CN101726636B - Multi-finger probe - Google Patents
Multi-finger probe Download PDFInfo
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- CN101726636B CN101726636B CN200810170739.1A CN200810170739A CN101726636B CN 101726636 B CN101726636 B CN 101726636B CN 200810170739 A CN200810170739 A CN 200810170739A CN 101726636 B CN101726636 B CN 101726636B
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Abstract
A multi-finger probe comprises a cantilever shared elastic part and a plurality of finger parts which extend from the free end of the cantilever shared elastic part. The multi-finger probe is characterized in that the free end of the cantilever shared elastic part is suspended above a basal plate so that the shared elastic part can provide a first section elastic deformation; and each finger part is provided with a needle point and a lead which are electrically connected together, and each finger part can provide the second section elastic deformation.
Description
Technical field
The present invention relates to a kind of probe, specifically, is a kind of multi-finger probe.
Background technology
Traditional probe is fixed on the probe of separate type on circuit board one by one, and the probe pin arm of this device and pin spacing (pitch) are all wider.If dwindle pin spacing, can utilize precision processing technology cloth pin on an insulcrete, more described insulcrete is joined on circuit board, for example day disclosure special permission numbering Unexamined Patent 6-140482.But make probe in the mode of assembling, and make the more difficult control of precision, cloth pin direction is limited, is difficult to carry out the probe card designs of complicated cloth pin, large area or high aggregation degree.For the demand in response to microminiaturization, micro-photographing process is used to make probe.No. 4961052nd, the people's such as such as Tada United States Patent (USP), utilizes micro-photographing process in the upper finger (fingers) that forms of insulating base (base plate), contacting conductor deposition on the free-ended surface of finger.But the insulating base of this device is only as the fixed pedestal use of finger, can't provide finger any elasticity, so probe lacks good elastic construction.
The U.S. Patent Application Publication of Gritters proposes a kind of probe with elastic construction No. 20070296433, it is upper that the probe of separate type is fixed on platform (platform), and the adjutage (extensionarm) of platform is fixed on and on substrate, forms torsion structure.But this device is difficult for being made into the product of fine needle spacing, and due to the relation of adjutage, this device has wider size, is unfavorable for microminiaturization.It is large that torsion structure accounts for area, makes probe cloth pin limited, and torsion structure also can increase structural stress, reduces life of product.
The people's such as Mathieu United States Patent (USP) proposes a kind of socle beam probe No. 6672875.Semi-girder is the structure that electric component of microcomputer is conventional, has had ripe manufacturing technology, and and micro-photographing process compatibility.But socle beam probe is single structure, probe itself, except transmitting electrical function, provides the elasticity and the anchorage force that bear test stress simultaneously, therefore can be subject to the restriction of size and material.Fig. 1 shows a general fine needle spacing socle beam probe design, it seems according to existing product specification, minimum pin spacing is about 10～30 μ m, and needle body length is 500～1500 μ m, conventional needle body material is nickel alloy, is 0.1～4g/mil according to the heavy scope of product demand differing needles.To these type of semi-girder 10 stress application tests, result shows that maximum stress occurs near near the end 14 stiff end 12, more approaches free end 16, and stress is less.Because of material yield strength (yield strength) restriction, taking the nickel alloy commonly used as example, the about 900MPa of maximum yield strength～1.4GPa left and right, under limited pin spacing and needle body length restriction, when free end 16 when assigning maximum flexibility displacement (common product is set as 3～4mil), the maximum stress value of structure has approached or has exceeded material yield strength, and semi-girder 10 is by permanent strain, and also can shorten the serviceable life of probe.
According to the semi-girder derivation of equation of square-section, the relational expression of pin weight, maximum stress value and needle body size is as follows:
K∝WT
3/L
3
σ∝T/L
2
Wherein K is pin heavy (spring constant), and W is needle body width, and T is needle body thickness, and L is needle body length, and σ is semi-girder needle body stiff end stress value.
In the case of do not increase needle body width and maintain identical pin heavy, increase needle body length and dwindle needle body thickness and can reduce near the stress value of stiff end 12, but, it is by pin spacing and needle body contraction in length that gesture is driven in following pin type development, in other words, if known pin type continues, toward dwindling the future development of pin spacing and needle body size, will to bear higher maximum stress near probe stiff end 12, must shorten the serviceable life of probe.
Therefore known pin type structure exists above-mentioned all inconvenience and problem.
Summary of the invention
Object of the present invention, is to propose a kind of multi-finger probe.
For achieving the above object, technical solution of the present invention is:
A kind of multi-finger probe, comprises the shared elastic of a semi-girder and multiple finger extending out from the free end of the shared elastic of described semi-girder, it is characterized in that:
The free end that described semi-girder is shared elastic is suspended on a substrate top, makes described shared elastic that one first paragraph elastic deformation amount can be provided;
Described multiple finger extending out from the free end of the shared elastic of described semi-girder, has a needle point and a wire to be electrically connected to each other on finger described in each, described in each, finger can provide a second segment elastic deformation amount.
Multi-finger probe of the present invention can also be further achieved by the following technical measures.
Aforesaid multi-finger probe, wherein said needle point wire has Part I and shares elastic top through described finger and described semi-girder, and Part II extends on described substrate.
Aforesaid multi-finger probe, the stiff end of the shared elastic of wherein said semi-girder has a column and anchors on described substrate.
Aforesaid multi-finger probe, wherein more comprises that a holder encases the Part II of described column and described wire.
Aforesaid multi-finger probe, the proof resilience deflection that wherein said needle point provides is described first paragraph elastic deformation amount and the summation of stating second segment elastic deformation amount.
Aforesaid multi-finger probe, it is insulator that wherein said semi-girder is shared elastic.
Aforesaid multi-finger probe, it is conductor that wherein said semi-girder is shared elastic.
Aforesaid multi-finger probe, wherein more comprises that a dielectric layer is between described wire and described finger and the shared elastic of described semi-girder.
Aforesaid multi-finger probe, the width of wherein said wire is narrower than described finger.
A kind of multi-finger probe, comprises that a semi-girder shares elastic, many wires, and multiple conductions finger, is characterized in that:
The free end that described semi-girder is shared elastic is suspended on a substrate top, and the free end that makes described semi-girder share elastic can provide a first paragraph elastic deformation amount;
Described many wires, described in each, wire has Part I above described semi-girder is shared elastic, and Part II extends on described substrate;
Described multiple conductions finger, conducts electricity finger to be overlapped on one of them Part I of described many wires described in each, conducting electricity finger described in each can provide a second segment elastic deformation amount separately; And the free end of described multiple conductions finger is electrically connected a needle point, the proof resilience deflection that described needle point provides is described first paragraph elastic deformation amount and described second segment elastic deformation amount's summation.
Aforesaid multi-finger probe, the stiff end of the shared elastic of wherein said semi-girder has a column and anchors on described substrate.
Aforesaid multi-finger probe, wherein more comprises that a holder encases the Part II of described column and described many wires.
Aforesaid multi-finger probe, it is insulator that wherein said semi-girder is shared elastic.
Aforesaid multi-finger probe, it is conductor that wherein said semi-girder is shared elastic.
Aforesaid multi-finger probe, wherein more comprises that a dielectric layer is between described many wires and the shared elastic of described semi-girder.
Aforesaid multi-finger probe, wherein more comprises that multiple blades extend to below, more described blade and the Jian Youyi space, more described conduction finger of more described conduction finger from the free end of the shared elastic of described semi-girder.
Aforesaid multi-finger probe, wherein said multiple blades have sandwich construction.
A kind of multi-finger probe, comprises the shared elastic of a semi-girder and multiple finger, it is characterized in that:
The free end that described semi-girder is shared elastic is suspended on a substrate top;
Described multiple finger, described in each, finger is overlapped in the shared elastic of described semi-girder, and have a needle point and a wire to be electrically connected to each other, described wire has Part I and shares elastic top through described finger and described semi-girder, and Part II extends on described substrate.
Aforesaid multi-finger probe, the stiff end of the shared elastic of wherein said semi-girder has a column and anchors on described substrate.
Aforesaid multi-finger probe, wherein more comprises that a holder encases the Part II of described column and described wire.
Aforesaid multi-finger probe, wherein said semi-girder is shared elastic and described finger is insulator.
Aforesaid multi-finger probe, it is conductor that wherein said semi-girder is shared elastic.
Aforesaid multi-finger probe, wherein more comprises that a dielectric layer is between described wire and described finger and the shared elastic of described semi-girder.
Aforesaid multi-finger probe, the width of wherein said wire is narrower than described finger.
Adopt after technique scheme, multi-finger probe of the present invention has the following advantages:
1. effectively reduce the max architecture stress that needle body bears, improve product serviceable life.
2. directly make on circuit substrate with micro-shadow, electroforming, etching mode, therefore positioning precision is high, is particularly suitable for pin spacing microminiaturization, any direction inserting needle, high aggregation degree cloth pin, large area test card.
Brief description of the drawings
Fig. 1 is the schematic diagram of known fine needle spacing socle beam probe;
Fig. 2 is the embodiment schematic diagram of elastic construction of the present invention;
The embodiment that Fig. 3 is Fig. 2 provides flexible schematic diagram;
Fig. 4 is sectional view and the top view of the first embodiment of the present invention;
Fig. 5 is the stereographic map of the first embodiment of the present invention;
Fig. 6 is sectional view and the top view of the second embodiment of the present invention;
Fig. 7 is the stereographic map of the second embodiment of the present invention;
Fig. 8 is the sectional view of the third embodiment of the present invention;
Fig. 9 is the diverse schematic diagram of being permitted that semi-girder of the present invention is shared elastic and finger;
Figure 10 is that multi-finger probe of the present invention is arranged on the schematic top plan view on circuit substrate;
Figure 11 is sectional view and the top view of the embodiment of multilayer probe of the present invention;
Figure 12 is the schematic diagram that design many group multi-finger probes on a substrate of the present invention;
Figure 13 is sectional view and the top view of the fifth embodiment of the present invention;
Figure 14 is sectional view and the top view of the sixth embodiment of the present invention;
Figure 15 is the sectional view of the seventh embodiment of the present invention;
Figure 16 is the blade schematic diagram of whole piece formula;
Figure 17 shows the blade with dactylitic texture;
Figure 18 is the blade that shows sandwich construction;
Figure 19 is the first embodiment schematic diagram of the manufacturing process of multi-finger probe of the present invention;
Figure 20 is the second embodiment schematic diagram of the manufacturing process of multi-finger probe of the present invention.
Embodiment
Below in conjunction with embodiment and accompanying drawing thereof, the present invention is illustrated further.
The present invention is by the circuit function of multi-finger probe and structure function independent design respectively, now refer to Fig. 2, Fig. 2 is the Knot structure funtion part of Ben Faming, is the embodiment schematic diagram of elastic construction of the present invention, comprises the shared elastic 20 of described beam and 22 two of fingers part.As previously mentioned, K ∝ WT
3/ L
3, therefore, do not increasing needle body length L, do not change under the prerequisite of the heavy K of pin, if near needle body width W semi-girder stiff end increases, needle body thickness T is reduced the heavy K of pin that remains identical, now because of σ ∝ T/L
2, structure maximum stress value is minimized.The elastic construction of Fig. 2 is realized with the nickel cobalt (alloy) identical with Fig. 1, and while being verified with Finite Element, be all 10 μ m at needle body width and pin spacing, needle body length is 1500 μ m, finger 22 length are in the situation of 800 μ m, and needle body thickness is reduced to 100 μ m and is still maintained identical rigidity by the thickness 115 μ m of the single semi-girder of Fig. 1.The embodiment of Fig. 2 is done to finite element analysis emulation can be learnt, maximum stress is shared near the stiff end 22a of elastic 20 occurring in semi-girder, and the part of elastic 20 is more shared in finger 22 away from semi-girder, and the stress bearing is less.When the free end of finger 22 is during to bottom offset 100 μ m, the maximum stress of appearance is 663MPa, and the maximum stress value while bearing free end to bottom offset 100 μ m than the cantilever beam structure of Fig. 1 reduces by 21%.In addition, reduce because semi-girder is shared the thickness of elastic 20, reduce the depth-to-width ratio of structure, therefore the enforcement of processing procedure also can be than being easier to.
Fig. 3 is that the present embodiment provides flexible schematic diagram, in the time that downforce F is applied to finger 22 end, semi-girder is shared elastic 20 provides first paragraph elastic deformation amount d1, finger 22 provides second segment elastic deformation amount d2, disperse to bear downforce F, the finger available proof resilience deflection of 22 end is d1+d2.Because dispersed texture is stressed, reduce max architecture stress, therefore under limited material bearing strength, elastic 20 shared by semi-girder and finger 22 can provide larger elastic deformation amount, the serviceable life of reducing creep degree, increase probe, in other words, under the condition of identical stress ability to bear and use same process, the elastic construction that the present embodiment provides can be reached the multi-finger probe of less pin spacing.
Fig. 4 is the first embodiment schematic diagram of the elastic construction of application drawing 2, and Fig. 5 is its stereographic map.In the present embodiment, the column 20a that described semi-girder is shared elastic 20 has one end to anchor on substrate 18, form semi-girder and share the stiff end of elastic 20, the free end that semi-girder is shared elastic 20 extends multiple fingers 22, each 22 top, finger has a needle point 24 and a wire 26 to be electrically connected to each other, the Part I of wire 26 extends past the top of finger 22 and the shared elastic 20 of semi-girder from needle point 24, the Part II 26a of wire 26 extends downward substrate 18, is electrically connected the circuit in substrate 18.Because shared 20 of the elastic of semi-girder provide structure function, therefore needn't be electrically connected the circuit in substrate 18.It is two different (distinct) assemblies from wire 26 that semi-girder is shared elastic 20.In the present embodiment, it is one with finger 22 that semi-girder is shared elastic 20, semi-girder is shared elastic 20 provides shared first paragraph elastic deformation amount to each finger 22, alleviate the stressed of each finger 22, each finger 22 structure separated from one another makes each finger 22 to provide alone second segment elastic deformation in response to external force, complies with the difference in height between each determinand.The space that the shared elastic 20 of semi-girder takes full advantage of the below, gap of each wire 26 provides structural design, compares with single Design of Cantilever Beam, and thinner structural thickness can reach identical pin weight, has increased maximum flexibility deflection simultaneously.Described multi-finger probe bears the required elasticity of test stress and is mainly provided by the shared elastic 20 of semi-girder, and wire 26 only provides the function of electrical transmission, is therefore no longer subject to the restriction of material bearing strength, and its width and thickness also can freely be adjusted.Described wire 26 can be selected the material that electric conductivity is high, also can use fine rule, should consider as main taking electricity specification, and rating of machine meets the strength of materials restriction of wire own.In the time bearing external force, there is semi-girder to share the elastic deformation amount of elastic 20 and elastic deformation amount's two parts of finger 22.The selectivity of finger 22 Design of length can allow maximum stress value optimization, also can control finger 22 other elastic deformation amplitude itself, makes finger 22 have separately the ability of complying with determinand surface undulation.Compared with the single socle beam probe of tradition, the length of finger 22 is shorter, and therefore side direction structural elasticity is stronger, and when pin spacing is little, the more traditional single socle beam probe in finger 22 is more difficult causes the friction between adjacent finger 22 because of side direction perturbation power skew.If the single socle beam probe of tradition, because side direction perturbation power contacts with adjacent probe, will cause short circuit, when serious, can cause determinand or probe to damage.According to the circuit function of multi-finger probe of the present invention and structure function independent design respectively; therefore the width of described wire 26 can design narrowlyer than described finger 22; thus; even if each described finger 22 is in contact with one another because of abnormal disturbances; can not cause the short circuit between wire 26, the function of self-short-circuit protection is provided yet.In the present embodiment, it is insulator that semi-girder is shared elastic 20, therefore wire 26 Direct precipitations surface thereon.Although show that in the present embodiment needle point 24 is above wire 26, can be also that needle point 24 is directly connected finger 22.Described needle point 24 and wire 26 can be one, for example, on wire 26, after electroforming or plated metal, form needle point 24.Needle point 24 and wire 26 can be also independently, for example, rejoin on wire 26 after making separately needle point 24.
Fig. 6 and Fig. 7 show the second embodiment of the present invention, are the Part II 26a that increases dielectric medium holder 28 and encase column 20a and wire 26 on the first embodiment, to strengthen pillar construction.
Fig. 8 is third embodiment of the present invention schematic diagram, and the described the 3rd structure of implementing is identical with the first embodiment, but the material of the shared elastic 20 of semi-girder and finger 22 is conductor.If need electrical isolation between different needle point 24, between wire 26 and the shared elastic 20 of semi-girder and finger 22, set up a dielectric layer 30.For the needle point 24 that does not need electrical isolation, allow the wire 26 of described correspondence directly contact the shared elastic 20 of semi-girder and finger 22.If necessary, also semi-girder can be shared to elastic 20 and finger 22 ground connection, configure suitable wire, dielectric layer and ground plane size with known high-frequency design, to reach good signal transmission quality.
Due to the circuit function of multi-finger probe and structure function are distinguished to independent design, therefore design flexibility becomes large, and can there be the variation of various shapes or structure the shared elastic 20 of semi-girder and finger 22.As shown in Figure 9, the length of each finger 22, spacing and width can change along with needs example; Semi-girder is shared in elastic 20 also can increase perforate 32 or other minor structure, to adjust the distribution of semi-girder elasticity size or stress; The direction of finger 22 also can change.
Figure 10 is that multi-finger probe of the present invention is arranged on the schematic top plan view on circuit substrate 18, represents that its needle body layout is freer compared with conventional probe, can provide compared with the more resilient design space of conventional probe, the probe card designs of particularly suitable large area or high integration.
Figure 11 is the embodiment schematic diagram of multilayer multi-finger probe.Two multi-finger probes 34 and 36 are set on same substrate 18, by the distribution mode of levels dislocation, can meet more highdensity testing requirement.The number of plies that increases multi-finger probe can improve needle point distribution density again.The needle point height of multi-finger probe 34 and 36 can be designed as copline or non-copline, to meet testing requirement.
Figure 12 is another embodiment schematic diagram of multilayer multi-finger probe, and incorgruous multi-finger probe is mutually set on same substrate 18, and as shown in figure 12, multi-finger probe 34 and 36 intermeshes, and meets multidirectional probe demand.
Figure 13 is another embodiment of the present invention schematic diagram, and it is identical with aforesaid embodiment that semi-girder is shared elastic 20, and finger 22 is conductors, is overlapped on wire 26, and extends upward needle point 24.Because finger 22 is to provide the part of the structural design of spring function, it is limited that therefore its Thickness Design provides more merely the wire 26 of conducting function, and only the required elastic force of sharing in finger is lighter, without bearing excessive exerting oneself, therefore in design, still possesses elasticity.Described in embodiment above, are conductors if semi-girder is shared elastic 20, can increase by a dielectric layer and share between elastic 20 and wire 26 at semi-girder.
In the embodiment of Figure 14 schematic diagram, finger 22 is overlapped on semi-girder and shares in elastic 20, and the two is one.Needle point 24 is on finger 22, and wire 26 is electrically connected the internal wiring of needle point 24 to substrate 18.The height that finger 22 overlaps can change.Described in embodiment above, are conductors if semi-girder is shared elastic 20, can increase by a dielectric layer and share between elastic 20 and finger 22 and needle point 24 and wire 26 at semi-girder.
Figure 15 is the embodiment schematic diagram of the same type with Figure 13, and finger 22 is overlapped on wire 26, and its overlap height is higher.The free end that blade 38 is shared elastic 20 from semi-girder extends out, and has a space between finger 22.At needle point 24 stressed hour (F1+F2), only provide power F2 and F1 to absorb stress by the shared elastic 20 of semi-girder and finger 22.When needle point 24 is stressed larger, during for F1 '+F2 '+F3 ', it is integrally-built stressed to assist to disperse that blade 38 also provides support power F3 '.It is one that blade 38 is shared elastic 20 with semi-girder.It is whole piece that blade 38 can be shared elastic 20 the same with semi-girder, as shown in figure 16, can be also that finger-like separates, as shown in figure 17.
As shown in figure 18, also can make the blade 38 of apparatus sandwich construction.It is one that blade 38 is shared elastic 20 with semi-girder.
Figure 19 is the embodiment schematic diagram of the manufacturing process of multi-finger probe.Step 1 forms shielding 40 on substrate 18 with micro-photographing process, and step 2 forms metal 42,44 and sacrifice layer 46.Circuit in metal 42 and substrate 18 is electrically connected.Step 2 can be done regional deposition by subregion electroforming/plating, subregion electroless plating, electricity work, sputter or evaporation collocation shielding, and filled conductive material etc. mode is reached, if desired grinding-flatening upper surface after deposition.Step 3 forms shielding 48, and step 4 continues plated metal 42,44, step 5 dielectric layer 50 covering metals 44.Step 6 formation shielding 52 once again plated metal 42; step 7 forms shielding 54 and continues plated metal 56; step 8 etching metal 56, and the shielding protection of the arranging in pairs or groups tip portion wanting to stay, manufacture needle point in chemical etching, chemical etching, Laser Processing, electric discharge processing etc. mode.Step 9 except deshield 54,52,48 and sacrifice layer 46 after, complete multi-finger probe.In this device, metal 44 provides semi-girder to share elastic and finger, and metal 42 provides wire, and metal 56 provides needle point, and dielectric layer 50 code wires 42 are shared elastic and finger 44 with semi-girder, and holder is used as in the shielding 40 staying.Each shielding in this processing procedure and the material of sacrifice layer can be selected photoresistance, removable metal or macromolecular material, and each layer not necessarily identical, and visual processing procedure needs and adjusts.If this processing procedure uses the electroforming that needs to lay Seed Layer, can metal deposition (evaporation, sputter, change plating etc.), micro-shadow, the mode such as etching defines required Seed Layer, this part is known manufacture of semiconductor.The needle point of step 8 is made part also can copy direct electrotyping forming one needle point of processing procedure of step 7, replaces with etching mode moulding needle point.
Figure 20 is another embodiment schematic diagram of the manufacturing process of multi-finger probe.Step 1 forms shielding 40 equally on substrate 18, and step 2 forms after metal 42,44, removes shielding 40 in step 3.Circuit in metal 42 and substrate 18 is electrically connected.Step 4 deposition of sacrificial layer 58, step 5 continues processing procedure mode plated metal 42,44 and the sacrifice layer 58 with step 2～4, plated metal 42 once again after step 6 dielectric layer 50 covering metals 44.Step 7 forms shielding 60 and continues plated metal 56, step 8 etching metal 56.Step 9 except deshield 60 and sacrifice layer 58 after, complete multi-finger probe.In this device, metal 44 provides semi-girder to share elastic and finger, and metal 42 provides wire, and metal 56 provides needle point, and needle point production method is identical with last embodiment, and dielectric layer 50 code wires 42 are shared elastic and finger 44 with semi-girder.
Figure 19 and 20 represented processing procedure applied in any combination mutually, repeatedly apply the steps such as micro-shadow and deposition materials and complete various according to multi-finger probe of the present invention.If semi-girder share elastic by fill or electricity insulating material form, and the Insulation Specification suiting the requirements, can omit and apply semi-girder and share the dielectric layer 50 between elastic and wire.
In different embodiment, also can utilize aforementioned processing procedure to make semi-girder and share elastic, finger and wire, then the needle point of independent moulding is bonded on wire.Separately moulding needle point and be bonded on and be all known technology on wire.
Above embodiment is used for illustrative purposes only, but not limitation of the present invention, person skilled in the relevant technique, without departing from the spirit and scope of the present invention, can also make various conversion or variation.Therefore, all technical schemes that are equal to also should belong to category of the present invention, should be limited by each claim.
Element numbers explanation
10 socle beam probes
12 stiff ends
14 semi-girder ends
16 free ends
18 substrates
20 semi-girders are shared elastic
20a column
22 fingers
24 needle points
26 wires
The Part II of 26a wire
28 holders
30 dielectric layers
32 holes
34 multi-finger probes
36 multi-finger probes
38 blades
40 shieldings
42 metals
44 metals
46 sacrifice layers
48 shieldings
50 dielectric layers
52 shieldings
54 shieldings
56 metals
58 sacrifice layers
60 shieldings
Claims (21)
1. a multi-finger probe, is characterized in that, comprises the shared elastic of a semi-girder and multiple finger;
Described semi-girder is shared elastic and is comprised column and the cantilever extending out from described column on set one substrate;
The cantilever that described semi-girder is shared elastic is suspended on described substrate top, makes the cantilever of described shared elastic that one first paragraph elastic deformation amount can be provided;
The free end that the cantilever of elastic is shared from described semi-girder in described multiple finger extends out, described in each, on finger, have a needle point and a wire to be electrically connected to each other, described in each, finger can provide a second segment elastic deformation amount who is greater than described first paragraph elastic deformation amount.
2. multi-finger probe as claimed in claim 1, is characterized in that, described wire has Part I shares elastic cantilever top through described finger and described semi-girder, and Part II extends on described substrate.
3. multi-finger probe as claimed in claim 2, is characterized in that, more comprises that a holder encases the Part II of described column and described wire.
4. multi-finger probe as claimed in claim 1, is characterized in that, the proof resilience deflection that described needle point provides is described first paragraph elastic deformation amount and described second segment elastic deformation amount's summation.
5. multi-finger probe as claimed in claim 1, is characterized in that, it is insulator that described semi-girder is shared elastic.
6. multi-finger probe as claimed in claim 2, is characterized in that, it is conductor that described semi-girder is shared elastic.
7. multi-finger probe as claimed in claim 6, is characterized in that, more comprises that a dielectric layer is between described wire and the cantilever of described finger and the shared elastic of described semi-girder.
8. multi-finger probe as claimed in claim 1, is characterized in that, the width of described wire is narrower than described finger.
9. a multi-finger probe, is characterized in that, comprises that a semi-girder shares elastic, many wires, multiple conductions finger;
Described semi-girder is shared elastic and is comprised column and the cantilever extending out from described column on set one substrate;
The cantilever that described semi-girder is shared elastic is suspended on described substrate top, and the cantilever that makes described semi-girder share elastic can provide a first paragraph elastic deformation amount;
Described many wires, described in each, wire has Part I above the cantilever of the shared elastic of described semi-girder, and Part II extends on described substrate;
Described multiple conductions finger, conducts electricity finger to be overlapped on one of them Part I of described many wires described in each, described in each, conducting electricity finger can provide a second segment elastic deformation amount who is greater than described first paragraph elastic deformation amount separately; And the free end of described multiple conductions finger is electrically connected a needle point, the proof resilience deflection that described needle point provides is described first paragraph elastic deformation amount and described second segment elastic deformation amount's summation.
10. multi-finger probe as claimed in claim 9, is characterized in that, more comprises that a holder encases the Part II of described column and described many wires.
11. multi-finger probes as claimed in claim 9, is characterized in that, it is insulator that described semi-girder is shared elastic.
12. multi-finger probes as claimed in claim 9, is characterized in that, it is conductor that described semi-girder is shared elastic.
13. multi-finger probes as claimed in claim 12, is characterized in that, more comprise that a dielectric layer is between described many wires and the shared elastic of described semi-girder.
14. multi-finger probes as claimed in claim 9, it is characterized in that, more comprise that multiple blades extend to below, described multiple blades and the Jian Youyi space, described multiple conductions finger of described multiple conductions finger from the free end of the cantilever of the shared elastic of described semi-girder.
15. multi-finger probes as claimed in claim 14, is characterized in that, described multiple blades have sandwich construction.
16. 1 kinds of multi-finger probes, is characterized in that, comprise the shared elastic of a semi-girder and multiple finger;
Described semi-girder is shared elastic and is comprised column and the cantilever extending out from described column on set one substrate;
The cantilever that described semi-girder is shared elastic is suspended on described substrate top, makes the cantilever of described shared elastic that one first paragraph elastic deformation amount can be provided;
Described multiple finger, described in each, finger is overlapped on the cantilever of the shared elastic of described semi-girder, and on it, there are a needle point and a wire to be electrically connected to each other, described in each, finger can provide a second segment elastic deformation amount who is greater than described first paragraph elastic deformation amount, described wire has Part I shares elastic cantilever top through described finger and described semi-girder, and Part II extends on described substrate.
17. multi-finger probes as claimed in claim 16, is characterized in that, more comprise that a holder encases the Part II of described column and described wire.
18. multi-finger probes as claimed in claim 16, is characterized in that, described semi-girder is shared elastic and described finger is insulator.
19. multi-finger probes as claimed in claim 16, is characterized in that, it is conductor that described semi-girder is shared elastic.
20. multi-finger probes as claimed in claim 19, is characterized in that, more comprise that a dielectric layer is between described wire and the cantilever of described finger and the shared elastic of described semi-girder.
21. multi-finger probes as claimed in claim 16, is characterized in that, the width of described wire is narrower than described finger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810170739.1A CN101726636B (en) | 2008-10-23 | 2008-10-23 | Multi-finger probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810170739.1A CN101726636B (en) | 2008-10-23 | 2008-10-23 | Multi-finger probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101726636A CN101726636A (en) | 2010-06-09 |
| CN101726636B true CN101726636B (en) | 2014-08-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810170739.1A Expired - Fee Related CN101726636B (en) | 2008-10-23 | 2008-10-23 | Multi-finger probe |
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| CN (1) | CN101726636B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106526256B (en) * | 2016-11-03 | 2019-02-05 | 上海纳米技术及应用国家工程研究中心有限公司 | A kind of air-sensitive test combined probe and its application |
| CN114200279B (en) * | 2021-11-29 | 2023-03-14 | 强一半导体（苏州）有限公司 | Film probe card and probe head thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020008530A1 (en) * | 1998-10-01 | 2002-01-24 | Amst Co., Ltd. | Micro cantilever style contact pin structure for wafer probing |
| US20020072136A1 (en) * | 1999-09-27 | 2002-06-13 | Masatoshi Kanamaru | Method for manufacturing semiconductor device utilizing semiconductor testing equipment |
| CN1822341A (en) * | 2005-02-16 | 2006-08-23 | 旺矽科技股份有限公司 | Suspension arm probe |
| CN101149393A (en) * | 2006-09-21 | 2008-03-26 | 艾佩思有限公司 | Probe substrate for test and manufacturing method thereof |
-
2008
- 2008-10-23 CN CN200810170739.1A patent/CN101726636B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020008530A1 (en) * | 1998-10-01 | 2002-01-24 | Amst Co., Ltd. | Micro cantilever style contact pin structure for wafer probing |
| US20020072136A1 (en) * | 1999-09-27 | 2002-06-13 | Masatoshi Kanamaru | Method for manufacturing semiconductor device utilizing semiconductor testing equipment |
| CN1822341A (en) * | 2005-02-16 | 2006-08-23 | 旺矽科技股份有限公司 | Suspension arm probe |
| CN101149393A (en) * | 2006-09-21 | 2008-03-26 | 艾佩思有限公司 | Probe substrate for test and manufacturing method thereof |
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|---|---|
| CN101726636A (en) | 2010-06-09 |
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