CN102477527B - Manufacture method of shell and shell manufactured by method - Google Patents

Manufacture method of shell and shell manufactured by method Download PDF

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Publication number
CN102477527B
CN102477527B CN201010555189.2A CN201010555189A CN102477527B CN 102477527 B CN102477527 B CN 102477527B CN 201010555189 A CN201010555189 A CN 201010555189A CN 102477527 B CN102477527 B CN 102477527B
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CN
China
Prior art keywords
target
layer
housing
matrix
making method
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Application number
CN201010555189.2A
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Chinese (zh)
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CN102477527A (en
Inventor
张新倍
陈文荣
蒋焕梧
陈正士
张�成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Zhongcai Wyse Education Technology Co ltd
Nantong Dongfang Science & Technology Co ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN201010555189.2A priority Critical patent/CN102477527B/en
Priority to US13/169,697 priority patent/US20120128948A1/en
Publication of CN102477527A publication Critical patent/CN102477527A/en
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Publication of CN102477527B publication Critical patent/CN102477527B/en
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0015—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterized by the colour of the layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0068—Reactive sputtering characterised by means for confinement of gases or sputtered material, e.g. screens, baffles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3435—Applying energy to the substrate during sputtering
    • C23C14/345—Applying energy to the substrate during sputtering using substrate bias
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3492—Variation of parameters during sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention provides a manufacture method of a shell, which comprises the steps of: providing a substrate; forming a color layer on the surface of the substrate by a magnetic sputtering method; then arranging a moveable baffle at the front end of a metal target, and powering on the power supply of the target, wherein the target is any one of a titanium target, a chromium target or a zirconium target; adjusting the baffle right ahead the target, and depositing for a certain time; sputtering target atoms on the baffle and removing the baffle when the number of atoms sputtered on the target and the sputtering speed are stable, so that the target atoms are sputtered on the substrate; after continuously sputtering for a period of time, powering off the power supply of the target; depositing and remaining a pattern layer on the surface of the color layer in the nucleation stage to form the pattern layer on the color layer. The shell manufactured by the manufacture method disclosed by the invention comprises the substrate, the color layer and the pattern layer, wherein the color layer is formed on the surface of the substrate, the pattern layer is formed on the surface of the color layer, and the pattern layer is a Ti, Cr or Zr film layer.

Description

The making method of housing and housing obtained by this method
Technical field
The present invention relates to a kind of making method and housing obtained by this method of housing.
Background technology
Along with the continuous progress of science and technology, the various electronic installations such as mobile phone and computer also develop rapidly, and its function is also more and more abundant.In order to make the exterior design design of electronic installation more rich and varied, can form pattern at surface of shell by modes such as bat printing, printing or laser sculptures traditionally, or form patterned layer by the mode of spraying paint at the surface of shell of electronic installation, make it present good outward appearance.
Magnetron sputtering technique has the features such as metal-like because of the outward appearance of the film of its environmental protection, preparation, more and more wider in the application in ornamental plated film field.At present, the way that forms patterned layer with magnetron sputtering technique on the housing of electronic installation normally prior to housing on magnetron sputtering one color layers, then this color layers of laser sculpture forms desired pattern or lines.But this kind of method is in the time forming the irregular pattern of small point-like and lines, the effect of processing is bad, and working (machining) efficiency is not high on the whole, has seriously restricted the lifting of output, has limited the competitive power of decorating field at case of electronic device.
Summary of the invention
Given this, be necessary to provide a kind of method for producing shell with asterism shape pattern.
In addition, be also necessary to provide a kind of by the prepared housing of aforesaid method.
A manufacture method for housing, comprises the following steps:
Matrix is provided;
Adopt magnetically controlled sputter method to form color layer on the surface of matrix;
On this color layer, continue to form patterned layer with magnetically controlled sputter method, at metal targets front end, one baffle plate moving is set, open target power supply, this target is titanium target, arbitrary target in chromium target or zirconium target, add hot basal body to 500～800 DEG C and keep this temperature, regulate this baffle plate to target right on, deposit 1～3 minute, target atom is splashed on this baffle plate, and the target atom quantity of sputter and sputtering rate are stablized, remove baffle plate, continue sputter and after 1～5 minute, close target power supply, make patterned layer stay in the forming core stage in the deposition on color layer surface, and the target atom of matrix surface spreads to nucleating center, thereby make core grow up and contact with adjacent core and form continuous asterism shape figure layer, to form described patterned layer, close target power supply after 1～10 minute, stop matrix heating.
The housing being made by aforesaid method, this housing comprises a matrix, a color layer, a patterned layer, and described color layer is formed at the surface of matrix, and described patterned layer is formed at the surface of color layer, and described patterned layer is Ti, Cr or Zr rete.
The making method of housing of the present invention is in the time forming patterned layer, make described patterned layer stay in the forming core stage in the deposition on color layer surface by the control matrix of filming parameter, under high temperature action, the target atom that forms patterned layer continues to nucleating center diffusion, core constantly to be grown up, produce a kind of decorative effect matrix of asterism, enrich the surface decoration effect of magnetron sputtering layer, improved the outward appearance competitive power of product.
Brief description of the drawings
Fig. 1 is the cross-sectional schematic of the housing of preferred embodiment of the present invention.
Fig. 2 is the schema that described housing is made in preferred embodiment of the present invention.
Main element nomenclature
Housing 10
Matrix 11
Color layer 13
Patterned layer 15
Protective layer 17
Embodiment
Refer to Fig. 1 and Fig. 2, the making method of the housing 10 of the present invention's one preferred embodiments comprises the steps:
One matrix 11 is provided, and this matrix 11 can be glass, pottery or stainless steel.
Matrix 11 is carried out to surface cleaning, to remove impurity and the greasy dirt etc. on matrix 11 surfaces, dry for standby after cleaning.Described cleaning comprises that matrix 11 is put into the ultrasonic cleaner that is loaded with ethanol or acetone soln shakes cleaning.
Matrix 11 after cleaning is fixed on the pivoted frame of magnetron sputtering coating equipment (not shown), and the vacuum chamber of this magnetron sputtering coater is vacuumized, making the pressure in this vacuum chamber is 3 × 10 -8pa, afterwards, passing into flow is 100～400sccm(standard state ml/min) argon gas (working gas); And the temperature that makes this cavity remains on 100～200 DEG C of left and right, taking nitrogen as reactant gases, setting nitrogen flow is 2～4sccm; The target using in the present embodiment can be titanium target, also can be the preparation such as chromium target or zirconium target color rete conventional target.In the preferred embodiment of the invention, use Ti target, setting titanium target power supply power is 4～9kw, matrix 11 is applied to the bias voltage of-100～-300V, dutycycle is 30～70%, and the revolution rotating speed that pivoted frame is set is 3 rpms of (revolution per minute, rpm), in matrix 11 surface magnetic control sputtering color layers 13.The time of magnetron sputtering color layer 13 is 10～40 minutes.
Please consult again Fig. 1, on color layer 13, form again a patterned layer 15, the step of preparing this patterned layer 15 is: a baffle plate is movably set in the vacuum chamber in described magnetron sputtering coater, and regulates this baffle plate to target right on (movement of baffle plate can operate by coating equipment Controlling System).Form in the present invention the target that patterned layer 15 uses and can be titanium target, also can be the target such as chromium target or zirconium target.The patterned layer 15 forming is Ti, Cr or Zr rete.Open target, setting target power is 4～9kw, matrix 11 is applied to the bias voltage of-100～-300V, dutycycle 30～70%, and Ar airshed 100～400sccm, adds hot basal body to 500～800 DEG C, offers sputter.Because the effect of blocking of baffle plate, now can be on matrix 11 plated film.After 1～3 minute, when from target as sputter ion out, when its quantity and speed are all comparatively stablized, remove rapidly the baffle plate before target, now, the atom of target institute sputter starts high speed deposition on matrix 11, after 1～5 minute, close target power supply again, make the deposition growing of target atom on color layer 13 rest on the forming core stage, thereby core is constantly grown and is contacted with adjacent core and forms continuous asterism shape figure layer, now under above-mentioned high temperature action, the target atom on matrix 11 surfaces has higher energy, still can continue to spread to nucleating center, core is constantly grown up.After 1～10 minute, stop heating, after matrix is cooling, is filled with air and finishes plated film.
The principle that forms starburst pattern in above-mentioned preparation method is, ion deposition process comprised atom absorption, surface diffusion, condense and forming core process of growth.Gas phase atom through being splashed to matrix 11 surfaces, all with certain energy, can carry out energy exchange with its surface atom after arrival matrix 11, matrix 11 surface free energies is reduced, thereby become stable, completes thus adsorption process.After being adsorbed, the gas phase atom that is splashed to matrix 11 surfaces loses the kinetic energy in surface normal direction, only there is the kinetic energy of parallel surfaces direction, rely on this kinetic energy, adatom does diffusion motion on surface, in this process, adatom mutually collides and condenses, when exceeding a certain threshold value, the atomicity of atomic group just forms stationary atom group, can catch other adatom and incident atoms, and form core, thereby core is constantly grown and contact with adjacent core and form continuous asterism shape figure layer.Can on matrix 11, form irregular point-like by above-mentioned deposition step and method, be similar to the exterior design effect of mid point point an array of stars at night, make to adopt the patterned layer 15 that aforesaid method forms to there is similar asterism shape outward appearance.
Form after described patterned layer 15, continue to prepare in this patterned layer 15 with the method for magnetron sputtering the protective layer 17 of layer of transparent, to improve, patterned layer 15 is wear-resisting, corrosion resistance nature.Concrete preparation method is: treat that matrix 11 temperature decline, and vacuumize cavity to 3 × 10 of this coating equipment -8pa, passing into flow is 100～400sccm(standard state ml/min) argon gas; And the temperature that makes this cavity remains on 100～200 DEG C of left and right, taking oxygen as reactant gases, setting oxygen flow is 200～150sccm; Available Ti target, Al target or Zr target in the present invention, forming described protective layer 17 can be Ti-O layer, Al-O layer or Zr-O layer.In the preferred embodiment of the invention, use Ti target, setting titanium target power supply power is 5～12kw, matrix 11 is applied to the bias voltage of-100～-300V, dutycycle is 30～70%, 100～200 DEG C of temperature, and the revolution rotating speed that pivoted frame is set is 3 rpms (revolution per minute, rpm), the time that sputter forms this protective layer 17 is 5～30 minutes.
Please consult again Fig. 1, by the prepared housing 10 of aforesaid method, this housing 10 comprises a matrix 11, a color layer 13, a patterned layer 15 and a protective layer 17, described color layer 13 is formed at the surface of matrix 11, described patterned layer 15 is formed at the surface of color layer 13, described protective layer 17 is formed at the surface of patterned layer 15, described color layer 13 can be Ti-N layer, Cr-N layer or Zr-N layer, described patterned layer 15 can be Ti layer, Cr layer or Zr layer, and described protective layer 17 can be Al-O layer, Si-O layer or Zr-O layer.
Matrix 11 can be glass, pottery or stainless steel.
Be noted that above-mentioned embodiment is only preferred embodiments of the present invention, those skilled in the art also can do other variation in spirit of the present invention.The variation that these do according to spirit of the present invention, within all should being included in the present invention's scope required for protection.

Claims (9)

1. a making method for housing, it comprises the steps:
Matrix is provided;
Adopt magnetically controlled sputter method to form color layer on the surface of matrix;
On this color layer, form patterned layer with magnetically controlled sputter method, the key step parameter that forms described patterned layer is: at metal targets front end, one baffle plate moving is set, this target is the arbitrary target in titanium target, chromium target or zirconium target; Open target power supply, add hot basal body to 500～800 DEG C and keep this temperature, regulate this baffle plate to target right on, deposit 1～3 minute, target atom is splashed on this baffle plate; Until the target atom quantity of sputter and sputtering rate stable after, remove baffle plate, target atom is sputtered onto on the color layer of matrix and closes target power supply after 1～5 minute, make target atom stay in the forming core stage in the deposition on color layer surface, and the target atom of matrix surface spreads to nucleating center, form continuous asterism shape figure layer thereby make core grow up and contact with adjacent core, to form described patterned layer, close target power supply after 1～10 minute, stop matrix heating.
2. the making method of housing as claimed in claim 1, is characterized in that: the processing parameter that magnetron sputtering forms described patterned layer is specially: target power is 4～9kw, and it is-100～-300V that base material is applied to bias voltage, and dutycycle is 30～70%.
3. the making method of housing as claimed in claim 1, is characterized in that: described patterned layer is Ti, Cr or Zr rete.
4. the making method of housing as claimed in claim 1, it is characterized in that: the processing parameter that magnetron sputtering forms color layer is: target is the arbitrary target in titanium target, chromium target or zirconium target, taking argon gas as working gas, the temperature of plated film cavity remains on 100-200 DEG C, the power of titanium target is 4～9kw, and the rete that forms color layer is Ti-N layer, Cr-N layer or Zr-N layer.
5. the making method of housing as claimed in claim 1, is characterized in that: described method is also included in the step of magnetron sputtering protective layer in described patterned layer, and this protective layer is Al-O layer, Si-O layer or Zr-O layer.
6. the making method of housing as claimed in claim 5, it is characterized in that: described in magnetron sputtering, the processing parameter of protective layer is: taking oxygen as reactant gases, setting oxygen flow is 200～150sccm, the time that sputter forms this protective layer is 5～30 minutes, target power is 5～12kw, matrix is applied to the bias voltage of-100～-300V, dutycycle is 30～70%, 5～30 minutes plated film time.
7. the making method of housing as claimed in claim 6, is characterized in that: the target of described formation protective layer is titanium target, aluminium target or zirconium target.
8. the making method of housing as claimed in claim 1, is characterized in that: described matrix is glass, pottery or stainless steel.
9. the housing being made by the method described in any one in claim 1-8.
CN201010555189.2A 2010-11-23 2010-11-23 Manufacture method of shell and shell manufactured by method Active CN102477527B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201010555189.2A CN102477527B (en) 2010-11-23 2010-11-23 Manufacture method of shell and shell manufactured by method
US13/169,697 US20120128948A1 (en) 2010-11-23 2011-06-27 Coated article and method for manufacturing same

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CN102477527B true CN102477527B (en) 2014-07-30

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US10202679B2 (en) * 2013-03-08 2019-02-12 Vapor Technologies Coated article having a vivid color
KR102160429B1 (en) * 2018-01-23 2020-09-29 주식회사 셀코스 Non-Conductive Semi-Transparent Metallic Color Film and Manufacturing Method thereof
CN109561177A (en) * 2018-11-19 2019-04-02 潮州三环（集团）股份有限公司 A kind of portable electronic device cover board and preparation method thereof
CN109334333A (en) * 2018-11-30 2019-02-15 维沃移动通信有限公司 Preparation method, shell and the terminal device of shell
CN110499495A (en) * 2019-09-05 2019-11-26 西安交通大学 It is a kind of using Zr as Cr-Me multilayer film of substrate and preparation method thereof

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US4745035A (en) * 1985-11-04 1988-05-17 Asulab S.A. Article having a wear resisting precious metal coating
US4997538A (en) * 1988-06-24 1991-03-05 Asulab S.A. Process for depositing a black-colored coating on a substrate and a black-colored coating obtained using this process
US5948548A (en) * 1997-04-30 1999-09-07 Masco Corporation Coated article
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