CN101868123A - Printed circuit board and design method thereof - Google Patents
Printed circuit board and design method thereof Download PDFInfo
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- CN101868123A CN101868123A CN 201010216329 CN201010216329A CN101868123A CN 101868123 A CN101868123 A CN 101868123A CN 201010216329 CN201010216329 CN 201010216329 CN 201010216329 A CN201010216329 A CN 201010216329A CN 101868123 A CN101868123 A CN 101868123A
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- pad
- circuit board
- printed circuit
- pcb
- linear increasing
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Abstract
The invention discloses a design method for a printed circuit board, which comprises the following steps of: setting each bonding pad into a strip shape; and performing linearly increased arrangement on bonding pads from large to small. The invention also discloses a printed circuit board, which comprises at least two bonding pads, wherein the bonding pads are strip-shaped, and are arranged in a linear increase mode from short to long. The bonding pads are arranged in a mode of increasing from large to small, so solder cannot be concentrated between pins in the welding process; and the solder is pulled to the large-small increasing direction of the bonding pads like a relay according to the flowing direction of the solder during wave soldering, and the solder is prevented from bridging between adjacent pins.
Description
Technical field
The present invention relates to printed circuit board (PCB), particularly a kind of printed circuit board (PCB) and method for designing that prevents bridge joint between pad.
Background technology
In existing printed circuit board (PCB), the too small pad of spacing is when wave soldering, the bridge joint phenomenon appears in the capital, traditional solution is to increase to steal the soldering dish, and dwindles pad as much as possible, to widen the spacing between the pad, but this kind solution is subject to PCB (Printed Circuit Board, printed circuit board (PCB)) space size not only can increase manufacturing cost, but also can widen the hidden danger that solder pad space length brings weld strength to reduce because of dwindling pad.
Therefore, how to design a kind of pad and neither be prone to the bridge joint phenomenon when wave soldering, the printed circuit board (PCB) that can avoid weld strength to reduce is a technical problem to be solved in the industry again.
Summary of the invention
Main purpose of the present invention provides a kind of printed circuit board (PCB) and method for designing, and the pad that is intended to solve printed circuit board (PCB) the bridge joint phenomenon can not occur when wave soldering.
Technical scheme provided by the invention is: a kind of method for designing of printed circuit board (PCB), and it may further comprise the steps:
Each pad is set to bar shaped, and according to pad size each pad that is arranged in a linear increasing from large to small.
Preferably, described each pad is set to bar shaped, and is arranged in a linear increasing from large to small according to the pad size and comprises in the step of each pad:
When being arranged in a linear increasing pad, be that orientation is arranged with the line of centres of pad.
Preferably, described each pad is set to bar shaped, and is arranged in a linear increasing from large to small according to the pad size and comprises in the step of each pad:
When being arranged in a linear increasing pad, be that orientation is arranged with the line of pad one end.
Preferably, described each pad is set to bar shaped, and is arranged in a linear increasing from large to small according to the pad size and comprises in the step of each pad:
When being arranged in a linear increasing pad, each pad is arranged parallel to each other.
Also disclose a kind of printed circuit board (PCB), comprised at least two pads, wherein, described pad is bar shaped, and is arranged in a linear increasing from short to long by length.
Preferably, described pad is that orientation is arranged with the line of centres of pad.
Preferably, described pad is that orientation is arranged with the line of pad one end.
Preferably, described pad is arranged parallel to each other.
Compared with prior art, the present invention is when the PCB layout designs, each pad is set to bar shaped, and according to pad size each pad that is arranged in a linear increasing from large to small, scolding tin is not concentrated between the pin when making welding, but the flow direction of scolding tin during according to wave soldering, like the relay scolding tin being increased progressively direction toward the pad size draws back, avoid the bridge joint of scolding tin between adjacent leads, the present invention can reduce manufacturing cost, improve and produce first-pass yield and production efficiency, bridge joint problem when reducing hidden danger of quality and solving rectangle integrated chip wave soldering also can be avoided the hidden danger of bringing device performance to reduce because of manual repairing solder joint.
Description of drawings
Fig. 1 is an example schematic of the method for designing of printed circuit board (PCB) of the present invention;
Fig. 2 a is an example schematic of the pad of printed circuit board (PCB) of the present invention;
Fig. 2 b is another example schematic of the pad of printed circuit board (PCB) of the present invention;
Fig. 3 is an example schematic of printed circuit board (PCB) of the present invention.
The realization of the object of the invention, functional characteristics and advantage will be in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
With reference to Fig. 1, a kind of method for designing of printed circuit board (PCB), it may further comprise the steps:
Step 10: each pad is set to bar shaped;
Step 20: according to pad size each pad that is arranged in a linear increasing from large to small.
Pad is arranged in the mode that size increases progressively, scolding tin is not concentrated between the pin when making welding, (wave soldering is meant the solder with fusing but according to wave soldering, become the solder wave of designing requirement through electrodynamic pump or electromagnetic pump jet flow, also can be by forming to the solder pot nitrogen injection, make the printed board that components and parts are housed in advance pass through solder wave, realize machinery between components and parts weldering end or pin and the printed board pad and the solder that is electrically connected) time scolding tin the flow direction, like the relay scolding tin being increased progressively direction toward the pad size draws back, avoid the bridge joint of scolding tin between adjacent leads, also avoid the hidden danger of bringing device performance to reduce because of manual repairing solder joint.
With reference to Fig. 2 b, above-mentioned each pad 1 is set to bar shaped, and is arranged in a linear increasing from large to small according to pad 1 size and comprises in the step of each pad 1: when being arranged in a linear increasing pad 1, be that orientation is arranged with the line of centres of pad 1.Pad 1 is expanded the method for designing when being fit to have than multiposition in the circuit board to two rightabouts with its center.
With reference to Fig. 2 a, above-mentioned each pad 1 is set to bar shaped, and is arranged in a linear increasing from large to small according to pad 1 size and comprises in the step of each pad 1: when being arranged in a linear increasing pad 1, be that orientation is arranged with the line of pad 1 one ends.A side of only expanding pad 1 just can reach and scolding tin is increased progressively direction toward pad 1 size draw back, and is adapted at pad 1 comparatively dense or position method for designing hour.
Above-mentioned each pad 1 is set to bar shaped, and is arranged in a linear increasing from large to small according to pad 1 size and comprises in the step of each pad 1: when being arranged in a linear increasing pad 1, each pad 1 is arranged parallel to each other.Pad 1 can not connected, and the scolding tin that draws back during wave soldering can not join yet.
With reference to Fig. 3, a kind of printed circuit board (PCB) 2 is disclosed, comprise at least two pads 1, wherein, described pad 1 is bar shaped, and is arranged in a linear increasing from short to long by length.
Above-mentioned pad 1 is that orientation is arranged with the line of centres of pad 1.Pad 1 is expanded the method for designing when being fit to have than multiposition in the circuit board to two rightabouts with its center.
Above-mentioned pad 1 is that orientation is arranged with the line of pad 1 one ends.A side of only expanding pad 1 just can reach and scolding tin is increased progressively direction toward pad 1 size draw back, and is adapted at pad 1 comparatively dense or position method for designing hour.
Above-mentioned pad 1 is arranged parallel to each other.Pad 1 can not connected, and the scolding tin that draws back during wave soldering can not join yet.
The above only is the preferred embodiments of the present invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (8)
1. the method for designing of a printed circuit board (PCB) is characterized in that, may further comprise the steps:
Each pad is set to bar shaped, and according to pad size each pad that is arranged in a linear increasing from large to small.
2. method for designing according to claim 1 is characterized in that, described each pad is set to bar shaped, and is arranged in a linear increasing from large to small according to the pad size and comprises in the step of each pad:
When being arranged in a linear increasing pad, be that orientation is arranged with the line of centres of pad.
3. method for designing according to claim 1 is characterized in that, described each pad is set to bar shaped, and is arranged in a linear increasing from large to small according to the pad size and comprises in the step of each pad:
When being arranged in a linear increasing pad, be that orientation is arranged with the line of pad one end.
4. method for designing according to claim 1 is characterized in that, described each pad is set to bar shaped, and is arranged in a linear increasing from large to small according to the pad size and comprises in the step of each pad:
When being arranged in a linear increasing pad, each pad is arranged parallel to each other.
5. a printed circuit board (PCB) comprises at least two pads, it is characterized in that, described pad is bar shaped, and is arranged in a linear increasing from short to long by length.
6. printed circuit board (PCB) according to claim 5 is characterized in that, described pad is that orientation is arranged with the line of centres of pad.
7. printed circuit board (PCB) according to claim 5 is characterized in that, described pad is that orientation is arranged with the line of pad one end.
8. printed circuit board (PCB) according to claim 5 is characterized in that described pad is arranged parallel to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102163293A CN101868123B (en) | 2010-07-02 | 2010-07-02 | Printed circuit board and design method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102163293A CN101868123B (en) | 2010-07-02 | 2010-07-02 | Printed circuit board and design method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101868123A true CN101868123A (en) | 2010-10-20 |
| CN101868123B CN101868123B (en) | 2011-12-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102163293A Expired - Fee Related CN101868123B (en) | 2010-07-02 | 2010-07-02 | Printed circuit board and design method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN101868123B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102469695A (en) * | 2010-10-29 | 2012-05-23 | 海尔集团公司 | Printed circuit board, tinning line thereof and tinning method thereof |
| CN105555024A (en) * | 2014-10-24 | 2016-05-04 | 富士施乐株式会社 | Substrate, substrate device and manufacturing method of substrate device |
| CN105578743A (en) * | 2015-12-29 | 2016-05-11 | 广东欧珀移动通信有限公司 | Flexible circuit board, circuit board assembly and mobile terminal |
| CN108288610A (en) * | 2018-04-20 | 2018-07-17 | 深圳市锐钜科技有限公司 | It a kind of design of novel chip tin tailing solder pad and its is applied in red adhesive process |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5952611A (en) * | 1997-12-19 | 1999-09-14 | Texas Instruments Incorporated | Flexible pin location integrated circuit package |
| CN1384697A (en) * | 2001-04-27 | 2002-12-11 | 松下电器产业株式会社 | Wire circuit board |
-
2010
- 2010-07-02 CN CN2010102163293A patent/CN101868123B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5952611A (en) * | 1997-12-19 | 1999-09-14 | Texas Instruments Incorporated | Flexible pin location integrated circuit package |
| CN1384697A (en) * | 2001-04-27 | 2002-12-11 | 松下电器产业株式会社 | Wire circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102469695A (en) * | 2010-10-29 | 2012-05-23 | 海尔集团公司 | Printed circuit board, tinning line thereof and tinning method thereof |
| CN102469695B (en) * | 2010-10-29 | 2016-09-21 | 海尔集团公司 | Printed circuit board (PCB) and tining circuit thereof and tining method |
| CN105555024A (en) * | 2014-10-24 | 2016-05-04 | 富士施乐株式会社 | Substrate, substrate device and manufacturing method of substrate device |
| CN105578743A (en) * | 2015-12-29 | 2016-05-11 | 广东欧珀移动通信有限公司 | Flexible circuit board, circuit board assembly and mobile terminal |
| CN105578743B (en) * | 2015-12-29 | 2018-12-11 | 广东欧珀移动通信有限公司 | Flexible circuit board, circuit board assemblies and mobile terminal |
| CN109327958A (en) * | 2015-12-29 | 2019-02-12 | 广东欧珀移动通信有限公司 | Flexible circuit board, circuit board assemblies and mobile terminal |
| CN108288610A (en) * | 2018-04-20 | 2018-07-17 | 深圳市锐钜科技有限公司 | It a kind of design of novel chip tin tailing solder pad and its is applied in red adhesive process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101868123B (en) | 2011-12-28 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111228 Termination date: 20190702 |
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| CF01 | Termination of patent right due to non-payment of annual fee |