CN102161179B - Wafer grinding device - Google Patents
Wafer grinding device Download PDFInfo
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- CN102161179B CN102161179B CN201010614088.8A CN201010614088A CN102161179B CN 102161179 B CN102161179 B CN 102161179B CN 201010614088 A CN201010614088 A CN 201010614088A CN 102161179 B CN102161179 B CN 102161179B
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Abstract
The invention relates to a wafer grinding device for sapphire lining wafers. The invention provides a wafer grinding device which has high efficiency and avoids wafer edge collapse. The wafer grinding device comprises a base, a wafer carrier, a workbench, a grinding mechanism and a pressing mechanism, wherein the base is used for supporting components of the grinding device; the wafer carrier is used for fixing and holding the wafer; the workbench is used for supporting the wafer carrier and is installed on the base and comprises a first drive mechanism and a second drive mechanism, the first drive mechanism drives the workbench to do traverse and vertical reciprocation motion, and the second drive mechanism drives the wafer carrier to spin; the grinding mechanism is positioned above the workbench for grinding wafers and comprises a grinding head, a drive motor and a connection part, the drive motor drives the grinding mechanism to spin, and the connection part is used for fixing the grinding head; and the pressing mechanism is positioned above the grinding mechanism for applying a press onto the grinding head. The wafer grinding device basically eliminates the phenomenon of product edge collapse, and uses a single grinding head to grind a single wafer instead of multiple wafers adhered to the wafer carrier, so grinding efficiency is greatly improved.
Description
Technical field
The present invention relates to a kind of opto-electronic information technology field, particularly a kind of wafer polishing apparatus for Sapphire Substrate wafer.
Background technology
Sapphire wafer is used as the superiority of backing material: sapphire is a kind of alumina single crystal material, there is very high hardness, be the backing material generally adopting of current LED industry, the matrix of growing as gallium nitride homepitaxy is to produce the light emitting diodes such as blue light.Substrate processing is a main bugbear in LED industrial chain, not only need the precision that reaches very high, especially for the substrate of making patterned wafers, require flatness (TTV) to be less than 5 microns, edge ring is less than 30 microns, meanwhile, also to reach higher working (machining) efficiency and certain economy.
Sapphire is because its hardness is high and fragility is large, and machining is difficult, and sapphire is a kind of backing material of the most generally applying.As backing material, the surface flatness of plane of crystal is had high requirements.Research shows that the quality of device depends on the Surface Machining of substrate to a great extent.Especially to more complicated for the Sapphire Substrate wafer precision processing technology of GaN growth, be a difficult problem for current primary study.Poor quality, the Sapphire Substrate wafer that smoothness is inadequate, can not grow thereon and meets the required GaN film of light emitting diode (LED).
The ubiquitous problem of wafer of conventional wafer lapping device processing is exactly easily the collapse problem on limit of Waffer edge.The reason that causes this problem is that abrasion path rule has caused edge abrasion to be greater than inside and easily formed the limit of collapsing.The qualification rate of the finished product that the lapping device of the Sapphire Substrate of prior art obtains is low, long processing time cause high heterodyne and cost high, and the index such as surface roughness, flatness, wafer thickness tolerance all can not reach the requirement of graphics processing substrate wafer.
Develop rapidly along with photoelectric technology, the day by day increase of photovoltaic to the demand of saphire substrate material, in order to meet the demand of sapphire optics development, be badly in need of the lapping device that a kind of operating efficiency is high, percent defective is low, product smoothness is high, cost is low.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of wafer polishing apparatus, its operating efficiency is high, product smoothness is high, product collapses, and limit phenomenon greatly reduces.
Technical scheme of the present invention is: a kind of wafer polishing apparatus, comprises for supporting the base station 1 of the element of lapping device; For the fixing chip carrier 2 that keeps described wafer 201; For supporting described chip carrier 2 and being installed on the workbench 3 on described base station 1, it comprises driving its first driving mechanism 310 that produces radially reciprocating motion and front-rear reciprocation movement and the second driving mechanism 320 in order to drive described chip carrier 2 generations to rotatablely move; Be positioned at the top of described workbench 3, for grinding the grinding mechanism 4 of described wafer 201, it comprises grinding head 401, be arranged at described grinding head 401 tops and for driving drive motors 402 that its generation rotatablely moves and for the coupling components 403 of fixing described grinding head 401; Be positioned at described grinding mechanism 4 tops, for the pressing mechanism 5 that described grinding head 401 is exerted pressure, preferred pneumatic shuttle.Wherein, the coverage of grinding head 401 is slightly less than wafer 201 surfaces, makes the edge grinding time slightly be less than inside, and the grinding of whole like this wafer surface is even, reduces the generation on the limit of collapsing.
On described chip carrier 2, pore 202 is set, in order to vacuum suction wafer.Adopt the mode of vacuum suction to keep wafer, can avoid the problem of deterioration and the cleaning problem of wax of the flatness that causes because of wax bonding mode.
Described coupling components 403 comprises travel(l)ing rest 404 and support arm 405, and one end of support arm 405 is fixedly connected on travel(l)ing rest 404, on support arm 405, distributes described grinding head 401 is set.
Described the first driving mechanism 310 is the screw mechanism that two square crossings arrange, be positioned at the bottom of workbench 3, comprise driving workbench 3 to produce radially moving back and forth the first leading screw 311 and in order to drive workbench 3 to produce the second leading screw 312 of front-rear reciprocation movements.The first leading screw 311 drives workbench 3 to produce while radially moving back and forth, and drives the chip carrier 2 being arranged on workbench 3 to do radially and moves back and forth; When the second leading screw 312 drives workbench 3 to produce front-rear reciprocation movement, drive the chip carrier 2 being arranged on workbench 3 to do front-rear reciprocation movement.
Described the second driving mechanism 320 comprises motor 321 and drive disk assembly, and motor 321 passes through drive disk assembly connecting wafer carrier 2, and drives its rotation.
Described drive disk assembly is gear and rotating shaft, its middle gear comprises output gear 322, governor gear 323 and driven gear, output gear 322 connects the output shaft 328 of motor 321, governor gear 323 and output gear 322 engagements, governor gear 323 and the first driven gear 324 are setting up and down in the first rotating shaft 325, and the first driven gear 324 meshes with the second driven gear 326 and the 3rd driven gear 327 respectively.Also can replace gear drive with belt pulley.Wherein governor gear 323 is different from the diameter of output gear 322, and in order to change rotating speed, governor gear 323 is all identical with the diameter of each driven gear, makes each chip carrier 2 have identical rotating speed.
Beneficial effect of the present invention is: traditional grinding technique, because wafer is inner large with edge grinding amount difference, has caused taking place frequently of the limit phenomenon of collapsing; Be exactly in addition the process of lapping time long, make work efficiency low.Font abrasion path that the present invention adopts irregular " 8 ", the milling time at balanced substrate interior and edge, has eliminated the phenomenon on the limit of collapsing substantially; Grinding mechanism of the present invention adopts the mode of single grinding head single-chip to replace traditional multi-wafer to stick to the mode on chip carrier in addition, has greatly improved grinding efficiency.
Accompanying drawing explanation
Fig. 1 is overall structure schematic diagram of the present invention;
Fig. 2 is the position view of grinding mechanism 4 and workbench 3 in the present invention;
Fig. 3 is the structural representation of chip carrier 2 in the present invention;
Fig. 4 is the distribution schematic diagram of chip carrier 2 on workbench 3 in the present invention;
Fig. 5 is the structural representation of coupling mechanism 403 in the present invention;
Fig. 6 is the structural representation of the second driving mechanism 320 in the present invention;
Fig. 7 is the relative motion schematic diagram of grinding head 401 and chip carrier 2 in the present invention.
Wherein, 1-base station, 2-chip carrier, 3-workbench, 4-grinding mechanism, 5-pressing mechanism, 201-wafer, 202-pore, 310-the first driving mechanism, 311-the first leading screw, 312-the second leading screw, 320-the second driving mechanism, 321-motor, 322-output gear, 323-governor gear, 324-the first driven gear, 325-the first rotating shaft, 326-the second driven gear, 327-the 3rd driven gear, the output shaft of 328-motor 321,401-grinding head, 402-drive motors, 403-coupling components, 404-travel(l)ing rest, 405-support arm.
The specific embodiment
Below in conjunction with accompanying drawing explanation the present invention.
Referring to Fig. 1, the present invention includes base station 1, it is for supporting the element of lapping device; Chip carrier 2, it is for the fixing wafer 201 that keeps; Workbench 3, it is for supporting described chip carrier 2 and being installed on base station 1; Grinding mechanism 4, it is positioned at the top of workbench 3 for grinding wafers 201; Pressing mechanism 5, it is positioned at described grinding mechanism 4 tops for described grinding head 401 is exerted pressure, and pressing mechanism 5 adopts pneumatic shuttle.
Referring to Fig. 2 and Fig. 5, grinding mechanism 4 comprises grinding head 401, be arranged at described grinding head 401 tops and for driving drive motors 402 that its generation rotatablely moves and for the coupling components 403 of fixing described grinding head 401.Wherein coupling components 403 comprises travel(l)ing rest 404 and support arm 405, and one end of support arm 405 is fixedly connected on travel(l)ing rest 404, on support arm 405, distributes described grinding head 401 is set.Wherein, the coverage of grinding head 401 is less than wafer 201 surfaces, makes the edge grinding time slightly be less than inside, and the grinding of whole like this wafer surface is even, reduces the generation on the limit of collapsing.
Referring to Fig. 1 and Fig. 6, workbench 3 comprises driving its first driving mechanism 310 that produces radially reciprocating motion and front-rear reciprocation movement and the second driving mechanism 320 in order to drive described chip carrier 2 generations to rotatablely move; Described the first driving mechanism 310 is the screw mechanism that two square crossings arrange, be positioned at the bottom of workbench 3, comprise driving workbench 3 to produce radially moving back and forth the first leading screw 311 and in order to drive workbench 3 to produce the second leading screw 312 of front-rear reciprocation movements.The first leading screw 311 drives workbench 3 to produce while radially moving back and forth, and drives the chip carrier 2 being arranged on workbench 3 to do radially and moves back and forth; When the second leading screw 312 drives workbench 3 to produce front-rear reciprocation movement, drive the chip carrier 2 being arranged on workbench 3 to do front-rear reciprocation movement.Described the second driving mechanism 320 comprises motor 321 and drive disk assembly, and motor 321 passes through drive disk assembly connecting wafer carrier 2, and drives its rotation.Drive disk assembly adopts gear and rotating shaft, its middle gear comprises output gear 322, governor gear 323 and driven gear, output gear 322 connects the output shaft 328 of motor 321, governor gear 323 and output gear 322 engagements, governor gear 323 and the first driven gear 324 are setting up and down in the first rotating shaft 325, and the first driven gear 324 meshes with the second driven gear 326 and the 3rd driven gear 327 respectively.Also can replace gear drive with belt pulley.Wherein governor gear 323 is different from the diameter of output gear 322, and in order to change rotating speed, governor gear 323 is all identical with the diameter of each driven gear, makes each chip carrier 2 have identical rotating speed.
Referring to Fig. 3, pore 202 is set, in order to vacuum suction wafer on chip carrier 2.Adopt the mode of vacuum suction to keep wafer, can avoid the problem of deterioration and the cleaning problem of wax of the flatness that causes because of wax bonding mode.
Referring to Fig. 4, on workbench 3, be uniformly distributed a plurality of chip carriers 2.
Referring to Fig. 1-Fig. 6, wafer 201 is passed through to pore 202 vacuum suction to chip carrier 2.Start the motor 321 of the second driving mechanism 320, drive output gear 322 to rotate, by governor gear 323 adjusting rotary speeds, by the first rotating shaft 325, drive the first driven gear 324 to rotate, thereby drive chip carrier 2 rotations that are arranged in the first rotating shaft 325.The first driven gear 324 is respectively at the second driven gear 326 and the engagement of the 3rd driven gear 327, and other driven gears have respectively and these three driven gears engagements, thereby realizes a plurality of chip carriers 2 of being arranged on workbench 3 with identical rotating speed rotation.When chip carrier 2 drives wafer 201 rotations of adsorbing on it, workbench 3 drives the wafer 201 of chip carrier 2 and upper absorption thereof radially to move back and forth and front-rear reciprocation movement by the first driving mechanism 310.A plurality of grinding heads 401 rotation under the effect of drive motors 402 of grinding mechanism 4, the switched in opposite that turns to chip carrier 2 supporting with it of grinding head 401, rotating speed is identical.Pressing mechanism 5 orders about grinding head 401 and pushes down the wafer 201 on chip carrier 2 with certain pressure.As shown in Figure 7, grinding head 401 starts from an edge of wafer 201, and grinding head 401 and wafer 201 are backwards rotation; Start grinding head 401 and move downwards, simultaneously chip carrier 2 and on wafer 201 move right, grinding head 401 and wafer 201 leftmost edges in motion are on the way collided; Then grinding head 401 moves downward, and chip carrier 2 and on wafer 201 to left movement, then grinding head 401 moves upward, chip carrier 2 and on wafer 201 move right, move in circles, certain on wafer 201 a bit presents irregular figure of eight motion path with respect to grinding head 401, to avoid because of wafer that abrasion path rule the causes limit problem of collapsing.
Claims (5)
1. a wafer polishing apparatus, is characterized in that, comprises
For supporting the base station (1) of the element of lapping device;
For the fixing chip carrier (2) that keeps described wafer (201);
Be used for supporting described chip carrier (2) and be installed on the workbench (3) on described base station (1), it comprises driving its first driving mechanism (310) that produces radially reciprocating motion and front-rear reciprocation movement and the second driving mechanism (320) in order to drive described chip carrier (2) generation to rotatablely move;
Be positioned at the top of described workbench (3), be used for grinding the grinding mechanism (4) of described wafer (201), it comprises grinding head (401), be arranged at described grinding head (401) top and for the drive motors (402) that drives its generation to rotatablely move with for the coupling components (403) of fixing described grinding head (401);
Be positioned at described grinding mechanism (4) top, for making described grinding head (401) press to the pressing mechanism (5) of described wafer (201);
Described the second driving mechanism (320) comprises motor (321) and drive disk assembly, and motor (321) connects described chip carrier (2) by drive disk assembly, and drives its rotation;
Described drive disk assembly is gear and rotating shaft, its middle gear comprises output gear (322), governor gear (323) and driven gear, output gear (322) connects the output shaft (328) of motor (321), governor gear (323) and output gear (322) engagement, governor gear (323) is setting up and down upper in the first rotating shaft (325) with the first driven gear (324), and the first driven gear (324) meshes with the second driven gear (326) and the 3rd driven gear (327) respectively.
2. wafer polishing apparatus according to claim 1, is characterized in that, pore (202) is set, vacuum suction wafer on described chip carrier (2).
3. wafer polishing apparatus according to claim 1, it is characterized in that, described coupling components (403) comprises travel(l)ing rest (404) and support arm (405), it is upper that one end of support arm (405) is fixedly connected on travel(l)ing rest (404), and upper distribution of support arm (405) arranges described grinding head (401).
4. wafer polishing apparatus according to claim 1, it is characterized in that, described the first driving mechanism (310) is the screw mechanism that two square crossings arrange, be positioned at the bottom of described workbench (3), comprise driving described workbench (3) to produce radially moving back and forth the first leading screw (311) and in order to drive described workbench (3) to produce second leading screw (312) of front-rear reciprocation movement.
5. wafer polishing apparatus according to claim 1, is characterized in that, described pressing mechanism (5) adopts pneumatic shuttle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010614088.8A CN102161179B (en) | 2010-12-30 | 2010-12-30 | Wafer grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010614088.8A CN102161179B (en) | 2010-12-30 | 2010-12-30 | Wafer grinding device |
Publications (2)
| Publication Number | Publication Date |
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| CN102161179A CN102161179A (en) | 2011-08-24 |
| CN102161179B true CN102161179B (en) | 2014-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010614088.8A Active CN102161179B (en) | 2010-12-30 | 2010-12-30 | Wafer grinding device |
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Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102950523A (en) * | 2011-08-30 | 2013-03-06 | 浚鑫科技股份有限公司 | Silicon-chip grinding device |
| CN102909650B (en) * | 2012-11-01 | 2015-04-08 | 成都精密光学工程研究中心 | Surface processing method of strip laser medium |
| CN106272010B (en) * | 2015-05-25 | 2019-03-08 | 蓝思科技股份有限公司 | A kind of abrasive polishing method of sapphire mirror surface substrate indent flat surface |
| CN105014526B (en) * | 2015-07-27 | 2018-01-05 | 尚德太阳能电力有限公司 | The automatic sander and automatically grinding method of scraping bar for silk screen printing |
| CN106826406B (en) * | 2016-12-27 | 2019-06-14 | 重庆晶宇光电科技有限公司 | Wafer processing method |
| CN106826491B (en) * | 2016-12-27 | 2018-09-21 | 重庆晶宇光电科技有限公司 | Process equipment for wafer grinding |
| CN106826537B (en) * | 2016-12-28 | 2019-03-15 | 重庆晶宇光电科技有限公司 | Wafer grinding equipment with dust-absorbing function |
| CN108177040A (en) * | 2017-11-24 | 2018-06-19 | 苏州中拓专利运营管理有限公司 | A kind of reinforcing chip debarring process |
| CN108544364A (en) * | 2018-05-24 | 2018-09-18 | 镇江金莱宝光电有限公司 | A kind of sapphire stereo omnibearing formula grinding device |
| CN110561264B (en) * | 2019-10-10 | 2020-08-25 | 温州冲亚电子科技有限公司 | Crystal bar outer diameter grinding equipment for semiconductor components and parts |
| CN111390750B (en) * | 2020-03-25 | 2021-09-03 | 福建北电新材料科技有限公司 | Wafer surface processing device |
| CN112757152A (en) * | 2020-12-31 | 2021-05-07 | 福建省将乐县长兴电子有限公司 | Wafer grinding device |
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| JP3649393B2 (en) * | 2000-09-28 | 2005-05-18 | シャープ株式会社 | Silicon wafer processing method, silicon wafer and silicon block |
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| SU607655A2 (en) * | 1975-12-08 | 1978-05-25 | Всесоюзный заочный машиностроительный институт | Device for obtaining curvilinear paths |
| US5762544A (en) * | 1995-10-27 | 1998-06-09 | Applied Materials, Inc. | Carrier head design for a chemical mechanical polishing apparatus |
| JPH10315103A (en) * | 1997-05-16 | 1998-12-02 | Okamoto Kosaku Kikai Seisakusho:Kk | Grinding/polishing method and device therefor |
| JPH1199470A (en) * | 1997-07-17 | 1999-04-13 | Canon Inc | Polishing device |
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| CN102161179A (en) | 2011-08-24 |
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Effective date of registration: 20170623 Address after: 266114 Hedong Road, hi tech Zone, Shandong, Qingdao Patentee after: QINGDAO XINJIAXING ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 266114, high tech Industrial Development Zone, Mount 1, Ao Road, Chengyang District, Qingdao, Shandong Patentee before: QINGDAO ISTARWAFER TECHNOLOGY Co.,Ltd. |
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Address after: 266114 Hedong Road North, Gaoxin District, Qingdao, Shandong Province Patentee after: Qingdao Xinjiaxing Electronic Technology Co.,Ltd. Address before: 266114 Hedong Road North, Gaoxin District, Qingdao, Shandong Province Patentee before: QINGDAO XINJIAXING ELECTRONIC TECHNOLOGY Co.,Ltd. Address after: 266114 Hedong Road North, Gaoxin District, Qingdao, Shandong Province Patentee after: Qingdao huaxinjingdian Technology Co.,Ltd. Address before: 266114 Hedong Road North, Gaoxin District, Qingdao, Shandong Province Patentee before: Qingdao Xinjiaxing Electronic Technology Co.,Ltd. |