CN101844275A

CN101844275A - Method for dividing substrate

Info

Publication number: CN101844275A
Application number: CN201010143474A
Authority: CN
Inventors: 李炫澈; 朴镇翰; 金俊亨; 林元圭; 朴宰爽; 卢喆来; 李榕秦
Original assignee: Samsung Mobile Display Co Ltd
Current assignee: Samsung Display Co Ltd
Priority date: 2009-03-25
Filing date: 2010-03-25
Publication date: 2010-09-29
Anticipated expiration: 2030-03-25
Also published as: DE102010003258A1; KR101041140B1; TW201043379A; TWI413565B; KR20100107254A; JP2010229024A; CN101844275B; US8444906B2; US20100243623A1

Abstract

The invention provides a kind of method for dividing substrate, comprise step: the panel that will comprise two or more substrates is aimed at along line of cut; By making corresponding UV laser beam in the corresponding substrate of described panel, form the line of rabbet joint along described line of cut along described line of cut vibration; And, power cuts described panel along the described line of rabbet joint by being put on described panel.

Description

Method for dividing substrate

Technical field

This teaching relates to a kind of method for dividing substrate.

Background technology

For category of glass substrate (for example, the basal substrate of flat-panel monitor) is cut into desirable product size, use multiple method for dividing substrate at present.Flat-panel monitor can be Organic Light Emitting Diode (OLED) display, LCD (LCD), or the like.

Usually, flat-panel monitor comprises a pair of relative glass substrate.This is separated from each other predetermined gap usually to glass substrate.Just, in order to cut panel display apparatus, glass substrate is cut simultaneously.

But, existing method (for example using the method for blade or laser beam) existing problems, that is, the separation between the glass substrate makes that cutting substrate becomes difficult simultaneously.In other words, the problem of existing method is, when cutting a pair of glass substrate at the same time, the marginal portion of or all glass substrates is easy to damage in cutting process.

Disclosed above-mentioned information only is used to strengthen the understanding to the background of institute's description technique in this background technology part, thereby it may comprise the information that does not constitute prior art.

Summary of the invention

This teaching provides a kind of method for dividing substrate, is used for effectively and cutting stably comprises the panel of a plurality of substrates.

According to the exemplary embodiment of this teaching, a kind of method for dividing substrate comprises: use vibration ultraviolet (UV) laser beam to form the line of rabbet joint at the substrate upper edge of panel line of cut; And, power cuts apart described panel along the described line of rabbet joint by being put on described panel.

According to the each side of this teaching, the described line of rabbet joint can cave in along equidirectional also can be overlapped.

According to the each side of this teaching, described power can put on described panel in the opposite direction along the side with described line of rabbet joint depression.

According to the each side of this teaching, described laser beam can vibrate in the predetermined beam irradiated region of described line of cut, and described bundle irradiated region moves along described line of cut.

According to the each side of this teaching, every kind of described oscillating laser Shu Junke has the wavelength from about 200nm to about 900nm.

According to the each side of this teaching, described laser beam can be a pulsed, and described laser beam can form the described line of rabbet joint by a part of removing described substrate with physics mode.

According to the each side of this teaching, described laser beam can have the unit irradiation time that is shorter than about 50 psecs.

According to the each side of this teaching, described laser beam can have the pulse frequency from about 0.1MHz to about 100MHz.

According to the each side of this teaching, described method for dividing substrate can further comprise: buffer component is arranged on being applied on the apparent surface with the surface of power of described panel.

According to the each side of this teaching, described method for dividing substrate can further comprise: the described panel of upset before cutting apart described panel.

According to the each side of this teaching, described panel can comprise: first glass substrate; Second glass substrate; With the sealer that described first glass substrate is attached to described second glass substrate.

According to the each side of this teaching, described laser beam can comprise: first laser beam that vibrates on described first glass substrate; With second laser beam that on described second glass substrate, vibrates.

According to the each side of this teaching, forming the described line of rabbet joint can comprise: use described first laser beam to form first line of rabbet joint on described first glass substrate; And use described second laser beam on described second glass substrate, to form second line of rabbet joint.

According to the each side of this teaching, described second line of rabbet joint can form after described first line of rabbet joint forms.

According to the each side of this teaching, described first line of rabbet joint and described second line of rabbet joint can form simultaneously.

The others of this teaching and/or advantage will partly propose in the following description, and partly become apparent by these descriptions or can know by implementing this teaching.

Description of drawings

By below in conjunction with the description of accompanying drawing to each embodiment, these and/or others of the present invention and advantage will become obviously and be easier to and understand, wherein:

Fig. 1 is the perspective view according to the substrate dividing apparatus of the exemplary embodiment of this teaching;

Fig. 2 is the schematic diagram that demonstrates the bundle oscillator of Fig. 1;

Fig. 3 is that example illustrates the flow chart according to the method for dividing substrate of the exemplary embodiment of this teaching;

Fig. 4 to Fig. 6 is the cutaway view that demonstrates according to the method for dividing substrate of the exemplary embodiment of this teaching; With

Fig. 7 and Fig. 8 demonstrate according to the exemplary embodiment of this teaching with according to the photo that is formed on the line of rabbet joint in the substrate of comparative example.

The specific embodiment

The exemplary embodiment of this teaching now that detailed reference example is shown in the drawings, wherein identical Reference numeral is always represented components identical.Describe each exemplary embodiment hereinafter with reference to the accompanying drawings to explain the each side of this teaching.

In the accompanying drawings, the thickness in layer, film, panel, zone etc. is exaggerated in order to know.The thickness in layer, film, panel, zone etc. is exaggerated in the accompanying drawings, to understand better and to be easy to describe the present invention.It should be understood that when the element such as layer, film, zone or substrate be mentioned be arranged on another element " on " time, it can be set directly on another element or therebetween also can exist intermediary element.

Hereinafter, the substrate dividing apparatus 100 according to the exemplary embodiment of this teaching is described with reference to Fig. 1.As shown in fig. 1, substrate dividing apparatus 100 comprises: platform unit 20, laser generator 30, bundle oscillator 50 and delivery unit 80.

Platform unit 20 support panels 10, panel 10 will be cut along line of cut CL.Panel 10 comprises two or

more substrates

11 and 12 that combine.Though demonstrate a line of cut CL, in each

substrate

11 and 12, all form line of cut.Each

substrate

11 and 12 is glass substrate, that is, can be made by glass-like materials.Should notice that

substrate

11 and 12 is not limited to glass substrate and can be made by the nonmetallic materials that replace glass.

Laser generator 30 emission wavelengths are about ultraviolet (UV) the laser beam LB of 200nm to 900nm.Laser beam LB all forms line of rabbet joint GL along line of cut CL by a part of removing each

substrate

11 and 12 in each

substrate

11 and 12.

Further, are pulseds from laser generator 30 emitted laser bundle LB.Laser beam LB has less than the unit irradiation time of about 50 psecs (ps) and the pulse frequency of about 0.1MHz to 100MHz.

Bundle oscillator 50 is arranged in the beam path of laser beam LB and in complex way laser beam LB is directed on the panel 10, forms oscillating laser bundle OLB thus.Bundle oscillator 50 is by making laser beam LB vibration by minute changing the incident inclination angle of laser beam LB with respect to panel 10.Just, laser beam LB transmitted beam oscillator 50 vibrates in the predetermined beam irradiated region IS of line of cut CL.Bundle irradiated region IS extends along line of cut CL.At this, described inclination angle is meant that oscillating laser bundle OLB incides the lip-deep angle of panel 10.Just, laser beam LB incides the inclination angle variation of the laser beam LB on the panel 10.Therefore, the oscillating laser bundle OLB lip-deep angle that incides panel 10 changes in preset range.Further, oscillating laser bundle OLB vibrates along line of cut CL vibration (that is, along straight line) in bundle irradiated region IS.

Oscillating laser bundle OLB shines each

substrate

11 and 12, removes the part of each

substrate

11 and 12 thus.Therefore, line of rabbet joint GL is formed in each substrate 11 and 12.More specifically, oscillating laser bundle OLB is back and forth tens of inferior to hundreds of times in bundle irradiated region IS.Laser beam LB removes the part of each

substrate

11 and 12 by making the molecular scission in the glass with physics mode.Further, when bundle irradiated region IS when line of cut CL moves, line of rabbet joint GL forms along line of cut CL.

As shown in Figure 2, bundle oscillator 50 comprises: reflector 51 is used for reflection from laser generator 30 emitted laser bundle LB; With driver 52, be used to drive reflector 51.Though not shown, except the element shown in Fig. 2, driver 52 can further comprise motor and controller.Driver 52 makes from laser generator 30 emitted laser bundle LB by the motion of controlling reflector 51 and vibrates.At this, driver 52 is optionally controlled the motion of reflector 51.Just, driver 52 can be controlled swing width and the swing speed of laser beam LB by the motion of control reflector 51.

Bundle oscillator 50 can further comprise housing 55, is used to hold reflector 51 and driver 52.Housing 55 comprises: bundle is gone into flow port 551, is used for introducing from laser generator 30 emitted laser bundle LB; With bundle irradiation port 555, be used for towards the laser beam LB of panel 10 (referring to Fig. 1) radiation by reflector 51 vibrations.But the swing width of the oscillating laser bundle OLB also size of transmitted beam irradiation port 555 is controlled.

Though not shown, bundle oscillator 50 can further comprise: be arranged on the optical unit in the bundle irradiation port 555, be used for oscillating laser bundle OLB is focused in the bundle irradiated region IS.This optical unit can focus on oscillating laser bundle OLB on each substrate 11 and 12.This optical unit can comprise at least one lens.

Optical unit can be and restraint the discrete element of oscillator 50.Especially, optical unit can be arranged between laser generator 30 and the bundle oscillator 50 or between bundle oscillator 50 and the panel 10.Bundle oscillator 50 is not limited to the structure shown in Fig. 2.In other words, bundle oscillator 50 can make the laser beam LB vibration that arrives panel 10 by various optical means.

Return referring to Fig. 1, delivery unit 80 transmits the platform unit 20 that panel 10 is installed along the direction SD that is parallel to line of cut CL.Just, when forming line of rabbet joint GL in

substrate

11 and 12, bundle irradiated region IS moves along line of cut CL by delivery unit 80.Alternately, delivery unit 80 removable bundle oscillator 50 and laser generators 30, rather than travelling carriage unit 20.

Be described with reference to Fig. 3 to Fig. 6 below the method for dividing substrate according to the exemplary embodiment of this teaching.Method for dividing substrate is described to use the substrate dividing apparatus 100 shown in Fig. 1, but also can use distinct device to implement.Therefore, those skilled in the art can use various substrate dividing apparatus to implement described method for dividing substrate.

At first, as shown in Fig. 3 and Fig. 4, in operation S100, comprise that the panel 10 of first glass substrate 11 and second glass substrate 12 is installed on the platform unit 20, and aim at according to line of cut CL.For example, as shown in Figure 4, panel 10 can comprise first glass substrate 11 that wherein is formed with organic illuminating element.Second glass substrate 12 is combined and be sealed to first glass substrate 11, and is constructed to protect organic illuminating element.Panel 10 comprises that also sealer 15 is to be attached to second glass substrate 12 with first glass substrate 11.

But, this teaching is not limited to said structure.For example, panel 10 can comprise the three or more substrates that combine.Just, though not shown, panel 10 can further comprise element, for example touch panel.Further, as previously mentioned, panel 10 can comprise the substrate of being made by the nonmetallic materials that are different from glass.

Next step in operation S210, uses the first laser beam LB1 of vibration to form first line of rabbet joint GL1 in first glass substrate 11.This first line of rabbet joint GL1 is formed on facing in the surface of second glass substrate 12 of first glass substrate 11.In other words, the first laser beam LB1 is radiated on first glass substrate 11 through second glass substrate 12.In this case, if the first laser beam LB1 not vernier focusing to first glass substrate 11, then owing to when the first laser beam LB1 passes second glass substrate 12, have an energy loss, so possibly can't accurately form first line of rabbet joint GL1.

Next step in operation S220, as shown in Figure 5, uses the second laser beam LB2 of vibration to form second line of rabbet joint GL2 in second glass substrate 12.This second line of rabbet joint GL2 is formed among the apparent surface in the face of the surface of first glass substrate 11 of second glass substrate 12.Just, first line of rabbet joint GL1 and second line of rabbet joint GL2 are along equidirectional depression (being recessed into).Further, first line of rabbet joint GL1 and second line of rabbet joint GL2 are along line of cut CL overlapped (referring to Fig. 1).In other words, when the edge was watched with the direction of the planar quadrature of first substrate 11 and second substrate 12, first line of rabbet joint GL1 and second line of rabbet joint GL2 were overlapped.

Comprise at panel 10 under the situation of three or more substrates, can use said process in each substrate, to form line of rabbet joint GL (referring to Fig. 1).At this, line of rabbet joint GL is along the equidirectional depression and along line of cut CL overlapped (referring to Fig. 1).

Wavelength is about the UV laser beam of 200nm to 900nm as the first laser beam LB1 and the second laser beam LB2.Further, the first laser beam LB1 and the second laser beam LB2 are pulsed laser beam, and this pulsed laser beam has the unit irradiation time that is shorter than about 50 psecs and the pulse frequency of about 0.1MHz to 100MHz.Vibration is tens of times to hundreds of times in the first laser beam LB1 and the second laser beam LB2 respective regions on first glass substrate 11 and second glass substrate 12.Further, the second laser beam LB2 of first laser beam LB1 of vibration and vibration forms first line of rabbet joint GL1 and second line of rabbet joint GL2 by a part of removing first glass substrate 11 and second glass substrate 12 respectively.

Further, the vibration of the bundle of the first laser beam LB1 and the second laser beam LB2 can use the bundle oscillator 50 shown in Fig. 1 to realize.At this, the first laser beam LB1 and the second laser beam LB2 focus on respectively on first glass substrate 11 and second glass substrate 12.

The first laser beam LB1 can launch from identical laser generator 30 (referring to Fig. 1) with the second laser beam LB2, and by 50 vibrations of identical bundle oscillator, perhaps can launch from different laser generator 30 and bundle oscillator 50.

Further, the first laser beam LB1 and the second laser beam LB2 vibrate in predetermined bundle irradiated region IS.As described above with reference to Figure 1, bundle irradiated region IS is along will extending by the line of rabbet joint GL that oscillating laser bundle OLB forms, and moves along line of cut CL.

In this method for dividing substrate, can use oscillating laser bundle OLB in the

corresponding substrate

11 and 12 of panel 10, effectively and stably to form line of rabbet joint GL.The exemplary embodiment that is different from this teaching forms line of rabbet joint GL in order to use the conventional UV class laser beam LB that is not vibrated, on high energy laser beam Continuous irradiation to a zone.Therefore, in the substrate of bombardment with laser beams owing to thermal shock is easy to occur localized cracks.The crackle that is produced is difficult to control, and these crackles can be from the line of cut STOCHASTIC DIFFUSION.The edge of panel can damage owing to random crack, and this may cause the panel performance to reduce.

But, according to this teaching, oscillating laser bundle OLB is used, and reduces thermal shock and relevant crackle thus.Like this, can increase the energy level of laser beam LB.Therefore, vibration UV laser beam OLB can more stably form line of rabbet joint GL in

corresponding substrate

11 and 12.

For example, bundle irradiated region IS can have about 100mm or littler length.Further, oscillating laser bundle OLB can be in bundle irradiated region IS with the velocity fluctuation of about 0.1m/s to 10m/s.But, it should be noted that the length of bundle irradiated region IS and the hunting speed of oscillating laser bundle OLB only are exemplary, this teaching is not limited thereto.In other words, the length of bundle irradiated region IS and the hunting speed of oscillating laser bundle OLB can be according to the energy levels of laser beam OLB and suitably control, thereby can suppress because the crackle due to the thermal shock occurs.

Next step as shown in Figure 6, in operation S300, by along in the opposite direction power being put on panel 10 with line of rabbet joint GL1 and GL2 depression side, cuts panel 10 along line of rabbet joint GL1 and GL2.In this case, can the instrument of disruptor 90 and so on puts on panel 10 with power by for example using.On the other hand, as shown in Figure 6, if suitable, can overturn before power is put on panel 10 in the forward and backward surface of panel 10, be beneficial to finish the work.

Further, when by disruptor 90 cutting panels 10, panel 10 may be cut suddenly and be damaged.Therefore, buffer component 19 can additionally be arranged on being applied on the opposite side with the surface of power of panel 10, damages panel 10 when preventing that panel is cut.By such method for dividing substrate, can more effective and stably cut panel 10.

Especially, according to this teaching, in this method for dividing substrate, by UV class laser beam OLB formation line of rabbet joint GL in

corresponding substrate

11 and 12 of vibration.Therefore, the energy level of oscillating laser bundle OLB can be controlled by variety of way.This means, can use the panel of method for dividing substrate cutting all thickness.And, according to this teaching, because can prevent because the appearance of localized cracks due to the thermal shock, so can more stably cut panel 10.

Hereinafter, with reference to Fig. 7 and Fig. 8 experimental example and comparative example are described.In experimental example,, use UV vibration UV laser beam in substrate, to form the line of rabbet joint according to the exemplary embodiment of this teaching.In comparative example, use the conventional infrared laser beam that is not vibrated in substrate, to form the line of rabbet joint.

Fig. 7 demonstrates the line of rabbet joint that forms according to experimental example in substrate, Fig. 8 demonstrates the line of rabbet joint that forms according to comparative example in substrate.As shown in Figure 7, the line of rabbet joint that forms in substrate according to experimental example evenly and stable.Simultaneously, as shown in Figure 8, the line of rabbet joint that forms in comparative example has many crackles in the edge of substrate.

In order to use the conventional UV laser beam that is not vibrated to form the line of rabbet joint in substrate, the necessary Continuous irradiation of the laser beam of high level is on a zone.In this case, owing to impacting, localized heat is easy to occur crackle.These crackles are difficult to control, thereby may form at random, even form along the direction that intersects at line of cut.If the edge of substrate is owing to random crack damages, then the bulk strength of panel is weakened.

But, as according to as shown in the method for dividing substrate of the exemplary embodiment of this teaching, crackle can not produce, thereby can carry out stable cutting task.According to this teaching, can be effectively and stably cut panel.

Though shown and described some exemplary embodiments of this teaching, but, those skilled in the art will recognize that, under the situation of principle that does not deviate from this teaching and spirit, can change in these exemplary embodiments, scope of the present invention limits in claims and equivalent thereof.

Claims

1. method for dividing substrate comprises:

Make UV laser beam in the vibration of the substrate upper edge of panel line of cut, in described substrate, to form the line of rabbet joint; And

Cut described panel by power being put on described panel in described line of rabbet joint punishment.

2. method for dividing substrate as claimed in claim 1, wherein:

The described line of rabbet joint is formed in the first surface of described substrate, and described first surface is in the face of identical direction; And

When the edge was watched with the direction of the planar quadrature of described first surface, the described line of rabbet joint was overlapped.

3. method for dividing substrate as claimed in claim 2, wherein said power put on described substrate one of them with described first surface opposing second surface.

4. method for dividing substrate as claimed in claim 2 wherein makes described laser beam comprise:

Described laser beam is vibrated in the bundle irradiated region of every described line of cut; And

Move described bundle irradiated region along corresponding described line of cut.

5. method for dividing substrate as claimed in claim 4, wherein said laser beam has the wavelength from 200nm to 900nm.

6. method for dividing substrate as claimed in claim 4, wherein:

Described laser beam is a pulsed; And

Described laser beam forms the described line of rabbet joint by a part of removing described substrate.

7. method for dividing substrate as claimed in claim 6, wherein said laser beam have the unit irradiation time less than 50 psecs.

8. method for dividing substrate as claimed in claim 6, wherein said laser beam has the pulse frequency from 0.1MHz to 100MHz.

9. method for dividing substrate as claimed in claim 1 is wherein cut apart described panel and is further comprised: buffer component is arranged on being applied on the apparent surface with the surface of described power of described substrate.

10. method for dividing substrate as claimed in claim 1 wherein makes described laser beam comprise: use different focal at each described laser beam.

11. method for dividing substrate as claimed in claim 1, wherein said panel comprises:

First glass substrate;

Be set to second glass substrate in the face of described first glass substrate; With

Described first glass substrate is attached to the sealer of described second glass substrate.

12. method for dividing substrate as claimed in claim 11 wherein makes described laser beam comprise:

First laser beam is vibrated on described first glass substrate; And

Second laser beam is vibrated on described second glass substrate.

13. method for dividing substrate as claimed in claim 12 wherein makes described laser beam further comprise:

Use described first laser beam on described first glass substrate, to form first line of rabbet joint; And

Use described second laser beam on described second glass substrate, to form second line of rabbet joint.

14. method for dividing substrate as claimed in claim 13, wherein said second line of rabbet joint forms after described first line of rabbet joint forms.

15. method for dividing substrate as claimed in claim 13, wherein said first line of rabbet joint and described second line of rabbet joint form simultaneously.

16. method for dividing substrate as claimed in claim 1 further comprises: the described panel before cutting apart described panel on the described platform of upset.