CN101882590A - Heating block device - Google Patents
Heating block device Download PDFInfo
- Publication number
- CN101882590A CN101882590A CN 201010226557 CN201010226557A CN101882590A CN 101882590 A CN101882590 A CN 101882590A CN 201010226557 CN201010226557 CN 201010226557 CN 201010226557 A CN201010226557 A CN 201010226557A CN 101882590 A CN101882590 A CN 101882590A
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- China
- Prior art keywords
- heating block
- heat block
- piston
- heating
- compressing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to a heating block device, which comprises a heating block (1) and a vacuum hole (2), wherein a compressing component (3) is arranged on the heating block (1), the compressing component (3) comprises a top compressing structure, a joint and a rear end, wherein the joint is connected to the heating block (1), the rear end is fixed on a piston (4), and the piston (4) is arranged in a hollow groove below the heating block (1). The compressing component (3) is arranged at both the left and the right sides of the heating block (1). A spring (5) is arranged between the piston (4) and the heating block (1), and the vacuum hole (2) is arranged on the bottom of the heating block (1) and is below the spring (5). The top compressing structure of the compressing component (3) is of a concave hook-shaped structure. The invention can solve the problem that a gap is generated between a lead frame and the heating device when heating is carried out in the prior art, as a result, the lead frame cannot be locked.
Description
Technical field
The invention belongs to semiconductor packages bonding anchor clamps field, particularly relate to a kind of heating block device of semiconductor packages bonding anchor clamps.
Background technology
Need to use heating block device in the conductor encapsulation bonding technology, lead frame is placed on the heating block device and comes draw heat by heat block; Latch frame prevents that displacement from appearring in framework in bonding process simultaneously.Traditional heating block interposed structure is comparatively simple, only comprises heat block and one or several vacuum hole (as Fig. 1), and vacuum suction-operated makes to combine closely between lead frame and the heat block and reaches the purpose of latch frame.But in the actual job process, there is certain deviation in frame structure itself, when if deviation is big, only rely on the vacuum suction effect that framework and heat block surface are fitted tightly, cause and occur space 7(such as Fig. 2 between framework and heat block), do not reach the purpose of latch frame, and then have influence on the bonding technology effect.
Summary of the invention
Technical problem to be solved by this invention provides a kind of heating block device, and lead frame the space occurs, the problem that causes lead frame to lock in the prior art when heating and between the heater to solve.
The technical solution adopted for the present invention to solve the technical problems is: a kind of heating block device is provided, comprise heat block and vacuum hole, described heat block is provided with compressing member, compressing member is divided into top compressing structure, joint and end, wherein the joint is connected on the heat block, end is fixed on the piston, and described piston is arranged in the dead slot of heat block below.The left and right both sides of described heat block all are provided with compressing member.
Be provided with spring between described piston and the heat block, under the state of vacuumizing, drive piston by spring and slide, the below of spring, heat block bottom have vacuum hole.The top compressing structure of described compressing member is the hook formation that concaves.
Beneficial effect
The present invention is pressed on framework the heat block surface mechanically by increased the paw of lock function in heating block device, thereby avoids occurring the phenomenon of framework " unsettled ", reaches the purpose of latch frame; Simultaneously, this mechanical part has made full use of bonding machine vacuum plant, produces power by the air motion that vacuumizes, and does not need to increase other power set.
Description of drawings
Fig. 1 is existing bonding anchor clamps heating block device structural representation;
Fig. 2 is the unsettled phenomenon schematic diagram of slide holder that existing bonding anchor clamps heating block device occurs in bonding process;
Fig. 3 is a structure chart of the present invention;
Fig. 4 is a working state figure of the present invention.
Embodiment
Below in conjunction with specific embodiment, further set forth the present invention.Should be understood that these embodiment only to be used to the present invention is described and be not used in and limit the scope of the invention.Should be understood that in addition those skilled in the art can make various changes or modifications the present invention after the content of having read the present invention's instruction, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
As shown in Figure 3, a kind of heating block device, comprise heat block 1 and vacuum hole 2, described heat block 1 is provided with compressing member 3, compressing member 3 is divided into top compressing structure, joint and end, wherein the joint is connected on the heat block 1, and end is fixed on the piston 4, and described piston 4 is arranged in the dead slot of heat block 1 below.Described heat block 1 left and right both sides all are provided with compressing member 3.
Be provided with spring 5 between described piston 4 and the heat block 1, under the state of vacuumizing, drive piston 4 by spring 5 and slide, the below of spring 5, heat block 1 bottom have vacuum hole 2.The top compressing structure of described compressing member 3 is the hook formation that concaves.
As shown in Figure 4, when framework places on the heat block, the bonding apparatus vacuum plant is started working, vacuum plant acts on piston 4 by vacuum hole 2, piston 4 to spring 5 direction translations, drives compressing member 3 simultaneously and makes circular motion along joint, thereby make the hook-shaped top of compressing member 3 press to framework 6 under vacuum action, and then realize framework 6 is pressed on the heat block surface, thereby realize the purpose of latch frame; After finishing the bonding operation, the bonding apparatus vacuum plant quits work, under the reset response of spring 5, piston 4 spring 5 translations dorsad, drive compressing member 3 once more and make circular motion, make the hook-shaped top of compressing member 3 break away from framework 6 surfaces, and then unlock and enter next duty cycle along joint.
Claims (4)
1. heating block device, comprise heat block (1) and vacuum hole (2), it is characterized in that: described heat block (1) is provided with compressing member (3), compressing member (3) is divided into top compressing structure, joint and end, wherein the joint is connected on the heat block (1), end is fixed on the piston (4), and described piston (4) is arranged in the dead slot of heat block (1) below.
2. a kind of heating block device according to claim 1 is characterized in that: the left and right both sides of described heat block (1) all are provided with compressing member (3).
3. a kind of heating block device according to claim 1 is characterized in that: be provided with spring (5) between described piston (4) and the heat block (1), the below of spring (5), heat block (1) bottom have vacuum hole (2).
4. a kind of heating block device according to claim 1 is characterized in that: the top compressing structure of described compressing member (3) is the hook formation that concaves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010226557 CN101882590B (en) | 2010-07-15 | 2010-07-15 | Heating block device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010226557 CN101882590B (en) | 2010-07-15 | 2010-07-15 | Heating block device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101882590A true CN101882590A (en) | 2010-11-10 |
| CN101882590B CN101882590B (en) | 2013-01-09 |
Family
ID=43054557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010226557 Active CN101882590B (en) | 2010-07-15 | 2010-07-15 | Heating block device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101882590B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105921873A (en) * | 2015-02-27 | 2016-09-07 | 库利克和索夫工业公司 | Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06252183A (en) * | 1993-03-01 | 1994-09-09 | Nec Corp | Semiconductor chip mounting stage |
| JPH11214486A (en) * | 1998-01-27 | 1999-08-06 | Komatsu Ltd | Apparatus for treating substrate |
| US6513848B1 (en) * | 1999-09-17 | 2003-02-04 | Applied Materials, Inc. | Hydraulically actuated wafer clamp |
| CN100407398C (en) * | 2005-07-29 | 2008-07-30 | 东京毅力科创株式会社 | Substrate lifting device and substrate processing device |
| CN101728300A (en) * | 2008-10-29 | 2010-06-09 | 沈阳芯源微电子设备有限公司 | Novel non-vacuum adsorption wafer clamping mechanism |
| CN201732772U (en) * | 2010-07-15 | 2011-02-02 | 南通富士通微电子股份有限公司 | Heating block device |
-
2010
- 2010-07-15 CN CN 201010226557 patent/CN101882590B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06252183A (en) * | 1993-03-01 | 1994-09-09 | Nec Corp | Semiconductor chip mounting stage |
| JPH11214486A (en) * | 1998-01-27 | 1999-08-06 | Komatsu Ltd | Apparatus for treating substrate |
| US6513848B1 (en) * | 1999-09-17 | 2003-02-04 | Applied Materials, Inc. | Hydraulically actuated wafer clamp |
| CN100407398C (en) * | 2005-07-29 | 2008-07-30 | 东京毅力科创株式会社 | Substrate lifting device and substrate processing device |
| CN101728300A (en) * | 2008-10-29 | 2010-06-09 | 沈阳芯源微电子设备有限公司 | Novel non-vacuum adsorption wafer clamping mechanism |
| CN201732772U (en) * | 2010-07-15 | 2011-02-02 | 南通富士通微电子股份有限公司 | Heating block device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105921873A (en) * | 2015-02-27 | 2016-09-07 | 库利克和索夫工业公司 | Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same |
| CN110834141A (en) * | 2015-02-27 | 2020-02-25 | 库利克和索夫工业公司 | Bond head assembly, thermal compression bonding system, and methods of assembling and operating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101882590B (en) | 2013-01-09 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Jiangsu province Nantong City Chongchuan road 226001 No. 288 Patentee after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee before: Fujitsu Microelectronics Co., Ltd., Nantong |
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| CP03 | Change of name, title or address |