CN101995672B - Photoelectric integrated testing system and photoelectric testing method - Google Patents
Photoelectric integrated testing system and photoelectric testing method Download PDFInfo
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- CN101995672B CN101995672B CN2009100919068A CN200910091906A CN101995672B CN 101995672 B CN101995672 B CN 101995672B CN 2009100919068 A CN2009100919068 A CN 2009100919068A CN 200910091906 A CN200910091906 A CN 200910091906A CN 101995672 B CN101995672 B CN 101995672B
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Abstract
The invention discloses a photoelectric integrated testing system and a photoelectric testing method. The system comprises a testing base station supporting a test sample, wherein a switching component, an integrated control component and a plurality of testing components are arranged inside the testing base station; each testing component is connected with the switching component and the integrated control component; and the integrated control component is used for controlling the switching component and the testing components in a centralized manner. The invention also provides a photoelectric testing method. The invention realizes that a system can complete various photics tests and electrics tests of the same test sample at various stages, solves the problem that the test sample is required to continuously move between various testing equipment or driving equipment in the prior art, ensures the state of the test sample and the stability of the testing environment during testing, reduces the floor areas of the testing equipment or the driving equipment, saves cost and realizes intensification and efficiency of the equipment.
Description
Technical field
The present invention relates to the photoelectricity test technology, relate in particular to a kind of photoelectric integral type test macro and photoelectric test method.
Background technology
Along with the continuous development of science and technology, display panels is compact based on it, significantly saves advantages such as placing space, has obtained application more and more widely.In the production run of display panels; The testing procedure of display panels is most important; Wherein the test to display panels comprises electrical testing and optic test, tests, lights test, the test of voltage transmittance curve or the like like characteristic of semiconductor test, optic test, signal waveform.Usually, the test phase of display panels is divided into module (Module) test, unit (Cell) test and array (Array) test three phases.
In the prior art, the optic test of display panels and electrical testing are independently to carry out, and need use different optical test equipments or electrical testing equipment to accomplish the test to display panels respectively.Because the project of test is different; Employed testing apparatus is also different; And the test of accomplishing the sample of a display panels usually need be between different testing apparatuss continuous mobile test sample; Cause the state and the test environment of specimen in every test all inequality, have a negative impact for the vertical contrast and the collective analysis of the test result of same specimen.In addition, because every pairing testing apparatus of test is all inequality, and each testing apparatus all has independent matching component, and floor area is bigger, and especially for the test of large scale product, the usable floor area of equipment can be bigger, makes whole cost increase.
Summary of the invention
The object of the present invention is to provide a kind of photoelectric integral type test macro and photoelectric test method; Make the optic test and the electrical testing of display panels are all accomplished on an equipment; When carrying out each item test, need not mobile liquid crystal display panel specimen; Guarantee the stability of specimen and test mode in the different test phases, reduce the floor area of testing apparatus, practice thrift whole cost.
To achieve these goals; The invention provides a kind of photoelectric integral type test macro; The test base station that comprises support test specimens; In said test base station set inside exchange assembly, integrated Control Component and a plurality of test suite are arranged, each said test suite links to each other with said integrated Control Component with said exchange assembly, and said integrated Control Component is used for the said exchange assembly of centralized control and said a plurality of test suite;
The switch of said exchange assembly for constituting by multilayer board and control device; The number of plies of said printed circuit board (PCB) is by the number decision of said test suite; Each layer printed circuit board in the said multilayer board corresponds respectively to each said test suite, respectively each said test suite is controlled, and said exchange component internal comprises a plurality of on-off circuits; Lay respectively on the said multilayer board, be used for respectively said a plurality of test suites being controlled.
Further, photoelectric integral type test macro provided by the invention also comprises:
Be arranged on the lip-deep mechanical guide rail of said test base station;
The mechanical arm pull that is slidingly connected with said mechanical guide rail;
Be movably housed in optical lens and microlens on the said mechanical arm pull, be used for said specimen is carried out optic test;
Be arranged on the monitor on the said mechanical arm pull, be used for cooperating the completion optic test with said optical lens and microlens.
Further, photoelectric integral type test macro provided by the invention also comprises many Low Voltage Differential Signal lines and several probes, is connected with said a plurality of test suites respectively, is used for said specimen is surveyed.
Further, photoelectric integral type test macro provided by the invention also comprises the external control interface that links to each other with said integrated Control Component, is used for cooperating with said integrated Control Component the control of accomplishing said a plurality of test suites and said exchange assembly.
Particularly, said integrated Control Component is a computer host system, and said external control interface is calculator display organization and computer peripheral equipment system.
Particularly, said a plurality of test suite comprises current/voltage test suite, signal generating assembly, the thermomechanical components of lighting a lamp, oscillograph assembly and direct supply assembly.
A kind of photoelectric integral type test macro provided by the invention and photoelectric test method; Through various testing apparatuss or driving arrangement are integrated into a plurality of test suites; And be arranged in the photoelectric integral type test macro; Under controlling at integrated Control Component and exchange assembly; Realization just can accomplish multiple optic test and the electrical testing that same specimen is carried out each stage to utilizing a system, solved in the prior art problem that need specimen constantly be moved between a plurality of testing apparatuss or driving arrangement, guaranteed the state of specimen and the stability of test environment in the test process; Reduced the floor area of testing apparatus or driving arrangement; Also save the quantity of probe when specimen tested, processor, test platform etc., practiced thrift cost, realized the intensification and the high efficiency of equipment; Overcome the defective that to test, to monitor all photoelectric parameters simultaneously in the prior art simultaneously; Can understand the inner link between each photoelectric parameter of same specimen through photoelectric integral type test macro provided by the invention and photoelectric test method; There is the relation of supporting each other between the photoelectric parameter that test obtains, finds the reason that causes that specimen is bad so more easily.
Description of drawings
Fig. 1 is the one-piece construction synoptic diagram of photoelectric integral type test macro embodiment of the present invention;
Fig. 2 is the concrete structure synoptic diagram of photoelectric integral type test macro embodiment of the present invention;
Fig. 3 is the structural representation of the ground floor printed circuit board (PCB) of the exchange assembly among the photoelectric integral type test macro embodiment of the present invention;
Fig. 4 is the structural representation of the second layer printed circuit board (PCB) of the exchange assembly among the photoelectric integral type test macro embodiment of the present invention;
Fig. 5 is the structural representation of the 3rd layer printed circuit board of the exchange assembly among the photoelectric integral type test macro embodiment of the present invention;
Fig. 6 is the structural representation of the 4th layer printed circuit board of the exchange assembly among the photoelectric integral type test macro embodiment of the present invention;
Fig. 7 is the structural representation of the layer 5 printed circuit board (PCB) of the exchange assembly among the photoelectric integral type test macro embodiment of the present invention;
Fig. 8 is the inner structure synoptic diagram of specimen among the photoelectric integral type test macro embodiment of the present invention;
Fig. 9 is the process flow diagram of photoelectric test method embodiment of the present invention.
Embodiment
Through accompanying drawing and embodiment, technical scheme of the present invention is done further detailed description below.
Fig. 1 is the one-piece construction synoptic diagram of photoelectric integral type test macro embodiment of the present invention; As shown in Figure 1; Present embodiment provides a kind of photoelectric integral type test macro; The test base station 1 that specifically can comprise support test specimens 2, test base station 1 set inside has exchange assembly 3, integrated Control Component 4 and a plurality of test suite 5.Test base station 1 each inner test suite 5 links to each other with integrated Control Component 4 with exchange assembly 3 respectively; Integrated Control Component 4 is used for centralized control exchange assembly 3 and a plurality of test suites 5, specifically realizes the control to a plurality of test suites 5 through control exchange assembly 3.Wherein, Test suite 5 can be each testing apparatus or the driving arrangement in the technical field of liquid crystal display; A plurality of testing apparatuss or driving arrangement are integrated in a plurality of test suites 5 settings photoelectric integral type test macro in the present embodiment; Utilize native system that specimen is carried out optic test and electrical testing, issue steering order through integrated Control Component 4 to exchange assembly 3, exchange assembly 3 is controlled a plurality of test suites 5 according to control instruction corresponding; Can specifically control the operating switch of one or more test suites 5, the test that utilizes in running order one or more test suites 5 to accomplish to specimen.Therefore; The photoelectric integral type test macro that present embodiment provides is through being integrated in various testing apparatuss or driving arrangement in the same test macro; Through the integrated Control Component in the system exchange assembly is controlled; The exchange assembly is controlled being switched on or switched off of test suite, realizes utilizing a system just can accomplish multiple optic test and the electrical testing that same specimen is carried out each stage, and having solved need be with specimen continuous problem that moves between a plurality of testing apparatuss or driving arrangement in the prior art; The state of specimen and the stability of test environment in the test process have been guaranteed; Reduce the floor area of testing apparatus or driving arrangement, practiced thrift cost, realized the intensification and the high efficiency of equipment.
Fig. 2 is the concrete structure synoptic diagram of photoelectric integral type test macro embodiment of the present invention; As shown in Figure 2; And combination Fig. 1; The photoelectric integral type test macro that present embodiment provides specifically can comprise test base station 1, and 1 pair of specimen 2 of test base station supports, and in test base station 1 set inside exchange assembly 3, integrated Control Component 4 and a plurality of test suite 5 is arranged; Each test suite 5 links to each other with integrated Control Component 4 with exchange assembly 3, and integrated Control Component 4 is used for centralized control exchange assembly 3 and a plurality of test suites 5.Further, the photoelectric integral type test macro that provides of present embodiment can also comprise mechanical guide rail 6, mechanical arm pull 7, optical lens 8, microlens 9 and monitor 10.Wherein, mechanical guide rail 6 is arranged on the surface of test base station 1, can be positioned at the two ends on test base station 1 surface, and an end is provided with a mechanical guide rail 6; Machinery arm pull 7 is arranged on the top of test base station 1; One end and mechanical guide rail 6 are slidingly connected; Make mechanical arm pull 7 on mechanical guide rail 6, to be free to slide, the other end is used to settle optical lens 8 and microlens 9, is free to slide on mechanical guide rail 6 through mechanical arm pull 7; And then make optical lens 8 and microlens 9 carry out moving of front and back position, realize optic test to the different angles of specimen 2; Optical lens 8 is placed on the mechanical arm pull 7 with microlens 9; Wherein, Optical lens 8 can be arranged on the mechanical arm pull 7 with microlens 9 versatilely, and free movable on mechanical arm pull 7, optical lens 8 is used for specimen 2 is carried out optic test with microlens 9; As utilize 8 pairs of test zones of optical lens to make public, utilize microlens 9 observation specimen 2 whether to have microcosmic situation such as light leak; Monitor 10 is arranged on the mechanical arm pull 7; Monitor 10 is used for cooperating with optical lens 8 and microlens 9; Accomplishing optic test, obtain the optic test data of each state of the specimen 2 that optical lens 8 and microlens 9 observed through monitor 10 to specimen 2.
Further, the photoelectric integral type test macro that provides of present embodiment can also comprise many Low Voltage Differential Signals (Low Voltage Differential Signaling; Hereinafter to be referred as: LVDS) line 11 and several probes 12, be connected with a plurality of test suites 5 respectively, be used for specimen 2 is surveyed.One end of LVDS line 11 or probe 12 is connected on each test suite 5; The other end is connected with specimen 2; When test suite 5 is connected the entering duty under the control of integrated Control Component 4 and exchange assembly 3; LVDS line 11 or 12 pairs of specimen 2 of probe through being connected with this test suite 5 are surveyed, and realize the test of 5 pairs of specimen 2 of this test suite.
In the present embodiment; Integrated Control Component 4 can be computer host system, and in addition, the photoelectric integral type test macro that present embodiment provides also comprises the external control interface 13 that links to each other with integrated Control Component 4; This external control interface 13 can be specially calculator display organization and computer peripheral equipment system; Like display, mouse and keyboard, be used for cooperating with integrated Control Component 4, accomplish the centralized control of test suite 5 with exchange assembly 3.Operating personnel are through external control interface 13 input operations instruction, and integrated Control Component 4 is converted into concrete steering order with the operational order that receives, and through this steering order exchange assembly 3 controlled, and then realized the control to each test suite 5.
Particularly, the test suite 5 in the photoelectric integral type test macro in the present embodiment can specifically comprise current/voltage test suite 51, signal generating assembly 52, the thermomechanical components of lighting a lamp 53, oscillograph assembly 54 and direct supply assembly 55 etc.Wherein, current/voltage test suite 51 can specifically use the high-accuracy voltage current flow devices, is used for semiconductor is carried out the current with high accuracy voltage tester; Signal generating assembly 52 can specifically use signal generator, is used to produce the AC signal of certain frequency; The thermomechanical components of lighting a lamp 53 can specifically be used the machine of lighting a lamp, and is used to export the drive signal of various signal testing samples 2; Oscillograph assembly 54 can specifically use oscillograph, is used to detect the signal waveform that shows certain bandwidth; Direct supply assembly 55 can specifically use D.C. regulated power supply, is used to provide DC driven.It is to be noted; Test suite 5 in the photoelectric integral type test macro that present embodiment provides can include but not limited to above-mentioned five types testing apparatus or driving arrangement, can also be in this system integrated remaining be used for specimen is carried out other testing apparatuss or the driving arrangement of optic test or electrical testing.
Particularly; The switch of exchange assembly 3 in the present embodiment for constituting by multilayer board and control device; Wherein, the number of plies of multilayer board is decided by the number of test suite 5, and promptly a test suite is corresponding to a layer printed circuit board; If comprise 5 test suites in this test macro; Then exchange assembly 3 and be made up of five layer printed circuit boards and control device, each layer printed circuit board in the multilayer board corresponds respectively to each test suite, respectively each test suite is controlled.Particularly; When test macro comprises 5 test suites; Exchange assembly 3 can be specially 5 port switch; 5 ports that are switch are corresponding with 5 test suites respectively, and each port connects a test suite, and the quantity of the port of switch is also decided by the quantity of test suite in the test macro.Wherein, Exchange assembly 3 inside comprise a plurality of on-off circuits; These on-off circuits are positioned on the multilayer board; Be used for respectively a plurality of test suites 5 being controlled,, so do not disturb mutually between the on-off circuit in each layer printed circuit board because exchange assembly 3 adopts the PCB design of layering.Suppose to comprise 5 test suites in the test macro that present embodiment provides; The port number that then exchanges assembly 3 is 5; Exchange assembly 3 comprises 5 layer printed circuit boards; Be illustrated in figure 3 as the structural representation of the ground floor printed circuit board (PCB) of the exchange assembly among the photoelectric integral type test macro embodiment of the present invention, wherein A1, A2, A3, A4 and A5 represent 5 corresponding ports of five layer printed circuit boards of a side of exchange assembly 3 respectively, 5 corresponding ports of five layer printed circuit boards of the opposite side of B1, B2, B3, B4 and B5 representative exchange assembly 3; Be that A1 is the A port of the ground floor printed circuit board (PCB) of exchange assembly 3; B1 is the B port of the ground floor printed circuit board (PCB) of exchange assembly 3, and A2 is the A port of the second layer printed circuit board (PCB) of exchange assembly 3, and B2 is the B port of the second layer printed circuit board (PCB) of exchange assembly 3.On-off circuit among Fig. 3 comprises 6 switches; One end of one of them switch is connected with A1; The other end is connected on the bus switches; One end of all the other 5 switches also is connected on the bus switches, and the other end then is connected with B1, B2, B3, B4 and B5 respectively, like this can be under the control of integrated Control Component 4; Can optionally connect A1-B1 port, A1-B2 port, A1-B3 port, A1-B4 port and the A1-B5 port of exchange assembly 3, and then realize connection the test suite 5 that is connected with these ports.Similarly; The on-off circuit in the remainder layer printed circuit board (PCB) of exchange assembly 3 and the similar of ground floor printed circuit board (PCB); The port that just switch connected is not A1; And be respectively among the A2-A5; Like Fig. 4-Fig. 7 is respectively the structure of the second layer, the 3rd layer, the 4th layer and the layer 5 printed circuit board (PCB) of the exchange assembly among the photoelectric integral type test macro embodiment of the present invention, and the on-off circuit of each layer printed circuit board through Fig. 3-shown in Figure 4 can be implemented between the port of both sides of exchange assembly 3 and realizes path arbitrarily.
Fig. 8 is the inner structure synoptic diagram of specimen among the photoelectric integral type test macro embodiment of the present invention; Wherein, zone (1) is a pixel region, and zone (2) is the PCB circuit board; Zone (3) is the zone of coated with conductive medium; Zone (4) is the external drive power supply, and a1, a2 and a4 are the source drive solder joint (Pad) of specimen, and b1, b2 and b3 are the gate driving solder joint of specimen.When the photoelectric integral type test macro that utilizes present embodiment to provide carries out actual test to specimen; Can specimen as shown in Figure 8 be positioned on the test base station; Before test; The source driving COF at the 3rd Pad place of specimen removes in elder generation, at the metal wire place coating electrically conductive elargol that exposes, shown in (3) zone among Fig. 8.In conjunction with going up Fig. 2; At first; When carrying out the test in Module stage; Need to utilize light a lamp thermomechanical components 53, direct supply assembly 55 and signal generating assembly 52, the A end that then exchanges the ground floor printed circuit board (PCB) of assembly 3 connects the LVDS line, and the B end of the ground floor printed circuit board (PCB) of exchange assembly 3 connects the D3 thermomechanical components of lighting a lamp; The A end of the second layer printed circuit board (PCB) of exchange assembly 3 connects a signal and drives probe, and the B end of the second layer printed circuit board (PCB) of exchange assembly 3 connects the direct supply assembly; The A end of the second layer printed circuit board (PCB) of exchange assembly 3 connects another signal and drives probe, and the B end of the second layer printed circuit board (PCB) of exchange assembly 3 connects the signal generating assembly.
At first carry out the optic test of specimen 2,, optical lens 8 is moved to the corresponding test zone of A2 through mechanically moving arm pull 7 on mechanical guide rail 6; Under the control of exchange assembly 3, control the 53 pairs of specimen of thermomechanical components of lighting a lamp and carry out driven, show specific image; Use microlens 9 to observe the microcosmic situation; Promptly whether there is light leak etc., makes public through 8 pairs of test zones of exchange assembly 3 control optical lens, in monitor 10, to obtain optical data.Carry out the test of module V-T (voltage transmitance) curve of sample then; Optical lens 8 is moved to the corresponding test zone in zone (3); The driving probe of second layer printed circuit board (PCB) is placed into the zone (3) that applies elargol to be located; Direct supply assembly 55 is delivered to the DC driven signal on the driving probe through the control of exchange assembly 3, realizes the DC driven to black region among Fig. 8.In addition, cooperate optical lens 8 to carry out the test of direct current V-T curve, locate if the driving probe of the 3rd layer printed circuit board is placed into zone (3), start signal generating assembly 52 under the control of exchange assembly 3 then realizes exchanging the test of V-T curve simultaneously.In the test process of routine, often be first measuring optical characteristic, if the result of Gamma curve can not meet the demands; Then need carry out the test of V-T curve; Carry out PCB and go up readjusting of resistance, carry out the test of optical characteristics again, till can meeting the demands.In the present embodiment, whole test process does not need mobile example and the state that changes sample, has guaranteed that not only test result receives interference few, and the carrying out of having accelerated whole process.
After the test of accomplishing the Module stage, remove the backlight part of specimen, specimen is separated into the Cell state, promptly keep the printed circuit board (PCB) in the specimen, with carry out the Cell stage optic test test with the V-T curve.When carrying out the test in Module stage; Need utilize direct supply assembly 55 and signal generating assembly 52; The specimen in Cell stage is positioned on the test base station 1; The A end of the ground floor printed circuit board (PCB) of exchange assembly 3 connects a signal and drives probe, and the B end of the ground floor printed circuit board (PCB) of exchange assembly 3 connects direct supply assembly 55; The A end of the second layer printed circuit board (PCB) of exchange assembly 3 connects another signal and drives probe, and the B end of the second layer printed circuit board (PCB) of exchange assembly 3 connects signal generating assembly 52.Signal is driven probe placement locate,, the DC driven signal is delivered to signal drives on the probe, realize the DC driven of black region among Fig. 8, carry out the test of direct current V-T curve through exchange assembly 3 control direct supply assemblies 55 to zone (3).It is pointed out that if signal is driven probe placement to be located to (3) simultaneously the start signal generating assembly 52, what then carry out is optic test such as response time, visual angle and the test that exchanges the V-T curve.
After the test of accomplishing the Cell stage; The color membrane substrates of specimen is separated with the TFT substrate; And keep the printed circuit board (PCB) of specimen, the residual substance on the flush away TFT substrate (like PI liquid etc.), with electrical testing and the pixel waveforms observation of carrying out the Array stage.The specimen in Array stage is positioned on the test base station 1; The characteristic test of semiconductor electricity needs 3 probes; Then the A of the ground floor printed circuit board (PCB) of switch component 3 end connects a signal driving syringe needle, and the B end of the ground floor printed circuit board (PCB) of switch component 3 connects current/voltage test suite 51; The A end of the second layer printed circuit board (PCB) of switch component 3 connects another signal and drives syringe needle, and the B end of the second layer printed circuit board (PCB) of switch component 3 connects current/voltage test suite 51; The A end of the 3rd layer printed circuit board of switch component 3 connects a signal probe, and the B end of the 3rd layer printed circuit board of switch component 3 connects current/voltage test suite 51; The A end of the 4th layer printed circuit board of switch component 3 connects another signal probe, and the B end of the 4th layer printed circuit board of switch component 3 connects oscillograph assembly 54; The A end of the 4th layer printed circuit board of switch component 3 connects the LVDS signal wire, and the B end of the 4th layer printed circuit board of switch component 3 connects the thermomechanical components 53 of lighting a lamp.At first carry out the test of TFT electrology characteristic, under the help of microlens 9, the signal driving syringe needle that the ground floor printed circuit board (PCB) is connected is placed on the pairing gate driving line in Array tester substrate position; The signal that second layer printed circuit board (PCB) connects drives syringe needle and is placed on the pairing source drive line; The signal probe that the 3rd layer printed circuit board connects is placed on the pixel region of test position.Current/voltage test suite 51 passes to two through switch component 3 with drive signal and drives syringe needle; The grid source electrode is opened; Pixel region has the electric current process; The signal probe that the 3rd layer printed circuit board connects feeds back to current/voltage test suite 51 with the signal that detects through exchange assembly 3, accomplishes test.Carry out obtaining of pixel and other regional waveforms then; Present embodiment is an example with the pixel region waveform only, and the probe that the layer 5 printed circuit board (PCB) is connected is connected on the zone (2) among Fig. 8 driven Array substrate; Under the help of microlens 9; The probe placement that the 4th layer printed circuit board is connected passes to the thermomechanical components 53 of lighting a lamp through exchange assembly 3 with the signal that obtains, the real-time waveform of acquisition pixel region current/voltage on the thermomechanical components 53 of lighting a lamp to the pixel region that will survey waveform.
Because test of TFT electrology characteristic and real-time waveform are surveyed contact is closely arranged on test result; Usually need vertically contrast; But in test process in the past,, seldom can access the contrast of two kinds of test results of same sample owing to equipment and sample managing.In the present embodiment, under the situation that does not need mobile example and the state that changes sample, obtained two test results of same sample, not only realized the feasibility of data contrasts, guaranteed that also test result receives other disturbing factors minimum.
Present embodiment provides a kind of photoelectric integral type test macro; Through various testing apparatuss or driving arrangement are integrated into a plurality of test suites; And be arranged in the photoelectric integral type test macro; Under controlling, realize that to utilizing a system just can accomplish multiple optic test and the electrical testing that same specimen is carried out each stage having solved need be with specimen continuous problem that moves between a plurality of testing apparatuss or driving arrangement in the prior art at integrated Control Component and exchange assembly; The state of specimen and the stability of test environment in the test process have been guaranteed; Also save the quantity of probe when specimen tested, processor, test platform etc., practiced thrift cost, realized the intensification and the high efficiency of equipment; Overcome the defective that to test, to monitor all photoelectric parameters simultaneously in the prior art simultaneously; Can understand the inner link between each photoelectric parameter of same specimen through photoelectric integral type test macro provided by the invention and photoelectric test method; There is the relation of supporting each other between the photoelectric parameter that test obtains, finds the reason that causes that specimen is bad so more easily.
Fig. 9 is the process flow diagram of photoelectric test method embodiment of the present invention; As shown in Figure 9; Present embodiment provides a kind of photoelectric test method, and the method for present embodiment for through the photoelectric integral type test macro that provides in the foregoing description specimen being tested specifically can comprise the steps:
Step 901; Low Voltage Differential Signal line and probe through being movably housed in the optical lens on the mechanical arm pull and microlens in the photoelectric integral type test macro, the thermomechanical components of lighting a lamp, exchange assembly, signal generating assembly, being arranged on the monitor on the said mechanical arm pull and being connected with specimen carry out the test of module stage to said specimen.
This step is to utilize the photoelectric integral type test macro specimen to be carried out the test in Module stage; In conjunction with above-mentioned Fig. 2 and shown in Figure 8; Specimen is positioned on the test base station; Before test, the metal wire place coating electrically conductive elargol that is exposing is removed with the source driving COF at the 3rd Pad place of specimen by elder generation.When carrying out the test in Module stage; Need to utilize light a lamp thermomechanical components 53, direct supply assembly 55 and signal generating assembly 52; The A end that then exchanges the ground floor printed circuit board (PCB) of assembly 3 connects the LVDS line, and the B end of the ground floor printed circuit board (PCB) of exchange assembly 3 connects the D3 thermomechanical components of lighting a lamp; The A end of the second layer printed circuit board (PCB) of exchange assembly 3 connects a signal and drives probe, and the B end of the second layer printed circuit board (PCB) of exchange assembly 3 connects the direct supply assembly; The A end of the second layer printed circuit board (PCB) of exchange assembly 3 connects another signal and drives probe, and the B end of the second layer printed circuit board (PCB) of exchange assembly 3 connects the signal generating assembly.At first carry out the optic test of specimen 2,, optical lens 8 is moved to the corresponding test zone of A2 through mechanically moving arm pull 7 on mechanical guide rail 6; Under the control of exchange assembly 3, control the 53 pairs of specimen of thermomechanical components of lighting a lamp and carry out driven, show specific image; Use microlens 9 to observe the microcosmic situation; Promptly whether there is light leak etc., makes public through 8 pairs of test zones of exchange assembly 3 control optical lens, in monitor 10, to obtain optical data.Carry out the test of the module V-T curve of sample then; Optical lens 8 is moved to the corresponding test zone in zone (3); The driving probe of second layer printed circuit board (PCB) is placed into the zone (3) that applies elargol to be located; Direct supply assembly 55 is delivered to the DC driven signal on the driving probe through the control of exchange assembly 3, realizes the DC driven to black region among Fig. 8.In addition, cooperate optical lens 8 to carry out the test of direct current V-T curve, locate if the driving probe of the 3rd layer printed circuit board is placed into zone (3), start signal generating assembly 52 under the control of exchange assembly 3 then realizes exchanging the test of V-T curve simultaneously.In the test process of routine, often be first measuring optical characteristic, if the result of Gamma curve can not meet the demands; Then need carry out the test of V-T curve; Carry out PCB and go up readjusting of resistance, carry out the test of optical characteristics again, till can meeting the demands.In the present embodiment, whole test process does not need mobile example and the state that changes sample, has guaranteed that not only test result receives interference few, and the carrying out of having accelerated whole process.
Step 902 through the exchange assembly in the said photoelectric integral type test macro, integrated Control Component, direct supply assembly, signal generating assembly and said Low Voltage Differential Signal line and probe, is carried out the test in unit stage to said specimen.
This step is to utilize the photoelectric integral type test macro specimen to be carried out the test in Cell stage; Continue to combine above-mentioned Fig. 2 and shown in Figure 8; After the test of accomplishing the Module stage, remove the backlight part of specimen, specimen is separated into the Cell state; Promptly keep the printed circuit board (PCB) in the specimen, with carry out the Cell stage the test of optic test and V-T curve.When carrying out the test in Module stage; Need utilize direct supply assembly 55 and signal generating assembly 52; The specimen in Cell stage is positioned on the test base station 1; The A end of the ground floor printed circuit board (PCB) of exchange assembly 3 connects a signal and drives probe, and the B end of the ground floor printed circuit board (PCB) of exchange assembly 3 connects direct supply assembly 55; The A end of the second layer printed circuit board (PCB) of exchange assembly 3 connects another signal and drives probe, and the B end of the second layer printed circuit board (PCB) of exchange assembly 3 connects signal generating assembly 52.Signal is driven probe placement locate,, the DC driven signal is delivered to signal drives on the probe, realize the DC driven of black region among Fig. 8, carry out the test of direct current V-T curve through exchange assembly 3 control direct supply assemblies 55 to zone (3).It is pointed out that if signal is driven probe placement to be located to (3) simultaneously the start signal generating assembly 52, what then carry out is optic test such as response time, visual angle and the test that exchanges the V-T curve.
Step 903 through the said exchange assembly in the said photoelectric integral type test macro, current/voltage test suite, oscillograph assembly, the thermomechanical components of lighting a lamp and said Low Voltage Differential Signal line and probe, is carried out the test in array stage to said specimen.
This step is to utilize the photoelectric integral type test macro specimen to be carried out the test in Array stage; Continue to combine above-mentioned Fig. 2 and shown in Figure 8; After the test of accomplishing the Cell stage, the color membrane substrates of specimen is separated with the TFT substrate, and the printed circuit board (PCB) of reservation specimen; Residual substance on the flush away TFT substrate is observed with the electrical testing and the pixel waveforms that carry out the Array stage.The specimen in Array stage is positioned on the test base station 1; The characteristic test of semiconductor electricity needs 3 probes; Then the A of the ground floor printed circuit board (PCB) of switch component 3 end connects a signal driving syringe needle, and the B end of the ground floor printed circuit board (PCB) of switch component 3 connects current/voltage test suite 51; The A end of the second layer printed circuit board (PCB) of switch component 3 connects another signal and drives syringe needle, and the B end of the second layer printed circuit board (PCB) of switch component 3 connects current/voltage test suite 51; The A end of the 3rd layer printed circuit board of switch component 3 connects a signal probe, and the B end of the 3rd layer printed circuit board of switch component 3 connects current/voltage test suite 51; The A end of the 4th layer printed circuit board of switch component 3 connects another signal probe, and the B end of the 4th layer printed circuit board of switch component 3 connects oscillograph assembly 54; The A end of the 4th layer printed circuit board of switch component 3 connects the LVDS signal wire, and the B end of the 4th layer printed circuit board of switch component 3 connects the thermomechanical components 53 of lighting a lamp.At first carry out the test of TFT electrology characteristic, under the help of microlens 9, the signal driving syringe needle that the ground floor printed circuit board (PCB) is connected is placed on the pairing gate driving line in Array tester substrate position; The signal that second layer printed circuit board (PCB) connects drives syringe needle and is placed on the pairing source drive line; The signal probe that the 3rd layer printed circuit board connects is placed on the pixel region of test position.Current/voltage test suite 51 passes to two through switch component 3 with drive signal and drives syringe needle; The grid source electrode is opened; Pixel region has the electric current process; The signal probe that the 3rd layer printed circuit board connects feeds back to current/voltage test suite 51 with the signal that detects through exchange assembly 3, accomplishes test.Carry out obtaining of pixel and other regional waveforms then; Present embodiment is an example with the pixel region waveform only, and the probe that the layer 5 printed circuit board (PCB) is connected is connected on the zone (2) among Fig. 8 driven Array substrate; Under the help of microlens 9; The probe placement that the 4th layer printed circuit board is connected passes to the thermomechanical components 53 of lighting a lamp through exchange assembly 3 with the signal that obtains, the real-time waveform of acquisition pixel region current/voltage on the thermomechanical components 53 of lighting a lamp to the pixel region that will survey waveform.
Present embodiment provides a kind of photoelectric test method; Realization utilizes a system just can accomplish multiple optic test and the electrical testing that same specimen is carried out each stage; Having solved need be with specimen continuous problem that moves between a plurality of testing apparatuss or driving arrangement in the prior art; The state of specimen and the stability of test environment in the test process have been guaranteed; Also save the quantity of probe when specimen tested, processor, test platform etc., practiced thrift cost, realized the intensification and the high efficiency of equipment; Overcome the defective that to test, to monitor all photoelectric parameters simultaneously in the prior art simultaneously; Can understand the inner link between each photoelectric parameter of same specimen through photoelectric integral type test macro provided by the invention and photoelectric test method; There is the relation of supporting each other between the photoelectric parameter that test obtains, finds the reason that causes that specimen is bad so more easily.
What should explain at last is: above embodiment is only in order to explaining technical scheme of the present invention, but not to its restriction; Although with reference to previous embodiment the present invention has been carried out detailed explanation, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that previous embodiment is put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these are revised or replacement, do not make the spirit and the scope of the essence disengaging embodiment of the invention technical scheme of relevant art scheme.
Claims (6)
1. photoelectric integral type test macro; It is characterized in that; The test base station that comprises support test specimens; In said test base station set inside exchange assembly, integrated Control Component and a plurality of test suite are arranged, each said test suite links to each other with said integrated Control Component with said exchange assembly, and said integrated Control Component is used for the said exchange assembly of centralized control and said a plurality of test suite;
The switch of said exchange assembly for constituting by multilayer board and control device; The number of plies of said printed circuit board (PCB) is by the number decision of said test suite; Each layer printed circuit board in the said multilayer board corresponds respectively to each said test suite, respectively each said test suite is controlled, and said exchange component internal comprises a plurality of on-off circuits; Lay respectively on the said multilayer board, be used for respectively said a plurality of test suites being controlled.
2. system according to claim 1 is characterized in that, also comprises:
Be arranged on the lip-deep mechanical guide rail of said test base station;
The mechanical arm pull that is slidingly connected with said mechanical guide rail;
Be movably housed in optical lens and microlens on the said mechanical arm pull, be used for said specimen is carried out optic test;
Be arranged on the monitor on the said mechanical arm pull, be used for cooperating the completion optic test with said optical lens and microlens.
3. system according to claim 2 is characterized in that, also comprises many Low Voltage Differential Signal lines and several probes, is connected with said a plurality of test suites respectively, is used for said specimen is surveyed.
4. system according to claim 1 is characterized in that, also comprises the external control interface that links to each other with said integrated Control Component, is used for cooperating with said integrated Control Component the control of accomplishing said a plurality of test suites and said exchange assembly.
5. system according to claim 4 is characterized in that, said integrated Control Component is a computer host system, and said external control interface is calculator display organization and computer peripheral equipment system.
6. system according to claim 1 is characterized in that, said a plurality of test suites comprise current/voltage test suite, signal generating assembly, the thermomechanical components of lighting a lamp, oscillograph assembly and direct supply assembly.
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| CN104516132B (en) * | 2014-11-21 | 2018-02-06 | 京东方科技集团股份有限公司 | A kind of measurement jig |
| US9880407B2 (en) | 2014-11-21 | 2018-01-30 | Boe Technology Group Co., Ltd. | Test fixture for electrical function test of product to be tested |
| CN110763988A (en) * | 2019-10-14 | 2020-02-07 | 国营芜湖机械厂 | Automatic detection device of airborne exchange assembly |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5432461A (en) * | 1991-06-28 | 1995-07-11 | Photon Dynamics, Inc. | Method of testing active matrix liquid crystal display substrates |
| CN101454677A (en) * | 2006-05-31 | 2009-06-10 | 应用材料股份有限公司 | Mini-prober for tft-lcd testing |
| CN101505914A (en) * | 2006-08-31 | 2009-08-12 | 武藏工业株式会社 | Deformable gantry type working apparatus |
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2009
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5432461A (en) * | 1991-06-28 | 1995-07-11 | Photon Dynamics, Inc. | Method of testing active matrix liquid crystal display substrates |
| CN101454677A (en) * | 2006-05-31 | 2009-06-10 | 应用材料股份有限公司 | Mini-prober for tft-lcd testing |
| CN101505914A (en) * | 2006-08-31 | 2009-08-12 | 武藏工业株式会社 | Deformable gantry type working apparatus |
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Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY Effective date: 20150616 Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150616 |
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Effective date of registration: 20150616 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE Technology Group Co., Ltd. Patentee after: Beijing BOE Photoelectricity Science & Technology Co., Ltd. Address before: 100176 Beijing economic and Technological Development Zone, West Central Road, No. 8 Patentee before: Beijing BOE Photoelectricity Science & Technology Co., Ltd. |