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Publication numberCN101923290 A
Publication typeApplication
Application numberCN 201010186587
Publication date22 Dec 2010
Filing date12 Aug 2005
Priority date13 Aug 2004
Also published asCN1746775A, CN1746775B, CN101923290B, EP1628161A2, EP1628161A3, EP1628161B1, US7304715, US7804575, US9188880, US9268242, US20060033892, US20060033898, US20100321650, US20120113402, US20160048085
Publication number201010186587.1, CN 101923290 A, CN 101923290A, CN 201010186587, CN-A-101923290, CN101923290 A, CN101923290A, CN201010186587, CN201010186587.1
InventorsAJ范德内特, ALHJ范米尔, BLP小恩德马克, B门奇奇科夫, CGM德莫, ER鲁普斯特拉, FE德荣格, FJJ詹斯森, H博姆, JA夸伊达克斯, JHW贾科布斯, JJLH维斯帕, JJSM梅坦斯, JJ奥坦斯, K戈尔曼, MCM维哈根, ME鲁曼-休斯肯, MFP斯米特斯, MJEH米特詹斯, MK斯塔温加, M里伊彭, N坦卡特, PAJ廷内曼斯, R莫尔曼, S尼蒂亚诺夫, TPM卡迪
ApplicantAsml荷兰有限公司
Export CitationBiBTeX, EndNote, RefMan
External Links: SIPO, Espacenet
Lithographic apparatus and device manufacturing method
CN 101923290 A
Abstract
A lithographic apparatus comprising: an illumination system configured to condition a radiation beam; a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; a substrate table constructed to hold a substrate; a projection system configured to project the patterned radiation beam onto a target portion of the substrate; a liquid supply system configured to at least partly fill a space between a final element of said projection system and said substrate with liquid; a seal member arranged substantially to contain said liquid within said space between said final element of the projection system and said substrate; and elements to control and/or compensate for evaporation of immersion liquid from said substrate.
Claims(12)  translated from Chinese
  1. 一种光刻设备,包括:支撑构图器件的支架,该构图器件能够将它截面中的图案赋予辐射束以形成构图的辐射束:支撑衬底的衬底台;把已构图的辐射束投影到衬底的目标部分的投影系统;用液体至少部分地填充在所述投影系统的最后元件和所述衬底之间的间隙的液体供应系统;在投影系统的所述最后元件和所述衬底之间的所述间隙中基本包含所述液体的密封构件;和衬底台移位系统,沿着相对于所述密封构件的预定路径移动所述衬底台,由此在所述衬底的表面上移动所述目标部分;和根据位置、速度、加速度和所述衬底台相对于所述密封构件的预定路径、局部衬底温度、和局部衬底台温度的至少一个来加热所述衬底的至少一部分的衬底加热器。 A lithographic apparatus, comprising: a support bracket patterning device, the patterning device capable of imparting a pattern in its cross-section to form a patterned radiation beam radiation beam: a substrate table supporting a substrate; the patterned radiation beam onto a the projection system target portion of the substrate; at least partially filled between the final element of the projection system and the substrate liquid supply system with a liquid gap; in the final element of the projection system and the substrate The gap between the fluid seal substantially containing member; and a substrate table displacement system, along a predetermined path relative to said seal member to move the substrate table, the substrate, thereby moving the target surface portion; and according to the position, velocity, and acceleration of the substrate table with respect to the predetermined path of said seal member, the local substrate temperature, the local substrate table temperature and at least one of heating said substrate at least a portion of the substrate of the bottom heater.
  2. 2. 一种光刻设备,包括:支撑构图器件的支架,该构图器件能够将它截面中的图案赋予辐射束以形成构图的辐射束;支撑衬底的衬底台:把已构图的辐射束投影到衬底的目标部分的投影系统;利用液体至少部分地填充在所述投影系统的最后元件和所述衬底之间的间隙的液体供应系统;在投影系统的所述最后元件和所述衬底之间的间隙基本包含所述液体的密封构件; 控制从所述密封构件经过缝隙逃出的液体量的气体密封,该缝隙通过所述密封构件的边界限定在一侧面上和通过所述衬底限定在第二侧面上;所述气体密封包括加压气体出口,通过它加压气体被供应到所述缝隙内的区域,和真空排气进口,通过它由所述加压气体出口供应的气体从所述缝隙内的区域去除,所述加压气体出口和真空排气进口分别连接到嵌入到所述述密封构件中的加压气体管和真空排气管,其中所述密封构件进一步包括密封构件温度稳定器。 2. A lithographic apparatus, comprising: a support bracket patterning device, the patterning device capable of imparting a pattern in its cross-section to form a patterned radiation beam radiation beam; a substrate table supporting a substrate: the patterned radiation beam projected onto a target portion of the substrate, the projection system; and at least partially filled with a liquid between the final element of the projection system and the substrate gap liquid supply system; the final element of the projection system and the the gap between the substrate substantially comprises the liquid seal member; and a control amount of the gas through the liquid seal gap to escape from the seal member through the slit of the seal member defining the boundary on one side and by the defined on the second side of the substrate; said gas seal comprising a pressurized gas outlet, through which pressurized gas is supplied to the region, and a vacuum exhaust inlet in said gap, through which the gas supplied by the pressurized outlet The gas from the inner region of the removal gap, said pressurized gas outlet and a vacuum exhaust inlet connected to said sealing member is embedded in said pressurized gas pipe and a vacuum exhaust pipe, wherein the sealing member further It includes a seal member temperature stabilizer.
  3. 3. 一种光刻设备包括: 调节辐射束的照明系统;支撑构图器件的支架,该构图器件能够将它截面中的图案赋予辐射束以形成构图的辐射束;支撑衬底的衬底台;把已构图的辐射束投影到衬底的目标部分的投影系统:利用液体至少部分地填充在所述投影系统的最后元件和所述衬底之间的间隙的液体供应系统;在投影系统的所述最后元件和所述衬底之间的间隙中基本包含所述液体的密封构件;用于控制流过嵌入在所述衬底台中的沟道网络的热交换液体的温度和流速的衬底台热交换液体控制器。 3. A lithographic apparatus comprising: adjusting the lighting system of the radiation beam; patterning device support bracket, the patterning device capable of imparting a pattern in its cross-section beam of radiation to form a patterned radiation beam; a substrate table supporting a substrate; The patterned radiation beam onto a target portion of the substrate, the projection system of: at least partially filled with a liquid in the gap between the liquid supply system of the final element of the projection system and said substrate; a projection system in the said gap between the final element and the substrate substantially comprises the liquid seal member; means for controlling flow through the substrate table is embedded in a heat exchange network channel substrate table temperature and flow rate of the liquid heat exchange fluid controller.
  4. 4. 一种光刻设备包括:支撑构图器件的支架,该构图器件能够将它截面中的图案赋予辐射束以形成构图的辐射束;支撑衬底的衬底台;把已构图的辐射束投影到衬底的目标部分的投影系统; 所述衬底台包括至少一个集成的局部温度控制系统,该系统包括: 与加热器耦合的温度传感器,所述加热器被构成为当由所述温度传感器测量的局部温度低于预定参考值时产生热量,当所述局部温度超过所述预定参考值时停止产生热量。 4. A lithographic apparatus comprising: a support bracket patterning device, the patterning device capable of imparting a pattern in its cross-section to form a patterned radiation beam radiation beam; a substrate table supporting a substrate; the patterned radiation beam onto a projection system target portion of the substrate; the substrate table comprises at least one integrated local temperature control system, the system comprising: a temperature sensor coupled with a heater, the heater is configured to the temperature sensor when the generate heat below a predetermined reference value of the local temperature measurement, stop generating heat when the local temperature exceeds the predetermined reference value.
  5. 5. 一种光刻设备包括:支撑构图器件的支架,该构图器件能够将它截面中的图案赋予辐射束以形成构图的辐射束;支撑衬底的衬底台;把已构图的辐射束投影到衬底的目标部分的投影系统;至少一个温度传感器,用于测量所述衬底、所述衬底台和衬底固定器的至少一个的至少一部分的温度;和投影系统控制器,其根据由所述至少一个温度传感器测量的所述温度来调节所述已构图的辐射束的属性。 A lithographic apparatus comprising: a support bracket patterning device, the patterning device capable of imparting a pattern in its cross-section to form a patterned radiation beam radiation beam; a substrate table supporting a substrate; the patterned radiation beam onto the projection system of the target portion of the substrate; at least one temperature sensor for measuring the substrate, the substrate table and substrate holder temperature of at least a portion of at least one; and a projection system controller, based The temperature from the at least one temperature sensor to adjust the properties of the patterned radiation beam.
  6. 6. 一种光刻设备,包括:支撑构图器件的支架,该构图器件能够将它截面中的图案赋予辐射束以形成构图的辐射束:支撑衬底的衬底台;把已构图的辐射束投影到衬底的目标部分的投影系统;用液体至少部分地填充在所述投影系统的最后元件和所述衬底之间的间隙的液体供应系统;在投影系统的所述最后元件和所述衬底之间的所述间隙中基本包含所述液体的密封构件;和衬底台移位系统,沿着相对于所述密封构件的预定路径移动所述衬底台,由此在所述衬底的表面上移动所述目标部分;和微波源和微波容器器件,一起被设置成为所述衬底表面上的液体供热。 A lithographic apparatus, comprising: a support bracket patterning device, the patterning device capable of imparting a pattern in its cross-section to form a patterned radiation beam radiation beam: a substrate table supporting a substrate; the patterned radiation beam projected onto a target portion of the substrate, the projection system; and filled between the final element of the projection system and the substrate gap liquid supply system with a liquid, at least in part; the last element of the projection system and the The gap between the substrates of the liquid containing substantially seal member; and a substrate table displacement system, with respect to the sealing member along a predetermined path of movement of the substrate table, whereby said liner moving the target surface of the bottom portion; and a microwave source and a microwave container device, it is provided together with a liquid heating on the substrate surface.
  7. 7. 一种器件制造方法,包括:提供支撑构图器件的支架,该构图器件能够将它截面中的图案赋予辐射束以形成构图的辐射束;提供支撑衬底的衬底台;提供把已构图的辐射束投影到衬底的目标部分的投影系统;提供利用液体至少部分地填充在所述投影系统的最后元件和所述衬底之间的间隙的液体供应系统;提供在投影系统的所述最后元件和所述衬底之间的间隙中基本包含所述液体的密封构件;和提供衬底台移位系统,沿着相对于所述密封构件的预定路径移动所述衬底台,由此在所述衬底的表面上移动所述目标部分;和根据依照位置、速度、加速度和所述衬底台相对于所述密封构件的预定路径、局部衬底温度和局部衬底台温度的至少一个来加热所述衬底的至少一部分。 A device manufacturing method, comprising: providing a patterning device support bracket, the patterning device capable of imparting a pattern in its cross-section to form a patterned radiation beam radiation beam; a substrate table supporting a substrate provided; patterned to provide The radiation beam is projected onto a target portion of the substrate, the projection system; providing a liquid at least partially filling the gap between the final element of the projection system and the substrate a liquid supply system; providing said projection system the gap between the final element and the substrate substantially comprises the liquid seal member; and providing a substrate table displacement system, along a predetermined path relative to said seal member to move the substrate table, whereby on the surface of said substrate moving said target portion; and according to in accordance with position, velocity, and acceleration of the substrate table with respect to at least a predetermined path of said seal member, the local substrate temperature and the local substrate table temperature heating at least a portion of one of said substrate.
  8. 8. 一种器件制造方法,包括:提供支撑构图器件的支架,该构图器件能够将它截面中的图案赋予辐射束以形成构图的辐射束;提供支撑衬底的衬底台;提供把已构图的辐射束投影到衬底的目标部分的投影系统;提供利用液体至少部分地填充在所述投影系统的最后元件和所述衬底之间的间隙的液体供应系统;提供在投影系统的所述最后元件和所述衬底之间的间隙中基本包含所述液体的密封构件;提供控制从所述密封构件经过缝隙逃出的液体量的气体密封,该缝隙通过所述密封构件的边界限定一个侧面上在和通过所述衬底限定在第二侧面上;提供气体密封,其包括气体进口,通过它供应气体到所述缝隙内的区域,和真空排气出口,通过它由所述气体进口供应的气体从所述缝隙内的区域去除,所述气体进口和真空排气出口分别连接到嵌入到所述密封构件中的气体进口管和真空排气出口管。 8. A device manufacturing method, comprising: providing a patterning device support bracket, the patterning device capable of imparting a pattern in its cross-section to form a patterned radiation beam radiation beam; a substrate table supporting a substrate provided; patterned to provide The radiation beam is projected onto a target portion of the substrate, the projection system; providing a liquid at least partially filling the gap between the final element of the projection system and the substrate a liquid supply system; providing said projection system the gap between the final element and the substrate substantially comprises the liquid seal member; providing a control fluid to escape through the gap seal from the amount of gas sealing member, through the slit of the seal member defining the boundary of a on the side of the substrate is defined in and through on the second side; providing a gas seal, which includes gas imports, the supply of gas to the region within the gap, and the vacuum exhaust outlet through it, through which the gas imported from the supply of gas from the region of the gap in the removal of the gas inlet and outlet are connected to the vacuum exhaust embedded in the seal member of the gas inlet tube and a vacuum exhaust outlet pipe. 稳定所述密封构件的温度。 Stabilizing the temperature of the sealing member.
  9. 9. 一种器件制造方法,包括:提供支撑构图器件的支架,该构图器件能够将它截面中的图案赋予辐射束以形成构图的辐射束;提供支撑衬底的衬底台;提供把已构图的辐射束投影到衬底的目标部分的投影系统;提供利用液体至少部分地填充在所述投影系统的最后元件和所述衬底之间的间隙的液体供应系统:提供在投影系统的所述最后元件和所述衬底之间的间隙中基本包含所述液体的密封构件;提供嵌入在所述衬底台中的沟道网络,和控制流过所述沟道网络的热交换流体的温度和流速。 A device manufacturing method, comprising: providing a patterning device support bracket, the patterning device capable of imparting a pattern in its cross-section to form a patterned radiation beam radiation beam; providing a substrate table supporting a substrate; providing the patterned The radiation beam is projected onto a target portion of the substrate, the projection system; providing a liquid at least partially filling the gap between the final element of the projection system and the substrate of the liquid supply system: providing said projection system the gap between the final element and the substrate substantially comprises the liquid seal member; embedded in the substrate to provide a channel network station, and controlling the temperature of the flowing heat exchange fluid channel network and flow rate.
  10. 10. 一种器件制造方法,包括:提供支撑构图器件的支架,该构图器件能够将它截面中的图案赋予辐射束以形成构图的辐射束;提供支撑衬底的衬底台;提供把已构图的辐射束投影到衬底的目标部分的投影系统;其中所述衬底台包括至少一个集成的局部温度控制系统,其包括:与加热器耦合的温度传感器,所述加热器被设置为当由所述温度传感器测量的局部温度低于预定参考值时产生热量,当所述局部温度超过所述预定参考值时停止产生热量。 10. A device manufacturing method, comprising: providing a patterning device support bracket, the patterning device capable of imparting a pattern in its cross-section to form a patterned radiation beam radiation beam; providing a substrate table supporting a substrate; providing the patterned The radiation beam is projected onto a target portion of the substrate, the projection system; and wherein the substrate table comprises at least one integrated local temperature control system, comprising: a temperature sensor coupled with a heater, the heater is set as the generate heat when the local temperature sensor measurement is below a predetermined reference value, stops generating heat when the local temperature exceeds the predetermined reference value.
  11. 11. 一种器件制造方法,包括:提供支撑构图器件的支架,该构图器件能够将它截面中的图案赋予辐射束以形成构图的辐射束;提供支撑衬底的衬底台;提供把已构图的辐射束投影到衬底的目标部分的投影系统;提供至少一个温度传感器,用于测量所述衬底、所述衬底台和衬底固定器的至少一个的至少一部分的温度;和根据由所述至少一个温度传感器测量的所述温度来调节所述已构图的辐射束的属性。 11. A device manufacturing method, comprising: providing a patterning device support bracket, the patterning device capable of imparting a pattern in its cross-section to form a patterned radiation beam radiation beam; providing a substrate table supporting a substrate; providing the patterned The radiation beam onto a target portion of the substrate of the projection system; providing at least one temperature sensor for measuring the substrate, the substrate table and substrate holder temperature of at least a portion of at least one of; and according to the wherein at least one of the temperature sensor measurements to adjust the properties of the patterned radiation beam.
  12. 12. —种器件制造方法,包括;提供支撑构图器件的支架,该构图器件能够将它截面中的图案赋予辐射束以形成构图的辐射束;提供支撑衬底的衬底台;提供把已构图的辐射束投影到衬底的目标部分的投影系统;提供利用液体至少部分地填充在所述投影系统的最后元件和所述衬底之间的间隙的液体供应系统;提供在投影系统的所述最后元件和所述衬底之间的间隙中基本包含所述液体的密封构件;和提供衬底台移位系统,沿着相对于所述密封构件的预定路径移动所述衬底台,由此在所述衬底的表面上移动所述目标部分;和使用微波源和微波容器器件以给在所述衬底的表面上的液体供热。 12. - Species device manufacturing method, comprising; providing a support bracket patterning device, the patterning device capable of imparting a pattern in its cross-section to form a patterned radiation beam radiation beam; providing a substrate table supporting a substrate; providing the patterned The radiation beam is projected onto a target portion of the substrate, the projection system; providing a liquid at least partially filling the gap between the final element of the projection system and the substrate a liquid supply system; providing said projection system the gap between the final element and the substrate substantially comprises the liquid seal member; and providing a substrate table displacement system, along a predetermined path relative to said seal member to move the substrate table, whereby on the surface of the substrate moving the target portion; and the use of microwave sources and microwave devices in the container to the surface of the substrate in a liquid heating.
Description  translated from Chinese

光刻设备和器件制造方法 The lithographic apparatus and device manufacturing method

技术领域 Technical Field

[0001] 本发明涉及光刻设备和用于制造器件的方法。 [0001] The present invention relates to a lithographic apparatus and a method for manufacturing a device. 背景技术 Background

[0002] 光刻设备是把希望的图案应用到衬底上,通常是在衬底的目标部分上的机器。 [0002] A lithographic apparatus is the desired pattern onto a substrate, usually onto a target portion of the substrate in the machine. 光刻设备可以在例如集成电路(IC)的制造中使用。 The lithographic apparatus can be used, for example, an integrated circuit (IC) manufacture. 在那种情况下,可以使用构图器件,其选择性地称作掩模或标线,以产生要在IC的单独层上形成的电路图案。 In that case, you can use the patterning device, which selectively referred to as a mask or reticle to generate a circuit pattern on a separate layer IC to be formed. 这个图案可以转移到衬底(例如硅晶片)上的目标部分(例如,包括一个或几个管芯的部分)。 This pattern can be transferred to a substrate (e.g. a silicon wafer) on a target portion (e.g., comprising one or several die parts). 图案的转移典型地是通过成像到设置在衬底上的辐射敏感材料(抗蚀剂)层。 Transferring the pattern is typically via imaging onto a radiation-sensitive material disposed on the substrate (resist). 通常,单个衬底会包含成功构图的邻接目标部分的电路。 In general, a single substrate will contain a target portion of the circuit adjacent patterned success. 已知的光刻设备包括所谓的分档器(St印per),其中每个目标部分通过同时曝光整个图案到目标部分而被辐照,和所谓的扫描器,其中通过在给定方向(扫描方向)上的辐射束扫描图案来照射每个目标部分,并同时地扫描平行或反平行这个方向的衬底。 Known lithographic apparatus include so-called steppers (St printed per), in which each target portion by simultaneously exposing an entire pattern onto a target portion is irradiated, and so-called scanners, which it adopted in a given direction (scanning patterning the radiation beam scanning direction) on each target portion is irradiated, and simultaneously the scanning direction parallel to anti-parallel or substrate. 也可能通过在衬底上印下图案,把图案从构图器件转移到衬底上。 May also be printed on the substrate by lower pattern, the pattern is transferred from the patterning device to the substrate.

[0003] 建议使在光刻投影设备中的衬底浸渍到具有相对高的折射率的液体中,例如水, 以填充在投影系统最后元件和衬底之间的间隔。 [0003] suggests the substrate in a lithographic projection apparatus is immersed in a liquid having a relatively high refractive index, such as water, to fill in between the final element of the projection system and the substrate interval. 由于曝光辐照在液体中具有更短波长,这一点的目的是使得更小特征成像。 Since the exposure radiation having a shorter wavelength in the liquid, the purpose of this feature is to make a smaller image. (液体的效果也可以认为增加系统的有效NA和也增加聚焦深度。)已经提出其他的浸渍液体,包括具有悬浮在其中的固体颗粒(例如石英)的水。 (Effect of the liquid may also be considered to increase the effective NA of the system and also increasing the depth of focus.) Other immersion liquids have been proposed, including having suspended therein solid particles (e.g. quartz) in water.

[0004] 然而,把衬底或衬底与衬底台浸渍到液体容器中(见例如US4509852,这里引入其整个内容作为参考),意为存在在扫描曝光期间必须被加速的大量液体。 [0004] However, the substrate or substrate and substrate table dipped into the liquid container (see for example US4509852, the entire contents of which are incorporated herein by reference), meaning that there is a scanning exposure must be accelerated during the bulk liquid. 这需要附加的或更加有力的发动机,和液体中的紊流可以导致不希望和不可预料的影响。 This requires additional or more powerful engines, and turbulence in the liquid may lead to undesirable and unpredictable effects.

[0005] 其中一个建议的解决方法是对于液体供应系统,仅在衬底的局部区域上和在投影系统的最后元件和衬底之间使用液体限定系统提供液体(衬底通常具有比投影系统的最后元件更大的表面区域)。 [0005] One of the suggested solutions for the liquid supply system, and only limited system using a liquid between the final element of the projection system and the substrate to provide liquid on a localized area of the substrate (substrate generally has a ratio of the projection system The last element of the larger surface area). 已经提出的用于它的设置的一种方式在W099/49504中公开了, 这里引入其整个内容作为参考。 It is used in a manner that has been proposed is disclosed in W099 / 49504, the entire contents of which are incorporated herein by reference. 如图2和3中所述,通过至少一个进口IN把液体供应到衬底上,优选沿着衬底相对于最后元件移动的方向,并在已经在投影系统下通过之后,通过至少一个出口OUT去除。 2 and described in FIG. 3, IN liquid supplied through at least one inlet onto the substrate, preferably along the direction of the substrate relative to the final element to move, and after having passed under the projection system, through at least one outlet OUT removed. 即,由于在X方向上的元件下扫描衬底,液体在元件的+X侧供应并在-X侧取走。 That is, since the scanning of the substrate in the element in the X direction, the + X side of the liquid supply unit and remove the -X side. 图2概略地示出了液体经过进口IN供应并且通过出口OUT在元件的另一侧取出的设置,该出口OUT连接到低压源。 Figure 2 schematically shows a supply of liquid through an inlet IN and OUT taken out through the outlet provided at the other side of the element, the outlet OUT is connected to a low pressure source. 在图2的图解中,液体沿着衬底相对于最后元件的移动方向供应,虽然这并不需要是这种情况。 In the illustration of Figure 2, with respect to the direction of movement of the liquid supply last element along the substrate, although this need not be the case. 位于在最后元件周围的多个方向和数量的进口和出口都是可能的,一个例子是在图3中说明的,在最后元件的周围以规则图案提供四组在任一侧具有出口的进口。 Located around the final element in a plurality of directions and the number of import and export are possible, one example is illustrated in Figure 3, around the final element in a regular pattern provided on either side of the four groups of imports having an outlet.

[0006] 提出的另一解决方案是为液体供应系统提供密封构件,该密封构件沿着投影系统的最后元件和衬底台之间间隔的至少一部分界限延伸。 [0006] Another proposed solution is to provide a seal member for the liquid supply system, at least a portion of the seal member along the boundaries between the final element of the projection system and the substrate table interval extends 在图4a和4b中说明了这样的解决方法。 It illustrates such a solution in Figures 4a and 4b. 封装构件相对于在XY平面中的投影系统基本上是固定的,虽然在Z方向(在光学轴的方向)有一些相对移动。 Encapsulating member relative to the projection system in the XY plane is substantially fixed, although the Z direction (in the direction of the optical axis) has some relative movement. 密封形成在密封构件和衬底表面之间。 Seal is formed between the sealing member and the substrate surface. 优选地,密封可以是无接触密封,如气体密封。 Preferably, the seal may be a contactless seal such as a gas seal. 在欧洲专利申请No. 03252955. 4中公开了这样的具有气体密封的系统,这里引入其整个内容作为参考。 In European Patent Application No. 03252955. 4 discloses such a system with a gas seal, the entire contents of which are incorporated herein by reference.

[0007] 图4b示出了用于密封构件12的示例设置,设置该密封构件12以在投影透镜PL下的局部区域25中包含浸渍液体。 [0007] Figure 4b illustrates an exemplary set 12 of the sealing member, the sealing member 12 provided to a localized area at 25 of the projection lens PL contains immersion liquid. 密封构件12具有设置成通过滤网GZ从局部区域25萃取液体的萃取器EX。 The sealing member 12 has arranged through the filter GZ extractor local area from 25 to extract liquid of EX. 该萃取器EX可以提取液体和气体或仅仅提取液体。 The extractor EX may extract liquid and gaseous or liquid extract only. 凹陷RE呈放射状地提供在萃取器EX的外部,气体密封27呈放射状地提供在凹陷RE的外部。 RE recess provided radially outside the extractor EX and a gas seal 27 is provided radially outside the recess RE. 气体密封27形成用于干燥衬底W表面和/或减少从密封构件12透出的液体的量的一股气体JE。 Gas seal 27 is formed for drying the surface of the substrate W and / or reduce the amount of JE from the seal member 12 revealed a surge of liquid gas.

[0008] 在欧州专利申请No. 03257072. 3中公开了孪生或双台浸渍光刻装置的构思。 [0008] In European Patent Application No. 03257072. 3 discloses conceived twin or dual stage immersion lithography apparatus. 这种设备具有用于支撑衬底的两个台。 This apparatus has two tables for supporting a substrate. 利用一个台在第一位置处在没有浸渍液体的情况下进行水准测量,利用一个台在存在浸渍液体的第二位置处进行曝光。 Utilizing a first position at a station level measurements performed without immersion liquid, the exposure station utilizing a second position in the presence of immersion liquid. 可选择地,该装置仅具有一个台。 Alternatively, the device has only one table.

[0009] 虽然提供了改良的解决方法,但是已经发现浸渍液体的引入在衬底上产生的图像中导致了误差,包括在一层和下一层之间的对准误差(即覆盖错误)、散焦和偏差。 [0009] While providing an improved solution, but it has been found in the image introduction of immersion liquid on a substrate generated led to the error, including alignment errors between the layer and the next layer (ie coverage error) defocus and bias.

发明内容 DISCLOSURE

[0010] 希望提供一种减小由于浸渍液体产生的光刻误差的系统。 [0010] Since the system is desirable to provide a method of reducing the liquid immersion lithography errors arising.

[0011] 根据本发明的一个方面,提供一种光刻设备包括:设置以调节辐射束的照明系统; 支撑构图器件的支持物,构图器件能够将在其截面上的图案赋予辐射束以形成已构图的辐射束;构造以支撑衬底的衬底台;设置以把已构图的辐射束投影到衬底的目标部分上的投影系统;设置以利用液体至少部分地填充所述投影系统和所述衬底之间间隙的液体供应系统;设置以在投影系统的所述最后元件和所述衬底之间的所述间隙内基本地包含所述液体的密封构件;和设置以控制由所述液体供应系统提供的液体蒸发净速率的液体蒸发控制 [0011] In accordance with one aspect of the present invention, there is provided a lithographic apparatus comprising: a setting condition a radiation beam to an illumination system; supporting patterning device support, the patterning device capable of imparting the radiation beam in a pattern to form the cross-section has on its patterned radiation beam; a substrate table configured to support a substrate; a projection system provided with the patterned radiation beam onto a target portion of the substrate; a liquid provided to at least partially fill the projection system and the the gap between the liquid supply system of the substrate; disposed to the inside between the final element of the projection system and said substrate comprises the substantially liquid gap sealing member; and arranged to be controlled by the liquid liquid supply system provides a net rate of evaporation of liquid evaporation control

O O

[0012] 根据本发明的另一方面,提供一种光刻设备,包括:设置以调节辐射束的照明系统;支撑构图器件的支持物,构图器件能够将在其截面上的图案赋予辐射束以形成已构图的辐射束;构造以支撑衬底的衬底台;设置以把已构图的辐射束投影到衬底的目标部分上的投影系统;设置以利用液体至少部分地填充所述投影系统的最后元件和所述衬底之间间隙的液体供应系统;设置以在投影系统的所述最后元件和所述衬底之间的所述间隙内基本地包含所述液体的密封构件;衬底台扫描系统,设置以相对于所述密封构件沿着预定扫描路径移动所述衬底台,由此在所述衬底的表面上扫描所述目标部分;和设置以依照位置、速度、加速度和所述衬底台相对于所述密封构件的扫描路径、局部衬底温度和局部衬底台温度的至少一个加热所述衬底的至少一部分的衬底加热器。 [0012] According to another aspect of the present invention, there is provided a lithographic apparatus, comprising: providing an illumination system to condition a radiation beam; supporting patterning device support, the patterning device capable of imparting the radiation beam with a pattern on its cross-section forming a patterned radiation beam; a substrate table configured to support a substrate; setting to the patterned radiation beam onto a target portion of a substrate a projection system; arranged to at least partially filled with a liquid of the projection system Finally, the gap between the substrate member and a liquid supply system; disposed to the inside between the final element of the projection system and said substrate comprises the substantially liquid gap sealing member; substrate table scanning system provided with respect to the sealing member to move said substrate table along a predetermined scanning path, whereby the surface of the substrate on scanning the target portion; and provided in accordance with the position, velocity, acceleration, and the said substrate table at least one substrate heater heating at least a portion of the substrate with respect to the scanning path of the seal member, the local substrate temperature and the local substrate table temperature.

[0013] 根据本发明的另一方面,提供一种光刻设备包括:设置以调节辐射束的照明系统; 支撑构图器件的支持物,构图器件能够将在其截面上的图案赋予辐射束以形成已构图的辐射束;构造以支撑衬底的衬底台;设置以把已构图的辐射束投影到衬底的目标部分上的投影系统;设置以利用液体至少部分地填充所述投影系统的最后元件和所述衬底之间间隙的液体供应系统;设置以在投影系统的所述最后元件和所述衬底之间的所述间隙内基本地包含所述液体的密封构件;设置以控制从所述密封构件经过缝隙逃出的液体的量的气体密封,该缝隙限定在所述密封构件的边界的一侧面上和在所述衬底的第二侧面上,所述气体密封包括气体出口,通过它气体供应到所述缝隙内的区,和真空排气进口,通过它将由所述气体出口供应的气体从所述缝隙内的区去除,所述气体出口和真空排气进口分别连接到嵌入到所述密封构件中的气体出口管和真空排气进口管,其中所述密封构件进一步包括密封构件温度稳定器。 [0013] According to another aspect of the present invention, there is provided a lithographic apparatus comprising: an illumination system arranged to adjust the beam of radiation; a support to form a support patterning device, the patterning device capable of imparting the radiation beam in a pattern on its cross-section a patterned radiation beam; a substrate table configured to support a substrate; a projection system provided with the patterned radiation beam onto a target portion of the substrate; a liquid provided to at least partially fill the final projection system the gap between the substrate member and a liquid supply system; disposed to the inside between the final element of the projection system and said substrate comprises the substantially liquid gap sealing member; provided to control from said seal member through a gap amount of gas escaped liquid seal, the slit defining the boundary on one side of the sealing member and the second side of said substrate, said gas seal comprising a gas outlet, through which the gas supply to the region within the gap, and the vacuum exhaust inlet by the gas export supplies of gas removed from the slot within the region through which the gas outlet and the vacuum exhaust inlet connected to the embedded the sealing member to the gas outlet pipe and a vacuum exhaust inlet pipe, wherein the sealing member further comprises a seal member temperature stabilizer.

[0014] 根据本发明的另一方面,提供一种光刻设备包括:设置以调节辐射束的照明系统; 支撑构图器件的支持物,构图器件能够将在其截面上的图案赋予辐射束以形成已构图的辐射束;构造以支撑衬底的衬底台;设置以把已构图的辐射束投影到衬底的目标部分上的投影系统;设置以利用液体至少部分地填充所述投影系统的最后元件和所述衬底之间间隙的液体供应系统;设置以在投影系统的所述最后元件和所述衬底之间的所述间隙内基本地包含所述液体的密封构件;用于控制设置成流过嵌入在所述衬底台中的沟道网络的热交换液体的温度和的流速的衬底台热交换液体控制器。 [0014] According to another aspect of the present invention, there is provided a lithographic apparatus comprising: an illumination system arranged to adjust the beam of radiation; a support to form a support patterning device, the patterning device capable of imparting the radiation beam in a pattern on its cross-section a patterned radiation beam; a substrate table configured to support a substrate; a projection system provided with the patterned radiation beam onto a target portion of the substrate; a liquid provided to at least partially fill the final projection system the gap between the substrate member and a liquid supply system; disposed to the inside between the final element of the projection system and said substrate comprises the substantially liquid gap sealing member; means for control settings a switching temperature of the liquid flowing through the embedded and the substrate table heat exchange fluid flow rate in the heat of the substrate table controller channel network.

[0015] 根据本发明的另一方面,提供一种光刻设备包括:设置以调节辐射束的照明系统; 支撑构图器件的支持物,构图器件能够将在其截面上的图案赋予辐射束以形成已构图的辐射束;构造以支撑衬底的衬底台;设置以把已构图的辐射束投影到衬底的目标部分上的投影系统,其中所述衬底台包括至少一个集成的局部温度控制系统,该控制系统包括:与加热器耦合的温度传感器,设置所述加热器以当通过所述温度传感器测量的局部温度低于预定参考值时产生热量,当所述局部温度升高到所述预定参考值以上时停止产生热量。 [0015] According to another aspect of the present invention, there is provided a lithographic apparatus comprising: an illumination system arranged to adjust the beam of radiation; a support to form a support patterning device, the patterning device capable of imparting the radiation beam in a pattern on its cross-section at least one integrated local temperature control system is provided with a projection of the patterned radiation beam onto a target portion of the substrate, wherein the substrate table comprises; patterned radiation beam; a substrate table configured to support a substrate system, the control system comprising: a temperature sensor coupled with the heater, set the heater to generate heat below a predetermined reference value when the local temperature by the temperature sensor, and when the local temperature to the Stop when the above predetermined reference value generating heat.

[0016] 根据本发明的另一方面,提供一种光刻设备包括:设置以调节辐射束的照明系统; 支撑构图器件的支持物,构图器件能够将在其截面上的图案赋予辐射束以形成已构图的辐射束;构造以支撑衬底的衬底台;设置以把已构图的辐射束投影到衬底的目标部分上的投影系统;设置以测量所述衬底、所述衬底台和衬底固定器的至少一个的至少一部分的温度的至少一个温度传感器;和投影系统控制器,设置以响应由所述至少一个温度传感器测量的所述温度来调节所述已构图辐射束的属性。 [0016] According to another aspect of the present invention, there is provided a lithographic apparatus comprising: an illumination system arranged to adjust the beam of radiation; a support to form a support patterning device, the patterning device capable of imparting the radiation beam in a pattern on its cross-section patterned radiation beam; a substrate configured to support the substrate table; set to the patterned radiation beam onto a target portion of the substrate projection system on; setting to measure the substrate, the substrate table and at least a portion of at least one of the temperature of the substrate holder at least one temperature sensor; and a projection system controller, in response to the temperature provided by said at least one temperature sensor to adjust the properties of the patterned radiation beam.

[0017] 根据本发明的另一方面,提供一种光刻设备,包括:设置以调节辐射束的照明系统;支撑构图器件的支持物,构图器件能够将在其截面上的图案赋予辐射束以形成已构图的辐射束;构造以支撑衬底的衬底台;设置以把已构图的辐射束投影到衬底的目标部分上的投影系统;设置以利用液体至少部分地填充所述投影系统的最后元件和所述衬底之间间隙的液体供应系统;设置以在投影系统的所述最后元件和所述衬底之间的所述间隙内基本地包含所述液体的密封构件;衬底台转移系统,设置以沿着相对于所述密封构件的预定路径移动所述衬底,由此在所述衬底的表面上移动所述目标部分;和微波源和微波容器器件(microwavecontainmentdevice),一起设置以向在所述衬底表面上的液体供热。 [0017] According to another aspect of the present invention, there is provided a lithographic apparatus, comprising: providing an illumination system to condition a radiation beam; supporting patterning device support, the patterning device capable of imparting the radiation beam with a pattern on its cross-section forming a patterned radiation beam; a substrate table configured to support a substrate; setting to the patterned radiation beam onto a target portion of a substrate a projection system; arranged to at least partially filled with a liquid of the projection system Finally, the gap between the substrate member and a liquid supply system; disposed to the inside between the final element of the projection system and said substrate comprises the substantially liquid gap sealing member; substrate table transfer system provided with respect to the sealing member along a predetermined path of movement of the substrate, thereby moving said target portion on a surface of the substrate; and a microwave source and a microwave container device (microwavecontainmentdevice), together with arranged to heat the liquid on the substrate surface.

[0018] 根据本发明的另一方面,提供一种器件的制造方法,包括:提供设置以调节辐射束的照明系统;提供支撑构图器件的支持物,该构图器件能够将在其截面上的图案赋予辐射束以形成已构图的辐射束;提供构造以支撑衬底的衬底台;提供设置以把已构图的辐射束投影到衬底的目标部分上的投影系统;提供设置以利用液体至少部分地填充所述投影系统的最后元件和所述衬底之间间隙的液体供应系统;提供设置以在投影系统的所述最后元件和所述衬底之间的所述间隙内基本包含所述液体的密封构件;和控制由所述液体供应系统提供的液体蒸发的净速率。 [0018] According to another aspect, there is provided a device manufacturing method of the present invention, comprising: providing an illumination system arranged to adjust the radiation beam; provide support patterning device support, the patterning device can be a pattern in its cross-section arranged to provide at least part of a liquid; imparting the radiation beam to form a patterned radiation beam; providing a substrate table configured to support a substrate; providing settings to the patterned radiation beam onto a target portion of the substrate on the projection system filling the gap between the final element of the projection system and the substrate liquid supply system; arranged to provide said gap between said final element of the projection system and the substrate substantially comprises the liquid and fluid control provided by the liquid supply system net evaporation rate; the seal member.

[0019] 根据本发明的另一方面,提供一种器件的制造方法,包括:提供设置以调节辐射束的照明系统;提供支撑构图器件的支持物,该构图器件能够将在其截面上的图案赋予辐射束以形成已构图的辐射束;提供构造以支撑衬底的衬底台;提供设置以把已构图的辐射束投影到衬底的目标部分上的投影系统;提供设置以利用液体至少部分地填充所述投影系统的最后元件和所述衬底之间间隙的液体供应系统;提供设置以在投影系统的所述最后元件和所述衬底之间的所述间隙内基本包含所述液体的密封构件;提供衬底台移位系统,设置以相对于所述密封构件沿着预定扫描路径移动所述衬底台,由此在所述衬底的表面上移动所述目标部分;和依照位置、速度、加速度和所述衬底台相对于所述密封构件的预定路径、 局部衬底温度和局部衬底台温度的至少一个来加热所述衬底的一部分。 [0019] According to another aspect, there is provided a device manufacturing method of the present invention, comprising: providing an illumination system arranged to adjust the radiation beam; provide support patterning device support, the patterning device can be a pattern in its cross-section arranged to provide at least part of a liquid; imparting the radiation beam to form a patterned radiation beam; providing a substrate table configured to support a substrate; providing settings to the patterned radiation beam onto a target portion of the substrate on the projection system filling the gap between the final element of the projection system and the substrate liquid supply system; arranged to provide said gap between said final element of the projection system and the substrate substantially comprises the liquid a sealing member; providing a substrate table displacement system, arranged to seal with respect to the path of the moving member along a predetermined scanning the substrate table, thereby moving said target portion on a surface of the substrate; and in accordance with the position, velocity, and acceleration of the substrate table with respect to the predetermined path of said seal member, the local substrate temperature and the local substrate table temperature of at least one part of said heated substrate.

[0020] 根据本发明的另一方面,提供一种器件的制造方法,包括:提供设置以调节辐射束的照明系统;提供支撑构图器件的支持物,该构图器件能够将在其截面上的图案赋予辐射束以形成已构图的辐射束;提供构造以支撑衬底的衬底台;提供设置以把已构图的辐射束投影到衬底的目标部分上的投影系统;提供设置以利用液体至少部分地填充所述投影系统的最后元件和所述衬底之间间隙的液体供应系统;提供设置以在投影系统的所述最后元件和所述衬底之间的所述间隙内基本包含所述液体的密封构件;提供设置以控制从所述密封构件经过缝隙逃出的液体的量的气体密封,该缝隙限定在所述密封构件的边界的一侧和在所述衬底的第二测面上,提供气体密封,其包括气体进口,通过它气体供应到所述缝隙内的区,和真空排气出口,通过它由所述气体进口供应的气体从所述缝隙内的区去除,所述气体进口和所述真空排气出口分别连接到嵌入到所述密封构件中的气体进口管和真空排气出口管,并稳定所述密封构件的温度。 [0020] According to another aspect, there is provided a device manufacturing method of the present invention, comprising: providing an illumination system arranged to adjust the radiation beam; provide support patterning device support, the patterning device can be a pattern in its cross-section arranged to provide at least part of a liquid; imparting the radiation beam to form a patterned radiation beam; providing a substrate table configured to support a substrate; providing settings to the patterned radiation beam onto a target portion of the substrate on the projection system filling the gap between the final element of the projection system and the substrate liquid supply system; arranged to provide said gap between said final element of the projection system and the substrate substantially comprises the liquid a sealing member; providing settings to control the amount of the gap after the escape of the liquid from the gas seal sealing member, the slit is defined on one side of the boundary of the sealing member and the second surface of said substrate measured providing a gas seal comprising a gas inlet, through which gas is supplied to the region within the gap, and a vacuum exhaust outlet, removed from the area within the gap through which the gas supplied from said gas inlet, the gas said vacuum exhaust inlet and outlet respectively connected to said sealing member is embedded in the gas inlet pipe and a vacuum exhaust outlet pipe, and stabilize the temperature of the sealing member.

[0021] 根据本发明的另一方面,提供一种光刻器件的制造方法,包括:提供设置以调节辐射束的照明系统;提供支撑构图器件的支持物,该构图器件能够将在其截面上的图案赋予辐射束以形成已构图的辐射束;提供构造以支撑衬底的衬底台;提供设置以把已构图的辐射束投影到衬底的目标部分上的投影系统;提供设置以利用液体至少部分地填充所述投影系统的最后元件和所述衬底之间间隙的液体供应系统;提供设置以在投影系统的所述最后元件和所述衬底之间的所述间隙内基本包含所述液体的密封构件;提供嵌入在所述衬底台中的沟道网络,并控制设置成流过所属沟道网络的热交换液体的温度和热交换液体的流速。 [0021] According to another aspect of the present invention, there is provided a method of manufacturing a lithographic device, comprising: providing an illumination system arranged to adjust the radiation beam; provide support patterning device support, the patterning device can be, in its cross section pattern imparted to the radiation beam to form a patterned radiation beam; providing a substrate configured to support a substrate table; providing settings to the patterned radiation beam onto a target portion of the substrate on the projection system; set to provide a liquid between the final element of at least partially filling the projection system and the substrate gap liquid supply system; arranged to provide said gap between said final element of the projection system and the substrate substantially containing the said liquid seal member; providing embedded in the substrate table channel network, and control settings to flow through the channel belongs to a network of heat exchange fluid temperature and the flow rate of heat exchange fluid.

[0022] 根据本发明的另一方面,提供一种器件的制造方法,包括:提供设置以调节辐射束的照明系统;提供支撑构图器件的支持物,该构图器件能够将在其截面上的图案赋予辐射束以形成已构图的辐射束;提供构造以支撑衬底的衬底台;提供设置以把已构图的辐射束投影到衬底的目标部分上的投影系统;其中所述衬底台包括至少一个集成的局部温度控制系统,该控制系统包括:与加热器耦合的温度传感器,设置所述加热器以当如通过所述温度传感器所测量的局部温度降到低于预定参考值时产生热量,和当所述局部温度升高到所述预定参考值以上时停止产生热量。 [0022] According to another aspect, there is provided a device manufacturing method of the present invention, comprising: providing an illumination system arranged to adjust the radiation beam; provide support patterning device support, the patterning device can be a pattern in its cross-section imparting the radiation beam to form a patterned radiation beam; providing a substrate table configured to support a substrate; providing settings to the patterned radiation beam onto a target portion of the substrate on the projection system; wherein the substrate table comprises coupled to the heater to generate heat and the temperature sensor, provided by the heater when the local temperature as measured by said temperature sensor falls below a predetermined reference value: at least one integrated local temperature control system, the control system comprising , and when the local temperature rises to the predetermined stops generating heat than the reference value.

[0023] 根据本发明的另一方面,提供一种器件的制造方法,包括:提供设置以调节辐射束的照明系统;提供支撑构图器件的支持物,该构图器件能够利将在其截面上的图案赋予辐射束以形成已构图的辐射束;提供构造以支撑衬底的衬底台;提供设置以把已构图的辐射束投影到衬底的目标部分上的投影系统;提供至少一个温度传感器,该温度传感器测量所述衬底、所述衬底台和衬底固定器的至少一个的至少一部分的温度;和响应由所述至少一个温度传感器测量的所述温度来调节所述已构图辐射的属性。 [0023] According to another aspect of the present invention, there is provided a method of manufacturing a device, comprising: providing a radiation beam arranged to adjust an illumination system; provide support patterning device support, the patterning device can be benefits in its cross section a pattern imparted to the radiation beam to form a patterned radiation beam; providing a substrate configured to support the substrate table; set to provide the patterned radiation beam onto a target portion of a substrate a projection system on; providing at least one temperature sensor, The sensor measures the temperature of the substrate, a temperature of at least a portion of at least one of the substrate table and the substrate holder; and responsive to said temperature from said at least one temperature sensor to regulate the patterned radiation property. [0024] 根据本发明的另一方面,提供一种器件的制造方法,包括:提供设置以调节辐射束的照明系统;提供支撑构图器件的支持物,该构图器件能够将在其截面上的图案赋予辐射束以形成已构图的辐射束;提供构造以支撑衬底的衬底台;提供设置以把已构图的辐射束投影到衬底的目标部分上的投影系统;提供设置以利用液体至少部分地填充所述投影系统的最后元件和所述衬底之间间隙的液体供应系统;提供设置以在投影系统的所述最后元件和所述衬底之间的所述间隙内基本包含所述液体的密封构件;提供衬底台转移系统,设置以沿着相对于所述密封构件的预定路径移动所述衬底,由此在所述衬底的表面上移动所述目标部分;并使用微波源和微波容器器件为在所述衬底表面上的液体供热。 [0024] According to another aspect, there is provided a device manufacturing method of the present invention, comprising: providing an illumination system arranged to adjust the radiation beam; provide support patterning device support, the patterning device can be a pattern in its cross-section arranged to provide at least part of a liquid; imparting the radiation beam to form a patterned radiation beam; providing a substrate table configured to support a substrate; providing settings to the patterned radiation beam onto a target portion of the substrate on the projection system filling the gap between the final element of the projection system and the substrate liquid supply system; arranged to provide said gap between said final element of the projection system and the substrate substantially comprises the liquid a sealing member; providing a substrate table transfer system is provided with respect to the sealing member along a predetermined path of movement of the substrate, thereby moving said target portion on a surface of the substrate; and the use of a microwave source and microwave heating container device is a liquid on the substrate surface.

附图说明 Brief Description

[0025] 下面将参考所附示意图仅通过示例的方式描述本发明的实施例,图中相应的参考符号代表相应的部分,其中: [0025] The following description with reference to the accompanying schematic view of an embodiment of the present invention only by way of example, with reference to the drawing symbols representing the respective corresponding parts, wherein:

[0026] 图1描述了根据本发明实施例的光刻设备; [0026] Figure 1 depicts a lithographic apparatus according to an embodiment of the present invention;

[0027] 图2和3描述了在现有技术的光刻投影设备中使用的液体供应系统; [0027] Figures 2 and 3 describe the liquid supply system used in a prior art lithographic projection apparatus;

[0028] 图4a和4b描述了根据另一个现有技术的光刻投影设备的液体供应系统; [0028] Figures 4a and 4b depicts a liquid supply system of another prior art lithographic projection apparatus;

[0029] 图5描述了根据本发明实施例的密封构件,示出了与加压气体湿度控制器的相互作应,浸渍液体温度控制器和加压气体温度控制器; [0029] FIG. 5 depicts the seal member according to an embodiment of the present invention, showing the interaction of pressurized gas humidity controller should, immersion liquid temperature controller and a pressurized gas temperature controller;

[0030] 图6描述了根据本发明实施例的密封构件,气体簇射出口和气体簇射出口控制器; [0030] Figure 6 depicts the exit port and the gas sealing member according to an embodiment of the present invention, a gas cluster shower outlet controller;

[0031] 图7描述了根据本发明实施例的包括局部加热器和衬底温度控制器的系统的衬底台的顶视图; [0031] FIG. 7 depicts a substrate table includes a system of local heater and the substrate temperature controller of the embodiment of the present invention, a top view;

[0032] 图8描述了图7的衬底台的侧视图,也示出了多个温度传感器,衬底台路径限定器件和位于密封构件内的衬底加热器; [0032] Figure 8 depicts a side view of the substrate table of Figure 7 also shows a plurality of temperature sensors, a substrate table path-defining components and the sealing member is located within the substrate heater;

[0033] 图9描述了衬底台的顶视图,该顶视图示出了设置衬底加热器的几何尺寸以在衬底台的下方区域比上方区域消耗更多的能量; [0033] Figure 9 illustrates a top view of the substrate table, the top view shows the geometry of the substrate heater settings in the area below the substrate table to consume more energy than the upper area;

[0034] 图10描述了根据本发明实施例的独立可控制的衬底加热器阵列; [0034] FIG. 10 illustrates the array of individually controllable substrate heater according to an embodiment of the present invention;

[0035] 图11描述了图10结构的侧视图,也示出了加热器阵列控制器和预定算法输入器件的相互作用; [0035] Figure 11 depicts a side view of the structure of FIG. 10, also shows the interaction heater array controller and a predetermined algorithm input device;

[0036] 图12描述了根据本发明实施例的密封构件的局部视图,示出了用于真空排气进口和真空排气管的热隔离套管和密封构件加热器; [0036] FIG. 12 illustrates a partial view of a seal member in accordance with this invention, showing a thermal isolation sleeve and the seal member heater for vacuum exhaust inlet and vacuum exhaust pipe;

[0037] 图13描述了根据本发明实施例在密封构件和密封构件温度稳定器之间的相互作用; [0037] Figure 13 depicts the interaction between the seal member and the seal member temperature stabilizer] According to embodiments of the present invention;

[0038] 图14描述了根据本发明实施例的包括液体运输沟道网络和液体供应系统的密封构件; [0038] Figure 14 depicts the seal member comprises a liquid transport channel network and a liquid supply system in accordance with an embodiment of the present invention;

[0039] 图15描述了密封构件和包括液体运输沟网络和独立可控制加热器阵列的衬底台,该触立可控制加热器由衬底温度控制器控制,该衬底温度控制器包括衬底台热交换液体控制器和衬底加热器控制器; [0039] Figure 15 depicts the seal member and includes a liquid transport channel network and independently controllable heater array substrate table, the contact established by the substrate temperature can be controlled heater controller, the substrate temperature controller comprising a substrate Bottom station heat exchange fluid controller and the substrate heater controller;

[0040] 图16描述了根据本发明实施例的具有沟道网络和循环沟槽的衬底台; [0040] Figure 16 depicts a substrate table and circular grooves having a channel network in accordance with an embodiment of the present invention;

[0041] 图17和18描述了根据图16的具有循环沟槽的衬底台,由根据本发明实施例的密封环密封; [0041] FIG. 17 and 18 depicts a substrate table with a circular groove 16 of the seal ring according to an embodiment of the present invention, the sealing;

[0042] 图19描述了示出了根据本发明实施例的衬底台中和密封构件中温度传感器位置的光刻设备; [0042] FIG. 19 illustrates shows a substrate table and embodiments of the present invention, the sealing member in the position of the temperature sensor lithographic apparatus;

[0043] 图20描述了根据本发明实施例在示出了微观温度控制系统设置的衬底区域中的衬底台的放大图; [0043] Figure 20 depicts an embodiment of the invention is shown in microscopic areas of the substrate temperature control system is provided in the enlarged view of the substrate table;

[0044] 图21描述了根据本发明实施例的投影系统控制器和热感应形变计算器; [0044] Figure 21 depicts a projection system controller and thermal sensing deformation calculator according to an embodiment of the present invention;

[0045] 图22描述了用于加热衬底表面上的浸渍液体的微波源和微波容器罩(microwave containment cage); [0045] FIG. 22 describes a method for heating the immersion liquid on the substrate surface of the microwave source and microwave containment cage (microwave containment cage);

[0046] 图23描述了电阻加热带和有关的电流的设置; [0046] FIG. 23 illustrates the resistance heating tape and related current settings;

[0047] 图24描述了用作用于局部加热器系统的局部温度传感器的单电阻带; [0047] Figure 24 depicts a single resistor is used as a local heater system with local temperature sensor;

[0048] 图25描述了用于衬底台WT的感应加热的设置; [0048] Figure 25 depicts the substrate table WT arranged for induction heating;

[0049] 图26描述了用于利用控制了的湿度级别来产生气流的设备; [0049] FIG. 26 is described for the use of controlled humidity levels to generate airflow equipment;

[0050] 图27描述了用于控制气流温度的热交换器; [0050] FIG. 27 describes a heat exchanger is used to control the temperature of the gas stream;

[0051] 图28描述了用于能够使得加湿器盒的操作稳定的通风系统; [0051] FIG. 28 illustrates a stable operating ventilation system for being able to make the humidifier cartridge;

具体实施方式 DETAILED DESCRIPTION

[0052] 图1简要描述了根据本发明的一实施例的光刻设备。 [0052] Figure 1 schematically depicts a lithographic apparatus an embodiment of the present invention. 该设备包括: The apparatus comprising:

[0053] 设置的照明系统(照明装置)IL,以调节辐射束B (例如UV辐射或DUV辐射)。 [0053] provided illumination system (illumination device) IL, to condition a radiation beam B (e.g. UV radiation or DUV radiation).

[0054] 设置的支撑结构(例如掩模台)MT,以支持构图器件(例如掩模)MA并连接到根据特定参数精确定位构图器件的第一定位器PM。 [0054] provided a support structure (e.g. mask table) MT, in order to support the patterning device (e.g. mask) MA and connected to pinpoint patterning device in accordance with certain parameters of the first positioner PM.

[0055] 设置的衬底台(例如晶片台)WT,以支撑衬底(例如涂敷抗蚀剂的晶片)W并连接到根据特定参数精确定位衬底的第二定位器PW ;和 [0055] provided a substrate table (e.g. a wafer table) WT, for supporting a substrate (e.g. a resist-coated wafer) W and connected to accurately position the substrate in a second positioner PW accordance with certain parameters; and

[0056] 设置的投影系统(例如折射投影透镜系统)PS,以把通过构图器件MA赋予到辐射束B的图案投影到衬底W的目标部分C (例如包括一个或多个管芯)上。 [0056] The projection system settings (e.g., a refractive projection lens system) PS, by patterning device MA in order to impart a pattern to the radiation beam B is projected on the substrate W target portion C (e.g. comprising one or more dies).

[0057] 照明系统可以包括多种光学元件,例如折射、反射、磁性、电磁、静电或其他类型的光学元件,或任何它们的组合,用于导引、成形或控制辐射。 [0057] The illumination system may include various optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic or other types of optical components, or any combination thereof, for directing, shaping, or controlling radiation.

[0058] 支撑结构支撑构图器件,即承受构图器件的重量。 [0058] The patterning device support structure supports, i.e. bears the weight of the composition of the device. 它以依赖于构图器件的方向、光刻设备的设计和其他条件的方式支撑构图器件,其它条件例如是否构图器件被固定在真空环境中。 It depends on the direction of the patterning device, the design of the lithographic apparatus and the way other conditions patterning device support, other conditions such as whether the patterning device is secured in a vacuum environment. 该支撑结构可以使用机械、真空、静电或其他夹紧技术以固定构图器件。 The support structure can use mechanical, vacuum, electrostatic or other clamping techniques to secure the patterning device. 该支撑结构可以是框架或台,例如,如需要其可以是固定的或可移动的。 The support structure may be a frame or a table, for example, as required, which may be fixed or movable. 支撑结构可以保证构图器件位于例如关于投影系统的所希望的位置。 The support structure may ensure that the patterning device is located on the projection system such as a desired position. 这里术语“标线”或“掩模”的任何使用可以认为是与更通用的术语“构图器件”同义的。 The term "reticle" or "mask" any use can be considered with the more general term "patterning device" synonymous.

[0059] 这里使用的术语“构图器件”应该广义地解释为指能够用于将它的截面中的图案赋予到辐射束的任何器件,例如以在衬底的目标区域中产生图案。 [0059] As used herein, the term "patterning device" should be broadly interpreted as referring to its cross-section can be used in any device to impart a pattern in a radiation beam, such as to produce a pattern in the target area of the substrate. 应该注意到,例如如果图案包括相移特性或所谓的辅助特性,那么赋予到辐射束的图案可以不正好与衬底目标区域中的图案对应。 It should be noted, for example if the pattern includes phase-shifting features or so called assist features, the pattern imparted to the radiation beam may not exactly correspond to the target area of the substrate in a pattern. 通常,赋予到辐射束的图案将对应于在目标部分中产生的器件中的特殊功能层,如集成电路。 Typically, they impart a pattern to the radiation beam will correspond to a particular functional layer in the device produced in the target portion, such as an integrated circuit.

[0060] 构图器件可以是透射的或反射的。 [0060] The patterning device may be transmissive or reflective. 构图器件的例子包括掩模、可编程镜面阵列和可编程LCD面板。 Examples of patterning devices include masks, programmable mirror arrays, and programmable LCD panels. 掩模在光刻中是众所周知的,包括例如双元、交互相移和衰减相移和多种 Mask lithography is well known and include, for example dual, cross each other, and attenuated phase-shift shift and more

11混合掩模型的掩模类型。 11 hybrid mask types cover model. 可编程镜面阵列的例子采用小镜面矩阵排列,每个镜面可以单独地倾斜以反射在不同方向上的入射辐射束。 Examples of a programmable mirror array employs a matrix arrangement of small mirrors, each mirror can be individually tilted in different directions to reflect incident radiation beam. 倾斜镜面在被镜面阵列反射的辐射束中赋予了图案。 Tilt the mirror gives the pattern of the reflected radiation beam mirror array.

[0061] 这里使用的术语“投影系统”应该广义地解释为包含任何类型的投影系统,包括如适合于所使用的曝光辐射或适合于用于其他因素如浸渍液体的使用或者真空的使用的折射、反射、折反射、磁、电磁和静电的光学系统,或者他们的任何组合。 [0061] The term used herein "projection system" should be broadly construed to include any type of projection system, including as appropriate for the exposure radiation being used, or adapted for other factors such as the use of immersion liquid or the use of a vacuum refraction , reflection, catadioptric, magnetic, electromagnetic and electrostatic optical systems, or any combination of them. 这里的术语“投影透镜”的任何使用可以认为与更加通用的术语“投影系统”同义。 Any use herein of the term "projection lens" herein may be considered with the more general term "projection system" synonymous.

[0062] 如这里所述,设备是透射型(例如采用透射掩模)。 [0062] As described herein, the device is of a transmissive type (e.g. employing a transmissive mask). 可选择地,设备可以是反射型(如采用如上所述的可编程镜面阵列,或采用反射掩模)。 Alternatively, the apparatus may be of a reflective type (e.g. a programmable mirror arrays as described above, or employing a reflective mask).

[0063] 该光刻设备可以是具有两个(双台)或多个衬底台(和/或两个或更多掩模台) 的类型。 [0063] The lithographic apparatus may be having two (dual stage) or more substrate tables (and / or two or more mask tables). 在这样的“多台”机器中,当使用一个或多个其它的台用于曝光时,附加的台可以平行地使用,或者可以在一个或多个台上进行准备性步骤。 In such "multiple stage" machines, when one or more other tables are being used for exposure, the additional tables can be used in parallel, or preparatory steps can be carried out in one or more tables. 可以通过衬底台WT(有时称作镜面块)直接固定衬底W且可以通过衬底固定器(有时称作节盘或卡盘)固定衬底W,其依次由衬底台WT固定。 By the substrate table WT (sometimes referred to as a mirror block) is fixed directly to the substrate W and the substrate holder can (sometimes referred to as segment disk or cartridge) fixing the substrate W, the substrate table WT which in turn is fixed.

[0064] 参考图1,照明装置IL从辐射源SO接收辐射束。 [0064] Referring to Figure 1, illuminator IL receives a radiation beam from a radiation source SO. 例如当源是准分子激光时,该源和光刻设备可以是分开的机构。 For example when the source is an excimer laser light, the source and the lithographic apparatus may be separate institutions. 在这种情况下,不认为源形成了光刻设备的一部分,辐射束借助于分束系统BD从源SO传送到照明装置IL,该分束系统包括例如,适当的导引镜和/或束扩展器。 In this case, the source is not considered a part of the formed lithographic apparatus, the radiation beam by means of a system BD beam transmitted from the source SO to the illumination system IL, the beam system including, for example, a suitable guide mirrors and / or beam extender. 在其他情况下源可以是光刻设备的集成部分,例如当源是汞灯时。 In other cases the source may be an integral part of the lithographic apparatus, for example when the source is a mercury lamp. 源SO和照明装置IL,如果需要的的话还有分束系统BD,一起可以称作辐射系统。 The source SO and the illumination device IL, if desired, then there are splitting system BD, together may be referred to as a radiation system.

[0065] 照明装置IL可以包括用于调节辐射束的角强度分布的调节器AD。 [0065] IL may comprise illumination means for adjusting the angular intensity distribution of the radiation beam adjuster AD. 一般,至少可以调整在照明装置射的光孔面中的强度分布的外部和/或内部辐射范围(通常分别指6-外部和6-内部)。 Generally, at least you can adjust the external and / or internal radiation range emitted intensity illumination device pupil plane distribution (generally refer 6- external and 6 internal). 另外,照明装置IL可以包含多种其他元件,如积分器IN和聚光器CO。 In addition, illuminator IL may comprise various other components, such as an integrator IN and a condenser CO. 该照明装置可以用作调节辐射束以在其截面具有所希望的均勻度和强度分布。 The illumination device may be used to condition a radiation beam having a cross-section at its desired uniformity and intensity distribution.

[0066] 辐射束B入射到构图器件(例如掩模MA)上,其固定在支撑结构(例如掩模台MT) 上,并通过构图器件构图。 [0066] The radiation beam B is incident on the patterning device (eg, mask MA), which is fixed on the support structure (eg mask table MT) on, and by patterning device patterning. 穿过掩模MA后,辐射束B经过投影系统PS,其把辐射束聚焦到衬底W的目标部分C上。 After passing through the mask MA, the radiation beam B through the projection system PS, which focuses the beam onto the target portion C of the substrate W on. 利用第二定位器PW和定位传感器IF (例如干涉仪器件、线性编码器或电容传感器),可以精确地移动衬底台WT,例如在辐射束B的路径中定位不同的目标部分C。 Using the second positioner PW and position sensor IF (e.g. an interferometric device, linear encoder or capacitive sensor), the substrate table can be moved accurately WT, e.g., to position different target portions in the path of the radiation beam B C. 类似地,例如在从掩模库机械修复后,或在扫描期间,可以使用第一定位器PM和另一定位传感器(其没有在图1中明确地描述)以精确地使掩模MA对于辐射束B的路径定位。 Similarly, for example, after a mechanical repair from a mask library, or during a scan, you can use the first positioner PM and another location sensor (which is not explicitly depicted in Fig. 1) to precisely the mask MA for radiation Location B of the beam path. 通常,掩模台MT的移动可以利用长冲程组件(粗糙定位)和短冲程组件(精确定位)来实现,其形成第一定位器PM的一部分。 Typically, movement of the mask table MT may use long-stroke module (coarse positioning) and a short-stroke module (fine positioning) is achieved, the part of the first positioner PM formed. 类似地,衬底台WT的移动可以使用长冲程组件和短冲程组件实现,其形成第二定位器PW的一部分。 Similarly, movement of the substrate table WT can be used long-stroke module and a short-stroke component implementation, part of the second positioner PW formed. 在分档器(与扫描器相对)的情况下,掩模台MT可以仅连接到短冲程激励器,或可以被固定。 In stepper under (opposed to a scanner) case, the mask table MT may be connected to a short stroke actuator only, or may be fixed. 掩模MA和衬底W可以利用掩模对准标记M1、M2和衬底对准标记P1、P2对准。 Mask MA and substrate W may be using mask alignment marks M1, M2 and substrate alignment marks P1, P2 aligned. 虽然所述的衬底对准标记占用了专用的目标部分, 他们可以位于目标部分(这里是已知的划线对准标记)之间的间隙中。 Although the gap between the substrate alignment marks as illustrated occupy dedicated target portions, they may be located in target portions (known here scribe-lane alignment marks) between. 类似地,在掩模MA 上提供多于一个管芯的情况下,掩模对准标记可以位于管芯之间。 Under Similarly, provided on the mask MA case more than one die, the mask alignment marks may be located between the dies.

[0067] 在下述模式的至少一种中可以使用所述装置: [0067] The device can be used in at least one of the following modes:

[0068] 1.在步进模式,掩模台MT和衬底台WT保持基本静止,而给予辐射束的整个图案同时一次投影到目标部分C (即单个静态曝光)。 [0068] 1. In step mode, the mask table MT and the substrate table WT are kept essentially stationary, while an entire pattern given while the radiation beam is projected onto a target portion C (i.e. a single static exposure). 然后该衬底台WT转移到X和/或Y方向,以 The substrate table WT is then shifted to the X and / or Y direction,

12使得可以曝光不同的目标部分C。 12 can be exposed so that a different target portion C. 在步进模式中,曝光区域的最大尺寸限制了在单个静态曝光中成像的目标部分C的尺寸。 In step mode, the maximum size of the exposure field limits the imaged in a single static exposure target portion C of size.

[0069] 2.在扫描模式中,当给予辐射束的图案投影到目标部分C(即单动态曝光)上时, 同时扫描掩模台MT和衬底台WT。 When the [0069] 2. In scan mode, when administered to the radiation beam pattern is projected onto a target portion C (ie a single dynamic exposure), and while scanning the mask table MT and the substrate table WT. 衬底台WT相对于掩模台MT的速度和方向可以由投影系统PS的放大(缩小)和反成像特性决定。 The substrate table WT relative to the mask table MT speed and direction can be determined by the imaging properties and anti-projection system PS enlarged (reduced). 在扫描模式中,曝光区域的最大尺寸限制了在单动态曝光中目标部分的宽度(在非扫描方向),反之扫描移动的长度确定了(在扫描方向上)目标部分的高度。 In scan mode, the maximum size of the exposure field limits the width of the target in a single dynamic exposure portion (in the non-scanning direction), whereas the length of the scanning motion determines the height (in the scanning direction) of the target portion.

[0070] 3.在其他模式中,当赋予辐射束的图案投影到目标部分C上时,支撑可编程构图器件的掩模台MT保持基本静止,移动或扫描衬底台WT。 [0070] 3. In another mode, when a pattern imparted to the radiation beam is projected onto a target portion C, holding a programmable patterning device is a mask table MT is kept essentially stationary, moving or scanning the substrate table WT. 在这个模式中,通常采用脉冲辐射源,并且在衬底台WT的每个移动后或在扫描期间的连续辐射脉冲之间,根据需要可以修正可编程构图器件。 In this mode, generally a pulsed radiation source, and in each movement of the substrate table WT after or between successive radiation pulses during a scan, it can be corrected as required programmable patterning devices. 这个操作模式可以很容易地应用到无掩模光刻中,该光刻利用可编程构图器件,例如上述的可编程镜面阵列。 This mode of operation can be readily applied to maskless lithography that utilizes programmable patterning lithographic device, such as a programmable mirror array described above.

[0071] 也可以使用利用上述模式的基础上的组合和/或变形,或利用完全不同的模式。 COMBINED [0071] can also be used on the above-mentioned modes and / or deformed, or use a completely different pattern.

[0072] 根据本发明的一个方面,覆盖误差和与浸渍液体和密封构件12的存在相关的其它问题通过液体蒸发控制器解决,其标的并控制在衬底区域中的浸渍液体的蒸发率。 [0072] In accordance with one aspect of the present invention, the overlay errors and other problems with the presence of immersion liquid and seal member 12 associated with controller solutions by liquid evaporates, its subject and controls the rate of evaporation of the immersion liquid in the substrate region. 为了蒸发,液体分子从周围吸收能量,特别地如果用泵抽走,导致的制冷可以造成关键元件如衬底W的温度的显著和非均勻变化。 In order to evaporate the liquid molecules absorb energy from the surroundings, especially if using a pump siphoned off the cooling caused significant and can cause non-uniform changes in key components such as the temperature of the substrate W. 热感应形变可以导致最终写入到衬底的图像中的误差。 Can lead to thermally induced deformation of the substrate of the final image is written to the error. 例如,在密封构件12经过后,残留在衬底上浸渍液体的蒸发能够导致局部温度降低到3K。 For example, after the seal member 12 passes over a substrate evaporation of residual immersion liquid can lead to local temperature was lowered to 3K. 作为这样的结果,典型地可以产生超过20nm的单机械覆盖误差。 Such a result can typically produce more than 20nm single machine overlay error.

[0073] 图5示出了根据本发明的一个或多个实施例的密封构件12的设置。 [0073] FIG. 5 shows a sealing member 12 provided in accordance with one embodiment of the present invention, one or more embodiments. 浸渍液体包含在位于投影系统PL的最后元件和衬底W之间的浸渍容器25内。 25 immersed within the liquid contained in the impregnation vessel is located between the final element of the projection system PL and the substrate W. 浸渍液体通过密封构件12的主体和在其下面周围上的气体密封27包含在浸渍容器25内,气体密封27限制了从浸渍容器25经过缝隙22逃走的浸渍液体的量。 Impregnating liquid through the body 12 of the sealing member and the gas around it at the following 27 contained within the sealed impregnation vessel 25, the gas seal 27 limits the amount of 25 to escape through the slit 22 of immersion liquid from the impregnation vessel. 气体密封27连接到加压气体供应系统30,其经过加压气体出口18和加压气体供应管15供应加压气体到气体密封27。 The gas seal 27 is connected to a pressurized gas supply system 30, through which the pressurized gas outlet 18 and a pressurized gas supply tube 15 supplies pressurized gas to the gas seal 27. 气体经过真空排气进口17和真空排气管14抽走。 17 evacuated after gas imports and a vacuum exhaust pipe 14 pumped. 在气体密封27的区域中蒸发的浸渍液体可以经过真空排气进口17抽走。 In the gas seal region 27 may be subjected to evaporation of the immersion liquid 17 pumped vacuum exhaust inlet. 可选择地,逃出气体密封27的液体要么可以进入在缝隙22中密封构件12下面的区域,要么超出密封构件12的外部边缘,蒸发到密封构件12外的衬底W外部的环境中。 Alternatively, the liquid to escape the gas seal 27 may be either in the seal member 12 into the area below the slit 22, or beyond the outer edge of the sealing member 12, the sealing member 12 to the outside of the evaporator of the external environment of the substrate W.

[0074] 物质既以液体形式存在也以气体形式存在,通常地情况是在液体蒸发率和蒸汽凝结率平衡时存在的动态平衡。 [0074] substance only in liquid form but also in gaseous form, is generally the case when the liquid evaporation rate and the vapor condenses rate equilibrium exists homeostasis. 由蒸发产生的冷却量由此被凝结产生的热量抵消(其中随着部分转变到低能量液体状态,高能量气体分子对它们周围的环境产生热量)。 The amount of cooling of heat generated by the evaporator is condensed thereby resulting offset (which as part of the transition to the lower energy liquid state, high energy gaseous molecules to their surroundings generate heat). 由此冷却能量依赖于蒸发的净速率(即单位时间从液体进入到气体状态的分子数量和单位时间从气体进入液体状态的分子数量的差)。 Thereby cooling energy depends on the net evaporation rate (per unit time from a liquid into a gaseous state and the number of molecules per unit time from a gas into a liquid state is the number of molecules of the difference). 凝结和蒸发都是统计效应,增加涉及的分子数量将会增加任一过程的速率。 Condensation and evaporation are statistical effects, increase the number of molecules involved in either process will increase the rate. 因此,增加蒸汽浓度将会增加凝结率并导致蒸发净速率的减小。 Therefore, increasing the vapor concentration will increase the rate of condensation and lead to a reduction in the net rate of evaporation. 蒸汽由水分子组成,浓度可以与相对湿度直接相关,被限定为以在给定温度下存在的最大量百分比存在的水蒸汽的量。 Steam generated by water molecules, can be directly related to the concentration of the relative humidity, it is defined as a percentage of the maximum amount in the presence of an amount of water at a given temperature in the presence of steam.

[0075] 根据本发明实施例采用这个理解以控制由浸渍液体蒸发产生的冷却。 [0075] According to embodiments of the invention to control the use of this understanding is cooled by the evaporation of the immersion liquid. 如图5中所示,加压气体湿度控制器50,提供它以与加压气体供应系统30相互作用,为气体密封27提供加压气体,其相对湿度被控制到大于10%。 Shown in Figure 5, the pressurized gas humidity controller 50, providing it with the interaction between the pressurized gas supply system 30 for providing pressurized gas the gas seal 27, which is controlled to a relative humidity greater than 10%. 增加气体的相对湿度增加了凝结率并由此减小了蒸发的净速率和由此产生的冷却。 Increasing the relative humidity of the gas increases the rate of condensation and thereby reducing the net rate of evaporation and the resulting cooling. 优选地相对湿度设置在由参考校准量测确定的预定范围内。 Relative humidity is preferably disposed within a predetermined range by the determination of the reference calibration measurement. 为了控制冷却的目的,相对湿度越高越好。 To control cooling purposes, the relative humidity the higher the better. 然而,对于非常高的相对湿度,密封构件12可以在其尾迹(wake)剩余过量的水。 However, for very high relative humidity, the sealing member 12 may be excess surplus in its wake (wake) of water. 并且,如果为靠近密封构件的外直径的潮湿气体取出提供不充分机械,湿气会残留并会干扰定位传感器IF的操作。 And, if it is moist gas near the outer diameter of the seal member to provide insufficient mechanical removal, moisture may remain and may interfere with the operation of the positioning sensor IF. 因此,通常上限会取决于密封构件构造和/或设置的细节。 Therefore, the upper limit will generally depend on the details of the sealing member constructed and / or settings. 另外地或可选地,预定范围可以大于40%。 Additionally or alternatively, the predetermined range may be greater than 40%. 例如这些的高相对湿度可以通过使用比仅为了得到优化密封性能(典型地可以使用6bar)的目的而可能选择的另外的压力更低的工作压力来实现。 For example, these are high relative humidity can be optimized to use than only for the seal performance (typically can use 6bar) purposes may select additional pressure to achieve a lower operating pressure. 理想地,应当选择工作压力以尽可能地接近大气压力,同时仍为气体轴承27提供足够的流速以实施其功能。 Ideally, the working pressure should be chosen as close as possible to the atmospheric pressure, the gas bearing 27 while still providing sufficient flow rate in order to implement its functionality. 当加压气体在离开加压气体供应系统30膨胀时,工作压力越低,相对湿度就减小得越低。 When the pressurized gas at the exit of the pressurized gas supply system 30 expands, the lower the operating pressure, the more low relative humidity decreases.

[0076] 可以设置加压气体湿度控制器50以响应衬底W和/或衬底台WT的温度改变。 [0076] You can set the pressurized gas humidity controller 50 in response to the substrate W and / or temperature change of the substrate table WT. 这些温度改变可以经过一个或多个设置例如在衬底台WT中的温度传感器60确定。 These temperature changes in the substrate table WT can e.g. temperature sensor 60 is determined through one or more settings. 根据本发明的实施例,设置加压气体湿度控制器50以比较通过温度传感器60在一个或多个点测量的衬底W和/或衬底台WT和/或衬底固定器的温度和目标温度或温度Tt。 According to an embodiment of the present invention, the pressurized gas humidity controller 50 is provided to compare the temperature sensor 60 by the substrate W at one or more points of measurement and / substrate table WT / or the substrate holder and the target temperature and or temperature or temperatures Tt. 也就是说,存在单个温度传感器60时,加压气体温度控制器50把这一个温度读数与单个目标温度Tt比较。 That is, the presence of a single temperature sensor 60, the pressurized gas temperature controller 50 compares this one temperature reading with a single target temperature Tt comparison. 当存在多个温度传感器60时,加压气体温度控制器50把多个读数和单个目标温度Tt 比较,或与多个目标温度Tt比较,该多个目标温度相应于例如衬底W的特殊区域,和/或衬底台/衬底固定器的相应区域,因此相应于温度传感器读数(其内部可以使用平均读数) 的特殊组。 When there are a plurality of temperature sensors 60, over 50 readings with a single target temperature Tt compare the pressurized gas temperature controller, or a plurality of target temperatures Tt compared with the target temperature corresponding to a plurality of specific regions of the substrate W e.g. and / or substrate table / corresponding region of the substrate holder, and therefore corresponds to the temperature sensor readings (within which an average reading may be used) in special groups.

[0077] 为了减小在所测量和目标温度之间的差别,加压气体湿度控制器50此时调节加压气体的相对湿度,该过程的效果由反馈控制器如PID系统控制。 [0077] In order to reduce the difference between the measured and target temperature, pressurized gas humidity controller 50 at this time adjusting the relative humidity of the pressurized gas, the effect of the process is controlled by a feedback controller such as a PID system.

[0078] 对于由在气体密封27的区域中,特别是在真空排气入口18和真空排气管14周围的蒸发引起的冷却,调节供应到气体密封27的气体湿度是最有效的。 [0078] For the gas seal region 27, in particular in the exhaust gas is cooled and evaporated in vacuo and the inlet 18 around the vacuum exhaust pipe 14 caused by adjusting the gas supplied to the humidity of the gas seal 27 is most efficient. 优选具有附加的机械装置来控制超出气体密封27和密封构件12的外部的液体的净蒸发。 Preferably it has additional mechanical means to control the net evaporation beyond the gas seal 27 and outside of the liquid sealing member 12. 在图6中说明了根据本发明实施例的这样的设置。 In Figure 6 illustrates such an arrangement according to an embodiment of the present invention. 这里,提供能够提供具有相对湿度被控制成大于10%的气体流的气体簇射出口70。 Here, there is provided a gas cluster can be provided with a relative humidity controlled to be greater than 10% of the exit gas stream outlet 70. 提供气体簇射温度控制器75,该控制器能根据校准测量、计算或测量在衬底W和/或衬底台/衬底固定器上的一个或多个点的温度中的任一种来调整相对湿度,如通过一个或多个温度传感器60所提供的,并与目标温度或温度Tt比较。 Providing a gas shower temperature controller 75, the controller according to the calibration measurements, calculations or measurements at any temperature of the substrate W and / or substrate table / substrate holder on one or more points in one of adjust the relative humidity, such as by one or more temperature sensors 60 provided and compared with the target temperature Tt or temperature. 在这种情况下的优选相对湿度的范围是40至50%。 In this case the relative humidity is preferably in the range of 40-50%. 在这种情况下设置气体簇射湿度控制器75以响应温度测量,为了减小在所测量的和目标温度Tt之间的差,它可以调节气体的相对湿度。 In this case a gas-shower humidity controller 75 in response to the temperature measurement, in order to reduce the difference between the measured and target temperature Tt, it can adjust the relative humidity of the gas. 也就是说,存在单个温度传感器60时,气体簇射湿度控制器75把这一个温度读数与单个目标温度Tt比较。 That is, the presence of a single temperature sensor 60, the gas-shower humidity controller 75 compares this one temperature reading with a single target temperature Tt comparison. 当存在多个温度传感器60时,气体簇射湿度控制器75把多个读数和单个目标温度Tt比较,或与多个目标温度Tt比较,该多个目标温度相应于例如衬底W的特殊区域,和/或衬底台/衬底固定器的相应区域,因此相应于温度传感器读数(其内部可以使用平均读数)的特殊组。 When there are a plurality of temperature sensors 60, over 75 readings with a single target temperature Tt gas-shower humidity controller comparison, or a plurality of target temperatures Tt compared with the target temperature corresponding to a plurality of specific regions of the substrate W e.g. and / or substrate table / corresponding region of the substrate holder, and therefore corresponds to the temperature sensor readings (within which an average reading may be used) in special groups. 反馈控制器如PID系统可以控制该过程的效率。 Feedback controller such as PID control system efficiency of the process.

[0079] 气体簇射湿度控制器75可以设置以与加压气体湿度控制器50相互作用,以确保由气体密封27提供的气体相对湿度和气体簇射出口70匹配。 [0079] gas-shower humidity controller 75 may be provided with the pressurized gas humidity controller 50 interact to ensure that the gas supplied from the gas seal 27 relative humidity and gas-shower outlet 70 matches. 这个特征提供了一个机械装置,通过该机械装置可以控制在气体密封27外部的相对湿度中的变化,并避免对诸如用于可能另外发生的测量衬底台WT位置的干涉仪的系统的干扰。 This feature provides a mechanism by which a mechanical means may control the gas seal 27 at the outside relative humidity changes, and to avoid the substrate table WT, such as for measuring the position of the interferometer system might otherwise occur interference.

[0080] 正常地设置衬底台WT以通过衬底台移位系统100相对于投影系统PL和密封构件12移动(见图8),以使得衬底W的连续目标区域可以通过构图的辐射束曝光。 [0080] The substrate table WT is normally provided by the substrate table displacement system 100 with respect to the projection system PL and the sealing member 12 is moved (see FIG. 8), so that a continuous region of the target substrate W can be patterned radiation beam exposure. 这个过程可以促进少量的浸渍液体离开浸渍容器25的限制,尽管有气体密封27的操作。 This process can contribute to a small amount of immersion liquid left limit impregnation vessel 25, although the gas sealing 27 operation. 上面已经计论了设置以减小由减小浸渍液体蒸发导致的元件冷却的实施例。 As already count on the settings to reduce the embodiment of the cooling element immersion liquid is reduced by evaporation caused. 根据本发明的可选的方面,由蒸发浸渍液体的冷却效应引起的误差可以通过提供衬底加热器解决,该加热器根据位置、速度、加速度和衬底台WT相对于密封构件12的预定路径、和局部衬底W和/或衬底台WT的温度的至少一个来加热衬底W的至少一部分。 According to an alternative aspect of the invention, errors caused by the cooling effect caused by evaporation of immersion liquid can be solved by providing a substrate heater, the heater according to the position, velocity, acceleration and predetermined path of the substrate table WT relative to the sealing member 12 , and the local substrate W and / or substrate table WT at least one temperature to heat at least a portion of the substrate W. 衬底加热器可以通过多个机械装置加热。 The substrate heater may be heated by a plurality of mechanical devices. 这些可以包括下列的一个或者多个:红外辐射源,热灯丝电阻加热器和热气喷射。 These may include one or more of the following: infrared radiation, hot filament resistance heater and heat injection. 当确定使用何种类型的加热器时的重要因素包括发热量需要怎样精确和快速地调节,以及怎样有效地生产微型形状的加热器。 When important factor in determining what type of heater used include heat required to adjust how accurate and fast, and how effectively the production of micro-shaped heater. 根据加热器是否要嵌入到材料内或在材料附近(如热灯丝,例如,嵌入到衬底台WT中),其中倾向于调节该材料的温度,或加热器是否在一定距离上工作(例如红外辐射源或温度控制气体喷射源),后者因素将或多或少的成为重要性。 The heater is to be embedded into the material or the material nearby (such as hot filament, for example, embedded in the substrate table WT), which tends to regulate the temperature of the material, or the heater is working at a distance (such as infrared radiation or temperature controlled gas jet source), the latter factor will become more or less important. 在辐射源的情况下,辐射的波长分布被选择成不与衬底W上的抗蚀剂成分反应(对于所关心的大部分的抗蚀剂红外辐射应当是安全的)。 In the case of the radiation source, the wavelength of the radiation distribution components of the reaction are selected so as not to resist and substrate W (for most resists of interest infrared radiation should be safe). 辐射强度的选择取决于抗蚀剂的光学性能(如它的反射率)。 The choice depends on the radiation intensity of the optical properties of the resist (such as its reflectivity). 这可以通过在光刻设备的安装顺序期间的校准测量确定。 This can be determined by calibration measurements during the installation sequence of the lithographic apparatus. 在可能存在处理阶段相关性处(例如由于在反射率中的改变),也可以在生产顺序中执行校准作为用于每块衬底的额外测量阶段。 Correlation may exist at the processing stage (e.g., due to a change in the reflectance), calibration may also be performed in the production sequence as an extra measurement phase for each substrate. 如下所述,本发明的几个实施例以下列规则操作,该规则中, 在衬底曝光程序期间,即,在密封构件12经过衬底W上方时,启动存在的衬底加热器的至少一子集。 At least one substrate heater are described below, several embodiments of the present invention, the following rule actions, the rule, during substrate exposure sequence, i.e., when the seal member 12 passes over the substrate W, the presence of the start subset. 然而,在曝光前加热衬底W以便补偿不得不发生但也是预期发生的冷却的系统也落在发明的范围之内。 However, heating of the substrate W before the exposure to compensate for the cooling system had to happen but also expected to occur also within the scope of the invention.

[0081] 图7和图8示出了根据本发明实施例的设置,包括嵌入在衬底台作为“局部加热器” 85,或嵌入在密封构件12中作为“远程加热器” 86,或者两者都包括的加热器85/86系统。 [0081] Figures 7 and 8 shows two settings embodiment according to the present invention, including embedded in the substrate table as "local heaters" 85, or embedded in the sealing member 12 as "remote heaters" 86, or who include a heater 85/86 system. 设置每个局部加热器85以主要加热衬底W的特殊区域,并可以一起用来控制衬底W的至少一部分的温度曲线。 Each local heater 85 provided in a special area of the primary heating the substrate W, the substrate W and can be used to control the temperature profile along at least a portion. 远程加热器86将依据密封构件12相对于衬底W的位置加热衬底W的不同部分。 Remote heater 86 will be based on the position of the seal member 12 with respect to the different parts of the substrate W is heated substrate W.

[0082] 根据包括局部加热器85的第一操作模式,在衬底曝光循环开始之前,可以调节每个加热器的发热量和相对时限以在已知时间内为衬底W建立开始温度曲线。 [0082] According to a first mode of operation comprises a local heater 85, before the substrate exposure cycle begins, the heat can be adjusted relative to each heater and within the time frame to establish a known start time of the substrate temperature profile W. 参考由光刻设备产生的校准测量和/或测试图案分析,可以选择开始温度曲线,以基本补偿由于在曝光循环期间的浸渍液体蒸发产生的冷却。 Reference calibration measurement generated by the lithographic apparatus and / or test pattern analysis, can select start temperature curve, cooled to substantially compensate for evaporation of immersion liquid during the exposure cycle generated.

[0083] 根据包括局部加热器85的第二操作模式,仅仅当经过定位加热的区域上的密封构件12时,可以设置这些加热器85的每一个以转换到加热发射状态,。 [0083] According to a second mode of operation includes a local heater 85, just when the seal member 12 is positioned through the heated region, you can set each of these heaters 85 for conversion to heat-emitting state. 例如,如图7中所示在密封构件12(由此目标区域)沿着在初始管芯(或目标区域)160到最后管芯170之间的路径150相对于衬底W移动的情况下,局部加热器85也可以以基本沿着同样的路径150 的渐进方式切换。 For example, as shown in FIG 12 (whereby the target region) in the sealing member along an initial die (or target area) 160 to a final path 170 between the die 150 with respect to the case where the substrate W moves, local heater 85 may also be the basic switching gradual way along the same path 150. 这可以通过编程衬底温度控制器110得到,以提供一系列的时间延迟启动信号,该信号对于每个局部加热器85接近地滞后于密封构件12相对于制底台WT的预定路径。 This can be programmed to obtain the substrate temperature controller 110, to provide a series of time delayed start signal, the signal for each local heater 85 closely lags behind the sealing member 12 with respect to the predetermined path soles table WT. 预定路径可以存储在衬底台路径确定器件90中。 The predetermined path can be stored in the substrate table path determining device 90. 作为可选择或另外的方法,局部加热器85的启动顺序可以从衬底台路径确定器件90的进一步功能得出。 As an alternative or additional method, the startup sequence local heater 85 may determine further features of the device 90 is derived from the substrate table path. 例如衬底台路径确定器件90可以包括用于测量衬底台WT的位置、速度和/或加速度和用于馈送这个信息到衬底温度控制器110的装置(例如在干涉量度的基础上),当启动每个局部加热器85时,该装置可以在这个点计算。 E.g., the substrate table path determining device 90 may include a substrate table WT for measuring the position, velocity and / or acceleration, and means for feeding this information to the substrate temperature controller 110 (e.g., the interference on the basis of measurements), When you start each local heater 85, the device can be calculated at this point. 例如,当识别到密封构件12从特定加热器移开或移过时,路径确定器件90可以设置成为给定的加热器传送启动信号。 For example, when recognizing that the seal member 12 or move away from certain obsolete heater path determining device 90 can be set to transmit a given heater activation signal. 通过每个局部加热器85提供的能量可以设置成以恒定或随时间变化,并与其它局部加热器85相同或者不同。 Energy provided by each local heater 85 may be arranged at a constant or varies with time and with the same or different from the other local heaters 85. 用于每个加热器的最优化设置是最好地补偿由于有关区域的蒸发产生的能量损失。 Optimization settings for each of the heaters is best to compensate the energy loss due to evaporation of the region concerned produced. 在从密封构件12的液体损失率为恒定的情况下,一旦启动就由每个加热器85供应基本相同的能量(因为一旦密封构件12经过,可以发现残留在衬底W上将要蒸发的液体量大致恒定)。 In the sealing member 12 from the liquid loss rate is constant, once it is started by each of the heaters 85 substantially the same energy supply (because once the seal member 12 through, can be found in the amount of liquid remaining on the substrate W will be evaporated substantially constant). 可选择地,可以发现在特定区域中需要更多热量,如当密封构件12相对于衬底台WT改变方向时。 Alternatively, can be found in a particular area needs more calories, such as when to change the direction of the substrate table WT relative to the seal member 12. 可以进行作为特定衬底台所需路径和速率的函数的校准测量以确定操作加热器能量最有效的方法。 Calibration measurements can be carried out as a function of the particular substrate table path and rate required to determine the most efficient operation of the heater energy method.

[0084] 如图8所示,在密封构件12中的远程加热器86可以优选地定位于密封构件12的周围。 [0084] shown in Figure 8, the sealing member 12 in the remote heaters 86 may preferably be positioned around the sealing member 12. 这个设置使得要操作的加热器邻进于蒸发过程可以吸取最多热量的区域。 This setting makes the heater to operate adjacent to the evaporation process can be drawn into the most heat of the region. 布局选择在外径附近设置作为折衷以避开直接在气体密封27周围的区域,该气体密封27实际上已经被孔、管和灰尘占据。 Layout options provided in the vicinity of the outer diameter of the seal as a compromise to avoid the immediate area surrounding the gas 27, the gas seal 27 has actually been holes, tubes and dust occupied. 因为它们在距离衬底W—定距离操作,加热机械装置如那些基于辐射或热气喷射会是比较适合的。 Because they are a given distance from the substrate W- operation, the heating mechanism such as those based on radiation or hot gas injection would be more appropriate. 在密封构件12的基础上产生热表面是一个方法,通过该方法可以实施辐射源。 Heat is generated in the surface of the sealing member 12 on the basis of a method, the method can be implemented by a radiation source. 这种器件与密封构件12的剩余部分的热隔离将会改善这种特征的性能。 Thermal isolation of such a device with the remaining portion of the sealing member 12 would improve the performance characteristics. 可选择地或附加地,可以使用红外灯泡。 Alternatively or additionally, it is possible to use an infrared lamp.

[0085] 如对于上述局部加热器85所设置的,可依据衬底台的移动方向来控制远程加热器86的能量。 [0085] As for the above-mentioned local heater 85 set according to the direction of movement of the substrate table can be controlled remotely heater 86 energy. 例如,可以设置其以从密封构件12的一侧提供比另一侧更多的热量。 For example, you can set it to provide from one side than the other side of the seal member 12 more calories. 在冷却的一个方面,涉及到从密封构件12逃出的蒸发液体,可以设置在密封构件86的尾缘(浸渍液体在这里可能逃出)上的远程加热器86以发射比位于密封构件12 (衬底W在这里仍然是干的)的前边缘上的那些远程加热器更高的热量。 In one aspect of cooling, related to evaporation of the liquid to escape from the seal member 12 may be provided in remote heater 86 86 Trailing Edge (immersion liquid may escape here) on the sealing member to transmit than the sealing member 12 ( where the substrate W is still dry) higher remote heater heat those on the front edge. 远程加热器86的效率可以应要求通过改变能量和/或在密封构件12的圆周周围的加热器86的宽度而改变。 Remote efficiency heater 86 may be required to change the energy and / or around the circumference of the sealing member 12 width of the heater 86 is changed. 这个后者的参数可以改变,例如,通过依次地启动分段加热器86的不同段,或多个加热器86中的一个加热器86。 This latter parameter may be varied, for example, by sequentially starting the different segments of the heater section 86, a heater 86 or a plurality of heaters 86.

[0086] 虽然显示嵌入在衬底台WT或密封构件12中,可以理解加热器85/86可以位于它们能够影响衬底W的温度的任何位置。 [0086] Although shown embedded in the substrate table WT or 12 in the sealing member, to be understood that the heater 85/86 may be positioned anywhere that they can influence the temperature of the substrate W. 例如,可以将辐射发射加热器定位在不同于衬底台WT和密封构件12的分离体中。 For example, radiation emission is different from the heater may be positioned in the substrate table WT and the sealing member 12 isolates. 在曝光前加热衬底W时,这可以发生在远离用于曝光的区域中,以更加容易地实施远程加热器86。 When the substrate is heated prior to exposure W, which can occur in a region away for exposure in order to more easily the remote heaters 86 embodiment.

[0087] 光刻设备也可以包括局部温度传感器60,在图8中说明的例子中该传感器嵌入到衬底台WT中。 [0087] The lithographic apparatus may also comprise local temperature sensors 60, in the example illustrated in FIG. 8 that the sensor is embedded in the substrate table WT. 根据本发明的实施例,设置这些温度传感器60以测量衬底W的每个区的温度和/或由每个局部加热器85影响的衬底台/衬底固定器的相应区域。 According to an embodiment of the present invention, the temperature sensor 60 is provided to measure the temperature of each zone of the substrate W and / or substrate table by the influence of each local heater 85 of the corresponding region / substrate holder. 信息输入到衬底温度控制器110,其然后可以计算怎样控制局部加热器85和/或远程加热器86的输出,以减小在目标温度Tt和由局部温度传感器60测量的温度之间的差。 Information is inputted to the substrate temperature controller 110, which can then be calculated how to control the output of local heaters 85 and / or remote heaters 86 so as to reduce the difference between the target temperature Tt and a temperature sensor 60 measured by the local temperature . 优选地,在这个实施例中,可以为加热器85和/或86设置以具有除了固定输出的变化输出。 Preferably, in this embodiment, the output can be set to change with a fixed output except for the heater 85 and / or 86. 在任何情况下,可以使用反馈控制器(例如PID)以优化会聚过程的效率。 In any case, a feedback controller may be used (e.g., PID) to optimize the efficiency of the convergence process.

[0088] 调制由液体供应系统130供应的液体的温度也可以控制衬底W和/或衬底台/衬底固定器的温度。 [0088] temperature of the liquid supply modulation by the liquid supply system 130 can also control the substrate W and / or substrate table / substrate holder temperature. 例如,可以加热浸渍液体至大于295K的控制温度。 For example, the immersion liquid may be heated to a controlled temperature greater than 295K. 图5示出了本发明的实施例,包括设置浸渍液体温度控制器120以与液体供应系统130协作实施该功能。 Figure 5 shows an embodiment of the present invention, including immersion liquid temperature controller 120 provided to cooperate with the liquid supply system 130 to implement the function. 为了选择有效补偿蒸发热损失的浸渍液体温度,可以根据校准测量或根据从一个或多个温度传感器60的读数来实现浸渍液体的温度控制。 In order to select an effective immersion liquid temperature compensation evaporative heat loss can be measured or calibrated in accordance with from one or more temperature sensors 60 readings to achieve temperature control immersion liquid. 在后一种情况中,可以控制浸渍液体温度控制器120的输出以最小化在目标温度Tt和由温度传感器60提供的温度之间的差,该会聚过程通过反馈控制器如PID控制器被控制。 In the latter case, it is possible to control the output of the immersion liquid temperature controller 120 to minimize the difference between the target temperature Tt and the temperature provided by the temperature sensor 60 between the converging process by a feedback controller such as a PID controller is controlled . 也就是说,存在单个温度传感器60时,浸渍液体温度控制器120把这一个温度读数与单个目标温度Tt比较。 That is, the presence of a single temperature sensor 60, the immersion liquid temperature controller 120 compares this one temperature reading with a single target temperature Tt comparison. 当存在多个温度传感器60时, 浸渍液体温度控制器120把多个读数和单个目标温度Tt比较,或与多个目标温度Tt比较, 该多个目标温度例如相应于衬底W的特殊区域,和/或衬底度台/衬底固定器的相应区域, 由此相应于温度传感器读数(其内部可以使用平均读数)的特殊组。 When there are a plurality of temperature sensors 60, the immersion liquid temperature controller over 120 readings with a single target temperature Tt comparison or compared with a plurality of target temperatures Tt, e.g., the target temperature corresponding to a plurality of specific regions of the substrate W, and the corresponding region / substrate of the table / substrate holder or, thus corresponding to the temperature sensor readings (within which an average reading may be used) in special groups.

[0089] 调节由加压气体供应系统30供应的气体的温度也可以控制衬底W和/或衬底台/衬底固定器的温度。 [0089] regulated by the pressurized gas temperature of the gas supply system 30 can also control the supply of the substrate W and / or substrate table / substrate holder temperature. 例如,加压汽体可以加热到大于300K的控制温度。 For example, the vapor pressure can be heated to more than 300K of temperature control. 由于气体相对于液体有更低的比热,这里温度下限比上述的浸渍液体温度控制器120要求的更高。 Since the gas relative to the liquid has a lower specific heat, where the temperature is lower than that of the immersion liquid temperature controller 120 requires higher. 根据本发明的一个实施例,在300至320K的范围内的温度下提供加压气体。 According to one embodiment of the present invention, there is provided a pressurized gas at a temperature in the range of 300 to 320K. 图5示出了本发明的实施例,包括设置的加压气体温度控制器140以结合加压气体供应系统30执行温度控制功能。 Figure 5 shows an embodiment of the present invention, comprising a pressurized gas temperature controller arranged to bind 140 the pressurized gas supply system 30 performs the temperature control functions. 可以关限据校准测量或根据从一个或者多个温度传感器60的读数来实现加压气体的温度控制。 According to the calibration measurement can be restricted or closed in accordance with the one or more temperature sensors 60 reading to achieve temperature control of the pressurized gas. 在后者的情况下,可以控制加压气体温度控制器140的输出以最小化在目标温度Tt和由温度传感器60提供的温度之间的差,会聚过程受反馈控制器控制,例如PID控制器。 In the latter case, the pressurized gas temperature controller can control the output 140 to minimize the difference between the target temperature Tt and the temperature provided by the temperature sensor 60 between the converging process by a feedback controller, such as a PID controller . 也就是说,存在单个温度传感器60时,加压气体控制器140把这一个温度读数与单个目标温度Tt比较。 That is, the presence of a single temperature sensor 60, the pressurized gas temperature controller 140 compares this one reading compared with a single target temperature Tt. 当存在多个温度传感器60时,加压气体控制器140把多个读数和单个目标温度Tt比较,或与多个目标温度Tt比较,该多个目标温度例如相应于衬底W的特殊区域,和/或衬底台/衬底固定器的相应区域,且由此相应于温度传感器读数(其内部可以使用平均读数)的特殊组。 When there are a plurality of temperature sensors 60, the pressurized gas controller over 140 readings with a single target temperature Tt comparison or compared with a plurality of target temperatures Tt, e.g., the target temperature corresponding to a plurality of specific regions of the substrate W, and the corresponding region / substrate table / substrate holder or, and thus corresponds to the temperature sensor readings (within which an average reading may be used) in special groups.

[0090] 如上所讨论的,衬底加热需求具有位置相关性,该位置相关性至少部分由在衬底W 上的密封构件12的路径决定。 [0090] As discussed above, the substrate heating requirements have a position correlated, the correlation between the position of at least partially determined by the path on the substrate W the sealing member 12. 至少两种过程被认为对冷却过程有贡献:在衬底W和密封构件12之间的缝隙22中的液体的蒸发,和如果曝露区域是湿的,在曝光后残留在衬底W上的残留液体的蒸发。 At least two processes are considered to contribute to the cooling process: evaporation in a gap 12 between the substrate W and the sealing member 22 of the liquid, and if the exposed area is wet, after remaining on the substrate W exposed residues evaporation of the liquid. 密封构件12的冷却能量(即从第一过程冷却)在时间上是恒定的,虽然在其它因素中它依赖密封构件12相对于衬底W的速度。 Cooling energy (i.e., from the first cooling process) of the sealing member 12 is constant in time, although it depends on other factors, the sealing member 12 with respect to the speed of the substrate W. 在其它因素中第二过程的冷却能量依赖于留在衬底W上的液体的量。 Among other factors the energy of the second cooling process is dependent on the amount left on the substrate W liquid. 需要被补偿的冷却量通常是两种过程的复变函数,导致具有复合位置相关性的冷却能量。 The amount of cooling required to be compensated is usually complex function of the two processes, resulting in a composite position cooling energy correlation. 在衬底W中的热导率也是一个重要因素,由于在衬底W 的曝露部分中的冷却,即使在密封构件12到达它们之前,就意味着衬底W的未曝露区域将开始冷却。 The thermal conductivity of the substrate W also an important factor, since the cooling in exposed portions of the substrate W, even before the seal member 12 reaches them, it means that the unexposed areas of the substrate W will start to cool down. 一次进行一个过程,然而,可以进行估计。 Once carried out a process, however, it can be estimated. 例如,仅仅考虑从衬底W上的残留浸渍液体蒸发的直接冷却,设置衬底曝光达大约30秒,在最后曝光和约5秒钟的衬底卸载之间的时间内,和如在图7中所标示的曝光顺序150,期望通过这个机械装置在第一曝光的位置160处比最后曝光的位置170多抽取大约20%至30%的热量。 For example, considering only the direct cooling from the residue on the substrate W of immersion liquid evaporation, the exposure of the substrate disposed approximately 30 seconds, in the time between the unloading of about 5 seconds of the last exposure of the substrate, and as shown in Fig. 7 marked exposure sequence 150, hope that through this mechanism in the first exposure position 160 positions over the last exposure to extract more than 170 about 20-30% of the heat. 在上述的特定实施例中,包括衬底加热器85/86,通过延迟沿着密封构件12的路径的独立加热器的启动来考虑这个效果。 In the particular embodiment described above, it includes a substrate heater 85/86, by delaying the start of the heater along a separate path sealing member 12 to consider this effect. 类似效果也可以通过设置衬底加热器以在衬底W上的目标区域(其中设置投影系统以在第一时间投影已构图辐射束)和渐进地在衬底W上的目标区域处提供更低的热量(其中设置投影系统PL以在随后的时间中投影已构图辐射束)提供更高的热量来实现。 A similar effect can also be set on the substrate to substrate heater W target area (which is set to be the first time the projection system a patterned radiation beam projection) and progressively target area on the substrate W at providing lower heat (which is set to the projection system PL at a later time in a patterned projection beam of radiation) to provide higher heat to achieve. 这个设置可以变化以依赖于要被补偿的特殊的设置的冷却特性来给出更多复合位置相关的加热。 This setting may be varied to be compensated is dependent on the particular characteristics of the cooling provided to give more complex position-dependent heating.

[0091] 虽然技术上有可能在衬底W上的许多不同位置处定位多个局部加热器85,但既实际又有效而且显著减小花费的方法是提供更有限数量的加热器并把它们基本沿着密封构件12的路径设置。 [0091] While technically possible at many different locations on the substrate W is positioned a plurality of local heaters 85, but both practical and effective method of significantly reduced cost and to provide a more limited number of heaters and put them substantially 12 is provided along the path of the sealing member. 图7中描述了这种类型的设置。 Figure 7 illustrates this type of setting. 这里,设置拉长衬底加热器85,如热灯丝, 使得一个独立的可控制元件与在衬底W上的密封构件12的主要扫描或分档轴181-187 (每个对应于一行管芯)之一对准。 Here, set elongated substrate heater 85, such as hot filament, making a separate control element and the sealing member may be on the substrate W of the main scan or binning axis 12 181-187 (each corresponding to one line of the die ) One of the alignment. 在示出的这个例子中,设置每个热灯丝85以在单位长度发射恒定热量,并设置其以使得与主要扫描或分挡轴187对准的热灯丝具有最大的发热量, 其对准186下一个最高的发热量等,其渐进地减小直到到达与主要扫描或分档轴181对应的最终的热灯丝,其分配最低的发热量。 In the illustrated example, the settings on each hot filament 85 to emit a constant heat per unit length, and set it so that the main scanning or sub-block axis 187 hot filament aligned with the greatest amount of heat, which is aligned 186 the next highest amount of heat, etc., which progressively decreases until it reaches the main scan or binning shaft 181 corresponding to the final heat filament, assign the lowest heat.

[0092] 其中在不同位置处(例如在每个衬底100和700之间)提供大量的局部加热器, 优选尽可能靠近衬底W表面的定位加热器。 [0092] wherein at different positions (e.g., between each substrate 100 and 700) provide a large number of local heaters, preferably as close to the surface of the substrate W positioned heaters. 然而在图7和8中所示的设置中,提供了很少的加热器,优选基本更远地定位加热器以使得每个加热器将会具有在衬底W的更大部分上的有效控制。 However, in the setting shown in Figures 7 and 8, there is provided a small heater, the heater is preferably positioned substantially farther so that each heater will have a majority in the more effective control of the substrate W .

[0093] 图9示出了其中提供连续热灯丝加热器85以加热衬底W的设置。 [0093] FIG. 9 shows a heater which provides continuous hot filament 85 to heat the substrate W is disposed. 在示出的例子中,设置热灯丝加热器85以在一定程度上跟随密封构件12的路径,它具有基本平行于密封构件12 (如图7中所示)的主扫描轴181-187 (即垂直于扫描方向)的更长部分195。 In the example shown, the glow wire heater 85 is disposed in the path to follow to a certain extent the sealing member 12, having a main scanning axis substantially parallel to the sealing member 12 (shown in Figure 7) of 181-187 (i.e. perpendicular to the scanning direction) of the longer portion 195. 然而, 设置在这些更长部件之间的节距191-193以朝向衬底W的底端变得越来越短,如图所示,其对应于其中衬底W将要被首先曝光的的区域(即节距191 >节距192 >节距193)。 However, a longer pitch is disposed between the members 191-193 to the bottom towards the substrate W becomes shorter and shorter, as shown, which corresponds to the substrate W which is to be exposed in the first region (ie pitch 191> 192 pitches> 193 pitches). 这意味着热灯丝加热器85能给出最简单和最坚固的结构(其中单位长度的发热量是恒定的,实际上可以对应于相等截面的伸长电阻元件),并仍然提供朝向其中的衬底将首先曝光的的区域变大的发热量,其是需要用于冷却效果最大修正的衬底W的区域。 This means that the hot wire heater 85 can be given the simplest and most robust construction (including heat per unit length is constant, in fact, may correspond to the same cross section of elongated resistance element), and still provide orientation wherein the lining The first end of the exposed region becomes large heat, which is needed for the area of the substrate W maximum cooling effect correction. 作为可选择的/或另外的设置,可以设置热灯丝加热器85以提供单位长度的发热量,该发热量沿着其长度(例如,在所示方向上朝衬底W的底端增加)改变。 As an alternative and / or additional settings, you can set the hot wire heater 85 to provide heat per unit length of the heat along its length (for example, in the direction shown towards the bottom of the substrate W is increased) change . 在热灯丝通过与经过其长度的电流相关的电力消散操作的情况下,可以通过改变截面(例如,提供变得需要更多能量的更薄的热灯丝) 或通过改变使用的材料而得到变化的发热量。 In the case of the hot filament through its length and the current through the power dissipation associated with the operation, you can change the cross-section (for example, more energy is necessary to provide a thinner hot filament) or by changing the material used to obtain changes heat. 在后者的设置中,必须当心以避开在不同成分的材料之间制得的结处的高电阻的点。 In the latter arrangement, care must be taken to avoid a high resistance between the different components of the material obtained junction point.

[0094] 图10和图11示出了其中衬底加热器包括独立可控加热器85的系统的设置。 [0094] Figures 10 and 11 show an arrangement wherein the substrate heater comprises 85 individually controllable heating system. 在图10中示出的实施例中,设置独立可控制的加热器85作为基本平行于主扫描轴181-187(即垂直于扫描方向)的延伸构件,并限制独立可控制加热器85以在衬底W的几何界限内部加热。 Shown in FIG. 10 embodiment, provided independently controllable heaters 85 as substantially parallel to the main scanning axis 181-187 (i.e. perpendicular to the scanning direction) of the extension member, and limit the heater 85 to be controlled independently in geometry of the substrate W limit internal heating. 然而,加热器的可选择设置也应当可以与本发明的实施例兼容,只要它们可以被独立地控制即可。 However, you can choose to set the heater should be compatible with the embodiment of the present invention, as long as they can be controlled independently. 加热阵列控制器180通过地址总线控制每个独立可控加热器85。 Heating array controller 180 via address bus 85 controls each individually controllable heater. 加热器阵列控制器180依次地从预定算法190接收输入,该算法描述了应当怎样控制每个独立的加热器的发热量作为时间的函数(和由此作为密封构件12相对于在考虑中的独立加热器的位置的函数)。 Heater array controller 180 in turn receives input 190 from a predetermined algorithm, the algorithm describes how should control each individual heater heat as a function of time (and thus as a sealing member 12 with respect to the independent consideration function of the position of the heater). 适当算法的使用可以从校准测量和/或计算(例如,在时间量的基础上,预期残留在衬底W上的液体的预期的量)。 (E.g., the expected amount, on the basis of the amount of time expected to remain in the liquid on the substrate W) using the appropriate algorithm from calibration measurements and / or calculations. 这个方法具有不需要温度传感器的优点,其大大简化了构造。 This method has the advantage of not requiring temperature sensors, which greatly simplifies the construction.

[0095] 浸渍液体的蒸发也可以导致密封构件12自身的冷却。 [0095] evaporation of immersion liquid can also lead to the sealing member 12 itself is cooled. 例如通过冷却浸渍液体和/ 或加压气体,通过对流,和/或通过辐射效应,这个效应反过来导致了衬底W的冷却。 For example by cooling the immersion liquid and / or pressurized gas, by convection, and / or by radiation effect, this in turn leads to a cooling effect of the substrate W. 根据本发明的一个方面,提供密封构件温度稳定器以通过这个机械装置减小衬底W的冷却。 According to one aspect of the present invention, there is provided the seal member temperature stabilizer is reduced by the mechanical means of cooling the substrate W.

[0096] 具体涉及的区域位于真空排气入口17的周围和真空排气管14内。 [0096] area specifically covered around the vacuum exhaust inlet 17 and the vacuum exhaust pipe 14. 浸渍液体存在于这些区域中,当蒸汽浓度通过真空系统保持得较低(蒸发液体被立即用泵抽走)时,特别地产生净蒸发,。 Impregnating liquid is present in these regions, when the steam concentration kept low by the vacuum system (evaporated liquid is now pumped by a pump) when, in particular a net evaporated. 由于这个机械装置,可以控制密封构件12的整体冷却的一种方式在图12 中进行了描述,其中可以将由热隔离套管210影响的密封构件温度稳定器设置在真空排气管14周围。 Because of this mechanism, the sealing member may be a way to control the overall cooling 12 has been described in Figure 12, by which the thermal isolation sleeve 210 may affect the seal member temperature stabilizer is provided around the vacuum exhaust pipe 14. 热隔离套管210优选由在光刻设备预期的操作温度下具有低导热率的材料形成。 Thermal isolation sleeve 210 is preferably formed of a material under the expected operating temperature of the lithographic apparatus having a low thermal conductivity. 通常目的的塑料,PTFE等是用作热隔离套管210的适当材料。 General purpose plastic, PTFE, etc. are used as a thermal isolation sleeve 210 of a suitable material. 可选择地或另外地,密封构件本身整体地或部分地由热绝缘材料构成。 Alternatively or additionally, the sealing member itself in whole or in part, is composed of thermal insulating material. 这个方法比仅具有热隔离套管210更有效和更容易实施,虽然可以限制选择具有适当的机械特性的材料。 This method than having only a thermal isolation sleeve 210 is more effective and easier to implement, although you can limit the selection with the appropriate mechanical properties of materials.

[0097] 另外和/或可选择的方法是提供一个专用的密封构件加热器220,设置其以对由浸渍液体蒸发冷却的密封构件12的那些区域提供补偿加热。 [0097] Additionally and / or alternative method is to provide a dedicated seal member heater 220 is provided for those areas to which the sealing member is cooled by the evaporation of the immersion liquid 12 is heated to provide compensation. 虽然在一方面直接加热密封构件12本身,但是因此,间接地加热衬底W,可以设置密封构件加热器220以直接加热衬底W。 While on the one hand the sealing member 12 itself is heated directly, but thus, indirectly heating the substrate W, the seal member heater 220 may be provided to directly heat the substrate W. 这可以通过使用辐射发射加热器如红外加热器得到,该红外加热器在前文中的可能的衬底加热器85/88中已经描述过。 This is done by the use of radiation-emitting heater such as an infrared heater obtained the infrared heater front substrate heater 85/88 possible text that has been described before. 在图12中所示的设置中,把密封构件加热器220设置在真空排气入口周围并沿着在垂直于密封构件12的轴的平面(向所示方向上的页里面)中的真空排气进口的几何尺寸。 In the arrangement shown in FIG. 12, the seal member heater 220 disposed around the vacuum exhaust inlet, and in that the sealing member along the axis perpendicular to the plane 12 (the direction shown on the inside page) in the vacuum exhaust gas imported geometry.

[0098] 密封构件加热器220的发热量根据从许多可能源的一个或多个入口被密封构件温度稳定器控制。 [0098] The sealing member 220 is based on the heater heat from one or more of the many entrance possible source is the seal member temperature stabilizer control. 例如,密封构件加热器能量可以根据在真空排气管14中的流速调节,其可以通过加压气体供应系统30提供。 For example, the seal member heater power may be adjusted according to the flow rate in the vacuum exhaust pipe 14, 30 which can be provided by the pressurized gas supply system. 这里,希望更高的发热量将需要更高的流速。 Here, we hope more will require a higher heat flow rate.

[0099] 密封构件加热器220也可以参考衬底W和/或衬底台/衬底固定器的温度被控制, 其可以通过一个或更多的温度传感器60在一个或更多位置被测量。 [0099] seal member heater 220 may also refer to a substrate W and / or substrate table / substrate holder temperature is controlled, which can be measured by one or more temperature sensors 60 at one or more locations. 如前述实施例中,可以采用反馈控制器以减小在测量的衬底温度和一个或多个预定义的目标温度Tt之间的差。 Preceding embodiment, feedback controller can be used to reduce the difference between the measured temperature of the substrate and one or more predefined target temperature Tt's.

[0100] 也可以响应于通过加压气体出口18供应的气体的相对湿度来控制密封构件加热器220。 [0100] may be in response to the pressurized gas through the supply outlet 18 to control the relative humidity of the gas seal member heater 220. 这个信息可以通过湿度传感器提供,其可以设置位于密封构件内或作为加压气体供应系统30的一部分(在图13中说明了后一种情况)。 This information may be provided by humidity sensors, which may be provided within the sealing member located or as part of the pressurized gas supply system 30 (illustrated in FIG. 13 the latter case).

[0101] 最后,密封构件温度稳定器200可以参考需要修正的校准表230来控制密封构件加热器220的输出,从密封构件温度的测量建立作为下列一个或多个的函数:衬底温度,加压气体流速,加压气体流温度,真空排气流速,真空排气温度,加压气体相对湿度和浸渍液体温度。 [0101] Finally, the seal member temperature stabilizer 200 may be corrected calibration reference table 230 to control the seal member heater output 220, to establish as a function of one or more of the sealing member from the measured temperature: substrate temperature, plus pressure gas flow rate, pressurized gas flow temperature, vacuum exhaust flow rate, vacuum exhaust temperature, pressurized gas relative humidity and immersion liquid temperature. 虽然必须承担校准测量,但是这个方法大大地减小了在运送给顾客的最终光刻设备中的结合额外功能元件的需要。 Although calibration measurements must be undertaken, but this approach greatly reduces the binding of additional functional elements in the final delivery to the customer's needs in a lithographic apparatus.

[0102] 当考虑到与冷却的密封构件12相关的衬底冷却问题时,密封构件12的最重要的区域是最靠近和/或面对衬底W的区域。 [0102] When considering the cooling of the sealing member 12 associated with substrate cooling problem, the most important regional seal member 12 is the closest and / or facing the substrate W area. 根据在图14中描述的本发明的实施例,密封构件12由在最靠近衬底W的密封构件12的部分中的层400中分布的沟道网络构成。 According to the embodiment described in FIG. 14 of the present invention, the sealing member 12 is made of the distribution of the substrate W in the portion closest to the sealing member 12 in the layer 400 in the channel network. 设置密封构件温度稳定器200以控制热交换液体供应系统410,该系统以控制的温度和/或流速提供热交换液体到所述网络。 Setting the seal member temperature stabilizer 200 to control the heat exchange fluid supply system 410, the system temperature and / or flow rate controlled by a heat exchange fluid provided to the network. 如前面实施例所述,能够提供反馈控制器从而以更有效的方式帮助控制衬底温度。 As previously described embodiments, a feedback controller can be provided so that a more efficient way to help control the substrate temperature. 在这种情况下,可以调节由液体供应系统400提供的热交换液体的温度和/或流速,以减小在一个或更多如通过局部温度传感器60系统所测量的衬底温度和/或衬底台温度与目标温度Tt之间的差。 In this case, the temperature may be adjusted to provide the liquid supply system 400 by a heat exchange fluid and / or flow rate, in order to reduce the temperature of the substrate as one or more local temperature sensor 60 through the measurement system and / or a liner Tt difference between the lower base temperature and the target temperature. 也就是说,存在单个温度传感器60时,液体供应系统400把这一个温度读数与单个目标温度Tt比较,当存在多个温度传感器60时,液体供应系统400把多个读数和单个目标温度Tt比较,或与多个目标温度Tt比较,该多个目标温度相应于衬底W的特殊区域,和/或衬底台/衬底固定器的相应区域,因此相应于温度传感器读数(其内部可以使用平均读数)的特殊组。 That is, the presence of a single temperature sensor 60, the liquid supply system 400 compares this one temperature reading with a single target temperature Tt comparison, when there are a plurality of temperature sensors 60, the liquid supply system over 400 readings with a single target temperature Tt Comparison , or a plurality of target temperatures Tt compared with the target temperature corresponding to a plurality of specific regions of the substrate W and / or substrate table / substrate holder of the corresponding region, and therefore corresponds to the temperature sensor readings (within which may be used The average reading) special group. 可以参考需要校正的校准表230来控制液体的温度和/或流速,从密封构件温度的测量建立作为下列一个或多个的函数:衬底温度,加压气体流速,加压气体流温度,真空排气流速,真空排气温度,加压气体相对湿度和浸渍液体温度。 You can refer to the need to correct a calibration table 230 to control the temperature of the liquid and / or flow rate, established as a function of one or more of the sealing member from the measurement temperature: substrate temperature, pressurized gas flow rate, pressurized gas flow temperature, vacuum exhaust flow rate, vacuum exhaust temperature, pressurized gas relative humidity and immersion liquid temperature. 虽然必须承担校准测量,但是这个方法大大地减小了在运送给顾客的最终光刻设备中的结合额外功能元件的需要。 Although calibration measurements must be undertaken, but this approach greatly reduces the binding of additional functional elements in the final delivery to the customer's needs in a lithographic apparatus.

[0103] 依靠位于密封构件12中的机械装置的上述这些实施例的总的优点在于其可以在不影响衬底台WT (对于液体基的或电系统都是成立的)的动力特性的情况下实施。 [0103] The advantage of the above rely on the total of these embodiments of the sealing member 12 in its mechanical devices can not affect the dynamic characteristics of the substrate table WT (for liquid-based or electrical systems are set up) in the case of implemented. 密封构件温度条件也不仅改善了在衬底W中短期(管芯到管芯)的温度变化,也改善了从一个衬底W到下一个衬底的长期温度变化。 The sealing member has not only improved the temperature conditions of the substrate W in the short-term (die to die) temperature variations, but also improved a substrate W from the substrate to the next long-term temperature changes. 更通常地,与密封构件改善相关的开发成本(和开发时间)有可能显著低于包括衬底台WT的那些。 More generally, with the sealing member to improve the related development costs (and development time) there may be significantly lower than those comprising a substrate table WT. 除了与控制衬底台WT的动力相关的问题之外,有利于在密封构件12上而不是衬底台WT上的工作的另一因素涉及平坦需求,其对于密封构件12缓和了大约是100倍之多。 In addition to the issue and control of power-related substrate table WT is conducive to the sealing member 12 instead of the substrate table WT Another factor working on involving flat demand, which eased the sealing member 12 is about 100 times much. 这可以是很重要的,例如,沟道被机械加工到密封构件12中。 This can be very important, for example, a channel is machined into the seal member 12. 随着热交换液体的压力的变化(由于在密封构件的外表面和内沟道边缘之间残留的材料的窄的宽度的减小的硬度),靠近表面(在那里它们是最有效的)引入孔倾向于引入表面不规则(凸出部分)。 With the change of the pressure of the heat exchange fluid (due to the narrow width between the outer surface of the sealing member and the inner edge of the channel material decreases residual hardness), near the surface (where they are most effective) is introduced introducing hole inclined surface irregularities (convex portions).

[0104] 图15至18描述了包括液体运输沟道网络的设置,这次位于衬底台WT中靠近衬底W的位置。 [0104] FIG. 15-18 describes the network settings liquid transport channel comprises, located in the substrate table WT close to the substrate W in position. 设置沟道的布局以控制衬底W的温度,其可能受到来自其顶部表面的浸渍液体蒸发不利地影响。 Setting the channel to control the layout of the temperature of the substrate W, which may be impregnated with liquid from the top surface of the evaporator adversely affected.

[0105] 在本实施例中,提供用于控制热交换液体温度和流速的衬底台热交换液体控制器510,该热交换液体流过沟道网络500。 [0105] In the present embodiment, there is provided a substrate table for controlling heat exchange fluid temperature and flow rate of heat exchange fluid controller 510, the heat exchange fluid flows through the channel network 500.

[0106] 如前面实施例所述,能够提供反馈控制器从而以更有效的方式帮助控制衬底温度。 [0106] As previously described embodiments, a feedback controller can be provided so that a more efficient way to help control the substrate temperature. 在这种情况下,可以调节衬底台热交换液体的温度和/或流速,以减小在一个或更多通过局部温度传感器60的系统测量的衬底温度和/或衬底台/衬底固定器温度与目标温度Tt之间的差。 In this case, you can adjust the temperature of the substrate table heat-exchange fluid and / or flow rate, to reduce one or more systems through the substrate temperature measuring local temperature sensor 60 and / or substrate table / substrate the difference between the fixed temperature and the target temperature Tt between.

[0107] 如果局部衬底加热器,如热灯丝也被包括以实施“推挽式的”的温度控制原理,则该设置可以特别有效率地工作。 [0107] If the local substrate heater, such as hot filament temperature is also included to implement the "push-pull" control principle, the setting may be particularly efficient job. 根据这个实施例,衬底温度控制器520控制衬底加热器控制器430和衬底台热交换液体控制器510的操作。 According to this embodiment, the substrate temperature controller 520 controls the substrate heater controller 430 and the substrate table heat-exchange fluid controller 510 operation. 可以包括反馈控制器作为衬底温度控制器520的一部分,以最小化在衬底温度和目标温度Tt之间的差,其中衬底温度如通过局部温度传感器60在衬底W和/或衬底台/衬底固定器上的一个或者多个位置进行测量。 May include a feedback controller as a part of the substrate temperature controller 520, in order to minimize between the substrate and the temperature difference between the target temperature Tt, wherein the substrate temperature sensor 60, such as by local temperature of the substrate W and / or substrate a table / substrate holder or a plurality of locations on the measure. 也就是说,存在单个温度传感器60时,衬底温度控制器520把这一个温度读数与单个目标温度Tt比较。 That is, the presence of a single temperature sensor 60, the substrate temperature controller 520 compares this one temperature reading with a single target temperature Tt comparison. 当存在多个温度传感器60时,衬底温度控制器520把多个读数和单个目标温度Tt比较,或与多个目标温度Tt比较,该多个目标温度相应于例如衬底W的特殊区域,和/ 或衬底台/衬底固定器的相应区域,因此相应于温度传感器读数(其内部可以使用平均读数)的特殊组。 When there are a plurality of temperature sensors 60, the substrate temperature controller over 520 readings with a single target temperature Tt comparison or compared with a plurality of target temperatures Tt, the target temperature corresponding to a plurality of specific regions of the substrate W, e.g., and / or substrate table / holder of the corresponding region of the substrate, thus corresponding to the temperature sensor readings (within which an average reading may be used) in special groups. 可选择地,如果热流可以计算为密封构件12相对于衬底W的速度和位置的函数,则可以使用前馈回路。 Alternatively, if the heat can be calculated as the sealing member 12 with respect to the speed and position of the substrate W as a function, you can use a feed-forward loop. 根据“推挽式的”原理,热交换液体控制器510可以设置成在低于目标温度Tt的温度下提供液体,有效地起到冷却衬底W的作用。 According to "push-pull" principle, the heat exchange fluid controller 510 may be configured to provide a liquid at a temperature below the target temperature Tt, effectively it plays the role of cooling the substrate W. 可以是如上所述的电阻加热器(热灯丝)的局部衬底加热器对于突然的蒸发率的增加比热交换液体控制器反应得更快。 Can be local substrate heater resistance heater as described above (hot filament) of the increase over the sudden evaporation rate of heat exchange fluid controller reacted faster. 另外它们的反应速度通过设定热交换液体控制器的冷却作用而改善。 In addition to their speed of response is improved by setting the heat exchange cooling effect of the liquid controller. 并且,应该发生衬底温度的过调节,然后供应冷却的热交换液体,将比没有额外的冷却机械装置提供的情况更迅速地回复到平衡。 Further, the substrate temperature should overshoot occur, then cooled heat exchange fluid supply, than the case without additional cooling mechanism provided more quickly respond to the balance.

[0108] 为了机械加工的简便(在其它原因中),沟道500的网络包括基本在衬底台的平面内取向的垂直孔(其可以是钻孔的)的阵列,如图16中所述。 [0108] For simplicity machined (in other reasons), the network includes a channel 500 in a substantially vertical hole in the plane orientation of the substrate table (which may be drilled) array 16 as described in FIG. . 这些垂直孔的末端必须连接并接近不透水的。 Ends of these vertical holes must be connected and close to the water-impermeable. 这可以通过在这些孔中的插塞完成。 This can be a plug in the holes to complete. 然而,包括4mm孔和8mm节距的典型 However, including the 4mm and 8mm hole pitch typical

20的设置中,可能需要大于80个插塞。 Set 20, it may require more than 80 plug. 除了需要建立许多独立元件的这个问题之外,存在这种设置中存在产生闭塞不通的端部的可能性,其中液体完全无法到达或液体无法循环。 In addition to the need to establish many individual elements of this problem, there is such an arrangement there is a possibility of blocking barrier ends generation, in which the liquid or liquid can not be completely unable to reach the circulation. 根据本发明的实施例,通过在衬底台WT的边缘提供循环沟槽420 (如图16至18中所示)克服了这些问题,在衬底台内部所有的通孔可以整齐地连接,而没有闭塞不通的端部。 According to an embodiment of the present invention, by providing a circular groove at the edge of the substrate table WT 420 (shown in Figure 16-18) to overcome these problems, the interior of the substrate table all neatly vias can connect, and no blocking ends nowhere. 这个设置具有另一优点在于:可以使得液体更靠近衬底台WT的边缘循环。 Another advantage is that this arrangement has: a liquid can be made closer to the edge of the substrate table WT cycle. 该循环沟槽420可以使用更小数量的元件密封。 The loop trench 420 can use a smaller number of elements sealed. 在所示实施例中,使用密封环410,为了安装的简便其可以分成两个元件并通过胶或一些其他的标准粘结技术粘附到沟槽。 In the illustrated embodiment, a sealing ring 410, which is simple to install and can be divided into two components adhered to the groove by glue or some other standard bonding technique. 改善的液体分布为衬底台WT提供了更均勻和受控制的冷却,使得热量管理更有效并改善了覆盖。 Improved liquid distribution of the substrate table WT provides a more uniform and controlled cooling, so that heat management more effective and improved coverage.

[0109] 在上述实施例中,已经示出了所包括的局部衬底温度传感器60嵌入在靠近衬底W 的衬底台WT中。 [0109] In the above embodiment, it has been shown local substrate temperature sensor 60 include embedded near the substrate W in the substrate table WT. 这些传感器可以基于多个原理工作,这些原理通常以校准测量和可重复的温度相关属性(如电阻)为基础。 These sensors may be based on the principle of a plurality of work, these principles generally repeatable calibration measurements and temperature-dependent properties (e.g. resistance) basis. 虽然所示的嵌入在衬底中,局部温度传感器也可以定位在如图19中所示的密封构件12中。 Although shown embedded in the substrate, the local temperature sensor 19 may be positioned as shown in FIG. 12 in the sealing member. 由于跨过缝隙22的热连接相对较差(不像在衬底W和嵌入在衬底台WT中的传感器之间,其中更容易设置高的导热率),优选位于密封构件12内的传感器60通过分析从衬底W发射的辐射来操作。 Since the gap 22 is connected across the heat relatively poor (not embedded between the substrate W and substrate table WT in the sensor, wherein easier to set a high thermal conductivity), the sensor 12 is preferably located within the seal member 60 operate by analyzing radiation emitted from the substrate W. 根据本发明的实施例,提供这个类型的传感器60,其包括能够确定在波长范围上的俘获的辐射的强度谱的辐射俘获和分析器件。 According to an embodiment of the present invention, there is provided a sensor 60 of this type, which comprises a radiation capture can be determined in the wavelength range of the radiation intensity spectrum capture and analysis device. 通常,如果选择更广范围的波长,可以最精确地确定温度。 Typically, if you select a wider range of wavelengths that can most accurately determine the temperature. 然而,对于在本申请中的感兴趣的温度,选择包含和/或在红外辐射波段中间的受限的波长范围是节约成本的。 However, in the present application, the temperature of interest, comprising selecting and / or infrared radiation in a wavelength band in the middle of the range is limited by cost.

[0110] 图20示出了本发明的实施例,其中局部微小温度控制系统600建立在衬底台WT 中。 [0110] FIG. 20 illustrates an embodiment of the present invention, in which local small temperature control system 600 to establish the substrate table WT. 在所示的例子中,这些控制系统600定位在衬底台WT (斑点顶(burltops)640)的上升部位的顶附近,其反过来与衬底W接触。 In the example shown, the control system 600 is positioned near the top of the substrate table WT (top spot (burltops) 640) of the rising portion, which in turn in contact with the substrate W. 每个微型控制系统600包括微型温度传感器610, 其可以作为微能量集成电路温度传感器来实现,和微型加热器620,其可以作为集成电路加热器(有阻力地分散热量)来实现。 Each miniature control system 600 comprises a miniature temperature sensor 610, which can be used as micro-power integrated circuit temperature sensor to achieve, and micro-heater 620, which can be used as an integrated circuit heater (dissipating heat there is resistance to) be realized. 设置微型控制系统600以使得启动加热器元件620以当如由微型温度传感器610测量的衬底局部温度下降到预定阈值以下时发热。 Set mini-control system 600 so that the heater element 620 by the substrate when the local temperature drops as miniature temperature sensor 610 measured to a predetermined threshold value or less heat. 一旦温度升高以至于它超过了阈值,设置微型控制系统以关闭微型加热器。 Once the temperature rises so that it exceeds the threshold, set the mini-control system to turn off micro-heater. 由于控制系统600的微型尺寸和不需要分开的外部控制系统以控制加热器620,因此这个设置具有能够提供高度局域化的温度控制的优点。 Because the control system 600 miniature size and does not require a separate external control system to control the heater 620, and therefore this arrangement has the advantage to provide highly localized temperature control. 将需要仅仅两条导线(连接线630)来为在衬底台WT中的所有微型控制系统600提供电压。 Will require only two wires (cable 630) are available for all micro-control system in the substrate table WT in a voltage 600. 在斑点顶640中的微型温度传感器600的建立可以通过从硅晶片形成衬底台WT来进行。 In the top 640 spots in the establishment of micro-temperature sensor 600 may be formed by the substrate table WT from a silicon wafer to perform. 可以使用微制造技术如MEMS (微机电系统)和CMOS (互补金属氧化物半导体)技术以提供标准衬底台WT构造的完全复制,同时也在每个斑点顶640上加上集成电路温度传感器/加热器610/620,并提供将它们电连接到外部(连接630)的方法。 You can use the micro-fabrication techniques such as MEMS (microelectromechanical systems) and CMOS (complementary metal oxide semiconductor) technology to provide a complete copy of the standard substrate table WT structure, while also adding an integrated circuit temperature sensor on each of the top 640 spots / heater 610/620, and to provide a method which is electrically connected to the external (connection 630) is.

[0111] 图21描述了包括投影系统控制器710的本发明的实施例,设置以根据由温度传感器60测量的衬底和/或衬底台温度来调节已构图的辐射束的属性。 [0111] Figure 21 depicts an embodiment comprising a projection system controller 710 of the present invention, provided in accordance with the substrate and / or substrate table temperature measured by the temperature sensor 60 to adjust the patterned radiation beam properties. 在所示实施例中,多个温度传感器60嵌入在衬底台WT中。 In the illustrated embodiment, a plurality of temperature sensors 60 embedded in the substrate table WT. 然而,它也应该在本发明的范围内,以在别处提供温度传感器,例如在密封构件12内,和/或仅仅提供单个温度传感器。 However, it should also be within the scope of the present invention to provide temperature sensors elsewhere, such as in the sealing member 12, and / or to provide only a single temperature sensor.

[0112] 如上所述,在衬底W上的浸渍液体的蒸发可以导致衬底冷却,所得的形变导致覆盖误差,散焦,色差等。 [0112] As described above, evaporation of immersion liquid on the substrate W can lead to substrate cooling, the resulting deformation leads to overlay errors, defocus, color and so on. 根据本实施例,投影系统控制器710能够调节已构图的投影束的参数,如它的整体缩放比例,定位偏移量等,以对衬底W的热感应形变进行补偿。 According to this embodiment, the projection system controller 710 can adjust the parameters of the patterned projection beam, such as its overall scaling, offset positioning, in order to thermally induced deformation of the substrate W to compensate. 作为简单的例子,如果投影系统控制器710接收来自温度传感器60的输入,表明衬底W在第一近似下均勻地在目标温度下,可以配置以通过因子缩放已构图的投影束,以减小在冷却的衬底W As a simple example, if the projection system controller 710 receives an input from the temperature sensor 60, indicates that the substrate W in a first approximation, uniformly at a target temperature, the scaling factor can be configured by the patterned projection beam, to reduce the The cooled substrate W

21上产生的图像尺寸。 21 resulting image size. 衬底W和/或衬底台WT的温度通过多个温度传感器60测量以获得温度曲线时,为了减小误差如层叠误差,散焦和色差,可以通过投影系统控制器710进行更复杂的修正。 The substrate W and / or substrate table WT temperature measured by the plurality of temperature sensors 60 to obtain a temperature profile, in order to reduce errors such as errors laminated, and the color difference defocusing, the projection system controller 710 may be a more complex correction . 这个方法对响应温度的突然改变提供了快速的方法,而不需要在密封构件12或衬底台WT中结合加热元件,其执行和/或与衬底台WT的动态性能干扰是昂贵的。 This method of response to sudden changes in temperature provides a quick way, without the need to combine the heating element in the sealing member 12 or the substrate table WT in its implementation and / or interference with the dynamic performance of the substrate table WT is expensive. 补偿的这个形式具有不需要依赖特殊的冷却机制工作的附加优点,并且可应用于在由于除了浸渍液体蒸发之外的处理对衬底W温度的改变起到了至少一定作用的情况。 This form of compensation has the added advantage of not requiring special cooling mechanism dependent on the work, and can be applied in the case due to the evaporation of the immersion liquid outside except handling of the temperature change of the substrate W has played at least some role.

[0113] 在图21中所示的实施例中,也提供了热感应形变校准器以把从温度传感器60得到的读数传送到衬底W的预计形变。 [0113] In the embodiment shown in FIG. 21, the thermally-induced deformation is also provided to the calibrator obtained from the temperature sensor 60 is transferred to the substrate W readings expected deformation. 这通过首先导出衬底W的温度曲线,然后利用已知的衬底W的例如衬底材料的热膨胀系数的热属性来得到以计算热感应形变。 This is accomplished by first export of the temperature profile of the substrate W, the substrate W and then using the known thermal properties such as coefficient of thermal expansion of the substrate material obtained to calculate the thermally-induced deformation. 对于第一近似, 衬底W部分的相对形变与该部分的温度和参考操作温度(与零相对形变对应)之间的温度差成正比。 For a first approximation, the relative deformation of the substrate W portion and the temperature of the portion and the reference operating temperature (corresponding to zero relative deformation) is proportional to the temperature difference between. 在所示实施例中,温度传感器60嵌入在衬底台WT中,以使得需要进行另外的校准以从温度传感器读数中导出衬底温度曲线。 In the illustrated embodiment, the temperature sensor 60 is embedded in the substrate table WT, such that the need for additional calibration to derive the substrate temperature profile from the temperature sensor readings. 在下面的这个和本发明的其它实施例描述了这个可以怎样得到。 In the following this and other embodiments of the present invention describes how this can get.

[0114] 根据上述的几个实施例衬底W的温度测量通过定位在衬底台WT中的温度传感器60确定。 [0114] Examples of temperature measurement is determined by positioning the substrate W in the substrate table WT temperature sensor 60 according to the above several embodiments. 因为对于定位传感器存在相对大的空间,这个设置具有结构上的优点,它们可以坚固而精确地定位,并且它们可以通过任何需要的电连接更容易地工作。 Because for a relatively large space positioning sensor exists, this arrangement has the advantage on the structure, they may firmly and accurately positioned, and they can be more easily connected to any electrical work required. 如前面所讨论的,在距离在衬底台WT中的衬底W的距离定位传感器也为每个传感器60采用更大的衬底区域提供了有效的手段。 As previously discussed, the distance of the substrate table WT the substrate W is positioned a distance sensor 60 for each sensor using a larger area of the substrate provides an effective means. 然而,应当理解直接在温度传感器60周围的材料的温度可以给出衬底W 温度的近似值,有可能通过下述的进一步分析得到衬底温度曲线的更加精确的图。 However, it should be understood that the temperature sensor 60 directly at the material surrounding the temperature of the substrate W can be given approximation, it is possible to obtain further analysis by following more precise temperature profile of the substrate in FIG. 这个分析可以作为任何上述的实施例的一部分实施,该实施例包括位于衬底台WT内的温度传感器60。 This analysis can be implemented as part of any of the above embodiments, the temperature sensor 60 includes a substrate table WT cases within this embodiment.

[0115] 假定从衬底表面到其中具有温度传感器60的衬底台WT中的水平面的热传输可以被描述为: [0115] assumed to have a temperature sensor 60 from the substrate surface to which the substrate table WT horizontal heat transport can be described as:

[0116] Zhuck - α = /(Δ Tsuhln"), [0116] Zhuck - α = / (Δ Tsuhln "),

[0117] 其中,7:^是衬底W的初始温度,是由嵌入到衬底台WT中的传感器60所测量的衬底的区域的当前温度,而ATsubsteate是用于正在讨论的区域的衬底级别处的温度差。 [0117] wherein, 7: ^ is the initial temperature of the substrate W, the current temperature is embedded in the region from the substrate table WT measured by the sensor 60 of the substrate, while the substrate region is used ATsubsteate being discussed temperature difference at the bottom level. 在该关系的基础上可以得到作为一个整体(如果需要)的衬底区域温度和用于衬底的温度曲线。 On the basis of this relationship can be used as a whole (if needed) a substrate zone temperature and temperature profile for the substrate. 例如,可以使用下面的模型: For example, you can use the following model:

[0118] [01]

[0119] 其后跟随着: [0119] followed with:

[0120] ΔTtubsln" = -τΙη((Τ:Μ - J^inl)/k), [0120] ΔTtubsln "= -τΙη ((Τ: Μ - J ^ inl) / k),

[0121] 其提供了用于在仅仅基于参数τ和k的衬底级别处的温度差的表达,其反过来能从测试数据估计。 [0121] it provides an expression only at the level of the substrate temperature parameters τ and k is used based on the difference, which in turn is estimated from test data.

[0122] 可以使用类似的分析以从红外温度传感信号导出衬底温度的更好的测量。 [0122] A similar analysis can be used to derive the substrate temperature of the infrared temperature sensor signal from a better measurement. 这里, 问题是硅(其经常用作衬底材料)对于红外线是透明的,因此定位在在衬底W上“往下看” 的密封构件12中的红外传感器将会收到从衬底W和直接在它下面的衬底台WT发出的辐射的混合。 Here, the problem is silicon (which is often used as a substrate material) is transparent to infrared so positioned in 12 infrared sensors on the substrate W "look down" of the sealing member will receive from the substrate W and Radiation hybrid in its underlying substrate table WT emitted directly.

[0123] 如上所述,由于密封构件12相对于衬底W移动,在密封构件12的尾迹中,在衬底W 的顶部表面上会留下液体的薄膜。 [0123] As described above, since the sealing member 12 to move relative to the substrate W in the wake of the seal member 12, on the top surface of the substrate W will leave a thin film of the liquid. 如果不采取足够有效的措施,这些液体的蒸发会从衬底 If you do not take sufficiently effective measures, these liquids will evaporate from the substrate

22W和和/或衬底台WT抽取热量。 22W and and / or substrate table WT extract heat. 获得的在衬底W和/或衬底台WT的温度中的降低能导致收缩,其反过来会导致覆盖误差,要生产的集成电路的性能/分辨率/或和产量的损失的总的损失。 Obtain the substrate W and / or reduce the temperature of the substrate table WT can lead to contraction, which in turn will lead to coverage error, the total loss to the production of integrated circuits loss of performance / resolution / or and Yield . 以上讨论了对这个问题的几个解决方法,包括提供衬底加热沟道网络和/或独立控制的电加热器的阵列。 We discussed above on several solutions to this problem, including providing a substrate heating channel network and / or an array of electrical heaters controlled independently. 然而,以热量仅仅在发生蒸发的地方产生的这种方式调整这些加热机械装置的操作是很困难的。 However, this occurs only way to heat generated by the evaporation of the local heating mechanism to adjust these operations are very difficult. 因此,很难确保在衬底W内的温度梯度是最小化的。 Therefore, it is difficult to ensure that the temperature gradient within the substrate W is minimized.

[0124] 根据本发明的实施例,提供具有使用微波辐射加热残留在密封构件12的尾迹中的浸渍液体的装置的光刻设备。 [0124] According to an embodiment of the present invention, there is provided with the use of microwave radiation residual immersion liquid in the wake of the sealing member 12 in the lithographic apparatus device. 微波辐射的频率可调以主要直接加热浸渍液体,而不与周围设备的元件(如衬底台WT,衬底W,密封构件12等)耦合。 Adjustable frequency microwave radiation to heat the immersion liquid directly to the main, but not the surrounding equipment and components (e.g., the substrate table WT, substrate W, seal member 12, etc.) is coupled. 因此发热量能直接精确地施加到需要的地方,而温度梯度能够被最小化。 Therefore, the heat can be precisely applied directly to where it is needed, while the temperature gradient can be minimized. 大体上,需要蒸发液体的热量可以完全由微波源提供,以使得不从衬底W吸取热量。 In general, the heat required evaporation of the liquid can be completely provided by the microwave source, so as not to absorb heat from the substrate W.

[0125] 图22示出了示例设置,包括微波源800,设置以提供用于加热使用的浸渍液体的微波辐射,和微波容器罩810,设计以在感兴趣的区域内包含微波辐射(对于保护区域,例如浸渍液体容器25,在那里加热是不期望的)。 [0125] FIG. 22 shows an example of settings, including the microwave source 800, arranged to provide the immersion liquid used for heating the microwave radiation, and microwave vessel cover 810, in the region designed to contain the microwave radiation of interest (for protection region, for example, immersion liquid container 25, where heating is not desirable). 在所示的实施例中,感兴趣的区域基本覆盖了在密封构件12周围的衬底W的环形区域。 In the illustrated embodiment, the region of interest covering substantially annular region of the substrate W at 12 around the seal member. 在密封构件12相对于衬底台WT移动得足够远以便该液体将会留在暴露在微波下的区域之前,可以选择由微波容器罩810覆盖的区域尺寸足够大,以至于微波辐射能完全蒸发在密封构件12的尾迹中残留的浸渍液体。 In the sealing member 12 with respect to the substrate table WT move far enough so that the liquid will remain in the microwave before exposure area, the size of the region can be selected by a microwave vessel cover 810 covering large enough that the microwave radiation is completely evaporated at the end of the sealing member 12 remaining trace immersion liquid. 微波容器罩810的尺寸将会因此是保留在容器罩810中的微波辐射强度、密封构件12通过衬底台WT的速度和期望残留在密封构件12的尾迹中的液体量的函数。 Microwave vessel 810 will thus cover the size of the microwave radiation intensity is in the container cover 810, the sealing member 12 through the substrate table WT and the desired speed remains in the wake of the seal member 12 is a function of the amount of liquid retained.

[0126] 微波容器罩810可以由金属材料形成,具有确保微波的基本全反射的适合尺寸的开口。 [0126] microwave vessel cover 810 may be formed of a metal material, to ensure substantially totally reflected microwaves having suitable size openings. 在微波容器罩810内的微波辐射的传播由箭头830示意性示出。 Microwave propagation in the microwave containment cage 810 radiated by arrow 830 schematically shown. 可以在校准测量的基础上选择微波源800的功率,其确定在衬底上残留的液体被加热的速率。 Microwave source can be selected on the basis of calibration measurements of power 800, which determines the liquid remaining on the substrate was heated at a rate. 例如,为了确定哪个电源导致最小的覆盖误差,对许多不同的微波源功率进行了测试。 For example, to determine which power leads to a minimum overlay error, for many different microwave source power were tested. 可选择地,可以提供温度传感器60并经过数据连接850结合到反馈回路中。 Alternatively, the temperature sensor 60 may be provided via a data connection 850 and coupled to the feedback loop. 当密封构件12的速度随着时间改变和/或当从密封构件12逃出的浸渍液体的量改变时这个设置是有优势的。 When the speed of the sealing member 12 to change over time and / or when changing the amount of the seal member 12 from the immersion liquid to escape this setting is advantageous. 当微波加热装置结合其他温度补偿方法使用时,反馈机制也是有用的,其有效地随着时间改变。 When the microwave heating apparatus used in combination with other temperature compensation methods, the feedback mechanism is also useful, which effectively changes over time. 如上所述地反馈设置中,这里的反馈回路可以包括调节微波源800的功率,以便由温度传感器60测量的温度朝一个或多个目标温度聚合。 Feedback provided as described above, the feedback loop here may include adjusting the power of the microwave source 800, so that the temperature measured by the temperature sensor 60 in one or more of the target temperature of the polymerization. 可以预计,微波源800将会发射微波波长辐射。 It is expected that the microwave source 800 will emit microwave wavelength radiation. 然而,如果最有效地耦合所使用的浸渍液体的辐射的波长正好在与微波有关的通常波长范围之外,则可以理解,源800适合于发射适当波长的辐射(例如在红外或者可见光中)。 However, if the most efficient use of the radiation coupling of the immersion liquid and microwave wavelengths just beyond the wavelength range normally associated, is to be understood that the source 800 adapted to emit radiation of suitable wavelength (e.g. infrared or visible light in).

[0127] 图23示出了根据在衬底温度中的空间变化能够调节热量输出的空间变化,而不需要温度传感器和/或外部控制系统的复杂设置的衬底加热器设置。 [0127] FIG. 23 illustrates a spatial variation in substrate temperature can be adjusted in the heat output space changes, without the need for a temperature sensor and / or a substrate heater disposed complex set of external control system. 这可以通过形成靠近衬底台WT表面的导电带900而实现,与衬底W有良好的热接触。 This can be formed by a conductive surface near the substrate table WT is realized with 900, and the substrate W has a good thermal contact. 例如,导电带900可以通过在衬底台WT的顶表面上涂敷导电材料而形成。 For example, the strap 900 may be coated on the top surface of the substrate table WT conductive material is formed. 在所示的实施例中,提供外部电流源920(未示出),以使得相等的电流910经过每个导电带900。 In the illustrated embodiment, there is provided an external current source 920 (not shown), so that equal current through each conductive strip 910 900. 根据第一变化,提供相同电流经过每个导电带900的单个电流源920。 According to the first change, provide the same current flows through each of the conductive single current source 900 of 920 bands. 可选择地,可以提供多个电流源920,设置其以使得不同的电流经过导电带900。 Alternatively, it is possible to provide a plurality of current source 920, which provided so that different currents through the electrically conductive strip 900. 在另一种情况下,经过每个导电带的电流保持恒定,以使得单位长度的电阻发热产生的热率仅仅依赖于形成导电带900的材料的局部电阻。 In another case, the current through each of the conductive strip is held constant, so that the thermal resistance of the heat generating rate per unit length produced depends only on the formation of local resistive material 900 of the conductive strips. 根据本实施例,选择的材料具有负温度相关性(即温度的增加导致电阻减小),优选具有强烈的负温度相关性,以使得在每个导电带900的较冷区域(其具有较高的电阻)中产生比相对较热的区域中产生明显更多的热量。 According to this embodiment, the material chosen has a negative temperature dependency (i.e., increase in temperature leads to decrease resistance), preferably with a strong negative temperature dependence, such that each of the conductive tape cooler region 900 (which has a higher the resistance) is generated to produce significantly more calories than a relatively hot region. 在这种情况下,更多的热量自然地导入到那些最需要加热的区域,因此减小了温度梯度。 In this case, more heat is naturally introduced into those areas most in need of heating, thus reducing temperature gradients. 特别地,可以改变电流910直到在更冷区域和更热区域之间的发热量的差基本补偿了由在衬底W的表面上的液体蒸发带走的热量(其如上所述,期望对衬底温度的非均勻性作出了主要贡献)。 In particular, you can change the current 910 poor heat until colder regions and hotter regions substantially compensated by the liquid on the surface of the substrate W of the evaporation heat away (which as described above, it is desirable for lining Non-uniformity of the temperature of the bottom made a major contribution). 在导电带中的一个的任何给定段产生的热量期望与由电流乘以该段的电阻的平方成正比。 Any proportional to the square in the conduction band of a desired amount of heat generated in a given segment and the segment is multiplied by the current resistance.

[0128] 在上述实施例中,直接使用导电带900的温度相关电阻率以提供温度相关衬底, 该衬底通过使用本身作为加热器的导电带加热。 [0128] In the above embodiment, the direct use of temperature dependent resistivity of the conductive tape 900 to provide temperature dependent substrate, the substrate itself is heated by the heater as the conductive tape used. 根据本发明的可选择的实施例,可以使用导电带900作为温度传感器,可以与他们作为加热元件的功能相结合。 According to an alternate embodiment of the present invention, the conductive strip 900 can be used as a temperature sensor, and they function as a heating element combined. 图24示出了根据这个实施例的设置。 Figure 24 shows an arrangement according to this embodiment. 再一次,电流910经过导电带900,其设置成具有温度相关电阻率。 Again, the current 910 through the conductive tape 900, arranged to have a temperature dependent resistivity. 优选地,如前所述,温度相关电阻是强烈负的,但较弱的温度相关和/或正的温度相关也是可以容忍的。 Preferably, as described above, the temperature dependent resistor is strongly negative, but a weaker temperature dependence and / or a positive temperature dependence is tolerable. 根据这个实施例,提供分开的局部衬底加热器930,其通过局域化的电源/放大器950为每一个提供能量。 According to this embodiment, separate local substrate heater 930, through which the localized power / amplifier 950 provided for each energy. 供给每个衬底加热器930的电源通过参考在导电带900的段中的局部电阻率的测量来控制,该导电带900最靠近讨论中的衬底加热器930。 Supply power to each substrate heater 930 by reference in section 900 of the conductive tape measure in the local resistivity to control the conduction band 900 closest to the discussion of the substrate heater 930. 例如可以通过测量在最近的一对电极940之间的电势差而得到这个,如图24中所示。 For example, by measuring between a pair of electrodes 940 closest to the electrical potential difference and get this, shown in Figure 24. 如前所述,导电带900的局部电阻率是局部温度的函数。 As mentioned earlier, local resistivity conductive strips 900 is a partial function of temperature.

[0129] 可以使用校准测量以确定在电阻率和衬底W的局部温度之间的关系,可以设置电源/放大器950以在测量的电阻率和与所希望温度对应的电阻率之间的差别的基础上调节衬底加热器930的功率。 [0129] calibration measurement can be used to determine the relationship between the resistivity and the local temperature of the substrate W, you can set the power / amplifier 950 to the resistivity measurements and a corresponding difference in temperature between the resistivity desired adjust the substrate heater 930 on the basis of power.

[0130] 上述设置具有不被导电带900的电阻率的温度相关性的强度限制的优点,并能够主要提供更强烈的空间相关加热能量给衬底W。 [0130] above arrangement has the advantage of not being the resistivity of the conduction band 900 of the temperature dependence of the strength limit, and can provide a more intense major space-related heating energy to the substrate W. 提供大量成对的电源/放大器950和衬底加热器930允许高的空间分辨率。 Provide a large number of pairs of power supply / amplifier 950 and the substrate heater 930 allows a high spatial resolution. 另外,因为提供给衬底加热器930的加热能量通过导电带900段附近的电阻率的简单测量确定,对于在衬底台不需要平面处的复杂且庞大电子设备或是外部提供的复杂控制电子设备。 Further, since the heating energy supplied to the substrate heater 930 with a simple measurement of the resistivity near the segment 900 is determined by the conductivity, it is not required for the substrate table in the complex plane of the large and complex control electronics provided externally or electronic equipment. 由电源/放大器950提供的放大因子(或放大函数:描述局部加热器功率应该怎样随着从所希望温度的偏移量变化而变化)可以参考校准测量预先被确定,并能在硬件上提供。 Amplification factor provided by the power supply / amplifier 950 (or zoom function: With how the local heater power should be from the desired temperature change offset changes described below) can be determined in advance with reference to calibration measurements and provides the hardware.

[0131] 图25示出了本发明的实施例,其中衬底W由感应加热器加热。 [0131] FIG. 25 illustrates an embodiment of the present invention, in which the substrate W is heated by an induction heater. 这个方法具有主要在需要加热的地方提供加热的优点(例如在密封构件12的周围)。 This method needs to be heated with mainly provides the advantage of local heating (e.g., the periphery of the sealing member 12). 感应源960启动以通过与形成在衬底台WT内部的感应元件970耦合来提供感应加热能量,并优选处于能与衬底W良好热接触的位置。 Sensor 970 is coupled to source 960 starts with the sensing element is formed inside the substrate table WT to provide induction heating power, and preferably at a position in contact with the substrate W can be good heat. 感应源960的功率输出反过来被感应控制器980控制。 Inductive source power output 960 of the controller 980 in turn is induced control. 感应控制器980可以根据预先设定的路线改变感应源960的能量(例如,为了主要加热密封构件12最近通过其上的衬底W的区域)。 Inductive sensor controller 980 may change the source of energy in accordance with a preset route 960 (for example, to the main heat sealing member 12 through the region recently on which the substrate W). 可以提供多个空间分开的感应源和/或元件:例如,每个可配置以提供相同或不同的加热量,以便可以以减小温度梯度的方式为衬底W提供热量。 It may be provided a plurality of spatially separated induction sources and / or elements: for example, each configurable to provide the same or a different amount of heat, so as to reduce the temperature gradient can be provided to heat the substrate W. 可选择地,感应控制器980可以使用反馈模型。 Alternatively, the sensor controller 980 may use feedback model. 这可以配置以改变感应源960的输出功率,以使得由一个或多个温度传感器60所测量的温度与一个或多个对应的目标温度会聚。 This sensor can be configured to vary the output power source 960, such that one or more temperature sensors 60 measure temperature and one or more corresponding target temperatures convergence. 加热衬底台WT的感应加热的使用具有另外的优点,其在于仅仅需要对衬底台WT (例如加入感应元件970)作少量的改变。 Using induction heating to heat the substrate table WT has the further advantage that it requires only the substrate table WT (such as adding the induction element 970) for a small amount of change. 因此,衬底台WT的机械操作不会被显著地干扰。 Therefore, the mechanical operation of the substrate table WT is not significantly disturbed. 感应源960从感应元件970机械分离的事实是有优势的,也从可升级性来说:每个元件在较大程度上适合于独立于其他元件。 Induction source 960 from the fact that mechanical separation induction element 970 is advantageous, but also for the scalability: Each element is adapted to a large extent independent of the other elements.

[0132] 如上所述,减小由浸渍液体从衬底W表面蒸发引起的冷却的一个方法,是为气体密封27提供潮湿气体(潮湿气体在广义上理解为包含很大一部分以蒸汽形式存在的浸渍液体的气体)。 [0132] As described above, the immersion liquid is reduced by the method of cooling the surface of the substrate W caused by the evaporation, the gas seal 27 is provided for the moist gas (wet gas understood in a broad sense to include a large part in the form of steam the gas immersion liquid). 在衬底W上的气体包含更高比例的浸渍液体蒸汽,在从衬底W的液体蒸发和液体蒸汽凝结到衬底W之间建立了动态平衡,以至于净蒸发率低于如果在衬底W上方的气体是干燥的情况(即不包含任何大量的浸渍液体蒸汽)。 Gas on the substrate W contains a higher proportion of immersion liquid vapor from the substrate W in the liquid evaporates and the liquid vapor condenses to establish a dynamic equilibrium between the substrate W, so that the net evaporation rate is lower than if the substrate W is the gas above the dry conditions (i.e., does not contain any large amount of immersion liquid vapor). 为了这个机制以可重复和恒定的方式工作,有必要为使得供应到气体密封27的气体潮湿提供可靠的方法。 For this mechanism to be repeated and constant manner, so that it is necessary for the gas supplied to the gas seal 27 provides a reliable method for wet. 根据实施例, 如在图26中示意性所示,为了这个目的提供了增湿部件1000。 According to the embodiment, as schematically shown in FIG. 26, it is provided for this purpose humidifying member 1000. 气体从干净气体源(例如) 经过导管1005到蒸发容器1010输入到增湿部件1000中。 Clean gas from the gas source (for example) through conduit 1005 to evaporation vessel 1010 is input to the humidification unit 1000. 蒸发容器1010包括内部加热元件,为了产生浸渍液体蒸汽该内部加热元件加热一个或者多个浸渍液体容器。 Evaporation vessel 1010 comprises internal heating elements, in order to produce immersion liquid vapor heating the inner heating element is impregnated with one or more liquid containers. 由此产生的浸渍液体蒸汽与经过导管1005提供的干净气体混合,并从蒸发容器1010经过导管1015输出。 Impregnating the resulting liquid vapor is mixed with a clean gas supplied through conduit 1005 and 1010 from the evaporation vessel through conduit 1015 output. 部分饱和的气体然后输入到凝结容器1020中(也称作“冷却容器”),其中它冷却到气体和浸渍液体蒸汽的混合物达到过饱和并且浸渍液体从混合物中凝结出来的程度。 Partially saturated gas is then input to condensation vessel 1020 (also referred to as "cooling vessel"), in which it is cooled to a gas and immersion liquid vapor mixture to reach the degree of supersaturation and immersion liquid condenses out from the mixture. 以气体形式残留的是在凝结容器1020的工作温度下非常接近或正好100%饱和的浸渍液体蒸汽。 The residue is in gaseous form at the operating temperature of the condensation vessel 1020 is very close to or exactly 100% saturated with immersion liquid vapor. 这个100 %的饱和气体供应然后经过导管1025输入到混合室1040中,在这里它可以与以控制的比例从干燥气体源1030经导管1035输入的干燥气体源混合,以便使得输出气体经过导管1045以控制的温度和/或控制的饱和度输出,例如其可以然后供应给气体密封27。 This 100% saturated gas supply conduit 1025 and then after 1040 entered into a mixing chamber, where it can be mixed with the gas source dried to proportional control from the drying gas source 1030 through conduit 1035 input so that the output of gas through conduit 1045 to temperature and / or saturation of the control of the output control, for example, which can then be supplied to the gas seal 27.

[0133] 用于增湿气体的可选择的系统是将它通过所谓的起泡器,其是浸渍在包含液体和液体蒸汽的容器中的多孔器件。 [0133] Alternatively a system for humidifying the gas is through the so-called bubbler, which is immersed in a vessel containing liquid and liquid vapor porous device. 随着它的通过气体变得逐渐的饱和。 Through the gas as it becomes increasingly saturated. 在这个设置中控制产生的气体的饱和度或湿度是困难的。 In this setup controls produce saturation or humidity of the gas is difficult. 流速、容器温度或液面的变化都会影响离开该系统的气体中保留的液体蒸汽的量。 The amount of liquid vapor changes will affect gas flow rates, temperature or liquid container leaves the system reserved. 特别地,使用这个方法很难达到100%饱和。 In particular, the use of this method difficult to achieve 100% saturation. 优化这样系统的性能可以得到相对复杂的装置设计,例如保证在液体和气体之间的足够和可重复的接触。 Performance optimization of such a system can be relatively complex device design, such as to ensure adequate and reproducible contact between liquid and gas.

[0134] 如上所述,从衬底W的浸渍液体的蒸发对于光刻设备的性能有不利效果。 [0134] As described above, the substrate W from the evaporation of immersion liquid for the performance of the lithographic apparatus have an adverse effect. 在液体中的污染可以导致衬底W上的颗粒污染(也称作水污染)。 Contamination in the liquid may cause particle contamination on the substrate W (also called water pollution). 因为冷却效应,蒸发也可以不利地影响覆盖性能、聚焦和光学性能。 Because the cooling effect, can also adversely affect the evaporation coverage performance, focus and optical performance. 可以使用在气体密封27中的增湿气体以最小化蒸发。 It can be used in the gas seal 27 humidified gas to minimize evaporation. 根据一个方法,需要100%的饱和气体以达到从衬底W的表面的零净蒸发。 According to one method, a 100% saturated gas in order to achieve zero net evaporation from the surface of the substrate W. 上面已经讨论了以可控制的方式产生100%饱和气体的实施例。 As already discussed in a controlled manner to produce 100% saturated gas embodiments. 然而,由于气体地膨胀,随着它从气体密封27输出,气体的相对湿度不可避免地降低了。 However, since the gas expands, as it is output from the gas seal 27, the relative humidity of the gas inevitably reduced. 实际上,这可以意味着当气体在衬底W的工作温度导出时(例如22C ),接近使用最大可达到的湿度可以基本低于100%,例如约60%。 In practice, this may mean that when the gas in the working temperature of the substrate W derived (eg 22 C), close to the maximum achievable humidity may be substantially less than 100%, for example about 60%. 如果小于100%相对湿度的气体保留在衬底表面上方,就会发生一定程度的净蒸发。 If the gas is less than 100% relative humidity retained over the substrate surface, the net evaporation will occur to some extent.

[0135] 根据在图27中简要说明的实施例,在气体离开气体密封27并已经膨胀后,气体的湿度通过增加供应到气体密封的气体的温度来被控制。 [0135] According to the embodiment in FIG. 27 briefly described, after leaving the gas in the gas seal 27 and has expanded, the humidity of the gas is controlled by increasing the temperature of the gas supplied to the gas seal.

[0136] 在这种情况下,离开气体密封27的热气体突然暴露在更低温度的环境中(即光刻设备的正常工作温度)并冷却。 [0136] In this case, the hot gas leaving the gas seal 27 is suddenly exposed to an environment at a lower temperature (i.e. the normal operating temperature of the lithographic apparatus) and cools. 冷却倾向于增加饱和度或相对湿度。 Cooling tends to increase the saturation or relative humidity. 可以控制整体温度下降以对气体的膨胀和饱和率的相关减小作出补偿。 You can control the overall temperature is lowered to reduce correlation to the expansion and saturation rate of the gas to make compensation.

[0137] 对于保持在22C的工作温度并具有供应到气体密封27的接近饱和(例如90-100%的相对湿度)的气体的典型系统,典型的密封构件压力下降0. 4巴,在1和5K之间的温度偏移量对于在气体密封27外残留在衬底W上方的气体中保持接近100%的相对湿度是足够的。 [0137] For maintaining the operating temperature of 22 C and is supplied to the gas seal 27 having a nearly saturated (e.g., 90 to 100% relative humidity) for a typical gas system, a typical seal member pressure drop of 0.4 bar, in temperature offset between 1 and 5K for the outer gas seal 27 remains in the gas above the substrate W held close to 100% relative humidity is sufficient. 需要对系统认真的设计以在气体离开气体密封27之前阻止高度饱和的气体的凝结。 Careful design of the system needs to before leaving the gas seal 27 in gas to prevent condensation of highly saturated gas. 例如,经过密封构件12导引到气体密封27的导管壁应当是热绝缘的,以把热气体与冷却的密封构件12隔开并防止在导管壁上凝结。 For example, after the seal member 12 guide to the gas seal 27 of the catheter wall should be thermally insulated to the hot gas and the cooling of the sealing member 12 in the catheter wall spaced from and prevent condensation. [0138] 图27,如上所述,示出了用于控制供应到气体密封27的气体温度的设置,其可以位于例如在增湿部件1000和气体密封27之间。 [0138] FIG. 27, as described above, is shown for controlling the supply of gas to the temperature of the gas seal 27 is provided, for example, which may be located in a humidified gas sealing member between 1000 and 27. 相关的冷却饱和气体通过导管1045供应到热交换器1100,其通过由加热器1110提供的热交换液体的热交换来加热饱和气体到目标温度。 Related cooled saturated gas is supplied to the heat exchanger 1045 through conduit 1100, which is heated to a target temperature of the saturated gas by heat exchange heater 1110 provided by the heat exchange fluid. 加热器1110在温度Tl下通过输入线1120提供热交换液体,并在温度T2下接收经过输入管1130的热交换液体,其中Tl大于T2。 A heater at a temperature of 1110 Tl 1120 provides heat exchange fluid via input line, and at a temperature T2 receiver 1130 via inlet tube heat exchange fluid, wherein Tl is greater than T2. 例如,加热器1110可以通过Peltier加热器对热交换液体加热。 For example, the heater 1110 by Peltier heater for heating the heat exchange fluid. 根据示例设置,提供Peltier加热器,其工作在500瓦至1500瓦的范围内以产生温度控制在27C设定点精确到士0.01C的水。 According to the example set, providing Peltier heater in the range of 500 watts to 1500 watts to produce temperature control at 27 C set point accuracy of 0.01 C water with disabilities.

[0139] 根据在图28中简要描述的本发明的实施例,使用增湿柜1200产生潮湿气体的高纯气流,其中几个平行的蒸发单元1220用来蒸发液体。 [0139] According to the embodiment in FIG. 28, a brief description of the present invention, using a humidifier cabinet 1200 produce moist gas stream of high purity, in which several evaporating units 1220 in parallel to the evaporative liquid. 产生的潮湿气体的温度通过由导管1205为每个蒸发器1220提供温度受控制的热交换液体流而被控制。 Temperature wet gas generated by each of the evaporator 1220 to provide temperature controlled heat exchange fluid flow is controlled by the catheter 1205. 可以通过热交换液体源1110提供热交换液体,也可以使用它以控制在如上所述的供给气体密封27之前的饱和气体的温度。 Provides heat exchange fluid through the heat exchange fluid source 1110, also can use it to control the supply of gas as described above, saturated gas 27 before sealing temperature. 可选择地,可以提供分开的热交换液体源。 Alternatively, it is possible to provide a separate source of heat exchange fluid. 在经过热交换器1100到达密封构件27之前,湿度和温度受控制的气体经过憎水过滤器1210到达输出阀1250。 Prior to 1100 through the heat exchanger reaches the sealing member 27, the gas humidity and temperature controlled through a hydrophobic filter 1210 to the output valve 1250.

[0140] 改变或甚至停止来自增湿柜1200的潮湿气流改变了平衡,在潮湿气流以良好地受控温度和饱和度再次供应到气体密封27之前,可能需要很长的稳定时间。 [0140] change or even stop moist air from a humidifier cabinet 1200 changed the balance in the moist air to well controlled temperature and saturation before re-supplied to the gas seal 27, it may take a long time to stabilize. 然而,由于由密封构件12和气体密封27实施的任务的动态特性,气体密封27需要的气体速率可以相当大地随着时间变化:例如,可能短时间内存在气体密封27不工作的情况。 However, since the sealing member 12 and by a gas seal 27 of the embodiment of the dynamic characteristics of the task, the gas seal 27 requires a gas rate can change considerably with time: for example, the presence of the gas seal 27 may not work in a short time. 除了调节系统使得它能更快速稳定之外,其需要牢固且复杂的额外装置,本实施例包括可变的通风系统1240,其允许气体以可控制速率通风到外部容器或排出。 In addition to regulating the system so that it is more stable than the fast, which requires strong and complex additional apparatus, the present embodiment includes a variable vent system 1240 which allows gas to vent to the outside of the container at a controlled rate, or discharge. 该通风系统1240可以设置以使得从增湿柜1200的流速保持恒定。 The ventilation system can be set up in 1240 so as to maintain a constant flow rate of the humidifier cabinet from 1200. 这实际上通过确保经过主阀1250和通风系统1240的总的流速保持恒定可以实现。 This effectively by ensuring that the total flow rate through the main valve 1250 and 1240 remains constant ventilation system can be achieved. 这可以通过设置通风系统1240以具有对应于压力计1230的读数的流动阻抗而实施,其相应于由增湿柜1200 “感觉”的背压。 This can be provided with a ventilation system 1240 to 1230 corresponding to the pressure gauge reading of flow impedance and implementation, which corresponds to the humidifier cabinet 1200 "feel" of back pressure. 特别的,这个压力应该保持恒定。 In particular, this pressure should be kept constant. 因为可以避免对在不同的气体密封27的操作阶段之间的稳定时间的需要,所以这个设置不仅仅提供了更好的稳定性,也提供了更高生产量。 It avoided because of settling time at different stages of operation of the gas seal 27 between the needs, so this set not only provides a better stability, but also provides higher productivity.

[0141] 所有以上的特点能以任何组合结合,并能应用到与包括在上面的背景技术部分提到的那些的所有类型的液体供应系统相关的地方。 [0141] All of the above features can be combined in any combination, and can be applied to those included in all types of liquid supply systems mentioned in the background section above related to the place.

[0142] 虽然在本文中作出了对在IC制造中光刻设备使用的具体描述,但是应该理解这里描述的光刻设备可以具有其他应用,如集成光学系统的制造,用于磁领域存储器的图案的引导和检测,平板显示器,液晶显示器(LCD),薄膜磁头等。 [0142] Although made in the detailed description of the use of lithographic apparatus in the manufacture of IC's, it should be understood that the lithographic apparatus described herein may have other applications, such as the manufacture of integrated optical systems, patterns for magnetic field memories used herein guidance and inspection, flat panel displays, liquid crystal displays (LCD), a thin film magnetic heads, etc. 本领域的技术人员应当清楚在可选择的应用的前文中,这里对术语“晶片”或“管芯”的任何使用被认为分别是更通用术语“衬底”或“目标部分”的同义词。 Those skilled in the art will be clear in the foregoing optional application, here the term "wafer" or "die" is considered any use are more generic term "substrate" "target portion" or a synonym. 在曝光前或曝光后,这里的衬底可以在例如轨迹(典型的涂敷抗蚀剂层到衬底并显影曝光的抗蚀剂的工具)中、计量工具和/或观察工具中被加工。 Before and after the exposure or the exposure, the substrate may be, for example, where the track (typically a resist layer is applied to a substrate and develops the exposed resist tools), the metrology tool and / or workpiece observation tool. 可应用的,这里的公开内容可以应用到这样的或其他的衬底加工工具。 Applicable, the disclosure herein may be applied to such and other substrate processing tools. 并且,衬底可以不止加工一次,例如为了建立多层IC,以使得这里使用的术语衬底也可以指已经包含多个已加工层的衬底。 Further, the substrate may be processed more than once, for example in order to establish a multi-layer IC, so that the term substrate used herein may also refer to a substrate that already contains multiple processed layers.

[0143] 虽然上面已经对利用光刻技术的上下文中的本发明实施例作了具体参考,可以理解本发明也可以应用到其他应用中,例如印刷光刻,且上下文允许的,并不局限于光刻。 [0143] While the above is already using photolithography techniques in the context of specific embodiments of the invention made with reference to, be understood that the invention can also be applied to other applications, for example imprint lithography, and the context allows, is not limited to lithography. 在印刷光刻中,构图器件中的形状限定了在衬底上产生的图案。 In lithography, the patterning device defines the shape of the pattern on a substrate. 构图器件的形状可以被压印到提供到衬底的抗蚀剂层中,在衬底上抗蚀剂通过施加电磁辐射、热、压力或者它们的组合 Shape patterning device may be provided to the substrate to imprint resist layer, the resist on the substrate by applying electromagnetic radiation, heat, pressure or a combination thereof

26来硬化。 26 to harden. 在抗蚀剂硬化后,构图器件从抗蚀剂移开并在其中留下图案。 After the resist is cured, patterning device is removed from the resist leaving a pattern in which.

[0144] 这里使用的术语“辐射”和“束”包括了电磁辐射的所有类型,包括紫外(UV)辐射(即具有约365、248、193、157或126nm的波长)和超紫外(EUV)辐射(例如具有5_20nm范围内的波长),和粒子束,如离子束或电子束。 [0144] As used herein, the term "radiation" and "beam" covers all types of electromagnetic radiation, including ultraviolet (UV) radiation (that is having about 193, 157 or 126nm wavelength) and extreme ultraviolet (EUV) radiation (e.g. having a wavelength in the range 5_20nm), and particle beams, such as ion beams or electron beams.

[0145] 术语“透镜”,本文中允许其指代任何一种或多种类型光学元件的组合,包括折射、 反射、磁、电磁和静电光学元件。 [0145] The term "lens" herein allowed to refer to any combination of one or more types of optical components, including refractive, reflective, magnetic, electromagnetic and electrostatic optical components.

[0146] 由于上面已经描述了本发明的具体实施例,应当理解除了所述之外,本发明也能实施。 [0146] Since the above embodiments have been described particular embodiments of the present invention, it should be understood that in addition to the outside, the present invention can also be implemented. 例如,本发明可以采用包含一个或多个描述了上面公开的方法的机器可读指令序列的计算机程序的形式,或具有这样的计算机程序存储在其中的数据存储媒介(例如半导体存储器,磁或光盘)。 For example, the present invention can contain one or more of the above described method disclosed in machine-readable form of a computer program instruction sequences, or having such a computer program stored therein data storage medium (eg semiconductor memory, magnetic or optical disk ).

[0147] 本发明可以应用到任何浸渍光刻设备,特别是但不是排他性的,可以应用到上述的那些类型。 [0147] The present invention can be applied to any immersion lithography apparatus, in particular, but not exclusive, can be applied to those types mentioned above.

[0148] 上面的描述倾向于是说明性的,而不是限制性的。 [0148] The above described tended to be illustrative, and not restrictive. 因此,对于本领域的技术人员可以对所述的本发明作出修改,而不超出下面的权利要求书的范围。 Therefore, for those skilled in the art of the present invention may be modified, without departing from the scope of the following claims.

Classifications
International ClassificationG03F7/20
Cooperative ClassificationG03F7/70808, G03F7/70341, G03F7/70875, G03F7/70841
European ClassificationG03F7/70P2, G03F7/70P2H, G03F7/70F24, G03F7/70P6B2
Legal Events
DateCodeEventDescription
22 Dec 2010C06Publication
2 Feb 2011C10Request of examination as to substance
18 Jul 2012C14Granted