuit packages |
| EP1365250A1 (en) * | 2001-01-29 | 2003-11-26 | Sumitomo Electric Industries, Ltd. | Contact probe, method of manufacturing the contact probe, and device and method for inspection |
| CN1745306A (en) * | 2002-12-23 | 2006-03-08 | 佛姆费克托公司 | Microelectronic contact structure |
-
2010
- 2010-11-30 CN CN2010105711374A patent/CN102478592A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5366380A (en) * | 1989-06-13 | 1994-11-22 | General Datacomm, Inc. | Spring biased tapered contact elements for electrical connectors and integrated circuit packages |
| EP1365250A1 (en) * | 2001-01-29 | 2003-11-26 | Sumitomo Electric Industries, Ltd. | Contact probe, method of manufacturing the contact probe, and device and method for inspection |
| CN1745306A (en) * | 2002-12-23 | 2006-03-08 | 佛姆费克托公司 | Microelectronic contact structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108663553A (en) * | 2017-03-29 | 2018-10-16 | 上海中船电气有限公司 | A kind of contact semi-conducting material measuring head |
| CN108663553B (en) * | 2017-03-29 | 2022-01-25 | 上海中船电气有限公司 | Contact type semiconductor material testing head |
| CN111033273A (en) * | 2018-01-11 | 2020-04-17 | 欧姆龙株式会社 | Probe, inspection tool, inspection unit, and inspection apparatus |
| CN111033273B (en) * | 2018-01-11 | 2022-04-26 | 欧姆龙株式会社 | Probe, inspection tool, inspection unit, and inspection apparatus |
| CN111812366A (en) * | 2020-08-05 | 2020-10-23 | 苏州韬盛电子科技有限公司 | Method for manufacturing wafer test micro probe based on micro electro mechanical system |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120530 |