CN102438405B - Method for cleaning through hole smears of rigid-flexible printed circuit board - Google Patents
Method for cleaning through hole smears of rigid-flexible printed circuit board Download PDFInfo
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- CN102438405B CN102438405B CN 201110386278 CN201110386278A CN102438405B CN 102438405 B CN102438405 B CN 102438405B CN 201110386278 CN201110386278 CN 201110386278 CN 201110386278 A CN201110386278 A CN 201110386278A CN 102438405 B CN102438405 B CN 102438405B
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Abstract
The invention relates to a method for cleaning through hole smears of a rigid-flexible printed circuit board, belonging to the field of printed circuit board manufacturing. The cleaning method comprises the following steps: 1) using a novel decontamination liquid to remove polyimide and acrylic resin smears and swell epoxy resin smears; 2) using a potassium permanganate decontamination liquid to oxidize and crack the swollen epoxy resin; and 3) using a sulfuric acid-sodium oxalate system to remove the residual potassium permanganate liquid, thereby realizing the removal of through hole smears of the rigid-flexible board based on a low-valence chemical method, wherein every liter of decontamination liquid for removing polyimide and acrylic resin smears and swelling epoxy resin contains 20-50g of sodium hydroxide or potassium hydroxide, 10-40g of epoxy resin sweller, 1-5g of solubilizer, 10-60ml of polyimide sweller and the balance of water. The method provided by the invention realizes the low-cost smear cleaning, and has the characteristics of simple method and high decontamination efficiency. By using the method to clean the through holes of the rigid-flexible printed circuit board, a level hole wall having good hole interlocking capability can be obtained.
Description
Technical field
The invention belongs to printed circuit board and make the field, specially refer to the rigid-flexible combined circuit plate through hole of a kind of cleaning (or removal) and bore dirty method.
Background technology
The development trend of electronic product requires printed circuit board to develop along " light, thin, short, little " and multifunction direction.Rigid-flexible combined printed wiring board is little, in light weight with its size, can avoid Miswire, increases the assembling handiness, realizes that advantage such as 3 D stereo assembling will become an important directions of printed circuit board development.In rigid-flex combined board, layer with layer between, being electrically connected mainly between rigid plate and the flexible sheet realize by the plated through-hole of rigid region.Because rigid-flexible combined printed wiring board medium substrate contains rigid board material such as Resins, epoxy, woven fiber glass usually, and acrylate glue, flexible panel material such as polyimide, so after the boring, the empty interior logical powder (be called and bore dirt) that leaves above-mentioned materials and form that produces.Boring dirt must clean up before via metalization, otherwise can influence metallization performance, can cause scratching when serious between combined printed wiring board layer and the layer realizing electric interconnection.
For the comparatively single printed circuit board of base material component, can adopt the method for chemical cleaning solution to remove the brill dirt.Such as for the rigid printed circuit boards of base materials such as Resins, epoxy or woven fiber glass, bore dirt and can pass through potassium permanganate solution swelling, cracking removal; For the flexible printed-circuit board of polyimide base material, bore dirt and can adjust the liquid removal by alkaline PI.But for the multilayer printed circuit board of rigid-flexible combination, simple potassium permanganate solution and PI adjust liquid all can't remove the brill dirt fully.
Existing a kind of dirty method of rigid-flexible combined printed wiring board through hole brill of removing is that the method that adopts that plasma to clean realizes.Its technical scheme main points are: under the high-frequency and high-voltage electric field action, with CF
4And O
2Be ionized into CF
3, F, O, CF, e plasma body, highly active plasma body can react with the macromolecular materials such as epoxy glass fabric, vinylformic acid and polyimide of hole wall and form CO
2, H
2Gas shape materials such as O, thus reach purpose except desmearing.But plasma cleans and has high input with equipment, and every facility investment is more than 1,000,000, and the influence of subject plasma generation cavity volume, and cleaning efficiency is lower.In addition, because plasma gas, causes through hole hole wall lack of homogeneity behind the desmearing to the removal speed difference of differing materials.
Summary of the invention
The invention provides a kind of rigid-flexible combined printed wiring board through hole and bore dirty purging method.This method realizes simultaneously that by the novel decontamination liquid of configuration polyimide, acrylic resin bore dirty the cleaning and the Resins, epoxy swelling, carries out the Resins, epoxy oxicracking then and finishes desmearing, has that the decontamination cost is low, efficient is high, characteristics simple to operate.
The concrete technological method of the present invention is as follows:
A kind of rigid-flexible combined printed wiring board through hole bores dirty purging method, as shown in Figure 1, may further comprise the steps:
Step 1: prepare two kinds of decontamination liquids.
First kind of decontamination liquid wherein, every liter contains sodium hydroxide or potassium hydroxide 20～50g, Resins, epoxy swelling agent 10～40g, solubilizing agent 1～5g, polyimide swelling agent 10～60ml, and all the other are water; Second kind of decontamination liquid, every liter contains sodium hydroxide or potassium hydroxide 10～50g, potassium permanganate 30～60g, clorox 0.1～2g, and all the other are water.
Step 2: polyimide, acrylic resin bore dirty removal and Resins, epoxy bores dirty swelling.
Rigid-flexible combined printed wiring board after the boring is soaked in first kind of decontamination liquid that step 1 prepares, under 30～80 ℃ temperature condition, soaked 3～10 minutes, and adopted the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process.
Step 3: the Resins, epoxy of potassium permanganate oxidation cracking swelling.
Printed circuit board after step 2 immersion is taken out and uses deionized water rinsing, be soaked in then in second kind of decontamination liquid that step 1 prepares, under 50～80 ℃ temperature condition, soaked 5～20 minutes, and adopted the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process.
Step 4: remove the potassium permanganate debris.
Taking-up after step 3 soaked is also used deionized water rinsing, be soaked in then in the mixing solutions of sulfuric acid-sodium oxalate, under 30～50 ℃ temperature condition, soaked 2～15 minutes, and adopted the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process.The mixing solutions of described sulfuric acid-sodium oxalate, every liter contains the vitriol oil 50～200ml sodium oxalate 10～50g, and all the other are water.
Technique scheme, what need further specify is:
1, in first kind of decontamination liquid: described Resins, epoxy swelling agent is a kind of organism identical with the epoxide resin reactive group that contain, to come swelling Resins, epoxy by the similar compatibility principle; Described polyimide swelling agent is a kind of organism identical with the polyimide active group that contain, to come the swelling polyimide by the similar compatibility principle; Described solubilizing agent is a kind of hydrophilic pure type organic, can improve Resins, epoxy swelling agent or the solubleness of polyimide swelling agent in the aqueous solution; Potassium hydroxide or sodium hydroxide can decompose the polyimide of acrylic resin and swelling.
When 2, step 2 adopts first kind of decontamination liquid to soak printed circuit board, can realize simultaneously that polyimide, acrylic resin bore dirty removal and Resins, epoxy bores dirty swelling.
When 3, step 3 adopted second kind of decontamination liquid to soak printed circuit board, main purpose was to adopt the potassium permanganate oxidation cracking to bore dirty through the Resins, epoxy of step 2 swelling; Also adopt simultaneously potassium hydroxide or sodium hydroxide further to decompose and remove polyimide, the dirt of acrylic resin brill that step 2 may be residual.
4, step 3 adopts the potassium permanganate oxidation cracking after the Resins, epoxy of step 2 swelling bores dirt, meeting lingering section potassium permanganate debris in printed circuit board and the boring, wherein contain potassium permanganate, potassium manganate and Manganse Dioxide, so adopt the mixing solutions of sulfuric acid-sodium oxalate to remove the potassium permanganate debris.
The present invention is by the novel decontamination liquid of configuration, realize that simultaneously polyimide, acrylic resin bore dirty the removal and the Resins, epoxy swelling, carry out the Resins, epoxy oxicracking then, realized boring dirty the cleaning cheaply, have the characteristics that method is simple, detersive efficiency is high simultaneously.Bore dirty purging method by rigid-flexible combined printed wiring board through hole provided by the invention rigid-flexible combined printed wiring board through hole is cleaned, can access smooth, good with hole copper snap-in force hole wall.
Description of drawings
Fig. 1 is schematic flow sheet of the present invention.
Fig. 2 is for passing through the inventive method desmearing, four layers of rigid-flexible combined printed wiring board through hole cut-plane slices figure that obtain behind the hole metallization.
Embodiment
Embodiment 1
Use mechanical numerical control machine to bore the 0.25mm through hole in four layers of rigid-flexible combined printed wiring board, the rigid-flex combined board structure is the middle double-faced flexible plate that is, both sides are respectively the single face rigid plate.The rigidity sheet material beneficial 18/0.2FR-4 single-side coated copper plate material of making a living, flexible sheet are platform rainbow 18/25/18 calendering PI halogen double face copper.Use the inventive method desmearing, hole metallization then, its technological process is as follows:
Step 1: prepare two kinds of decontamination liquids;
First kind of decontamination liquid wherein, every liter contain sodium hydroxide or potassium hydroxide 35g, as the ethylene glycol ethyl ether 30g of Resins, epoxy swelling agent, as the butyleneglycol 2g of solubilizing agent, as the diamine 40ml of polyimide swelling agent, all the other are water; Second kind of decontamination liquid, every liter contains sodium hydroxide or potassium hydroxide 35g, potassium permanganate 55g, clorox 0.5g, and all the other are water;
Step 2: polyimide, acrylic resin bore dirty removal and Resins, epoxy bores dirty swelling;
Rigid-flexible combined printed wiring board after the boring is soaked in first kind of decontamination liquid that step 1 prepares, under 50 ℃ temperature condition, soaked 6 minutes, adopt the vibration printed circuit board in the immersion process or the mode of inflating improves the grout ability of decontaminating solution;
Step 3: the Resins, epoxy of potassium permanganate oxidation cracking swelling;
Printed circuit board after step 2 immersion is taken out and uses deionized water rinsing, be soaked in then in second kind of decontamination liquid that step 1 prepares, under 75 ℃ temperature condition, soaked 10 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process;
Step 4: remove the potassium permanganate debris;
Taking-up after step 3 soaked is also used deionized water rinsing, be soaked in then in the mixing solutions of sulfuric acid-sodium oxalate, under 40 ℃ temperature condition, soaked 10 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process; The mixing solutions of described sulfuric acid-sodium oxalate, every liter contains vitriol oil 100ml sodium oxalate 30g, and all the other are water.
Rigid-flexible combined printed wiring board is carried out alkaline degreasing, black hole, plating, obtain the through hole behind the hole metallization.After plating is finished, make through hole cut-plane slices figure, slice map shows that the through hole hole wall is even.According to the IPC method through hole being carried out reliability detects: placed in 280 ℃ of high temperature thermal shocking 10 seconds, and impacted 3 times, the making through hole is cut into slices, and slice map shows that hole copper is intact, and desmearing is respond well.
Embodiment 2
Use mechanical numerical control machine to bore the 0.30mm through hole at six layers of rigid-flexible combined printed wiring board, the rigid-flex combined board structure is the double-faced flexible plate in the middle of being, both sides are respectively two-sided rigid plate.The rigidity sheet material beneficial 35/0.5/35FR-4 double-sided copper-clad plate of making a living, flexible sheet are platform rainbow 18/25/18 calendering PI halogen double face copper.Use the inventive method desmearing, hole metallization, its technological process is as follows:
Step 1: prepare two kinds of decontamination liquids;
First kind of decontamination liquid wherein, every liter contain sodium hydroxide or potassium hydroxide 35g, as the ethylene glycol ethyl ether 20g of Resins, epoxy swelling agent, as the butyleneglycol 2g of solubilizing agent, as the buzane 40ml of polyimide swelling agent, all the other are water; Second kind of decontamination liquid, every liter contains sodium hydroxide or potassium hydroxide 35g, potassium permanganate 55g, clorox 0.5g, and all the other are water;
Step 2: polyimide, acrylic resin bore dirty removal and Resins, epoxy bores dirty swelling;
Rigid-flexible combined printed wiring board after the boring is soaked in first kind of decontamination liquid that step 1 prepares, under 50 ℃ temperature condition, soaked 6 minutes, adopt the vibration printed circuit board in the immersion process or the mode of inflating improves the grout ability of decontaminating solution;
Step 3: the Resins, epoxy of potassium permanganate oxidation cracking swelling;
Printed circuit board after step 2 immersion is taken out and uses deionized water rinsing, be soaked in then in second kind of decontamination liquid that step 1 prepares, under 75 ℃ temperature condition, soaked 10 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process;
Step 4: remove the potassium permanganate debris;
Taking-up after step 3 soaked is also used deionized water rinsing, be soaked in then in the mixing solutions of sulfuric acid-sodium oxalate, under 40 ℃ temperature condition, soaked 10 minutes, adopt the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process; The mixing solutions of described sulfuric acid-sodium oxalate, every liter contains vitriol oil 100ml sodium oxalate 30g, and all the other are water.
Rigid-flexible combined printed wiring board is carried out alkaline degreasing, black hole, plating, obtain the through hole behind the hole metallization.After plating is finished, make through hole cut-plane slices figure, slice map shows that the through hole hole wall is even.According to the IPC method through hole being carried out reliability detects: placed in 280 ℃ of high temperature thermal shocking 10 seconds, and impacted 3 times, the making through hole is cut into slices, and slice map shows that hole copper is intact, and desmearing is respond well.
Those skilled in the art should know; above-mentioned two embodiment are not to be limitation of the invention further, and other are any to bore the dirty purging method that carries out according to technical solution of the present invention all within the scope i volume of the present patent application protection to rigid-flexible combined printed wiring board.It will be appreciated by those skilled in the art that all numerical ranges in the technical solution of the present invention (content, temperature, time etc.) only can influence the efficient of boring dirty cleaning, can't influence and bore dirty essence of cleaning.
Claims (7)
1. a rigid-flexible combined printed wiring board through hole bores dirty purging method, may further comprise the steps:
Step 1: prepare two kinds of decontamination liquids;
First kind of decontamination liquid wherein, every liter contains sodium hydroxide or potassium hydroxide 20～50g, Resins, epoxy swelling agent 10～40g, solubilizing agent 1～5g, polyimide swelling agent 10～60ml, and all the other are water; Second kind of decontamination liquid, every liter contains sodium hydroxide or potassium hydroxide 10～50g, potassium permanganate 30～60g, clorox 0.1～2g, and all the other are water;
Step 2: polyimide, acrylic resin bore dirty removal and Resins, epoxy bores dirty swelling;
Rigid-flexible combined printed wiring board after the boring is soaked in first kind of decontamination liquid that step 1 prepares, under 30～80 ℃ temperature condition, soaked 3～10 minutes, and adopted the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process;
Step 3: the Resins, epoxy of potassium permanganate oxidation cracking swelling;
Printed circuit board after step 2 immersion is taken out and uses deionized water rinsing, be soaked in then in second kind of decontamination liquid that step 1 prepares, under 50～80 ℃ temperature condition, soaked 5～20 minutes, and adopted the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process;
Step 4: remove the potassium permanganate debris;
Taking-up after step 3 soaked is also used deionized water rinsing, be soaked in then in the mixing solutions of sulfuric acid-sodium oxalate, under 30～50 ℃ temperature condition, soaked 2～15 minutes, and adopted the mode of vibrating printed circuit board or inflating to improve the grout ability of decontaminating solution in the immersion process; The mixing solutions of described sulfuric acid-sodium oxalate, every liter contains the vitriol oil 50～200ml sodium oxalate 10～50g, and all the other are water.
2. rigid-flexible combined printed wiring board through hole according to claim 1 bores dirty purging method, it is characterized in that, Resins, epoxy swelling agent described in described first kind of decontamination liquid is a kind of organism identical with the epoxide resin reactive group that contain, to come swelling Resins, epoxy by the similar compatibility principle.
3. rigid-flexible combined printed wiring board through hole according to claim 2 bores dirty purging method, it is characterized in that, described to contain the organism identical with the epoxide resin reactive group be ethylene glycol ethyl ether.
4. rigid-flexible combined printed wiring board through hole according to claim 1 bores dirty purging method, it is characterized in that, polyimide swelling agent described in described first kind of decontamination liquid is a kind of organism identical with the polyimide active group that contain, to come the swelling polyimide by the similar compatibility principle.
5. rigid-flexible combined printed wiring board through hole according to claim 4 bores dirty purging method, it is characterized in that, described to contain the organism identical with the polyimide active group be diamine or buzane.
6. rigid-flexible combined printed wiring board through hole according to claim 1 bores dirty purging method, it is characterized in that, solubilizing agent is a kind of hydrophilic pure type organic described in described first kind of decontamination liquid, can improve Resins, epoxy swelling agent or the solubleness of polyimide swelling agent in the aqueous solution.
7. rigid-flexible combined printed wiring board through hole according to claim 6 bores dirty purging method, it is characterized in that described hydrophilic pure type organic is butyleneglycol.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110386278 CN102438405B (en) | 2011-11-29 | 2011-11-29 | Method for cleaning through hole smears of rigid-flexible printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110386278 CN102438405B (en) | 2011-11-29 | 2011-11-29 | Method for cleaning through hole smears of rigid-flexible printed circuit board |
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| CN102438405A CN102438405A (en) | 2012-05-02 |
| CN102438405B true CN102438405B (en) | 2013-08-14 |
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| CN103298269B (en) * | 2013-05-13 | 2016-03-09 | 广东生益科技股份有限公司 | A kind of manufacture method of pcb board |
| CN104093279A (en) * | 2014-07-16 | 2014-10-08 | 电子科技大学 | Printed-circuit board manufacturing method based on laser groove machining technology |
| CN104470237A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Drill dirt removing method for rigid-flexible combined board |
| CN107734870A (en) * | 2017-09-26 | 2018-02-23 | 深圳明阳电路科技股份有限公司 | A kind of rigid-flex combined board is except the method for boring dirt |
| CN109323948A (en) * | 2018-08-15 | 2019-02-12 | 深圳崇达多层线路板有限公司 | A kind of testing mould and test method that can be improved except glue uniformity and efficiency |
| CN109219262A (en) * | 2018-09-13 | 2019-01-15 | 镇江华印电路板有限公司 | A kind of efficient Rigid Flex is except boring dirty method |
| CN111499915A (en) * | 2019-12-30 | 2020-08-07 | 瑞声科技(新加坡)有限公司 | Surface treatment method of L CP film |
| EP4237482A1 (en) * | 2020-10-30 | 2023-09-06 | PostProcess Technologies Inc. | Compositions for removing resin and ceramic from a surface of an object and methods of using such compositions |
| CN113174591B (en) * | 2021-03-20 | 2023-02-07 | 福建闽威科技股份有限公司 | Pretreatment process and treatment equipment for electroless copper plating of double-sided printed circuit board |
| CN113814224A (en) * | 2021-08-23 | 2021-12-21 | 中国电子科技集团公司第十五研究所 | Printed board hole wall drilling dirt treatment method |
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| CN102120828A (en) * | 2011-03-18 | 2011-07-13 | 常州大学 | Swelling solution for removing through-hole residues of epoxy resin circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06350229A (en) * | 1993-06-08 | 1994-12-22 | Sumitomo Bakelite Co Ltd | Cleaning method of printed circuit board |
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2011
- 2011-11-29 CN CN 201110386278 patent/CN102438405B/en not_active Expired - Fee Related
Patent Citations (5)
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|---|---|---|---|---|
| US5261967A (en) * | 1991-07-17 | 1993-11-16 | Church & Dwight Co, Inc. | Powdered electric circuit assembly cleaner |
| CN1248881A (en) * | 1998-09-21 | 2000-03-29 | 电化学公司 | Permanganate dirt-removing method for printed-circuit board |
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Non-Patent Citations (1)
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