CN101747073A - Manufacturing method of copper foil and ceramic composite board - Google Patents
Manufacturing method of copper foil and ceramic composite board Download PDFInfo
- Publication number
- CN101747073A CN101747073A CN200810182792A CN200810182792A CN101747073A CN 101747073 A CN101747073 A CN 101747073A CN 200810182792 A CN200810182792 A CN 200810182792A CN 200810182792 A CN200810182792 A CN 200810182792A CN 101747073 A CN101747073 A CN 101747073A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- manufacture method
- clad plate
- solution
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention relates to a manufacturing method of a copper foil and a ceramic composite board, comprising the following steps that: a copper foil with a copper oxide surface layer is oppositely laminated with the surface of a ceramic substrate, and then the heat treatment is carried out to lead the copper foil to be jointed with the ceramic substrate so as to form a composite board; and the the oxide copper surface layer is formed on the single surface of the copper foil by a wet oxidation manner.
Description
Technical field
The present invention relates to the manufacture method of a kind of Copper Foil and ceramic clad plate, particularly relate to a kind of manufacture method of having only oxidized Copper Foil of single face and ceramic clad plate with wet oxidation manner with control Copper Foil top layer.
Background technology
The at present common mode that is used for Copper Foil and pottery formation composition board is that direct copper joining technique (is called for short DCB, Direct Copper Bonding or abbreviation DBC, Direct Bonding Copper), its key step comprises: make copper foil surface form copper oxide earlier, again copper oxide is covered on the ceramic plate surface, make it be lower than metallic copper fusing point (about 1083 ℃) and be higher than copper and the temperature range of cupric oxide eutectic temperature (1063 ℃) is heat-treated, and Copper Foil is incorporated into the ceramic plate surface one.
The existing mode that makes copper foil surface form copper oxide, be at Copper Foil before ceramic plate thermal treatment, separately Copper Foil is carried out another heat treatment process with the copper foil surface oxidation earlier.Because heat treatment process only is not easy to control the single surface oxidation of Copper Foil, make Copper Foil after the thermal treatment, it is two-sided all can to form copper oxide.When the ceramic plate two sides all will be in conjunction with Copper Foil, as shown in Figure 1, if the upper and lower sides that the two-sided Copper Foil 91,92 that all forms copper oxide 911,921 is laminated in ceramic plate 93 is respectively heat-treated, the saggar 94 of the superimposed body of carrying Copper Foil 91/ ceramic plate 93/ Copper Foil 92 also is a ceramic material during then because of thermal treatment, and lower floor's Copper Foil 92 is a copper oxide 921 also with the contact surface of saggar 94, makes can cause Copper Foil 92 to attach to the puzzlement of saggar 94 after the thermal treatment.
So when desiring on the ceramic plate two sides all in conjunction with Copper Foil, as shown in Figure 2, generally be to have copper oxide 951 with one earlier, 952 Copper Foil 95 is positioned on the surface of ceramic plate 96, place with the another side of ceramic plate 96 again and carry out making the first time Copper Foil 95 and ceramic plate 96 bonded thermal treatments on the saggar 97, after making Copper Foil 95 and ceramic plate 96 combining, again Copper Foil 95 is revealed in outer copper oxide 952 and is reduced to copper, the surface is placed on the saggar for the Copper Foil 95 of copper layer, place another at the another side of ceramic plate 96 again and have copper oxide 981,982 Copper Foil 98, carry out making the second time Copper Foil 98 and ceramic plate 96 bonded thermal treatments, the copper oxide 982 that will expose again is reduced to copper, so just can make the two sides of ceramic plate 96 all be combined with Copper Foil 95,98, not only manufacturing process (is a processing procedure, this paper all is called manufacturing process) complicated, and must also increase the waste of the energy through heat treatment step repeatedly.
This shows that the manufacture method of above-mentioned existing Copper Foil and ceramic clad plate obviously still has inconvenience and defective, and demands urgently further being improved in manufacture method and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and general manufacture method does not have appropriate manufacture method to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of new Copper Foil and the manufacture method of ceramic clad plate, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Summary of the invention
The objective of the invention is to, overcome the defective of the manufacture method existence of existing Copper Foil and ceramic clad plate, and a kind of new Copper Foil and the manufacture method of ceramic clad plate, technical problem to be solved are provided is to make the easy and energy save energy of its manufacturing process, is very suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of Copper Foil that proposes according to the present invention and the manufacture method of ceramic clad plate are fit relative with a ceramic base plate surface of Copper Foil that has a cupric oxide top layer with, heat-treat this Copper Foil is engaged with this ceramic substrate to form a composition board again; By wet oxidation manner, make the single surface of this Copper Foil form the cupric oxide top layer.
Be applicable to that wet oxidation manner of the present invention is copper foil surface to be soaked place an oxidation that contains oxygenant with solution, makes this copper foil surface oxidation form the cupric oxide top layer.Preferably, this oxygenant can be selected from the combination of Potassium Persulphate, tertiary sodium phosphate, Textone, sodium hydroxide or its etc.This oxidation with the concentration that contains this oxygenant in the solution to be advisable between 2～60 gram/litres.Preferably, this oxidation is between 25～80 ℃ with the working temperature of solution, and this copper foil surface soak place this oxidation with time of solution approximately between 10 seconds～10 minutes.
This copper foil surface makes this copper foil surface coarse carrying out also can comprising a surface coarsening step before the wet oxidation processing.The surface coarsening step can utilize modes such as sandblast, the bombardment of electricity slurry, chemical milling to carry out, one embodiment of carrying out the surface coarsening step in the present invention is this copper foil surface to be soaked place an alligatoring solution that contains hydrogen peroxide, sulfuric acid and a tranquilizer, makes this copper foil surface coarse.This tranquilizer can be amine, and concrete example is ethamine and ethanamide.This alligatoring is with the concentration that contains hydrogen peroxide, sulfuric acid and tranquilizer in the solution, and preferably vitriolic concentration is between 1～10 gram/litre between the concentration of 150～250 gram/litres, hydrogen peroxide between the concentration of 30～40 gram/litres, tranquilizer.Preferably, this alligatoring uses the working temperature of solution approximately between 25～60 ℃.This copper foil surface is soaked place this alligatoring to use the time of solution with comparatively suitable between 1 minute～5 minutes.
Further, after this copper foil surface is handled through wet oxidation, also can form an oxygen barrier layer on this copper oxide surface.Be applicable to that the step that forms this oxygen barrier layer is this copper oxide surface to be soaked place one to contain the anti-oxidant with solution, to form this oxygen barrier layer of antioxidant.Preferably, this antioxidant can be selected from the combination of benzotriazole, benzene a pair of horses going side by side three chlorazols, benzene a pair of horses going side by side triazole, triazole, imidazoles, benzimidazolyl, tetrazolium or its etc.This anti-oxidant working temperature of solution of using is with comparatively suitable between 25～60 ℃.This copper oxide surface is soaked and is placed this anti-oxidant time with solution with preferable between 10 seconds～5 minutes.
This oxygen barrier layer is optionally used, if after Copper Foil forms the cupric oxide top layer, do not engage with ceramic substrate immediately, then can utilize oxygen barrier layer oxidized to avoid Copper Foil to continue, and causes the cupric oxide top layer blocked up, reduces bond strength.This oxygen barrier layer can be volatilized in heat treatment process, can not influence engaging of Copper Foil and ceramic substrate.
When carrying out step such as roughening treatment, oxide treatment when a surface of Copper Foil, another surface of Copper Foil is with the protective tapes lining, forms copper oxide to avoid another surface.
By technique scheme, the manufacture method of Copper Foil of the present invention and ceramic clad plate has following advantage and beneficial effect at least: the present invention utilizes wet oxidation manner to make copper foil surface form the cupric oxide top layer, only can conveniently control and form the cupric oxide top layer on one of them surface of Copper Foil, and when ceramic substrate needed single or double to engage Copper Foil, all the thermal treatment manufacturing process that only Copper Foil is engaged with ceramic substrate got final product.Compared to existing form copper oxide with a heat treatment process after, the method for making that in addition Copper Foil is engaged with ceramic substrate again with a heat treatment process, not only can save the manufacturing process time and the energy, and can control and only on one of them surface of Copper Foil, form the cupric oxide top layer, like this then the superimposed body of Copper Foil/ceramic substrate/Copper Foil can be heat-treated simultaneously, the two sides of ceramic substrate is combined with Copper Foil simultaneously, and can not cause Copper Foil to attach to the puzzlement of saggar.
In sum, the manufacture method of a kind of Copper Foil of the present invention and ceramic clad plate is fits relative with a ceramic base plate surface of Copper Foil that has a cupric oxide top layer with, heat-treats this Copper Foil is engaged with this ceramic substrate to form a composition board again; By wet oxidation manner, make the single surface of this Copper Foil form the cupric oxide top layer.The present invention has obvious improvement technically, and has tangible positively effect, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technique means of the present invention, and can be implemented according to the content of specification sheets, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the existing two two-sided Copper Foil of copper oxide and the synoptic diagram of superimposed body on a saggar of a ceramic plate of being formed with.
Fig. 2 is that existing ceramic plate is two-sided gets the manufacturing process synoptic diagram in conjunction with Copper Foil.
Fig. 3 is the making schematic flow sheet of embodiment 1 of the manufacture method of invention Copper Foil and ceramic clad plate.
Fig. 4 is the making schematic flow sheet of embodiment 2 of the manufacture method of Copper Foil of the present invention and ceramic clad plate.
Embodiment
Reach technique means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to the Copper Foil and its embodiment of manufacture method, manufacture method, step, feature and the effect thereof of ceramic clad plate that foundation the present invention proposes, describe in detail as after.
Relevant aforementioned and other technology contents, characteristics and effect of the present invention can be known to present in the following detailed description that cooperates with reference to graphic preferred embodiment.By the explanation of embodiment, when can being to reach technique means that predetermined purpose takes and effect to get one more deeply and concrete understanding to the present invention, yet appended graphic only provide with reference to the usefulness of explanation, be not to be used for the present invention is limited.
Alligatoring Copper Foil top layer
Get hydrogen peroxide 30g, sulfuric acid 150g and ethamine 10g, be mixed in 1 liter the deionized water, form an alligatoring mixing solutions.Heat this alligatoring with mixing solutions to about 50 ℃.
Get the clean Copper Foil in a slice surface, and after a surface therein pastes protective tapes, soak again and place this alligatoring, make the exposed surface of Copper Foil be etched and form coarse top layer, again this Copper Foil is taken out, clean with deionized water with about 3 minutes of mixing solutions.Its reaction formula is shown below:
Cu+H
2O
2+H
2SO
4→CuSO
4+2H
2O
Form the cupric oxide top layer
Get Textone 40 gram and sodium hydroxide 30 grams, be mixed in 1 liter the deionized water, form an oxidation solution, heat this oxidation with extremely about 77 ℃ of solution.
This Copper Foil of aforementioned surfaces alligatoring soaked place this oxidation with about 5 minutes of solution, make the exposed surface of Copper Foil carry out oxidizing reaction to form the cupric oxide top layer, its reaction formula is shown below:
2Cu+NaClO
2+2H
2O→2Cu(OH)
2+NaCl
2Cu(OH)
2→2CuO+2H
2O
This Copper Foil autoxidation that one surface has been formed the cupric oxide top layer is cleaned copper foil surface and drying with deionized water with after taking out in the solution, protective tapes is taken off again.
Copper Foil engages with ceramic substrate
As shown in Figure 3, the Copper Foil 1 that abovementioned steps is made, place on the ceramic substrate 2 of an aluminum oxide material with its one side that forms cupric oxide top layer 11, in the atmosphere of about 1070 ℃ and the about 20ppm of oxygen content of envrionment temperature, heat-treated about 20 minutes, Copper Foil 1 is engaged with ceramic substrate 2.
In the present embodiment, after carrying out the copper foil surface oxidation step, then promptly carry out engagement step with ceramic substrate, if when needing behind the oxidation step carrying out certain interval of time to carry out engagement step again, can after oxidation step, on the cupric oxide top layer, form an oxygen barrier layer, for example, the Copper Foil that forms the cupric oxide top layer is soaked the benzotriazole solution that places the about 10g/L of concentration to be taken out after about 2 minutes, and on the cupric oxide top layer, form oxygen barrier layer, in order to isolation from oxygen, it is oxidized to avoid Copper Foil to continue, and causes copper oxide blocked up, reduces bond strength.
Alligatoring Copper Foil top layer
Get hydrogen peroxide 30g, sulfuric acid 150g and ethanamide 1g, be mixed in 1 liter the deionized water, form an alligatoring mixing solutions.Heat this alligatoring with mixing solutions to about 50 ℃.
Get the clean Copper Foil in two surfaces; and after one of them surface of each Copper Foil pastes protective tapes, soak again and place this alligatoring with about 5 minutes of mixing solutions, the exposed surface of Copper Foil is etched and forms coarse top layer; again this Copper Foil is taken out, clean with deionized water.Its reaction formula is shown below:
Cu+H
2O
2+H
2SO
4→CuSO
4+2H
2O
Form the cupric oxide top layer
Get Potassium Persulphate 10g and hydrogen-gasified sodium 50g, be mixed in 1 liter the deionized water, form an oxidation solution, heat this oxidation with solution to about 60 ℃.
Two Copper Foils of aforementioned surfaces alligatoring are soaked place this oxidation with about 7 minutes of solution, make the exposed surface of Copper Foil carry out oxidizing reaction to form the cupric oxide top layer, its reaction formula is shown below:
K
2S
2O
8+2NaOH→K
2SO
4+Na
2SO
4+H
2O+[O]
Cu+2NaOH+[O]→Na
2CuO
2+H
2O
Na
2CuO
2+H
2O→CuO+2NaOH
Each the Copper Foil autoxidation that one surface has been formed the cupric oxide top layer is cleaned each copper foil surface and drying with deionized water with after taking out in the solution, protective tapes is taken off again.
Copper Foil engages with ceramic substrate
As shown in Figure 4, each Copper Foil 3,4 that abovementioned steps is made, about in the of 5 both sides to place the ceramic substrate of an aluminium nitride material respectively with its one side that forms cupric oxide top layer 31,41, in the atmosphere of about 1072 ℃ and the about 20ppm of oxygen content of envrionment temperature, heat-treated about 15 minutes together, Copper Foil 3,4 is engaged with ceramic substrate 5.
In the present embodiment, after carrying out the copper foil surface oxidation step, then promptly carry out the engagement step with ceramic substrate, if when carrying out needing certain interval of time to carry out engagement step again behind the oxidation step, also can after oxidation step, form the step of oxygen barrier layer as described above, promptly no longer repeat at this.
In sum, the manufacture method of Copper Foil of the present invention and ceramic clad plate, only can conveniently control on the single surface of Copper Foil by wet oxidation manner and to form the cupric oxide top layer, and when ceramic substrate needs single or double to engage Copper Foil, all the thermal treatment manufacturing process that only Copper Foil is engaged with ceramic substrate gets final product, and can reduce the heat treated step of needs, when especially making the two-sided joint Copper Foil of ceramic substrate, compared to existing method for making, more can simplified manufacturing technique step and time.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (15)
1. the manufacture method of Copper Foil and ceramic clad plate is fits relative with a ceramic base plate surface of Copper Foil that has a cupric oxide top layer with, heat-treats this Copper Foil is engaged with this ceramic substrate to form a composition board again; It is characterized in that it comprises following steps:, make the single surface of this Copper Foil form the cupric oxide top layer by wet oxidation manner.
2. the manufacture method of Copper Foil as claimed in claim 1 and ceramic clad plate is characterized in that wherein said wet oxidation manner is this copper foil surface to be soaked place an oxidation that contains oxygenant with solution, makes this copper foil surface oxidation form the cupric oxide top layer.
3. the manufacture method of Copper Foil as claimed in claim 2 and ceramic clad plate is characterized in that wherein said oxygenant is the combination that is selected from Potassium Persulphate, tertiary sodium phosphate, Textone, sodium hydroxide or its etc.
4. the manufacture method of Copper Foil as claimed in claim 3 and ceramic clad plate is characterized in that wherein said oxidation is between 2～60 gram/litres with the concentration that contains this oxygenant in the solution.
5. the manufacture method of Copper Foil as claimed in claim 4 and ceramic clad plate is characterized in that wherein said oxidation is between 25～80 ℃ with the working temperature of solution.
6. the manufacture method of Copper Foil as claimed in claim 5 and ceramic clad plate, it is characterized in that wherein said copper foil surface soak place this oxidation with time of solution between 10 seconds～10 minutes.
7. the manufacture method of Copper Foil as claimed in claim 1 and ceramic clad plate is characterized in that wherein said copper foil surface carrying out also comprising a surface coarsening step before the wet oxidation processing, makes this copper foil surface coarse.
8. the manufacture method of Copper Foil as claimed in claim 7 and ceramic clad plate is characterized in that wherein said surface coarsening step is this copper foil surface to be soaked place an alligatoring solution that contains hydrogen peroxide, sulfuric acid and a tranquilizer, makes this copper foil surface coarse.
9. the manufacture method of Copper Foil as claimed in claim 8 and ceramic clad plate is characterized in that wherein said alligatoring is between 150～250 gram/litres with containing vitriolic concentration in the solution.
10. the manufacture method of Copper Foil as claimed in claim 8 and ceramic clad plate is characterized in that wherein said alligatoring is between 30～40 gram/litres with the concentration that contains hydrogen peroxide in the solution.
11. the manufacture method of Copper Foil as claimed in claim 8 and ceramic clad plate is characterized in that wherein said alligatoring is between 1～10 gram/litre with the concentration that contains this tranquilizer in the solution.
12. the manufacture method of Copper Foil as claimed in claim 11 and ceramic clad plate is characterized in that wherein said tranquilizer is ethamine or ethanamide.
13. the manufacture method of Copper Foil as claimed in claim 8 and ceramic clad plate is characterized in that wherein said alligatoring is between 25～60 ℃ with the working temperature of solution.
14. the manufacture method of Copper Foil as claimed in claim 8 and ceramic clad plate, it is characterized in that wherein said copper foil surface soak place this alligatoring with time of solution between 1 minute～5 minutes.
15., it is characterized in that another surface of wherein said Copper Foil is covered with protective tapes as the manufacture method of claim 1 or 8 described Copper Foils and ceramic clad plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101827923A CN101747073B (en) | 2008-12-04 | 2008-12-04 | Manufacturing method of copper foil and ceramic composite board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101827923A CN101747073B (en) | 2008-12-04 | 2008-12-04 | Manufacturing method of copper foil and ceramic composite board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101747073A true CN101747073A (en) | 2010-06-23 |
| CN101747073B CN101747073B (en) | 2012-05-30 |
Family
ID=42474767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101827923A Active CN101747073B (en) | 2008-12-04 | 2008-12-04 | Manufacturing method of copper foil and ceramic composite board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101747073B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102468408A (en) * | 2010-11-02 | 2012-05-23 | 财团法人工业技术研究院 | Bonding material, bonding method, and bonding structure |
| CN103113126A (en) * | 2011-11-17 | 2013-05-22 | 上海申和热磁电子有限公司 | Method for directly cladding copper by sintering wet-method copper oxide piece |
| CN103819214A (en) * | 2014-01-10 | 2014-05-28 | 南京中江新材料科技有限公司 | AlN ceramic bonded copper substrate and preparation method thereof |
| CN106927850A (en) * | 2015-12-29 | 2017-07-07 | 上海申和热磁电子有限公司 | A kind of preparation method of double-sided copper-clad ceramic substrate |
| CN107012449A (en) * | 2017-03-23 | 2017-08-04 | 同济大学 | A kind of Novel film-coated method based on multiple individual layer membrane stacks |
| CN112226790A (en) * | 2020-10-19 | 2021-01-15 | 九江德福科技股份有限公司 | Production method of ultrathin high-strength electronic copper foil |
| CN113832469A (en) * | 2021-09-24 | 2021-12-24 | 江苏富乐德半导体科技有限公司 | Method for processing copper sheet special for copper-clad ceramic substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003097557A1 (en) * | 2002-05-15 | 2003-11-27 | Schulz-Harder Juergen | Method for producing a ceramic-copper composite substrate |
-
2008
- 2008-12-04 CN CN2008101827923A patent/CN101747073B/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102468408A (en) * | 2010-11-02 | 2012-05-23 | 财团法人工业技术研究院 | Bonding material, bonding method, and bonding structure |
| CN102468408B (en) * | 2010-11-02 | 2014-08-13 | 财团法人工业技术研究院 | Bonding material, bonding method, and bonding structure |
| US8808494B2 (en) | 2010-11-02 | 2014-08-19 | Industrial Technology Research Institute | Bonding material, method, and structure |
| CN103113126A (en) * | 2011-11-17 | 2013-05-22 | 上海申和热磁电子有限公司 | Method for directly cladding copper by sintering wet-method copper oxide piece |
| CN103819214A (en) * | 2014-01-10 | 2014-05-28 | 南京中江新材料科技有限公司 | AlN ceramic bonded copper substrate and preparation method thereof |
| CN106927850A (en) * | 2015-12-29 | 2017-07-07 | 上海申和热磁电子有限公司 | A kind of preparation method of double-sided copper-clad ceramic substrate |
| CN107012449A (en) * | 2017-03-23 | 2017-08-04 | 同济大学 | A kind of Novel film-coated method based on multiple individual layer membrane stacks |
| CN112226790A (en) * | 2020-10-19 | 2021-01-15 | 九江德福科技股份有限公司 | Production method of ultrathin high-strength electronic copper foil |
| CN112226790B (en) * | 2020-10-19 | 2022-04-22 | 九江德福科技股份有限公司 | Production method of ultrathin high-strength electronic copper foil |
| CN113832469A (en) * | 2021-09-24 | 2021-12-24 | 江苏富乐德半导体科技有限公司 | Method for processing copper sheet special for copper-clad ceramic substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101747073B (en) | 2012-05-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101747073B (en) | Manufacturing method of copper foil and ceramic composite board | |
| EP2072483B1 (en) | Ceramic-copper foil bonding method | |
| JP4811756B2 (en) | Method for manufacturing metal-ceramic bonding circuit board | |
| CN104064478B (en) | A kind of manufacture method of copper/aluminium nitride ceramics composite heat-conducting substrate | |
| CN103304276A (en) | Method for metalizing ceramic substrate surface and high-power LED (light-emitting display) base | |
| CN102922828A (en) | Composite board of copper-foil-bonded ceramic substrate and preparation method of composite board | |
| CN100343356C (en) | Process for improving polymer to metal adhesion | |
| US20140338162A1 (en) | Process for producing dcb substrates | |
| CN112582278B (en) | Preparation method of DCB copper-clad substrate | |
| CN107295755A (en) | Cover the manufacture method of copper ceramic substrate | |
| JP2012203983A (en) | Exterior material for lithium ion battery | |
| ES2297911T5 (en) | Metal surface treatment procedure | |
| US6066219A (en) | Process for producing a ceramic substrate and a ceramic substrate | |
| CN111627822A (en) | Etching solution and etching method for active metal layer of copper-clad ceramic substrate | |
| TW201131013A (en) | Nano-oxide process for bonding copper/copper alloy and resin | |
| JP3908663B2 (en) | Polymer material for metal surface bonding process | |
| CN102271827A (en) | Process for improving the adhesion of polymeric materials to metal surfaces | |
| US10798824B2 (en) | Method for manufacturing insulated circuit board, insulated circuit board, and thermoelectric conversion module | |
| CN101780614B (en) | Imidazole derivative solution capable of being used as organic solderability preservative | |
| JP2001148360A (en) | Chemical and mechanical grinding slurry and grinding method | |
| CN102286739A (en) | Blackening agent for inner layer of multilayer board of printed circuit board and preparation method and application thereof | |
| CN115551214A (en) | Chemical treatment method for sintered ceramic copper-clad plate | |
| CN115107324A (en) | Method for increasing DCB copper thickness | |
| JP2013227194A (en) | Method for manufacturing metal-ceramic bonding substrate | |
| KR101590081B1 (en) | A surface treatment method for pcb inner layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: TONGXIN ELECTRONIC INDUSTRY CO., LTD. Free format text: FORMER OWNER: HCS HIGH CONDUCTION SCIENTIFIC CO., LTD. Effective date: 20120822 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20120822 Address after: Taipei City, Taiwan Chinese Zhongzheng District Yanping Road No. 83 6 floor Patentee after: Tong Hsing Electronic Industries, Ltd. Address before: China Taiwan Taoyuan County Patentee before: High Conduction Scientific Co., Ltd. |