CN101907590A - Thermal contact resistance test equipment - Google Patents

Thermal contact resistance test equipment Download PDF

Info

Publication number
CN101907590A
CN101907590A CN201010229877.XA CN201010229877A CN101907590A CN 101907590 A CN101907590 A CN 101907590A CN 201010229877 A CN201010229877 A CN 201010229877A CN 101907590 A CN101907590 A CN 101907590A
Authority
CN
China
Prior art keywords
sample
temperature
contact resistance
thermal contact
loading device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201010229877.XA
Other languages
Chinese (zh)
Other versions
CN101907590B (en
Inventor
侯卫国
张卫方
王宗仁
崔本仓
唐庆云
刘肖
丁美丽
王晓亮
姚婧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beihang University
Original Assignee
Beihang University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beihang University filed Critical Beihang University
Priority to CN201010229877XA priority Critical patent/CN101907590B/en
Publication of CN101907590A publication Critical patent/CN101907590A/en
Application granted granted Critical
Publication of CN101907590B publication Critical patent/CN101907590B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The invention discloses thermal contact resistance test equipment, which mainly comprises a bracket, a top plate, a bottom plate, a stress loading device, a data acquisition system and a heating device, wherein the heating device, a test sample and the stress loading device are arranged sequentially from the bottom up between the bottom plate and the top plate; the stress loading device is fixed in the centre of the top plate and adjusts four groups of nuts on the top plate; a stress transfer bar of the stress loading device is in contact with the top end of the test sample to load stress to the top end of the test sample; and the bottom plate adjusts a horizontal angle and a vertical height through the four groups of nuts, and is provided with the heating device used for heating the test sample. The equipment provided by the invention can perform thermal contact resistance test experiments under high temperature and high-contact stress, continuously change the temperature (less than or equal to 1,000 DEG C) of a hot end and adjust the loaded stress (less than or equal to 500 MPa), and simultaneously detect, record, analyze and count the temperatures of monitoring points of a plurality of channels so as to avoid errors caused by the loop record of each channel.

Description

A kind of thermal contact resistance test equipment
Technical field
The invention belongs to technical field of measurement and test, be specifically related to a kind of thermal contact resistance method of testing and equipment, be applicable to the test of in different temperatures and loading stress scope, carrying out thermal contact resistance, especially possess the thermal contact resistance test condition under high temperature, the high contact stress condition.
Background technology
When two body surfaces are in contact with one another, no matter how smooth the surface is, always there is the incomplete contact point of microcosmic.The surface in contact of object is kept apart by big space between these contact points by disperseing tiny contact point to form, and may be vacuum in these spaces, also may the falling heat-transfer medium.Therefore, except intrinsic thermal resistance, also there is extra heat transmission resistance---thermal contact resistance at the surface of contact place.Thermal contact resistance is an important parameters in a lot of engineerings are used.The research of thermal contact resistance now mainly concentrates on theoretical analysis and calculating Methods Research aspect, promptly by setting up mathematical model, the mode of utilization computer simulation is predicted thermal contact resistance, then by with document in test figure compare the reliability of judgment models again.Present main calculation methods has: finite element method, Monte Carlo random point method, molecular dynamics method etc.But these method parameters are more, error is bigger, and are also impracticable on engineering.
Summary of the invention
The present invention is in order to solve simple problem of relying on theory and analog computation to carry out thermal contact resistance test existence in the prior art, a kind of thermal contact resistance engineering test method of testing and equipment thereof are provided, described method of testing adopts many root timbers material samples and a heat flow meter to form an axial heat passage, gather axial many test points of hot-fluid transmission direction temperature respectively, adopt multilayer insulation material and interface temperature compensation technique to reduce heat simultaneously and laterally scatter and disappear phenomenon, realize the test of thermal contact resistance according to the test point temperature of gathering contacting the influence of thermo-resistance measurement.
Thermal contact resistance test equipment provided by the invention mainly comprises support, top board, base plate, answers force loading device, data acquisition system (DAS) and heating arrangement, described top board and base plate are horizontally fixed on four supports by four groups of nuts respectively, and top board is positioned at the top of base plate, sets gradually heating arrangement, sample between base plate and the top board from the bottom to top and answers force loading device; The described force loading device of answering is fixed on the top board center, regulates four groups of nuts on the top board, answers the power conductive bar of force loading device to contact with the top of sample, is sample top loading stress; Described base plate is regulated level angle and vertical height by four groups of nuts, and heating arrangement is set on the base plate, is used to the sample heating.At least three of the quantity of described sample, vertically axial array, and one of them sample is as the heat flow meter sample, and all the other are the material sample of thermal contact resistance to be measured; Described heat flow meter sample is positioned at top or lowermost end.Described temperature acquisition system is divided into two parts with the temperature data of being gathered, a part is all temperature datas of test point thermopair, be used for computer drawing and become temperature variation curve, the steady change of test samples heating-up temperature, the temperature data according to this collection carries out resolving of thermal contact resistance then; Another part is the temperature data of two thermopairs nearest apart from the contact interface place, is used to resolve the medial temperature at sample contact interface place, and control is for the temperature compensation at sample contact interface place.
The invention has the advantages that:
(1) heat block in the heating arrangement of the present invention's employing is a high-temperature material, answer force loading device that the interface contact stress of 500MPa can be provided, therefore equipment provided by the invention can carry out the thermal contact resistance testing experiment high temperature, high contact stress under, and can change on request continuously hot-side temperature (≤1000 ℃) and adjustment loading stress (≤500MPa).
(2) temperature required by the power control hot junction of silicon-controlled voltage regulation device control heater strip, avoid the lateral heat flow loss by multilayer insulation material and interface temperature compensation, and adopt cooling device to make the hot junction of test sample and colling end form the very big temperature difference, realized the one dimension transmission that hot-fluid is axial.
(3) equipment provided by the invention can detect and record simultaneously to multichannel monitoring point temperature, and analyzes and add up, thereby has improved work efficiency, the error of having avoided each passage of cycle index to be brought.
(4) method of testing provided by the invention can test sample thermal contact resistance under thermal stress and compressive stress act on simultaneously, and method simply is easy to realize.
Description of drawings
Fig. 1 is a thermal contact resistance test equipment one-piece construction synoptic diagram provided by the invention;
Fig. 2 is the layout of thermopair on the sample among the present invention;
Fig. 2 a is the structural representation of stable support frame among the present invention;
Fig. 3 is top board loss of weight structural representation among the present invention;
Fig. 4 a looks cut-open view for the master of cooling water tank among the present invention;
Fig. 4 b is the vertical view of cooling water tank among the present invention;
Fig. 5 a is heating arrangement structural representation among the present invention;
Fig. 5 b is the cylindrical shape cartridge heater structural representation of heating arrangement among the present invention;
Fig. 5 c is the structural representation of heat block among the present invention;
Fig. 6 is the structural representation of compensating heating device among the present invention;
Fig. 6 a is a support bracket fastened upward view in the compensating heating device;
Fig. 6 b is a support bracket fastened front view in the compensating heating device.
Embodiment
The present invention is described in detail below in conjunction with drawings and Examples.
The invention provides a kind of thermal contact resistance method of testing, this method of testing utilizes the characteristic of the temperature variation that hot-fluid transmits between the different materials interface to detect the interface thermal contact resistance, thus this kind method adopt fairly simple, reliable, measuring accuracy is higher, the testing apparatus of easy operating is just passable.But, need the regular hour just can reach thermal equilibrium, so the data that reach after the stable state are only believable because of temperature element and surrounding medium need carry out sufficient heat interchange.Based on above-mentioned factor, thermal contact resistance method of testing provided by the invention specifically realizes as follows:
The first step, the preparation of test sample and equipment.
Process at least three samples, comprise a heat flow meter sample and two test samples, be installed in the bottom heating arrangement and the top is answered between the force loading device with three samples are vertically coaxial, described sample is provided with thermopair, thermopair is connected with data acquisition system (DAS), is used to test and gather the axial temperature of sample.
In second step,, gather sample testing point temperature to sample heating and loading compressive stress.
By heating arrangement sample is heated, and sample is applied compressive stress, after 3~4 hours, treat that specimen temperature reaches and begin the collecting test temperature after stable.Described probe temperature comprises the test point temperature T of n test point on each sample iI=1 ... n, n are test point number on the sample.Described test point temperature T iGather by test point thermopair uniform on sample, the probe of described test point thermopair is arranged on the axis of sample, guarantees the accuracy of thermometric.
For example the distance between the test point satisfies following relation on the sample: specimen length is l, axial distance between adjacent two test points equates, n test point is set between from the lower surface to the upper surface on each sample, distance between the test point is l/n, first test point equals the distance of n test point apart from the upper surface apart from the distance of lower surface, and two equal distance between adjacent two test points apart from sum.Test sample is vertically coaxial, and test point is evenly arranged from top to bottom, serial number.
Thermopair connects data acquisition system (DAS), and the temperature variation that shows each test point on the sample when computing machine on the data acquisition system (DAS) can think that axial hot-fluid transmission has reached stable state in 0.5 degree the time.
In the 3rd step, adjacent samples is in the medial temperature at contact interface place.
Temperature on each test point on the sample is gathered and stored, and pass through the temperature variation curve at computer drawing test point place.
On per two adjacent samples, the temperature of two the test point thermopairs nearest apart from contact interface is T nAnd T N+1, then the below sample n test point temperature T nThe 1st test point temperature T with adjacent top sample N+1Mean value be exactly the medial temperature at two sample contact interface places, then the medial temperature Δ T ' at contact interface place is:
Δ T ′ = T n + T n + 1 2 .
In the 4th step, the sample contact interface is carried out temperature compensation.
The medial temperature Δ T ' at contact interface place is conducted temperature as the theory between adjacent two samples, the sample contact interface is carried out temperature compensation, adopt compensating heating device to guarantee that the contact interface place of sample keeps the theoretical temperature Δ T ' that conducts.
In the 5th step, determine that by the extrapolation thermograde Δ T falls in the temperature at adjacent samples contact interface place:
ΔT = ( T n - ( T 1 - T n ) ( n - 1 ) · l / n × l / 2 n ) - ( T n + 1 + ( T n + 1 - T 2 n ) ( n - 1 ) · l / n × l / 2 n )
= ( T n - 2 ( T 1 - T n ) n - 1 ) - ( T n + 1 + 2 ( T n + 1 - T 2 n ) n - 1 )
Wherein, l is a specimen length, and n is a number of checkpoints on each sample, T 1, T n, T N+1, T 2nThe temperature of the 1st of first tested sample of difference, a n test point, second adjacent tested sample n+1 and the temperature of 2n test point.
The 6th goes on foot, and determines the axial hot-fluid of sample according to selected heat flow meter.
Ignore the lateral heat flow loss of sample, as heat flow meter, be prepared into the heat flow meter sample with the same size of sample with metallic copper, then axially hot-fluid is:
q = λ T dt dx = λ T ( T 1 - T n ) / m
λ wherein TThermal conductivity for copper; T 1, T nTemperature for first test point and n test point on the heat flow meter sample; M is the distance between first test point and n the test point on the heat flow meter sample.
In the 7th step, calculate contact conductane and thermal contact resistance.
According to the axial hot-fluid in the 6th step, the contact conductane h in obtaining testing CAs follows:
h C = q ΔT = λ T ( T 1 - T n ) / m ( T n - 2 ( T 1 - T n ) n - 1 ) - ( T n + 1 + 2 ( T n + 1 - T 2 n ) n - 1 )
Fall Δ T according to the temperature at per two sample contact interface places and calculate thermal contact resistance R C
Described thermal contact resistance R CFor:
R C = 1 h C = ΔT q
Wherein q is axial hot-fluid.
According to the test needs, can adjust heating-up temperature or loading stress, repeat the first step to the six and go on foot the thermal contact resistance that can test under different temperatures and the stress condition.
The present invention also provides a kind of thermal contact resistance test equipment, and as shown in Figure 1, described testing apparatus mainly comprises support 1, top board 2, base plate 3, answers force loading device 4, data acquisition system (DAS) 6 and heating arrangement 7, also comprises a cooling device 5.Described top board 2 and base plate 3 are horizontally fixed on four supports 1 by four groups of nuts 8 respectively, and top board 2 is positioned at the top of base plate 3.Space between base plate 3 and the top board 2 sets gradually heating arrangement 7, sample 9, cooling device 5 from the bottom to top and answers force loading device 4.The described force loading device 4 of answering is fixed on top board 2 centers, answers the power conductive bar of force loading device 4 to pass cooling device 5 and contacts with the top of sample 9, is used to sample 9 top loading stresses.Described base plate 3 is provided with heating arrangement 7, is used to sample 9 heating.
At least three of the quantity of described sample 9, vertically axial array, and one of them sample 9 is as the heat flow meter sample, and all the other are the material sample of thermal contact resistance to be measured.As shown in Figure 2, arrange 4 test point thermopairs 10 (as nickelchromium-nickelsiliconthermocouple) on the axis of each sample 9, test point thermopair 10 is used for measuring in real time along the Temperature Distribution of sample 9 on axially as temperature sensor, the probe of test point thermopair 10 is arranged on the vertical axis of sample 9, the buttock line of test point thermopair 10 connects data acquisition system (DAS) 6, as Fig. 1, temperature variation curve is stored and drawn to the temperature data that data acquisition system (DAS) 6 is gathered by computing machine 601, be shown to the operator, be convenient to operator's monitoring and control thermal contact resistance test process.
Distance relation on each sample 9 between the thermocouple probe is as follows: the axial distance between the adjacent heat galvanic couple equates; The length of each sample is l, from the lower surface to the upper surface, arrange n thermopair on each sample successively, then the distance between the thermopair is l/n, and first thermopair equals the distance of n thermopair apart from the upper surface apart from the distance of lower surface, is l/2n.
Select for use the material of known heat-conduction coefficient such as copper as heat flow meter among the present invention, come the axial hot-fluid q of test sample.Heat flow meter is made the size the same with sample 9, as one of them heat flow meter sample, during test, the top that described heat flow meter sample is arranged in test sample contacts with the power conductive bar of answering force loading device 4, perhaps lowermost end directly contacts with heating arrangement 7, guarantee that contact forms contact interface 901 between the alloy material sample of thermal contact resistance to be measured, testing apparatus provided by the invention is exactly the thermal contact resistance that is used to test contact interface 901 places between contacted two samples.
Described test point thermopair 10 adopts the nickelchromium-nickelsiliconthermocouple of K type, can survey 0~1300 ℃ temperature range.The probe arrangement mode that the present invention adopts test point thermopair 10 as shown in Figure 2, probe is arranged on the vertical axis of sample 9.Specimen length is 60mm, the probe distance upper and lower end face 7.5mm of test point thermopair 10 on each sample 9, and interval 15mm arranges four thermopairs altogether each other.On sample 9, arrange the necessary careful processing of probe hole of test point thermopair 10,, and then draw the bigger uncertainty of thermal contact resistance because the small error of probe hole spacing promptly can be brought the bigger error of thermograde.
Because all there is tolerance in the processing in test point thermopair 10 and thermocouple probe hole, in sample is heated the process of carrying, sample meeting expanded by heating, some test point thermopairs 10 might come off from sample aperture.For fixing test point thermopair 10, as shown in Figure 2, buttock line with described test point thermopair 10 among the present invention passes through a stable support frame 11, shown in Fig. 2 a, buttock line hole 11A is set on the described stable support frame 11, the quantity of buttock line hole 11A equals the quantity of test point thermopair 10 on the sample, the buttock line of each test point thermopair 10 is connected with data acquisition system (DAS) 6 after all passing buttock line hole 11A, and buttock line is that the mode by screw lock is fixed on the stable support frame 11, prevents that test point thermopair 10 from coming off from sample 9.
Be connected with pressure transducer 401 on the force loading device 4 described answering, as Fig. 1, pressure transducer 401 is connected with computing machine 601 in the data acquisition system (DAS) 6, be used to measure the size of the compressive stress that loads, and with measured compressive stress data recording and being presented on the computing machine 601 of data acquisition system (DAS) 6.Promote top boards 2 by regulating four nuts 8, make the adjustable height of top board 2, and then realize that counter stress charger 4 exerts pressure, answer force loading device 4 pressure to be imposed on the top of sample 9 by the power conductive bar.Because described power conductive bar is passed the cooling water tank of cooling device 5 and is contacted with sample.When the power conductive bar applies compressive stress for sample 9 conduction, also will realize cooling to the top of sample 9.
The structure of described top board 2 as shown in Figure 3, top board 2 adopts the structure of steel plate+reinforcements, and top board 2 adopted the loss of weight structure to come thin device, parts such as test point thermopair and compensating heating device also can easier insertion and safe handling.In the area that has increased top board 2, lightening hole 201 is set on top board 2 realizes loss of weight, also make more convenient operation when having alleviated the weight of charger.
Described cooling device 5 is placed on the top of sample 9, shown in Fig. 4 a, 4b, described cooling device 5 is a cooling water tank structure, the center of cooling water tank is provided with central through hole 501, the internal diameter of central through hole 501 is a bit larger tham the external diameter of power conductive bar, described central through hole 501 has internal thread, and cooling water tank is fastened on the power conductive bar of answering force loading device 4 by described internal thread.The temperature of the chilled water of cooling water tank inside can directly be conducted to the power conductive bar, and the temperature by the power conductive bar reduces the top cold junction that comes cooling samples 9.Cooling water tank inside is provided with cooling duct 502, and cooling duct 502 centers on central through hole 501 for spirality.Chilled water enters cooling duct 502 from the chilled water water inlet 503 of cooling water tank bottom, and flow out from the cooling water outlet 504 at cooling water tank top, so circulation, chilled water is with the cooling duct 502 of certain flow velocity by cooling water tank inside, for the power conductive bar provides lower stationary temperature, can reduce the temperature of power conductive bar, and then the top cold junction of cooling samples 9.The temperature maintenance of general recirculated cooling water gets final product at 20 ℃~25 ℃.This kind mode makes and the contact area maximum of recirculated cooling water and sample cold junction has improved cooling effectiveness to greatest extent.There is upper, middle and lower-ranking cooling duct 502 cooling water tank inside, and between layer and layer the dividing plate 505 that two opening diagonal angles distribute is set, in order to guarantee that recirculated cooling water flows to the top from the bottom.Recirculated cooling water will from down and on, prevented delay.
Adopt this kind type of cooling to find in the test, after heating arrangement reaches needed hot-side temperature with the power of maximum heating (220V/1500W), turn down voltage between 90V-120V by silicon-controlled voltage regulation device 12, after about 2-3 hour, the axial hot-fluid on the sample has reached metastable state.
Described heating arrangement 7 shown in Fig. 5 a, mainly comprises heat block 701, and heat block 701 can directly connect silicon-controlled voltage regulation device 12, and silicon-controlled voltage regulation device 12 connects temperature controller, is the sample heating; Also can connect silicon-controlled voltage regulation device 12 by pottery (SiC) cartridge heater 702 of heat block 701 outer rings or the cylinder heater 705 of a side opening, silicon-controlled voltage regulation device 12 connects temperature controller, is the sample heating.When selecting ceramic cartridge heater 702 for use, ceramic cartridge heater 702 peripheries are wound with heater strip 703, and heater strip 703 connects silicon-controlled voltage regulation device 12, and silicon-controlled voltage regulation device 12 connects temperature controller 12A, be used to heater strip 703 to provide power controllable heating-up temperature, for sample 9 loads temperature.The heat of heater strip 703 passes to heat block 701 by ceramic cartridge heater 702, for sample 9 provides thermal source.The internal diameter of ceramic cartridge heater 702 is a bit larger tham the external diameter of heat block 701, guarantees that the heat of ceramic cartridge heater 702 can all pass to heat block 701.
The cylinder heater 705 of a described side opening is the structure shown in Fig. 5 b, promptly adopts the cylinder heater 705 of a side opening to be heat block 701 heating.Described cylinder heater 705 internal diameters closely contact with heat block 701 external diameters, and then can increase the efficiency of heating surface, shorten heat time heating time.Be designed to the structure of a side opening, help tight contact the between cylinder heater 705 inwalls and the heat block 701 more.Arrange heater strip 703 on described cylinder heater 705 inwalls, the two ends of heater strip 703 are connected to silicon-controlled voltage regulation device 12, and silicon-controlled voltage regulation device 12 connects temperature controller 12A.
Described heat block 701 structures are shown in Fig. 5 c, heat block 701 is a cylindrical structure, cylindrical upper surface is provided with a cylinder shape groove 701A, groove 701A diameter is a bit larger tham sample 9 diameters, bolt hole 701D is set around the groove 701A, after being installed to sample 9 bottoms in the groove 701A, with bolt passing through bolt hole 701D sample 9 bottoms are held out against, prevent sample 9 bottoms moving with respect to groove 701A, simultaneously can be with the heat transferred sample 9 of heat block 701, general bolt hole 701D is provided with four.A threaded post 701B is arranged at the bottom of heat block 701, is threaded between the sheet metal of arranging on this threaded post 701B and the refractory brick 13 14, as Fig. 5 a, connects sheet metal 14 and makes the center of gravity of heat block 701 descend the firm upper surface that is positioned at refractory brick 13.Described refractory brick 13 places on the base plate 3.Described refractory brick 13 and sheet metal 14 all are to play the fixedly effect of heat block 701, and refractory brick 13 also plays the effect of the position balance of heat insulation and adjustment heat block 701 simultaneously.
Bottom position at heat block 701 upper groove 701A is provided with a temperature sensor 701C, temperature sensor 701C is connected to temperature controller 12A by the opening of cylinder heater 705 or by ceramic sleeve 702, temperature sensor 701C feeds back to the measured temperature data on the temperature controller 12A, temperature controller 12A guarantees that by the break-make of heating on the silicon-controlled voltage regulation device 12 control cylinder heaters 705 heat block 701 tip positions remain stationary temperature with heat transferred test sample 9.
Described four supports 1 all have external thread structure, and eight groups of nuts 8 can be regulated separately.Regulate four groups of fixing on the top board 2 nuts 8 straight down power can proof stress charger 4 be provided; Regulate four groups of nuts 8 of base plate 3, can guarantee that the axis of the heat block 701 on the refractory brick 13 is perpendicular to the ground.
Usually the heater strip of choosing 703 is siderochrome aluminium heater strip, as 0Cr21Al16Nb.Choose heat block 701 and adopt high-temperature alloy,, perhaps choose K417 alloy steel (high temperature resistant more than 1000 ℃) as 1Cr18Ni9Ti (600 ℃).The peak power that can provide is 1500W.Heat-insulation layer 704 (avoiding heater strip directly to contact with heat-barrier material reacts) can also be set in the outside of described ceramic cartridge heater 702, as shown in Figure 1, be used to prevent the heat dissipation of heater strip 703 and heat block 701.
Periphery at described sample 9 is provided with thermofin 16, thermofin 16 is made up of heat-preservation cotton and perlite, as Fig. 1, thermofin 16 is arranged on the periphery of sample 9 and heating arrangement 7, be used to prevent that the specimen surface heat laterally scatters and disappears, guarantee that as far as possible the temperature heat on the sample 9 axially rises along sample 9, avoids the horizontal loss of hot-fluid at the interface.
In the thermal contact resistance test process, because specimen temperature transmits from bottom to top, in different temperature, hot-fluid loss transversely is inevitable at radially same graphic memory.According to the principle of dynamics of conducting heat, the temperature difference on two planes is big more, and then the power of Chuan Reing is just big more, when hot-fluid in axial direction maximizes, reaches the metastable state of hot-fluid one dimension transmission, and just can carry out the test of thermal contact resistance this moment.Minimizing lateral heat flow loss in order to try one's best makes hot-fluid transmit vertically, and the present invention also is provided with compensating heating device 15.Described compensating heating device 15 comprises two thermopair 15A and two ring heater 15B, as shown in Figure 6, described ring heater 15B is positioned at the sagittal plane of contact interface, respectively apart from the position of contact interface 50mm and 60mm, fixedly install a thermopair 15A on the ring heater 15B respectively, thermopair 15A links to each other with temperature controller 12A, give temperature controller 12A with the Temperature Feedback of ring heater 15B, make the temperature of sample contact interface consistent with the temperature of ring heater 15B by temperature controller 12A, the horizontal isothermal of two material contact interfaces has been avoided laterally scattering and disappearing of heat.In the process of the test by immediate two test point thermopair 10 measured temperatures on adjacent two samples are made difference and are asked average, obtain the theory conduction temperature Δ T ' at contact interface place, according to this theory conduction temperature Δ T ', regulate the temperature control point of temperature controller 12A, ring heater 15B heating and temperature control is conducted in the temperature range in described theory, make hot-fluid maximize, avoid lateral heat flow to scatter and disappear in the axial transmission at sample contact interface place.
Described ring heater 15B is fixed on the top board 2 by fixed support 15C, and described fixed support 15C is inverted "L" shaped, and the top is provided with two threaded holes 150, and shown in Fig. 6 a, screw passes described threaded hole 150 fixed support 15C is fixed on the top board 2; Bottom end vicinity is provided with slotted hole 151, shown in Fig. 6 b, two circular holes are arranged on the ring heater 15B, passing described circular hole with bolt is fixed on ring heater 15B on the slotted hole 151, the purpose that is processed into slotted hole is to regulate ring heater 15B position in the axial direction for convenience, and then makes that ring heater 15B's is Height Adjustable.
Data acquisition system (DAS) 6 among the present invention is divided into two parts with the temperature data of being gathered, a part is all temperature datas of test point thermopair 10, be used for computer drawing and become temperature variation curve, the steady change of test samples heating-up temperature, the temperature data according to this collection carries out resolving of thermal contact resistance then; Another part is the temperature data of two thermopairs nearest apart from the contact interface place, is used to resolve the medial temperature at sample contact interface place, so that control is for the temperature compensation at sample contact interface place.
Temperature controller 12A among the present invention can realize the independent control and the data presentation of multichannel heating, and the temperature controller 12A model of choosing among the present invention is XMZJ16-38K XLDS.

Claims (10)

1. thermal contact resistance test equipment, it is characterized in that: mainly comprise support, top board, base plate, answer force loading device, data acquisition system (DAS) and heating arrangement, described top board and base plate are horizontally fixed on four supports by four groups of nuts respectively, and top board is positioned at the top of base plate, sets gradually heating arrangement, sample between base plate and the top board from the bottom to top and answers force loading device; The described force loading device of answering is fixed on the top board center, regulates four groups of nuts on the top board, answers the power conductive bar of force loading device to contact with the top of sample, is sample top loading stress; Described base plate is regulated level angle and vertical height by four groups of nuts, and heating arrangement is set on the base plate, is used to the sample heating.
2. thermal contact resistance test equipment according to claim 1 is characterized in that: at least three of the quantity of described sample, and vertically axial array, and one of them sample is as the heat flow meter sample, and all the other are the material sample of thermal contact resistance to be measured; Described heat flow meter sample is positioned at top or lowermost end.
3. thermal contact resistance test equipment according to claim 2 is characterized in that: the distance relation on each sample between the thermocouple probe is as follows: the axial distance between the adjacent heat galvanic couple equates; The length of each sample is l, from the lower surface to the upper surface, arrange n thermopair on each sample successively, then the distance between the thermopair is l/n, and first thermopair equals the distance of n thermopair apart from the upper surface apart from the distance of lower surface, is l/2n.
4. thermal contact resistance test equipment according to claim 2, it is characterized in that: described heat flow meter is selected the material copper of known heat-conduction coefficient for use, the size that the heat flow meter sample is the same with test sample, as one of them heat flow meter sample, during test, the top that is arranged in test sample contacts with the power conductive bar of answering force loading device, perhaps directly contacts with heating arrangement bottom.
5. thermal contact resistance test equipment according to claim 2 is characterized in that: the described force loading device of answering is provided with pressure transducer, and pressure transducer is connected with the computing machine of data acquisition system (DAS).
6. thermal contact resistance test equipment according to claim 2 is characterized in that: on the described top board lightening hole is set.
7. thermal contact resistance test equipment according to claim 1 is characterized in that: arrange refractory brick on the described base plate, arrange sheet metal on the refractory brick, there is threaded hole at the sheet metal center, and described threaded hole is used for fixing heating arrangement.
8. according to claim 1 or 7 described thermal contact resistance test equipments, it is characterized in that: the axis of the center of gravity of described refractory brick, sheet metal and heat block and the axis of sample, power conductive bar is positioned on the same vertical curve.
9. thermal contact resistance test equipment according to claim 1, it is characterized in that: the described force loading device of answering is to promote top board by regulating four nuts, make the height of top board descend, and then realize pressure being imposed on the top of sample by the power conductive bar of answering force loading device.
10. thermal contact resistance test equipment according to claim 1, it is characterized in that: described temperature acquisition system is divided into two parts with the temperature data of being gathered, a part is all temperature datas of test point thermopair, be used for computer drawing and become temperature variation curve, the steady change of test samples heating-up temperature, the temperature data according to this collection carries out resolving of thermal contact resistance then; Another part is the temperature data of two thermopairs nearest apart from the contact interface place, is used to resolve the medial temperature at sample contact interface place, and control is for the temperature compensation at sample contact interface place.
CN201010229877XA 2010-07-13 2010-07-13 Thermal contact resistance test equipment Expired - Fee Related CN101907590B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201010229877XA CN101907590B (en) 2010-07-13 2010-07-13 Thermal contact resistance test equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201010229877XA CN101907590B (en) 2010-07-13 2010-07-13 Thermal contact resistance test equipment

Publications (2)

Publication Number Publication Date
CN101907590A true CN101907590A (en) 2010-12-08
CN101907590B CN101907590B (en) 2012-01-11

Family

ID=43263109

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010229877XA Expired - Fee Related CN101907590B (en) 2010-07-13 2010-07-13 Thermal contact resistance test equipment

Country Status (1)

Country Link
CN (1) CN101907590B (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103018137A (en) * 2012-12-07 2013-04-03 山东科技大学 Apparatus and method used for determining thermal contact resistance in hot stamping process
CN104132963A (en) * 2014-08-08 2014-11-05 哈尔滨工业大学 Device for detecting thermal contact resistance under micro-stress condition
CN104215661A (en) * 2014-09-02 2014-12-17 兰州大学 Solid interface contact thermal resistance test device based on super-magnetostrictive intelligent material
CN104359942A (en) * 2014-12-01 2015-02-18 哈尔滨工业大学 Interface thermal resistance measuring method in dissimilar metal compound molding process
CN104535604A (en) * 2014-11-11 2015-04-22 中国北方发动机研究所(天津) A head gasket thermal resistance measuring device
CN105388184A (en) * 2015-12-17 2016-03-09 北京航空航天大学 Specimen installation fixture used for contact thermal resistance testing
CN105572162A (en) * 2015-12-17 2016-05-11 北京航空航天大学 Thermal contact resistance testing equipment with compensation heating system and thermal insulation system
CN105628730A (en) * 2015-12-17 2016-06-01 北京航空航天大学 Contact thermal resistance type test equipment with stable heating system
CN107490595A (en) * 2017-09-21 2017-12-19 北京工业大学 A kind of normal load influences the assay method and device of relation on faying face thermal contact resistance
CN108007964A (en) * 2017-12-27 2018-05-08 齐鲁工业大学 A kind of thermal contact resistance test device and test method
CN109580706A (en) * 2018-12-13 2019-04-05 西安空间无线电技术研究所 A kind of experimental provision for rapid survey thermal contact resistance
CN109580022A (en) * 2019-01-28 2019-04-05 中国船舶工业综合技术经济研究院 A kind of temperature monitoring device
CN110031504A (en) * 2019-03-20 2019-07-19 东南大学 The test method of thermal contact resistance between a kind of circular cross-section one-dimensional nano structure
CN110214270A (en) * 2016-12-13 2019-09-06 丰田自动车株式会社 Thermal characteristics evaluates the evaluation measuring method of measurement device and the thermal characteristics using the measurement device
CN111594352A (en) * 2020-05-15 2020-08-28 北京航空航天大学 Method and device for measuring extension length of alloy welding point of tungsten-rhenium thermocouple
CN109580707B (en) * 2018-12-21 2021-06-01 中国航空工业集团公司西安航空计算技术研究所 Device and method for measuring contact thermal resistance
CN113514492A (en) * 2021-06-02 2021-10-19 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) Method and device for measuring interface thermal resistance

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6142662A (en) * 1998-06-16 2000-11-07 New Jersey Institute Of Technology Apparatus and method for simultaneously determining thermal conductivity and thermal contact resistance
CN101126729A (en) * 2007-09-18 2008-02-20 南京航空航天大学 Double heat flux gauge steady state method for measuring material heat conductivity

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6142662A (en) * 1998-06-16 2000-11-07 New Jersey Institute Of Technology Apparatus and method for simultaneously determining thermal conductivity and thermal contact resistance
CN101126729A (en) * 2007-09-18 2008-02-20 南京航空航天大学 Double heat flux gauge steady state method for measuring material heat conductivity

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103018137A (en) * 2012-12-07 2013-04-03 山东科技大学 Apparatus and method used for determining thermal contact resistance in hot stamping process
CN103018137B (en) * 2012-12-07 2015-04-15 山东科技大学 Apparatus and method used for determining thermal contact resistance in hot stamping process
CN104132963A (en) * 2014-08-08 2014-11-05 哈尔滨工业大学 Device for detecting thermal contact resistance under micro-stress condition
CN104215661B (en) * 2014-09-02 2017-02-22 兰州大学 Solid interface contact thermal resistance test device based on super-magnetostrictive intelligent material
CN104215661A (en) * 2014-09-02 2014-12-17 兰州大学 Solid interface contact thermal resistance test device based on super-magnetostrictive intelligent material
CN104535604A (en) * 2014-11-11 2015-04-22 中国北方发动机研究所(天津) A head gasket thermal resistance measuring device
CN104535604B (en) * 2014-11-11 2017-03-15 中国北方发动机研究所(天津) A kind of head gasket heat resistance test apparatus
CN104359942A (en) * 2014-12-01 2015-02-18 哈尔滨工业大学 Interface thermal resistance measuring method in dissimilar metal compound molding process
CN105628730A (en) * 2015-12-17 2016-06-01 北京航空航天大学 Contact thermal resistance type test equipment with stable heating system
CN105572162A (en) * 2015-12-17 2016-05-11 北京航空航天大学 Thermal contact resistance testing equipment with compensation heating system and thermal insulation system
CN105388184A (en) * 2015-12-17 2016-03-09 北京航空航天大学 Specimen installation fixture used for contact thermal resistance testing
CN105628730B (en) * 2015-12-17 2019-01-18 北京航空航天大学 With the thermal contact resistance test equipment for stablizing heating system
CN110214270A (en) * 2016-12-13 2019-09-06 丰田自动车株式会社 Thermal characteristics evaluates the evaluation measuring method of measurement device and the thermal characteristics using the measurement device
CN107490595A (en) * 2017-09-21 2017-12-19 北京工业大学 A kind of normal load influences the assay method and device of relation on faying face thermal contact resistance
CN108007964A (en) * 2017-12-27 2018-05-08 齐鲁工业大学 A kind of thermal contact resistance test device and test method
CN109580706A (en) * 2018-12-13 2019-04-05 西安空间无线电技术研究所 A kind of experimental provision for rapid survey thermal contact resistance
CN109580706B (en) * 2018-12-13 2021-11-16 西安空间无线电技术研究所 Experimental device for be used for rapid survey thermal contact resistance
CN109580707B (en) * 2018-12-21 2021-06-01 中国航空工业集团公司西安航空计算技术研究所 Device and method for measuring contact thermal resistance
CN109580022A (en) * 2019-01-28 2019-04-05 中国船舶工业综合技术经济研究院 A kind of temperature monitoring device
CN110031504A (en) * 2019-03-20 2019-07-19 东南大学 The test method of thermal contact resistance between a kind of circular cross-section one-dimensional nano structure
CN110031504B (en) * 2019-03-20 2021-07-20 东南大学 Method for testing thermal contact resistance between circular-section one-dimensional nano structure
CN111594352A (en) * 2020-05-15 2020-08-28 北京航空航天大学 Method and device for measuring extension length of alloy welding point of tungsten-rhenium thermocouple
CN111594352B (en) * 2020-05-15 2021-08-20 北京航空航天大学 Method and device for measuring extension length of alloy welding point of tungsten-rhenium thermocouple
CN113514492A (en) * 2021-06-02 2021-10-19 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) Method and device for measuring interface thermal resistance
CN113514492B (en) * 2021-06-02 2023-09-01 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) Method and device for measuring interface thermal resistance

Also Published As

Publication number Publication date
CN101907590B (en) 2012-01-11

Similar Documents

Publication Publication Date Title
CN101907590B (en) Thermal contact resistance test equipment
CN101929970B (en) Thermal contact resistance testing method and equipment
CN101929969B (en) Thermal contact resistance testing device with cooling device
CN101915780B (en) Test equipment applied to high-temperature and high-stress thermal contact resistance test
CN108007964A (en) A kind of thermal contact resistance test device and test method
CN101915781B (en) Thermal contact resistance test equipment with compensating heating device
CN103983660B (en) A kind of indoor rock sample test device of thermal conductivity coefficient
CN102012382A (en) Heat conductivity coefficient quick test device and method of vacuum insulating board
JP4866419B2 (en) Method and apparatus for measuring and inspecting reactor fouling
CN103868948B (en) The modification method of the hot exchange power of single test specimen Guarded hot plate Conduction Coefficient Detector Basing
CN102141529A (en) Vacuum contact thermal conduction measurement device of fixed junction surface
CN110277179A (en) A kind of Plate-type Fuel Elements axially and transversely non-homogeneous heat release simulation test device
CN105572162A (en) Thermal contact resistance testing equipment with compensation heating system and thermal insulation system
CN105628730A (en) Contact thermal resistance type test equipment with stable heating system
CN103954648A (en) Apparatus and method for measuring heat conduction coefficient by employing hemisphere-surface heat-source stable-state process
CN108195879A (en) The method that Transient Method measures material thermal conductivity and thermal diffusion coefficient
CN203849193U (en) Indoor rock sample heat conduction coefficient testing device
CN107831189A (en) A kind of multi-functional quenching detection apparatus
US6862941B2 (en) Heat flux measurement pipe and method for determining sprinkler water delivery requirement
CN105717157A (en) Device and method for rapidly testing effective thermal conductivity of porous metal material on basis of guarded hot plate method
CN207611006U (en) A kind of thermal contact resistance test device
Wu et al. Thermal conductivity of cobalt-based catalyst for Fischer–Tropsch synthesis
CN109959676A (en) A kind of graphite and graphite film material thermal contact resistance test method
CN104567746B (en) A kind of high-temperature flange deflection angle test system
CN110045096B (en) Test device and method for evaluating concrete cracking caused by temperature gradient

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120111

Termination date: 20120713