CN101738509B - High-frequency vertical probe device - Google Patents
High-frequency vertical probe device Download PDFInfo
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- CN101738509B CN101738509B CN2008101821838A CN200810182183A CN101738509B CN 101738509 B CN101738509 B CN 101738509B CN 2008101821838 A CN2008101821838 A CN 2008101821838A CN 200810182183 A CN200810182183 A CN 200810182183A CN 101738509 B CN101738509 B CN 101738509B
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Abstract
The invention discloses a vertical probe device which is an electronic element used for transmitting a high-frequency test signal and accompanying ground potential to a wafer to be tested. The vertical probe device is provided with an adapter plate for receiving the high-frequency test signal and accompanying ground potential; after being output, the high-frequency test signal and accompanying ground potential are respectively received by one signal pin and at least one compensating pin; after the ground potential is transmitted to the compensating pin, the compensating pin and two ground planes mutually conducted up and down are stable and are in effective electric contact so as to ensure that a ground loop is conducted to a ground pin by the ground plane to reach the ground potential set by the electronic element, so that a high-frequency test signal received by the electronic element maintains the characteristic impedance thereof.
Description
Technical field
The present invention relates to vertical probe carb, be meant a kind of especially in order to transmit the vertical probe carb of high-frequency test signal.
Background technology
Along with the fast development of semiconductor technology, more the tend towards superiority high frequency operation condition of speed of electronic component, electrical measuring probe are stuck in design and go up and to need the test condition of high frequency emphatically equally, to reach the integrality of test signal transmission; To be applied to the vertical probe carb of high density components test, general probe circuit design can be laid by multiple high-frequency transmission line mostly and meet the signal transmission conditions, yet, when the high-frequency test signal transfers to probe, the parasitic capacitance effect or the cross-talk phenomenon of test signal two-way process between adjacent probe of dielectric environment around the probe, often cause the unmatched situation of high-frequency test signal transfer impedance, cause the loss of signal of testing element actual reception too high, that is the actual gain frequency range can't reach required high-frequency test condition.
Shown in Figure 1ly be a kind of " vertical probe carb " that this case inventor was proposed on August 18th, 2006, in the domestic patent that is disclosed as No. 200811444 of Nikkei March 1 in 2008, be the vertical probe carb 10 that can meet the high-frequency transmission condition, be on probe 11 assembling design, to provide the compensation probe 112 of signal probe 111 impedance matching function to wear probe guide plate 121, contact in the time of 122 to the set conductive layer 13 of bottom guide 122, can make all compensation probes 112, grounded probe 113 electrically conducts to earthing potential jointly with conductive layer 13, reaches the characteristic impedance demand of keeping signal probe 111 carry high frequency test signals.
It is right because described probe 11 is inner for having the elastic bending stretching structure at probe base 12, be beneficial in the test process to reach the best effect that electrically contacts in order between the needle point position of surveying measured electronic elements and the measured electronic elements, though therefore each probe 11 just can wear probe guide plate 121,122 combinations that so are not fastened fully with it, displacement longitudinally can take place in the perforation in bottom guide 122 when touching measured electronic elements but put, so down through permanent test, between conductive layer 13 and grounded probe 113, cause unnecessary wearing and tearing unavoidably, reduce compensation probe 112, effect electrically conducts between grounded probe 113 and the conductive layer 13.
In view of this, this case inventor endeavours to improve above-mentioned disappearance, for the high frequency electrical measuring probe of high-quality and high-reliability can be provided, with realistic electrical measurement condition and operating characteristic.
Summary of the invention
Therefore, fundamental purpose of the present invention is to be to provide a kind of vertical probe device, can make wafer scale electrical measurement engineering meet the transmission conditions of high frequency electromotive signal by high-quality signal transmission structure.
Take off purpose for before reaching, a kind of vertical probe device provided by the present invention includes a card extender, one probe base and a plurality of probe, high-frequency test signal and the earthing potential of following thereof are received by a signal pin and at least one compensation pin respectively after this card extender output, not only make the high-frequency test signal be passed to the characteristic that has impedance matching behind this signal pin, and after earthing potential is passed to this at least one compensation pin, more by last, two ground planes of following mutual conduction make ground loop conducting to a grounding pin, so that the set earthing potential of high-frequency electronic element that this ground connection pin mark touches, and then the high-frequency test signal that high-frequency electronic element received that this signal pin mark is touched is kept its characteristic impedance; Moreover, by stable between this at least one compensation pin and this two ground plane and effectively electrically contact, can avoid the ground loop interruption of high-frequency test signal and phenomenon is consumed in the generation characteristic impedance reflection that is caused that do not match.
Below, cooperate diagram to enumerate some preferred embodiments now, in order to structure of the present invention and effect are elaborated, wherein used illustrated brief description is as follows:
Description of drawings
Fig. 1 is the structural representation of existing vertical probe carb;
Fig. 2 is the structural representation that first preferred embodiment provided by the present invention is applied to probe;
Fig. 3 A is the structural representation that second preferred embodiment provided by the present invention is applied to probe;
Fig. 3 B is the online cut-open view of 3B-3B among Fig. 3 A, and Fig. 3 C is the online cut-open view of 3C-3C among Fig. 3 A;
Fig. 4 A is the structural representation that the 3rd preferred embodiment provided by the present invention is applied to probe; Fig. 4 B is the online cut-open view of 4B-4B among Fig. 4 A, and Fig. 4 C is the online cut-open view of 4C-4C among Fig. 4 A;
Fig. 5 is the structural representation that the 4th preferred embodiment provided by the present invention is applied to probe;
Fig. 6 is the structural representation that the 5th preferred embodiment provided by the present invention is applied to probe;
Fig. 7 is the structural representation that the 6th preferred embodiment provided by the present invention is applied to probe;
Fig. 8 is the structural representation of the 7th preferred embodiment provided by the present invention;
Fig. 9 is the structural representation of the 8th preferred embodiment provided by the present invention;
Figure 10 is the structural representation of the 9th preferred embodiment provided by the present invention;
Figure 11 is the structural representation of the tenth preferred embodiment provided by the present invention;
Figure 12 is the structural representation of the 11 preferred embodiment provided by the present invention;
Figure 13 is the structural representation of the 12 preferred embodiment provided by the present invention.
[main element symbol description]
1,2,2 ', 2 ' ', 3,4,5,6,7,7 ', 8,9 vertical probe devices
100 circuit boards, 110 pedestals
120 transmission lines, 121,71,81 signal wires
122,72,82 ground wires
20,20 ', 70,70 ', 80,85 card extenders
201,701,801 end faces, 202,702,802 bottom surfaces
21 through holes, 22 conductive junction points
221,73,83 signal contacts, 222,74,84 ground contacts
30,50,60,90 probe bases, 31,51,61,91 upper guide plates
311,331 inboards, 312,332 peripheries
32,35,35 ', 35 ' ', ground plane on 52,37,75,86
321,341,521,371,381 openings
33,53,62,92 bottom guides
34,36,36 ', 54,38,93 times ground planes
531,541 recesses, 55 locks are established element
611,621 through holes, 612,622 insulation courses
40 probes, 41 signal pins
42 grounding pins, 43 first compensation pins
44 second compensation pins
Embodiment
See also first preferred embodiment provided by the present invention as shown in Figure 2, for in order to be arranged at a vertical probe device 1 of probe circuit board 100, can electrically connect for the required plurality of transmission lines 120 of high-frequency test, described transmission line 120 comprises the signal wire 121 that transmits the high-frequency test signal and earthing potential is provided or keeps the required ground wire 122 of high-frequency test characteristics of signals impedance, makes the high frequency electromotive signal for being sent to this probe unit 1 from this circuit board 100 through this signal wire 121 respectively; Certain probe unit provided by the present invention does not limit applied circuit transmission space structure, with the application person of present embodiment institute is example, be circuit board and transmission line structure that above-mentioned patent disclosure is provided for No. 200811444, described transmission line 120 is that jumper connection is in these circuit board 100 superjacent air spaces, pedestal 110 through these circuit board 100 central authorities connects with this probe unit 1 provided by the present invention again, transmits electromotive signal that this circuit board 100 received to this probe unit 1 to reach; In addition, the inventor in 2007 on September 19, of the Republic of China a kind of " high-speed test device " of No. the 96134978th, the patented claim that proposes, also disclosed vertical probe group in this high-speed test device this probe unit 1 provided by the present invention can be substituted by, the effect that the present invention desires to provide can be brought into play equally; Therefore based on above-mentioned electrical transmission structure, this probe unit 1 includes a card extender 20, a probe base 30 and a plurality of probe 40, wherein:
The material that this card extender 20 is the tool insulation characterisitic is made, have an end face 201, a bottom surface 202, a plurality of through hole 21 and conductive junction point 22, this end face 201 and these pedestal 110 bottom connections, described through hole 21 for be through to bottom surface 202 from end face 201 and in the bottom surface 202 respectively correspondence be provided with described conductive junction point 22, this signal wire 121 is passed behind the through hole 21 can be in the bottom surface 202 electrically connect and correspond to a signal contact 221 with this conductive junction point 22, respectively this ground wire 122 passes these through hole 21 backs and electrically connects and correspond to a ground contact 222 with this conductive junction point 22.
This probe base 30 is located at the bottom surface 202 of this card extender 20, have a upper guide plate 31 and a bottom guide 33, for the material of tool insulation characterisitic made, for described probe 40 is set, this guide plate 31 respectively, 33 respectively correspondence be laid with on one ground plane 32 and ground plane 34 once, this two ground plane 32,34 test conditions for the wafer electronic component that touches according to described probe 40 required corresponding point have specific laying pattern, with the supplier of present embodiment institute is to attach mode or in the film preparation mode metallic film is attached to this two guide plate 31 with copper foil, 33, and the position corresponding to described signal contact 221 is formed with an opening 321 respectively, 341, make described opening 321,341 can corresponding probe 40 for part pass and not with this ground plane 32,34 electrically connect.
Described probe 40 is that differentiation has signal pin 41, grounding pin 42, the first compensation pin 43 and the second compensation pin 44; Respectively this signal pin 41 and grounding pin 42 are for wearing this two guide plate 31,33 to keep the upright state of pin, make it protrude this bottom guide 33 the high-frequency test contact and the ground contact of power supply property contact measured electronic component respectively in needle point position of an end separately, the other end then electrically connects this signal contact 221 and ground contact 222 set on this card extender 20 respectively, and this signal pin 41 is by this two ground plane 32 when wearing this probe base 30,34 opening 321,341 to keep and this two ground plane 32,34 is electrically isolated, can effectively send high-frequency test signal from signal wire 121, certainly be mainly with this grounding pin 42 provided by the present invention and electrically connect the functional structure that this goes up ground plane 32, thus present embodiment to exemplify the structure that this grounding pin 42 and ground contact 222 connect be non-essential syndeton for making things convenient for its setting only; Respectively this first compensation pin 43 is set up in parallel for following this signal pin 41, two ends are respectively to be fixed in this upper guide plate 31 and to be resisted against this bottom guide 33, and keep an end and electrically contact the following ground plane 34 that this bottom guide 33 is laid, the other end then electrically connects the ground contact 222 with these signal contact 221 adjacent settings; Respectively this second compensation pin 44 and this first compensation pin, 43 same apical graftings are in this time ground plane 34, and provide current return between this two ground plane 32,34 and this grounding pin 42, make keep the required earthing potential of following of high-frequency test characteristics of signals impedance pin 43 be passed to this time ground plane 34 via this first compensation after, can effectively reach ground plane 32 down to this grounding pin 42 by this second compensation pin 44; In addition,, therefore do not limit and to wear this upper guide plate 31, also can have same effect if only be resisted against this two ground plane 32,34 because this second compensation pin 44 is the media as this two ground plane 32,34 of conducting; Certainly, because this two compensation pin 43,44 is based on the transmission media as the required ground current of following of high-frequency signal, therefore do not limit with acicular texture and reach its functional characteristic, any metallic conductor and lead with conduction of current characteristic all can be applicable to the present invention to reach the effect of expection.
Therefore this probe unit 1 transmit the high-frequency test signal to this signal pin 41 and grounding pin 42 when put the electronic component that touches, can pass through this signal wire 121, signal pin 41, grounding pin 42, first and compensate pin 43 and the complete high-frequency test signal transmission loop of ground wire 122 formation; And be set side by side with respectively this first compensation pin 43 with these signal pin 41 adjacent specific spacings respectively, cooperate this time ground plane 34, this second compensation pin 44, go up ground plane 32 and the grounding pin 42 complete ground loop that forms, the high-frequency test signal that high-frequency electronic element received that 41 of this signal pins are touched is kept its characteristic impedance.Moreover, on this bottom guide 33, even if this signal pin 41 and grounding pin 42 in order to an electric shock sub-element have the function of longitudinal elasticity displacement, has best electrical contact effect when touching to wafer to be measured each electronic component with time point with needle point that respectively this signal pin 41 and grounding pin 42 are provided, right permanent test down, be arranged between the ground plane 34 of bottom guide 33 and the grounded probe 42 and cause unnecessary wearing and tearing unavoidably, make between this grounding pin 42 and the following ground plane 34 and be difficult for keeping the excellent electrical property contact action, so by this two compensation pin 43,44 with this two ground plane 32, stable and effectively electrically contact between 34, the ground loop that can avoid high frequency to survey signal interrupts and produces the reflection consume phenomenon that characteristic impedance does not match and caused, so this probe unit 2 provided by the present invention more can effectively be kept the integrality that the high-frequency test signal transfers to measured electronic elements compared to prior art.
What deserves to be mentioned is, probe unit provided by the present invention is mainly to keep the complete of ground current loop, do not limit this two guide plate 31, the laying mode of set ground plane on 33, see also a vertical probe device 2 that is respectively second and third preferred embodiment provided by the present invention as shown in Figures 3 and 4,2 ', the difference that compares to the foregoing description is, this two guide plate 31, on 33 corresponding make on, following ground plane 35,36,35 ', 36 ' only is at described grounding pin 42 and compensation pin 43,44 are arranged in the position of this probe base 30 and lay specific electric connection structure; Therefore can be shown in Fig. 3 B and Fig. 3 C, the upper and lower ground plane 35,36 of this of this vertical probe device 2 is the lead laying structure, the central ground plane 35 of should going up electrically connects respectively this second compensation pin 44 and grounding pin 42, and this time ground plane 36 electrically connects respectively this first compensation pin 43 and the second compensation pin 44; Perhaps can be shown in Fig. 4 B and Fig. 4 C, this vertical probe device 2 ' is local film metal sheet laying structure, the central ground plane 35 ' of should going up electrically connects adjacent described second compensation pin 44 and the grounding pin 42, and this time ground plane 36 ' electrically connects the adjacent described first compensation pin 43 and the second compensation pin 44.
See also a vertical probe device 3 of the 4th preferred embodiment provided by the present invention as shown in Figure 5, be to have a probe base 50 and this card extender 20 and the described probe 40 identical with the various embodiments described above, this probe base 50 has a upper guide plate 51 and a bottom guide 53, respectively this guide plate 51,53 and respectively correspondence be laid with on one ground plane 52 and ground plane 54 once, the difference that is provided with above-mentioned first preferred embodiment is:
Dig corresponding to the position of described compensation pin 43,44 on this bottom guide 53 and be carved with a plurality of recesses 531, when the adhesion metal film in this bottom guide 53 when forming this time ground plane 54, described recess 531 makes this time ground plane 54 correspondences be formed with a plurality of recesses 541 from this bottom guide 53 concave surfaces; Therefore have better electrical contact effect in the time of can making described compensation pin 43,44 correspondences be resisted against the recess 541 of this time ground plane 54, and can avoid the situation of this vertical probe device 3 transversal displacements such as described compensation pin 43,44 generation sideslips when moving or operate.
See also a vertical probe device 4 of the 5th preferred embodiment provided by the present invention as shown in Figure 6, the difference that compares to above-mentioned first preferred embodiment is, be to have several locks made from metal material to establish the edge that element 55 runs through this upper and lower guide plate 31,33, not only can be by fixing this two guide plate 31,33, therefore and can save as the second compensation pin 44 as described in the required setting of above-mentioned first preferred embodiment, directly establish element 55 as the medium that will this upper and lower ground plane 32,34 electrically conducts by this lock respectively.
See also a vertical probe device 5 of the 6th preferred embodiment provided by the present invention as shown in Figure 7, the difference that compares to above-mentioned first preferred embodiment is, this two guide plate 31, on 33 corresponding respectively make one on and ground plane 37 once, 38 are comprehensive this two guide plate 31 that is attached to, 33 inboard 311,331 and periphery 312,332, be formed with a plurality of openings 371 equally in the position of the described signal pin 41 of correspondence again, 381, make this two ground plane 37,38 directly in this two guide plate 31,33 periphery 312,332 electrically contacts can be saved equally as the second compensation pin 44 as described in the required setting of above-mentioned first preferred embodiment.
See also a vertical probe device 6 of the 7th preferred embodiment provided by the present invention as shown in Figure 8, be to have a probe base 60 and this card extender 20 identical and described signal pin 41, grounding pin 42, the first compensation pin 43 with the various embodiments described above, this probe base 60 has a upper guide plate 61 and a bottom guide 62, and the difference that is provided with above-mentioned first preferred embodiment is:
This two guide plate 61,62 for to make with metal material, can wear and be electrically insulated for described signal pin 41 with described signal pin 41, thereby do not influence the characteristic of described signal pin 41 transmitting high-frequency signals, known by being engaged in this technical field person as for reaching the technological means that this probe base 60 and described signal pin 41 are electrically insulated, present embodiment provided in this guide plate 61 respectively, corresponding described signal pin 41 places of wearing that supply are provided with a through hole 611 respectively on 62,621, this through hole 611 respectively, be equipped with an insulation course 612 on 621 the hole wall, 622, by keeping described signal pin 41 and this two guide plate 61,62 is electrically isolated, and the internal diameter of these upper guide plate 61 through holes 611 is greater than the external diameter of 41 corresponding these signal contacts 221 that electrically connect of this signal pin, avoid this upper guide plate 61 to electrically conduct with described signal contact 221, therefore this probe unit 6 not only can omit as above-mentioned first preferred embodiment provided as described in ground plane 32,34 making, and the setting of saving the described second compensation pin 44 equally.
If certainly more save easy to make, also can be around signal pin 41 sheathed insulating sleeve, directly pass the probe base made from metal material as above-mentioned again, have the effect that is equal to equally.
See also a vertical probe device 7 of the 8th preferred embodiment provided by the present invention as shown in Figure 9, be to have a card extender 70 and this probe base 30 and described probe 40 identical with above-mentioned first preferred embodiment, this card extender 70 is with the difference that above-mentioned first preferred embodiment is provided:
This card extender 70 can be general printed circuit board (PCB) (PCB), organic multilayer plate (Multi-Layer Organic, MLO) or multi-layer ceramics plate (Multi-Layer Ceramic, the space convertor of the made tool circuit space translation function of structure such as MLC), have a relative end face 701 and a bottom surface 702, inside is provided with a plurality of high-frequency transmission line structures that are made of a plurality of signal wires 71 and ground wire 72, not only respectively these signal wire 71 adjacent specific spacings are provided with at least one this ground wire 72, and the line pitch near 30 transmission lines of this probe base is more little more, that is via after the space conversion function, the spacing of each signal wire 71 on the end face 701 more than bottom surface 702 on the spacing of each signal wire 71 big; Therefore the circuit transmission structure can be corresponded to the electronic component of laying with high density on the wafer to be measured from these card extender 70 end faces 701 to these card extender 70 bottom surfaces 702 through space conversion, the bottom surface 702 of this card extender 70 is corresponding to respectively this signal wire 71 and ground wire 72 are respectively equipped with a signal contact 73 and a ground contact 74, this signal contact 73 is for respectively these signal pin 41 corresponding electric connections, therefore this ground contact 74 reaches the effect that the high-frequency test signal is passed to measured electronic elements from these card extender 70 tops by described signal pin 41 and grounding pin 44 for respectively this first compensation pin 43 and grounding pin 44 corresponding electric connections.
See also a vertical probe device 8 of the 9th preferred embodiment provided by the present invention as shown in figure 10, circuit transmission structure for another tool space conversion function, have a card extender 80 and this probe base 30 and described probe 40 identical with above-mentioned the 7th preferred embodiment, its difference is:
This card extender 80 has a relative end face 801 and a bottom surface 802, and be laid with a plurality of signal wire 81 and ground wires 82 that are provided with the carry high frequency test signal, be provided with at least one this ground wire 82 to keep the characteristic impedance of high-frequency test signal transmission with these signal wire 81 adjacent specific distance respectively, respectively the end of this signal wire 81 and ground wire 82 connects respectively on bottom surface 802 and establishes a signal contact 83 and a ground contact 84, for respectively this signal pin 41 and the 43 corresponding electric connections of the first compensation pin, in the middle of this signal wire 81 and the ground wire 82 of part directly electrically connect this signal contact 83 and ground contacts 84 for being through to back, bottom surface 802, this signal wire 81 partly and ground wire 82 more 802 extend laterally to the preposition place and connect and establish this signal contact 83 and ground contact 84 in the bottom surface.
Therefore this card extender 80 can with this signal wire 81 and ground wire 82 from end face 801 comparatively near around locate through space conversion to the suitable position of lower surface 702 should the signal pin 41 and the first compensation pin 43, the circuit transmission structure that not only has the space conversion function equally that is provided compared to above-mentioned the 8th preferred embodiment, and only carry out the conversion of horizontal circuit space in these card extender 80 bottom surfaces 802, the expensive condition with material such as organic multilayer plate or multi-layer ceramics plates is laid and saved to the circuit that can simplify the inner high complexity of card extender; Moreover, the high-frequency test construction of condition of high-frequency signal and ground signalling corresponds to this probe base 30 peripheral places around being distributed in these card extender 80 end faces 801 owing to need can be arranged in pairs or groups simultaneously, it is corresponding with this signal pin 41 and the first compensation pin 43 to be forwarded to nearly center again by this signal wire 81 and ground wire 82 receptions earlier, needn't with all the other than the test condition of low-frequency range dense distribution together, the high density wafer electronics that helps minority high-frequency component testing requirement is laid, and can effectively use circuit space and reduce the probability that the high-frequency test signal is disturbed.
See also a vertical probe device 9 of the tenth preferred embodiment provided by the present invention as shown in figure 11, the equivalence utilization structure for above-mentioned the 9th preferred embodiment has a card extender 85, a probe base 90 and described probe 40, and its difference is:
This card extender 85 is laid with described signal wire 81 and ground wire 82 equally, and bottom surface 802 is to have ground plane 86 described ground wire 82 of electric connection and ground contacts 84 on; This probe base 90 has a upper and lower guide plate 91,92, and be located at the needle point position apical grafting of the ground plane 93 of this bottom guide 92 for described first and second compensation pin 43,44, as for the backshank position of described first and second compensation pin 43,44 then apical grafting in this set ground contact 84 of this card extender 85 bottom surfaces 802.
Because described ground wire 82 needs in the bottom surface 802 to follow this corresponding signal wire 81 to keep the characteristic impedance of high-frequency test signal transmission, therefore ground plane 86 on this is set when this bottom surface 802 makes described ground wire 82 can be saved as making man-hour and cost that ground plane is set in the upper guide plate 91 of this probe base 90 as the various embodiments described above, so described second compensation pin 44 and grounding pin 42 are resisted against this ground contact 84 on this card extender 85, then this first compensation pin 43 earthing potential that the high-frequency test signal is required conducts to this time ground plane 93 so that behind this second compensation pin 44, can be passed to this grounding pin 42 so that complete ground current loop to be provided through ground plane 86 on this.
Certainly, present embodiment provide is located at ground plane on this 86 function of these card extender 85 bottom surfaces 802, not limiting the high-frequency transmission line structure that can be provided with in the card extender, is example with Figure 12 and Figure 13, is respectively the provided by the present invention the 11 and the 12 preferred embodiment; A vertical probe device 2 shown in Figure 12 " be change application as pairing second preferred embodiment of Fig. 3; a central card extender 20 ' is for being provided with wearing signal wire 121 and ground wire 122; bottom surface of this card extender 20 ' is provided with ground plane 35 on ", should go up ground plane 35 " directly electrically contact with respectively this second compensation pin 44 and grounding pin 42, so the ground current loop followed of high-frequency test signal equally can be through being somebody's turn to do upward ground plane 35 " reach this grounding pin 42; A vertical probe device 7 ' shown in Figure 13 is the change application as pairing the 8th preferred embodiment of Fig. 9, a central card extender 70 ' is the space convertor structure that constitutes with signal wire 71 and ground wire 72, the bottom surface of this card extender 70 ' is provided with ground plane 75 and described ground wire 72 electric connections on one, and should go up ground plane 75 and directly electrically contact, so the ground current loop followed of high-frequency test signal equally can ground plane 75 reach this grounding pin 42 through being somebody's turn to do upward with respectively this second compensation pin 44 and grounding pin 42.
But, above-described, only be preferable possible embodiments of the present invention, change so use the equivalent structure that instructions of the present invention and claim do such as, ought to be included in the claim of the present invention.
Claims (28)
1. vertical probe device is characterized in that including:
One card extender has a bottom surface, and this bottom surface is provided with at least one signal contact and at least one ground contact, and this ground contact electrically conducts to earthing potential;
One probe base has upper and lower relative a upper guide plate and a bottom guide, and this upper guide plate is arranged in the bottom surface of this card extender;
One signal pin wears this probe base, has a needle point and a backshank, and the needle point of this signal pin is suspended at this bottom guide below, and the backshank of this signal pin electrically connects this at least one signal contact;
One compensation pin, adjacent specific spacing with this signal pin has a needle point and a backshank, and the needle point of this compensation pin is resisted against this bottom guide, and the backshank of this compensation pin electrically connects this at least one ground contact; And,
One grounding pin wears this probe base, has a needle point and a backshank, and the needle point of this grounding pin is suspended at this bottom guide below, and the backshank of this grounding pin electrically connects the needle point of this compensation pin.
2. according to the described vertical probe device of claim 1, it is characterized in that, this probe base be provided with electrically conduct mutually one on ground plane and ground plane once, be laid in this upper guide plate and this bottom guide respectively.
3. according to the described vertical probe device of claim 2, it is characterized in that ground plane is to be attached to metallic film that to wear a plurality of openings behind this upper guide plate made on this, described opening corresponding for described signal pin passes with this on ground plane be electrically insulated.
4. according to the described vertical probe device of claim 2, it is characterized in that this time ground plane is to be attached to metallic film that to wear a plurality of openings behind this bottom guide made, described opening is corresponding to be passed and is electrically insulated with this time ground plane for described signal pin.
5. according to the described vertical probe device of claim 2, it is characterized in that ground plane was to electrically connect in the edge of this probe base under ground plane reached on this.
6. according to the described vertical probe device of claim 5, it is characterized in that also having a plurality of locks made from metal material and establish element, wear this upper guide plate and bottom guide and electrically connect upward ground plane and ground plane down.
7. according to the described vertical probe device of claim 5, it is characterized in that ground plane extension laying to side edge of this probe base was touched under ground plane reached on this.
8. according to the described vertical probe device of claim 1, it is characterized in that the bottom surface of this card extender is laid with ground plane on, this bottom guide is laid with ground plane, and ground plane was to electrically conduct mutually under ground plane reached on this.
9. according to claim 2 or the 8th described vertical probe device, it is characterized in that, this compensation pin is the first compensation pin, and this probe unit also is provided with one second compensation pin, and this second compensation needle set has a needle point and a backshank to electrically connect this time ground plane respectively and goes up ground plane.
10. according to the described vertical probe device of claim 9, it is characterized in that, have a plurality of these signal pins, a plurality of this first compensation pin, a plurality of this second compensation pin and a plurality of this grounding pin, this time ground plane is that many leads are made, electrically connect respectively this first compensation pin and respectively this second compensation pin respectively, should go up ground plane is that many leads are made, electrically connects respectively this second compensation pin and respectively this grounding pin respectively.
11. according to the described vertical probe device of claim 9, it is characterized in that, have a plurality of these signal pins, a plurality of this first compensation pin, a plurality of this second compensation pin and at least one this grounding pin, this time ground plane is that at least one sheet metal is made, electrically connect described first compensation pin and the described second compensation pin, should go up ground plane is that at least one sheet metal is made, electrically connects the described second compensation pin and this at least one grounding pin.
12. according to the described vertical probe device of claim 1, it is characterized in that this probe base is made with metal material, this upper guide plate and bottom guide are equipped with a plurality of through holes, correspondence is provided with described signal pin respectively, and described signal pin and this upper guide plate and bottom guide are electrically isolated.
13., it is characterized in that according to the described vertical probe device of claim 12, respectively be equipped with an insulation course on the hole wall of this through hole, and the internal diameter of the set through hole of this upper guide plate greater than this signal pin the external diameter of corresponding this signal contact that electrically connects.
14. according to the described vertical probe device of claim 1, it is characterized in that, this card extender is laid with a plurality of signal wires and ground wire, and respectively corresponding described signal contact and the ground contact of electrically connecting is provided with at least one this ground wire with the adjacent specific distance of this signal wire respectively.
15., it is characterized in that this card extender has an end face according to the described vertical probe device of claim 14, the spacing of adjacent respectively this signal wire is to phase down from end face to the bottom surface of this card extender.
16. according to the described vertical probe device of claim 15, it is characterized in that, this card extender be select with printed circuit board (PCB), organic multilayer plate or multi-layer ceramics plate structure one made.
17., it is characterized in that this bottom guide is concaved with at least one recess of predetermined depth according to the described vertical probe device of claim 1, the needle point of this compensation pin places this at least one recess.
18. a probe unit is characterized in that including:
One card extender has an end face, a bottom surface, and is equipped with a signal wire and at least one ground wire, and this ground wire electrically conducts to earthing potential;
One probe base is located at the bottom surface of this card extender, and is laid with a ground plane;
One signal pin wears this probe base, has a needle point and a backshank, and the needle point of this signal pin is in order to an electric shock sub-element, and the backshank of this signal pin electrically connects this signal wire;
One compensation pin with this signal pin adjacent specific spacing arranged side by side, has a needle point and a backshank, and the needle point of this compensation pin contacts this ground plane, and the backshank of this compensation pin protrudes this probe base and electrically connects this at least one ground wire; And,
One grounding pin has a needle point and a backshank, and the needle point that the needle point of this grounding pin protrudes this probe base and this signal pin is positioned at same plane, and the backshank of this grounding pin electrically connects this ground plane.
19., it is characterized in that this ground plane is following ground plane according to the described probe unit of claim 18, this probe base also is provided with ground plane on, backshank of contiguous this compensation pin is set, this on ground plane and under ground plane be to electrically conduct mutually.
20., it is characterized in that this two ground plane is to be attached to metallic film that to wear a plurality of openings behind this probe base made according to the described probe unit of claim 19, described opening is corresponding to be passed and is electrically insulated with this ground plane for described signal pin.
21., it is characterized in that this two ground plane is to electrically connect in the edge of this probe base according to the described probe unit of claim 19.
22., it is characterized in that according to the described probe unit of claim 21, also have more a plurality of locks made from metal material and establish element, wear this probe base and electrically connect this two ground plane.
23., it is characterized in that this two ground planes extension is established to the side edge of this probe base and touched according to the described probe unit of claim 21.
24., it is characterized in that this compensation pin is the first compensation pin according to the described probe unit of claim 19, this probe unit also is provided with one second compensation pin, this second compensation needle set has a needle point and a backshank to electrically connect this two ground plane respectively.
25., it is characterized in that this ground plane is following ground plane according to the described probe unit of claim 18, this card extender is laid with ground plane on, ground plane and following ground plane are to electrically conduct mutually on this.
26., it is characterized in that this compensation pin is the first compensation pin according to the described probe unit of claim 25, this probe unit also is provided with one second compensation pin, this second compensation needle set has a needle point and a backshank to connect respectively to establish this time ground plane and last ground plane.
27., it is characterized in that the spacing of adjacent respectively this signal wire is to phase down from end face to the bottom surface of this card extender according to the described probe unit of claim 18.
28., it is characterized in that the needle point of this compensation pin is to go deep into the predetermined degree of depth of this probe base according to the described probe unit of claim 18, this probe base forms a recess to the needle point that should compensate pin, has this ground plane on this recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101821838A CN101738509B (en) | 2008-11-24 | 2008-11-24 | High-frequency vertical probe device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101821838A CN101738509B (en) | 2008-11-24 | 2008-11-24 | High-frequency vertical probe device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101738509A CN101738509A (en) | 2010-06-16 |
| CN101738509B true CN101738509B (en) | 2011-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101821838A Active CN101738509B (en) | 2008-11-24 | 2008-11-24 | High-frequency vertical probe device |
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| Country | Link |
|---|---|
| CN (1) | CN101738509B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107430150A (en) * | 2015-03-13 | 2017-12-01 | 泰克诺探头公司 | It is used in particular for the measuring head with vertical probe of frequency applications |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102466739B (en) * | 2010-11-02 | 2014-04-09 | 旺矽科技股份有限公司 | Probe card |
| TWI506280B (en) * | 2013-12-13 | 2015-11-01 | Mpi Corp | Probe module (2) |
| TWI564569B (en) * | 2015-09-21 | 2017-01-01 | 旺矽科技股份有限公司 | Probe structure and manufacturing method thereof |
| TW202035995A (en) * | 2019-03-18 | 2020-10-01 | 旺矽科技股份有限公司 | Probe device |
| CN112710878B (en) * | 2019-10-24 | 2024-02-27 | 台湾中华精测科技股份有限公司 | Detachable high-frequency testing device and vertical probe head thereof |
| TWI719895B (en) * | 2020-05-11 | 2021-02-21 | 中華精測科技股份有限公司 | Thin-film probe card with array type and test module thereof |
| TWI739592B (en) * | 2020-09-09 | 2021-09-11 | 旺矽科技股份有限公司 | Probe assembly |
| CN114089160B (en) * | 2021-11-19 | 2023-03-14 | 法特迪精密科技（苏州）有限公司 | Method for assembling, repairing and testing parameter setting of vertical probe card device |
| TWI810824B (en) * | 2022-02-23 | 2023-08-01 | 研鋐精密電子科技股份有限公司 | Probe card and manufacturing method thereof |
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| CN101135701A (en) * | 2006-08-29 | 2008-03-05 | 旺矽科技股份有限公司 | Vertical type high frequency probe card |
| CN101266262A (en) * | 2007-03-13 | 2008-09-17 | 旺矽科技股份有限公司 | High speed test card |
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| US5525911A (en) * | 1993-08-04 | 1996-06-11 | Tokyo Electron Limited | Vertical probe tester card with coaxial probes |
| CN1653340A (en) * | 2002-05-08 | 2005-08-10 | 佛姆费克托公司 | High peformance probe system for testing semiconductor wafers |
| US6967556B2 (en) * | 2003-06-30 | 2005-11-22 | International Business Machines Corporation | High power space transformer |
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| CN107430150A (en) * | 2015-03-13 | 2017-12-01 | 泰克诺探头公司 | It is used in particular for the measuring head with vertical probe of frequency applications |
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| Publication number | Publication date |
|---|---|
| CN101738509A (en) | 2010-06-16 |
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