CN102403255A - Mechanical chuck and etching machine - Google Patents
Mechanical chuck and etching machine Download PDFInfo
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- CN102403255A CN102403255A CN2010102847546A CN201010284754A CN102403255A CN 102403255 A CN102403255 A CN 102403255A CN 2010102847546 A CN2010102847546 A CN 2010102847546A CN 201010284754 A CN201010284754 A CN 201010284754A CN 102403255 A CN102403255 A CN 102403255A
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- male member
- chuck
- pallet
- arc
- mechanical chuck
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Abstract
The invention relates to a mechanical chuck and an etching machine using the mechanical chuck. The mechanical chuck comprises a supporting plate, a clamping plate and a flow control structure, a fluid cavity is arranged between the supporting plates and the clamping plate, and the flow control structure which is used for preventing temperature adjusting fluid from directly flowing out of the fluid cavity is arranged around the supporting plates and the clamping plate and respectively connected with the supporting plates and the clamping plate. Since the flow control structure which is used for preventing temperature adjusting fluid from directly flowing out of the fluid cavity is arranged in the mechanical chuck, the temperature adjusting fluid can completely contact with the back of a wafer on the supporting plate, heat exchanging efficiency and speed are increased while outflow of helium from the fluid cavity into a technical cavity is reduced, and purity degree of the technical cavity where the mechanical chuck is positioned can be improved.
Description
Technical field
The present invention relates to semiconductor fabrication, particularly a kind of mechanical chuck and etching machine.
Background technology
In semiconductor technology processing procedures such as integrated circuit manufacturing, LED manufacturing,, all rely on mechanical chuck to fix and supporting wafers like technologies such as etching, sputter and chemical vapour deposition (CVD)s.Mechanical chuck prevents that except the fixed support wafer it from taking place outside displacement and the vibration in technical process, it also is a critical function of mechanical chuck that the temperature of wafer is controlled.Mechanical chuck is installed in the processing chamber, and is not contaminated with the surface of guaranteeing wafer.
Fig. 1 is the structural representation of existing mechanical chuck.As shown in Figure 1; The existing machinery chuck comprises pallet 101, chuck 102 and pressure ring 108; Wherein, Be provided with fluid cavity 109 between pallet 101 and the chuck 102, pressure ring 108 is positioned at the top of pallet 101 and along its circumference setting, and the pad 106 support wafers 107 that pallet 101 can be through being arranged at its circumference are so that form slight void 111 between pallet 101 and the wafer 107; And wafer 107 can be stabilized in pallet 101 by pressure ring 108, and chuck 102 is provided with at least one conduction hole 112 that is connected with slight void 111; And chuck 102 is provided with the through hole 103 that is connected with fluid cavity 109, and temperature adjustable fluid (like helium) can feed in the fluid cavity 109 through this through hole 103, and gets into slight void 111 by conduction hole 112.
When using the existing mechanical chuck; The fluid cavity 109 that temperature adjustable fluid gets between pallets 101 and the chuck 102 from 103 of chuck 102 settings, the lower surface that the conduction hole 112 on the temperature adjustable fluid process pallet 101 arrives wafers 107 is to carry out heat exchange with wafer 107; But because differential pressure action; Most of temperature adjustable fluid goes out fluid cavity 109 through the path flow straight that is parallel to pallet 101 lower surfaces and chuck 102 upper surfaces; Make quite most of helium not participate in heat exchange and just leave fluid cavity 109 entering processing chambers, cause mechanical chuck poor the temperature control effect of wafer 107; Further; Can increase the temperature adjustable fluid amount of participating in heat exchange though feed excessive temperature adjustable fluid; Improvement is to the thermoregulation effect of wafer 107; But this processing mode will cause more temperature adjustable fluid to get into processing chamber, not only cause the serious waste of temperature adjustable fluid, also polluted wafer 107 the surface, damaged the processing procedure quality of wafer 107.
Summary of the invention
The purpose of present embodiment provides a kind of mechanical chuck and etching machine, is used for solving temperature controlled weak effect and the helium waste serious technical problem of prior art mechanical chuck to wafer.
For addressing the above problem, present embodiment provides a kind of mechanical chuck, comprises pallet and chuck, is provided with fluid cavity between this pallet and the chuck, it is characterized in that, also comprises being used to stop temperature adjustable fluid to flow out the control flow structure of said fluid cavity straight;
Said control flow structure is provided with around the circumference of said pallet and said chuck, and is connected with said chuck with said pallet respectively.
Wherein, Said control flow structure comprises two male members that are crisscross arranged respectively on said pallet and chuck; The height sum of said two male members is greater than the distance between said pallet and the chuck, and said two control runners that male member constituted are used to stop said temperature adjustable fluid to flow out said fluid cavity straight.
Wherein, said control flow structure comprises suitable male member and groove, and the height of said male member is greater than the distance between said pallet and the chuck; Said male member is arranged on the said pallet, and said groove is arranged on the said chuck, and the control runner that said male member and groove constituted is used to stop said temperature adjustable fluid to flow out said fluid cavity straight.
Wherein, said control flow structure comprises suitable male member and groove, and the height of said male member is greater than the distance between said pallet and the chuck; One of said groove is arranged on the said pallet, and said male member is arranged on the said chuck, and the control runner that said male member and groove constituted is used to stop said temperature adjustable fluid to flow out said fluid cavity straight.
Wherein, said control flow structure comprises suitable male member and right angle breach, and the height of said male member is greater than the distance between said pallet and the chuck; Said male member is arranged on the said pallet, and said right angle breach is arranged on the said chuck, and the control runner that said male member and right angle breach are constituted is used to stop said temperature adjustable fluid to flow out said fluid cavity straight.
Wherein, said control flow structure comprises suitable male member and right angle breach, and the height of said male member is greater than the distance between said pallet and the chuck; Said right angle breach is arranged on the said pallet, and said male member is arranged on the said chuck, and the control runner that said male member and right angle breach are constituted is used to stop said temperature adjustable fluid to flow out said fluid cavity straight.
Wherein, said control flow structure comprises suitable arc male member and arc notch, and the height of said arc male member is greater than the distance between said pallet and the chuck; Said arc male member is arranged on the said pallet, and said arc notch is arranged on said on chuck, and the control runner between said arc male member and the arc notch stops said temperature adjustable fluid to flow out said fluid cavity straight.
Wherein, said control flow structure comprises suitable arc male member and arc notch, and the height of said arc male member is greater than the distance between said pallet and the chuck; Said arc notch is arranged on the said pallet, and said arc male member is arranged on the said chuck, and the control runner between said arc male member and the arc notch stops said temperature adjustable fluid to flow out said fluid cavity straight.
Wherein, said control flow structure comprises two mutually nested arcuate structures, and the control runner that two said arcuate structures are constituted is used to stop said temperature adjustable fluid to flow out said fluid cavity straight.
Wherein, said arcuate structure is a C shape.
Wherein, said male member and groove are respectively suitable arc male member and arc groove.
Wherein, said arc male member and arc groove are respectively the arc male member of C shape and the arc groove of C shape.
Present embodiment also provides a kind of etching machine, wherein, comprises processing chamber, vacuum pump, top electrode, bottom electrode and above-mentioned any described mechanical chuck, and said mechanical chuck is arranged in the said processing chamber to be used to carry wafer to be processed.
Mechanical chuck provided by the present invention and etching machine; Stop temperature adjustable fluid to flow out the control flow structure of said fluid cavity straight through set being used in mechanical chuck; Make temperature adjustable fluid fully to contact with the chip back surface on being positioned over pallet; Improving the efficient and the speed of heat exchange, and reduce helium flows to processing chamber from fluid cavity discharge, helped improving the degree of purity of the processing chamber at mechanical chuck place.
Description of drawings
Fig. 1 is the structural representation of existing mechanical chuck;
Fig. 2 is the structural representation of mechanical chuck first specific embodiment provided by the invention;
Fig. 3 is the structural representation of mechanical chuck second specific embodiment provided by the invention;
Fig. 4 is the structural representation of mechanical chuck the 3rd specific embodiment provided by the invention;
Fig. 5 is the structural representation of mechanical chuck the 4th specific embodiment provided by the invention;
Fig. 6 is the structural representation of mechanical chuck the 5th specific embodiment provided by the invention;
Fig. 7 is the structural representation of mechanical chuck the 6th specific embodiment provided by the invention;
Fig. 8 is the structural representation of mechanical chuck the 7th specific embodiment provided by the invention;
Fig. 9 is the structural representation of mechanical chuck the 8th specific embodiment provided by the invention;
Figure 10 is the structural representation of mechanical chuck the 9th specific embodiment provided by the invention;
Figure 11 is the structural representation of etching facility body embodiment provided by the invention.
Embodiment
Through accompanying drawing and embodiment, technical scheme of the present invention is done detailed description further below.
Fig. 2 is the structural representation of mechanical chuck first specific embodiment provided by the invention.As shown in Figure 2; The present embodiment mechanical chuck comprises pallet 101, chuck 102 and control flow structure; In practical application, pallet 101 is generally circular with chuck 102, through the through hole on the chuck 102 103 helium of temperature adjustment is sent to the fluid cavity 109 between pallet 101 and the chuck 102; The assembly of control flow structure is separately positioned on fixed tray 101 and the chuck 102; And around the circumference of pallet 101 and chuck 102, the direction when being used to change helium flow and going out fluid cavity 109, thus helium effluent fluid chamber 109 straight stoped; In the present embodiment, the control flow structure comprises two male members 104, and male member 104 is separately fixed on pallet 101 and the chuck 102; And around pallet 101 and chuck 102 circumference, the position between two male members 104 is crisscross arranged, and male member 104 is arranged on the outside of the male member 104 on the chuck 102 on the pallet 101; Wherein, the height of the male member 104 on the pallet 101 is H, and the male member 104 on 102 highly is H; The height sum of two male members 104 is greater than the height of the fluid cavity 109 between pallet 101 or the chuck 102; Space between two male members 104 has been for control runner 105, control runner 105 has changed the outflow direction of helium from fluid cavity 109, stops helium effluent fluid chamber 109 straight on the footpath straight path on the surface that is parallel to pallet 101 or chuck 102; Helium can fully be contacted with wafer 107 back sides on being placed on pallet 101; Avoid helium from fluid cavity 109, to flow out fast,, realize its purpose wafer 107 effective temperature controls to improve the efficient of heat exchange; And reduced helium and get into the flow of processing chambers from fluid cavity 109, help improving the degree of purity of the processing chamber at mechanical chuck place.
Fig. 3 is the structural representation of mechanical chuck second specific embodiment provided by the invention.As shown in Figure 3, different with the structure of mechanical chuck shown in Figure 2 is, in the present embodiment, the male member on the pallet 101 104 is arranged on the inboard of the male member 104 on the chuck 102, and the height sum of two male members 104 is greater than the height of fluid cavity 109.
Fig. 4 is the structural representation of mechanical chuck the 3rd specific embodiment provided by the invention.Different with Fig. 2 or Fig. 3 is; Control flow structure in the present embodiment comprises two mutually nested arcuate structures 110; The control runner 105 that two arcuate structures 110 are constituted stops temperature adjustable fluid helium effluent fluid chamber 109 straight; Arcuate structure 110 can be C shape, also can be other shaped form, like waveform or complicated winding curve etc.
Fig. 5 is the structural representation of mechanical chuck the 4th specific embodiment provided by the invention.As shown in Figure 5; Male member 104 is fixed on the pallet 101, and the height H of male member 104 is greater than the height of fluid cavity 109, and chuck 102 circumference are provided with the right angle breach suitable with male member 104; Male member 104 is formed the control flow structure with the right angle breach; Space between the recessed and male member 104 of square is for control runner 105, in practical application, also can be on male member 104 fixing chuck 102; Pallet 101 circumference are provided with the right angle breach suitable with male member 104, and the width L that will control runner 105 usually is arranged on the 0.1mm magnitude.Control runner 105 can stop helium effluent fluid chamber 109 straight on the footpath straight path on the surface that is parallel to pallet 101 or chuck 102; To avoid outflow fast in the helium longshore current body cavity 109; And then can make helium fully to contact with wafer 107 back sides; Realize its purpose, and reduced helium flows to processing chamber from fluid cavity 109 discharge, help improving the degree of purity of the processing chamber at mechanical chuck place wafer 107 effective temperature controls.
Fig. 6 is the structural representation of mechanical chuck the 5th specific embodiment provided by the invention.As shown in Figure 6, different with Fig. 5 is that the control flow structure in the present embodiment is made up of arc male member 104 and arc notch; For example can form by C shape male member 104 and C v notch v; C shape male member 104 is arranged on the circumference of pallet 101, and the C v notch v is arranged on the circumference of chuck 102, to prolong the length of the shape male member 104 and the control runner 105 of C v notch v formation; Further stop helium effluent fluid chamber 109 straight on the footpath straight path on the surface that is parallel to pallet 101 or chuck 102; In practical application, also can C shape male member 104 be arranged on the circumference of chuck 102, the C v notch v is arranged on the circumference of pallet 101.
Fig. 7 is the structural representation of mechanical chuck the 6th specific embodiment provided by the invention.As shown in Figure 7, in the present embodiment mechanical chuck, male member 104 is fixed on the pallet 101; Chuck 102 is provided with the groove suitable with male member 104; This groove is formed by being fixed on chuck 102 lip-deep two male members 104, and the male member 104 on the pallet 101 and the height sum of the male member 104 on the chuck 102 are nested in the groove male member 104 less than the height of fluid cavity 109; Male member 104 is formed the control flow structure with groove, and the space between groove and the male member 104 is control runner 105; In practical application, also can groove be arranged on the pallet 101, suitable with it male member 104 is arranged on the chuck 102.
Fig. 8 is the structural representation of mechanical chuck the 7th specific embodiment provided by the invention.As shown in Figure 8; Different with Fig. 7 is, on the surface of the recessed chuck 102 of groove of the control flow structure of present embodiment mechanical chuck, male member 104 is formed the control flow structure with groove; The height of male member 104 is greater than the height of fluid cavity 109, and the space between groove and the male member 104 is control runner 105.
Fig. 9 is the structural representation of mechanical chuck the 8th specific embodiment provided by the invention.As shown in Figure 9, mechanical chuck in the present embodiment, different with Fig. 8 is; Male member 104 is arranged on the chuck 102; The surface of the recessed pallet 101 of groove, groove and male member 104 are formed the control flow structure, and the height of male member 104 is greater than the height of fluid cavity 109; Male member 104 is nested in the groove, and the space between groove and the male member 104 is control runner 105.
Figure 10 is the structural representation of mechanical chuck the 9th specific embodiment provided by the invention.In practical application, shown in figure 10, mechanical chuck in the present embodiment; Different with Fig. 7, Fig. 8 or Fig. 9 is, the male member 104 in the present embodiment is the arc male member, and groove is corresponding arc groove; Male member 104 is nested in the groove; For example can be made up of C shape male member 104 and C connected in star, C shape male member 104 is arranged on the pallet 101, and the C connected in star is arranged on the circumference of chuck 102; To prolong the length of the control runner 105 that C shape male member 104 and C connected in star form, can further stop helium effluent fluid chamber 109 straight on the footpath straight path on the surface that is parallel to pallet 101 or chuck 102; In practical application, also can C shape male member 104 be arranged on the chuck 102, the C connected in star is arranged on the circumference of pallet 101.
In practical application; Thermometer, barometer and flowmeter can also be set in fluid cavity; Obtain in real time temperature, pressure and the flow of helium, the parameters such as temperature, pressure and flow that help according to helium are adjusted its flow etc., with the temperature of adjustment and control wafer more accurately.
The mechanical chuck that above-mentioned each embodiment provided; Stop temperature adjustable fluid to flow out the control flow structure of said fluid cavity straight through its set being used to; Make temperature adjustable fluid fully to contact with the chip back surface on being positioned over pallet; Improving the efficient and the speed of heat exchange, and reduce helium flows to processing chamber from fluid cavity discharge, helped improving the degree of purity of the processing chamber at mechanical chuck place.
Figure 11 is the structural representation of etching facility body embodiment provided by the invention.Shown in figure 11, present embodiment etching machine comprises processing chamber 50, vacuum pump 60, top electrode and mechanical chuck, and said mechanical chuck can adopt any one structure of above-mentioned mechanical chuck embodiment; Mechanical chuck is arranged in the processing chamber 50 to be used to carry wafer to be processed; And treat processed wafer and carry out temperature control, in the present embodiment, mechanical chuck adopts structure shown in Figure 3; In the process of etched wafer 107; The gas that vacuum pump 60 extracts in the processing chamber 50 to keep the vacuum degree of processing chamber 50, avoids wafer 107 grades to be polluted by foreign gas.
In the present embodiment; Stop helium effluent fluid chamber straight through the control runner in the control flow structure of mechanical chuck, helium can fully be contacted with the wafer on being placed on pallet, to improve the efficient and the speed of heat exchange; Realization is to the purpose of wafer temperature control; And reduced helium and get into the flow of processing chamber from fluid cavity, help improving the degree of purity of the processing chamber at mechanical chuck place, avoid the wafer surface contaminated.
It is understandable that above execution mode only is for the original and illustrative embodiments that adopts of the present invention is described, yet the present invention is not limited thereto.For the one of ordinary skilled in the art, under the situation that does not break away from spirit of the present invention and essence, can make various modification and improvement, these modification also are regarded as protection scope of the present invention with improving.
Claims (13)
1. a mechanical chuck comprises pallet and chuck, is provided with fluid cavity between this pallet and the chuck, it is characterized in that, also comprises being used to stop temperature adjustable fluid to flow out the control flow structure of said fluid cavity straight;
Said control flow structure is provided with around the circumference of said pallet and said chuck, and is connected with said chuck with said pallet respectively.
2. mechanical chuck according to claim 1; It is characterized in that; Said control flow structure comprises two male members that are crisscross arranged respectively on said pallet and chuck; The height sum of said two male members is greater than the distance between said pallet and the chuck, and said two control runners that male member constituted are used to stop said temperature adjustable fluid to flow out said fluid cavity straight.
3. mechanical chuck according to claim 1 is characterized in that, said control flow structure comprises suitable male member and groove, and the height of said male member is greater than the distance between said pallet and the chuck; Said male member is arranged on the said pallet, and said groove is arranged on the said chuck, and the control runner that said male member and groove constituted is used to stop said temperature adjustable fluid to flow out said fluid cavity straight.
4. mechanical chuck according to claim 1 is characterized in that, said control flow structure comprises suitable male member and groove, and the height of said male member is greater than the distance between said pallet and the chuck; One of said groove is arranged on the said pallet, and said male member is arranged on the said chuck, and the control runner that said male member and groove constituted is used to stop said temperature adjustable fluid to flow out said fluid cavity straight.
5. mechanical chuck according to claim 1 is characterized in that, said control flow structure comprises suitable male member and right angle breach, and the height of said male member is greater than the distance between said pallet and the chuck; Said male member is arranged on the said pallet, and said right angle breach is arranged on the said chuck, and the control runner that said male member and right angle breach are constituted is used to stop said temperature adjustable fluid to flow out said fluid cavity straight.
6. mechanical chuck according to claim 1 is characterized in that, said control flow structure comprises suitable male member and right angle breach, and the height of said male member is greater than the distance between said pallet and the chuck; Said right angle breach is arranged on the said pallet, and said male member is arranged on the said chuck, and the control runner that said male member and right angle breach are constituted is used to stop said temperature adjustable fluid to flow out said fluid cavity straight.
7. mechanical chuck according to claim 1 is characterized in that, said control flow structure comprises suitable arc male member and arc notch, and the height of said arc male member is greater than the distance between said pallet and the chuck; Said arc male member is arranged on the said pallet, and said arc notch is arranged on said on chuck, and the control runner between said arc male member and the arc notch stops said temperature adjustable fluid to flow out said fluid cavity straight.
8. mechanical chuck according to claim 1 is characterized in that, said control flow structure comprises suitable arc male member and arc notch, and the height of said arc male member is greater than the distance between said pallet and the chuck; Said arc notch is arranged on the said pallet, and said arc male member is arranged on the said chuck, and the control runner between said arc male member and the arc notch stops said temperature adjustable fluid to flow out said fluid cavity straight.
9. mechanical chuck according to claim 1 is characterized in that, said control flow structure comprises two mutually nested arcuate structures, and the control runner that two said arcuate structures are constituted is used to stop said temperature adjustable fluid to flow out said fluid cavity straight.
10. mechanical chuck according to claim 9 is characterized in that, said arcuate structure is a C shape.
11., it is characterized in that said male member and groove are respectively suitable arc male member and arc groove according to claim 3 or 4 described mechanical chuck.
12. mechanical chuck according to claim 11 is characterized in that, said arc male member and arc groove are respectively the arc male member of C shape and the arc groove of C shape.
13. an etching machine is characterized in that comprising any described mechanical chuck of processing chamber, vacuum pump, top electrode and claim 1-12, said mechanical chuck is arranged in the said processing chamber to be used to carry wafer to be processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010284754.6A CN102403255B (en) | 2010-09-15 | 2010-09-15 | Mechanical chuck and etching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010284754.6A CN102403255B (en) | 2010-09-15 | 2010-09-15 | Mechanical chuck and etching machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102403255A true CN102403255A (en) | 2012-04-04 |
| CN102403255B CN102403255B (en) | 2014-07-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010284754.6A Active CN102403255B (en) | 2010-09-15 | 2010-09-15 | Mechanical chuck and etching machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102403255B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110767568A (en) * | 2018-07-26 | 2020-02-07 | 北京北方华创微电子装备有限公司 | Pressure regulating assembly, lower electrode device, process chamber and semiconductor processing equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5883778A (en) * | 1994-02-28 | 1999-03-16 | Applied Materials, Inc. | Electrostatic chuck with fluid flow regulator |
| US6033478A (en) * | 1996-11-05 | 2000-03-07 | Applied Materials, Inc. | Wafer support with improved temperature control |
| KR20010054043A (en) * | 1999-12-03 | 2001-07-02 | 박종섭 | Wafer chuck stage |
| US20080229811A1 (en) * | 2007-03-20 | 2008-09-25 | Kla-Tencor Technologies Corporation | Stabilizing a substrate using a vacuum preload air bearing chuck |
| US20100002355A1 (en) * | 2008-07-02 | 2010-01-07 | Ngk Insulators, Ltd. | Wafer support device and component used for the same |
-
2010
- 2010-09-15 CN CN201010284754.6A patent/CN102403255B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5883778A (en) * | 1994-02-28 | 1999-03-16 | Applied Materials, Inc. | Electrostatic chuck with fluid flow regulator |
| US6033478A (en) * | 1996-11-05 | 2000-03-07 | Applied Materials, Inc. | Wafer support with improved temperature control |
| KR20010054043A (en) * | 1999-12-03 | 2001-07-02 | 박종섭 | Wafer chuck stage |
| US20080229811A1 (en) * | 2007-03-20 | 2008-09-25 | Kla-Tencor Technologies Corporation | Stabilizing a substrate using a vacuum preload air bearing chuck |
| US20100002355A1 (en) * | 2008-07-02 | 2010-01-07 | Ngk Insulators, Ltd. | Wafer support device and component used for the same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110767568A (en) * | 2018-07-26 | 2020-02-07 | 北京北方华创微电子装备有限公司 | Pressure regulating assembly, lower electrode device, process chamber and semiconductor processing equipment |
| CN110767568B (en) * | 2018-07-26 | 2022-05-27 | 北京北方华创微电子装备有限公司 | Pressure regulating assembly, lower electrode device, process chamber and semiconductor processing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102403255B (en) | 2014-07-16 |
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Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100015, M5 building, No. 1 Jiuxianqiao East Road, Beijing, Chaoyang District, two South Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |