CN101670541B - Fast polishing traversing processing method of heavy-calibre planar optical elements - Google Patents

Fast polishing traversing processing method of heavy-calibre planar optical elements Download PDF

Info

Publication number
CN101670541B
CN101670541B CN2009101125484A CN200910112548A CN101670541B CN 101670541 B CN101670541 B CN 101670541B CN 2009101125484 A CN2009101125484 A CN 2009101125484A CN 200910112548 A CN200910112548 A CN 200910112548A CN 101670541 B CN101670541 B CN 101670541B
Authority
CN
China
Prior art keywords
workpiece
polishing
traversing
polishing disk
heavy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009101125484A
Other languages
Chinese (zh)
Other versions
CN101670541A (en
Inventor
郭隐彪
林静
杨炜
柯晓龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen University
Original Assignee
Xiamen University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiamen University filed Critical Xiamen University
Priority to CN2009101125484A priority Critical patent/CN101670541B/en
Publication of CN101670541A publication Critical patent/CN101670541A/en
Application granted granted Critical
Publication of CN101670541B publication Critical patent/CN101670541B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The invention discloses a fast polishing traversing processing method of heavy-calibre planar optical elements, relating to heavy-calibre planar optical elements. The processing method adopts a numerical control polishing machine and is provided with a polishing disk, a polishing pad, a vacuum film, a workpiece rotating shaft, a freeing wheel, a freeing wheel spindle and a working traversing shaft. The method comprises the steps of selecting processing mode, setting processing parameters and using space coordinate transform and Fourier series to calculate the workpiece speed corresponding to the polishing disk; using a pressure distribution surface model to calculate the pressure distribution of the workpiece in the traversing process, conducting linear cutting to one traversing processing period of the workpiece, and combining Princeton formula to obtain material removing rates of points on different radiuses of the workpiece; calculating the probability for being exposed out of the polishing disk and falling to different pressure areas of the points on different radiuses of the workpiece, weighting and evaluating the obtained material removing rates by adopting specific values, predicting the surface variation trend of the processed workpiece, and detecting whether the result is in accordance with the predicted result or not after processing.

Description

The fast polishing traversing processing method of heavy-calibre planar optical elements
Technical field
The present invention relates to a kind of heavy-calibre planar optical elements, especially relate to a kind of fast polishing traversing processing method of heavy-calibre planar optical elements.
Background technology
The processing of the high-accuracy optical element of large scale at present receives attention both domestic and external; How to make the high-precision heavy-caliber optical element; Particularly heavy-calibre planar and non-spherical element are realized efficient mass processing; Being that pendulum is made an important topic in field at optics, also is a severe challenge in field that present optics is made.(referring to document: 1, Zhu Haibo, " the numerical control polishing technical research of heavy-calibre planar element, " [D]. Master of engineering academic dissertation, Sichuan University, 2005; 2, J.Luo and D.A.Domfeld; " Material removal mechanism in chemical mechanical polishing:theory and modeling, " [J] .IEEETransactions on Semiconductor Manufacturing, Vol.14; No; 2,112-123,2001).
Heavy-calibre planar optical elements, is requiring through polishing after the stage through corase grind, fine grinding or accurate grinding, to improve the surface of the work surface precision, to reduce surface roughness and subsurface defect.Traditional first throwing and annular polishing all are chemical mechanical polishing (CMP) processes, can satisfy the workpiece processing request, but need skilled engineer to obtain required workpiece face type by experiential operating, expend the more time, have reduced production efficiency.Just throwing and these two operations of annular polishing all are the operations of forming a connecting link again, and the result who processes is to the processing effect and the efficient of operation have great influence thereafter.Therefore be necessary to improve the processing technology of throwing just and annular polishing, improve working (machining) efficiency and machining accuracy, prediction and chain of command type variation tendency process the surface topography favourable to numerical control polishing.
Fast polishing traversing processing method can improve working (machining) efficiency greatly; (Material Removal Rate MRR) can reach 5~10um/h to material removing rate, is 8~10 times that just throw; Compare with annular polishing, can predict and control the variation tendency of workpiece face type again more exactly.Fast polishing traversing processing method is utilized in the inhomogeneities of workpiece and polishing disk contact zone pressure distributions in the traversing process, realizes workpiece material inhomogeneous removal on the whole, thereby obtains required workpiece surface precision.
Summary of the invention
The objective of the invention is to shortcoming, a kind of fast polishing traversing processing method of heavy-calibre planar optical elements is provided to low, difficult prediction of efficient in the heavy-calibre planar optical elements polishing processing and control workpiece face type variation tendency.
The present invention adopts heavy-calibre planar optical elements fast polishing system (being digital control polishing machine tool), and said digital control polishing machine tool is provided with polishing disk, polishing pad, vacuum film, workpiece rotating shaft, freeing wheel, finishing wheel shaft and works traversing axle.Polishing disk is provided with the polishing disk rotating shaft; Polishing disk is independent rotation under the polishing disk rotating shaft drives; Polishing pad is located on the polishing disk, and workpiece is located on the workpiece rotating shaft of polishing pad, and vacuum film is located at surface of the work; In order to keep polishing pad to have certain surface roughness and planarization, freeing wheel can be repaired pad interface under the finishing wheel shaft drives as required.On polishing pad, inject polishing fluid.
Said polishing pad can adopt polyurethane polishing pad.
Said polishing disk can adopt the marble polishing disk.
Said polishing fluid can be mixed by cerium oxide and deionized water and form.
The present invention includes following steps:
1) selects processing mode for 1, set machined parameters, utilize space coordinate transformation and fourier series to calculate the step of the speed of the relative polishing disk of workpiece;
2) 1 is utilized pressure distributions surface model (skin model) to calculate the pressure distributions in the traversing process of workpiece; Traversing process-cycle of workpiece is carried out linear incision; Obtain material removing rate (Material Removal Rate, step MRR) put on the workpiece different radii in conjunction with Princeton (Preston) formula;
3) 1 is calculated on the workpiece that point exposes the polishing disk probability regional with falling into different pressure on the different radii; Adopt ratio that resulting material removing rate MRR is carried out the weighting assignment according to probability; Prediction processing back workpiece face type variation tendency, the step that processing back testing result is consistent with prediction.
In step 1); Said processing mode is preferably the cross sliding type processing mode, and said machined parameters is that the external world exerts pressure, polishing disk rotating speed, workpiece rotational frequency, Princeton (Preston) coefficient, polishing disk radius, workpiece radius, eccentric throw, traversing speed and the maximum back gauge of revealing of workpiece.Said selection processing mode; Set machined parameters; Utilize space coordinate transformation and fourier series to calculate the step of the speed of the relative polishing disk of workpiece; Can set up relative motion and static relatively two coordinate systems in workpiece centre, set up relative motion and static relatively two coordinate systems at the polishing disk center, utilize space coordinate transformation and fourier series to calculate workpiece relative polishing disk speed in traversing process.
In step 2) in; Said " utilize pressure distributions surface model (skin model) to calculate the pressure distributions in the traversing process of workpiece; traversing process-cycle of workpiece is carried out linear incision, the material removing rate that obtains putting on the workpiece different radii in conjunction with Princeton (Preston) formula (Material Removal Rate, MRR) "; Pressure distributions surface model capable of using calculates the pressure distributions in the traversing process of workpiece; Traversing process-cycle of workpiece is carried out linear incision, set up cut point, utilize the pressure distributions surface model to calculate the pressure distributions of each cut point in the traversing process of workpiece; Combine Princeton (Preston) formula again; Calculate the material removing rate MRR that point rotates a circle at the cut point place on the workpiece different radii; At last; Material removing rate according to workpiece movement distance and each cut point rotate a circle can carry out integration to the material removing rate of whole horizontal moving process, calculates and puts total material removing rate on the workpiece on the different radii; Said Princeton (Preston) formula is MRR=kpv, and wherein k is a Princeton Preston coefficient, and p is certain any suffered pressure on the workpiece, and v is the speed of certain a bit relative polishing disk on the workpiece.
In step 3); Put the probability that exposes polishing disk and fall into different pressure zone on the said calculating workpiece on the different radii; Adopt ratio that resulting material removing rate MRR is carried out the weighting assignment according to probability; Workpiece face type variation tendency after the prediction processing, processing back testing result are to calculate to put on the different radii on the workpiece to expose polishing disk and the probability that falls into different pressure zone with the step that prediction is consistent, and adopt ratio that the total material removing rate MRR of point on the different radii on the resulting workpiece of integration is carried out the weighting assignment according to probability; Prediction processing back workpiece face type variation tendency, processing back testing result is consistent with prediction.
The principle of fast polishing is to adopt polymeric material one polyurethane as polishing pad, according to the pressure that is applied, in conjunction with relative velocity and traversing processing method carry out fast polishing to heavy-calibre planar optical elements faster.Polishing mode with other is compared, the polyurethane polishing pad that the present invention adopts, the heat that the hydration beds of precipitation, minimizing subsurface defect, the reduction that can avoid pitch polishing pad polishing workpiece to produce produced in polishing.Relative velocity and traversing processing method can improve polishing efficiency significantly faster, prediction and control workpiece face type variation tendency.
The present invention adopts heavy-calibre planar optical elements fast polishing system (being digital control polishing machine tool), comprises 3 linkage machine tools, polyurethane polishing pad, diamond dressing wheel and polishing fluid feed system.Adopt the traversing processing method fast polishing to accomplish the heavy-calibre planar optical elements Surface Machining, and prediction processing back workpiece face type variation tendency, processing back testing result is consistent with prediction, therefore can be used for control workpiece face type variation tendency in the processing.
Description of drawings
Fig. 1 is the structural representation of the heavy-calibre planar optical elements fast polishing system (being digital control polishing machine tool) of embodiment of the invention employing.
Fig. 2 is the plan structure sketch map of Fig. 1.
Prediction and control workpiece face type variation tendency flow chart that Fig. 3 adopts for the embodiment of the invention.
Fig. 4 is the sketch map of certain some N relative velocity on the calculating workpiece of embodiment of the invention employing.
Pressure distributions surface model (skin model) sketch map that Fig. 5 adopts for the embodiment of the invention.
Fig. 6 is that 100mmN point material removing rate is with workpiece center of circle travel distance variation relation figure for radius on the workpiece of embodiment of the invention employing.In Fig. 6, abscissa is a workpiece center of circle travel distance (m), and ordinate is material thickness average removal rate (m/s).
The material removing rate that N is ordered on the different radii on the workpiece in the cross sliding type process that Fig. 7 adopts for the embodiment of the invention is with workpiece center of circle travel distance variation relation figure.In Fig. 7, abscissa is a workpiece center of circle travel distance (m), and ordinate is material thickness average removal rate (m/s).■ is 0mm; ● be 20mm; ▲ be 40mm, is 60mm, ☆ is 80mm; ◇ is 100mm; is 120mm, and zero is 140mm, and
Figure GSB00000455233100032
is 160mm.
In the cross sliding type process that Fig. 8 adopts for the embodiment of the invention each bar curve among Fig. 7 is carried out on the different radii that integration obtains at N o'clock at a total material removing rate sketch map of traversing cycle.In Fig. 8, abscissa is workpiece radius (m), and ordinate is material thickness average removal rate (m/s).
In the cross sliding type process after the weighting assignment that Fig. 9 adopts for the embodiment of the invention on the prediction different radii N o'clock at a total material removing rate sketch map of traversing cycle.In Fig. 9, abscissa is workpiece radius (m), and ordinate is material thickness average removal rate (m/s).
Workpiece x after the data that Figure 10 and Figure 11 adopt for the embodiment of the invention, type survey map above the y direction.In Figure 10 and 11, abscissa is workpiece radius (m), and ordinate is measuring height poor (nm).
The specific embodiment
Following examples will combine accompanying drawing that the present invention is further described.
Referring to Fig. 1 and 2, the heavy-calibre planar optical elements fast polishing system (being digital control polishing machine tool) that the present invention adopts comprises 3 linkage machine tools, polyurethane polishing pad, diamond dressing wheel and polishing fluid feed system.Adopt the traversing processing method fast polishing to accomplish the heavy-calibre planar optical elements Surface Machining, and prediction processing back workpiece face type variation tendency, processing back testing result is consistent with prediction, therefore can be used for control workpiece face type variation tendency in the processing.
In Fig. 1 and 2, workpiece 21 is by vacuum film 22 absorption, workpiece rotating shaft Z1 liftable, so that workpiece 21 is applied different pressure, workpiece 21 drives independent down rotation at workpiece rotating shaft Z1, and the traversing axle Z3 that works can to drive workpiece 21 laterally mobile.Polyurethane polishing pad 23 is sticked on the marble polishing disk 24 by super glue, and polishing disk 24 is independent rotation under polishing disk rotating shaft Z4 drives.In order to keep polishing pad 23 to have certain surface roughness and planarization, diamond dressing wheel 25 can be repaired polishing pad 23 surfaces under finishing wheel shaft Z2 drives as required.In process, be sprayed at polishing pad 23 surfaces by polishing fluid P (polishing fluid is mixed by cerium oxide and deionized water and forms, and presses mass ratio, and the proportioning of cerium oxide and deionized water is preferably 10: 1) feed system.Axle Z1, axle Z3 and axle Z4 three-shaft linkage can carry out material to workpiece 21 and remove.In Fig. 2, the radius of freeing wheel 25 is R, and the radius of workpiece 21 is R1.
The used digital control polishing machine tool of the embodiment of the invention adopts ultraprecise fast polishing lathe, is Beijing PPS100 of NorthTiger lathe limited company fast polishing lathe.
Fig. 3 is the present invention's prediction and control workpiece face type variation tendency flow chart.Its flow process is beginning, and---the selection processing mode is also set machined parameters---to be calculated relative velocity and---uses surface model to calculate pressure distributions and---cut traversing process and calculate MRR (material removing rate)---weighted MRR---testing result is consistent with prediction---end.
Main implementation step of the present invention is:
1) select processing mode, set machined parameters, utilize space coordinate transformation and fourier series to calculate the speed of the relative polishing disk of workpiece:
Processing mode is selected the cross sliding type processing mode, the 105.84N that exerts pressure of the selected external world of machined parameters, and the polishing disk rotating speed is w1, workpiece rotational frequency is w2, w1=w2=36rad/s, Princeton (Preston) coefficient k is 0.7 * 10 -12m 2/ N 2, polishing disk radius R=550mm, workpiece radius R1=160mm, eccentric distance e=160mm, traversing speed Vx=1000mm/min, the maximum back gauge d=80mm that reveals of workpiece.
Fig. 4 is that the present invention has provided the sketch map that calculates certain some N relative velocity on the workpiece, in Fig. 4, sets up 4 cartesian coordinate systems respectively: 1, with the coordinate system x of workpiece motion s 2o 2y 2, initial point is workpiece motion s center o 22, the coordinate system X that workpiece is static relatively 2O 2Y 2, initial point is workpiece quiescent center O 23, the coordinate system x that moves with polishing disk 1y 1o 1, initial point is polishing disk centre of motion o 14, the coordinate system X that polishing disk is static relatively 1O 1Y 1, initial point is polishing disk quiescent center O 1Polishing disk rotating speed w 1, workpiece rotational frequency w 2, eccentric throw is e, and workpiece radius is R1, and the polishing disk radius is R, and the horizontal translational speed of workpiece is Vx.Take up an official post at workpiece and to get 1 N, relatively workpiece motion s coordinate system x 2o 2y 2Radius is r, relatively x 2The axle clamp angle is a.Utilize space coordinates variation and fourier series to get, the speed of the relative polishing disk of certain some N on the workpiece.
At coordinate system x 2o 2y 2In:
x 2=r·cos(a)、y 2=r·sin(a);
At coordinate system X 2O 2Y 2In:
X 2=x 2·cos(w2·t)-y 2·sin(w2·t)
Y 2=x 2·sin(w2·t)+y 2·cos(w2·t);
At coordinate system X 1O 1Y 1In:
X 1=X 2+e+F(t)
Y 1=Y 2
At coordinate system x 1y 1o 1In: x 1=X1cos (w1t)+Y1sin (w1t) y 1=-X 1Sin (w1t)+Y 1Cos (w1t).
Wherein
F ( t ) = S 2 - 4 S Vx · Vx · 1 [ π ( S Vx ) ] 2 · [ cos ( π · t S Vx ) + 1 3 2 ( 3 · π · t S Vx ) + 1 5 2 · cos ( 5 · π · t S Vx ) + . . . . . . ]
In the relative polishing disk speed of N point
Figure GSB00000455233100052
following formula, S is the workpiece side-to-side movement amplitude of oscillation on the workpiece.
2) utilize pressure distributions surface model (skin model) to calculate the pressure distributions in the workpiece motion s process; 1 traversing process-cycle of workpiece is carried out linear incision, the step of the material removing rate that obtains in conjunction with Preston formula (MRR=kpv) putting on the workpiece different radii:
The pressure distributions surface model that Fig. 5 provides for the present invention (skin model) sketch map, workpiece and polishing disk contact zone pressure distributions are divided into two parts, A district and B district, wherein the B district is an endless belt, width is S.The pressure of supposing the A district is p, and the pressure in B district is p+p0, and the polishing disk radius is R, and workpiece radius is R1, and the distance that workpiece reveals the limit is d, and workpiece centre and polishing disk Edge Distance are d1.Point M1 be the intersection point of workpiece circle and endless belt s circle among Fig. 5, and some M2 is the intersection point that workpiece is round and polishing disk is round among Fig. 5.Endless belt width s dew back gauge can be expressed as following equation with the formula of the variation relation of d:
s = ( 2 R 1 ) · d · ( R 1 - d ) 0 ≤ d ≤ R 1 2 R 1 - d R 1 2 ≤ d ≤ R 1
Based on the equation of equilibrium of power in the Newton's law and moment, can get equation group:
∫ Ω ∫ p ( x , y ) dxdy = F
∫ Ω ∫ x · p ( x , y ) dxdy = 0
According to above-mentioned equation group, utilize double integral just can obtain p, can be expressed as:
p = F · ( ∫ ∫ A + B x · dxdy - ∫ ∫ A x · dxdy ) ∫ ∫ A + B dxdy · ( ∫ ∫ A + B x · dxdy - ∫ ∫ A x · dxdy ) - ∫ ∫ A + B x · dxdy · ( ∫ ∫ A + B dxdy - ∫ ∫ A dxdy )
The process that the horizontal portable processing method of workpiece is a more complicated, the rotation of existing workpiece and polishing disk has laterally moving of workpiece again, and in horizontal moving process, workpiece also has part-time can expose polishing disk simultaneously, does not carry out material and removes.Therefore, in order to simplify this process, can carry out linear incision to the traversing process-cycle of workpiece.Be without loss of generality, select 1 some N on any radius r of workpiece to analyze, this horizontal moving process linear incision is divided into following two parts:
First: the edge of work does not expose polishing disk; In the moving process in this section; Point N is positioned at polishing disk all the time, and pressure
Figure GSB00000455233100065
workpiece is H0 at this zone rotation one loop material thickness average removal rate.
Second portion: begin to expose polishing disk to exposing this process of ultimate range from the edge of work.Suppose to exist some cut points like this, every is 1 point at a distance from 8mm, and it is 10 points that the arrival maximum is exposed distance.When workpiece centre moves to each cut point; Suppose to stop 1 week of rotation at each cut point place; The N point is respectively H1, H2, H3 at the material thickness average removal rate that these 10 cut point places obtain ... H10; The material removing rate that then rotates a circle according to workpiece movement distance and each cut point can carry out integration to the material removing rate of whole horizontal moving process, calculates the total material removing rate of N point.In each cut point position, because relative eccentric distance e is different, it is also different with p0 to utilize pressure distributions surface model (skin model) to calculate p.P and p0 that relative velocity of asking according to step 1) and pressure distributions surface model calculate can calculate on the workpiece radius certain some N at the material removing rate of each cut point according to Princeton Preston formula (MRR=kpv).
Fig. 6 be on the workpiece radius 100mmN point material removing rate with workpiece center of circle travel distance variation relation figure.Abscissa is represented workpiece center of circle travel distance, and unit is m, and ordinate is represented the material thickness average removal rate, and unit is m/s.Can see that from Fig. 6 the 1st turning point of curvilinear motion appears at the 1st cut point, tracing it to its cause is that workpiece begins to expose polishing disk, and pressure distributions begins to transfer surface model to by being uniformly distributed with; The 2nd turning point of curvilinear motion appears at the 8th cut point, and from 7 cut points of the 1st cut point to the, material removing rate is in ascent stage always; During to the 8th cut point; Material removing rate begins on a declining curve, traces it to its cause to be that the N point begins to have part-time to fall into the polishing disk perimeter behind the 8th cut point; Do not carry out material and remove, caused the remarkable decline of material removing rate.
The material removing rate curve that Fig. 7 is ordered for N on the workpiece different radii in the cross sliding type process.
Fig. 8 is for carrying out on the different radii that integration obtains at N o'clock at 1 total material removing rate of traversing cycle to each bar curve among Fig. 7 in the cross sliding type process.
3) put the probability that exposes polishing disk and fall into different pressure zone on the different radii on the calculating workpiece, adopt ratio resulting material removing rate to be carried out the step of weighting assignment according to probability:
Calculate the hypothesis of the material thickness average thickness clearance that rotates a circle according to linear incision; Be positioned at that to expose the probability of polishing disk than the point of the N on the long radius bigger; Its clearance should be smaller, and the N point that is positioned on the small radii does not expose polishing disk, and its clearance should be big so.But because discontinuity and the imperfection of rotation of motion, there is certain limitation in linear incision, and workpiece can not stop down at certain cut point place and not rotate a circle, and continuation is rotated and moved laterally to next cut point and stops again and rotate a circle then; And might neither rotate a circle, might be part week.The zone that might the less N point of radius in actual process when cut point rotates, falls into pressure p; And the bigger N point of radius falls into the p+p0 zone more much bigger than pressure p when cut point rotates; Expose the polishing disk probability for balance and fall into the influence that different pressure zone is caused the material thickness average removal rate with the N point; Can use one than this influence of value representation; With the radius is that the distance of track central coordinate of circle from the polishing disk edge that the last N of 0mm is ordered is benchmark; The ratio between the distance at polishing disk edge of N locus of points central coordinate of circle on this distance and the different radii is represented to expose in the process polishing disk probability and fallen into big these the two kinds of influences that possibility is brought of zone of pressure as weighing parameter, according to different ratio the material removing rate among Fig. 7 is carried out the weighting assignment then.Table 1 is according to the material removing rate of different central coordinate of circle after the ratio of polishing disk Edge Distance carries out the weighting assignment to clearance.
Table 1
Figure GSB00000455233100071
Fig. 9 on the prediction different radii in the cross sliding type process after the weighting assignment N o'clock at a total material removing rate of traversing cycle.
Figure 10 and Figure 11 are workpiece x after the data, type survey map above the y direction.
As stated, can see from Fig. 9~11 that along with the increase of workpiece radius, the prediction material removing rate is increasingly high, so the edge of work is more and more lower; The closer to workpiece centre, high highly more, low highly more the closer to the edge of work, the variation tendency of workpiece face type and prediction is consistent after the actual processing.Therefore, can adopt Different Exercise Mode, expeditiously workpiece polished, and can control practical work piece machined surface type according to prediction result according to the fast polishing traversing method.
In addition, the present invention is not limited in above-mentioned form of implementation, and nature can carry out various changes in the scope that does not break away from purport of the present invention.

Claims (8)

1. the fast polishing traversing processing method of heavy-calibre planar optical elements; It is characterized in that adopting digital control polishing machine tool; Said digital control polishing machine tool is provided with polishing disk, polishing pad, vacuum film, workpiece rotating shaft, freeing wheel, finishing wheel shaft and the traversing axle of working, and polishing disk is provided with the polishing disk rotating shaft, and polishing disk is independent rotation under the polishing disk rotating shaft drives; Polishing pad is located on the polishing disk; Workpiece is located on the workpiece rotating shaft of polishing pad, and vacuum film is located at surface of the work, on polishing pad, injects polishing fluid;
Said processing method may further comprise the steps:
1) selects processing mode for 1, set machined parameters, utilize space coordinate transformation and fourier series to calculate the step of the speed of the relative polishing disk of workpiece;
2) 1 is utilized the pressure distributions surface model to calculate the pressure distributions in the traversing process of workpiece, and traversing process-cycle of workpiece is carried out linear incision, the step of the material removing rate that obtains in conjunction with the Princeton formula putting on the workpiece different radii;
3) 1 is calculated on the workpiece that point exposes the polishing disk probability regional with falling into different pressure on the different radii; Adopt ratio that resulting material removing rate MRR is carried out the weighting assignment according to probability; Prediction processing back workpiece face type variation tendency, the step that processing back testing result is consistent with prediction.
2. the fast polishing traversing processing method of heavy-calibre planar optical elements as claimed in claim 1 is characterized in that said polishing pad is a polyurethane polishing pad.
3. the fast polishing traversing processing method of heavy-calibre planar optical elements as claimed in claim 1 is characterized in that said polishing disk is the marble polishing disk.
4. the fast polishing traversing processing method of heavy-calibre planar optical elements as claimed in claim 1 is characterized in that said polishing fluid is mixed by cerium oxide and deionized water to form.
5. the fast polishing traversing processing method of heavy-calibre planar optical elements as claimed in claim 1; It is characterized in that in step 1); Said processing mode is the cross sliding type processing mode, and said machined parameters is that the external world exerts pressure, polishing disk rotating speed, workpiece rotational frequency, Princeton coefficient, polishing disk radius, workpiece radius, eccentric throw, traversing speed and the maximum back gauge of revealing of workpiece.
6. the fast polishing traversing processing method of heavy-calibre planar optical elements as claimed in claim 1; It is characterized in that in step 1); Said selection processing mode; Setting machined parameters, utilize space coordinate transformation and fourier series to calculate the step of the speed of the relative polishing disk of workpiece, is to set up relative motion and static relatively two coordinate systems in workpiece centre; Set up relative motion and static relatively two coordinate systems at the polishing disk center, utilize space coordinate transformation and fourier series to calculate workpiece relative polishing disk speed in traversing process.
7. the fast polishing traversing processing method of heavy-calibre planar optical elements as claimed in claim 1; It is characterized in that in step 2) in; The said pressure distributions surface model that utilizes calculates the pressure distributions in the traversing process of workpiece, and traversing process-cycle of workpiece is carried out linear incision, obtains the material removing rate of putting on the workpiece different radii in conjunction with the Princeton formula; Be to utilize the pressure distributions surface model to calculate the pressure distributions in the traversing process of workpiece; Traversing process-cycle of workpiece is carried out linear incision, set up cut point, utilize the pressure distributions surface model to calculate the pressure distributions of each cut point in the traversing process of workpiece; Combine the Princeton formula again, calculate the material removing rate that point rotates a circle at the cut point place on the workpiece different radii; At last, the material removing rate that rotates a circle according to workpiece movement distance and each cut point carries out integration to the material removing rate of whole horizontal moving process, calculates on the workpiece the total material removing rate of point on the different radii; Said Princeton formula is MRR=kpv, and wherein k is a Princeton Preston coefficient, and p is certain any suffered pressure on the workpiece, and v is the speed of certain a bit relative polishing disk on the workpiece.
8. the fast polishing traversing processing method of heavy-calibre planar optical elements as claimed in claim 1; It is characterized in that in step 3); Put the probability that exposes polishing disk and fall into different pressure zone on the said calculating workpiece on the different radii; Adopt ratio that resulting material removing rate MRR is carried out the weighting assignment according to probability, prediction processing back workpiece face type variation tendency, the step that processing back testing result is consistent with prediction; Be to calculate to put the probability that exposes polishing disk and fall into different pressure zone on the workpiece on the different radii; Adopt ratio that the total material removing rate of point on the different radii on the resulting workpiece of integration is carried out the weighting assignment according to probability, prediction processing back workpiece face type variation tendency, processing back testing result is consistent with prediction.
CN2009101125484A 2009-09-15 2009-09-15 Fast polishing traversing processing method of heavy-calibre planar optical elements Expired - Fee Related CN101670541B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009101125484A CN101670541B (en) 2009-09-15 2009-09-15 Fast polishing traversing processing method of heavy-calibre planar optical elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009101125484A CN101670541B (en) 2009-09-15 2009-09-15 Fast polishing traversing processing method of heavy-calibre planar optical elements

Publications (2)

Publication Number Publication Date
CN101670541A CN101670541A (en) 2010-03-17
CN101670541B true CN101670541B (en) 2012-05-23

Family

ID=42018070

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009101125484A Expired - Fee Related CN101670541B (en) 2009-09-15 2009-09-15 Fast polishing traversing processing method of heavy-calibre planar optical elements

Country Status (1)

Country Link
CN (1) CN101670541B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102554764A (en) * 2012-02-15 2012-07-11 蔡桂芳 Machine and method for grinding and polishing ultra-long and ultra-thin quartz plate
CN103433832A (en) * 2013-08-01 2013-12-11 浙江工业大学 Dielectrophorisis-based certain eccentricity type grinding/polishing device
CN104385064B (en) * 2014-10-14 2016-08-31 中国科学院光电技术研究所 The heavy-calibre planar processing method that a kind of numerical control small tool combines with glass polishing machine
CN106891278B (en) * 2017-01-06 2019-08-20 浙江工业大学 A kind of preparation method with gradient function polishing disk based on Function Fitting
CN108789117B (en) * 2018-06-20 2020-05-05 中国科学院上海光学精密机械研究所 Efficient polishing machine and polishing method for meter-level large-caliber optical element
CN110587484A (en) * 2019-07-29 2019-12-20 苏州超徕精工科技有限公司 Device and method for predicting removal effect in polishing process in real time
CN110315421B (en) * 2019-08-20 2023-12-26 江苏集萃精凯高端装备技术有限公司 Crystal material homogenizing and polishing device and application method
CN111376143B (en) * 2020-03-18 2021-08-24 中科院南京耐尔思光电仪器有限公司 Automatic annulus error polishing numerical control single-shaft equipment and process method thereof
CN111266937B (en) * 2020-03-20 2021-09-10 大连理工大学 Rocker arm type polishing device and method for full-caliber deterministic polishing of planar parts
CN112775724B (en) * 2020-12-31 2022-04-15 长光卫星技术股份有限公司 Large-caliber optical mirror surface rapid polishing method based on multi-polishing system
CN112846977B (en) * 2021-01-04 2022-05-20 大连理工大学 Method for reducing flatness error of double-sided grinding workpiece

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3841031A (en) * 1970-10-21 1974-10-15 Monsanto Co Process for polishing thin elements
US5069002A (en) * 1991-04-17 1991-12-03 Micron Technology, Inc. Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
TW362249B (en) * 1997-12-16 1999-06-21 Asia Ic Mic Process Inc Controller of polishing process termination point for semiconductor wafer
DE19756960A1 (en) * 1997-12-20 1999-06-24 Friedrich Schiller Uni Jena Bu Optical working of functional surfaces with rotational symmetry
US6257953B1 (en) * 2000-09-25 2001-07-10 Center For Tribology, Inc. Method and apparatus for controlled polishing
CN1474734A (en) * 2000-07-31 2004-02-11 Asml Method of chemical polishing
US6918815B2 (en) * 2003-09-16 2005-07-19 Hitachi Global Storage Technologies Netherlands B.V. System and apparatus for predicting plate lapping properties to improve slider fabrication yield
WO2006022452A2 (en) * 2004-08-27 2006-03-02 Ebara Corporation Polishing apparatus and polishing method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3841031A (en) * 1970-10-21 1974-10-15 Monsanto Co Process for polishing thin elements
US5069002A (en) * 1991-04-17 1991-12-03 Micron Technology, Inc. Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
TW362249B (en) * 1997-12-16 1999-06-21 Asia Ic Mic Process Inc Controller of polishing process termination point for semiconductor wafer
DE19756960A1 (en) * 1997-12-20 1999-06-24 Friedrich Schiller Uni Jena Bu Optical working of functional surfaces with rotational symmetry
CN1474734A (en) * 2000-07-31 2004-02-11 Asml Method of chemical polishing
US6257953B1 (en) * 2000-09-25 2001-07-10 Center For Tribology, Inc. Method and apparatus for controlled polishing
US6918815B2 (en) * 2003-09-16 2005-07-19 Hitachi Global Storage Technologies Netherlands B.V. System and apparatus for predicting plate lapping properties to improve slider fabrication yield
WO2006022452A2 (en) * 2004-08-27 2006-03-02 Ebara Corporation Polishing apparatus and polishing method

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
李亚国 等.光学元件聚氨酯抛光特性研究.《光电工程》.2008,第35卷(第11期),139-144. *
杨炜 等.超精抛光中效应对材料去除量的影响.《强激光与粒子束》.2008,第20卷(第10期),1653-1657. *

Also Published As

Publication number Publication date
CN101670541A (en) 2010-03-17

Similar Documents

Publication Publication Date Title
CN101670541B (en) Fast polishing traversing processing method of heavy-calibre planar optical elements
CN103707154B (en) A kind of disc type burnishing device based on dynamic pressure effect and finishing method
KR101155055B1 (en) Raster cutting technology for ophthalmic lenses
Feng et al. Investigations on the automatic precision polishing of curved surfaces using a five-axis machining centre
CN103722467A (en) Method and device for determining grinding brittleness-ductility transformation critical cutting depth of hard and brittle material
CN102501152A (en) Integrated superfine, precise and mirror grinding method for surface of micro-structural array
EP3200954B1 (en) Tool and method for shaping and finishing a workpiece
CN104864811A (en) In-situ measurement method for complex curved surface of blade
CN110293482B (en) Method for dressing circular arc diamond grinding wheel
CN104741994A (en) Precise curved-surface grinding method for grinding wheel with any curved surface
Shiou et al. Ultra-precision surface finish of the hardened stainless mold steel using vibration-assisted ball polishing process
Wang et al. Application and development of high-efficiency abrasive process
CN105397609A (en) Profile correction machining method for high-precision plane of optical part
Barylski et al. Non-conventional approach in single-sided lapping process: kinematic analysis and parameters optimization
CN107378687A (en) A kind of large caliber reflecting mirror iteration based on abrasion of grinding wheel prediction pre-compensates for method for grinding
CN111266937B (en) Rocker arm type polishing device and method for full-caliber deterministic polishing of planar parts
Setti et al. Experimental investigations and kinematic simulation of single grit scratched surfaces considering pile-up behaviour: grinding perspective
CN104385083B (en) Cup emery wheel variable location basic circle convex surface workpiece grinding processing method
Chen et al. Affecting factors, optimization, and suppression of grinding marks: a review
Hou et al. Applications of high-efficiency abrasive process with CBN grinding wheel
CN107457703B (en) A kind of bronze boart boart wheel disc precise dressing method of the end surface full jumping better than 2 μm
CN203679976U (en) Device for determining grinding brittle-ductile conversion critical cutting depth of hard and brittle material
Zheng et al. Theoretical modeling and experimental research on the depth of radial material removal for flexible grinding
Tonnellier et al. Sub-surface damage issues for effective fabrication of large optics
CN203622138U (en) Disc type polishing device based on dynamic pressure effect

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120523

Termination date: 20180915