CN102357746A - Low-content modified rosin halogen-free soldering flux for lead-free solder wires - Google Patents
Low-content modified rosin halogen-free soldering flux for lead-free solder wires Download PDFInfo
- Publication number
- CN102357746A CN102357746A CN2011103160189A CN201110316018A CN102357746A CN 102357746 A CN102357746 A CN 102357746A CN 2011103160189 A CN2011103160189 A CN 2011103160189A CN 201110316018 A CN201110316018 A CN 201110316018A CN 102357746 A CN102357746 A CN 102357746A
- Authority
- CN
- China
- Prior art keywords
- free
- modified rosin
- rosin
- lead
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a low-content modified rosin halogen-free soldering flux for lead-free solder wires. The low-content modified rosin halogen-free soldering flux comprises the following components in percentage by weight: 9-27% of an organic acid activator, 1-5% of a surfactant, 0.01-1% of a corrosion inhibitor, 0.1-1% of an antioxidant, 2-4% of a film-forming agent, 1-8% of modified rosin and the balance of an organic solvent. The soldering flux for the lead-free solder wires has the advantages of no halogen, good solderability, bright and full welding spots, high spreading rate, a small amount of the modified rosin, fewer post-welding residues and being free from a cleaning procedure, and the surface insulation resistance of a welded substrate is more than 1*10+8 ohms, which meets the requirements of the electronical industry standard; and meanwhile mixed alcohols with different boiling points are used as the organic solvent, which can lower the content of the VOC (volatile organic compound) so as to prevent photochemical smog and air pollutions.
Description
Technical field
The present invention relates to lead-free soldering wire and use scaling powder; The lead-free soldering wire that is particularly useful for SAC (SnAgCu) series and tin copper (SnCu) series is mainly used in the welding and the assembling of electronic building bricks such as electronics, electrician, printed circuit board (PCB), household electrical appliance with low content modified rosin type halogen-free scaling powder.
Background technology
Along with the develop rapidly of present information electronics industry, Pb-free solder also is growing more intense with the market competition of scaling powder product.But characteristics such as oxidation are compared and exist the fusing point height, are prone to SAC series with traditional tin-lead solder with the lead-free solder of tin copper series; The lead-free solder soldering fluid majority that uses now is there being kupper solder to improve on the basis of scaling powder, contains halogen and too high rosin content mostly.Though this type scaling powder solderability is good, postwelding has a large amount of halide ions residual, and corrosivity is stronger, to demanding electronic product, must carry out postwelding and clean; And too high rosin content increases the non-volatile content of postwelding, and the postwelding residual content is too much, and can produce a large amount of smoke stratifications in the process of welding, is detrimental to health.
Summary of the invention
The objective of the invention is to clean and the too high residual problem such as too much of postwelding that causes of rosin content to residual needs of postwelding halide ion; Provide a kind of wetability strong, spreading area is big, and solderability is good; The solder joint light is full; Postwelding is residual few, and the postwelding bronze mirror does not have corrosion, and the lead-free soldering wire that does not need the postwelding cleaning is with low content modified rosin halogen-free scaling powder.
In order to realize the foregoing invention purpose, lead-free soldering wire of the present invention is with low content modified rosin type halogen-free scaling powder, and its component and weight percent content are following:
Organic acid for activating agent 9-27%,
Surfactant 1-5%,
Corrosion inhibiter 0.01-1%,
Anti-oxidant 0.1-1%,
Film forming agent 2-4%,
Modified rosin 1-8%,
Surplus is an organic solvent;
Described organic acid for activating agent is at least two kinds in DL malic acid, succinic acid, glutaric acid, adipic acid and the benzoic acid;
Described surfactant is at least a in polysorbas20, polysorbate60, span 20, sorbester p18 and the sorbester p17;
Described corrosion inhibiter is at least a in BTA (BTA) and the triethylamine;
Described anti-oxidant is hydroquinones, ditert-butylhydro quinone (TBHQ) and 2, at least a in the 5-ditert-butylhydro quinone (DBHQ);
Described film forming agent is at least a in the two stearic amides of second two support, polyacrylamide 3000000 and the Macrogol 2000;
Described modified rosin is at least a in water-white rosin, newtrex, leadless rosin and the disproportionated rosin;
Said organic solvent is at least two kinds in absolute ethyl alcohol, nitroethane, tetrahydrofurfuryl alcohol and the diethylene glycol monoethyl ether.
Compound method is following: each component of weighing by weight percentage, earlier organic solvent is placed the agitated reactor that has agitator at normal temperatures, and slowly be heated to 30-50 ℃; Add modified rosin while stirring until dissolving fully; Add organic acid for activating agent, surfactant, corrosion inhibiter, anti-oxidant and film forming agent then, constantly stirring is dissolved whole components fully, stops after mixing stirring; Leave standstill, promptly get scaling powder product of the present invention.
Scaling powder of the present invention is pressed in the solder through extruder, can pulls out the lead-free soldering wire of all size then through wire drawing machine.
Scaling powder of the present invention adopts at least two kinds of organic acid for activating agent; The boiling point of these organic acid for activating agent is different with decomposition temperature; Make scaling powder not only have good activation, and also can prevent the scolder generation oxidation of fusion, in welding process, can remove the oxide layer on welding thing surface in the welding stage at warm-up phase; Obtain the full solder joint of light, improve solderability thus;
Non-ionic surface active agent in the scaling powder can reduce surface tension, improves wetting power, strengthens the solderability of Pb-free solder.Corrosion inhibiter can play the corrosion inhibition to solder side, reduces the corrosivity of scaling powder to printed board.Anti-oxidant can stop the oxidation once again of welded article, and can improve the spreading ratio of Pb-free solder.Film forming agent has good electric property, and postwelding can form diaphragm on the welded article surface, has characteristics such as non-corrosiveness, protection against the tide.
Lead-free soldering wire of the present invention is with the advantage that low content modified rosin type halogen-free scaling powder is different from similar scaling powder:
1, contain more a spot of rosin, the postwelding residue is few, and non-corrosiveness has effectively overcome the bad phenomenon in the product in the past, need not to clean the rosin residue, has reduced production cost.
2, not halogen-containing ion can not cause that electrical insulation properties descends, and the problem that produces electronic device inefficacies such as short circuit.
3, used modified rosin is one or more the mixing in water-white rosin, newtrex, leadless rosin and the disproportionated rosin.This type rosin structure is relatively stable, and it is solid-state that modified rosin is at normal temperatures, unionization, and air-tightness is good after the soldering, can form transparent organic film, and solder joint is wrapped up, and has well solved activity and corrosive contradiction of scaling powder.
4, the mixed alcohol that adopts different boiling can not form photochemical fog as organic solvent, can not cause the pollution of air, and security is good.
The specific embodiment
The present invention will be described below in conjunction with concrete embodiment, but the present invention is not limited to the embodiment of the following stated.
Embodiment 1
The lead-free soldering wire of present embodiment is with low content modified rosin type halogen-free scaling powder, and its component and weight percent content are:
DL malic acid 2.25%
Succinic acid 4.5%
Glutaric acid 2.25%
Polysorbas20 2%
Sorbester p18 3%
BTA 0.01%
Hydroquinones 0.1%
The two stearic amides 4% of second two supports
Water-white rosin 3%
Newtrex 2%
Absolute ethyl alcohol 12.8%
Nitroethane 25.6%
Tetrahydrofurfuryl alcohol 25.67%
Diethylene glycol monoethyl ether 12.82%
Concrete preparation method:
Each component of weighing by weight percentage earlier places the agitated reactor that has agitator with organic solvent at normal temperatures, slowly is heated to 30 ℃; Add modified rosin while stirring until dissolving fully; Add activator, surfactant, corrosion inhibiter, anti-oxidant and film forming agent then, constantly stirring is dissolved whole components fully, stops after mixing stirring; Leave standstill, promptly get scaling powder product of the present invention.
The test result of various performance parameters is seen instance 1 in the table 1.
Embodiment 2
The lead-free soldering wire of present embodiment is with low content modified rosin type halogen-free scaling powder, and its component and weight percent content are:
DL malic acid 2%
Succinic acid 2%
Adipic acid 8%
Polysorbate60 1%
Sorbester p18 3%
BTA 0.01%
Triethylamine 0.02%
Ditert-butylhydro quinone 0.25%
The two stearic amides 1% of second two supports
Polyacrylamide 3,000,000 1%
Water-white rosin 3%
Leadless rosin 3%
Absolute ethyl alcohol 12.61%
Tetrahydrofurfuryl alcohol 37.87%
Diethylene glycol monoethyl ether 25.24%
Concrete preparation method:
Each component of weighing by weight percentage earlier places the agitated reactor that has agitator with organic solvent at normal temperatures, slowly is heated to 35 ℃, and all the other are with embodiment 1.
The test result of various performance parameters is seen instance 2 in the table 1.
Embodiment 3
The lead-free soldering wire of present embodiment is with low content modified rosin type halogen-free scaling powder, and its component and weight percent content are:
DL malic acid 4.5%
Succinic acid 4.5%
Adipic acid 9%
Span 20 2%
Sorbester p18 1%
BTA 0.1%
Triethylamine 0.1%
2,5-ditert-butylhydro quinone 0.15%
Macrogol 2000 2%
Newtrex 4%
Disproportionated rosin 4%
Absolute ethyl alcohol 17%
Nitroethane 34.43%
Tetrahydrofurfuryl alcohol 17.22%
Concrete preparation method:
Each component of weighing by weight percentage earlier places the agitated reactor that has agitator with organic solvent at normal temperatures, slowly is heated to 40 ℃, and all the other are with embodiment 1.
The test result of various performance parameters is seen instance 3 in the table 1.
Embodiment 4
The lead-free soldering wire of present embodiment is with low content modified rosin type halogen-free scaling powder, and its component and weight percent content are:
DL malic acid 4%
Succinic acid 8%
Adipic acid 12%
Sorbester p18 4%
Triethylamine 1%
Hydroquinones 0.2%
The two stearic amides 4% of second two supports
Water-white rosin 2%
Absolute ethyl alcohol 10.7%
Nitroethane 10.7%
Tetrahydrofurfuryl alcohol 43.4%
Concrete preparation method:
Each component of weighing by weight percentage earlier places the agitated reactor that has agitator with organic solvent at normal temperatures, slowly is heated to 45 ℃, and all the other are with embodiment 1.
The test result of various performance parameters is seen instance 4 in the table 1.
Embodiment 5
The lead-free soldering wire of present embodiment is with low content modified rosin type halogen-free scaling powder, and its component and weight percent content are:
DL malic acid 5.4%
Glutaric acid 10.8%
Benzoic acid 10.8%
Sorbester p18 0.6%
Sorbester p17 0.4%
BTA 0.05%
Triethylamine 0.05%
Hydroquinones 0.5%
Ditert-butylhydro quinone 0.5%
The two stearic amides 2% of second two supports
Macrogol 2000 1.5%
Newtrex 0.3%
Leadless rosin 0.7%
Nitroethane 13.40%
Tetrahydrofurfuryl alcohol 39.56%
Diethylene glycol monoethyl ether 13.44%
Concrete preparation method:
Each component of weighing by weight percentage earlier places the agitated reactor that has agitator with organic solvent at normal temperatures, slowly is heated to 50 ℃, and all the other are with embodiment 1.
The test result of various performance parameters is seen instance 5 in the table 1.
Table 1
The lead-free soldering wire of embodiment 1-5 being processed according to China Ministry of Information Industry " exempting to clean liquid scaling powder standard SJ/T 11273-2002 " shows with the testing result that low content modified rosin type halogen-free scaling powder carries out; Its spreading ratio is greater than 75%; The solder joint light is full; The postwelding residue is few, and the postwelding bronze mirror does not have corrosion, and the surface insulation resistance of postwelding substrate is greater than 1x10
+ 8Ohm has satisfied the requirement of electron trade standard.The test of the spreading ratio of each instance is that Pb-free solder with Sn-Ag3.0-Cu0.5 carries out as sample among the present invention.
Claims (1)
1. a lead-free soldering wire is characterized in that with low content modified rosin type halogen-free scaling powder its component and weight percent content are following:
Organic acid for activating agent 9-27%,
Surfactant 1-5%,
Corrosion inhibiter 0.01-1%,
Anti-oxidant 0.1-1%,
Film forming agent 2-4%,
Modified rosin 1-8%,
Surplus is an organic solvent;
Described organic acid for activating agent is at least two kinds in DL malic acid, succinic acid, glutaric acid, adipic acid and the benzoic acid;
Described surfactant is at least a in polysorbas20, polysorbate60, span 20, sorbester p18 and the sorbester p17;
Described corrosion inhibiter is at least a in BTA and the triethylamine;
Described anti-oxidant is hydroquinones, ditert-butylhydro quinone and 2, at least a in the 5-ditert-butylhydro quinone;
Described film forming agent is at least a in the two stearic amides of second two support, polyacrylamide 3000000 and the Macrogol 2000;
Described modified rosin is at least a in water-white rosin, newtrex, leadless rosin and the disproportionated rosin;
Said organic solvent is at least two kinds in absolute ethyl alcohol, nitroethane, tetrahydrofurfuryl alcohol and the diethylene glycol monoethyl ether.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103160189A CN102357746A (en) | 2011-10-18 | 2011-10-18 | Low-content modified rosin halogen-free soldering flux for lead-free solder wires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103160189A CN102357746A (en) | 2011-10-18 | 2011-10-18 | Low-content modified rosin halogen-free soldering flux for lead-free solder wires |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102357746A true CN102357746A (en) | 2012-02-22 |
Family
ID=45583155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103160189A Pending CN102357746A (en) | 2011-10-18 | 2011-10-18 | Low-content modified rosin halogen-free soldering flux for lead-free solder wires |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102357746A (en) |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102581522A (en) * | 2012-02-28 | 2012-07-18 | 河南科技大学 | Rosin-based flux for ZnSn-based lead free solder and preparation method thereof |
| CN102794582A (en) * | 2012-08-15 | 2012-11-28 | 北京工业大学 | Soldering flux matched with high-melting-point solder and preparation method thereof |
| CN102794581A (en) * | 2012-08-15 | 2012-11-28 | 江苏科技大学 | Steel no-clean welding flux and preparation method thereof |
| CN103008920A (en) * | 2012-12-13 | 2013-04-03 | 郴州金箭焊料有限公司 | Leadless rosin core no-clean scaling powder |
| CN103192200A (en) * | 2013-03-24 | 2013-07-10 | 广东普赛特电子科技股份有限公司 | Three-prevention electronic liquid soldering flux and preparation method thereof |
| CN104526186A (en) * | 2014-12-26 | 2015-04-22 | 苏州龙腾万里化工科技有限公司 | Novel scaling powder for SnZn series lead-free brazing filler metal |
| CN104646862A (en) * | 2013-11-26 | 2015-05-27 | 刘现梅 | Soldering flux containing by-product terpinene derivative of terpilenol |
| CN104801888A (en) * | 2015-05-20 | 2015-07-29 | 苏州汉尔信电子科技有限公司 | Scaling powder for solar photovoltaic components and preparation method of scaling powder |
| CN106425169A (en) * | 2016-10-11 | 2017-02-22 | 常州市鼎日环保科技有限公司 | Preparation method of easy-to-store and halogen-free scaling powder |
| CN107186387A (en) * | 2017-06-28 | 2017-09-22 | 合肥市闵葵电力工程有限公司 | A kind of cleaning-free lead-free solder soldering fluid and preparation method thereof |
| CN108247239A (en) * | 2018-01-12 | 2018-07-06 | 吉安谊盛电子材料有限公司 | Lead acid accumulator pole group cast welding oiliness scaling powder |
| CN108393611A (en) * | 2018-04-25 | 2018-08-14 | 苏州锐耐洁电子科技新材料有限公司 | A kind of electronics scaling powder |
| CN108817731A (en) * | 2018-07-04 | 2018-11-16 | 中原工学院 | A kind of low temperature, Halogen, low-solid content modified rosin type scaling powder and preparation method |
| CN110091098A (en) * | 2019-05-17 | 2019-08-06 | 江苏三沃电子科技有限公司 | A kind of low-residual cleaning-free scaling powder and preparation method thereof |
| CN111660037A (en) * | 2019-03-05 | 2020-09-15 | 潮州三环（集团）股份有限公司 | Soldering flux and solder paste containing same |
| CN112621012A (en) * | 2020-12-09 | 2021-04-09 | 东莞市千岛金属锡品有限公司 | Brazing solder wire of antistatic low-splashing solid soldering flux and preparation method thereof |
| CN112621007A (en) * | 2020-12-09 | 2021-04-09 | 东莞市千岛金属锡品有限公司 | Brazing solder wire of antistatic halogen-free solid soldering flux and preparation method thereof |
| CN112743259A (en) * | 2021-01-25 | 2021-05-04 | 苏州柯仕达电子材料有限公司 | Cleaning-free soldering flux |
| WO2022266839A1 (en) * | 2021-06-22 | 2022-12-29 | 京东方科技集团股份有限公司 | Flux, substrate, manufacturing method therefor, and apparatus |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004501765A (en) * | 2000-04-13 | 2004-01-22 | フライズ・メタルズ・インコーポレーテッド・ドゥーイング・ビジネス・アズ・アルファ・メタルズ・インコーポレーテッド | Brazing flux containing cationic surfactant |
| US20050039824A1 (en) * | 2001-06-29 | 2005-02-24 | Tsutomu Nishina | Solder composition |
| EP1736273A1 (en) * | 2004-01-29 | 2006-12-27 | Matsushita Electric Industries Co., Ltd. | Soldering flux and soldering method |
| CN101085497A (en) * | 2007-07-17 | 2007-12-12 | 西安理工大学 | Low-rosin cleaning-free scaling powder for tin-lead soldering paste and preparation method thereof |
| CN101352788A (en) * | 2008-09-12 | 2009-01-28 | 上海华实纳米材料有限公司 | Scaling powder for leadless soldering tin |
| CN101733589A (en) * | 2010-01-27 | 2010-06-16 | 浙江一远电子科技有限公司 | Halogen-free and cleaning-free soldering flux for lead-free solder |
| CN101890595A (en) * | 2010-07-02 | 2010-11-24 | 厦门大学 | Low-rosin washing-free soldering flux for lead-free flux-cored wires and preparation method thereof |
-
2011
- 2011-10-18 CN CN2011103160189A patent/CN102357746A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004501765A (en) * | 2000-04-13 | 2004-01-22 | フライズ・メタルズ・インコーポレーテッド・ドゥーイング・ビジネス・アズ・アルファ・メタルズ・インコーポレーテッド | Brazing flux containing cationic surfactant |
| US20050039824A1 (en) * | 2001-06-29 | 2005-02-24 | Tsutomu Nishina | Solder composition |
| EP1736273A1 (en) * | 2004-01-29 | 2006-12-27 | Matsushita Electric Industries Co., Ltd. | Soldering flux and soldering method |
| CN101085497A (en) * | 2007-07-17 | 2007-12-12 | 西安理工大学 | Low-rosin cleaning-free scaling powder for tin-lead soldering paste and preparation method thereof |
| CN101352788A (en) * | 2008-09-12 | 2009-01-28 | 上海华实纳米材料有限公司 | Scaling powder for leadless soldering tin |
| CN101733589A (en) * | 2010-01-27 | 2010-06-16 | 浙江一远电子科技有限公司 | Halogen-free and cleaning-free soldering flux for lead-free solder |
| CN101890595A (en) * | 2010-07-02 | 2010-11-24 | 厦门大学 | Low-rosin washing-free soldering flux for lead-free flux-cored wires and preparation method thereof |
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102581522A (en) * | 2012-02-28 | 2012-07-18 | 河南科技大学 | Rosin-based flux for ZnSn-based lead free solder and preparation method thereof |
| CN102794582A (en) * | 2012-08-15 | 2012-11-28 | 北京工业大学 | Soldering flux matched with high-melting-point solder and preparation method thereof |
| CN102794581A (en) * | 2012-08-15 | 2012-11-28 | 江苏科技大学 | Steel no-clean welding flux and preparation method thereof |
| CN102794581B (en) * | 2012-08-15 | 2014-12-10 | 江苏科技大学 | Steel no-clean welding flux and preparation method thereof |
| CN102794582B (en) * | 2012-08-15 | 2015-01-14 | 北京工业大学 | Soldering flux matched with high-melting-point solder and preparation method thereof |
| CN103008920A (en) * | 2012-12-13 | 2013-04-03 | 郴州金箭焊料有限公司 | Leadless rosin core no-clean scaling powder |
| CN103192200A (en) * | 2013-03-24 | 2013-07-10 | 广东普赛特电子科技股份有限公司 | Three-prevention electronic liquid soldering flux and preparation method thereof |
| CN104646862A (en) * | 2013-11-26 | 2015-05-27 | 刘现梅 | Soldering flux containing by-product terpinene derivative of terpilenol |
| CN104526186A (en) * | 2014-12-26 | 2015-04-22 | 苏州龙腾万里化工科技有限公司 | Novel scaling powder for SnZn series lead-free brazing filler metal |
| CN104801888A (en) * | 2015-05-20 | 2015-07-29 | 苏州汉尔信电子科技有限公司 | Scaling powder for solar photovoltaic components and preparation method of scaling powder |
| CN104801888B (en) * | 2015-05-20 | 2016-08-24 | 苏州汉尔信电子科技有限公司 | A kind of solar photovoltaic assembly scaling powder and preparation method thereof |
| CN106425169A (en) * | 2016-10-11 | 2017-02-22 | 常州市鼎日环保科技有限公司 | Preparation method of easy-to-store and halogen-free scaling powder |
| CN107186387A (en) * | 2017-06-28 | 2017-09-22 | 合肥市闵葵电力工程有限公司 | A kind of cleaning-free lead-free solder soldering fluid and preparation method thereof |
| CN108247239A (en) * | 2018-01-12 | 2018-07-06 | 吉安谊盛电子材料有限公司 | Lead acid accumulator pole group cast welding oiliness scaling powder |
| CN108247239B (en) * | 2018-01-12 | 2021-01-22 | 吉安谊盛电子材料有限公司 | Oily scaling powder for cast welding of lead-acid storage battery plate group |
| CN108393611A (en) * | 2018-04-25 | 2018-08-14 | 苏州锐耐洁电子科技新材料有限公司 | A kind of electronics scaling powder |
| CN108817731A (en) * | 2018-07-04 | 2018-11-16 | 中原工学院 | A kind of low temperature, Halogen, low-solid content modified rosin type scaling powder and preparation method |
| CN108817731B (en) * | 2018-07-04 | 2020-04-10 | 中原工学院 | Low-temperature halogen-free low-solid-content modified rosin type soldering flux and preparation method thereof |
| CN111660037A (en) * | 2019-03-05 | 2020-09-15 | 潮州三环（集团）股份有限公司 | Soldering flux and solder paste containing same |
| CN111660037B (en) * | 2019-03-05 | 2022-04-15 | 潮州三环（集团）股份有限公司 | Soldering flux and solder paste containing same |
| CN110091098A (en) * | 2019-05-17 | 2019-08-06 | 江苏三沃电子科技有限公司 | A kind of low-residual cleaning-free scaling powder and preparation method thereof |
| CN112621012A (en) * | 2020-12-09 | 2021-04-09 | 东莞市千岛金属锡品有限公司 | Brazing solder wire of antistatic low-splashing solid soldering flux and preparation method thereof |
| CN112621007A (en) * | 2020-12-09 | 2021-04-09 | 东莞市千岛金属锡品有限公司 | Brazing solder wire of antistatic halogen-free solid soldering flux and preparation method thereof |
| CN112743259A (en) * | 2021-01-25 | 2021-05-04 | 苏州柯仕达电子材料有限公司 | Cleaning-free soldering flux |
| WO2022266839A1 (en) * | 2021-06-22 | 2022-12-29 | 京东方科技集团股份有限公司 | Flux, substrate, manufacturing method therefor, and apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102357746A (en) | Low-content modified rosin halogen-free soldering flux for lead-free solder wires | |
| CN100532003C (en) | Colophony type non-halide cleaning-free soldering flux for lead-free solder wire | |
| CN102825398B (en) | Soldering flux matched with lead-free solder | |
| CN100528462C (en) | Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof | |
| CN100528461C (en) | Non-rosin cleaning-free scaling powder for tin-lead soldering paste and preparation method thereof | |
| CN101269448B (en) | Cleaning-free lead-free solder soldering fluid | |
| CN101733589B (en) | Halogen-free and cleaning-free soldering flux for lead-free solder | |
| CN107088716B (en) | Environment-friendly low-temperature residue-free solder paste and preparation method thereof | |
| CN100479975C (en) | Low-rosin cleaning-free scaling powder for tin-lead soldering paste and preparation method thereof | |
| CN101966632B (en) | Wash-free soldering flux for leadless low-temperature soldering paste and preparation method thereof | |
| CN102489897B (en) | Low-temperature lead-free soldering flux for tin-bismuth series | |
| CN107160052B (en) | A kind of high performance low temperature solder lead-free tin cream and preparation method thereof | |
| CN103286477A (en) | Soldering flux for lead-free solder and preparation method of soldering flux | |
| CN101780606A (en) | Washing-free lead-free halogen-free tin soldering paste | |
| CN101352788B (en) | Scaling powder for leadless soldering tin | |
| CN101264558A (en) | Lead-free solder water-soluble soldering fluid | |
| CN102166689B (en) | Halogen-free lead-free soldering paste and soldering flux used by same | |
| CN102161135B (en) | Lead-free welding tin wire and water-soluble welding flux used by same | |
| CN101670503A (en) | Halogen-free water-based and wash-free welding fluid | |
| CN103111773A (en) | Scaling powder for lead-free solder paste | |
| CN101733573B (en) | Lead-free and halogen-free environmental soldering paste for electronic industry | |
| CN102513735A (en) | Flux paste for high-bismuth content solder paste and preparation method thereof | |
| CN101569966B (en) | A kind of lead-free tin cream | |
| CN102528329B (en) | Halogen-free and lead-free solder paste and preparation method | |
| CN102909493A (en) | Soldering flux |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120222 |