CN101919122B - 采用各向同性导电弹性体互连介质的可分离电连接器 - Google Patents

采用各向同性导电弹性体互连介质的可分离电连接器 Download PDF

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CN101919122B
CN101919122B CN200880121549.9A CN200880121549A CN101919122B CN 101919122 B CN101919122 B CN 101919122B CN 200880121549 A CN200880121549 A CN 200880121549A CN 101919122 B CN101919122 B CN 101919122B
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circuit board
adaptor plate
weld pad
main circuit
plate
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CN101919122A (zh
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詹姆斯·V·拉塞尔
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R&D Circuits Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Abstract

采用各向同性导电弹性体作为互连介质的电连接器。

Description

采用各向同性导电弹性体互连介质的可分离电连接器
本申请是JamesRussell于2007年12月18日提交的第61008262号临时申请以及于2007年12月27日提交的第61009272号临时申请的正式申请。
技术领域
本发明涉及一种电连接器。在有必要通过采用插入板将适配器板和主电路板之一上稀疏的焊垫布置转换为另一个上精密的焊垫布置的情况下，这些连接器将适配器板电连接到主电路板(主板)。具体地，本发明涉及一种在改进的印刷电路(PC)板的两面采用各向同性导电弹性体的电连接器，从而在使PC板具有在PC板的界面上布线的能力的同时保持良好的电接触。
背景技术
Weiss等的美国专利6,702,587(‘587专利)涉及采用各向异性导电弹性体(ACE)的电连接器。该ACE提供为片状且在导电区域的整个表面上方以一致的节距沿z轴导电。这阻碍了‘587专利中的器件具有在适配器板和主板的界面上对导线布线的能力。
发明内容
本发明提供一种采用各向同性导电弹性体作为互连介质的电连接器。各向同性材料优选位于改进的PC板两面的导电焊盘上，以允许在适配器板和主板的界面上的导线的布线。
附图说明
图1是根据本发明第一实施例的分解截面图；
图2A是根据本发明第二实施例的分解截面图，其中焊垫数量不同于图1、4和5中的实施例的焊垫数量；
图2B示出在适配器板的界面层上可能的布线，应该理解的是，尽管未示出，但是按照本发明的图1、4和5中的实施例，可以代替适配器板相似地在主电路板的界面层上实施该布线；
图3是图1的实施例的PC板的改进；
图4是本发明的第三实施例，其中不需要改进的PC板且适配器板具有涂敷有各向同性弹性材料的焊盘(land)；以及
图5是本发明的第四实施例，其中不需要改进的PC板，且主电路板具有涂敷有各向同性弹性材料的焊盘。
具体实施方式
现在参考图1-3，图1示出本发明的电连接器以及具有连接焊盘11的主电路板10，其中电连接器具有机械压缩结构5、带有连接焊盘或焊垫7的适配器板6以及带有形成在PC板8两面的焊盘上的各向同性弹性体材料的改进的PC板8。压缩结构5中的插座5a适于容纳诸如集成电路(IC)芯片的测试电路。管脚5b提供容纳在插座5a中的IC芯片与适配器板6的焊垫7之间的电连接。当适配器板6、PC板8以及主电路板通过机械压缩结构被压在一起时，适配器板6的连接焊盘或焊垫7以及主电路板10的连接焊盘11被置于与位于改进的PC板8的焊盘或焊垫9a上的各向同性弹性体材料9接触。因此，通过在改进的PC板8的连接焊垫上设置各向同性弹性材料9，改进的PC板8的连接焊垫用作各向同性焊垫定义的连接器8。
通过将各个板压在一起，可以利用中间连接器-具有各向同性弹性体的改进的PC板而提供适配器板与主电路板10之间的电连接且可以将每个板的表面连接上的焊垫从稀疏(coarse)转换成精密(fine)，反之亦然。通过利用PC板两面上的焊盘，实现了良好的连接，同时增加了布线密度且通过将各向同性材料仅设置在焊垫位置处而不是如同‘587专利一样将其遍布连接区域的整个表面设置而降低成本。
除了通过将精密焊垫连接到稀疏焊垫(反之亦然)而转换节距之外，本发明也提供重布线从管脚5b1-7(连接到容纳在机械压缩结构5的插座5a中的测试电路3(诸如IC芯片3)的管脚4)到适配器板6的焊垫7以及到主电路板10的焊垫11的电连接。如图2A所示，适配器板6可以重布线，使得其路径或者线12不必连接到主电路板10上的相应焊盘或者焊垫11，而且也不需要转换节距。因此，结构5上的管脚5b-1可以连接到在适配器板6的第一面6a上的一个焊垫7-1，且焊垫7-1通过线12被重布线为连接到在适配器板6的第二面6b上的焊垫7-6而不是连接到第一焊盘7-5。然后，焊垫7-2连接到在主电路板10的相对表面10a上的焊垫11-2。可以以这样的方式实施任何可能的重布线。按照这样的方式，本发明允许所期望的电路的重布线。此外，用于适配器板6的焊垫数量和用于主电路板10的焊垫数量可以根据需要而改变且实施例中焊垫数量可不同于图1中的实施例。此外，在图2A的实施例中，不需要图1中的改进的PC板8，图5的实施例中也不需要改进的PC板8。
图2B示出了本发明一种可能的改善的布线12。由于各向同性焊盘9设置在改进的PC板8的每个面上，所以在改进的PC板8与适配器板6之间的界面层以及在改进的PC板8与主电路板10之间的界面层上布线12可以在连接焊盘阵列中或周围。这是为本发明的改进的PC板8的两面上的电路布线密度而提供。此外，与前述现有技术的提议相比，这也提供了更有成本效率的方案。改进的PC板未示出在图2A的示意图中。应该理解的是，适配器板6的该重布线此特征可用于图1、4和5的实施例。
图3示出了改进的PC板8。如图所示，通过将具有各向同性材料的焊盘设置在PC板8的两个表面上而改进PC板8。尽管图3示出了一个表面，但是应该理解的是，另一个表面也相似地被布置。各向同性材料可以是设置在改进的PC板8两面的焊垫上的各向同性膏体(isotropicpaste)。
图4示出了第二实施例，其中在适配器板与主电路板之间不需要改进的PC板。相反，适配器板表面上的焊盘(相对地面对主电路板的焊盘)被涂敷诸如各向同性弹性膏体的各向同性弹性体材料。因此，代替涂敷改进的PC板8的焊垫(如本公开的图1所示)，适配器板6的面对主电路板10的焊盘被涂敷各向同性弹性膏体。
图5示出了第三实施例，其中在适配器板6与主电路板10之间不需要改进的PC板8。替代地，主电路板10表面上的焊盘(相对地面对适配器板6的焊盘)被涂敷诸如各向同性弹性膏体的各向同性弹性体材料。因此，代替涂敷改进的PC板8的焊盘(如本公开的图1所示)，主电路板10的面对适配器板6的焊盘的焊盘被涂敷各向同性弹性膏体。
如同图1的实施例所示，图2B示出了本发明的图4和5的实施例的改善的布线12的一种可能例子。依赖于设置各向同性膏体的位置，焊垫可以是7或11。因此，如果诸如各向同性膏体的各向同性材料设置在适配器板6的焊垫7上，则如同之前所描述的对适配器板6进行重布线，应该对主电路板10进行重布线。相似地，如果诸如各向同性膏体的各向同性材料设置在主电路板10的焊垫11上，则对适配器板6进行线的重布线。
尽管现在为了公开本发明而描述了优选实施例，但应该理解的是，本领域的技术人员可以对装置的布置进行各种改变。这样的改变包括在由所附权利要求定义的本发明的精神范围内。

Claims (4)

1.一种电连接器，用于提供测试电路与主电路板之间的电连接，该电连接器包括：
适配器板；
具有各向同性导电弹性体的互连介质，该互连介质提供所述适配器板与所述主电路板之间的电连接；
具有腔的机械压缩结构，在该腔中容纳有所述测试电路，所述结构具有用于连接到所述适配器板上的焊垫的管脚，以提供从所述测试电路的管脚到所述适配器板、从所述适配器板到所述互连介质、以及从所述互连介质到所述主电路板的电连接，
其中所述互连介质形成为设置在所述适配器板与所述主电路板之间的印刷电路(PC)板，从而所述印刷电路板具有与所述适配器板和与所述主电路板的界面，所述印刷电路板被改进为在所述改进的印刷电路板的两面上具有各向同性弹性体，从而在所述适配器板和所述主电路板的界面上使所述适配器板和所述主电路自由布线的同时确保良好的电接触，
其中通过重布线从所述适配器板上的焊垫的上表面到所述适配器板的底表面的焊垫的电连接，从所述测试电路的管脚到所述适配器板的焊垫以及到所述主电路板的焊垫的电连接被重布线。
2.一种电连接器，用于提供测试电路与主电路板之间的电连接，该电连接器包括：
适配器板；
具有各向同性导电弹性体的互连介质，该互连介质提供所述适配器板与所述主电路板之间的电连接，
所述互连介质形成为在所述主电路板的相对地面对所述适配器板的焊垫的表面上的焊垫，而所述主电路板的所述焊垫涂敷有各向同性弹性体材料，
其中通过重布线从所述适配器板上的焊垫的上表面到所述适配器板的底表面的焊垫的电连接，从所述测试电路的管脚到所述适配器板的焊垫以及到所述主电路板的焊垫的电连接被重布线。
3.根据权利要求1或2所述的电连接器，其中所述各向同性弹性体材料是各向同性膏体。
4.根据权利要求1或2所述的电连接器，其中所述各向同性弹性体是焊垫限定的各向同性弹性体。
CN200880121549.9A 2007-12-18 2008-12-17 采用各向同性导电弹性体互连介质的可分离电连接器 Active CN101919122B (zh)

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US826207P 2007-12-18 2007-12-18
US61/008,262 2007-12-18
US927207P 2007-12-27 2007-12-27
US61/009,272 2007-12-27
US12/316,677 US7766667B2 (en) 2007-12-18 2008-12-16 Separable electrical connectors using isotropic conductive elastomer interconnect medium
US12/316,677 2008-12-16
PCT/US2008/013842 WO2009082461A2 (en) 2007-12-18 2008-12-17 Separable electrical connectors using isotropic conductive elastomer interconnect medium

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EP2225802A2 (en) 2010-09-08
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US20090156029A1 (en) 2009-06-18
WO2009082461A3 (en) 2009-08-20
EP2225802A4 (en) 2011-04-27
WO2009082461A2 (en) 2009-07-02
KR101262453B1 (ko) 2013-06-25
TWI462412B (zh) 2014-11-21
US7931476B2 (en) 2011-04-26
US8066517B2 (en) 2011-11-29
US7766667B2 (en) 2010-08-03
KR20100105684A (ko) 2010-09-29
JP2011507212A (ja) 2011-03-03
US20110124207A1 (en) 2011-05-26
JP5563477B2 (ja) 2014-07-30
US20100216320A1 (en) 2010-08-26

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