CN101868887B - Laser processing equipment - Google Patents

Laser processing equipment Download PDF

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Publication number
CN101868887B
CN101868887B CN2008801167230A CN200880116723A CN101868887B CN 101868887 B CN101868887 B CN 101868887B CN 2008801167230 A CN2008801167230 A CN 2008801167230A CN 200880116723 A CN200880116723 A CN 200880116723A CN 101868887 B CN101868887 B CN 101868887B
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China
Prior art keywords
laser beam
alignment unit
transducer
sensor
laser
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CN101868887A (en
Inventor
金贤中
金大镇
严升焕
李光在
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AP Systems Inc
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Kornic Systems Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
  • Recrystallisation Techniques (AREA)

Abstract

Laser processing equipment is provided. The laser beam processing equipment includes a laser resonator, an optical system, a chamber, a reflector, and a laser beam aligning unit. The laser resonator resonates a laser beam. The optical system converts the laser beam resonated by the laser resonator to have an energy density of a beam profile with a predetermined beam width. The laser beam converted by the optical system is radiated onto a processing object disposed in the chamber. The reflector is disposed between the laser resonator and the chamber to reflect the laser beam. The laser beam aligning unit aligns the laser beam radiated into the chamber. The laser beam aligning unit includes an aligning member installed between the reflector and the processing object and disposed in a travel path of the laser beam. The aligning member defines a through-hole that is greater in area than a cross-section of the laser beam to enable the laser beam to pass therethrough. The driver drives the reflector to control the travel path of the laser beam reflected by the reflector. The controller controls the driver to control a distance between a center of the laser beam and a center of the through-hole, based on the laser beam detected as passing through the through-hole of the aligning member.

Description

Laser processing device
Technical field
The disclosure relates to a kind of laser processing device, more specifically, relates to a kind of laser processing device, the structure that it has through improvement, make can calibrate irradiation on processing object laser beam and be convenient to compensate the recalibration of laser beam.
Background technology
In general, glass substrate is used as the substrate of Organic Light Emitting Diode (OLED) and LCD (LCD).Glass substrate is after the laser annealing that experience is undertaken by laser anneal device is handled, and glass substrate is that perhaps its degree of crystallinity of crystallization improves, and is as shown in Figure 1.
With reference to Fig. 1; Traditional laser anneal device 100 ' comprising: optical system, and said optical system comprises: launch the laser resonator 10 ' of PRK, be used for a plurality of reflectors of reflection lasering beam; Telephoto lens (telescopic lens) (not shown); Beam-averaging device (homogenizer) (not shown), field lens (field lens) (not shown), and collector lens 24 '; And chamber 30 ', be placed with glass substrate 33 ' in the said chamber 30 '.Beam-averaging device is placed between second reflector 43 ' and the 3rd reflector 44 '.In addition, attenuator 46 ' is placed between first subreflector 41 ' and first reflector 42 '.First subreflector 41 ' is constructed to and can moves point-blank through the actuator (not shown), and power meter 47 ' can Laser Measurement resonant cavity 10 ' institute's emitted laser bundle.In addition, second subreflector 45 ' is constructed to and can on the described direction of bilateral arrow, moves point-blank through the actuator (not shown), and power meter 47 ' can be measured second subreflector, 45 ' institute's laser light reflected bundle.A pair of micrometer 611 ' and 621 ' links with first reflector 42 ' and second reflector 43 ' respectively; And can control the reflecting surface of first reflector 42 ' and second reflector 43 ' and the angle between the laser beam through the operation micrometer, thereby can change the reflection direction of laser beam.Chain-dotted line among Fig. 1 is represented the light path of laser beam.
In the laser anneal device 100 ' of above-mentioned structure, need calibrate optical system, arrive on the glass substrate 33 ' so that have the laser beam irradiation of required form and beam profile (beam profile).This optical system calibration can be divided into original beam calibration, optical element calibration and fine tuning substantially, and wherein the original beam calibration is even more important.
For original beam calibration (that is, calibration is from laser resonator 10 ' emitted laser bundle), must make laser beam flatly or vertically advance about light path and finally drop on the center of optical system at predetermined altitude.Carry out said original beam calibration through driving micrometer to control first reflector 42 ' and second reflector 43 '.The particularly important is, laser beam is propagated between second reflector 43 ' and the 3rd reflector 44 ' in line, perhaps at the light path regional spread that is placed with beam-averaging device (its laser beam that will have Gaussian profile changes over the flat-top structure).
Be aligned in the laser beam that advances between second reflector 43 ' and the 3rd reflector 44 ' thus; Control laser resonator 10 ' so that institute's emitted laser bundle irradiation at the center of first reflector 42 '; And the operation micrometer to be controlling second reflector, thereby makes the center of reflector institute laser light reflected bundle irradiation at second reflector 43 ' of winning.A pair of cross hair 50 ' is installed between second reflector 43 ' and the 3rd reflector 44 '.Operate each micrometer 611 ' and 621 ' controlling first reflector 42 ' and second reflector 43 ', thereby make laser beam pass the center of cross hair 50 '.In more detail; This in the cross hair 50 ' each all with and another cross hair mode of separating preset distance be installed on the optical track (not shown) between second reflector 43 ' and the 3rd reflector 44 '; And control and drive the micrometer 611 ' of first reflector and the micrometer 621 ' of second reflector respectively; Make laser beam pass this, thereby make laser beam pass the center of each cross hair in line each the center in the cross hair 50 '.Here, the center of cross hair 50 ' is placed as mutual aligning, and (burn paper) the (not shown) inspection of can burning paper as sacrificial offerings through utilization is passed the laser beam at cross hair center.After collimated laser beam, must remove cross hair 50 '.
Yet; In the process of utilizing above-mentioned cross hair 50 ' to calibrate, there is following inconvenience, must carry out repeatedly calibration process; Each calibration inspection of the laser beam direction of propagation all must be used and burn paper as sacrificial offerings, and another inconvenience is manually to control each micrometer 611 ' and 621 ' times without number.In addition, owing to carry out calibration process by the technician, so technician's health possibly directly, indirectly and/or all of a sudden injured by laser beam.
In addition; In the process of using laser anneal device; When laser anneal device 100 ' is changed---for example, if between the window phase of cleaning or replacing laser chamber, during the calibration laser pipe or in cleaning or during changing resonant cavity; The section of laser beam is changed---so, must at first check the state of the laser beam that passes optical system.For this reason, after optical system is opened, above-mentioned cross hair must be installed, to check and to proofread and correct, this relates to above-mentioned restriction once more.
The section of the laser beam of irradiation on the glass substrate 33 ' is the flat-top section normally.Yet, preferably, through dissimilar beam profile is processed test, to obtain to be used to optimize the laser beam profiles of the optimization of processing.For example, laser section that can be using inclined.But change this beam profile; There is following inconvenience; Must open the door of laser resonator 10 ' and control said resonant cavity, especially be arranged on micrometer 611 ' and 621 ' on the output coupler, perhaps must open the lid and the micrometer 611 ' and 621 ' of control setting on first reflector 42 ' and second reflector 43 ' of optical system.
Summary of the invention
Technical problem
The disclosure provides a kind of laser processing device, and it can make irradiation keep identical shape and section to the laser beam on the processing object through following aspect, and these aspects comprise: can prevent the Body contact direct or indirect with laser beam; Can be easily collimated laser beam automatically; When the light path of laser beam in the cleaning of chamber window that carries out laser beam respectively and resonant cavity with when being changed between the stage of replacement, can be under the situation that needn't dismantle optical element collimated laser beam easily; And the calibration and the compensating offset (misalignment) automatically of monitoring laser bundle in real time.
The disclosure also provides a kind of laser processing device, its through utilize can the shield portions laser beam the structure through improvement change the final section of the laser beam of irradiation on the processing object, can optimize processing conditions.
Technical scheme
According to exemplary embodiment, a kind of laser processing device is provided, comprising: laser resonator, said laser resonator make laser beam produce resonance; Optical system, the laser beam that said optical system will resonate via laser resonator is converted into the energy density of the beam profile with predetermined width of light beam; Chamber, in said chamber, the laser beam irradiation that transforms via said optical system is on the processing object that is placed in the said chamber; Reflector, said reflector are placed between said laser resonator and the said chamber, with reflection lasering beam; And laser beam alignment unit; The laser beam of said laser beam alignment sing1e unit calibration irradiation in the said chamber; Wherein the laser beam alignment unit comprises: alignment unit, and said alignment unit is installed between reflector and the processing object, and is placed in the propagation path of laser beam; Said alignment unit delimited areas is greater than the through hole of the cross section of laser beam, so that said laser beam can pass said through hole; Driver, said driver drives reflector is with the propagation path of control via the laser beam of said reflector reflects; And controller, said controller is controlled said driver, thus detected laser beam is controlled the distance between laser beam center and the through hole center during based on the through hole that passes alignment unit when laser beam.
Beneficial effect
When collimated laser beam, can avoid direct or indirect Body contact.In addition, when the light path of laser beam is changed during the cleaning of the window of the chamber that carries out laser beam respectively and resonant cavity and replacing, can be under the situation that needn't dismantle optical element collimated laser beam automatically and easily.In addition, the calibration of monitoring laser bundle and automatically compensating offset in real time, thus can make the net shape of the laser beam of irradiation on the processing object keep identical with section.In addition, can change the final section of the laser beam of irradiation on the processing object, to optimize processing conditions.
Description of drawings
Fig. 1 is the exemplary configurations sketch map of traditional laser processing device;
Fig. 2 is the structural representation of laser processing device according to an exemplary embodiment of the present invention;
Fig. 3 is the perspective view according to a pair of alignment unit of the exemplary embodiment of Fig. 2;
Fig. 4 is control module figure, is used for being shown in the laser beam alignment control according to the laser processing device of the exemplary embodiment of Fig. 2;
Fig. 5 to Fig. 7 is the diagram utilization changes laser beam profiles according to the laser processing device of the exemplary embodiment of Fig. 2 a profile.
Embodiment
According to an exemplary embodiment, controller can Control Driver so that the center of through hole can be passed in the center of laser beam.
According to another exemplary embodiment; The laser beam alignment unit may further include the first sensor and second transducer; The said first sensor and second transducer link with alignment unit respectively; Being placed on the both sides of through hole, thus the said first sensor and the second sensor incoming laser beam and when detecting laser beam to the controller output detection signal.Distance between the first sensor and second transducer can be arranged so that laser beam can pass between the first sensor and second transducer.When first sensor touched laser beam and output detection signal, controller can drive the moment of driver up to the second transducer output detection signal.Driving driver after the moment of another detection signal of first sensor output; Controller can be in first reference time output drive signal; To drive driver; So that the center of through hole is passed at the center of laser beam, said first reference time based on from the second transducer output detection signal the time be carved into used time in the moment of another detection signal of first sensor output.When first sensor and second transducer all beyond the light path at laser beam and not during output detection signal; Driver can be driven up to the moment of first sensor output detection signal, and driver can be driven the moment up to the second transducer output detection signal.Then; Controller can be in second reference time output drive signal to drive driver; Make the center of laser beam pass the center of through hole, said second reference time based on from the first sensor output detection signal the time be carved into used time in the moment of another detection signal of second transducer output.
According to another exemplary embodiment, the laser beam alignment unit can further be provided with the 3rd transducer and four-sensor, and when detecting laser beam, said the 3rd transducer and four-sensor are to the controller output detection signal.Third and fourth transducer can be respectively links with alignment unit, radially being placed on each side of through hole with the first sensor and second transducer with respect to the center of through hole, thereby detects incoming laser beam.Distance between the 3rd transducer and the four-sensor can be arranged so that laser beam can pass between the 3rd transducer and four-sensor.When the 3rd transducer touched laser beam and output detection signal, controller can drive driver, up to the moment of four-sensor output detection signal, and drove the moment of driver up to another detection signal of the 3rd transducer output.Then; Controller can be in the 3rd reference time output drive signal; To drive driver; So that the center of through hole is passed at the center of laser beam, said the 3rd reference time based on from the four-sensor output detection signal the time be carved into used time in the moment of another detection signal of the 3rd transducer output.When the 3rd transducer and four-sensor all beyond the laser beam light path and not during output detection signal; Driver can be driven up to the moment of the 3rd transducer output detection signal, and driver can be driven the moment up to the four-sensor output detection signal.Then; In order to make the center of laser beam pass the center of through hole; Controller can be in the 4th reference time output drive signal; Driving driver, said the 4th reference time based on from the 3rd transducer output detection signal the time be carved into used time in the moment of another detection signal of four-sensor output.
According to another exemplary embodiment, a plurality of reflectors can be placed on respectively between laser resonator and the processing object, and a plurality of alignment units can be installed between the adjacent reflector.A plurality of alignment units can be installed to be and make the through hole of each alignment unit place with one heart.First sensor, second transducer, the 3rd transducer and four-sensor can link with each alignment unit respectively; A plurality of drivers can be installed to be corresponding with reflector; Be placed on a plurality of reflectors between laser resonator and a plurality of alignment unit with driving; And controller can be controlled each driver, so that laser beam can pass the through hole center of each alignment unit.
According to an exemplary embodiment again; Optical system can comprise beam-averaging device; First reflector, second reflector and the 3rd reflector sequentially are placed between laser resonator and the alignment unit along the direction of propagation of laser beam; First alignment unit, said beam-averaging device and second alignment unit sequentially are placed between second reflector and the 3rd reflector along the direction of propagation of laser beam; First reflector and second reflector can be driven by first driver and second driver respectively; And controller can be controlled first driver and second driver, so that the center of through hole of through hole and second alignment unit of first alignment unit can be passed in the center of laser beam.
Hereinafter, will describe concrete embodiment in detail with reference to accompanying drawing.
Fig. 2 is the structural representation of laser processing device according to an exemplary embodiment of the present invention; Fig. 3 is the perspective view according to a pair of alignment unit of the exemplary embodiment of Fig. 2; Fig. 4 is control module figure, is used for being shown in the laser beam alignment control according to the laser processing device of the exemplary embodiment of Fig. 2.
With reference to Fig. 2 to Fig. 4, identical with above-mentioned traditional embodiment, be constructed to laser anneal device according to the laser processing device 100 of exemplary embodiment.Chain-dotted line among Fig. 2 is represented the light path of laser beam.
Laser processing device 100 is provided with laser resonator 10, optical system 20, chamber 30, reflector and laser beam alignment unit.
Laser resonator 10 produces such as the laser beam of excimer laser beam and it is resonated.
20 pairs of laser beams of optical system are improved, so that said laser beam has the energy density of the beam profile of predetermined width of light beam.Optical system 20 comprises a plurality of optical elements, and these optical elements comprise: telephoto lens 21, beam-averaging device 22, field lens and collector lens 24, and carry out the function of widening laser beam and making the laser beam homogenizing thus, thereby make laser beam change into the laser beam of elongation.
Chamber 30 has the inner space 31 of defining the annealing space.Platform 32 is installed in the inner space 31, and processing object or the glass substrate 33 that is used for laser annealing are placed on platform 32.Transparent window 34 is installed in the top of chamber 30, and the laser beam that changes through optical system 20 passes said transparent window 34.
The reflector reflects laser beam.Said reflector is placed between laser resonator 10 and the chamber 30.In the present embodiment, a plurality of reflectors are installed, its number is 5.At length say, first subreflector 41, first reflector 42, second reflector 43, the 3rd reflector 44 and second subreflector 45 sequentially are installed along the direction of propagation of laser beam.Be installed as: actuator 46 is between first subreflector 41 and first reflector 42; Telephoto lens 21 is between first reflector 42 and second reflector 43; Beam-averaging device 22 and field lens 23 are between second reflector 43 and the 3rd reflector 44, and collector lens 24 is between the 3rd reflector 44 and second subreflector 45.Here; First subreflector 41 and second subreflector 45 are installed to be and can move point-blank through the actuator (not shown); And when first subreflector 41 and second subreflector 45 are placed in the light path of laser beam, can be through the energy of power meter 47 Laser Measurement bundles.
The laser beam alignment unit is set to be used for calibrating the laser beam that irradiation advances chamber 30.The laser beam alignment unit comprises: alignment unit 51 and 52, driver 61 and 62, transducer 71,72,73 and 74 and controller 80.
Alignment unit 51 and 52 is installed between the reflector that adjoins, and a plurality of alignment unit 51 and 52 is placed along the propagation path of laser beam.Especially, between second reflector 43 and the 3rd reflector 44, the alignment unit 51 and 52 in the present embodiment is set in couples.In other words, between second reflector 43 and the 3rd reflector 44, sequentially arrange first alignment unit 51 and second alignment unit 52 along the direction of propagation of laser beam.Through hole 511 and 521 is defined at respectively in first alignment unit 51 and second alignment unit 52.Through hole 511 and 521 is formed the cross-sectional area greater than laser beam, thereby makes laser beam can pass through hole 511 and 521.And the through hole 511 of first alignment unit 51 and the through hole 521 of second alignment unit 52 are placed concentrically with respect to one another.First alignment unit 51 is installed in (not shown) on the optical track with second alignment unit 52 with identical height, and in the present embodiment, and particularly, the through hole 511 and 521 of alignment unit center (C) separately is set to the end with said optical track at a distance of 90mm.
Driver 61 and 62 drives reflector, with the propagation path of control laser beam.In the present embodiment, driver 61 and 62 is provided with in couples, is placed on a plurality of reflectors between laser resonator 10 and alignment unit 51 and 52 to drive respectively, more specifically, is first reflector 42 and second reflector 43.In other words, first driver 61 drives first reflector, 42, the second drivers 62 and drives second reflector 43.Here, identical with above-mentioned conventional laser processing unit (plant), each in the driver 61 and 62 all is constructed to comprise a pair of micrometer 611 and 621.When the micrometer 611 and 621 of each driver is driven, can change the angle of reflection of reflector 42 and 43 according to the direction of propagation of laser beam, thereby can control the reflection and the direction of propagation of laser beam.
Transducer 71,72,73 and 74 detects incoming laser beams, and according to detected laser beam to controller 80 (below will describe) output detection signal.In the present embodiment, transducer 71,72,73 and 74 is constructed to photoelectric sensor, and identical four transducers 71,72,73 and 74 link with first alignment unit 51 and second alignment unit 52 respectively.In other words, all link on each in the alignment unit 51 and 52 first sensor 71 is arranged, second transducer 72, the 3rd transducer 73 and four-sensor 74.
As shown in Figure 3; The first sensor 71 and second transducer 72 are placed on the both sides of through hole 511 and 521 respectively; Face one another in the left and right sides, and the 3rd transducer 73 and four-sensor 74 also are placed on the both sides of through hole 511 and 521 respectively, are faced one another in both sides up and down.Therefore, totally four transducers 71,72,73 and 74 centers with respect to through hole 511 and 521 (C) radially place.Correspondingly, transducer 71,72,73 that faces one another and 74 center are aimed at the center (C) of through hole 511 and 521.In addition, distance between the first sensor 71 and second transducer 72 and the 3rd transducer 73 and four-sensor 74 make laser beam passing between the first sensor 71 and second transducer 72 and between the 3rd transducer 73 and the four-sensor 74.In other words, the paired transducer 71 that faces one another and 72 and 73 and 74 is detection laser beam simultaneously, but each centering in transducer 71 and 72 and 73 and 74 has only a transducer can detect the laser beam that passes through hole 511 and 521.For example, if first sensor 71 and the 3rd transducer 73 detect laser beam, then second transducer 72 and four-sensor 74 detect less than laser beam.
Controller 80 control first driver 61 and second drivers 62, thus the distance between through hole 511 and 521 centers (C) and the laser beam center controlled based on the detection signal that is received from each transducer 71,72,73 and 74.Particularly, the controller in the present embodiment 80 is controlled to each in the micrometer 621 of micrometer 611 and second driver 62 of the first right driver 61.Controller 80 is also controlled first driver 61 and second driver 62, thereby makes the center of laser beam pass the through hole 511 of first alignment unit 51 and second alignment unit 52 and 521 center (C).
To provide description below for the exemplary embodiment of the control procedure of controller 80.
Controller 80 work make laser beam can pass the center (C) of the through hole 511 of first alignment unit to control first driver 61.In other words, controller 80 is according to controlling first driver 61 from the detection signal of first sensor 71, second transducer 72, the 3rd transducer 73 and four-sensor 74, thereby makes laser beam pass the center (C) of the through hole 511 of first alignment unit.
When using the first sensor 71 and second transducer 72, the ability collimated laser beam will be described in detail this so that it passes the horizontal center of each alignment unit below.
When laser beam contact first sensor and first sensor 71 output detection signals, controller 80 drives first driver 61, thereby makes second transducer, 72 output detection signals, with the propagation path of control laser beam.Here, second transducer, 72 output detection signals only.Then, controller 80 drives first driver 61, thereby makes first sensor 71 another detection signals of output, with the direction of propagation of control laser beam.Here, first sensor 71 output detection signals only.Then, controller 80 is at the first reference time (t 1) interior output drive signal, so that laser beam passes the center between the first sensor 71 and second transducer 72.Here, the first reference time (t 1) be based on from second transducer, 72 output detection signals the time be carved into another detection signals of first sensor 71 output required required time of the moment be provided with.
Controller 80 in the present embodiment is configured in order to controlling first driver 61 particularly, thereby makes second transducer, 72 output initial examination and measurement signals, first sensor 71 another detection signals of output afterwards.In this case, controller 80 is with the first reference time (t 1) be calculated as from second transducer 72 output initial examination and measurement signals the time be carved into moment required time half the of first sensor 71 another initial examination and measurement signals of output.Thus, at the first reference time (t 1) interior output drive signal, so center that can collimated laser beam makes it pass the center (C between the first sensor 71 and second transducer 72 1).
When laser beam passes the first sensor 71 and second transducer 72; If the first sensor 71 and second transducer 72 be output detection signal not all; Then controller 80 drives the propagation path of first driver 61 with the control laser beam, thereby makes first sensor 71 output detection signals.Here, first sensor 71 output detection signals only.Thereafter, controller 80 drives the propagation path of first driver 61 with the control laser beam, thereby makes second transducer, 72 output detection signals.Here, second transducer, 72 output detection signals only.Then, controller is at the second reference time (t 2) interior output drive signal, so that laser beam passes the center between the first sensor 71 and second transducer 72.Here, the second reference time (t 2) be based on from first sensor 71 output detection signals the time be carved into the time period in the moment of second transducer, 72 output detection signals and be provided with.
Controller 80 in the present embodiment is constructed so that first sensor 71 output initial examination and measurement signals particularly, afterwards second transducer, 72 another initial examination and measurement signals of output.In this case, controller 80 is with the second reference time (t 2) be calculated as from first sensor 71 output initial examination and measurement signals the time be carved into moment required time half the of second transducer, 72 another initial examination and measurement signals of output.Thus, at the second reference time (t 2) interior output drive signal, so center that can collimated laser beam makes it pass the center (C between the first sensor 71 and second transducer 72 1).
Therefore, first sensor 71 output detection signal whether no matter, controller 80 is all at the first reference time (t 1) or the second reference time (t 2) interior output drive signal, so that the center (C between the first sensor 71 and second transducer 72 is passed at the center of laser beam 1).
In addition, when using the 3rd transducer 73 and four-sensor 74, laser beam can be set at the vertical center between each alignment unit.Use the control procedure of the 3rd transducer 73 and four-sensor 74 identical with the control procedure of second transducer 72 with use first sensor 71.Particularly; When the 3rd transducer 73 output detection signals; Controller 80 drives first driver 61, thereby makes the initial detection signal of four-sensor 74 outputs, and controller 80 drives first driver 61 then; Thereby make the 3rd transducer 73 export initial detection signal once more, controller 80 is at the 3rd reference time (t thereafter 3) interior output drive signal, with final collimated laser beam.Here, the 3rd reference time (t 3) be from four-sensor 74 output initial examination and measurement signals the time be carved into moment required time half that the 3rd transducer 73 is exported the initial examination and measurement signal once more.
When laser beam passes the 3rd transducer 73 and four-sensor 74; If the 3rd transducer 73 and four-sensor 74 be output detection signal not all; Then controller 80 drives first driver 61; Thereby make the initial detection signal of the 3rd transducer 73 outputs, and controller 80 drivings first driver 61, thereby the initial detection signal of four-sensor 74 outputs made.Then, controller 80 is at the 4th reference time (t 4) interior output drive signal, with collimated laser beam.Here, the 4th reference time (t 4) be from the 3rd transducer 73 output initial examination and measurement signals the time be carved into moment required time half the of four-sensor 74 output initial examination and measurement signals.
Therefore, the 3rd transducer 73 output detection signal whether no matter, controller 80 is all at the 3rd reference time (t 3) or the 4th reference time (t 4) interior output drive signal, so that the center (C between the 3rd transducer 73 and the four-sensor 74 is passed at the center of laser beam 2).
As stated, controller 80 can be at the first reference time (t 1) or the second reference time (t 2) interior output drive signal, so that the center (C between the first sensor 71 and second transducer 72 is passed at the center of laser beam 1); And controller 80 can be at the 3rd reference time (t 3) or the 4th reference time (t 4) interior output drive signal, so that the center (C between the 3rd transducer 73 and the four-sensor 74 is passed at the center of laser beam 2).Therefore, when controller 80 at the first reference time (t 1) or the second reference time (t 2) interior output drive signal, and at the 3rd reference time (t 3) or the 4th reference time (t 4) during interior output drive signal, the center of laser beam is calibrated, to pass the center (C between the first sensor 71 and second transducer 72 1) and the 3rd transducer 73 and four-sensor 74 between center (C 2), thereby along two axis calibration laser beams, with the center (C) of the through hole 511 that passes first alignment unit.
Controller 80 work make laser beam can pass the center (C) of the through hole 521 of second alignment unit 52 to control second driver 62.In other words; When controller 80 when controlling second driver 62 from the detection signal of first sensor 71, second transducer 72, the 3rd transducer 73 and four-sensor 74; Laser beam is calibrated the center (C) with the through hole 521 that passes second alignment unit, and first sensor 71, second transducer 72, the 3rd transducer 73 and four-sensor 74 are attached to second alignment unit 52.Collimated laser beam makes control procedure and the collimated laser beam at the center (C) of its through hole that passes second alignment unit 521 make the control procedure at center (C) of its through hole that passes first alignment unit 511 identical, therefore, at this its detailed description is not provided.
As stated, controller 80 can be controlled first driver 61 and second driver 62, so that laser beam passes the through hole 511 of first alignment unit and second alignment unit and 521 center (C).Because the through hole 511 of first alignment unit and the through hole 521 of second alignment unit are set at sustained height, therefore, can make it pass through hole 511 and 521 center (C) separately along two axis calibration laser beams, advance abreast then.Therefore, in the present embodiment, need not remove alignment unit 51 and 52, and controller 80 can come collimated laser beam through function driver 61 and 62 automatically.Therefore, compare with traditional laser processing device, collimated laser beam more easily, and do not exist in that human body is exposed to the danger under the laser beam between alignment epoch.
When maintenance laser resonator 10, need collimated laser beam.
When control output coupler 11 with cleaning or when changing the window of laser chamber, when cleaning or when changing resonant cavity, and when calibration and replacing laser tube, the direction and the beam profile of laser beam are changed.This variation can cause irradiation to change to the laser beam profiles on the processing object so that laser beam has different characteristic during passing optical system and before passing optical system.This variation takes place owing to suitably not calibrating original beam.Therefore; When collimated laser beam as described above; Can compensate this laser beam profiles that between the turn(a)round of laser resonator, is produced changes; Particularly, through the unknown skew of compensation contingent original beam during annealing in process, above-mentioned calibration can be used to carry out reliable laser annealing.
The laser beam alignment unit further comprises sensor actuator (not shown) and alignment unit actuator 90.
A plurality of sensor actuator (not shown) are set, and its quantity is corresponding with the quantity of transducer, thereby makes each transducer 71,72,73 and 74 move point-blank.Particularly, as shown in Figure 3, each in the transducer 71,72,73 and 74 can along the direction of four-headed arrow near or away from the center (C) of through hole.Therefore; When transducer 71,72,73 and 74 moves through their sensor actuator respectively point-blank; When changing the position of each transducer, the through hole 511 of alignment unit or 521 center can be departed from the center of four transducers that link with each alignment unit.Therefore, according to user's needs, can calibrate so that the misalignment through hole 511 of laser beam or 521 center.
Alignment unit actuator 90 is set in couples, and said alignment unit actuator drives alignment unit 51 and 52 respectively point-blank.Each alignment unit actuator 90 is moving alignment unit 51 and 52 respectively with the crossing direction in the direction of propagation of the laser beam that passes alignment unit, particularly, making progress, moving downwards and on the direction of level, shown in the four-headed arrow of Fig. 3.Like this, each alignment unit 51 or 52 can move point-blank, and can laser beam profiles be changed to state shown in Figure 6 from state shown in Figure 5; Wherein, Laser beam is calibrated between second reflector 43 and the 3rd reflector 44, flatly to advance in Fig. 5, in Fig. 6, passes through to move in the alignment unit 51 and 52, for example; First alignment unit 51 that moves up makes the part of laser beam blocked by first alignment unit 51.
If make laser beam be incident on the state on first alignment unit 51 for the center of laser beam with on-right angle from the align mode inclination of laser beam shown in Figure 5 through at least one that drives in first driver 61 and second driver 62; And laser beam advances with heeling condition shown in Figure 7; First alignment unit 51 can block the part of laser beam so, thereby changes the section of laser beam.
Likewise, in the present embodiment, can through move point-blank alignment unit 51 with 52 or driving driver 61 and 62 change the section of laser beam.The processing conditions that therefore, can obtain to optimize through this process variables of section that changes laser beam.
In order to change the section of laser beam as described above, the controller 80 in the present embodiment is according to from least one and alignment unit actuator (not shown) in the detection signal Control Driver 61 and 62 of each transducer 71,72,73 and 74.Particularly; Controller 80 is constructed to can Control Driver 61 and 62 and alignment unit actuator (not shown); Thereby through blocking under above-mentioned state, promptly laser beam abreast or the part of the laser beam under the state that advances with certain inclination angle change the section of laser beam.
Although said laser processing device is to describe with reference to concrete embodiment, the invention is not restricted to this.Therefore, it should be appreciated by those skilled in the art that under situation about not breaking away from, can carry out various improvement and modification the present invention the appended the spirit and scope of the present invention that claim limited.
For example, though exemplary embodiment is constructed to be provided with a pair of alignment unit, alternatively, also can be provided with one, three or more a plurality of alignment unit.
In addition, though exemplary embodiment has been constructed to four transducers and each alignment unit links, alternatively, not specifically to need four transducers, but can have only a pair of relative transducer and each alignment unit to link.
In addition, though exemplary embodiment is constructed to make the center of laser beam to pass the center of through hole, alternatively,, heart is passed if the reference time is set to difference.

Claims (9)

1. laser processing device comprises:
Laser resonator, said laser resonator make laser beam produce resonance;
Optical system, the said laser beam that said optical system will resonate via said laser resonator is converted into the energy density of the beam profile with predetermined width of light beam;
Chamber, in said chamber, the said laser beam irradiation that is transformed by said optical system is on the processing object that is placed in the said chamber;
Reflector, said reflector are placed between said laser resonator and the said chamber, to reflect said laser beam; And
Laser beam alignment unit, the said laser beam alignment sing1e unit calibration irradiation said laser beam in the said chamber,
Wherein, said laser beam alignment unit comprises:
Alignment unit; Said alignment unit is installed between said reflector and the said processing object; And said alignment unit is placed in the propagation path of said laser beam; Said alignment unit delimited areas is greater than the through hole of the cross section of said laser beam, so that said laser beam can pass said through hole;
Driver, the said reflector of said driver drives is with the propagation path of control via the said laser beam of said reflector reflects; And
Controller, said controller is controlled said driver, thereby, control the distance between the center of center and said through hole of said laser beam based on detected said laser beam when said laser beam passes the through hole of alignment unit.
2. laser processing device according to claim 1, wherein, said controller is controlled said driver, so that the center of said through hole is passed at the center of said laser beam.
3. laser processing device according to claim 2; Wherein, Said laser beam alignment unit further comprises the first sensor and second transducer, and said first sensor and said second transducer link with said alignment unit respectively, and is placed on the both sides of said through hole; To detect the laser beam of incident; And to said controller output detection signal, the distance between said first sensor and said second transducer makes said laser beam between said first sensor and said second transducer, to pass when detecting said laser beam
Wherein, When said first sensor detects said laser beam and exports said detection signal; The said driver of said controller drives, up to the moment that said second transducer is exported said detection signal, and the said driver of said controller drives; Export the moment of said detection signal once more up to said first sensor; Thereafter, said controller in first reference time output drive signal to drive said driver, so that the center of said through hole is passed at the center of said laser beam; Said first reference time be based on from said second transducer export said detection signal the time be carved into said first sensor and export the used time in the moment of said detection signal once more and be provided with, and
Beyond said first sensor and said second transducer all depart from the route of transmission at said laser beam and not during output detection signal; The said driver of said controller drives; When said first sensor is exported said detection signal; And the said driver of said controller drives; When said second transducer was exported said detection signal, thereafter, said controller was exported said drive signal to drive said driver in second reference time; So that the center of said through hole is passed at the center of said laser beam, said second reference time be based on from said first sensor output detection signal the time be carved into the said second transducer output detection signal the used time in the moment be provided with.
4. laser processing device according to claim 3; Wherein, Said laser beam alignment unit further comprises the 3rd transducer and four-sensor; Said the 3rd transducer and said four-sensor link with said alignment unit respectively, and are placed on the opposite side of said through hole, radially to arrange with respect to the center of said through hole with said first sensor and said second transducer; Said the 3rd transducer and four-sensor detect incoming laser beam; And to said controller output detection signal, the distance between said the 3rd transducer and the said four-sensor makes said laser beam between said the 3rd transducer and said four-sensor, to pass when detecting said laser beam
Wherein, When said the 3rd sensor to said laser beam and when exporting said detection signal, the said driver of said controller drives is up to the moment that said four-sensor is exported said detection signal; And the said driver of said controller drives; Up to said the 3rd transducer moment of output detection signal once more, thereafter, said controller is output drive signal in the 3rd reference time; To drive said driver; So that the center of said through hole is passed at the center of said laser beam, said the 3rd reference time be based on from said four-sensor export said detection signal the time be carved into the used time in the moment that said the 3rd transducer exports said detection signal once more and be provided with, and
Beyond said the 3rd transducer and said four-sensor all depart from the propagation path at said laser beam and when not exporting said detection signal; The said driver of said controller drives is up to moment that said the 3rd transducer is exported said detection signal; And the said driver of said controller drives; Up to the moment that said four-sensor is exported said detection signal; Thereafter, said controller is exported said drive signal in the 4th reference time, to drive said driver; So that the center of said through hole is passed at the center of said laser beam, said the 4th reference time be based on from said the 3rd transducer output detection signal the time be carved into said four-sensor output detection signal the used time in the moment be provided with.
5. laser processing device according to claim 4, wherein
Said first reference time be from said second transducer begin to export said detection signal the time be carved into time half that said first sensor begins to export the moment of said detection signal once more,
Said second reference time be from said first sensor begin to export said detection signal the time be carved into time half that said second transducer begins to export the moment of said detection signal,
Said the 3rd reference time be from said four-sensor begin to export said detection signal the time be carved into time half that said the 3rd transducer begins to export the moment of said detection signal once more, and
Said the 4th reference time be from said the 3rd transducer begin to export said detection signal the time be carved into time half that said four-sensor begins to export the moment of said detection signal.
6. laser processing device according to claim 4, wherein,
A plurality of said reflectors are placed between said laser resonator and the said processing object,
A plurality of said alignment units are installed between the adjacent said reflector,
Said alignment unit is installed to be and makes its through hole separately place with one heart,
Said first sensor, said second transducer, said the 3rd transducer and said four-sensor link with each said alignment unit respectively,
A plurality of said drivers correspondingly are installed on each reflector, are placed on the reflector between said laser resonator and the said alignment unit with driving, and
Said each said driver of controller control is so that said laser beam passes the center of the said through hole of each said alignment unit.
7. laser processing device according to claim 6, wherein
Said optical system comprises beam-averaging device,
First reflector, second reflector and the 3rd reflector sequentially are placed between said laser resonator and the said processing object along the propagation path of said laser beam, and said alignment unit comprises first alignment unit and second alignment unit;
First alignment unit, said beam-averaging device and second alignment unit sequentially are placed between said second reflector and said the 3rd reflector along the propagation path of said laser beam,
Said first reflector and said second reflector are driven by first driver and second driver respectively, and
Said controller is controlled said first driver and said second driver, so that the center of through hole of center and said second alignment unit of the through hole of said first alignment unit is passed at the center of said laser beam.
8. according to any described laser processing device in the claim 3 to 7, wherein, said laser beam alignment unit further comprises:
Sensor actuator, said sensor actuator drives said transducer, with move said transducer make its near or away from the center of said through hole; And
The alignment unit actuator, the said alignment unit of said alignment unit actuator is to move said alignment unit on the direction that intersects at the propagation path with the said laser beam that passes said through hole.
9. laser processing device comprises:
Laser resonator, said laser resonator make laser beam produce resonance;
Optical system, the said laser beam that said optical system will resonate via said laser resonator is converted into the energy density of the beam profile with predetermined width of light beam;
Chamber, in said chamber, the said laser beam irradiation that is transformed by said optical system is on the processing object that is placed in the said chamber;
Reflector, said reflector are placed between said laser resonator and the said chamber, to reflect said laser beam; And
Laser beam alignment unit, the said laser beam alignment sing1e unit calibration irradiation said laser beam in the said chamber,
Wherein, said laser beam alignment unit comprises:
Alignment unit; Said alignment unit is installed between said reflector and the said processing object; And said alignment unit is placed in the propagation path of said laser beam; Said alignment unit delimited areas is greater than the through hole of the cross section of said laser beam, so that said laser beam can pass said through hole;
Driver, the said reflector of said driver drives is with the propagation path of control via the said laser beam of said reflector reflects; And
Controller;
Wherein, said laser beam alignment unit further comprises:
The first sensor and second transducer; Said first sensor and said second transducer link with said alignment unit respectively; And be placed on the both sides of said through hole; Detecting the laser beam of incident, and when detecting said laser beam to said controller output detection signal, the distance between said first sensor and said second transducer makes said laser beam between said first sensor and said second transducer, to pass;
Sensor actuator, said sensor actuator drives said transducer, with move said transducer make its near or away from the center of said through hole; With
The alignment unit actuator, the said alignment unit of said alignment unit actuator is to move said alignment unit on the direction that intersects at the propagation path with the said laser beam that passes said through hole;
Wherein, Said controller is controlled at least one in said driver and the said alignment unit actuator; Thereby; Based on the said laser beam on detected, as the to be incident on said alignment unit through hole, change the section of the said laser beam of the said through hole that passes said alignment unit through a part of utilizing said alignment unit to block said laser beam.
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ES2403172B1 (en) * 2011-09-22 2014-12-12 Jeanología, S.L. METHOD AND SYSTEM OF ADJUSTMENT OF THE ALIGNMENT OF A PHOTONIC BEAM
JP6261844B2 (en) * 2012-02-20 2018-01-17 株式会社ディスコ Laser processing method and laser processing apparatus
CN104563976B (en) * 2013-10-11 2018-04-27 中国石油化工股份有限公司 Laser perforation system and laser perforating methods
CN110799892B (en) * 2017-06-23 2022-04-12 业纳光学系统有限公司 Method for assisting in adjusting a beam expander, adjustment assisting device and beam expander
EP4056948A1 (en) * 2018-10-26 2022-09-14 Concept Laser GmbH Determination device for determining at least one parameter of an energy beam
KR20210014835A (en) 2019-07-30 2021-02-10 삼성디스플레이 주식회사 Laser annealing apparatus and method of manufacturing substrate having poly-Si layer using the same
JPWO2021145357A1 (en) * 2020-01-15 2021-07-22
CN114505578A (en) * 2020-11-17 2022-05-17 大族激光科技产业集团股份有限公司 Method and device for debugging flight light path

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6943086B2 (en) * 2001-10-10 2005-09-13 Hitachi, Ltd. Laser annealing apparatus, TFT device and annealing method of the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5215107Y2 (en) * 1973-09-26 1977-04-05
JPS60130935A (en) * 1983-12-19 1985-07-12 Mitsubishi Electric Corp Laser beam transmitter
US4879448A (en) * 1988-10-24 1989-11-07 Storage Technology Corporation Apparatus for laser welding and annealing
US5103082A (en) 1990-07-12 1992-04-07 Grumman Aerospace Corporation Automatic laser beam expander-pinhole alignment system
JPH0780671A (en) * 1993-09-16 1995-03-28 Sanyo Mach Works Ltd Method and device for detecting beam abnormality of laser beam machine
JPH09271971A (en) * 1996-04-02 1997-10-21 Shinozaki Seisakusho:Kk Laser beam machine
JP3052928B2 (en) 1998-04-01 2000-06-19 日本電気株式会社 Laser processing equipment
JP2001284281A (en) * 2000-03-30 2001-10-12 Sumitomo Heavy Ind Ltd Laser machining device and method
MXPA02005590A (en) 2000-10-10 2002-09-30 Univ Columbia Method and apparatus for processing thin metal layers.
US7321114B2 (en) * 2005-03-10 2008-01-22 Hitachi Via Mechanics, Ltd. Apparatus and method for beam drift compensation

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6943086B2 (en) * 2001-10-10 2005-09-13 Hitachi, Ltd. Laser annealing apparatus, TFT device and annealing method of the same

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JP5220121B2 (en) 2013-06-26

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