CN102349360B - With printed circuit board component and the manufacture method thereof of at least one laser beam barrier element - Google Patents
With printed circuit board component and the manufacture method thereof of at least one laser beam barrier element Download PDFInfo
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- CN102349360B CN102349360B CN201080011207.9A CN201080011207A CN102349360B CN 102349360 B CN102349360 B CN 102349360B CN 201080011207 A CN201080011207 A CN 201080011207A CN 102349360 B CN102349360 B CN 102349360B
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- circuit board
- printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The present invention relates to a kind of printed circuit board component (1), particularly multilayer board element, this printed circuit board component is with multiple dielectric layer (5,6,7) and conductor layer (8,9,10,11), and the laser beam barrier element (14) distinctive with at least one, different from conductor layer (8,9,10,11) in printed circuit board component inside, to stop for the laser beam that punches or cut to the dark intrusion in printed circuit board (PCB), wherein, laser beam barrier element is by absorb and/or the particulate of reflected laser energy is formed.The invention still further relates to the manufacture method of this printed circuit board component.
Description
Technical field
The present invention relates to a kind of printed circuit board component, particularly multilayer board element, this printed circuit board component is with multiple dielectric layer and conductor layer, and the laser beam barrier element distinctive with at least one, different from conductor layer in printed circuit board (PCB) inside, to stop the dark intrusion of the laser beam for punching or cut in printed circuit board (PCB).
The invention still further relates to the method manufacturing this kind of printed circuit board component.
Background technology
Printed circuit board component is made up of different layers completely at large, and the mutual bonding connection of described layer, can use hot pressing at this.When multi-lamellar printed circuit board component, namely when so-called multilayer board element, multiple dielectric layer (insulating barrier) and metallization (conductor layer) stacked, thus on many levels, set up conduction between each electronic unit connect.Usually, this type of printed circuit board component is made up of resin bed (such as epoxy resin layer) and layers of copper, wherein, is provided with at least two position layers.
Being connected with the conduction of internal part for setting up, punching until the predetermined degree of depth in this type of printed circuit board component.If conduction will be formed to be connected between conductive plane, then electro-coppering such as can be carried out subsequently in the hole so produced.Completely generally, often require that the cutting of this printed circuit board component and punching are with the control to cutting or the degree of depth of punching, wherein cutting or punching use laser usually for this reason, such as, use CO
2laser.Although also can use common depth control method, this only can limitedly use.For the copper position layer of such as printed circuit board component inside configuration is used for the cutting and the punching that use laser beam, to stop laser beam deeper to invade further in printed circuit board component, namely stop cutting or drill process.This barrier effect reflects in visible region or infrared region based on layers of copper or general metal level well at this; Such as make CO
2laser beam reflects well in layers of copper.On the contrary, at the laser beam in UV district, copper is cut.
But now, in the printed circuit board component with structurized interior position layer, there are the following problems, namely, conductor layer (such as, copper position layer) only existed at multiple local place by structuring, then be etched removal at other position metallization, such as two resin position layers are directly interconnected; Similarly, also welding can be stopped that mask is connected directly between on epoxy resin layer.In this position, resin bed is interconnected or welds and stops that mask and resin bed are adjacent, and aforementioned laser barrier functionality no longer exists, because the metallization does not for this reason exist.In this case, debatable is the depth of cut or the punching degree of depth, the i.e. depth of invasion of laser beam in the structure of printed circuit board component that control laser beam.
Remedy for completing at this, in the prior art (see US 4,931,134A, JP 3-165594 A, JP 5-235556 A and JP 2002-271039A) the suggestion installation additional laser beam barrier element such as with strip-shaped form made of copper separately, described laser beam barrier element reflects laser beam and therefore prevents laser beam to the further intrusion in printed circuit board component structure.
Summary of the invention
The technical problem that the present invention will solve now is, there is provided as the printed circuit board component as described in starting and method herein, wherein, employ the laser beam barrier element of alternative easy installation, and can ensure when realizing interior position Rotating fields to the depth of cut of laser beam in printed circuit intralamellar part or the punching degree of depth effectively and control reliably.
For solving this technical problem, the invention provides printed circuit board component and as method according to claim 9 as defined in claim 1.Favourable form of implementation and expansion provide in the dependent claims.
At provided technical elements, therefore there are also installed the barrier element of intrinsic " the adding " for laser beam; But this barrier element is now to absorb and/or the little particulate of reflects laser beam energy is formed, and the size of described particulate especially in nanometer range in micrometer range.This particulate is made up of particularly suitable metal (such as gold, silver, copper, aluminium, zinc and/or lead); But also can use other suitable reflection or fusible material, such as ceramic particle.Can be such as the particulate of spherical or little dish type be so little at this, to such an extent as to when particulate is larger or when particulate and non-circular but little dish type time, or when adhesive to occupy compared with great share to be interconnected large particulate-wherein this adhesive do not reflect and can be penetrated by laser beam, laser beam such as can not the material of penetrated bed without difficulty due to the multipath reflection on particulate.Even if in this barrier element, particulate is larger, reflection also may be poor.In this manner, can consider by laser beam, enough energy to be incorporated into penetrate barrier element in barrier element, instead of stop laser beam.But when small particle, can make adhesive share seldom on the one hand and the energy of laser beam can be used to carry out melted material on the other hand, or making reflection higher by higher particulate share.
Large I for particulate takes following yardstick, and namely particulate should have " nanofeature ", and namely the size of particulate should make the fusing point of nanoparticle and the fusing point of common printed circuit board material under this size have deviation.When silvery particulate, such as approximately the particle size of 100nm is proved to be favourable for this reason.
This intrinsic barrier element at least can be laid in the position of depth of cut or the punching degree of depth of wishing restriction laser beam, certainly also can be laid in planar on the whole surface of the position layer being positioned at below; Especially, described barrier element is also by the mode structuring of routine.For carrying out structuring, the printing technology laid for local preferably can be used, as ink jet printing, silk screen printing etc.But following structuring is also fine, it is light activated for namely making the material of additional barrier be configured in a conventional manner, makes by means of common light process executable structure.Also can use foregoing printing technology for this reason, or use other coating process, such as spraying etc.
According in the mechanism of the technology of the present invention, by using little particulate, the energy of laser beam also can be used for completely or partially by particulate melting, with this, laser beam is stopped in this position, but not the situation that laser beam is similar in known layers of copper can fully or at least very mostly be reflected.By the thermo-contact of particulate in laser beam incident region, usually cause cooling effect, i.e. heat transfer.
This barrier element provides preferably as the extra play parts especially with paste form and lays, such as printed, and wherein this pastel contains little particulate and adhesive.
In addition, what also can conceive is to be used for stopping that the barrier element of laser beam is layeredly laid in above or below removable separation position layer, or is laid between two removable separation position layers.This type of separates position layer such as preventing from being located thereon or resin bed under it sticks together.Such as advise, the resin bed that namely part of matrix hardens afterwards should be removable, therefore to obtain so-called rigid-flexible printed circuit board, such as, with reference to WO 2008/098269 A, WO 2008/098270 A, WO 2008/098271 A and WO2008/098272 A.The laying of barrier element on the layer of separation position or between them also tool has the following advantages, and namely described barrier element can be removed together with the layer of separation position.
On the other hand, laser barrier element also can be used as intrinsic prefabricated film (band) to be existed, and such as lamination is on the resin layer or be embedded in resin bed.In this case, also there is stratiform, laser barrier element that is intrinsic, that independently lay with conductor layer, described laser barrier element is laid as extra play.
The feature of multiple particularly advantageous form of implementation is further, and this particulate directly loads as packing material in a layer of printed circuit board component.Such as, particulate can be incorporated in each resin bed of printed circuit board component, but particulate also can be encased in the layer of aforesaid separation position or comprise within it, wherein in this case, separates position layer and additionally works as barrier element; Similarly, packing material nanoparticle being encased in the afore-mentioned in resin bed, described resin bed is also used as laser barrier layer.
In addition, on printed circuit board component, usually there is multi-lamellar barrier element as the barrier element being additional to conductor layer laying.
Accompanying drawing explanation
The present invention should not be limited to this preferred embodiment-according to preferred embodiment-the present invention hereinafter and describe in more detail by reference to accompanying drawing.Illustrate respectively in the drawings and in which:
Fig. 1 has illustrated known multilayer board element in completely schematic cross section, the conductor position layer wherein also only schematically shown completely for the inside to conductor element cuts or laser beam to contact hole punching, wherein laser beam on the layer of inner conductor position in the usual manner (by reflection) stopped;
Fig. 2 shows similar schematic cross-sectional view, but wherein compared to Figure 1 inner conductor position layer is structured now, make when laser beam point to inner conductor position layer not there is due to structuring the position of metal time, do not stop the darker intrusion of described laser beam;
Fig. 3 shows the comparable schematic cross-section by printed circuit board component, but wherein now provided with the intrinsic barrier element for stopping laser beam with little particulate;
Fig. 4 shows comparable cross section, but at this with only two printed circuit board (PCB) position layers, wherein further provides the additional barrier element for laser beam, but is in now between two removable separation position layers;
Fig. 4 A is the viewgraph of cross-section being similar to Fig. 4, but only with a removable separation position layer, and this separation position layer is laid with an additional barrier element;
Fig. 5 shows a single position layer, this single position layer is with resin bed and laying structurized conductor layer on the resin layer, also with the layer with small particle established thereon, described small particle is arranged for formation extra play, to manufacture the intrinsic element for stopping laser beam when cutting the printed circuit board component completed or punch; With
Fig. 6 shows the multi-ply construction of the position layer for sandwich construction still illustrated dividually with three, wherein interposition layer corresponds to the position layer after extra play is structured shown in Fig. 5 to be formed according to additional barrier element of the present invention, and wherein schematically to also explains the extruding of every layer be multilayer board element.
Embodiment
In FIG completely schematically and show the structure of the routine of multilayer board element 1 not in scale, wherein such as show three position layers 2,3 and 4, but the structure of printed circuit board component should not be limited to this.Specifically have three artificial resin layers 5,6 and 7, described artificial tree lipid layer is such as made up of epoxy resin as known, and wherein, they also can containing glass fibre for strengthening.In addition, there are four conductor layers (metal level is generally layers of copper) 8,9,10 and 11 in the example shown, wherein two layers 8,11 are present on the outside of structure, and layers of copper 9 and 10 is present in inside.Schematically show other laser beam 12 in FIG completely; This laser beam 12 for contact hole punching but also for cutting, such as, to remove a part from printed circuit board (PCB) position layer.When wishing the flexible portion of printed circuit board component, when namely manufacturing so-called rigid-flexible printed circuit board, providing and such as removing from this type of of printed circuit board (PCB) position layer segment.The depth of invasion of laser beam 2 according to Fig. 1 by being positioned at inner layers of copper 9 limited boundary, because layers of copper 9 or metallization 9 reflect such as CO well for this reason
2the laser beam of laser beam.Due to this reflection in layers of copper 9, therefore laser beam 12 can not continue to invade to the inside of the structure of printed circuit board component 1.
Completely generally, as the laser in visible-range or infra-red range reflected well for the metal of conductor position layer 8,9,10 and 11; But the laser beam within the scope of UV then such as cuts layers of copper.For this type of UV laser, therefore when punching or the cutting of printed circuit board component, other control is carried out to its depth of invasion, wherein special nonmetal interval insulant part is placed in Rotating fields, its function is for UV laser provides space or interval, and described interval insulant part can be destroyed when using UV laser drilling or cutting.But use the method for known " spacer element " to be only suitable for cutting relatively slowly or punching, and require interval insulant to be inserted in the inside of such as resin bed.
If when being used in visible region or the laser beam in region of ultra-red 1 cutting printing circuit board element 1, in this case such as the internal conductor layer of layers of copper 9 is structured, see Fig. 2, there is not metal in the region 13 wherein in this conductor layer 9, therefore there is not laser beam 12 reflection on the metal surface, and the situation that laser beam 12 is wished in printed circuit board component 1 internal ratio invades darker, as shown in Figure 2.But what can conceive now is depth of invasion based on carrying out adjusting laser beam 12 to the control of laser beam 12 turn-on time, but the method too inaccuracy and also depend on the thickness and material etc. of each layer of particularly resin bed 5, described thickness and material may fully change.
If should on the position of conductor layer 9 (or also on the position of conductor layer 10, if should structuring be there is herein) welding stop mask has been installed, then thus on position 13, lack metallization in addition, the depth of invasion of laser beam 12 can not be readily controlled or limited boundary.
At this, remedy for completing, on required position the position of structuring (conductor layer that namely carries out position or the such as layers of copper 9 of cutting or punching with laser beam 12 subsequently) install intrinsic, independently, additional barrier element, at this also referred to as additional barrier element 14; This additional barrier element 14 with such as 9 conductor layer independently (additionally) installs and is formed with the little particulate playing laser beam barrier element, this is realized by the particulate that reflection lasering beam 12 and/or the energy by laser beam are used in this barrier element 14 added of melting thereon.Schematically illustrate the additional barrier element 14 without this type of local in metallized area 13 in the structurized conductor layer 9 of printed circuit board component 1 in figure 3, the situation structure that described printed circuit board component 1 goes out in addition as shown in Figures 1 and 2.
Additional barrier element 14 is as mentioned containing little particulate, and described particulate is connected by adhesive, and wherein this particulate is very little, makes their meltings more Zao than whole material composite.Such as, silver-colored particulate and golden particulate are for this reason tested as this " nanometer " particulate, wherein, already shown when particle size be the silver-colored particulate of about 100nm and golden particulate, good result can be realized.
Its size can reach until the little degree to also needing a small amount of adhesive in barrier element 14 of this small particle of μm scope, therefore this be that tool is advantageous, because adhesive is useless for barrier functionality for this reason, and the reflection of laser beam 12 in nanoparticle may be hindered.When particulate is excessive, multipath reflection can be also there is (such as further based on the geometry of particulate, high absorption by relatively high adhesive ingredients), wherein laser is possible by the region of barrier element 14 or penetrating of layer, thus laser is invaded dark.For barrier element 14 and barrier functionality thereof therefore tool meaningfully make " smallness " of particulate combine with less adhesive share or combine with reflection and absorption characteristic, wherein except the reflection on barrier element 14 can always higher than except the reflection in layers of copper 9 (see Fig. 1), the energy of laser 12 is also for if desired by nanoparticle melting.
Other material for nanoparticle is such as copper, zinc, lead, aluminium, can be used for the common metal of " nanometer " particulate processing, but also can be ceramic material.
As adhesive, being proved to be suitable at this is such as epoxy resin; Also the solvent based on alpha-terpineol for extra play material can be used.
Use as described in this type of or similar adhesive and this type of nanoparticle, such as can manufacture the layer material with paste form, described layer material easily can be configured to the additives of remaining part in the manufacture process of printed circuit board component 1.Multiple printing technology (comprising screen printing or ink jet printing) and other coating technology (such as spraying) are specially suitable for this pastel for barrier element 14 of laying.Also first pastel can be laid with the form of superficial layer, and then by this surface layer structure, if provide photaesthesia feature for pastel, then this can carry out by means of known optical exposure technology (developing process with subsequently).This also will explain according to Fig. 5 and Fig. 6 hereinafter further.
Be in operation, the energy of laser beam 12 is absorbed by small particle, and wherein, energy is used for particle fraction ground or fully melting.In addition, laser beam 12 is partially or even wholly reflected.Be also advantageous in that, cool, because transferred out heat by particulate due to the thermo-contact of the particulate of laser beam 12 incident area.
The laser beam barrier element 14 provided is suitable in printed circuit board component 1, carrying out the application of cutting by laser beam 12 in a particularly advantageous manner, described cutting is such as removing a part for a position layer, such as remove a part (see Fig. 1) for position layer 2, therefore to realize possible flexible printed circuit board region as is known by the resin portion removing sclerosis in this position.
As previously mentioned and it is known that when removing position layer a part of of printed circuit board component, load removable separation position layer, therefore to avoid each layer in the mutual bonding of this position.But this separates the effect that position layer is not used from the barrier element of laser beam 12.There is provided this type of to separate position layer, as the independent separation position layer 16 in the separation position layer 15,16 in Fig. 4 or Fig. 4 A, substantially can combine with the laser beam barrier element 14 such as according to Fig. 3 now as explained above, see Fig. 4 and Fig. 4 A.At this, separate between position layers 15,16 (see Fig. 4) it is possible that additional or intrinsic barrier element 14 are laid in two, or be laid in and separate on position layer 16 (see Fig. 4 A).Certainly, it is possible that be provided in this type of below of separating position layer (such as, 15 in Fig. 4) according to the concrete condition of barrier element 14, and other separation position layer 16 is not reoffered in below yet yet.
When Fig. 4 and Fig. 4 A, such as can by upper layer 5 with 8 part 17 remove from remaining printed circuit board component 1.This part 17 can be the part of closed such as rectangular shape, wherein, its border separates position layer 15,16 by least one and barrier element 14 is formed, and wherein cuts and carry out around this part 17 by means of laser beam 12, with final removable described part 17.This is non-detailed icon in Fig. 4 and Fig. 4 A, but is conventional technology as seen from this barrier element 14.
Schematically illustrate position layer in cross-section in Figure 5, such as, according to the position layer 3 of the printed circuit board component 1 of Fig. 1, institute's rheme layer is with resin bed 6 and laying structurized conductor layer 9 on the resin layer.According to structuring, in conductor layer 9, there is the region 13 be wherein no longer metallized.This layer shown in Fig. 5 provides position layer in the multilayer board element 1 such as shown in Fig. 1 to Fig. 3.
For intrinsic barrier element 14 is arranged in region 13, in this example layer 3 first in place provides particle surface layer 14 ' now, this is such as by brushing pastel and striking off, spray (spray coating), printing or similar known method and realize.First this superficial layer 14 ' formed by the pastel with nanoparticle and adhesive is equipped with light-sensitive element, and such as commercial light trigger is together with crosslinked adhesive.With this by using corresponding exposure of mask to make superficial layer 14 ' harden partly and being configured to be etched agent effect (such as can photodevelopment) partly, to make in erosion process subsequently (such as, in development step) be quite analogous to the situation in the structuring of conductor layer (such as 9), obtain the structurized extra play as barrier element 14, see Fig. 6.
Interior position layer 3 is stacking in known manner according to Fig. 6 and outer position layer 2,4 (and if desired with unshowned position layer in other), and usually stackedly with other this type of combine with the kind of arrangements of " books " as is known in a press, and be then extruded under heating state, to make position layer 2,3 mutually adhesively be connected with 4, see the extruder member 18,19 only schematically shown completely in Fig. 6.(should it is mentioned that certainly also there is non-thermal connection possibility at this, this such as can use when loading the barrier element 14 added provided).
Carry out this type of extruding also such as can be laid in position (therefore " being structured ") of hope at additional barrier element 14 certainly to otherwise during by screen printing.
The other types independently obtaining provided barrier element 14 with conductor layer 8,9,10,11 are such as also aforesaid particulate to be directly arranged in an appropriate manner in suitable position layer or layer as packing material.In this case, therefore particulate is directly included in as " packing material " in the resin system of resin bed of printed circuit board component, or be also contained in if desired to separate in position layer 15 or 16 and (wherein only there is this type of and separate position layer), and involved resin bed or separation position layer work as laser barrier coat or position layer, namely work as laser barrier element, have nothing to do with conductor layer 8,9,10,11 again.
There is provided the other possibility of barrier element 14 to be, prefabricated barrier element 14 is provided as film (band), wherein this barrier element rete is pressed on (resin) layer or is embedded in Rotating fields.
Use the additional barrier element 14 for laser beam 12 provided by especially due to particulate and the reflection that causes of its size or shape or absorption characteristic affect barrier properties.Advantageous at this tool is that this additional barrier element 14 can be laid everywhere in multi-ply construction, namely wishes the position of the depth of invasion limiting laser subsequently when cutting or the punching of printed circuit board component 1.This variable installation site also has advantage especially as flexible installing method.Be proved to be advantageously at this, after printed circuit board component is structured and corrodes, pastel can be printed on printed circuit board component or with other form with the form of the layer with nanoparticle and be attached on printed circuit board component, and need not use the layers of copper of the stopped laser beam with basal layer meaning.When laser beam 12 incides on additional barrier element 14, little particulate is reflection or if desired also partially or even wholly melting sintering, to stop laser beam to invade further in printed circuit board component as stated also.
When the invention described above is explained according to preferred embodiment especially, therefore certainly change within the scope of the invention and amendment are fine.Therefore, in the accompanying drawings, as described hitherto, laser barrier element 14 is always depicted as (approximately) in the plane with structurized conductor layer 9.But can conceive equally well and realize, making the barrier element 14 added be laid in resin bed (such as 6), as (for the sake of simplicity) is shown in broken lines for the sake of simplicity in figure 3.This is especially easily by such as under type realization, even if resin bed is made up of such as two-layer before extruding or bonding, such as in the resin system of the epoxy resin layer formed by prepreg, described prepreg originally in the form of a film exist and for extruding can be stacked simply, such as to realize the insulating barrier increased.When photosensitive pastel, the technology only using single-stage developing process as light process also can be used.This additionally relates to extra play material, therefore such as exist with the pastel of aluminium particulate filling or ink, wherein aluminium particulate exists with the yardstick of several microns (such as, about 4 μm) and is approximately planar shaped, therefore to realize the layout of the stratiform when laying (printing).
Claims (26)
1. a printed circuit board component (1), this printed circuit board component is with multiple dielectric layer (5, 6, 7) and conductor layer (8, 9, 10, 11), and at the laser beam barrier element (14) that printed circuit board component inside is formed by the little particulate of absorbing laser energy with at least one, to stop for the laser beam punched or cut (12) the dark intrusion in printed circuit board component, it is characterized in that, laser beam barrier element (14) is intrinsic, with conductor layer (8, 9, 10, 11) the additional barrier element (14) installed independently, the particulate of this barrier element is nanoparticle, namely make particulate little of such degree, make the fusing point of described nanoparticle and the fusing point of common printed circuit board material have deviation and make the melting more Zao than whole material composite of described particulate.
2. printed circuit board component according to claim 1, is characterized in that, described printed circuit board component is multilayer board element.
3. printed circuit board component according to claim 1, is characterized in that, particulate adhesive is combined into a layer parts.
4. printed circuit board component according to claim 3, is characterized in that, described adhesive is resin.
5. printed circuit board component according to claim 4, is characterized in that, described resin is epoxy resin.
6. the printed circuit board component according to claim 1 or 3, is characterized in that, particulate has spherical form.
7. the printed circuit board component according to claim 1 or 3, is characterized in that, particulate has little disc-like shape.
8. printed circuit board component according to claim 1, is characterized in that, at least some particulate is formed by metal.
9. printed circuit board component according to claim 8, is characterized in that, described metal is silver-colored and/or golden.
10. printed circuit board component according to claim 9, is characterized in that, the particulate formed by silver and/or gold has the particle size of about 100nm.
11. printed circuit board components according to claim 1, is characterized in that, at least some particulate is formed by ceramic material.
12. printed circuit board components according to claim 1, is characterized in that, barrier element (14) is the layer parts of printing.
13. printed circuit board components according to claim 1, it is characterized in that, barrier element (14) to be laid on removable separation position layer (15,16) or within, or to be laid between two removable separation position layers (15,16).
14. printed circuit board components according to claim 1, is characterized in that, barrier element (14) passes through film that is that embed or lamination and formed.
15. 1 kinds of methods for the manufacture of the printed circuit board component (1) according to any one of claim 1 to 14, wherein, connecting every layer (2 of printed circuit board component, 3, 4) barrier element (14) formed by the little particulate by absorbing laser energy before is laid in the position of hope, then every layer is extruded when enclosing additional barrier element (14), it is characterized in that, laser barrier element (14) is installed as and conductor layer (8, 9, 10, 11) independently intrinsic, additional barrier element (14), wherein, particulate is nanoparticle, namely make particulate little of such degree, make the fusing point of described nanoparticle and the fusing point of common printed circuit board material have deviation and make the melting more Zao than whole material composite of described particulate.
16. methods according to claim 15, it is characterized in that, barrier element (14) to be laid on removable separation position layer (15,16) or within, or to be laid between two removable separation position layers (15,16).
17. methods according to claim 15 or 16, is characterized in that, use the particulate be made of metal.
18. methods according to claim 17, is characterized in that, described metal is silver-colored and/or golden.
19. methods according to claim 15, is characterized in that, barrier element (14) is layeredly laid with printing process.
20. methods according to claim 19, is characterized in that, described printing process is screen printing, ink jet printing.
21. methods according to claim 15, is characterized in that, barrier element (14) is layeredly laid with spray-on coating method.
22. methods according to claim 15, is characterized in that, barrier element (14) is laid as pastel.
23. methods according to claim 22, is characterized in that, barrier element (14) utilizes adhesive to lay as pastel.
24. methods according to claim 23, is characterized in that, described adhesive is resin.
25. methods according to claim 24, is characterized in that, described resin is epoxy resin.
26. methods according to claim 15, is characterized in that, barrier element (14) is laid as prefabricated film, and described film is embedded in institute's rheme layer (2,3; 15,16) between or lamination layer (3 in place; 16) on.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT0000509U AT12321U1 (en) | 2009-01-09 | 2009-01-09 | MULTILAYER PCB LAYER ELEMENT WITH AT LEAST ONE LASER BEAM STOPPING ELEMENT AND METHOD FOR ATTACHING SUCH A LASER BEAM STOPPER IN A MULTILAYER PCB ELEMENT |
| ATGM5/2009 | 2009-01-09 | ||
| PCT/AT2010/000004 WO2010078611A1 (en) | 2009-01-09 | 2010-01-08 | Printed circuit board element having at least one laser beam stop element and method for producing a printed circuit board element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102349360A CN102349360A (en) | 2012-02-08 |
| CN102349360B true CN102349360B (en) | 2015-09-30 |
Family
ID=42316135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080011207.9A Active CN102349360B (en) | 2009-01-09 | 2010-01-08 | With printed circuit board component and the manufacture method thereof of at least one laser beam barrier element |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2386193A1 (en) |
| JP (1) | JP5693468B2 (en) |
| CN (1) | CN102349360B (en) |
| AT (1) | AT12321U1 (en) |
| WO (1) | WO2010078611A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2810539B1 (en) * | 2012-02-03 | 2018-03-28 | Avery Dennison Corporation | Laser patterning of photovoltaic backsheet |
| EP2906653B1 (en) | 2012-10-09 | 2022-06-15 | Avery Dennison Corporation | Adhesives and related methods |
| DE102013212665B4 (en) * | 2013-06-28 | 2015-06-25 | Laser Zentrum Hannover E.V. | Method for laser drilling or laser cutting a workpiece |
| JP6537620B2 (en) | 2015-02-05 | 2019-07-03 | アベリー・デニソン・コーポレイションＡｖｅｒｙ Ｄｅｎｎｉｓｏｎ Ｃｏｒｐｏｒａｔｉｏｎ | Label assembly for harsh environments |
| DE102015113324A1 (en) | 2015-08-12 | 2017-02-16 | Schweizer Electronic Ag | Ladder structure element with laminated inner layer substrate and method for its production |
| WO2018118767A1 (en) | 2016-12-22 | 2018-06-28 | Avery Dennison Corporation | Convertible pressure sensitive adhesives comprising urethane (meth) acrylate oligomers |
| CN109219255A (en) * | 2018-11-14 | 2019-01-15 | 生益电子股份有限公司 | A kind of production method and PCB of non-metallic stepped groove |
| KR20200106342A (en) * | 2019-03-04 | 2020-09-14 | 삼성전기주식회사 | Printed Circuit Board and manufacturing method for the same |
| CN114543986A (en) * | 2022-03-07 | 2022-05-27 | 英特尔产品（成都）有限公司 | Light barrier device |
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- 2010-01-08 EP EP10701190A patent/EP2386193A1/en not_active Ceased
- 2010-01-08 WO PCT/AT2010/000004 patent/WO2010078611A1/en active Application Filing
- 2010-01-08 CN CN201080011207.9A patent/CN102349360B/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2386193A1 (en) | 2011-11-16 |
| JP2012514859A (en) | 2012-06-28 |
| JP5693468B2 (en) | 2015-04-01 |
| WO2010078611A1 (en) | 2010-07-15 |
| CN102349360A (en) | 2012-02-08 |
| AT12321U1 (en) | 2012-03-15 |
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